KR102291250B1 - Microspeaker enclosure with porous material in resonance space - Google Patents

Microspeaker enclosure with porous material in resonance space Download PDF

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KR102291250B1
KR102291250B1 KR1020200061531A KR20200061531A KR102291250B1 KR 102291250 B1 KR102291250 B1 KR 102291250B1 KR 1020200061531 A KR1020200061531 A KR 1020200061531A KR 20200061531 A KR20200061531 A KR 20200061531A KR 102291250 B1 KR102291250 B1 KR 102291250B1
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porous material
enclosure
microspeaker
expanded particles
expanded
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KR1020200061531A
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Korean (ko)
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김천명
하종헌
윤종수
임재화
홍성진
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주식회사 이엠텍
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10—Homopolymers or copolymers of propene
    • C08J2323/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
    • C08J2325/02—Homopolymers or copolymers of hydrocarbons
    • C08J2325/04—Homopolymers or copolymers of styrene
    • C08J2325/06—Polystyrene
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Otolaryngology (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

An objective of the present invention is to provide a structure that can remove static noise caused by vibration of a porous material filled in a resonance space of a microspeaker enclosure in order to increase an SPL of a low frequency and decrease a THD of a low frequency. Provided, in the present invention, is the microspeaker enclosure provided with the porous material comprising: a microspeaker; an enclosure wherein a microspeaker is installed therein, forms a resonance space, and consists of an upper case and a lower case; a porous material filled within the resonance space of the enclosure; and expanded particles mixed with the porous material and filled in the resonance space of the enclosure, and expanded by heating.

Description

다공성 물질을 구비하는 마이크로스피커 인클로져{MICROSPEAKER ENCLOSURE WITH POROUS MATERIAL IN RESONANCE SPACE}MICROSPEAKER ENCLOSURE WITH POROUS MATERIAL IN RESONANCE SPACE

본 발명은 다공성 물질을 구비하는 마이크로스피커 인클로져에 관한 것이다. 더욱 상세하게는, 다공성 물질의 진동으로 인한 노이즈를 감소할 수 있는 구조를 구비하는 마이크로스피커 인클로져에 관한 것이다.The present invention relates to a microspeaker enclosure having a porous material. More particularly, it relates to a microspeaker enclosure having a structure capable of reducing noise due to vibration of a porous material.

마이크로스피커는 휴대용 기기 등에 구비되어 음향을 발생하는 장치로, 최근 모바일 기기들의 발달에 따라 다양한 기기들에 설치되고 있다. 특히 최근에 개발되는 모바일 기기들은 휴대를 용이하게 하기 위해 경량화, 소형화, 슬림화되는 추세인데, 그에 따라 모바일 기기에 설치되는 마이크로스피커도 소형화, 슬림화될 것이 요구된다. Microspeakers are devices that are provided in portable devices and generate sound, and are being installed in various devices according to the recent development of mobile devices. In particular, recently developed mobile devices tend to be lighter, smaller, and slimmer in order to facilitate portability, and accordingly, microspeakers installed in mobile devices are also required to be miniaturized and slimmer.

그러나 마이크로스피커의 경우 소형화, 슬림화되는 경우 진동판의 면적이 작아지고, 진동판이 진동하며 발생한 소리가 공명하며 증폭되는 공명 공간의 크기 역시도 작아지기 때문에 음압이 작아진다는 문제가 있었다. 이러한 음압의 감소는 특히 저음역대에서 두드러지며, 저음역대에서 음압을 강화하기 위해 다공성 물질인 공기 흡착제를 공명 공간에 배치함으로써, 다공성 물질이 공기 분자를 흡착하여 가상의 음향 공간을 만들게 되며, 저역대의 SPL을 향상되고, 저역대의 THD를 감소시키는 기술이 개발되어 왔다. However, in the case of a microspeaker, there is a problem that the sound pressure decreases because the area of the diaphragm becomes smaller when the size is reduced and the size of the resonant space in which the sound generated when the diaphragm vibrates is resonated and the size of the resonant space is also reduced. This reduction in sound pressure is particularly noticeable in the low range, and by placing an air adsorbent, a porous material, in the resonance space to enhance the sound pressure in the low range, the porous material adsorbs air molecules to create a virtual acoustic space. Techniques for improving SPL and reducing THD of low frequencies have been developed.

출원인 역시 저역대의 SPL을 향상시키기 위해, 도 1에 도시된 바와 같이 공기 흡착제를 마이크로스피커가 설치된 인클로져 내에 충진하는 기술을 개발하였다. 인클로져 내에 마이크로스피커(A)가 설치되며, 인클로져 내에서 공명 공간(back volume)에 다공성 물질(n)가 소정량 채워지며, 나머지 공간은 공기(air)가 차지한다. 인클로져는 상부 케이스(11), 하부 케이스(12), 하부 케이스(12)에 형성되며 다공성 물질을 인클로져 내로 충진하기 위한 충진홀(13), 충진홀(13)을 덮는 커버(14)로 이루어진다. 상부 케이스(11) 또는 하부 케이스(12)에는 마이크로스피커(A)의 설치를 안내하고, 마이크로스피커(A)의 요크에 형성된 통풍홀을 통해 공기가 원활히 드나들 수 있도록 하부 케이스(12)와 마이크로스피커(A)를 이격시키는 지지부재(21, 22)가 설치될 수 있다. 지지부재(21, 22)는 상부 케이스(11) 및 하부 케이스(12)와 각각 일체로 형성될 수도 있다. The applicant also developed a technique for filling an air adsorbent into an enclosure in which a microspeaker is installed as shown in FIG. 1 in order to improve the SPL of the low frequency band. A microspeaker (A) is installed in the enclosure, a predetermined amount of the porous material (n) is filled in a resonance space (back volume) in the enclosure, and the remaining space is occupied by air. The enclosure is formed in the upper case 11, the lower case 12, and the lower case 12, and includes a filling hole 13 for filling the porous material into the enclosure, and a cover 14 covering the filling hole 13. The upper case 11 or the lower case 12 guides the installation of the microspeaker (A), and allows air to smoothly enter and exit through the ventilation holes formed in the yoke of the microspeakers (A). Support members 21 and 22 to space the speaker A apart may be installed. The support members 21 and 22 may be formed integrally with the upper case 11 and the lower case 12, respectively.

그러나, 도 1에서 볼 수 있는 바와 같이, 다공성 물질 충진 과정에서 공명 공간에 다공성 물질(n)이 100% 충진이 안 될 경우, 다공성 물질(n) 간 또는 다공성 물질(n)과 인클로져(11, 12, 14)나 마이크로스피커(A)와 부딪힘으로써 잡음이 발생하는 문제가 있었다. 이러한 잡음은 다공성 물질(n)의 움직임이 없을 경우 발생하지 않아, 다공성 물질의 진동에 의한 것임을 알 수 있었다. 따라서 다공성 물질이 공명 공간에 충진되는 경우, 마이크로스피커가 음향 발생 시 인클로져 내부의 부품과 다공성 물질 간의 부딪힘으로 인한 것임을 알 수 있다. 따라서, 다공성 물질에 의한 저역대의 SPL 증가와 저역대의 THD 감소의 효과는 누리면서 다공성 물질의 진동에 의한 잡음을 제거하기 위한 기술 개발이 요구되었다. However, as can be seen in FIG. 1, when the porous material (n) is not 100% filled in the resonance space during the filling process of the porous material, between the porous material (n) or the porous material (n) and the enclosure (11, 12, 14) or the microspeaker (A), there was a problem that noise was generated. This noise does not occur when there is no movement of the porous material n, and it can be seen that the noise is due to the vibration of the porous material. Therefore, when the porous material is filled in the resonance space, it can be seen that the microspeaker is caused by the collision between the components inside the enclosure and the porous material when the sound is generated. Therefore, it was required to develop a technology to remove noise caused by vibration of the porous material while enjoying the effects of increasing the SPL of the low frequency band and reducing the THD of the low frequency band due to the porous material.

대한민국 등록특허 제10-1756673호Republic of Korea Patent No. 10-1756673

본 발명은 저역대의 SPL 증가와 저역대의 THD 감소를 위해 마이크로스피커 인클로져의 공명공간에 충진되는 다공성 물질의 진동에 의한 잡음을 제거할 수 있는 구조를 제공하는 것을 목적으로 한다. An object of the present invention is to provide a structure capable of removing noise caused by vibration of a porous material filled in a resonance space of a microspeaker enclosure in order to increase the SPL of the low frequency band and decrease the THD of the low frequency range.

본 발명은 마이크로스피커; 마이크로스피커가 내부에 설치되며, 공명 공간을 형성하고, 상부 케이스와 하부 케이스로 이루어지는 인클로져; 인클로져의 공명 공간 내에 충진되는 다공성 물질; 및 인클로져의 공명 공간 내에 다공성 물질과 혼합되어 충진되며, 가열에 의해 팽창되는 팽창 입자;를 포함하는 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다. The present invention is a microspeaker; an enclosure having a microspeaker installed therein, forming a resonance space, and comprising an upper case and a lower case; a porous material filled within the resonant space of the enclosure; and expanded particles that are mixed with and filled with a porous material in the resonance space of the enclosure and expand by heating.

또한 본 발명의 다른 일 예로, 팽창 입자는 팽창 전 0.1~1.0㎜이며, 50~120℃로 가열되어, 지름이 2배 이상 증가되고, 부피는 8배 이상 증가 되는 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다.In addition, as another example of the present invention, the expanded particles are 0.1 to 1.0 mm before expansion, and heated to 50 to 120° C. Microspeaker enclosures are provided.

또한 본 발명의 다른 일 예로, 팽창 입자는 팽창 전 서로 다른 지름을 가지는 것이 혼합되어 충진되며, 각 팽창 입자의 팽창 후 지름도 서로 다른 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다. Also, as another example of the present invention, there is provided a microspeaker enclosure comprising a porous material, characterized in that the expanded particles having different diameters are mixed and filled before expansion, and the diameters of each expanded particle are also different from each other after expansion.

또한 본 발명의 다른 일 예로, 팽창입자는 가열되어 팽창된 후 냉각될 때, 수축율이 10%이하인 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다.Further, as another example of the present invention, when the expanded particles are heated and expanded and then cooled, there is provided a microspeaker enclosure comprising a porous material, characterized in that the shrinkage is 10% or less.

또한 본 발명의 다른 일 예로, 팽창 입자는 폴리스틸렌, 폴리에틸렌, 폴리프로필렌을 포함하는 중합체인 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다. In another embodiment of the present invention, there is provided a microspeaker enclosure having a porous material, characterized in that the expanded particle is a polymer including polystyrene, polyethylene, and polypropylene.

또한 본 발명의 다른 일 예로, 다공성 물질에 대한 팽창 입자의 충진 비율은 10%보다 작은 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다. In another embodiment of the present invention, there is provided a microspeaker enclosure having a porous material, characterized in that the filling ratio of the expanded particles to the porous material is less than 10%.

또한 본 발명의 다른 일 예로, 팽창 입자의 형상은 구형, 타원형, 버섯 머리형, 일부가 찌그러진 구형과 같이 랜덤한 형상을 가지는 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다. Also, as another example of the present invention, the shape of the expanded particles provides a microspeaker enclosure comprising a porous material, characterized in that it has a random shape, such as a spherical shape, an oval shape, a mushroom head shape, or a partially crushed sphere.

또한 본 발명의 다른 일 예로, 팽창 입자는 오픈셀 또는 클로즈셀에서 필요에 따라 선택가능한 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져를 제공한다.In another embodiment of the present invention, the expanded particle provides a microspeaker enclosure having a porous material, characterized in that it can be selected as needed in an open cell or a closed cell.

본 발명이 제공하는 다공성 물질을 구비하는 마이크로스피커 인클로져는, 다공성 물질과 팽창 입자를 함께 충진하고, 충진 후 팽창 입자를 팽창시켜 다공성 물질이 인클로져 내에서 진동하거나 굴러다니면서 노이즈를 발생시키는 것을 방지할 수 있다. The microspeaker enclosure having a porous material provided by the present invention fills the porous material and the expanded particles together, and expands the expanded particles after filling to prevent the porous material from vibrating or rolling in the enclosure and generating noise. have.

도 1은 종래 기술에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져,
도 2는 본 발명의 제1 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져를 도시한 도면,
도 3은 도 2의 마이크로스피커 인클로져의 팽창 입자가 팽창된 모습을 도시한 도면,
도 4는 본 발명의 제2 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져를 도시한 도면,
도 5는 본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자의 제1 예를 도시한 도면,
도 6은 본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자의 제2 예를 도시한 도면,
도 7은 본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자의 제3 예를 도시한 도면.1 is a microspeaker enclosure having a porous material according to the prior art;
2 is a view showing a microspeaker enclosure having a porous material according to a first embodiment of the present invention;
3 is a view showing a state in which the expanded particles of the microspeaker enclosure of FIG. 2 are expanded;
4 is a view showing a microspeaker enclosure having a porous material according to a second embodiment of the present invention;
5 is a view showing a first example of expanded particles filled in a microspeaker enclosure having a porous material according to an embodiment of the present invention;
6 is a view illustrating a second example of expanded particles filled in a microspeaker enclosure having a porous material according to an embodiment of the present invention;
7 is a diagram illustrating a third example of expanded particles filled in a microspeaker enclosure having a porous material according to an embodiment of the present invention.

이하, 도면을 참조하여 본 발명을 더욱 상세하게 설명한다. Hereinafter, the present invention will be described in more detail with reference to the drawings.

도 2는 본 발명의 제1 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져를 도시한 도면, 도 3은 도 2의 마이크로스피커 인클로져의 팽창 입자가 팽창된 모습을 도시한 도면이다. FIG. 2 is a view showing a microspeaker enclosure having a porous material according to a first embodiment of the present invention, and FIG. 3 is a view showing a state in which expanded particles of the microspeaker enclosure of FIG. 2 are expanded.

본 발명의 일 실시예에 따른 마이크로스피커 인클로져는, 마이크로스피커(미도시)와, 마이크로스피커가 내부에 설치되며, 공명 공간(110) 형성하는 케이스(100)로 이루어지는 인클로져, 인클로져의 공명 공간(110) 내에 충진되는 다공성 물질(200) 및 인클로져의 공명 공간(110) 내에 다공성 물질(200)과 혼합되어 충진되며, 가열에 의해 팽창되는 팽창 입자(300)를 포함한다. A microspeaker enclosure according to an embodiment of the present invention includes a microspeaker (not shown), an enclosure including a case 100 having the microspeaker installed therein, and forming a resonance space 110 , the resonance space 110 of the enclosure. ) is mixed with the porous material 200 and filled with the porous material 200 in the resonance space 110 of the enclosure, and the expanded particles 300 are expanded by heating.

팽창 입자(300)는 가열 전 직경 0.1 ~ 1.0mm이며, 공명 공간(110) 내에 충진 된 후 50~120℃로 가열되어, 지름은 2배 이상 증가되고, 부피는 8배 이상 증가된다. 그로 인해, 다공성 물질(200)과 팽창 입자(300)가 공명 공간(110) 내에 충진될 때 생길 수 있는 입자 간 간극이 팽창 입자(300)의 팽창으로 인해 줄어들게 되며, 다공성 물질(200)과 팽창 입자(300)들이 밀집하게 되어 진동하거나 움직이며 노이즈가 발생하는 것을 방지할 수 있다. The expanded particles 300 have a diameter of 0.1 to 1.0 mm before heating, and are heated to 50 to 120° C. after being filled in the resonance space 110, so that the diameter is increased by 2 times or more, and the volume is increased by 8 times or more. As a result, a gap between the particles that may occur when the porous material 200 and the expanded particles 300 are filled in the resonance space 110 is reduced due to the expansion of the expanded particles 300 , and the porous material 200 and the expanded particles 300 . Since the particles 300 are densely vibrated or moved, it is possible to prevent noise from occurring.

팽창 입자(300)는 가열 후 열을 제거하여 냉각되더라도 수축율이 10%이내이다. 수축율은 팽창 입자(300)가 마이크로스피커의 발열 등에 의해 재가열되거나 재냉각되더라도 변함없이 10% 이내를 유지한다.The expanded particles 300 have a shrinkage rate of less than 10% even when cooled by removing heat after heating. The shrinkage rate is maintained within 10% even if the expanded particles 300 are reheated or recooled by heat of the microspeaker.

팽창 입자(300)는 폴리스틸렌, 폴리에틸렌, 폴리프로필렌과 같은 중합체 중에서 선택된 어느 하나로 제조된다. The expanded particles 300 are made of any one selected from among polymers such as polystyrene, polyethylene, and polypropylene.

한편, 팽창 입자(300)의 충진량은 다공성 물질(200)의 충진량의 10% 이하인 것이 바람직하다. Meanwhile, the filling amount of the expanded particles 300 is preferably 10% or less of the filling amount of the porous material 200 .

도 4는 본 발명의 제2 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져를 도시한 도면이다.4 is a diagram illustrating a microspeaker enclosure having a porous material according to a second embodiment of the present invention.

제2 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져는 공명 공간(110) 내에 다공성 입자(200)와 함께 충진되는 팽창 입자(302, 304, 306)의 크기가 각각 다른 사이즈인 것이 특징이다. 팽창 전 크기가 다른 팽창 입자(302, 304, 306)를 인클로져 내에 충진함으로써, 팽창 후에도 크기가 각각 다른 팽창 입자(302, 304, 306)들이 공명 공간(110)을 채우게 된다. 크기가 상이한 팽창 입자(302, 304, 306)들로 공명 공간(110)을 채움에 따라 다공성 물질(200)과 팽창 입자(302, 304, 306)를 포함한 충진 입자들 사이의 간극을 더 작게 줄일 수 있다는 장점이 있다. The microspeaker enclosure having a porous material according to the second embodiment is characterized in that the sizes of the expanded particles 302 , 304 , and 306 filled with the porous particles 200 in the resonance space 110 are different from each other. By filling the expanded particles 302 , 304 , 306 of different sizes before expansion into the enclosure, the expanded particles 302 , 304 , 306 of different sizes respectively fill the resonance space 110 even after expansion. As the resonant space 110 is filled with expanded particles 302 , 304 , 306 of different sizes, the gap between the porous material 200 and the filling particles including the expanded particles 302 , 304 , 306 is reduced to a smaller size. It has the advantage of being able to

도 5는 본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자의 제1 예를 도시한 도면, 도 6은 본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자의 제2 예를 도시한 도면, 도 7은 본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자의 제3 예를 도시한 도면이다. 5 is a view illustrating a first example of expanded particles filled in a microspeaker enclosure having a porous material according to an embodiment of the present invention, and FIG. 6 is a microscopic view showing a porous material according to an embodiment of the present invention FIG. 7 is a view showing a second example of expanded particles filled in a speaker enclosure, and FIG. 7 is a view showing a third example of expanded particles filled in a microspeaker enclosure having a porous material according to an embodiment of the present invention.

본 발명의 일 실시예에 따른 다공성 물질을 구비하는 마이크로스피커 인클로져에 충진되는 팽창 입자(300a, 300b, 300c)는 구형, 타원형, 버섯머리형, 구형 베이스에 일부가 찌그러진 형, 다각형의 모서리가 라운드 진 형태 등 다양한 형상을 가질 수 있다. 즉, 팽창 입자(300a, 300b, 300c)의 형상에는 큰 제약이 없다. The expanded particles 300a, 300b, and 300c filled in the microspeaker enclosure having a porous material according to an embodiment of the present invention are spherical, oval, mushroom head, partially dented on a spherical base, and rounded corners of polygons. It may have various shapes, such as a true form. That is, there is no great restriction on the shape of the expanded particles 300a, 300b, and 300c.

또한, 팽창 입자는, 공기를 흡수할 수 있는 오픈셀이나, 공기를 흡수하지 못하는 클로즈 셀 중 필요에 따라 셀 형상을 선택함으로써, 인클로져 내 공명 공간의 음성진동학적 특성을 조절할 수 있다. In addition, the expanded particles can adjust the negative vibrational properties of the resonance space in the enclosure by selecting a cell shape from among open cells capable of absorbing air and closed cells that cannot absorb air as needed.

Claims (8)

마이크로스피커;
마이크로스피커가 내부에 설치되며, 공명 공간을 형성하는 케이스로 이루어지는 인클로져;
인클로져의 공명 공간 내에 충진되는 다공성 물질; 및
인클로져의 공명 공간 내에 다공성 물질과 혼합되어 충진되며, 가열에 의해 팽창되는 팽창 입자;를 포함하되,
팽창 입자는, 팽창 전 0.1 ~ 1.0 ㎜이며, 50 ~ 120 ℃로 가열되어, 지름이 2배 이상 증가되고 부피는 8배 이상 증가되고, 팽창 전 서로 다른 지름을 가지는 것이 혼합되어 충진되고 각 팽창 입자의 팽창 후 지름도 서로 다르며, 가열되어 팽창된 후 냉각될 때 수축율이 10% 이하이며,
다공성 물질에 대한 팽창 입자의 충진 비율은 10%보다 작고,
팽창 입자는, 폴리스틸렌, 폴리에틸렌, 폴리프로필렌을 포함하는 중합체 중 어느 하나인 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져.microspeaker;
an enclosure having a microspeaker installed therein and comprising a case forming a resonance space;
a porous material filled within the resonant space of the enclosure; and
Including, but including,;
The expanded particles are 0.1 ~ 1.0 mm before expansion, heated to 50 ~ 120 ℃, the diameter is increased more than 2 times, the volume is increased 8 times or more, and before expansion, things with different diameters are mixed and filled, and each expanded particle The diameter after expansion is also different, and the shrinkage rate is less than 10% when heated and expanded and then cooled.
The filling ratio of the expanded particles to the porous material is less than 10%,
A microspeaker enclosure having a porous material, characterized in that the expanded particles are any one of a polymer including polystyrene, polyethylene, and polypropylene. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 제1항에 있어서,
팽창 입자의 형상은 구형, 타원형, 버섯 머리형, 일부가 찌그러진 구형과 같이 랜덤한 형상을 가지는 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져.According to claim 1,
A microspeaker enclosure having a porous material, characterized in that the expanded particle has a random shape, such as a sphere, an oval, a mushroom head, or a partially crushed sphere. 제1항에 있어서,
팽창 입자는 필요에 따라 오픈셀 또는 클로즈셀 구조로 선택가능한 것을 특징으로 하는 다공성 물질을 구비하는 마이크로스피커 인클로져.According to claim 1,
A microspeaker enclosure having a porous material, characterized in that the expanded particles are selectable in an open-cell or closed-cell structure, if necessary.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101756673B1 (en) 2016-06-07 2017-07-25 주식회사 이엠텍 Microspeaker enclosure with porous material in resonance space
US20200152165A1 (en) * 2018-11-08 2020-05-14 Apple Inc. Acoustic filler including acoustically active beads and expandable filler

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101756673B1 (en) 2016-06-07 2017-07-25 주식회사 이엠텍 Microspeaker enclosure with porous material in resonance space
US20200152165A1 (en) * 2018-11-08 2020-05-14 Apple Inc. Acoustic filler including acoustically active beads and expandable filler

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