KR102315052B1 - Crushing apparatus - Google Patents

Abstract

According to an embodiment of the present disclosure, there is provided a crushing apparatus, comprising: a crushing chamber having an enclosed inner space; an inlet having a door that can be opened and closed located in one area of the upper surface of the crushing chamber and into which a silicon wafer is put; a crusher located in the inner space and disposed below the inlet to crush the silicon wafer inserted through the inlet; a cone crusher located in the inner space and disposed below the crusher to crush the first discharge discharged from the crusher; a collector located in the inner space and disposed below the cone crusher to collect a second discharge discharged from the cone crusher; a ball mill receiving the second discharge discharged from the collector and pulverizing the second discharge; and a driving unit for driving the crusher, the cone crusher, and the ball mill device. Including, crushing device.

Description

crushing device {CRUSHING APPARATUS}

The present disclosure relates to a crushing device.

Modern society consumes energy through various energy sources to the extent that it is not an exaggeration to say that energy is used indiscriminately to satisfy the increasing energy demand. In particular, the most commonly used fossil fuel is not only used in various industries such as shipbuilding, automobile, heavy industry, etc., but also in general households using a huge amount annually.

However, although these fossil fuels are most commonly used, there is also a limitation that they are a limited resource. In addition, fossil fuels, as energy obtained through combustion, have inevitably followed problems such as ecosystem destruction, global warming, and abnormal climate. As a result, the world is focusing on the development of eco-friendly energy. And, among them, the development of power generation using sunlight, which is an infinite and stable energy source, is being actively developed.

However, solar power is not without problems. The lifetime of the solar module, which is the core of solar power generation, is only about 20 years. In addition, a large amount of silicon wafers are consumed to manufacture a solar module, and a large amount of chemicals and chemicals are used to produce a silicon wafer.

In order to solve this problem, an industry for recycling silicon wafers included in waste solar modules is being developed, but the cost of recycling silicon wafers is still consumed more than the cost of recycling extractable members. Optical modules are either disposed of in landfills or left in warehouses waiting for recycling technology to develop.

Republic of Korea Patent Publication 10-2010-0130640

The present disclosure has been made in response to the above-mentioned background art, and is intended to provide an apparatus for crushing a silicon wafer.

The technical problems of the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

The present disclosure has been made in response to the above-mentioned background art, and is intended to provide an apparatus for crushing a silicon wafer. The crushing device includes a crushing chamber having an enclosed inner space; an inlet having a door that can be opened and closed located in one area of the upper surface of the crushing chamber and into which a silicon wafer is put; a crusher located in the inner space and disposed below the inlet to crush the silicon wafer inserted through the inlet; a cone crusher located in the inner space and disposed below the crusher to crush the first discharge discharged from the crusher; a collector located in the inner space and disposed below the cone crusher to collect a second discharge discharged from the cone crusher; a ball mill receiving the second discharge discharged from the collector and pulverizing the second discharge; and a driving unit for driving the crusher, the cone crusher, and the ball mill device. may include.

In addition, the driving unit: a driving motor located outside the chamber; a drive shaft coupled to the shaft of the drive motor and having at least a portion inserted into the inner space to transmit power to the cone crusher; a first driven shaft receiving power from the drive shaft through a first bevel gear part; a second driven shaft receiving power from the first driven shaft through a reduction gear unit and transmitting power to the ball mill device; a third driven shaft receiving power from the second driven shaft through a second bevel gear part; a fourth driven shaft receiving power from the third driven shaft through a third bevel gear unit and transmitting power to the crusher; may include.

In addition, the cone crusher may include: a cylindrical main frame having an opening at an upper side through which the first discharge is introduced and a discharge unit through which the second discharge is discharged; a first shell disposed in the opening of the main frame, the first shell having a first hollow having a reduced cross-sectional area toward a lower side; a second shell disposed under the first shell and provided with a second hollow part whose cross-sectional area increases toward the lower side; and the first hollow part and the second hollow part having a cone shape pointed upward and rotating together according to the rotation of the drive shaft, causing friction with the second shell to remove the first discharge a pulverizing cone-shaped pulverizing unit; may include.

In addition, the ball mill device, the sub-chamber coupled to the second driven shaft rotates together according to the rotation of the second driven shaft; and a plurality of balls provided in the sub-chamber to cause collision and friction as the sub-chamber rotates to pulverize the second discharge. may include.

In addition, the crusher, the first crushing roller (roller) coupled to the fourth driven shaft rotates together according to the rotation of the fourth driven shaft; a rotating fifth driven shaft that receives power from the fourth driven shaft through a spur gear; It is coupled with the fifth driven shaft and rotates as the fifth driven shaft rotates, and rotates in the opposite direction to the first crushing roller so as to pull the silicon wafer from the top to the bottom between the first crushing roller and the shaft. a second crushing roller; may include.

In addition, the first crushing roller and the second crushing roller may include at least one cutter having a ratchet gear shape on an outer peripheral surface of a cylindrical shape.

In addition, the air discharge unit for discharging the air existing in the inner space to the outside; may further include.

In addition, when the air is discharged to the outside in the inner space through the air outlet, a gas input unit for introducing a gas (gas); may further include.

In addition, the gas may include at least one of argon gas and nitrogen gas. In addition, the oxygen concentration measuring unit for measuring the concentration of oxygen in the crushing chamber; Further comprising, wherein the gas input unit, when the concentration of the oxygen in the crushing chamber measured through the oxygen concentration measuring unit is less than a preset concentration, the gas may be introduced into the internal space.

In addition, the gas concentration measuring unit for measuring the concentration of the gas in the crushing chamber; It further includes, and the gas input unit may inject the gas into the inner space until the concentration of the gas in the fracturing chamber measured by the gas concentration measurement unit becomes a preset concentration.

In addition, the gas input unit may stop supplying the gas when the concentration of the gas measured by the gas concentration measurement unit exceeds a preset concentration.

In addition, the driving unit may drive the crusher, the cone crusher, and the ball mill device when the concentration of the gas measured by the gas concentration measuring unit exceeds a preset concentration.

In addition, a tread mill located in the inner space and conveying the second discharge discharged from the collector to the ball mill device to input the second discharge to the ball mill device; may further include.

In addition, the collector may have a hopper shape to receive the second discharge that has fallen from the cone crusher, and may be disposed between the treadmill and the cone crusher.

The technical solutions obtainable in the present disclosure are not limited to the above-mentioned solutions, and other solutions that are not mentioned are clearly to those of ordinary skill in the art to which the present disclosure belongs from the description below. can be understood

The present disclosure may provide an apparatus for effectively pulverizing a silicon wafer.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. .

Various aspects are now described with reference to the drawings, in which like reference numbers are used to refer to like elements collectively. In the following examples, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects. It will be evident, however, that such aspect(s) may be practiced without these specific details.
1 shows a block diagram for explaining a crushing apparatus according to some embodiments of the present disclosure.
Figure 2 is a schematic diagram for explaining an example of the operation of the crushing device according to some embodiments of the present disclosure.
3 is a perspective view for explaining a crusher according to some embodiments of the present disclosure.
4 is a cross-sectional perspective view for explaining a cone crusher according to some embodiments of the present disclosure.
5 is a schematic diagram for explaining a ball mill apparatus according to some embodiments of the present disclosure.
6 is a flowchart for explaining an example of a method in which the crushing device according to some embodiments of the present disclosure is driven.
7 is a flowchart illustrating an example of a method of processing a silicon wafer according to some embodiments of the present disclosure.

Various embodiments and/or aspects are now disclosed with reference to the drawings. In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of one or more aspects. However, it will also be appreciated by one of ordinary skill in the art that such aspect(s) may be practiced without these specific details. The following description and accompanying drawings set forth in detail certain illustrative aspects of one or more aspects. These aspects are illustrative, however, and some of the various methods in principles of various aspects may be employed, and the descriptions set forth are intended to include all such aspects and their equivalents. Specifically, as used herein, “embodiment”, “example”, “aspect”, “exemplary”, etc. is not to be construed as an advantage or advantage of any aspect or design described over other aspects or designs. It may not be.

Hereinafter, the same or similar components are assigned the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted. In addition, in describing the embodiments disclosed in the present specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the accompanying drawings.

Although the first, second, etc. are used to describe various elements or elements, these elements or elements are not limited by these terms, of course. These terms are only used to distinguish one element or component from another. Therefore, it goes without saying that the first element or component mentioned below may be the second element or component within the spirit of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

In addition, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or clear from context, "X employs A or B" is intended to mean one of the natural implicit substitutions. That is, X employs A; X employs B; or when X employs both A and B, "X employs A or B" may apply to either of these cases. It should also be understood that the term “and/or” as used herein refers to and includes all possible combinations of one or more of the listed related items.

Also, the terms "comprises" and/or "comprising" mean that the feature and/or element is present, but excludes the presence or addition of one or more other features, elements, and/or groups thereof. should be understood as not Also, unless otherwise specified or unless the context is clear as to designating a singular form, the singular in the specification and claims should generally be construed to mean "one or more."

In addition, the terms "information 7" and "data" as used herein may often be used interchangeably with each other.

When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but it is understood that other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that no other element is present in the middle.

The suffixes "module" and "part" for the components used in the following description are given or used in consideration of only the ease of writing the specification, and do not have distinct meanings or roles by themselves.

References to an element or layer “on” or “on” another component or layer mean that another layer or other component is directly on, as well as intervening, another component or layer. Including all intervening cases. On the other hand, when a component is referred to as "directly on" or "immediately on", it indicates that another component or layer is not interposed therebetween.

Spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe a component or a correlation with other components. Spatially relative terms should be understood as terms including different orientations of the device during use or operation in addition to the orientation shown in the drawings.

For example, when a component shown in the drawing is turned over, a component described as “beneath” or “beneath” of another component may be placed “above” of the other component. can Accordingly, the exemplary term “below” may include both directions below and above. Components may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

Objects and effects of the present disclosure, and technical configurations for achieving them will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. In describing the present disclosure, if it is determined that a detailed description of a well-known function or configuration may unnecessarily obscure the subject matter of the present disclosure, the detailed description thereof will be omitted. In addition, the terms described below are terms defined in consideration of functions in the present disclosure, which may vary according to intentions or customs of users and operators.

However, the present disclosure is not limited to the embodiments disclosed below and may be implemented in various different forms. Only the present embodiments are provided so that the present disclosure is complete, and to fully inform those of ordinary skill in the art to which the present disclosure belongs, the scope of the disclosure, and the present disclosure is only defined by the scope of the claims . Therefore, the definition should be made based on the content throughout this specification.

1 shows a block diagram for explaining a crushing apparatus according to some embodiments of the present disclosure.

The crushing apparatus 100 according to the present disclosure may be an apparatus capable of crushing a silicon wafer. However, the present invention is not limited thereto, and may be a device capable of pulverizing materials other than silicon wafers.

A silicon wafer may be a recyclable resource capable of obtaining silicon nitride or the like having a high added value. Also, the process of recycling silicon wafers can begin with smashing the silicon wafers.

Referring to FIG. 1 , the crushing apparatus 100 includes a control unit 110 , a driving unit 120 , an air discharge unit 130 , a gas input unit 140 , an oxygen concentration measurement unit 150 , and a gas concentration measurement unit 160 . ) and a power supply unit 170 . However, since the above-described components are not essential in implementing the crushing apparatus 100, the crushing apparatus 100 may have more or fewer components than those listed above. Here, each component may be configured as a separate chip, module, or device, or may be included in one device.

The control unit 110 may typically process the overall operation of the crushing apparatus 100 . The control unit 110 processes signals, data, information, etc. input or output through the above-described components or by driving an application program stored in a memory (not shown in FIG. 1 ), which is required for driving the shredding device 100 . It may provide or process appropriate functions.

The driving unit 120 may drive various devices included in the crushing apparatus 100 according to the control of the control unit 110 .

For example, the driving unit 120 may drive the driving motor 121 under the control of the control unit 110 . In addition, the shaft 122 of the drive motor may be coupled to one side of the drive shaft 124 through the coupling 123 . In addition, the other side of the driving shaft 124 may be coupled to the crushing unit 460 of a cone crusher 400 to be described later to drive the crushing unit 460 . In addition, the pulverizing unit may pulverize the first discharge in which the silicon wafer is primarily pulverized through friction.

As another example, the driving unit 120 may drive the driving motor 121 under the control of the control unit 110 . In addition, the driving shaft 210 receiving power from the driving motor 121 may transmit power to the first driven shaft 125 through the first bevel gear unit 211 . Here, the bevel gear has a conical shape and may be composed of two gears that meet at right angles or obtuse angles to transmit motion between two axes. Specifically, the first bevel gear unit 211 may include a bevel gear coupled to the driving shaft 124 and a bevel gear coupled to the first driven shaft 125 . In addition, the driving motor 121 may transmit power to the first driven shaft 125 through the meshing of the bevel gear coupled to the drive shaft 210 and the bevel gear coupled to the first driven shaft 125 . Meanwhile, the first driven shaft 125 may transmit power to the second driven shaft 126 through the reduction gear unit 214 . Here, the reduction gear unit 214 may be composed of at least two spur gears having different numbers of teeth. That is, the reduction gear unit 2140 may be a gear unit in which a gear ratio is designed so that the rotation speeds of the first driven shaft 125 and the second driven shaft 126 are different.

In addition, the second driven shaft 126 may be coupled to a sub-chamber 710 provided in a ball mill apparatus 700 to be described later to rotate the sub-chamber 710 . In addition, according to the rotation of the plurality of balls 720 provided in the sub-chamber 710 , the secondly pulverized second discharge may be pulverized.

As another example, the second driven shaft 126 receiving power from the driving motor 121 may transmit power to the third driven shaft 127 through the second bevel gear unit 212 . In addition, the third driven shaft 127 may transmit power to the fourth driven shaft 128 through the third bevel gear unit 213 . The fourth driven shaft 128 receiving the power may be coupled to a first crushing roller 310 provided in the crusher 300 to be described later to rotate the first crushing roller 310 . In addition, the crusher 300 may crush the silicon wafer through the provided first crushing roller 310 and the second crushing roller 320 .

Hereinafter, detailed description of the operation of various devices included in the crushing apparatus 100 according to the operation of the driving unit 120 will be described later with reference to FIGS. 2 to 5 .

In the present disclosure, the driving unit 120 may include a valve opening/closing unit (not shown).

Specifically, the valve opening/closing unit divides the silicon wafer, the first discharge, the second discharge, and the third discharge through the opening/closing of the valve under the control of the control unit 110. The crusher 300, the cone crusher 400, and the ball mill device 700, respectively, may be input or discharged from the crusher 300, the cone crusher 400, and the ball mill device 700, respectively. Here, the valve may perform an opening operation or a closing operation through electronic control, such as a solenoid valve, an electric valve, and an auto valve. In addition, the above-described valves can be manually opened or closed by a user in an emergency.

Here, the first discharge may be a discharge that is primarily pulverized through the crusher 300 . In addition, the second discharge may be a discharge discharged after being secondarily pulverized through the cone crusher 400 . In addition, the third discharge may be a discharge discharged after being thirdly pulverized through the ball mill device 700 . Hereinafter, the first, second, and third emissions produced according to the pulverization process of the silicon wafer will be described later with reference to FIGS. 2 to 7 .

On the other hand, the air discharge unit 130 may discharge the air present in at least a portion of the crushing device 100 to the outside.

Specifically, the crushing apparatus 100 may include a crushing chamber 180 having an enclosed inner space 181 . Here, the inner space 181 may be a space within the crushing chamber 180 . In addition, the air discharge unit 130 may be provided outside the crushing chamber 180 to discharge the air in the crushing chamber 180 through a combination of a vacuum pump and a pipe. However, the present invention is not limited thereto, and the air discharge unit 130 may be provided inside the crushing chamber 180 .

On the other hand, the pipe may be sealed (sealing) process for sealing the fluid existing inside the crushing chamber 180 .

For example, a rubber packing or an O-ring may be coupled to the pipe hole of the crushing chamber 180 . And, the crushing chamber 180 may block the inflow of air from the outside by coupling the pipe to the rubber packing or the O-ring.

As another example, a thread (female thread) may be machined in the pipe hole of the crushing chamber 180 . In addition, a thread (male thread) corresponding to the thread processed in the pipe hole may be machined on one side of the pipe. At this time, the inflow of air may be blocked by winding a seal tape or Teflon tape capable of preventing the inflow of fluid to the thread provided on one side of the pipe and combining it with the thread provided in the pipe hole. However, the sealing coupling between the crushing chamber 180 and the pipe is not limited to the above-described example.

The vacuum pump may be coupled to the other side of the pipe coupled to the crushing chamber 180 to discharge air inside the crushing chamber 180 .

Specifically, the vacuum pump includes a casing forming the exterior of the pump, a chamber for accommodating a fluid, an inlet for suction of air, an outlet for discharging the sucked air to the outside, and a rotatable interior of the chamber. It may include a provided rotor and a vane slidably supported by the rotor. Meanwhile, the rotor and the vane provided in the vacuum pump rotate by receiving power from the outside through the shaft provided in the vacuum pump. By the rotation of the rotor and the vane, external air may be sucked into the inside of the vacuum pump through the inlet. In addition, the sucked air may be discharged to the outside of the chamber through the outlet as the rotor and the vane further rotate in the rotational direction. Hereinafter, a vacuum pump in the present disclosure uses a generally used vacuum pump, and a detailed description of the structure and function of the vacuum pump will be omitted.

In the present disclosure, the control unit 110 may control the air discharge unit 130 to discharge the air present in the internal space 181 in the crushing chamber 180 for a preset time. Here, the preset time may be pre-stored in the memory of the controller 110 .

When air is discharged from the inner space 181 to the outside through the air discharge unit 130 , the control unit 110 may control the gas input unit 140 to inject gas. Here, the gas may be a gas for preventing a fire that may be generated by frictional heat, sparks, etc. in driving at least one device included in the crushing device 100 .

According to some embodiments of the present disclosure, the gas may include at least one of an inert gas or an inert gas, argon gas or nitrogen gas. However, the gas input to the crushing chamber 180 is not limited to the above-described gas.

Meanwhile, the gas input unit 140 may be provided outside the crushing chamber 180 .

Specifically, the gas input unit 140 may be connected to at least a portion of the crushing chamber 180 through a pipe or the like to inject gas into the internal space 181 . In addition, the pipe may be hermetically coupled to the crushing chamber 180 through the same method as the pipe provided in the air discharge unit 130 described above.

In the present disclosure, the controller 110 may control the gas input unit 140 so that the gas is introduced after the air present in the internal space 181 is discharged through the air discharge unit 130 for a preset time. . In addition, the controller 110 may control the gas input unit 140 to inject gas into the internal space 181 for a preset time.

The oxygen concentration measuring unit 150 may be located in a portion of the internal space 181 in the crushing chamber 180 . Here, the oxygen concentration measuring unit 150 may be at least one sensor capable of measuring the concentration of oxygen in the inner space 181 .

According to some embodiments of the present disclosure, when the concentration of oxygen in the internal space 181 of the fracturing chamber 180 measured by the oxygen concentration measuring unit 150 is less than a preset concentration, the control unit 110 controls the gas inside the The gas input unit 140 may be controlled to be injected into the space 181 . Here, the preset concentration may be pre-stored in the memory. In addition, the preset concentration may be a concentration with a small risk of fire in driving at least one device included in the crushing device 100 .

For example, in general, oxygen in the air makes up about 21%. And, when the concentration of oxygen in the air is less than 21%, combustion may be stopped or reduced. Accordingly, the preset concentration may be less than 21%, which is the concentration of oxygen in general air. However, the concentration of oxygen is not limited to the above-described examples.

Meanwhile, a gas concentration measuring unit 160 may be provided in a portion of the internal space 181 in the crushing chamber 180 . Here, the gas concentration measuring unit 160 may be at least one sensor capable of measuring the concentration of at least one gas in the internal space 181 .

According to some embodiments of the present disclosure, the control unit 110 injects the gas into the inner space 181 until the concentration of the gas in the inner space 181 measured by the gas concentration measuring unit 160 becomes a preset concentration. The gas input unit 140 may be controlled to input.

In addition, in the present disclosure, when the concentration of the gas measured by the gas concentration measurement unit 160 exceeds a preset concentration, the control unit 110 may control the gas input unit 140 to stop the injection of the gas. . Here, the preset concentration may be a concentration at which combustion can be further prevented by introducing an inert gas in addition to preventing combustion through the discharge of oxygen in the internal space 181 . Also, the preset concentration may be pre-stored in the memory.

On the other hand, when the concentration of the gas measured by the gas concentration measuring unit 160 exceeds a preset concentration, the control unit 110 may control the driving unit 120 to drive the crusher, the cone crusher, and the ball mill device. .

Specifically, the control unit 110 may control the air discharge unit 130 to discharge the air existing in the internal space 181 . Also, when the air in the inner space 181 is discharged to a preset concentration, the controller 110 may control the gas input unit 140 to inject the gas. And, when the concentration of the gas injected into the internal space 181 exceeds a preset concentration, the control unit 110 may drive the driving unit 120 .

Meanwhile, the driving unit 120 may transmit power to the devices included in the crushing apparatus 100 by driving the driving motor 121 .

Hereinafter, a method in which the driving unit 120 transmits power to the devices included in the crushing apparatus 100 will be described in detail with reference to FIG. 2 .

Figure 2 is a schematic diagram for explaining an example of the operation of the crushing device according to some embodiments of the present disclosure.

Referring to FIG. 2 , the crushing apparatus 100 includes a crushing chamber 180 , a driving unit 120 , a crusher 300 , a cone crusher 400 , a collector 500 , a tread mill 600 and a ball A mill apparatus 700 may be included. However, the above-described components are not essential in implementing the crushing apparatus 100, so the crushing apparatus 100 may have more or fewer components than those listed above. In addition, each component may be configured as a separate device, or may be included in one device.

The crushing chamber 180 may have an enclosed inner space 181 to accommodate at least one device included in the crushing apparatus 100 . Here, the sealed internal space 181 may be a space in which the fluid in the crushing chamber 180 is not introduced or discharged without the control of the controller 110 .

In addition, the crushing chamber 180 may include a door 182 and an inlet 183 .

The door 182 may be rotatably coupled through a hinge so as to be located in one area of the upper surface of the crushing chamber 180 to enable opening and closing. However, the position of the door is not limited to the upper surface, and may be provided on the side according to the position of the device provided in the crushing chamber 180 . In addition, the door 182 may be coupled to be slidably provided with a roller or the like.

For example, the door 182 is provided on the side of the crushing chamber 180 when a passage with an inclination is provided in the inner space 181 so that the silicon wafer inserted through the inlet 183 leads to the upper portion of the crusher 300 . may be located.

Meanwhile, the silicon wafer may be introduced into the crushing chamber 180 through the inlet 183 according to the opening and closing of the door 182 . For example, when the door 182 is opened, the user may insert a silicon wafer through the inlet 183 .

In the present disclosure, the door 182 may be sealed to prevent the fluid existing in the inner space 181 from flowing in and out.

Specifically, a rubber gasket or the like may be provided at a position where the door 182 and the inlet 183 are coupled to prevent movement of the fluid. In this case, the rubber gasket may be provided at the edge of the door 182 . Alternatively, the rubber gasket may be provided at the edge of the inlet 183 . Also, when the door 182 is closed, the rubber gasket provided between the door 182 and the inlet 183 is compressed to prevent movement of the fluid. However, the sealing process of the door 182 is not limited to the above-described example.

In the present disclosure, the crushing chamber 180 may include an additional door in one area below the side. The additional door may be a door through which a person or a mechanical device enters the crushing chamber 180 . In addition, the additional door may be sealed in the same manner as the above-described door 182 .

The driving unit 120 includes a driving motor 121 , a shaft 122 of the driving motor, a coupling 123 , a driving shaft 124 , a first driven shaft 125 , a second driven shaft 126 , and a third driven shaft. (127), fourth driven shaft 128, fifth driven shaft 129, first bevel gear portion 211, second bevel gear portion 212, third bevel gear portion 213, reduction gear portion It may include a 214 and a spur gear unit 215 . However, since the above-described components are not essential to implement the driving unit 120 , the driving unit 120 may have more or fewer components than those listed above.

Meanwhile, the driving unit 120 may drive the crusher 300 , the cone crusher 400 , and the ball mill device 700 through the driving motor 121 .

The driving motor 121 is a motor for rotating the shaft 122 of the driving motor under the control of the controller 110 , and may include an AC motor, a DC motor, and a BLDC motor. However, the present invention is not limited thereto, and various motors may be used as the driving motor 121 .

The driving motor 121 may be located outside the crushing chamber 180 . However, the position of the driving motor 121 is not limited to the outside of the crushing chamber 180 , and may be located inside the crushing chamber 180 .

The driving motor 121 may transmit the generated rotational force to the driving shaft 124 through the shaft 122 of the driving motor.

Specifically, the shaft 122 of the drive motor may be coupled to the drive shaft 124 through the coupling 123 . In addition, the drive shaft 124 coupled through the coupling 123 may rotate together as the shaft 122 of the drive motor rotates.

Meanwhile, at least a portion of the driving shaft 124 may be inserted into the inner space 181 of the crushing chamber 180 to transmit power to the cone crusher 400 . Here, the drive shaft 124 may be a shaft made of a solid shaft, or the like.

Meanwhile, the driving shaft 124 may be hermetically coupled to the crushing chamber 180 in order to prevent the fluid from being introduced or discharged into the internal space 181 of the crushing chamber 180 .

Specifically, a groove into which the drive shaft 124 is inserted may be provided in one heat region of the crushing chamber 180 . In addition, a bearing may be coupled to the groove so that the driving shaft 124 can rotate. In this case, a gasket may be coupled to a portion where the groove and the bearing are coupled to prevent the inflow of fluid. Here, the gasket may be a retainer made of a rubber material or the like.

Specifically, the gasket may have an outer diameter greater than a diameter of the groove and an inner diameter smaller than a diameter of the groove. In addition, when the bearing and the groove are coupled, the gasket may be provided on the outer wall surface and the inner wall surface of the crushing chamber 180 . And, by coupling a plate having a hole relatively larger than the diameter of the drive shaft 124 with the crushing chamber 180 through a bolt, the gasket is compressed on the outer and inner wall surfaces of the crushing chamber 180 to prevent the inflow of fluid. can

On the other hand, a silicon gasket, etc. may be evenly distributed in a portion where the drive shaft 124 and the bearing are coupled. Here, the silicone gasket is a liquid-type gasket that can prevent the movement of fluid, and may be a kind of bond.

In addition, the silicone gasket may be evenly distributed over the coupling portion between the bearing and the drive shaft 124 and then harden after a certain period of time to prevent the inflow and outflow of the fluid.

The first driven shaft 125 may receive power from the driving shaft 124 through the first bevel gear unit 211 . Here, the first driven shaft 125 may be a shaft made of a solid shaft.

Specifically, the first bevel gear unit 211 may include a bevel gear coupled to one area of the driving shaft 124 and a bevel gear coupled to one area of the first driven shaft 125 . In addition, the two bevel gears included in the first bevel gear unit 211 may be engaged at right angles. Accordingly, the bevel gear coupled to one region of the driving shaft 124 may transmit the power received from the driving shaft 124 to the bevel gear coupled to one region of the first driven shaft 125 .

That is, the driving shaft 124 may transmit power to the first driven shaft 125 forming a right angle to the driving shaft 124 through the first bevel gear unit 211 .

Meanwhile, the second driven shaft 126 may receive power from the first driven shaft 125 through the reduction gear unit 214 to transmit power to the ball mill device 700 . Here, the second driven shaft 126 may be a shaft made of a solid shaft.

Specifically, the reduction gear unit 214 may include a first reduction gear coupled to one area of the first driven shaft 125 and a second reduction gear coupled to one area of the second driven shaft 126 . . In addition, the first reduction gear and the second reduction gear may mesh with each other. Accordingly, the first reduction gear may transmit the power received from the first driven shaft 125 to the second reduction gear. Here, the number of teeth of the first reduction gear may be different from the number of teeth of the second reduction gear.

That is, the first driven shaft 125 may transmit power to the second driven shaft 126 through the reduction gear unit 214 . In addition, the rotation speed of the first driven shaft 125 and the second driven shaft 126 may be different by the reduction gear unit 214 .

Specifically, the number of teeth of the second reduction gear may be greater than the number of teeth of the first reduction gear. Accordingly, the rotation speed of the first driven shaft 125 may be faster than the rotation speed of the second driven shaft 126 .

Also, the third driven shaft 127 may receive power from the second driven shaft 126 through the second bevel gear unit 212 . Here, the third driven shaft 127 may be a shaft made of a solid shaft.

Specifically, the second bevel gear unit 212 may include a bevel gear coupled to one area of the second driven shaft 126 and a bevel gear coupled to one area of the third driven shaft 127 . In addition, the bevel gear coupled to one area of the second driven shaft 126 and the bevel gear coupled to one area of the third driven shaft 127 may be engaged at right angles. Accordingly, the bevel gear coupled to one area of the second driven shaft 126 may transmit the power received from the second driven shaft 126 to the bevel gear coupled to one area of the third driven shaft 127 .

That is, the second driven shaft 126 may transmit power to the third driven shaft 127 which is perpendicular to the second driven shaft 126 through the second bevel gear unit 212 .

Similarly, the fourth driven shaft 128 may receive power from the third driven shaft 127 through the third bevel gear unit 213 .

Specifically, the third bevel gear unit 213 may include a bevel gear coupled to one area of the third driven shaft 127 and a bevel gear coupled to one area of the fourth driven shaft 128 . And, the bevel gear coupled to one region of the third driven shaft 127 and the bevel gear coupled to one region of the fourth driven shaft 128 may be engaged at right angles. Accordingly, the bevel gear coupled to one area of the third driven shaft 127 may transmit the power received from the third driven shaft 127 to the bevel gear coupled to one area of the fourth driven shaft 128 .

That is, the third driven shaft 127 may transmit power to the fourth driven shaft 128 forming a right angle to the third driven shaft 127 through the third bevel gear unit 213 .

In the present disclosure, the number of teeth of the bevel gear included in the first bevel gear unit 211 , the second bevel gear unit 212 , and the third bevel gear unit 213 may be different from each other.

Specifically, the number of teeth of each of the two bevel gears included in the first bevel gear unit 211 may be different. In addition, the driving unit 120 may drive the rotation speed of the driving shaft 124 and the speed of the first driven shaft 125 differently through two bevel gears having different numbers of teeth. However, the present invention is not limited thereto, and gear ratios of the second bevel gear unit 212 and the third bevel gear unit 213 may be different.

Meanwhile, the fifth driven shaft 129 may receive power from the fourth driven shaft 128 through the spur gear unit 215 .

Specifically, the spur gear unit 215 may include a first spur gear coupled to one area of the fourth driven shaft 128 and a second spur gear coupled to one area of the fifth driven shaft 129 . In addition, the first spur gear and the second spur gear may mesh with each other. Accordingly, the first spur gear may transmit the power received from the fourth driven shaft 128 to the second spur gear.

That is, the fourth driven shaft 128 may transmit power to the fifth driven shaft 129 through the spur gear unit 215 .

In the present disclosure, the crusher 300 may be located in the inner space 181 of the crushing chamber 180 and disposed below the inlet 183 .

Specifically, the crusher 300 may be disposed below the inlet 183 so that the silicon wafer input through the inlet 183 can be put into the crusher 300 without any special transfer. However, the position of the crusher 300 is not limited to the lower portion of the inlet 183 , and may be located in another position of the internal space 181 .

For example, when the crushing device 100 is provided with a passage inclined from the inlet 183 , the crusher 300 may be provided on the opposite side of the inclined passage located on the inlet 183 side.

The crusher 300 may crush the silicon wafer inserted through the inlet 183 . A detailed description of the crusher 300 will be described later in more detail with reference to FIG. 3 .

In the present disclosure, between the crusher 300 and the inlet 183 , a hopper-type silicon wafer storage unit capable of transporting and loading silicon wafers may be included. In addition, the upper side (ie, the inlet side) of the hopper-shaped silicon wafer storage unit may be provided with a larger area than the inlet 183 . Accordingly, it is possible to prevent the silicon wafer introduced through the inlet 183 from flowing down without being put into the crusher 300 .

In addition, in the present disclosure, a valve may be provided at the lower side (ie, the crusher side) of the silicon wafer storage unit. And, when the operation of the crusher 300 is sensed, the controller 110 may control the valve so that the silicon wafer can be inserted.

Meanwhile, the cone crusher 400 may be located in the inner space 181 of the crushing chamber 180 and disposed below the crusher 300 .

Specifically, the cone crusher 400 may be disposed below the crusher 300 so that the first discharge discharged through the crusher 300 can be introduced into the cone crusher 400 without any special transport. However, the position of the cone crusher 400 is not limited to the lower portion of the crusher 300 , and may be located in another position of the internal space 181 .

For example, when an inclined passage is provided below the crusher 300 , the cone crusher 400 may be provided on the opposite side of the inclined passage located on the crusher 300 side.

The cone crusher 400 may crush the first discharge discharged from the crusher 300 . A detailed description thereof will be described later with reference to FIG. 4 .

Meanwhile, the collector 500 may be located in the inner space 181 of the crushing chamber 180 and may be disposed below the cone crusher 4090 . In addition, the collector 500 may be formed in the form of a hopper that becomes narrower from the upper side to the lower side to receive the second discharge that has fallen from the discharge unit 470 of the cone crusher 400 .

The inlet portion of the collector 500 may be connected to the discharge portion 470 of the cone crusher 400 to collect the second discharge discharged from the cone crusher 400 . In addition, the second discharge may be discharged through a collector discharge unit provided below the collector 500 .

Here, the area of the upper side (ie, the side connected to the discharge unit) of the collector 500 may be larger than the area of the discharge unit 470 of the cone crusher 400 . Accordingly, the second discharge discharged through the discharge unit 470 may be prevented from flowing down.

In addition, a tread mill 600 may be provided below the collector 500 . That is, the collector 500 may be disposed between the cone crusher 400 and the tread mill 600 .

In the present disclosure, a valve may be provided at the collector discharge unit provided in the collector 500 . And, when the operation of the treadmill 600 is sensed, the controller 110 may control the valve so that the second discharge is discharged.

The tread mill 600 is located in the inner space 181 of the crushing chamber 180 and may transport the second discharge discharged from the collector 500 to the ball mill apparatus 700 . In addition, the tread mill 600 may input the second discharge through the ball mill input unit 730 provided in the ball mill apparatus 700 .

Specifically, the treadmill 700 may include a belt unit (not shown), a timing gear unit (not shown), a support unit (not shown), and an electric motor (not shown). However, since the above-described components are not essential in implementing the tread mill 700 , the tread mill 700 may have more or fewer components than those listed above.

The belt unit may mount the second discharge discharged from the collector 500 . Specifically, one side of the belt part is located below the collector discharge part, and when the collector 500 discharges the second discharge part, the falling second discharge may be loaded.

In the present disclosure, the belt unit may be a timing belt provided with a sawtooth shape on the inner surface.

Specifically, the belt part may be provided with a tooth shape on the inside of the belt so that it can rotate in engagement with the timing gear part.

The timing gear unit may receive power through the electric motor to rotate the belt unit. Specifically, the timing gear unit may be directly coupled to the shaft of the electric motor or may receive power from the electric motor through a pulley, a gear, a V-belt, or the like.

In addition, the timing gear unit may mesh with the inner surface of the belt unit. Accordingly, the power generated by the electric motor can be transmitted to the belt portion through the timing gear portion.

The support part may be provided with a leg and a support plate capable of supporting the belt part and the timing gear part so that the tread mill 600 can be driven.

In the present disclosure, the legs included in the support part of the treadmill 600 may have different heights so that the belt part has an inclination.

Specifically, the tread mill 600 may have an inclination such that the height gradually increases from one side of the lower side of the collector 500 to the upper side of the ball mill apparatus 700 which is the other side. Accordingly, the position of the ball mill device 700 may not be limited to the lower portion of the cone crusher 400 .

According to some embodiments of the present disclosure, the timing gear unit of the tread mill 600 may receive power from the driving motor 121 included in the driving unit 120 .

Specifically, a fourth bevel gear part may be provided in one region of the second driven shaft 126 . And, it may include a sixth driven shaft that receives power from the second driven shaft through the fourth bevel gear unit. In this case, one side of the sixth driven shaft may be coupled to the timing gear unit of the tread mill 600 . Accordingly, the tread mill 600 may receive power from the driving motor 121 . However, the shaft for transmitting power to the treadmill 600 is not limited to the second driven shaft.

In the present disclosure, the crushing apparatus 100 may not include the tread mill 600 between the collector 500 and the ball mill apparatus 700 .

For example, an inclined passage leading to the input portion of the ball mill device 700 may be provided below the collector 500 . As another example, the ball mill apparatus 700 may be positioned below the collector 500 to directly receive the second discharge discharged from the collector 500 .

On the other hand, the ball mill device 700 may be located at one position in the inner space 181 of the crushing chamber 180 .

The ball mill apparatus 700 may receive the second discharge discharged from the collector 500 through the tread mill 600 . And, the ball mill device 700 may pulverize the input second discharge. A detailed description thereof will be described later with reference to FIG. 5 .

The crusher 100 is driven by transmitting power to the crusher 300, the cone crusher 400, and the ball mill device 700 through one driving motor 121 provided in the driving unit 120 as described above. can That is, the crushing device 100 does not need to include a driving motor for driving each of the crusher 300, the cone crusher 400, and the ball mill device 700, and the crushing device ( 100 may drive each of the crusher 300 , the cone crusher 400 , and the ball mill device 700 . Accordingly, the size of the crushing apparatus 100 may be reduced.

3 is a perspective view for explaining a crusher according to some embodiments of the present disclosure.

According to some embodiments of the present disclosure, the crusher 300 may receive a silicon wafer through the inlet 183 . In addition, when the silicon wafer is inserted through the inlet 183 , the crusher 300 may pulverize the inputted silicon wafer to discharge the first discharge.

Referring to FIG. 3 , the crusher 300 may include a first crushing roller 310 , a second crushing roller 320 , and at least one cutter 330 . However, since the above-described components are not essential in implementing the crusher 300, the crusher 300 may have more or fewer components than those listed above.

The first crushing roller 310 may be coupled to the fourth driven shaft 128 and rotate together according to the rotation of the fourth driven shaft 128 . Here, the fourth driven shaft 128 may receive power from the driving motor 121 through the bar described with reference to FIGS. 1 to 2 .

The first crushing roller 310 may be coupled to the fourth driven shaft 128 by coupling a key or the like to a key groove provided on the inner circumferential surface. In addition, a key groove for coupling with the first crushing roller 310 may be provided on the fourth driven shaft 128 . However, the coupling of the first crushing roller 310 and the fourth driven shaft 128 is not limited to the above-described example.

The second crushing roller 320 may be coupled to the fifth driven shaft 129 and rotate together according to the rotation of the fifth driven shaft 129 . Here, the fifth driven shaft 129 may rotate by receiving power from the fourth driven shaft 128 through the spur gear unit 215 .

The second crushing roller 320 may be coupled to the fifth driven shaft 129 by coupling a key or the like to a key groove provided on the inner circumferential surface. In addition, a key groove for coupling with the second crushing roller 320 may be provided on the fifth driven shaft 129 .

In addition, the second crushing roller 320 may rotate in opposite directions to the first crushing roller 310 so as to insert the silicon wafer from the top to the bottom between the first crushing roller 310 and the shaft.

Meanwhile, the first crushing roller 310 and the second crushing roller 320 may include at least one cutter 330 in the shape of a ratchet gear on an outer peripheral surface of a cylindrical shape constituting the roller. Here, the ratchet gear shape may be a toothed wheel shape rotatably formed in only one direction. However, the shape of the cutter 330 is not limited to the ratchet gear shape, and may have various shapes for pulverizing the silicon wafer.

According to some embodiments of the present disclosure, the first crushing roller 310 and the second crushing roller 320 may include at least one cutter 330 . In addition, the at least one cutter 330 rotates in the axial direction from one side of the roller to the other side and may be coupled to the first crushing roller 310 .

Specifically, referring to FIG. 3 , it can be seen that a plurality of cutters 330 are provided on the opposite side of the spur gear part 215 of the first crushing roller 310 . In addition, it can be seen that the cutters provided a little closer to the spur gear part 215 from the plurality of cutters 330 are rotated a little in the clockwise direction to be coupled. In the same way, it can be seen that each of the plurality of cutters 330 rotates clockwise from one side to the other side (spur gear side) and is coupled to the first crushing roller 310 .

In addition, the at least one cutter 330 of the second crushing roller 320 rotates in the opposite direction to the at least one cutter 330 provided in the first crushing roller 310 and may be coupled to the second crushing roller. .

That is, the first crushing roller 310 and the second crushing roller 320 are provided with at least one cutter 330 as described above, so that the silicon wafer is repelled by a repulsive force against the stress generated in the crushing process. can be suppressed

Accordingly, the crusher 300 may obtain the first effluent by crushing the silicon wafer. That is, silicon wafers can be pulverized so that they can be recycled.

4 is a cross-sectional perspective view for explaining a cone crusher according to some embodiments of the present disclosure.

According to some embodiments of the present disclosure, the cone crusher 400 may receive the first discharge from the crusher 300 . Also, the cone crusher 400 may pulverize the input first discharge and discharge the second discharge.

Referring to FIG. 4 , the cone crusher 400 includes a main frame 410 , a first hollow part 420 , a second hollow part 430 , a first shell 440 , a second shell 450 , and a crushing part. It may include a 460 and a discharge unit 470 . However, the above-described components are not essential in implementing the cone crusher 400, so the cone crusher 400 may have more or fewer components than those listed above.

The main frame 410 forms the exterior of the cone crusher 400 and may have a cylindrical shape. However, the shape of the main frame 410 is not limited thereto and may be formed in various shapes.

The main frame 410 may have an opening at the upper side through which the first discharge discharged from the crusher 300 is introduced into the main frame 410 . Also, the main frame 410 may include a discharge unit 470 through which the second discharge generated by pulverizing the first discharge is discharged in one lower area.

The first shell 440 may be disposed in the upper opening of the main frame 410 . In addition, the cross-sectional area of the first shell 440 may increase toward the lower side.

Specifically, the first shell 440 may have a structure that can narrow the space of the first hollow part 420 toward the lower side.

Meanwhile, the first hollow part 420 may be a space corresponding to the first shell 440 provided in the main frame 410 . Specifically, the first hollow portion 420 may be disposed in the opening of the main frame 410 and may have a reduced cross-sectional area corresponding to the first shell 440 having a larger cross-sectional area toward the lower side.

The second shell 450 may be disposed below the first shell 440 . In addition, the cross-sectional area of the second shell 450 may decrease toward the lower side.

Specifically, the second shell 450 may have a structure that can widen the space of the second hollow part 430 toward the lower side.

Meanwhile, the second hollow part 430 may be a space corresponding to the second shell 450 provided in the main frame 410 . Specifically, the second hollow part 430 may be disposed on the lower side of the first shell 440 , and the cross-sectional area may increase in response to the second shell 450 having a narrower cross-sectional area toward the lower side.

The crushing part 460 may be disposed inside the first hollow part 420 and the second hollow part 430 . In addition, the crushing unit 460 may be formed in a cone shape sharp upwards.

Specifically, the first hollow part 420 may have an upper side of the crushing part 460 . Here, the upper side of the crushing unit 460 may mean the same height as the height of the first shell 440 . In addition, the space of the first hollow part 420 may be narrowed by the crushing part 460 toward the direction in which the lower second hollow part 430 is located. That is, the upper side of the first hollow part 420 may have a wide space to receive the first pulverized material, and the lower side may have a narrow space so that the first shell 440 and the pulverization unit 460 can come into close contact with each other. .

Meanwhile, the second hollow part 430 may have a lower side of the crushing part 460 . Here, the lower side of the crushing unit 460 may mean from a position corresponding to a point where the first shell 440 and the second shell 450 contact each other to the bottom surface of the crushing unit 460 . In addition, the space in which the crushing part 460 is provided may become narrow as the second hollow part 430 goes downward. That is, as the second hollow part 430 goes from the upper side to the lower side, the space in which the crushing part 460 can be located may become narrower.

A coupling part (not shown) for coupling with the driving shaft 124 may be provided at a lower side of the crushing part 460 . And, the coupling portion of the crushing unit 460 is coupled to the drive shaft 124 through a coupling, a flange, a gear, a pulley, a belt, etc., thereby receiving power. can The grinding unit 460 that receives power from the driving motor 121 through the driving shaft 124 may rotate.

In addition, the crushing unit 460 may be coupled to the drive shaft 124 to rotate along with the rotation of the drive shaft 124 . And, the lower side of the crushing unit 460 may cause friction on the first discharge through the second shell 450 to crush the first discharge input from the crusher 300 .

Accordingly, the cone crusher 400 may discharge the second discharge by crushing the first discharge. In other words, silicon wafers can be pulverized more finely so that they can be recycled.

The pulverized first discharge (ie, the second discharge) may be discharged to the outside of the cone crusher 400 through the discharge unit 470 provided in the cone crusher 400 .

5 is a schematic diagram for explaining a ball mill apparatus according to some embodiments of the present disclosure.

According to some embodiments of the present disclosure, the ball mill apparatus 700 may receive the second discharge through the tread mill 600 . Also, the ball mill apparatus 700 may pulverize the second discharge to discharge the third discharge.

Referring to FIG. 5 , the ball mill apparatus 700 may include a sub-chamber 710 , a ball 720 , a second discharge input unit 730 , and a third discharge discharge unit 740 . However, the above-described components are not essential in implementing the ball mill apparatus 700 , and thus the ball mill apparatus 700 may have more or fewer components than those listed above.

The inner surface of the sub-chamber 710 may be formed of a special steel or nickel plate. However, the present invention is not limited thereto.

The ball 720 (steel ball) may be formed of cast iron, chile casting, flint stone, natural stone, or the like, and may have a spherical shape. However, the present invention is not limited thereto.

In addition, the sub-chamber 710 may be coupled to the second driven shaft 126 to rotate together according to the rotation of the second driven shaft 126 .

Specifically, a coupling part (not shown) for coupling with the second driven shaft 126 may be provided at one side of the sub-chamber 710 . In addition, the coupling portion of the sub-chamber 710 may be coupled to the second driven shaft 126 through a coupling, a flange, a gear, or the like, thereby receiving power. The sub-chamber 710 that receives power from the driving motor 121 through the second driven shaft 126 may rotate.

Meanwhile, the sub-chamber 710 may have a plurality of balls 720 therein.

When the sub-chamber 710 rotates, the plurality of balls 720 provided in the sub-chamber 710 may cause impulse mill friction as the sub-chamber 710 rotates to pulverize the second discharge. That is, as the sub-chamber 710 rotates, the plurality of balls 720 may pulverize the second impurity due to the impact caused by the steel ball motion.

The second discharge input unit 730 may receive the second discharge from the tread mill 600 . For example, the upper side of the second discharge input unit 730 may have a larger area than the width of the belt unit of the treadmill 600 . Accordingly, when the second discharge input unit 730 receives the second discharge through the tread mill 600, the second discharge may be prevented from flowing down.

The pulverized second discharge (ie, the third discharge) may be discharged to the outside of the ball mill apparatus 700 through the third discharge discharge unit 740 .

In the present disclosure, during the pulverization operation of the ball mill device 700, a plurality of balls 720 made of special steel or ceramic collide with and rub against a raw material (ie, a second impurity) to pulverize the pulverization object. The crushing of the crushing object may be achieved while the ball 720 and the crushing object collide with each other by centrifugal force (Coriolis force) in opposite directions through rotation in the opposite direction to the revolving direction.

Accordingly, the ball mill apparatus 700 may obtain the third effluent by crushing the second effluent. That is, the pulverized silicon wafer pulverized in the cone crusher 400 may be pulverized more finely so that it can be recycled.

6 is a flowchart for explaining an example of a method in which the crushing device according to some embodiments of the present disclosure is driven.

Referring to FIG. 6 , the control unit 110 may control the air discharge unit 130 to discharge the air present in the inner space 181 of the crushing chamber 180 to the outside ( S110 ).

Specifically, when the control unit 110 receives a signal requesting operation from the user of the crushing apparatus 100, the air present in the internal space 181 through the vacuum pump provided in the air discharge unit 130 to the outside can be discharged with Here, the control unit 110 may control the air discharge unit 130 to discharge air for a preset time.

In addition, the control unit 110 may control the air discharge unit 130 to discharge air until the oxygen concentration of the inner space 181 measured by the oxygen concentration measurement unit 150 becomes less than a preset concentration. .

Meanwhile, when the air is discharged to the outside, the controller 110 may control the gas input unit 140 to inject the gas into the internal space 181 ( S120 ).

Specifically, the controller 110 may control the gas input unit 140 so that argon gas or nitrogen gas, which is an inert gas, is introduced into the internal space 181 . Here, the controller 110 may control the gas input unit 140 to inject gas into the internal space 181 for a preset time.

Also, the controller 110 may control the gas input unit 140 to inject gas into the internal space 181 until the gas concentration measured by the gas concentration measurement unit 160 becomes a preset concentration.

When the gas concentration of the internal space 181 measured by the gas concentration measuring unit 160 exceeds a preset concentration, the controller 110 may drive the crusher, the cone crusher, and the ball mill device (S130).

Here, the preset concentration may be a concentration with a small risk of fire due to driving of the device when driving at least one device provided in the internal space 181 . That is, the control unit 110 may drive the driving unit 120 when the gas is injected through the gas input unit 140 to exceed the concentration stored as safe from combustion and ignition in the memory or the like.

On the other hand, the crusher 100 may crush the silicon wafer by driving the crusher 300 , the cone crusher 400 and the ball mill apparatus 700 .

7 is a flowchart illustrating an example of a method of processing a silicon wafer according to some embodiments of the present disclosure.

Referring to FIG. 7 , the shredding apparatus 100 may insert a silicon wafer into the inlet 183 according to the opening and closing of the door 182 provided in the shredding chamber 180 ( S210 ).

Here, the silicon wafer may be a recyclable resource capable of obtaining silicon nitride and the like having a high added value.

In addition, the silicon wafer may be inserted into the inlet 183 through a user, a mechanical device, a passage, or the like. Here, the mechanical device may be a robot arm that can be manipulated by a user. Also, the apparatus may be a trade mill or the like for transporting silicon wafers.

Also, the passage may have a downward slope from the inlet to the outlet. Also, the exit side of the passage may be located above the door. In addition, when the door 182 is opened, a user or a mechanical device may insert a silicon wafer into the entrance of the door. In addition, the input silicon wafer may be put into the inlet 183 of the crushing chamber 180 through the outlet.

Meanwhile, the crusher 100 may first crush the silicon wafer input from the inlet 183 through the crusher 300 provided in the inner space 181 ( S220 ).

Specifically, the silicon wafer inserted through the inlet 183 may fall upward of the crusher 300 . In addition, the crusher 300 may receive power through the driving unit 120 to rotate the first crushing roller and the second crushing roller in opposite directions to crush the input silicon wafer. Here, the first crushing roller and the second crushing roller may be provided with at least one cutter for crushing the silicon wafer.

In addition, the crusher 100 may secondary crush the first discharge discharged from the crusher 300 through the cone crusher 400 (S230).

Specifically, the crusher 300 may pulverize the silicon wafer to discharge the first discharge. In addition, the cone crusher 400 may be positioned below the crusher 300 to receive the first discharge dropped from the crusher 300 . In addition, the cone crusher 400 may receive power through the driving unit 120 to rotate the crushing unit 460 to crush the input first discharge.

Specifically, the first discharge may be introduced into the second hollow portion 430 provided between the crushing unit 460 having a cone shape pointed upward and the second shell 450 . And, the first discharge injected into the second hollow part 430 may be more finely pulverized by the friction generated between the pulverizing unit 460 rotates and the second shell 450 .

On the other hand, the first discharge pulverized by the cone crusher 400 may be discharged as a second discharge through the discharge unit 470 provided at the lower side of the cone crusher 400, and the discharged second discharge is the collector 500 can be loaded on

The crushing apparatus 100 may transfer the second discharge discharged from the cone crusher 400 and loaded on the collector 500 to the ball mill apparatus 700 through the tread mill 600 ( S240 ).

Specifically, the collector 500 may be located below the discharge unit 470 provided below the cone crusher 400 . In addition, the collector 500 may load the second discharge discharged from the cone crusher 400 .

At this time, when the operation of the treadmill 600 is sensed, the collector 500 may discharge the second discharge.

Specifically, the controller 110 may control the treadmill 600 to be driven. For example, the controller 110 may control the electric motor of the treadmill 600 to drive the belt part of the treadmill 600 .

As another example, at least one driven shaft included in the driving unit 120 and a part of the tread mill 600 may be coupled to drive the belt unit of the tread mill 600 .

When it is recognized that the belt unit is being driven, the control unit 110 may control a valve provided in the discharge unit of the collector 500 to load the second discharge product onto the treadmill. Then, the loaded second discharge may be transferred to the ball mill device.

Meanwhile, the crushing device 100 may thirdly crush the second discharge transferred through the tread mill 600 through the ball mill device 700 ( S250 ).

Specifically, the crushing apparatus 100 may input the second discharge through the tread mill 600 to the second discharge input unit 730 provided in the ball mill apparatus 700 . In addition, the sub-chamber 710 of the ball mill apparatus 700 may rotate by receiving power from the driving unit 120 . At this time, the plurality of balls 720 provided in the sub-chamber 710 may rise upward by rotation and then fall by gravity. In addition, the second discharge injected into the sub-chamber 710 may be pulverized due to the impact generated by the falling of the plurality of balls 720 .

The third discharge pulverized by the ball mill apparatus 700 of the crushing apparatus 100 may be discharged to the outside (S260).

Specifically, the third discharge may be discharged to the outside through a person or a mechanical device.

Therefore, the silicon wafer put into the crushing device 100 may be finely crushed so that it can be recycled through the above-described device or the like.

On the other hand, the finely pulverized silicon wafer may be transferred to the outside of the crushing device 100 and post-processed through the external device.

For example, the finely pulverized silicon wafer may have improved purity through washing with a mixed acid or the like. In addition, cleaning of the pulverized silicon wafer with the mixed acid may be performed through an impurity removal device or the like.

As another example, a silicon wafer that has been finely pulverized and washed with a mixed acid may be transferred to a high energy ball mill apparatus. In addition, the silicon wafer transferred to the high energy ball mill device may be pulverized to a nano size smaller than the third effluent.

The description of the presented embodiments is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the scope of the present disclosure. Thus, the present disclosure is not intended to be limited to the embodiments presented herein, but is to be construed in the widest scope consistent with the principles and novel features presented herein.

The scope of the rights to the method in the claims of the present disclosure is generated by the functions and features described in each step, and unless the precedence of the order is specified in each step constituting the method, the claims It is not affected by the order of description of each step in For example, in a claim described as a method comprising steps A and B, even if step A is stated before step B, the scope of rights is not limited that step A must precede step B.

Claims (15)

a crushing chamber having an enclosed interior space;
an inlet having a door that can be opened and closed located in one area of the upper surface of the crushing chamber and into which a silicon wafer is put;
a crusher located in the inner space and disposed below the inlet to crush the silicon wafer inserted through the inlet;
a cone crusher located in the inner space and disposed below the crusher to crush the first discharge discharged from the crusher;
a collector located in the inner space and disposed below the cone crusher to collect a second discharge discharged from the cone crusher;
a ball mill receiving the second discharge discharged from the collector and pulverizing the second discharge; and
a driving unit for driving the crusher, the cone crusher, and the ball mill device;
an air discharge unit for discharging air existing in the inner space to the outside;
a gas input unit for introducing gas when the air is discharged from the inner space to the outside through the air discharge unit;
a gas concentration measuring unit for measuring the concentration of the gas in the crushing chamber;
including,
The gas input unit,
Putting the gas into the inner space until the concentration of the gas in the fracturing chamber measured by the gas concentration measurement unit becomes a preset concentration,
crushing device. The method of claim 1,
The driving unit:
a driving motor located outside the chamber;
a drive shaft coupled to the shaft of the drive motor and having at least a portion inserted into the inner space to transmit power to the cone crusher;
a first driven shaft receiving power from the drive shaft through a first bevel gear part;
a second driven shaft receiving power from the first driven shaft through a reduction gear unit and transmitting power to the ball mill device;
a third driven shaft receiving power from the second driven shaft through a second bevel gear part;
a fourth driven shaft receiving power from the third driven shaft through a third bevel gear unit and transmitting power to the crusher;
comprising,
crushing device. 3. The method of claim 2,
The cone crusher,
a cylindrical main frame having an opening at an upper side through which the first discharge is introduced and a discharge unit through which the second discharge is discharged;
a first shell disposed in the opening of the main frame, the first shell having a first hollow having a reduced cross-sectional area toward a lower side;
a second shell disposed under the first shell and provided with a second hollow part whose cross-sectional area increases toward the lower side; and
It is disposed inside the first hollow part and the second hollow part, has a cone shape pointed upward, is coupled to the drive shaft, rotates together according to the rotation of the drive shaft, and causes friction with the second shell to pulverize the first discharge a cone-shaped crushing unit;
comprising,
crushing device. 3. The method of claim 2,
The ball mill device,
a sub-chamber coupled to the second driven shaft and rotated together according to the rotation of the second driven shaft; and
a plurality of balls provided in the sub-chamber to cause collision and friction as the sub-chamber rotates to pulverize the second discharge;
comprising,
crushing device. 3. The method of claim 2,
The crusher,
a first crushing roller coupled to the fourth driven shaft and rotating together with the rotation of the fourth driven shaft;
a rotating fifth driven shaft that receives power from the fourth driven shaft through a spur gear;
It is coupled with the fifth driven shaft and rotates as the fifth driven shaft rotates, and rotates in the opposite direction to the first crushing roller so as to pull the silicon wafer from the top to the bottom between the first crushing roller and the shaft. a second crushing roller;
containing,
crushing device. 6. The method of claim 5,
The first crushing roller and the second crushing roller,
Having at least one cutter in the shape of a ratchet gear on the outer peripheral surface of the cylindrical shape,
crushing device. delete delete The method of claim 1,
The gas is
containing at least one of argon gas or nitrogen gas,
crusher The method of claim 1,
an oxygen concentration measuring unit for measuring the concentration of oxygen in the crushing chamber;
further comprising,
The gas input unit,
When the concentration of oxygen in the crushing chamber measured through the oxygen concentration measurement unit is less than a preset concentration, injecting the gas into the inner space,
crushing device. delete The method of claim 1,
The gas input unit,
When the concentration of the gas measured by the gas concentration measurement unit exceeds a preset concentration, stopping the input of the gas
crushing device. The method of claim 1,
The drive unit,
When the concentration of the gas measured by the gas concentration measurement unit exceeds a preset concentration, driving the crusher, the cone crusher and the ball mill device,
crushing device. The method of claim 1,
a tread mill located in the inner space and conveying the second discharge discharged from the collector to the ball mill device and inputting the second discharge to the ball mill device;
further comprising,
crushing device. 15. The method of claim 14,
The collector is
It is made in the form of a hopper to receive the second discharge that has fallen from the cone crusher,
disposed between the tread mill and the cone crusher,
crushing device.

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