KR102304816B1 - Display device - Google Patents

Abstract

A display device is disclosed. The display device of the present disclosure includes a display panel; a module cover positioned at the rear of the display panel; a PCB coupled to the module cover, on which a plurality of elements are located; and a vapor chamber coupled to the PCB and in contact with a heating element which is at least one element among the plurality of elements, wherein the vapor chamber includes: a first plate having a heat absorbing part in contact with the heating element; a second plate coupled to the first plate; In addition, a fluid flowing in a space provided between the first plate and the second plate is included, and the first plate is spaced apart from the plurality of elements in a portion excluding the heat absorbing part.

Description

display device {DISPLAY DEVICE}

The present disclosure relates to a display device.

As the information society develops, the demand for display devices is also increasing in various forms. Various display devices such as display) and OLED (Organic Light Emitting Diode) have been researched and used.

Among them, a display device using an organic light emitting diode (OLED) has superior luminance and viewing angle compared to a liquid crystal display device, and does not require a backlight unit, so it can be implemented in an ultra-thin shape.

In addition, many studies have been made on a structure capable of effectively removing heat generated by displaying a high-quality image in a large-screen ultra-thin display device.

For example, as a heat dissipation structure, the vapor chamber may cool a heat generating element that generates high-temperature heat. Accordingly, it is possible to prevent thermal damage to the elements adjacent to the heating element according to space constraints.

SUMMARY OF THE INVENTION The present disclosure aims to solve the above and other problems.

Another object may be to provide a display device capable of effectively cooling the heating element while occupying a relatively small volume.

Another object may be to provide a display device in which evaporation of fluid or cooling of the heating element can be smoothly performed by preventing contact between elements other than the heating element and the vapor chamber.

Another object may be to provide a display device capable of securely fixing the vapor chamber to the PCB.

Another object may be to provide a display device capable of smoothly performing evaporation of fluid or cooling of a heating element by moving a fluid adjacent to the lower end to a heat absorbing part where the fluid is evaporated.

Another object may be to provide a display device capable of reducing noise generated during the evaporation process of the fluid.

According to an aspect of the present disclosure for achieving the above object, a display panel; a module cover positioned at the rear of the display panel; a PCB coupled to the module cover, on which a plurality of elements are located; and a vapor chamber coupled to the PCB and in contact with a heating element that is at least one element among the plurality of elements, wherein the vapor chamber includes: a first plate having a heat absorbing part in contact with the heating element; a second plate coupled to the first plate; In addition, there is provided a display device including a fluid flowing in a space provided between the first plate and the second plate, wherein the first plate is spaced apart from the plurality of elements in a portion excluding the heat absorbing part.

The effect of the display device according to the present disclosure will be described as follows.

According to at least one of the embodiments of the present disclosure, it is possible to provide a display device capable of effectively cooling a heating element while occupying a relatively small volume.

According to at least one of the embodiments of the present disclosure, it is possible to provide a display device in which evaporation of a fluid or cooling of the heating element can be smoothly performed by preventing contact between an element other than the heating element and the vapor chamber.

According to at least one of the embodiments of the present disclosure, it is possible to provide a display device capable of firmly fixing the vapor chamber to the PCB.

According to at least one of the embodiments of the present disclosure, it is possible to provide a display device capable of smoothly performing evaporation of fluid or cooling of a heating element by moving a fluid adjacent to the lower end to a heat absorbing part where the fluid is evaporated.

According to at least one of the embodiments of the present disclosure, it is possible to provide a display device capable of reducing noise generated during a fluid evaporation process.

Further scope of applicability of the present disclosure will become apparent from the following detailed description. However, it should be understood that the detailed description and specific embodiments such as preferred embodiments of the present disclosure are given by way of example only, since various changes and modifications within the spirit and scope of the present disclosure may be clearly understood by those skilled in the art.

1 to 10 are diagrams illustrating examples of display devices according to embodiments of the present disclosure.

Hereinafter, the embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but the same or similar components are assigned the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted.

The suffixes "module" and "part" for the components used in the following description are given or mixed in consideration of only the ease of writing the specification, and do not have a meaning or role distinct from each other by themselves.

In addition, in describing the embodiments disclosed in the present specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical spirit disclosed in the present specification is not limited by the accompanying drawings, and all changes included in the spirit and scope of the present disclosure , should be understood to include equivalents or substitutes.

Terms including an ordinal number, such as first, second, etc., may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that no other element is present in the middle.

The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following description, although embodiments are described with reference to specific drawings, if necessary, reference numbers not appearing in the specific drawings may be referred to, and reference numbers not appearing in the specific drawings are referred to in other drawings (in the other drawings). figures) are used where the above reference numbers appear.

Referring to FIG. 1 , the display device DD may include a display panel DP. The display panel DP may display a screen.

The display device DD includes a first long side LS1, a second long side LS2 opposite to the first long side LS1, a first long side LS1, and a second long side LS2. It may include a first short side (First Short Side, SS1) adjacent to and a second short side (Second Short Side, SS2) opposite to the first short side (SS1). Meanwhile, for convenience of explanation, the lengths of the first and second long sides LS1 and LS2 are illustrated and described as being longer than the lengths of the first and second short sides SS1 and SS2, but the first and second long sides are illustrated and described. A case in which the lengths of (LS1, LS2) are approximately equal to the lengths of the first and second short sides (SS1, SS2) may also be possible.

A direction parallel to the long sides LS1 and LS2 of the display device DD may be referred to as a first direction DR1 or a left-right direction LR. A direction parallel to the short sides SS1 and SS2 of the display device DD may be referred to as a second direction DR2 or a vertical direction UD. A direction perpendicular to the long sides LS1 and LS2 and the short sides SS1 and SS2 of the display device DD may be referred to as a third direction DR3 or a front-rear direction FR. Here, a direction in which the display panel DP displays a screen may be referred to as a front direction, and a direction opposite to this may be referred to as a rear direction.

Hereinafter, a display panel using an organic light emitting diode (OLED) will be described as an example for the display panel DP, but the display panel DP applicable to the present disclosure is not limited thereto.

1 and 2 , the display device DD may include a display panel DP, a frame F, a module cover MC, and a back cover BC.

The display panel DP forms the front surface of the display device DD, and can display an image in the front. The display panel DP may divide an image into a plurality of pixels and output an image by matching color, brightness, and saturation for each pixel. The display panel DP may be divided into an active area in which an image is displayed and a de-active area in which an image is not displayed. The display panel DP may generate light corresponding to a color of red, green, or blue according to a control signal.

The frame F may form a side surface of the display device DD. The frame F is positioned at the rear of the display panel DP, and the display panel DP may be coupled thereto. The frame (F) may be in the shape of a square ring as a whole. For example, the frame F may include a metal material. For example, the frame F may include aluminum (Al).

The module cover MC may be located at the rear of the display panel DP. The module cover (MC) may be coupled to the frame (F). In this case, the module cover MC may face the display panel DP with the frame F interposed therebetween.

The back cover BC may form a rear surface of the display device DD. The back cover BC may be coupled to the module cover MC to cover the rear of the module cover MC. On the other hand, in the display device (DD), the back cover (BC) is omitted, it is also possible that the above-described module cover (MC) functions as an exterior material.

Referring to FIG. 3 , various electronic components electrically connected to the display panel DP may be installed on the module cover MC. A PCB (P, Printed Circuit Board) on which a plurality of elements are located may be coupled to the module cover (MC). For example, the PCB (P) may be a main board. In this case, it is necessary to prevent thermal damage by preventing a plurality of elements mounted on the PCB (P) from being exposed to high-temperature heat, and for this purpose, the display device DD may include a vapor chamber 1 . can

The vapor chamber 1 may be coupled to the PCB(P) and may contact the heating element HE, which is at least one element among a plurality of elements positioned on the PCB(P). Here, the heating element HE may be a heating element that generates heat when current flows. For example, the heating element HE may be an IC chip. In this case, the vapor chamber 1 may cool the heating element HE by dissipating the heat transferred from the heating element HE to the outside. Accordingly, the vapor chamber 1 may prevent the heating element HE from being overheated, thereby preventing thermal damage to the heating element HE and elements adjacent thereto.

3 and 4 , the vapor chamber 1 may include a first plate 10 , a second plate 20 , and a fluid FL (not shown). Heat Hin transferred from the heating element HE to the vapor chamber 1 may evaporate the fluid FL accommodated in the vapor chamber 1 . In addition, the fluid FL of which the temperature has risen may move upward, and may be condensed while discharging heat Hout from the upper end of the vapor chamber 1 to the outside. In addition, the condensed fluid FL may move downward, and the above-described evaporation and condensation processes may be repeatedly performed to cool the heating element HE.

In this case, in consideration of the characteristic that the relatively high temperature fluid FL moves upward than the relatively low temperature fluid FL, the portion emitting the heat of the vapor chamber 1 is located above the portion absorbing the heat It is preferable to do In addition, the upper end of the vapor chamber 1 is located adjacent to the upper end of the module cover (MC), so that the heat dissipation of the fluid FL through the upper end of the vapor chamber 1 can be made smoothly.

The first plate 10 may form a rear surface of the vapor chamber 1 . The first plate 10 may include a heat absorbing part 12 that is in contact with the heat generating element HE and absorbs heat generated from the heat generating element HE. That is, heat generated from the heat generating element HE is provided to the fluid FL through the heat absorbing part 12 to evaporate the fluid FL.

The second plate 20 may form the front surface of the vapor chamber 1 . The second plate 20 may be coupled to the first plate 10 . For example, the second plate 20 may be coupled to the first plate 10 by welding or the like. For example, the first plate 10 and the second plate 20 may include a metal material. For example, the first plate 10 and the second plate 20 may include stainless steel having excellent corrosion resistance.

The fluid FL may flow in the space S provided between the first plate 10 and the second plate 20 . That is, upper and lower movements of the fluid FL according to the evaporation and condensation of the aforementioned fluid FL may be performed in the space S. To this end, a portion of the inner surface of the first plate 10 and a portion of the inner surface of the second plate 20 may be spaced apart from each other to form a space S. For example, the fluid FL may be water.

Meanwhile, the vapor chamber 1 may further include an adhesive AM. The adhesive AM is positioned between the heat absorbing part 12 and the heat generating element HE, and may be coupled to each of the heat absorbing part 12 and the heat generating element HE. Since the adhesive AM has excellent thermal conductivity, heat generated from the heat generating element HE may be easily transferred to the heat absorbing part 12 . For example, the adhesive AM may be a double-sided tape.

5 and 6 , the second plate 20 may include a second body 21 in which an inlet hole 24 for providing the fluid FL to the space S is formed. For example, after providing the fluid FL to the space S through the inlet hole 24 , the space S may be formed in a vacuum state through a vacuum device (not shown). For example, a copper pipe 25 through which the fluid FL flows may be inserted into the inlet hole 24 .

The plurality of depressions 23 may be formed by being depressed inwardly from the second body 21 . For example, the plurality of depressions 23 may be formed in an embossed shape. The plurality of depressions 23 may prevent the second plate 20 and the first plate 10 from being in close contact with each other in the process of forming the space S in a vacuum state. Accordingly, the plurality of depressions 23 may help the space S to have a certain size and be formed in a vacuum state.

Referring to FIG. 7 , the cap 50 may be coupled to the second plate 20 to cover the copper tube 25 inserted into the inlet hole 24 . For example, the cap 50 may be formed in a cylindrical shape. For example, the cap 50 may include a rubber material.

For example, the cap 50 may extend long in the front-rear direction. In this case, the cap 50 may prevent any parts located in the front of the vapor chamber 1 from coming into contact with the second plate 20 .

One side of the bracket 60 may be coupled to the vapor chamber 1 , and the other side may be coupled to the PCB (P). That is, the vapor chamber 1 may be coupled to the PCB (P) through the brackets (60). For example, the bracket 60 may include a plurality of brackets (60: 61, 62, 63) spaced apart from each other.

The other side of the bracket 60 may be formed with a hole 601 through which the fastening member SC fastened to the PCB (P) passes. In addition, the other side of the bracket 60 may be spaced apart from the PCB (P). In this case, the coupling force between the bracket 60 and the PCB(P) may be adjusted by adjusting the degree of fastening of the fastening member SC to the PCB(P). For example, the fastening member SC corresponding to the screw may be screwed to the PCB P through the hole 601 (refer to FIG. 4 ). At this time, as the fastening member SC is rotated in the fastening direction of the screw, the coupling force between the bracket 60 and the PCB(P) may be increased.

Accordingly, the heat absorbing part 12 may be more closely attached to the heating element HE, so that heat generated from the heating element HE may be easily transferred to the heat absorbing part 12 . Alternatively, the vapor chamber 1 may be coupled to the PCB (P) by another method such as welding.

For example, the bracket 60 may include a metal material. For example, the brackets 60 may include chromium (Cr).

4 and 8 , the first plate 10 may be spaced apart from a plurality of elements positioned on the PCB (P) except for the heat absorbing part 12 .

Specifically, the first plate 10 may include the first body 11 forming the heat absorbing part 12 . For example, the first body 11 may be a plate formed as a whole flat. The heat absorbing part 12 may protrude from the first body 11 toward the PCB (P). That is, the heat absorbing part 12 may be closer to the PCB(P) than the first body 11 except for the heat absorbing part 12 .

Accordingly, in addition to the contact of the heating element (HE) to the heat absorbing part 12, any heating element located on the PCB (P) is prevented from contacting the first body 11 except for the heat absorbing part. Evaporation and condensation of the fluid FL may be smoothly performed.

On the other hand, the first plate 10 bypasses the protruding element PE (refer to FIG. 3 ) that protrudes more toward the first plate 10 than the heating element HE among the plurality of elements positioned on the PCB (P). can be formed while In addition, the second plate 20 formed in the same shape as the first plate 10 may also be formed while bypassing the protruding element PE.

Accordingly, the vapor chamber 1 may not contact or interfere with the protruding element PE, so that the above-described evaporation and condensation processes of the fluid FL may be smoothly performed.

4 and 9 , the lower end of the first plate 10 may be spaced apart from the heat absorbing part 12 . For example, the lower end of the first plate 10 and the heat absorbing part ( 12) may be spaced apart from each other.

In this case, the vapor chamber 1 may include a sheet 30 . The sheet 30 may move the liquid fluid FL adjacent to the lower end of the first plate 10 to the heat absorbing part 12 . To this end, one end of the sheet 30 may be adjacent to the lower end of the first plate 10 , and the other end of the sheet 30 may be adjacent to the upper end of the heat absorbing part 12 . Accordingly, the liquid FL adjacent to the lower end of the first plate 10 may be moved to the heat absorbing part 12 by the sheet 30 and evaporated in the heat absorbing part 12 .

For example, the sheet 30 may move the liquid fluid FL adjacent to the lower end of the first plate 10 to the heat absorbing part 12 by using a capillary phenomenon. For example, the sheet 30 may include a porous material. For example, the sheet 30 may include a fiber material. For example, the thickness of the sheet 30 may be about 0.5 mm. Meanwhile, the sheet 30 may be referred to as a micro filter.

The heat absorbing part 12 may include a seating part 121 and an inclined part 122 . A portion of the seat 30 may be seated on the seat portion 121 . A heating element HE may contact the seating portion 121 . For example, the seating portion 121 may be formed to be flat as a whole. The inclined portion 122 may connect the seating portion 121 and the first body 11 . The inclined portion 122 may be formed to be inclined at an obtuse angle with respect to the seating portion 121 . In this case, the sheet 30 having one end adjacent to the lower end of the first plate 10 may extend upward and be seated on the seating portion 121 through the inclined portion 122 .

The sheet 30 may be spaced apart from the inner surface of the second plate 20 or the second body 21 . The gap between the seat 30 and the second plate 20 or the inner surface of the second body 21 may be greatest at a position where the seat 30 is seated on the seating part 121 . For example, the recessed portion 22 opposite to the seating portion 121 with the seat 30 interposed therebetween is recessed by about 1.0 mm inward from the second body 21, and is approximately 3.6 with the seating portion 121 therebetween. It may be spaced apart by an interval (g) as much as mm.

Accordingly, the gaseous fluid FL generated as the fluid FL absorbed by the seat 30 and moved to the seating portion 121 is evaporated by the heat transferred from the heat generating element HE is formed in the space S. can flow smoothly.

Meanwhile, the first flange 111 formed on the periphery of the first body 11 and the second flange 211 formed on the periphery of the second body 21 may be coupled to each other to face each other. For example, the first flange 111 and the second flange 211 may be coupled to each other by welding or the like. In this case, the inner surface of the portion of the first body 11 excluding the first flange 111 is spaced apart from the inner surface of the portion of the second body 21 except for the second flange 211 to form a space (S). can

9 and 10 , the seating part 121 may be formed in a rectangular shape as a whole. In this case, the inclined portion 122 may include first to fourth inclined portions 122a, 122b, 122c, and 122d extending from each side of the seating portion 121 . Here, the first inclined portion 122a may be positioned between one end and the other end of the sheet 30 . That is, the sheet 30 having one end adjacent to the lower end of the first plate 10 may extend upward and be seated on the seating portion 121 through the first inclined portion 122a.

The seat 30 may be spaced apart from the second to fourth inclined portions 122b, 122c, 122d except for the first inclined portion 122a positioned between one end and the other end of the seat 30 among the inclined portions 122. have. For example, the left side of the seat 30 may be spaced apart from the second inclined portion 122b located on the left side of the seating portion 121 by a predetermined interval g2 . For example, the upper side of the sheet 30 may be spaced apart from the third inclined portion 122c positioned above the seating portion 121 by a predetermined interval g3 . For example, the right side of the seat 30 may be spaced apart from the fourth inclined portion 122d located on the right side of the seating portion 121 by a predetermined interval g4 .

That is, since the sheet 30 is positioned on the seating portion 121 without overlapping with the second to fourth inclined portions 122b, 122c, and 122d, the sheet 30 that absorbs the fluid FL and has an increased volume It is possible to prevent the space S formed between the second to fourth inclined portions 122b, 122c, and 122d and the second body 21 from being narrowed.

In addition, the fact that the distance between the second body 21 and the seating part 121 is relatively larger than the distance between the second body 21 and the inclined part 122 is that even if the volume of the seat 30 increases, the seating part 121 ) and the second body 21 may be understood to secure a space S in which the fluid FL can flow smoothly.

Accordingly, even if the volume of the sheet 30 increases as the fluid FL is absorbed, the fluid FL evaporated from the sheet 30 may smoothly flow through the space S. In addition, it is possible to prevent the evaporated fluid FL from being stagnated in the heat absorbing part 12 to generate a boiling noise.

The mesh 40 may face the seating portion 121 with the sheet 30 interposed therebetween. A plurality of pores may be formed in the mesh 40 . Mesh 40 may be coupled to sheet 30 . The mesh 40 may reduce noise generated when a bubble of the fluid FL ejected through the sheet 30 bursts. That is, the fluid FL is evaporated from the sheet 30 by the plurality of pores of the mesh 40 , and the size of the generated bubble is reduced, so that the bubble can be extinguished without a great noise.

For example, the mesh 40 may be formed in an overall rectangular shape. For example, the mesh 40 may include a metal material. For example, the mesh 40 may include stainless steel having excellent corrosion resistance.

According to an aspect of the present disclosure, a display panel; a module cover positioned at the rear of the display panel; a PCB coupled to the module cover, on which a plurality of elements are located; and a vapor chamber coupled to the PCB and in contact with a heating element which is at least one element among the plurality of elements, wherein the vapor chamber includes: a first plate having a heat absorbing part in contact with the heating element; a second plate coupled to the first plate; In addition, there is provided a display device including a fluid flowing in a space provided between the first plate and the second plate, wherein the first plate is spaced apart from the plurality of elements in a portion excluding the heat absorbing part.

According to another aspect of the present disclosure, the first plate may include a first body in which the heat absorbing part is formed, and the heat absorbing part may protrude from the first body toward the PCB.

Further, according to another aspect of the present disclosure, the first plate may be formed while bypassing the protruding element more protruding toward the first plate than the heating element among the plurality of elements.

According to another (another) aspect of the present disclosure, it further comprises a bracket having one side coupled to the vapor chamber and the other side coupled to the PCB, and the other side of the bracket, through which a fastening member coupled to the PCB passes through. A hole is formed and may be spaced apart from the PCB.

Further, according to another aspect of the present disclosure, the fluid may be evaporated in the heat absorbing part to flow upward, and condensed in the upper side of the space to flow to the lower side of the space.

Also, according to another aspect of the present disclosure, the upper end of the vapor chamber may be adjacent to the upper end of the module cover.

According to another aspect of the present disclosure, the vapor chamber further includes: a porous sheet positioned between the first plate and the second plate, wherein the sheet is a fluid adjacent to a lower end of the first plate may be moved to the heat absorbing part.

Also, according to another aspect of the present disclosure, the sheet may have one end adjacent to the lower end of the first plate and the other end adjacent to the upper end of the heat absorbing part.

According to another (another) aspect of the present disclosure, the heat absorbing part includes: a seating part on which a part of the sheet is seated; In addition, it may further include an inclined portion that connects the seating portion and the first body and is formed to be inclined.

Also, according to another aspect of the present disclosure, the sheet may be spaced apart from the inclined portion except for the inclined portion positioned between one end and the other end of the sheet among the inclined portions.

According to another aspect of the present disclosure, the sheet may be spaced apart from the inner surface of the second plate.

Also, according to another aspect of the present disclosure, the gap between the sheet and the inner surface of the second plate may be greatest at a position where the sheet is seated on the seating part.

In addition, according to another (another) aspect of the present disclosure, it may further include a mesh facing the seating portion with the sheet interposed therebetween, in which a plurality of voids are formed.

According to another (another) aspect of the present disclosure, the second plate may include: a second body in which an inlet hole for providing the fluid to the space is formed; In addition, the second body may further include a plurality of depressions that are depressed inwardly.

Any or other embodiments of the present disclosure described above are not mutually exclusive or distinct. Certain embodiments or other embodiments of the invention described above are not mutually exclusive or distinct from each other. Any or all elements of the embodiments of the invention described above may be combined or combined with each other in configuration or function).

For example, it means that configuration A described in a specific embodiment and/or drawings may be combined with configuration B described in other embodiments and/or drawings. That is, even if the combination between the configurations is not directly described, it means that the combination is possible except for the case where it is explained that the combination is impossible (For example, a configuration "A" described in one embodiment of the invention and the drawings. and a configuration "B" described in another embodiment of the invention and the drawings may be combined with each other. Namely, although the combination between the configurations is not directly described, the combination is possible except in the case where it is described that the combination is impossible).

The above detailed description should not be construed as restrictive in all respects and should be considered as illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are included in the scope of the present invention (although embodiments have been described with reference to a number of illustrative embodiments) thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the scope of the principles of this disclosure. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art).

Claims (14)

display panel;
a module cover positioned at the rear of the display panel;
a PCB coupled to the module cover, on which a plurality of elements are located; and,
A vapor chamber coupled to the PCB and in contact with a heating element that is at least one element among the plurality of elements,
The vapor chamber comprises:
a first plate having a heat absorbing part in contact with the heat generating element;
a second plate coupled to the first plate;
a fluid flowing in a space provided between the first plate and the second plate; and,
and a porous sheet positioned between the heat absorbing part and the second plate. According to claim 1,
The first plate includes a first body in which the heat absorbing part is formed,
The heat absorbing part protrudes from the first body toward the PCB,
The first body is spaced apart from the plurality of elements in a portion except for the heat absorbing part. According to claim 1,
The first plate is
A display device formed while bypassing a protrusion element that protrudes more toward the first plate than the heating element among the plurality of elements. According to claim 1,
One side is coupled to the vapor chamber, the other side further comprises a bracket coupled to the PCB,
The other side of the bracket,
A hole through which a fastening member fastened to the PCB passes is formed, and the display device is spaced apart from the PCB. According to claim 1,
The fluid is
The display device evaporates from the heat absorbing part and flows upward, condensed on the upper side of the space and flows downward of the space. 6. The method of claim 5,
The upper end of the vapor chamber is a display device adjacent to the upper end of the module cover. 6. The method of claim 5,
The sheet moves the fluid adjacent to the lower end of the first plate to the heat absorbing part. 8. The method of claim 7,
The sheet is
A display device having one end adjacent to the lower end of the first plate and the other end adjacent to the upper end of the heat absorbing part. 9. The method of claim 8,
The first plate includes a first body in which the heat absorbing part is formed,
The heat absorbing part:
a seating portion on which a portion of the sheet is seated; and,
The display device further comprising an inclined portion connecting the seating portion and the first body, the inclined portion being inclined. 10. The method of claim 9,
The sheet is
A display device spaced apart from the inclined portion except for the inclined portion positioned between one end and the other end of the sheet among the inclined portion. 10. The method of claim 9,
The sheet is a display device spaced apart from the inner surface of the second plate. 12. The method of claim 11,
A distance between the sheet and the inner surface of the second plate is greatest at a position where the sheet is seated on the seating portion. 10. The method of claim 9,
The display device further comprising a mesh facing the seating portion with the sheet interposed therebetween, the mesh having a plurality of voids formed therebetween. According to claim 1,
The second plate comprises:
a second body having an inlet hole for providing the fluid into the space; and,
The display device further comprising a plurality of depressions recessed inwardly from the second body.

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