KR102297115B1 - Method of material cooling using micro porous module - Google Patents

Abstract

A material cooling method according to one embodiment of the present invention comprises the following steps of: (a) supplying a material on a porous module inside a chamber; (b) adjusting air pressure inside the chamber by a pressure control unit to adjust a saturation temperature of refrigerant to cool the material; (c) cooling the material at a predetermined temperature by supplying the refrigerant to the porous module; (d) reducing a difference between the internal air pressure of the chamber and an external air pressure by using the pressure control unit; and (e) replacing the material by opening a side of the chamber.

Description

Material cooling method using micro-sized porous module {METHOD OF MATERIAL COOLING USING MICRO POROUS MODULE}

The present invention relates to a material cooling method using a micro-sized porous module.

Recently, one of the interests in the automobile manufacturing industry is to reduce the weight and increase the strength. That is, in the recent automobile industry, ultra-high-strength steel materials with high strength-to-weight ratio, which are suitable for reducing vehicle weight and improving stability, are being widely applied. However, since ultra-high-strength steel has low formability and causes excessive springback, it is difficult to manufacture a mold for forming ultra-high-strength steel. A hot stamping process may be used as a forming technique to solve these difficulties. Hot stamping has the advantage of improving the formability of ultra-high strength steel and reducing springback to a minimum.

이상 가열하고 가열된 강재를 금형 내에 공급하고 성형한 후, 금형 내에서 성형품을 급냉시켜 성형품을 제조하는 공정이다. 그런데, 핫스탬핑은 금형 내에서 성형품을 급냉시키는 공정을 필요로 하므로, 냉간 스탬핑 대비 생산성이 저하되는 문제점이 있다. 또한, 가열된 성형품을 급냉시킴에 따라 발생하는 성형품 표면의 산화 스케일로 인해, 금형 수명이 저하되는 문제점이 있다.Hot stamping steel 900

It is a process of manufacturing a molded product by supplying and molding the heated steel material into the mold and then rapidly cooling the molded product in the mold. However, since hot stamping requires a process of rapidly cooling a molded product in a mold, there is a problem in that productivity is lowered compared to cold stamping. In addition, due to oxidized scale on the surface of the molded article generated by rapidly cooling the heated molded article, there is a problem in that the mold life is reduced.

The quality and productivity of these hot stamping parts are greatly affected by the cooling rate of the mold, and time reduction is one of the key technological factors. to improve cooling efficiency.

An embodiment of the present invention provides a material cooling method capable of latent heat cooling of the material at a preset temperature by controlling the saturation temperature of the refrigerant by adjusting the internal atmospheric pressure of the chamber after providing the material on the porous module inside the chamber The purpose.

On the other hand, the technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned are clearly to those of ordinary skill in the art to which the present invention belongs from the description below. can be understood

Material cooling method according to an embodiment of the present invention comprises the steps of (a) providing a material on the porous module inside the chamber; (b) adjusting the air pressure inside the chamber through a pressure adjusting unit to adjust the saturation temperature of the refrigerant for cooling the material; (c) cooling the material at a preset temperature by supplying the refrigerant to the porous module; (d) reducing the difference between the internal atmospheric pressure and the external atmospheric pressure of the chamber through the pressure adjusting unit; and (e) replacing the material by opening one side of the chamber.

Step (b) may include: (b-1) opening a third valve provided between the pressure regulator and the chamber; and (b-2) adjusting the internal atmospheric pressure of the chamber through the pressure adjusting unit to adjust the saturation temperature of the refrigerant.

The step (c) includes: (c-1) opening a first valve provided between the chamber and the refrigerant storage unit to supply the refrigerant to the porous module; (c-2) opening a second valve provided between the chamber and the cooling unit so that the refrigerant gas generated in the process of latent heat cooling the material can be discharged to the outside of the chamber; (c-3) the refrigerant latent heat cooling at the saturation temperature in the process of absorbing heat from the material on the porous module; and (c-4) discharging the refrigerant gas generated by the latent heat cooling to the outside of the chamber.

The step (d) includes: (d-1) closing the first valve to block supply of the refrigerant into the chamber; (d-2) reducing the difference between the internal atmospheric pressure and the external atmospheric pressure of the chamber through the pressure adjusting unit; and (d-3) closing the second valve after the refrigerant gas inside the chamber is discharged to the outside of the chamber.

The step (c-1) may include: (c-1-1) opening a first valve provided between the chamber and the refrigerant storage unit; (c-1-2) supplying the refrigerant to the bottom surface of the porous module provided in the chamber; and (c-1-3) flowing out of the refrigerant to the upper surface of the porous module through a plurality of fine refrigerant outlet pipes of a preset length provided downward from the upper surface of the porous module.

The step (c-3) includes: (c-3-1) a liquid refrigerant flowing to the upper surface of the porous module and absorbing heat from the material; and (c-3-2) latent heat cooling of the material by absorbing heat from the material by the liquid refrigerant and evaporating at a saturation temperature of the refrigerant set by the pressure control unit.

In the step (c-3), after the step (c-3-2), (c-3-3) the pressure in order to readjust the saturation temperature of the refrigerant according to the latent heat cooling situation by evaporation of the refrigerant. It may further include the step of re-adjusting the internal air pressure of the chamber through the adjusting unit.

The step (c-3-3) is: When the latent heat cooling of the material is performed even after a preset time has elapsed, the internal pressure of the chamber is increased through the pressure adjusting unit to increase the saturation temperature of the refrigerant to a higher temperature. When the latent heat cooling of the material is not achieved because the temperature of the refrigerant does not reach the saturation temperature of the refrigerant by cooling the material, and the pressure inside the chamber through the pressure adjusting unit It may be a step of lowering the saturation temperature of the refrigerant by lowering it so that the refrigerant is evaporated at a lower temperature.

After step (e), (f) cooling the refrigerant heated in the latent heat cooling process of the material through a cooling unit; (g) replenishing the refrigerant lost in the latent heat cooling process of the material through the refrigerant replenishment unit; and (h) temporarily storing the refrigerant before flowing into the chamber through the refrigerant storage unit, and maintaining the refrigerant amount in the chamber within a preset range by adjusting the amount of refrigerant supplied into the chamber.

The material cooling method according to an embodiment of the present invention can latent heat cooling the material at a preset temperature by controlling the saturation temperature of the refrigerant by adjusting the internal air pressure of the chamber after providing the material on the porous module inside the chamber.

On the other hand, the effects obtainable in the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those of ordinary skill in the art to which the present invention belongs from the following description. will be able

1 is a diagram schematically showing a material cooling system for performing a material cooling method according to an embodiment of the present invention.
2 is a block diagram illustrating a material cooling method according to an embodiment of the present invention.
3 is a view schematically showing the operation of the material cooling system in steps S100 to S300 of the material cooling method of FIG. 2 .
4 is a view schematically showing the operation of the material cooling system in steps S400 and S500 of the material cooling method of FIG. 2 .
5 is a block diagram illustrating the step S200 of FIG. 2 in more detail.
6 is a block diagram illustrating step S300 of FIG. 2 in more detail.
7 is a block diagram illustrating the step S400 of FIG. 2 in more detail.
8 is a view schematically illustrating the operation of the chamber, the porous module, the valve, the material and the refrigerant in the process of steps S100 to S500 of FIG.
9 is a graph showing the change in the pressure of each refrigerant and the saturation temperature accordingly.
10 is a view showing a porous module used in a material cooling method according to an embodiment of the present invention and a material provided on the porous module.
11 is a view showing the internal structure of the porous module of FIG.
12 is a block diagram illustrating step S310 of FIG. 6 in more detail.
13 is a block diagram illustrating step S330 of FIG. 6 in more detail.

Other advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only this embodiment serves to complete the disclosure of the present invention, and to obtain common knowledge in the technical field to which the present invention pertains. It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

Even if not defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly accepted by common technology in the prior art to which this invention belongs. Terms defined by general dictionaries may be construed as having the same meaning as in the related description and/or in the text of the present application, and shall not be conceptualized or overly formally construed even if the expression is not explicitly defined herein. won't

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, 'comprise' and/or various conjugations of this verb, eg, 'comprise', 'comprising', 'comprising', 'comprising', etc., refer to the referenced composition, ingredient, component, A step, operation and/or element does not exclude the presence or addition of one or more other compositions, components, components, steps, operations and/or elements. As used herein, the term 'and/or' refers to each of the listed components or various combinations thereof.

Meanwhile, terms such as '~ unit', '~ group', '~ block', and '~ module' used throughout this specification may mean a unit that processes at least one function or operation. For example, it can mean software, hardware components such as FPGAs or ASICs. However, '~ part', '~ group', '~ block', and '~ module' are not meant to be limited to software or hardware. '~ unit', '~ group', '~ block', and '~ module' may be configured to reside in an addressable storage medium or to regenerate one or more processors.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings of the present specification.

1 is a diagram schematically showing a material cooling system 10 for performing a material cooling method according to an embodiment of the present invention.

Referring to FIG. 1 , the material cooling system 10 includes a chamber 100 , a porous module 200 , a pressure control unit 300 , a valve 400 , a cooling unit 500 , a refrigerant supplementation unit 600 , and a refrigerant. It includes a storage unit 700 and a pump 800 .

The refrigerant 30 flows inside the material cooling system 10 and cools the material 20 provided in the chamber 100 . The flow process of the refrigerant is as follows.

The refrigerant 30 stored in the refrigerant storage unit 700 flows in the direction of the first valve 410 by the pump 800 . In order to provide the material 20 for cooling into the chamber 100 , the first valve 410 is opened and the refrigerant 30 is introduced into the chamber 100 through this. At this time, to be precise, the refrigerant 30 is introduced into the porous module 200 provided in the chamber 100 . A plurality of refrigerant outlet holes 220 are provided on the upper surface of the porous module 200 , and the refrigerant 30 fills the hollow 210 inside the porous module 200 and then moves downward from the upper surface of the porous module 200 . It is transferred along a plurality of provided fine refrigerant outlet pipe 230 , and is provided as material 20 through refrigerant outlet hole 220 on the upper surface of porous module 200 . At this time, the refrigerant 30 may be vaporized from the process of flowing to the material 20 through the fine refrigerant outlet pipe 230 due to the heat provided from the material 20, and the vaporized refrigerant gas is When it is open, it moves out of the chamber 100 and is transferred to the cooling unit 500 . The refrigerant cooled by the cooling unit 500 and liquefied again is transferred to the refrigerant replenishing unit 600 , the refrigerant replenishing unit 600 replenishes the refrigerant 30 by the amount lost in the cooling process of the material 20 . The supplemented refrigerant 30 is temporarily stored in the refrigerant storage unit 700 , and passes through the first valve 410 again through the pump 800 according to the temperature of the material 30 and the amount of refrigerant inside the chamber 100 . (100) is introduced into the interior.

2 is a block diagram illustrating a material cooling method according to an embodiment of the present invention, and FIG. 3 is a schematic diagram showing the operation of the material cooling system 10 in steps S100 to S300 of the material cooling method of FIG. 4 is a view schematically showing the operation of the material cooling system 10 in steps S400 and S500 of the method of cooling the material of FIG. 2 .

2 to 4 , the material cooling method includes the step of providing the material 20 on the porous module 200 inside the chamber 100 ( S100 ), and a refrigerant 30 for cooling the material 20 . Step (S200) of adjusting the air pressure inside the chamber 100 through the pressure adjusting unit 300 to control the saturation temperature of the material 20 at a preset temperature by supplying the refrigerant 30 to the porous module 200 ) cooling step (S300), reducing the difference between the internal atmospheric pressure and external atmospheric pressure of the chamber 100 through the pressure adjusting unit 300 (S400) and opening one side of the chamber 100 to the material 20 and replacing ( S500 ).

Here, step S200 is a pressure control unit 300 to adjust the saturation temperature of the refrigerant 30 for cooling the material 20 after providing the material 20 on the porous module 200 inside the chamber 100 . Refers to the step of adjusting the air pressure inside the chamber 100 through the. In addition, step S300 refers to a step of latent heat cooling of the material 20 by supplying the refrigerant 30 to the porous module 200 inside the chamber 100 , and step S400 is a chamber after the latent heat cooling of the material 20 is completed. Refers to a step of reducing the difference between the internal atmospheric pressure and the external atmospheric pressure of the chamber 100 through the pressure adjusting unit 300 before opening (100). Finally, step S500 refers to a step of replacing the material 20 after opening the door provided on one side of the chamber 100 .

5 is a block diagram illustrating the step S200 of FIG. 2 in more detail.

Referring to FIG. 5 , in step S200 , the third valve 430 provided between the pressure control unit 300 and the chamber 100 is opened ( S210 ) and the pressure to adjust the saturation temperature of the refrigerant 30 . and adjusting the internal air pressure of the chamber 100 through the adjusting unit 300 ( S220 ).

6 is a block diagram illustrating step S300 of FIG. 2 in more detail.

Referring to FIG. 6 , step S300 is a step of opening the first valve 410 provided between the chamber 100 and the refrigerant storage unit 700 to supply the refrigerant 30 to the porous module 200 ( S310 ). , opening the second valve 420 provided between the chamber 100 and the cooling unit 500 so that the refrigerant 30 gas generated in the process of latent heat cooling of the material 20 can be discharged to the outside of the chamber 100 Step (S320), the refrigerant 30 is latent heat cooling to a saturation temperature in the process of absorbing heat from the material 20 on the porous module 200 (S330) and refrigerant 30 gas generated by latent heat cooling and discharging to the outside of the chamber 100 ( S340 ).

7 is a block diagram illustrating the step S400 of FIG. 2 in more detail.

Referring to FIG. 7 , step S400 is a step of closing the first valve 410 to block the refrigerant 30 from being supplied into the chamber 100 ( S410 ), and the chamber ( S410 ) through the pressure adjusting unit 300 . reducing the difference between the internal atmospheric pressure and external atmospheric pressure of 100) (S420) and closing the second valve 420 after the refrigerant 30 gas in the chamber 100 is discharged to the outside of the chamber 100 ( S430).

8 is a view schematically illustrating the operation of the chamber 100, the porous module 200, the valve 400, the material 20, and the refrigerant 30 in the course of steps S100 to S500 of FIG.

Referring to FIG. 8 , it can be seen that steps S100 to S500 largely proceed in the form of (a) to (d).

First, in a state in which the first valve 410 , the second valve 420 and the third valve 430 are closed, one side of the chamber 100 is opened to provide the material 20 on the porous module 200 . do. At this time, a sliding door or a hinged door may be provided on one side of the chamber 100 , and the material 20 may be provided into the chamber 100 through this (FIG. 6 (a)).

Next, after closing the door of the chamber 100 and opening the third valve 430 , the refrigerant to be provided to the chamber 100 by raising or lowering the internal air pressure of the chamber 100 through the pressure adjusting unit 300 . The saturation temperature of 30 is adjusted, and the first valve 410 is opened to supply the refrigerant 30 to the porous module 200 (FIG. 6 (b)).

Thereafter, the refrigerant 30 supplied to the porous module 200 absorbs heat from the material 20 to cool the material 20 with latent heat, and the refrigerant 30 gas generated in this process is the second valve 420 . is discharged out of the chamber 100 by opening (FIG. 6(c)).

Finally, after the latent heat cooling of the material 20 through the refrigerant 30 is completed, the first valve 410 is closed to block the supply of the refrigerant 30 , and the chamber 100 through the pressure adjusting unit 300 . After reducing the difference between the internal atmospheric pressure and the external atmospheric pressure of ) by taking out the chamber 100, it is possible to replace the material 20 later (Fig. 6 (d)).

9 is a graph showing the change in the pressure of each refrigerant 30 and the saturation temperature (evaporation temperature) accordingly.

Referring to FIG. 9 , as the pressure [atm] increases in the case of water, R-134a refrigerant and R-245fa refrigerant, the saturation temperature also increases accordingly. This is not limited to the specific refrigerant shown in FIG. 9, but is applied regardless of the type of refrigerant in the case of a vaporizable liquid refrigerant. It indicates that the saturation temperature of the refrigerant 30, that is, the evaporation temperature can be adjusted.

For example, when water is used as the refrigerant, water vaporizes at 100°C in 1 [amt], and water supplied at a lower temperature than 100°C absorbs heat from the material 20 in the process of raising the temperature to 100°C. In addition, it is possible to cool the material 20 with latent heat during the phase change from liquid water to water vapor. At this time, the pressure adjusting unit 300 may increase the pressure inside the chamber 100 to increase the saturation temperature of water. If, by increasing the pressure inside the chamber 100, when the saturation temperature of water is raised to 120 ° C, water receives more heat energy from the material 20 as much as the temperature required to increase the temperature by 20 ° C compared to the existing 1 [atm] condition. will be absorbed

Conversely, when the pressure inside the chamber 100 is lowered to lower the saturation temperature of water to 80° C., the amount of thermal energy that the same mass of water can absorb from the material 20 decreases, but the cooling of the material 20 is completed. Since the temperature of the material 20 also corresponds to 80 ° C., when the material 20 is replaced after the material cooling method of the present invention is completed, the material 20 is safer than when the temperature of the material 20 is 100 ° C. ) can be replaced.

As such, in the material cooling method according to an embodiment of the present invention, the saturation temperature of the refrigerant 30 is increased by increasing the internal pressure of the chamber 100 through the pressure adjusting unit 300 , or the interior of the chamber 100 . By lowering the pressure to lower the saturation temperature of the refrigerant 30, the refrigerant 30 can be evaporated at a temperature desired by the user. That is, the material 20 can be cooled by latent heat at a temperature desired by the user through the pressure control in the chamber 100 through the pressure control unit 300 .

10 is a view showing the porous module 200 used in the material cooling method according to an embodiment of the present invention and the material 20 provided on the porous module 200, and FIG. 11 is the porous module ( 200) is a diagram showing the internal structure.

10 and 11 , the porous module 200 includes a hollow 210 therein, and includes a plurality of refrigerant outlet holes 220 on the upper surface. The refrigerant outlet hole 220 is provided downward starting from the upper surface of the porous module 200 and is formed by a plurality of fine refrigerant outlet pipes 230 connected to the hollow 210 inside the porous module 200 . The refrigerant 30 introduced into the hollow 210 through the bottom surface of the porous module 200 flows through the plurality of fine refrigerant outlet pipes 230 as the water level increases and is provided on the upper surface of the porous module 200 The refrigerant flows out through the plurality of refrigerant outlet holes 220 . At this time, the diameter of the fine refrigerant outlet pipe 230 is provided so small that the capillary phenomenon can occur, so that the refrigerant can more easily rise upward along the fine refrigerant outlet pipe 230 .

In addition, the refrigerant outlet holes 220 are provided at uniform intervals on the upper surface of the porous module 200 , so that the refrigerant 30 can uniformly contact each region of the material 20 , thereby allowing the material 20 to be rapidly moved. Allow cooling to take place.

12 is a block diagram illustrating step S310 of FIG. 6 in more detail, and FIG. 13 is a block diagram illustrating step S330 of FIG. 6 in more detail.

12 and 13, the step of opening the first valve 410 provided between the chamber 100 and the refrigerant storage unit 700 to supply the refrigerant 30 to the porous module 200 (S310) Step (S311) of opening the first valve 410 provided between the chamber 100 and the refrigerant storage unit 700 (S311), the refrigerant 30 is supplied to the bottom of the porous module 200 provided inside the chamber 100 Step (S312) and the step of the refrigerant 30 flowing out to the upper surface of the porous module 200 through a plurality of fine refrigerant outlet pipe 230 of a preset length provided downward from the upper surface of the porous module 200 (S313) ) is included. The material cooling system 10 in steps S311 to S313 may correspond to the appearance of (b) of FIG. 8 .

That is, by opening the first valve 410 , the refrigerant 30 flows into the porous module 200 , and the refrigerant 30 filling the hollow 210 flows along the fine refrigerant outlet pipe 230 . It undergoes a process of flowing out through the outlet hole 220 .

In addition, in the step (S330) of latent heat cooling at a saturation temperature in the process in which the refrigerant 30 absorbs heat from the material on the porous module 200, the liquid refrigerant 30 flows to the upper surface of the porous module 200. and absorbing heat from the material 20 (S331) and the liquid refrigerant 30 absorbs heat from the material 20 and evaporates at the saturation temperature of the refrigerant 30 set by the pressure control unit 300 It includes a step (S332) of latent heat cooling the material (20). The material cooling system 10 in steps S331 and S332 may correspond to the appearance of (c) of FIG. 8 .

That is, the refrigerant 30 flowing inside the porous module 200 not only contacts the material 20 provided on the upper surface of the refrigerant outlet hole 220 and vaporizes, but also flows along the fine refrigerant outlet pipe 230 . In the process, it may be vaporized by heat transferred from the material 20 to the porous module 200 .

The material cooling method according to an embodiment of the present invention comprises the steps of cooling the refrigerant 30 heated in the latent heat cooling process of the material 20 through the cooling unit 500 after the step S500, the refrigerant replenishment unit 600 Replenishing the refrigerant 30 lost in the latent heat cooling process of the material 20 through the refrigerant 30 and temporarily storing the refrigerant 30 before flowing into the chamber 100 through the refrigerant storage unit 700 and inside the chamber 100 The method may further include the step of maintaining the amount of refrigerant in the chamber 100 within a preset range by adjusting the amount of refrigerant supplied to the chamber 100 .

At this time, the cooling unit 500 arranges a plurality of flat plates at regular intervals and skips one by one in the passage to allow other fluids to pass therethrough, which is a plate heat exchanger 510 and a place where the tissue is to be dense by adjusting the cooling rate. It may further include a cooling chiller 520, which is a piece of metal attached to, through which a high-temperature refrigerant can be exchanged with a low-temperature refrigerant.

The refrigerant replenishment unit 600 replenishes the refrigerant 30 by the amount lost by flowing out of the chamber 100 during the cooling process of the material 20 .

The refrigerant storage unit 700 refers to a container for temporarily storing liquefied refrigerant, and after measuring the amount of refrigerant in the chamber 100, it can be maintained in a preset range. In other words, when the amount of refrigerant in the chamber 100 is smaller than the preset range, a larger amount of the refrigerant 30 is provided to the chamber 100 through the pump 800 , and conversely, the amount of refrigerant in the chamber 100 is preset. When the range is exceeded, the supply of the refrigerant 30 may be temporarily stopped or the amount of the refrigerant 30 supplied to the chamber 100 may be reduced.

In the material cooling method according to an embodiment of the present invention, after the step (S332) of latent heat cooling of the material by the refrigerant absorbs heat from the material and evaporates at the saturation temperature of the refrigerant set by the pressure control unit (S332), the refrigerant (30) The method may further include the step of re-adjusting the internal air pressure of the chamber 100 through the pressure adjusting unit 300 to readjust the saturation temperature of the refrigerant 30 according to the latent heat cooling condition due to evaporation.

At this time, when latent heat cooling of the material 20 is performed through evaporation of the refrigerant 30 even after a preset time has elapsed, the internal pressure of the chamber 100 is increased through the pressure adjusting unit 300 to increase the temperature of the refrigerant 30 . By increasing the saturation temperature, evaporation of the refrigerant 30 may be made at a higher temperature.

For example, when it is assumed that a refrigerant having an evaporation temperature of 100° C. is provided under the condition of 1 [atm], the evaporation temperature of the refrigerant 30 is adjusted by increasing the pressure inside the chamber 100 through the pressure adjusting unit 300 . The material 30 is cooled by increasing it to 120°C. Thereafter, when latent heat cooling of the material 30 through evaporation of the refrigerant 30 is performed even after a preset time, for example, 1 minute has elapsed, the temperature of the material 30 may be considered much higher than 120° C., so in this case In this case, the internal pressure of the chamber 100 may be further increased through the pressure adjusting unit 130 to set the saturation temperature of the refrigerant to 150° C., so that latent heat cooling may be performed. Through this, assuming that the refrigerant 30 of the same mass is supplied, more heat energy can be absorbed from the material 20 than when the saturation temperature is 120°C.

In addition, when the latent heat cooling of the material 20 is not achieved because the temperature of the refrigerant 30 does not reach the saturation temperature of the refrigerant 30 as the material 20 is cooled, the chamber ( 100) By lowering the internal pressure to lower the saturation temperature of the refrigerant 30, the refrigerant 30 is evaporated at a lower temperature.

For example, assuming that a refrigerant having an evaporation temperature of 100° C. is provided under the condition of 1 [atm], the temperature of the material 20 decreases after a certain period of time, and the temperature of the refrigerant 30 is further increased to the saturation temperature. won't be able to do it In this case, the latent heat cooling of the material 30 through evaporation of the refrigerant 30 is continued by lowering the evaporation temperature of the refrigerant 30 to 80° C. through the pressure drop inside the chamber 100 through the pressure control unit 300 . can make it happen.

In addition, the saturation temperature control of the refrigerant 30 through the pressure control unit 300 brings together the effect of allowing the final cooling of the material 20 at a specific temperature desired by the user. That is, by lowering the saturation temperature of the refrigerant 30 through the pressure drop inside the chamber 100, the effect of controlling the temperature of the material 20 at the time when the cooling of the material 20 is finally completed can also be obtained. have. For example, by lowering the temperature at which the final cooling of the material 20 is completed to a temperature that does not cause burns to the user, a safer operation when the user takes out the material 20 from the chamber 100 after completing the final step can make this happen.

The material cooling method according to an embodiment of the present invention can control the saturation temperature of the refrigerant 30 by controlling the atmospheric pressure inside the chamber 100 to latent heat cooling the material 20 at a temperature desired by the user, as well as porous By uniformly supplying the refrigerant 30 to the material 20 through the module 200 , the material 20 can be uniformly cooled.

Although the present invention has been described by way of examples above, the above examples are merely for explaining the spirit of the present invention and are not limited thereto. Those skilled in the art will understand that various modifications may be made to the above-described embodiments. The scope of the present invention is determined only through interpretation of the appended claims.

10: material cooling system 20: material
30: refrigerant 100: chamber
200: porous module 210: hollow
220: refrigerant outlet hole 230: fine refrigerant outlet pipe
300: pressure regulator 400: valve
410: first valve 420: second valve
430: third valve 500: cooling unit
510: plate heat exchanger 520: cooling chiller
600: Refrigerant replenishment unit 700: Refrigerant storage unit
800: pump

Claims (9)

(a) providing a material on the porous module inside the chamber;
(b) adjusting the air pressure inside the chamber through a pressure adjusting unit to adjust the saturation temperature of the refrigerant for cooling the material;
(c) cooling the material at a preset temperature by supplying the refrigerant to the porous module;
(d) reducing the difference between the internal atmospheric pressure and the external atmospheric pressure of the chamber through the pressure adjusting unit; and
(e) opening one side of the chamber to replace the material
Material cooling method.
The method of claim 1,
Step (b) is:
(b-1) opening a third valve provided between the pressure regulator and the chamber; and
(b-2) comprising the step of adjusting the internal atmospheric pressure of the chamber through the pressure adjusting unit to adjust the saturation temperature of the refrigerant
Material cooling method.
3. The method of claim 2,
Step (c) is:
(c-1) opening a first valve provided between the chamber and the refrigerant storage unit to supply the refrigerant to the porous module;
(c-2) opening a second valve provided between the chamber and the cooling unit so that the refrigerant gas generated in the process of latent heat cooling the material can be discharged to the outside of the chamber;
(c-3) performing latent heat cooling at the saturation temperature in the process in which the refrigerant absorbs heat from the material on the porous module; and
(c-4) discharging the refrigerant gas generated by the latent heat cooling to the outside of the chamber
Material cooling method.
4. The method of claim 3,
Step (d) is:
(d-1) closing the first valve to block the refrigerant from being supplied into the chamber;
(d-2) reducing the difference between the internal atmospheric pressure and the external atmospheric pressure of the chamber through the pressure adjusting unit; and
(d-3) closing the second valve after the refrigerant gas inside the chamber is discharged to the outside of the chamber
Material cooling method.
5. The method of claim 4,
The step (c-1) is:
(c-1-1) opening a first valve provided between the chamber and the refrigerant storage unit;
(c-1-2) supplying the refrigerant to the bottom surface of the porous module provided in the chamber; and
(c-1-3) comprising the step of flowing out of the refrigerant to the upper surface of the porous module through a plurality of fine refrigerant outlet pipes of a preset length provided downward from the upper surface of the porous module
Material cooling method.
6. The method of claim 5,
Step (c-3) is:
(c-3-1) a liquid refrigerant flowing to the upper surface of the porous module and absorbing heat from the material; and
(c-3-2) latent heat cooling of the material by absorbing heat from the material by the liquid refrigerant and evaporating at the saturation temperature of the refrigerant set by the pressure control unit
Material cooling method.
7. The method of claim 6,
Step (c-3) is after step (c-3-2),
(c-3-3) further comprising the step of re-adjusting the internal atmospheric pressure of the chamber through the pressure adjusting unit to readjust the saturation temperature of the refrigerant according to the latent heat cooling condition due to evaporation of the refrigerant
Material cooling method.
8. The method of claim 7,
The step (c-3-3) is:
When the latent heat cooling of the material is performed even after a preset time has elapsed, the internal pressure of the chamber is increased through the pressure adjusting unit to increase the saturation temperature of the refrigerant,
When the latent heat cooling of the material is not achieved because the temperature of the refrigerant does not reach the saturation temperature of the refrigerant by cooling the material, the pressure inside the chamber is lowered through the pressure adjusting unit to lower the saturation temperature of the refrigerant step to make
Material cooling method.
9. The method of claim 8,
After step (e),
(f) cooling the refrigerant heated in the latent heat cooling process of the material through a cooling unit;
(g) replenishing the refrigerant lost in the latent heat cooling process of the material through the refrigerant replenishment unit; and
(h) temporarily storing the refrigerant before flowing into the chamber through the refrigerant storage unit, and adjusting the amount of refrigerant supplied into the chamber to maintain the amount of refrigerant in the chamber in a preset range
Material cooling method.

Images