KR102289424B1 - 3d embeded electronic circuit parts, 3d embeded electronic circuit parts making apparatus and 3d embeded electronic circuit parts manufacturing method using the same - Google Patents

Abstract

The present invention is made of an insulating material, the body portion is formed concavely having an element accommodating portion for accommodating an electronic device; a first wiring part formed in a horizontal direction of the body part and electrically connecting the electronic device; and a second wiring part formed in a vertical direction of the body part to electrically connect the electronic device, wherein the electronic device, the first wiring part, and the second wiring part are embedded in the body part and sealed from the external environment. Disclosed is a three-dimensional embedded electronic circuit component that maintains a state.

Description

3D embedded electronic circuit component, 3D embedded electronic circuit component manufacturing apparatus, and 3D embedded electronic circuit component manufacturing method using the same SAME}

The present invention relates to a 3D embedded electronic circuit component manufactured using a 3D printing apparatus, a 3D embedded electronic circuit component manufacturing apparatus, and a 3D embedded electronic circuit component manufacturing method using the same.

Early IoT-related technologies introduced the ubiquitous concept and were developed focusing on wireless data transmission and reception indoors, such as home networking. Its use is rapidly increasing for the purpose of diagnosis, monitoring, and remote control. However, unlike indoors, in outdoor environments where rainfall and snowfall are common, not only water (moisture), but also salt, dust, and other chemicals in coastal areas may adversely affect electronic circuit components such as corrosion or short circuit. It is the main cause of the occurrence and shortening of lifespan.

In addition, since the wireless sensor module has various manufacturing and installation conditions depending on the installation and use environment, the physical properties to be measured and the communication method, it is difficult to present a unified standard in terms of shape, size and performance. However, the currently used wireless sensor module contains various electronic devices and has a printed circuit board (PCB, Printed Circuit Board) printed with electrical wiring inside, and the circuit board is protected from various mechanical loads and environmental factors outside. It is composed of a case (enclosure) for protection. At this time, the case plays a primary role in protecting the circuit board from a mechanical environment such as an impact, but it is almost impossible to completely block it from all physical and chemical environments such as water (moisture) moisture, salt and dust. In addition, since the printed circuit board itself has a uniform and standardized two-dimensional planar shape, the shape that the sensor module can have is also not significantly different from the two-dimensional shape, and there is always a constant empty space between the printed circuit board and the case. Due to its existence, effective and highly integrated space utilization is impossible, which acts as a decisive obstacle to the miniaturization of the sensor module.

In addition, the printed circuit board has a complex structure and is manufactured through an expensive semiconductor process, and once designed, not only is it difficult to redesign and remanufacture, but also design and manufacture expensive molds to manufacture even a simple and simple case. , and the production of parts by plastic injection is required. In this manufacturing process, there may be no major problem when the printed circuit board design is partially changed, but when a full redesign is required, even the mold must be remanufactured, resulting in a great loss in cost and time.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a three-dimensional embedded electronic circuit component, a three-dimensional embedded electronic circuit component, which can improve the blocking performance of components of an electronic circuit component from the external environment while further improving the degree of freedom for the shape of the electronic circuit component. An object of the present invention is to provide an electronic circuit component manufacturing apparatus and a three-dimensional embedded electronic circuit component manufacturing method using the same.

A three-dimensional buried electronic circuit component according to an embodiment of the present invention includes: a body portion made of an insulating material, formed concavely, and having an element accommodating portion for accommodating an electronic element; a first wiring part formed in a horizontal direction of the body part and electrically connecting the electronic device; and a second wiring part formed in a vertical direction of the body part to electrically connect the electronic device, wherein the electronic device, the first wiring part, and the second wiring part are embedded in the body part and sealed from the external environment. keep the status

The first wiring unit may be made of low melting metals, and the second wiring unit may be formed in a form in which a paste containing metal powder is cured.

The low-melting-point metal may include at least one of In, Sn, Ag, and Cu.

The metal powder may include at least one of Ag, Cu, Al, Au, Pt, Ni, Zn, and Pd.

The body portion includes a first body and a second body stacked to form a single exterior, and the device accommodating portion is formed in the first and second body, respectively, and a first device receiving groove for accommodating the electronic device. and a second element accommodating groove, wherein the electronic elements accommodated in the first and second element accommodating grooves may be electrically connected by the first and second wiring units.

The body portion may include: a first wire receiving portion concavely formed from one surface of the body portion to accommodate the first wire portion; and a second wire accommodating part formed through the body in a vertical direction to accommodate the second wire part.

In the three-dimensional buried electronic circuit component manufacturing apparatus according to an embodiment of the present invention for manufacturing the three-dimensional buried electronic circuit component, low melting metals are printed in a stacked manner so that the first wiring part is horizontally the body part. a first output unit formed in a direction; a second output unit for forming the second wiring unit in a vertical direction of the body unit by printing paste containing metal powder in a stacked type; and a third output unit for forming the body unit by printing an insulating material in a stacked manner.

The first output unit may print the low-melting-point metal by an induction heating method, and the second output unit may print the paste by a pneumatic dispenser method.

The three-dimensional embedded electronic circuit component manufacturing apparatus further includes a displacement sensing unit configured to acquire shape information in a vertical direction of the body part, wherein the first output unit and the second output unit are obtained from the displacement sensing unit. The height of the first and second wiring units may be adjusted using the shape information.

The three-dimensional buried electronic circuit component manufacturing apparatus may further include a heat generating unit configured to apply heat toward the second wiring unit in the paste state to harden the second wiring unit.

A method for manufacturing a 3D embedded electronic circuit component according to an embodiment of the present invention using the 3D embedded electronic circuit component manufacturing apparatus includes: a first step of manufacturing the body portion using the third output unit; a second step of obtaining shape information in a vertical direction of the body part using the displacement sensing unit and reflecting the obtained shape information on a movement path of the first and second output units; a third step of forming the first wiring unit on the first wiring receiving unit using the first output unit; a fourth step of inserting and fixing the electronic device into the device accommodating part; a fifth step of forming the second wiring unit on the second wiring receiving unit using the second output unit; and a sixth step of embedding the electronic device, the first wiring part, and the second wiring part on the body part using the third output part to seal it from an external environment.

The effects of the present invention obtained through the above-described solution are as follows.

The electronic device, the first wiring part, and the second wiring part are formed to have a structure embedded in the body part, and the electronic device, the first wiring part, and the second wiring part provided for the operation of the electronic circuit component are protected from harmful external environments. Since the completely blocked state can be maintained, the durability of electronic circuit components can be further improved.

In addition, by using the 3D printing type manufacturing apparatus, it is possible to minimize the empty area in the interior of the electronic circuit component, that is, the internal space of the body portion, so that the highly integrated arrangement of the components of the electronic circuit component is possible. As a result, the space utilization inside the electronic circuit component can be greatly improved, and the size of the electronic circuit component and the degree of freedom in design can be further improved.

1 is an exploded perspective view of a three-dimensional embedded electronic circuit component according to an embodiment of the present invention.
2 is a perspective view illustrating a first body of a three-dimensional buried electronic circuit component according to another embodiment of the present invention.
3 is a conceptual diagram illustrating a cross-section in which the first body is stacked with the second body in FIG. 2 .
4 is a conceptual diagram showing the configuration of a three-dimensional buried electronic circuit component manufacturing apparatus according to an embodiment of the present invention.
5 is a conceptual diagram illustrating an example in which the displacement sensing unit shown in FIG. 4 acquires shape information of the body part.
FIG. 6 is a conceptual diagram illustrating a state in which a first wiring unit and a second wiring unit are cured by the heating unit shown in FIG. 4 .
7 is a flowchart illustrating an embodiment of a method for manufacturing a 3D embedded electronic circuit component using the 3D embedded electronic circuit component manufacturing apparatus illustrated in FIG. 4 .

Hereinafter, a three-dimensional embedded electronic circuit component, a three-dimensional embedded electronic circuit component manufacturing apparatus, and a three-dimensional embedded electronic circuit component manufacturing method using the same according to the present invention will be described in more detail with reference to the drawings. In the present specification, the same and similar reference numerals are assigned to the same and similar components in different embodiments, and the description is replaced with the first description. As used herein, the singular expression includes the plural expression unless the context clearly dictates otherwise.

1 is an exploded perspective view of a 3D embedded electronic circuit component 100 according to an embodiment of the present invention, and FIG. 2 is a first body of the 3D embedded electronic circuit component 100 according to another embodiment of the present invention. ( 111 ) is a perspective view, and FIG. 3 is a conceptual diagram illustrating a cross-section in which the first body 111 is stacked with the second body 112 in FIG. 2 .

1 to 3 , the 3D embedded electronic circuit component 100 includes a body part 110 , first wiring parts 121 and 122 , and a second wiring part 130 . The three-dimensional embedded electronic circuit component 100 may be, for example, a sensor module.

The body part 110 forms the exterior of the three-dimensional buried electronic circuit component 100 , is made of an insulating material, and accommodates the electronic elements 10a and 10b constituting the three-dimensional buried electronic circuit component 100 . It includes accommodating portions 111a and 112a. In addition, the body part 110 may include a first body 111 and a second body 112 that are stacked to form a single exterior. In the drawings of the present invention, although it is shown that the body part 110 is composed of two, this is only one embodiment, and the body part 110 may be composed of a plurality of three or more instead of two. The electronic devices 10a and 10b may be accommodated in device accommodating portions 111a and 112a provided in the first body 111 and the second body 112 , respectively. The electronic devices 10a and 10b may have various shapes as needed, and the electronic device 10b accommodated on the second body 112 is a lead frame ( 10b') may be formed. In addition, in addition to the electronic devices 10a and 10b, a plurality of PADs 11 and a PAD wiring 11a for electrical connection of the PAD 11 as shown in FIG. 3 are provided inside the body 110 . can be

In addition, when the body part 110 includes the first body 111 and the second body 112 , the element accommodating parts 111a and 112a are formed on the first body 111 . A device accommodating groove 111a and a second device accommodating groove 112a formed on the second body 111 may be provided. The electronic devices 10a and 10b accommodated in the first element accommodating groove 111a and the second element accommodating groove 112a are electrically connected by the first wiring parts 121 and 122 and the second wiring part 130 .

The first wiring parts 121 and 122 are formed in a horizontal direction of the body part 110 to electrically connect the electronic devices 10a and 10b. The first wiring parts 121 and 122 may be formed in a form in which low melting metals are cured. In addition, the low-melting-point metal may include at least one of In, Sn, Ag, and Cu, or may be made of an alloy made of some of them. In the case of the low melting point metal, a mixture of an electrically conductive metal (In, Ag) in a ratio of 97:3 may be used, and a small amount of Cu flake may be added as needed. The melting temperature of the low-melting-point metal is 160 to 300 °C and may be adjusted as necessary. On the other hand, the body part 110 may be provided with first wiring receiving parts 111b1 and 112b1 formed concavely from one surface of the body part 110 to accommodate the first wiring parts 121 and 122 . The first wiring receiving portions 111b1 and 112b1 may be formed to have a semicircular shape.

The second wiring part 130 is formed in a vertical direction of the body part 110 to electrically connect the electronic devices 10a and 10b. The second wiring unit 130 may be formed in a cured form of paste including metal powder. In addition, the metal powder may include at least one of Ag, Cu, Al, Au, Pt, Ni, Zn, and Pd, or may be made of an alloy made of some of them. In the paste, vinyl chloride, vinyl acetate, hydroxyalkyl acrylate copolymer resin, etc. may be used as a binder, and a metal precursor compound (a metal carboxylate salt, etc.), carbon nanotubes (CNT), graphene, graphite, etc. may be used as a binder. (graphite), carbon fiber (carbon fiber), etc. may be included. The viscosity of the paste at room temperature is generally as low as about 50,000 cps and as high as about 150,000 cps.

The paste means a dough or paste state. Meanwhile, the body part 110 may include a second wire accommodating part 111b2 which is formed concavely from one surface of the body part 110 and accommodates the second wire part 130 . The second wiring accommodating part 111b2 may function as a via-hole. In the drawings of the present invention, the second wire accommodating part 111b2 provided on the first body 111 is illustrated as an example, but the second wire accommodating part may also be provided on the second body 112 . The second wiring accommodating part 111b2 may have a cylindrical shape, a triangular shape, or a rectangular shape. However, for the characteristics of the paste and smooth manufacturing process, it is more preferable to have a cylindrical shape.

Here, the electronic devices 10a and 10b, the first wiring parts 121 and 122 and the second wiring part 130 are embedded in the body part 110 to maintain a sealed state from the external environment. . According to the three-dimensional buried electronic circuit component 100 as described above, a structure in which the electronic elements 10a and 10b, the first wiring parts 121 and 122, and the second wiring part 130 are completely embedded on the body part 110 is formed. The electronic devices 10a and 10b, the first wiring parts 121 and 122, and the second wiring part 130 provided for the operation of the three-dimensional buried electronic circuit component 100 are completely blocked from the harmful external environment. Since the state can be maintained, the durability of the three-dimensional buried electronic circuit component 100 can be further improved. In addition, by using the manufacturing apparatus 200 of the 3D printing method to be described later, the interior of the 3D embedded electronic circuit component 100, that is, an unnecessary empty area in the interior space of the body part 110 can be minimized or completely excluded. Therefore, highly integrated arrangement of the components of the three-dimensional buried electronic circuit component 100 is possible. As a result, the space utilization inside the 3D embedded electronic circuit component 100 can be greatly improved, and the miniaturization of the 3D embedded electronic circuit component 100 and the degree of freedom in design can be further improved.

In addition, the conventional PCB substrate sensor module has an almost standardized rectangular parallelepiped shape regardless of the installation target and conditions, so it was difficult to mount on the complex and irregularly shaped equipment surface. Since electronic circuit components such as sensor modules could not be installed at the location, and were installed in the closest possible location, the reliability of the acquired data was relatively low. In the case of the three-dimensional buried electronic circuit component 100 of the present invention, since it can be freely installed even on a complex and irregularly shaped facility surface by taking advantage of the high degree of freedom in design, the three-dimensional buried electronic circuit component 100 It is possible to further improve the sensing performance and the like.

Hereinafter, a three-dimensional embedded electronic circuit component manufacturing apparatus 200 of the present invention will be described with reference to FIGS. 4 to 6 .

4 is a conceptual diagram illustrating the configuration of a three-dimensional embedded electronic circuit component manufacturing apparatus 200 according to an embodiment of the present invention, and FIG. 5 is an example in which the displacement sensing unit 240 shown in FIG. 4 is a body unit 110 For example, it is a conceptual diagram showing an example of obtaining shape information of the first body 111, and FIG. 6 is a first wiring part 111b1 and a second wiring part ( 111b2) is a conceptual diagram showing a cured state.

4 to 6 , the 3D embedded electronic circuit component manufacturing apparatus 200 for manufacturing the 3D embedded electronic circuit component 100 includes a first output unit 210 and a second output unit 220 . , and a third output unit 230 .

The first output unit 210 is configured to form the first wiring units 121 and 122 in a horizontal direction of the body unit by printing low melting metals in a stacked manner. The first output unit 210 may be configured to print the low-melting-point metal using an induction heating method. The induction heating method is a kind of electric heating, and means that energy is transferred from an electrode to a material to be heated by electromagnetic induction, and the material itself converts electric energy into thermal energy.

The second output unit 220 is configured to form the second wiring unit 130 in a vertical direction of the body unit by printing paste containing metal powder in a stacked manner. The second output unit 220 may be configured to print the paste in a pneumatic dispenser method. As such, the configuration of the second output unit 220 makes it easy to control the amount of discharge and adhesion to the polymer material, so that the second wiring unit 130 or the body unit 110 in a vertical or other angular direction instead of in a horizontal direction. It is advantageous for fixing the electronic devices 10a and 10b on the top.

The third output unit 230 is configured to form the body portion by printing an insulating material in a stacked manner. The third output unit 230 may include a first material output unit 231 and a second material output unit 232 for outputting different types (different types) of insulating materials. For example, the first material output unit 231 may be configured to output a polymer material, and the second material output unit 232 may be configured to output a polymer composite material.

A fused deposition modeling (FDM) method may be applied to the third output unit 230 . The FDM method refers to a method in which a wire-type engineering plastic material is semi-liquefied by passing it through a heater in a printer head, and then ejected through a nozzle to laminate each layer while repeating manufacturing the shape of one layer.

Meanwhile, the 3D embedded electronic circuit component manufacturing apparatus 200 may further include a displacement sensing unit 240 .

As shown in FIG. 5 , the displacement sensing unit 240 has a shape in the vertical direction (the Z-axis height direction) of the first body 111 using light such as the body 110, for example, a laser. made to obtain information. The shape information may include location information of the body 110 in the Z-axis height direction.

Here, the first output unit 210 and the second output unit 220 use the shape information of the first body 111 obtained by the displacement sensing unit 240 to provide first and second wirings. It is made to adjust the height of the parts (121, 122, 130). Accordingly, the first and second wiring units 121 , 122 , and 130 may be uniformly formed irrespective of the roughness, the step, and the curvature of the body unit 110 .

Meanwhile, the 3D embedded electronic circuit component manufacturing apparatus 200 may further include a heating unit 250 .

As shown in FIG. 6 , the heat generating unit 250 is configured to apply heat toward the second wiring unit 130 in the paste state to harden the second wiring unit 130 . The heat generating unit 250 may cure not only the second wiring unit 130 but also the first wiring units 121 and 122 together. At this time, the curing conditions are preferably carried out at a temperature of 60 ° C. to 200 ° C. for 10 to 30 minutes, and can be adjusted as necessary.

Hereinafter, a 3D buried electronic circuit component manufacturing method using the 3D embedded electronic circuit component manufacturing apparatus 200 will be described with reference to FIG. 7 .

7 is a flowchart illustrating an embodiment of a method for manufacturing a 3D embedded electronic circuit component using the 3D embedded electronic circuit component manufacturing apparatus 200 illustrated in FIG. 4 .

Referring to FIG. 7 , the 3D embedded electronic circuit component manufacturing method using the 3D embedded electronic circuit component manufacturing apparatus 200 uses the third output unit 230 for outputting an insulating material to the body unit 110 . In the first step ( S100 ) of manufacturing , shape information in the vertical direction of the body part 110 is obtained using the displacement sensing unit 240 , and the obtained shape information is output to the first and second The second step (S200) of reflecting the movement path of the parts 210 and 220, and the first output part 210 in the horizontal direction of the body part 110 on the first wiring receiving parts 111b1 and 112b1. A third step (S300) of forming the first wiring parts (121, 122) to be formed, and a fourth step (S400) of inserting and fixing the electronic devices (10a, 10b) into the device accommodating parts (111a, 112a), and , a fifth step (S500) of forming the second wiring unit 130 on the second wiring receiving unit 111b2 using the second output unit 220, and finally the third output unit 230 ) to embed the electronic devices 10a and 10b, the first wiring parts 121 and 122 and the second wiring part 130 on the body part 110 using S600). In the fourth step (S400), the mounting of the electronic devices 10a and 10b may be manually performed by a person or may be automatically performed using a Pick-and-Place (P&P) facility.

The foregoing is merely exemplary, and various modifications may be made by those of ordinary skill in the art to which the present invention pertains without departing from the scope and spirit of the described embodiments. The above-described embodiments may be implemented individually or in any combination.

100: three-dimensional embedded electronic circuit component 110: body part
111: first body 111a, 112a: element receiving part
111b1, 112b1: first wiring accommodating part 111b2: second wiring accommodating part
112: second body 121, 122: first wiring part
130: second wiring unit
200: 3D buried electronic circuit component manufacturing device
210: first output unit 220: second output unit
230: third output unit 231: first material output unit
232: second material output unit 240: displacement sensing unit
250: heating part

Claims (11)

a body part made of an insulating material and having a device accommodating part which is formed concavely to accommodate an electronic device;
a first wiring part formed in a horizontal direction of the body part and electrically connecting the electronic device; and
and a second wiring part formed in a vertical direction of the body part and electrically connecting the electronic device;
The electronic device, the first wiring part and the second wiring part are embedded in the body part to maintain a sealed state from the external environment,
The first wiring portion formed in the horizontal direction of the body portion is made of low melting metals,
The second wiring part formed in the vertical direction of the body part is made of a cured paste containing metal powder,
The insulating material constituting the body portion is made to include a polymer material,
The first wiring part is formed by printing the low melting metals in a stacked manner using an induction heating method,
The second wiring part is a three-dimensional embedded electronic circuit component, characterized in that it is formed by printing the paste in a stacked type using a pneumatic dispenser method. delete According to claim 1,
The low-melting-point metal is a three-dimensional buried electronic circuit component comprising at least one of In, Sn, Ag, and Cu. According to claim 1,
The metal powder, Ag, Cu, Al, Au, Pt, Ni, Zn, Pd three-dimensional buried electronic circuit component comprising at least one of. According to claim 1,
The body portion includes a first body and a second body that are stacked to form a single exterior,
The element accommodating part includes a first element accommodating groove and a second element accommodating groove respectively formed in the first and second bodies to accommodate the electronic element,
The electronic device accommodated in the first and second device accommodating grooves are electrically connected to each other by the first and second wiring units. According to claim 1,
The body part,
a first wiring accommodating part concavely formed from one surface of the body part to accommodate the first wiring part; and
and a second wiring accommodating part formed through the body in a vertical direction to accommodate the second wiring part. A three-dimensional embedded electronic circuit component manufacturing apparatus for manufacturing the three-dimensional embedded electronic circuit component according to claim 1, wherein the three-dimensional electronic circuit component manufacturing apparatus comprises:
a first output unit for printing the low melting metals in a stacked manner using the induction heating method to form the first wiring unit in a horizontal direction of the body unit;
a second output unit for forming the second wiring unit in a vertical direction of the body unit by printing the paste containing the metal powder in a stacked manner using the pneumatic dispenser method; and
and a third output part for forming the body part by printing the insulating material including the polymer material in a laminated type. delete 8. The method of claim 7,
Further comprising a displacement sensing unit configured to obtain shape information in the vertical direction of the body portion,
3D embedded electronic circuit component manufacturing, characterized in that the first output unit and the second output unit are configured to adjust the height of the first and second wiring units by using the shape information obtained from the displacement sensing unit Device. 8. The method of claim 7,
and a heating part configured to apply heat toward the second wiring part in the paste state and curing the second wiring part. 11. A method for manufacturing a three-dimensional embedded electronic circuit component using the apparatus for manufacturing a three-dimensional embedded electronic circuit component according to any one of claims 7 and 9 to 10, the method comprising:
The three-dimensional buried electronic circuit component manufacturing method,
a first step of manufacturing the body part using the third output part;
a second step of obtaining shape information in a vertical direction of the body part by using the displacement sensing unit and reflecting the obtained shape information on a movement path of the first and second output units;
a third step of forming the first wiring unit on the first wiring receiving unit using the first output unit;
a fourth step of inserting and fixing the electronic device into the device accommodating part;
a fifth step of forming the second wiring unit on the second wiring receiving unit using the second output unit; and
and a sixth step of embedding the electronic device, the first wiring part, and the second wiring part on the body part using the third output part and sealing it from an external environment. method.

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