CN102387446B - Sound equipment structure and electronic device using the same - Google Patents
Sound equipment structure and electronic device using the same Download PDFInfo
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- CN102387446B CN102387446B CN201110277654.5A CN201110277654A CN102387446B CN 102387446 B CN102387446 B CN 102387446B CN 201110277654 A CN201110277654 A CN 201110277654A CN 102387446 B CN102387446 B CN 102387446B
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Abstract
A sound equipment structure comprises a sound chamber shell and a loudspeaker arranged in the sound chamber shell. The sound equipment structure also comprises a low frequency resonance unit arranged in the sound chamber shell. The low frequency resonance unit comprises: a vibrating body and a mass block which is connected to the vibrating body. The loudspeaker is used to be responsible for a medium and high frequency part in sound. The low frequency resonance unit is used to be responsible for the low frequency part in the sound. The invention also provides an electronic device using the sound equipment structure. The electronic device comprises a shell. The sound equipment structure is arranged in the shell. In the sound equipment structure, the low frequency resonance unit is used to be responsible for the low frequency part in the sound so that playing defects of the loudspeaker to the low frequency part in the sound can be made up and a bass effect of the sound equipment structure can be improved.
Description
Technical field
The present invention relates to a kind of acoustic structure, particularly a kind of for the acoustic structure in electronic installation.
Background technology
Electronic installation is towards miniaturized and multifunctional direction development now, and need the function that more hardware supports is abundant, so, the space that speaker cavity left for by electronic installation is more and more less, and this just requires that the size of loud speaker is also more and more less.Undersized loud speaker is due to the restriction by size and inner space, it is smaller that vibrating membrane designs, vibrating membrane Oscillation Amplitude is also smaller, and this just determines small size loud speaker and is difficult to obtain lower resonance frequency, the low frequency part of also just having no way in good audio playback.
In order to obtain reasonable low-frequency effect, the vibrating diaphragm of loud speaker is needed to have a larger Oscillation Amplitude and a larger airtight sound chamber.After speaker size reduces, due to the restriction of sound film size, sound film can not obtain low resonance frequency, and loud speaker also just cannot obtain good low frequency result of broadcast.After the magnetic circuit part distance of sound film and loud speaker reduces, be easy to the magnetic circuit part colliding loud speaker self during the vibration of sound film, cause the noise that audio frequency is play.
Because loud speaker will take into account the broadcasting of bass and high middle pitch, at bass part, loud speaker amplitude is comparatively large, is easy to cause the bad problem such as vibratory murmur and voice coil line fatigue break.
Smaller szie, more the loud speaker of low resonant frequency needs higher cost, and this also brings the increase of electronic installation complete machine cost.
Summary of the invention
In view of this, be necessary that providing a kind of promotes the acoustic structure of bass effect and apply the electronic installation of this acoustic structure.
The present invention is achieved in that a kind of acoustic structure, it comprises sound chamber shell and is located at the loud speaker in the shell of described sound chamber, described acoustic structure also comprises the low-frequency resonant unit be arranged in the shell of described sound chamber, described low-frequency resonant unit involving vibrations body and the mass be connected on described vibrating body, described loud speaker is used for the medium-high frequency part being responsible for sound, and described low-frequency resonant unit is used for the low frequency part being responsible for sound.
The present invention also provides a kind of electronic installation applying above-mentioned acoustic structure, and described electronic installation comprises a shell, and described acoustic structure is arranged in described shell.
Described acoustic structure is responsible for the low frequency part of sound by low-frequency resonant unit, compensate for the broadcasting defect of loud speaker for acoustic low-pass part, improves the bass effect of acoustic structure.
Accompanying drawing explanation
Fig. 1 is the front view of the electronic installation of one embodiment of the invention.
Fig. 2 is the three-dimensional exploded view of the electronic installation of Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of the subelement in the electronic installation of Fig. 2.
Fig. 4 is the cutaway view along A-A line of Fig. 3, comprising a kind of low-frequency resonant unit of embodiment.
Fig. 5 is the front view of the low-frequency resonant unit of Fig. 4.
Fig. 6 is the cutaway view along B-B line of Fig. 5.
Fig. 7 is the cutaway view along A-A line of Fig. 3, comprising the low-frequency resonant unit of another kind of embodiment.
Fig. 8 is the front view of the low-frequency resonant unit of Fig. 7.
Fig. 9 is the cutaway view along C-C line of Fig. 8.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1 to Fig. 3, the acoustic structure 20 that the electronic installation 100 of one embodiment of the invention comprises a shell 10 and is placed in shell 10.Described acoustic structure 20 comprises a sound chamber shell 21 and is located at loud speaker 22 and the low-frequency resonant unit in described sound chamber shell 21.Described loud speaker 22 is for the medium-high frequency part of responsible sound, and described low-frequency resonant unit is responsible for the low frequency part of sound.Described sound chamber shell 21 comprises the installation panel 23 for installing described loud speaker 22 and low-frequency resonant unit.Described installation panel 23 offers the first through hole 24 and the second through hole 25.Described loud speaker 22 is first through hole 24 described in capping in sound chamber shell 21, and described low-frequency resonant unit is second through hole 25 described in capping in sound chamber shell 21.The mass that described low-frequency resonant unit comprises a vibrating body and is connected on described vibrating body.
The low-frequency resonant unit that the acoustic structure 20 of the electronic installation 100 of one embodiment of the invention is applied has at least two kinds of embodiments, Fig. 4 to Fig. 6 shows the low-frequency resonant unit 30a of the first embodiment, and Fig. 7 to Fig. 9 shows the low-frequency resonant unit 30b of the second embodiment.Below low-frequency resonant unit 30a, 30b of two kinds of embodiments are described in detail.
Please refer to Fig. 4 and Fig. 6, the mass 32a that described low-frequency resonant unit 30a comprises a vibrating body 31a and is connected on described vibrating body 31a.Described vibrating body 31a structure in the form of sheets.The outer rim of described vibrating body 31a is connected to the edge of described second through hole 25.Described mass 32a is connected to the middle part of described vibrating body 31a.Described vibrating body 31a is formed with a protruding 33a extended towards described sound chamber shell 21 inside around described mass 32a.Described vibrating body 31a is circular ring, and described mass 32a is round pie structure, and the outer rim of described mass 32a is connected to the inner edge of described vibrating body 31a.Described vibrating body 31a is made up of nonmetallic elastomeric material, such as, and rubber.The weight of described mass 32a is greater than the weight of described vibrating body 31a.Described mass 32a is made up of metal material, and such as, described mass 32a is steel plate.
Please refer to Fig. 7 to Fig. 9, described low-frequency resonant unit 30b involving vibrations body 31b and the mass 32b be connected on described vibrating body 31b.Described vibrating body 31b structure in the form of sheets.The outer rim of described vibrating body 31b is connected to the edge of described second through hole 25.Described mass 32b is connected to the middle part of described vibrating body 31b.Described vibrating body 31b around described mass 32b be formed one dorsad described sound chamber shell 21 inside extend protruding 33b.Described vibrating body 31b structure in the form of annular discs, described mass 32b is round pie structure, and described mass 32b is connected to the middle part of described vibrating body 31b.Described vibrating body 31b is known sound membrane structure.The weight of described mass 32b is greater than the weight of described vibrating body 31b.Described mass 32b is made up of nonmetallic materials, and such as, resin, resin superpose mixture of thing, resin and aluminium foil etc. with aluminium foil.In other embodiments, described protruding 33b can extend towards described sound chamber shell 21 inside.
Please again consult Fig. 1 to Fig. 4 and Fig. 7, the shell 10 of described electronic installation 100 comprises upper cover 11 and lower cover 12.Described upper cover 11 and lower cover 12 coordinate and are placed in shell 10 by described acoustic structure 20.The sound chamber shell 21 of described acoustic structure 20 comprises upper casing 211 and a lower casing 212.Described upper casing 211 coordinates with described lower casing 212 and described loud speaker 22 and low-frequency resonant unit is placed in sound chamber shell 21.Some senders 13 are offered in the first through hole 24 on the corresponding described installation panel 23 of described upper cover 11 and the position of the second through hole 25.In the present embodiment, described electronic installation 100 is mobile phone.Described lower casing 212 is the housing in mobile phone, and described sound chamber shell 21 is made up of with the housing in mobile phone described upper casing 211.Certainly, described sound chamber shell 21 can be made up of through the housing in mobile phone and the circuit board 14 in mobile phone described upper casing 211.In a word, as long as ensure that described upper casing 211 will form an airtight sound chamber with other elements.Installing one camera 15 in mobile phone, described camera 15 is through the approximate mid-section position of described sound chamber shell 21, and described camera 15 ensures sealing state with the binding site of described sound chamber shell 21.
Electronic installation 100 of the present invention, for mobile phone, is not limited to mobile phone, can be other electronic installations, fall as, convenient music player devices, TV, computer etc.
Described acoustic structure 20 is applied in miniaturized electronic installation, and be responsible for the medium-high frequency part of sound by loud speaker 22, low-frequency resonant unit is responsible for the low frequency part of sound.The medium-high frequency part of loud speaker 22 responsible sound is play, and sound film amplitude is little, and the probability that noise occurs diminishes, and the probability of voice coil vibrations fatigue break diminishes, and reduces the probability of the speaker damage that electronic installation long-time play music causes.
Low-frequency resonant unit is made up of vibrating body and mass, and with low cost, structure is simple, manufactures processing and is very easy to.Low frequency part completes primarily of low-frequency resonant unit, low-frequency resonant unit is not because have magnetic circuit part and the coiler part of conventional loudspeakers, its Oscillation Amplitude is only relevant with the space in sound chamber, this just effectively prevent the high problem of the fraction defectives such as conventional loudspeakers audio plays part low-frequency noise, reduce the performance requirement to device speaker, improve the complete machine rate of finished products of electronic installation.
These are only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. an acoustic structure, it comprises sound chamber shell and is located at the loud speaker in the shell of described sound chamber, it is characterized in that: described acoustic structure also comprises the low-frequency resonant unit be arranged in the shell of described sound chamber, described low-frequency resonant unit involving vibrations body and the mass be connected on described vibrating body, the weight of described mass is greater than the weight of described vibrating body, described loud speaker is used for the medium-high frequency part being responsible for sound, described low-frequency resonant unit is used for the low frequency part being responsible for sound, described sound chamber shell comprises the installation panel for installing described loud speaker and low-frequency resonant unit, described installation panel offers the first through hole and the second through hole, described loud speaker is the first through hole described in capping in the shell of sound chamber, described low-frequency resonant unit is the second through hole described in capping in the shell of sound chamber, described sound chamber shell comprises a upper casing and a lower casing, and described installation panel is positioned on described upper casing, and described in described loud speaker and described low-frequency resonant unit matching, upper casing and described lower casing are encircled into airtight sound chamber.
2. acoustic structure as claimed in claim 1, is characterized in that: the outer rim of described vibrating body is connected to the edge of described second through hole, and described mass is connected to the middle part of described vibrating body.
3. acoustic structure as claimed in claim 2, is characterized in that: described vibrating body is formed with a projection around described mass.
4. acoustic structure as claimed in claim 2 or claim 3, it is characterized in that: described vibrating body is circular, the outer rim of described mass is connected to the inner edge of described vibrating body.
5. acoustic structure as claimed in claim 4, is characterized in that: described vibrating body is made up of nonmetallic elastomeric material.
6. acoustic structure as claimed in claim 2 or claim 3, it is characterized in that: described vibrating body is in the form of annular discs, described mass is connected to the middle part of described vibrating body.
7. acoustic structure as claimed in claim 6, is characterized in that: described vibrating body is sound film.
8. an electronic installation, it comprises a shell, it is characterized in that: described electronic installation also comprises the acoustic structure as described in claim 1 to 7 any one be placed in described shell.
9. electronic installation as claimed in claim 8, is characterized in that: described electronic installation is mobile phone, and the corresponding described acoustic structure of described shell is provided with sender.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110277654.5A CN102387446B (en) | 2011-09-19 | 2011-09-19 | Sound equipment structure and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110277654.5A CN102387446B (en) | 2011-09-19 | 2011-09-19 | Sound equipment structure and electronic device using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102387446A CN102387446A (en) | 2012-03-21 |
| CN102387446B true CN102387446B (en) | 2014-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110277654.5A Active CN102387446B (en) | 2011-09-19 | 2011-09-19 | Sound equipment structure and electronic device using the same |
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| Country | Link |
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| CN (1) | CN102387446B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630067B (en) * | 2012-04-02 | 2015-11-25 | 瑞声声学科技(深圳)有限公司 | Multimedia sound system and driving method thereof |
| CN103118313A (en) * | 2012-10-18 | 2013-05-22 | 中兴通讯股份有限公司 | Sound cavity, sound cavity system and mobile terminal |
| CN102946580A (en) * | 2012-11-15 | 2013-02-27 | 深圳市盛泰兴业科技有限公司 | Frequency demultiplier |
| CN113497845B (en) * | 2020-04-02 | 2022-07-19 | 华为技术有限公司 | Electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1781334A (en) * | 2003-05-30 | 2006-05-31 | 索尼爱立信移动通讯股份有限公司 | Reverse mounted micro-speaker assembly and mobile terminals including the same |
| CN1783903A (en) * | 2004-11-29 | 2006-06-07 | 京瓷株式会社 | Acoustic device |
| CN201557247U (en) * | 2009-11-09 | 2010-08-18 | 常州美欧电子有限公司 | Vibration film and electroacoustic energy converter using same |
-
2011
- 2011-09-19 CN CN201110277654.5A patent/CN102387446B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1781334A (en) * | 2003-05-30 | 2006-05-31 | 索尼爱立信移动通讯股份有限公司 | Reverse mounted micro-speaker assembly and mobile terminals including the same |
| CN1783903A (en) * | 2004-11-29 | 2006-06-07 | 京瓷株式会社 | Acoustic device |
| CN201557247U (en) * | 2009-11-09 | 2010-08-18 | 常州美欧电子有限公司 | Vibration film and electroacoustic energy converter using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102387446A (en) | 2012-03-21 |
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Address after: Nanshan District Xili street Shahe road 518000 Shenzhen City, Guangdong province No. 3151 emerging industrial park (Jian Xing Technology Building B building 801-805) Patentee after: Shenzhen Technology Co., Ltd. Address before: 518000 Futian District, Shenzhen Binhe Road interchange with Xiangmi Lake, Tian An Innovation Technology Plaza (phase two) east block, 1101 Patentee before: Shenzhen Doov Technology Co., Ltd. |
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Effective date of registration: 20170728 Address after: 644005, 21, 27 and 7, west section of port Park Avenue, Lingang Economic and Technological Development Zone, Sichuan, Yibin Patentee after: Sichuan doov intelligent Yungu Limited Address before: Nanshan District Xili street Shahe road 518000 Shenzhen City, Guangdong province No. 3151 emerging industrial park (Jian Xing Technology Building B building 801-805) Patentee before: Shenzhen Technology Co., Ltd. |