KR102318198B1 - Automatic ejection device of chip plating machine - Google Patents

Abstract

The present invention is to provide a chip plating machine which can reduce a manpower input time of a plating machine, and improve productivity and working environment through equipment automation. An automatic discharging device of the chip plating machine, in a chip plating machine composed of a plated housing (10), a cathode ring (20), a shaft (30), a motor (40), a rotating plate (50), a basket (60), a post (70), a lifting plate (80), a base plate (90), a ring member (100) and a lifting cylinder (110), has a pad (120) with an inclined surface (121) toward an outer lower side, wherein the pad (120) is coupled to the lifting plate (80), so that the inclined surface (121) of the pad (120) opens and closes an opening part opened under the cathode ring (20). In addition, a plurality of coil springs (130) are elastically installed between the rotating plate (50) and the lifting plate (80), and the rotating plate (50) and the cathode ring (20) are connected by a number of pillars (140).

Description

Automatic ejection device of chip plating machine

The present invention relates to an automatic discharging device for a chip plating machine, and more particularly, to prevent wastage of work time and manpower by simply discharging all washing water and chips at the same time without the input of manpower after completing the plating process and the washing process. It was invented to significantly improve economic efficiency and production efficiency by preventing chip loss.

In general, the MLCC (Multi Layer Ceramic Capacitor) chip plays a role of supplying electricity uniformly, and it is a very small and expensive component that can be seen as a small dot with the naked eye.

These multilayer ceramic capacitors (hereinafter referred to as 'MLCC') are also applied for special purposes such as mobile devices such as memory modules and tuners, military devices, medical devices, aircraft, and automobiles, in addition to cell phones, PCs, and D-TVs. It is widely used in various fields requiring

In particular, since the internal inductance is low and the noise canceling effect is excellent at high frequencies compared to other capacitors, it is applied to mobile phones and satellites, and plays a role as a capacitor with high reliability while having a high capacity even in an ultra-small size.

Recently, for the miniaturization of portable communication devices such as smartphones, tablet PCs, notebook computers, smart TVs, etc. and high performance of electronic devices, the thin film sheet has reached the stage of producing MLCCs with a thickness of 1.5 μm or less, which is an ultra-thin film.

Such MLCC forms a thin film sheet by tape casting, and processes such as lamination, compression, cutting, plasticization, firing, and polishing of the formed thin film sheet, and then applies a plating layer thereon through an MLCC dedicated plating machine for forming an electric circuit. is forming

1 illustrates an apparatus of a conventional chip plating machine in a plan view.

As shown in the figure, the chip plating machine consists of four steps.

The plating housing 10 has a hollow case structure, and a cathode ring 20 is installed therein, respectively.

The cathode ring 20 turns each step in a state in which a plurality of MLCC chips are filled, and pure cleaning is performed through the cleaning nozzle in a state in which a large number of chips are put into the cathode ring 20 from the starting position.

Then, the plating housing 10 is moved to the next step to perform primary plating, and for plating cleaning, the position is moved to the next step to perform secondary cleaning through the cleaning nozzle.

Then, after moving to the next stage for secondary plating, the plating solution is supplied through the plating nozzle, and after the plating process is completed, the chip plating operation is completed by moving to the initial stage where the chips were put in and performing pure water cleaning for finishing. do.

The plating housing 10 and the cathode ring 20 have their upper inlets opened, and the cleaning nozzle and the plating nozzle are lowered in each step, and then the cleaning solution or the plating solution is supplied to the inside of the cathode ring 20 and then returned again. will repeat

It is important to separate and collect the chips from the cleaning solution after completing each plating process and cleaning operation performed inside the cathode ring 20 .

Conventionally, when all the plating processes are completed in a state where the operator waits in the chip plating machine to collect the chips, a hose connected to the vacuum pump is put inside the cathode ring 20 to discharge the chips so that they are contained in the chip collecting container. made by hand

At this time, it is necessary to check with the naked eye to check whether there are any residual chips inside the cathode ring 20, and the process of manually finding and sucking each one through a vacuum hose is done manually, so it is a waste of work time and manpower. resulting in loss of productivity.

In addition, there are many problems in that not only the productivity is significantly different depending on the ability of the operator, but also the cases in which expensive chips are continuously accumulated, resulting in economic loss.

Domestic Registered Patent No. 10-1749997 (Registration Date June 16, 2017)

Domestic Patent Publication No. 10-2005-0096298 (published on October 06, 2005)

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip plating machine capable of reducing the manpower input time of the plating machine and improving productivity and working environment through equipment automation.

Another object of the present invention is to provide a chip plating machine capable of providing economic benefits by preventing loss of MLCC chips and improving productivity through automation.

In the configuration of the present invention for achieving the above object, it is seated on the turntable 1 and pivots to a position where the cleaning nozzle 2 is installed and a position where the plating nozzle 3 is installed, and a plating housing with an open top and a hollow ( 10) and

A cathode ring 20 positioned inside the plating housing 10 so that cleaning or plating is performed in a state in which a large number of MLCC chips are filled;

a shaft 30 connected to the cathode ring 20 to rotate together;

a motor 40 for driving the shaft 30 to rotate the chip and a cleaning solution or plating solution into the cathode ring 20;

A rotating plate 50 coupled to the shaft 30 and connected to rotate the cathode ring 20 positioned thereon;

A discharge port 11 is provided on one side of the bottom surface of the plating housing 10, and a collection basket 60 installed under the discharge port 11,

and a post 70 erected through the rotary plate 50;

A lifting plate 80 that is coupled to the upper end of the post 70 and is in close contact with or separated from the lower surface of the cathode ring 20,

a base plate 90 coupled to the lower end of the post 70;

a ring member 100 connected with the base plate 90 and the bearing 101 interposed therebetween;

An elevating cylinder ( 110) in the chip plating machine comprising,
A pad 120 having an inclined surface 121 toward the lower outer side is coupled to the lifting plate 80, and the inclined surface 121 of the pad 120 opens and closes an opening in the lower portion of the cathode ring 20,
A plurality of coil springs 130 are elastically installed between the rotating plate 50 and the lifting plate 80,
The rotating plate 50 and the cathode ring 20 are characterized in that they are connected by several pillars (140).

delete

delete

In the present invention as described above, in particular, when the lifting plate and the pad sealing the opening of the cathode ring are lowered by the lifting cylinder in a state where the MLCC chip is plated and the cleaning process is completed, the chip and the cleaning solution simultaneously close the outlet of the plating housing. It is collected in a collection basket through
In addition, excellent airtightness can be maintained when sealing the bottom opening of the cathode ring in a state wrapped around the periphery of the lifting plate by further coupling a pad having an inclined surface toward the lower outer side of the lifting plate can be expelled quickly.

Therefore, it is possible to reduce the manpower input time for chip collection of the plating machine.

And, it is possible to improve the productivity and work environment through the automation of the equipment.

In addition, there is an effect of preventing the loss of an expensive and very small MLCC chip and providing economic benefits by improving productivity.

1 is a plan view showing a state in which plating housings are disposed in a conventional chip plating machine.
Figure 2 is a front view showing a state in which the chip automatic discharging device of the present invention is provided in the plating housing, partially cut away.
Figure 3 is a cross-sectional view showing a state in which the opening of the cathode ring is opened.
Figure 4 is a cross-sectional view showing a closed state of the opening of the cathode ring.
5 is an enlarged view of part A of FIG. 3 ;
6 is an enlarged view of part B of FIG. 4 ;
7 is a partially enlarged view of FIG. 4 ;

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and are common in the art to which the present invention pertains. It is provided to fully inform those with knowledge of the scope of the invention, and the present invention is only defined by the scope of the claims.

In addition, the terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention.

As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, "comprises" and/or "comprising" does not exclude the presence or addition of elements other than those mentioned.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs.

Hereinafter, in order to describe the present invention in more detail, embodiments according to the present invention will be described in more detail with reference to the accompanying drawings.

2 to 7 show the configuration of an automatic discharging device for a chip plating machine according to an embodiment of the present invention.

A typical chip plating machine consists of four steps as shown in FIG. 1 , and cleaning and plating are performed in a state where the plating housings 10 are positioned at each step position, and when each process is completed, the The positions of the plating housings 10 are rotated one step at a time.

Cathode rings 20 in which a plurality of chips are filled are respectively provided in the plating housings 10 .

The cathode ring 20 rotates at each stage like the plating housing 10. In a state in which a plurality of MLCC chips are put into the cathode ring 20 from the starting position, the cleaning nozzle 2 is turned into the plating housing. After descending to the inlet of (10) and the cathode ring 20, the cleaning solution is supplied, and after returning, the chip and the cleaning solution are mixed while rapidly rotating the cathode ring 20 by driving the shaft 30 and the motor 40 The cleaning process is performed.

The upper portion of the cathode ring 20 is covered with a dome-shaped cover 21 through which the center is penetrated to prevent the chips and the cleaning solution or plating solution from being separated when the cathode ring 20 is rapidly rotated.

Then, the plating housing 10 moves to the next plating step, and the plating nozzle 3 located on the upper part is lowered to the inlet of the plating housing 10 and the cathode ring 20, and then the plating solution is supplied in an appropriate amount. After returning, the primary plating process is performed while the shaft 30 and the cathode ring 20 are rotated at a high speed by driving the motor 40 .

The main component of the plating solution used in the primary plating process is Ni.

After the primary plating is performed for a predetermined time, the positions of the plating housings 10 are moved to the next step by turning the turntable 1 for cleaning the plating solution, and the secondary cleaning process is performed through the cleaning nozzle 2 . .

This secondary cleaning nozzle (2) also descends to the inlet of the plating housing (10) and the cathode ring (20), supplies an appropriate amount of cleaning solution, and then returns to the cathode through the shaft (30) quickly driven by the motor (40). A cleaning process is performed while rotating the ring 20 .

Then, for secondary plating, it moves to the next plating step, and after the plating solution is supplied through the secondary plating nozzle 3, the plating process is performed.

The main component of the plating solution used in the secondary plating process is Sn.

In this way, after completing all of the secondary cleaning and plating processes, the chip plating operation is completed by moving back to the initial stage where new chips were put in and further cleaning with pure water for finishing.

Pure cleaning for finishing is also performed through the cleaning nozzle 2 , and the cleaning nozzles 2 and the plating nozzle 3 are lifted and lowered by the respective cylinders 4 and 5 .

The plating housing 10 and the cover 21 of the cathode ring 20 have their upper inlets opened, respectively, so that the cleaning nozzles 2 and the plating nozzles 3 are lowered in each step, and then into the inside of the cathode ring 20 . After supplying the cleaning solution or the plating solution, the process of returning again is repeated.

After each plating process and cleaning operation performed inside the cathode ring 20 are finished, the cleaning solution and chips are discharged from the cathode ring 20 and only the MLCC chips are separated and collected.

Hereinafter, a device for automatically discharging the cleaning solution and chips from the cathode ring 20 will be described.

First, the rotating plate 50 is coupled to the upper end of the shaft 30 to rotate the cathode ring 20 positioned thereon together.

The rotating plate 50 and the cathode ring 20 are connected by several pillars 140 so that rotation is made together, and a gap is formed between the pillars 140 .

The plating housing 10 has a structure in which an upper case having a dome structure and a lower case having a support container structure are combined as shown in the drawing. The outlet 11 is provided.

And, a basket 60 for collection is installed at the lower part of the outlet 11 .

The collection basket 60 is provided with a filter net 61 of a size that allows the chips to be hung on the upper part, so that when the chips and the cleaning solution fall, only the chips are hung on the upper part of the filter net 61, and the cleaning liquid passes through to enable separation and collection do.

A number of posts 70 are installed to pass through the rotating plate 50 , and a lifting plate 80 is coupled to the upper end of the post 70 .

The lifting plate 80 is moved up and down like the post 70 so as to be in close contact with or separated from the open bottom surface of the cathode ring 20 .

And, the base plate 90 is coupled to the lower end of the post 70 .

A ring member 100 is provided on the outside of the base plate 90 with the bearing 101 interposed therebetween.

Therefore, even if the ring member 100 of the ring structure is maintained in a stationary state by the bearing 101 , the base plate 90 , the post 70 , and the rotating plate 50 can freely rotate together with the shaft 30 . it can be

A rod of the elevating cylinder 110 is supported on the bottom surface of the ring member 100 .

While the lifting cylinder 110 is not rotated together with the ring member 100 in a state supported by the turntable 1, when the rod is raised, the base plate 90 connected to the ring member 100. And the post 70 and the lifting plate 80 can be raised and lowered at the same time.

4 and 6 are partially enlarged views in which the elevating cylinder 110 advances the rod by an electrical signal, and the ring member 100 supported thereon and the bearing 101 are connected through the base plate 90. , shows a state in which the bottom opening of the cathode ring 20 is sealed by raising the post 70 and the lifting plate 80 at the same time.

Here, it is preferable to further couple the pad 120 having the inclined surface 121 toward the lower outer side to the lifting plate 80 .

The pad 120 can maintain excellent airtightness when sealing the bottom opening of the cathode ring 20 in a state in which the periphery of the lifting plate 80 is wrapped with a rubber or silicon material having good elasticity and flexibility.

In addition, there is an effect of rapidly discharging both the chips and the cleaning solution through the inclined surface 121 provided on the pad 120 .

In addition, a plurality of coil springs 130 are elastically installed between the rotating plate 50 and the lifting plate 80 so that the lifting plate 80 and the pad 120 are in close contact with the bottom surface of the cathode ring 20 while retaining elasticity. to make it possible

On the other hand, when an electric signal is applied to retract the rod of the elevating cylinder 110 for a new operation after finishing both the plating and cleaning processes, the base plate 90 connected through the ring member 100 and the bearing 101 ), the post 70 and the pad 120 surrounding the lifting plate 80 are lowered at the same time to open the bottom opening of the cathode ring 20 .

3 and 5 show a state in which the bottom opening of the cathode ring 20 is opened.

As described above, when the pad 120 surrounding the lifting plate 80 is lowered, the chips and the cleaning liquid fall along the inclined surface 121 to the collection basket 60 through the outlet 11, and only the chips are caught in the filtering net 61. it can be picked up.

Therefore, due to the automation of the equipment, it is possible to reduce the manpower input time for collecting the chips of the plating machine, and it is possible to improve the productivity and the working environment.

In addition, it is to prevent loss of an expensive and very small MLCC chip to provide economic benefits.

As described above, the present invention has been described with reference to the embodiments shown in the drawings, but this is only for explaining the invention, and various modifications or equivalents from the detailed description of the invention to those of ordinary skill in the art to which the present invention pertains It will be appreciated that one embodiment is possible.

Therefore, the true scope of the present invention should be determined by the technical spirit of the claims.

1 - turntable
2 - cleaning nozzle
3 - plating nozzle
10 - Plated housing
20 - cathode ring
30 - shaft
40 - motor
50 - Spindle
60 - collection basket
70 - post
80 - lift plate
90 - base plate
100 - ring member
110 - elevating cylinder
120 - pad

Claims (3)

It is seated on the turntable (1) and pivots to the position where the cleaning nozzle (2) is installed and the position where the plating nozzle (3) is installed.
A cathode ring 20 positioned inside the plating housing 10 so that cleaning or plating is performed in a state in which a large number of MLCC chips are filled;
a shaft 30 connected to the cathode ring 20 to rotate together;
A motor 40 for driving the shaft 30 to rotate the chip and a cleaning solution or a plating solution into the cathode ring 20;
A rotating plate 50 coupled to the shaft 30 and connected to rotate the cathode ring 20 positioned thereon;
A discharge port 11 is provided on one side of the bottom surface of the plating housing 10, and a collection basket 60 installed under the discharge port 11;
and a post 70 erected through the rotary plate 50;
A lifting plate 80 that is coupled to the upper end of the post 70 and is in close contact with or separated from the lower surface of the cathode ring 20,
a base plate 90 coupled to the lower end of the post 70;
a ring member 100 connected with the base plate 90 and the bearing 101 therebetween;
An elevating cylinder ( 110) in the chip plating machine consisting of,
A pad 120 having an inclined surface 121 toward the lower outer side is coupled to the lifting plate 80, and the inclined surface 121 of the pad 120 opens and closes an opening opened in the lower portion of the cathode ring 20,
A plurality of coil springs 130 are elastically installed between the rotating plate 50 and the lifting plate 80,
The automatic discharging device of the chip plating machine, characterized in that the rotating plate (50) and the cathode ring (20) are connected by several pillars (140).





delete delete

Images