KR102280626B1 - Multi layer busduct - Google Patents

Abstract

The present invention relates to a multi-stage bus duct capable of securing stability and reliability by adding a heat dissipation structure to an enclosure so that heat generated from a bus bar during a power supply process is efficiently dissipated to the outside.

Description

Multi-level bus duct {MULTI LAYER BUSDUCT}

The present invention relates to a multi-stage bus duct. More particularly, the present invention relates to a multi-stage bus duct capable of securing stability and reliability by adding a heat dissipation structure to an enclosure so that heat generated from a bus bar during the power supply process is efficiently dissipated to the outside.

In general, a cable (cable) has been widely used as a medium for transmitting electrical energy, but recently, a busduct is widely used as an alternative to the cable. The bus duct is equipped with a bus bar that performs the same role as the conductor core included in the cable, and it is possible to conduct a large current.

For internal wiring in large buildings or large factories, the wiring method using the bus duct is better than wiring using the power cable in terms of space utilization or ease of installation. In the event of an abnormality or accident, the use of bus ducts is expanding because the maintenance or repair is simple and can be quickly restored.

In addition, the bus duct system that replaces these power cables is becoming more competitive between products, and competition is being formed with lightweight and compact products due to the diversity of customers and markets.

A method of reducing the cross-sectional area of a bus bar can be considered as a method for compacting the bus duct, and when the cross-sectional area of a bus bar is reduced, a method of efficiently resolving the heat generation of the bus bar that is increased according to the reduced ratio of the cross-sectional area of the bus bar this is required

In a sandwich-type bus duct, since the bus bars are stacked and accommodated inside the enclosure, the heat generated from the bus bars is difficult to dissipate, making it difficult to reduce the size of the bus bars.

If the heat generated from the busbar is not properly dissipated to the outside, the electrical resistance of the busbar may increase and power loss may occur, and the aluminum or copper constituting the busbar may be excessively elongated, causing the busbar to deform. Deformation phenomena such as buckling (座屈, buckling) may occur.

Therefore, there is a need for a bus duct that can efficiently dissipate heat generated from the bus bar to the outside to improve heat dissipation performance, prevent excessive temperature rise, and secure stability and reliability.

An object of the present invention is to provide a multi-stage bus duct capable of securing stability and reliability by adding a heat dissipation structure to the enclosure so that heat generated from the bus bar during the power supply process is efficiently dissipated to the outside.

In order to solve the above problems, the present invention provides a plurality of busbars made of a conductor and an insulating material surrounding the outside of the conductor, an enclosure that is located outside the busbar and made of a metal material, and is added to the enclosure to increase the heat dissipation area It is possible to provide a multi-stage bus duct comprising a; heat dissipation structure for

In addition, a plurality of bus bars are stacked and accommodated in the enclosure, the enclosure is configured to include an upper surface unit, a lower surface unit and a pair of side units, and a plurality of the bus bars are accommodated between parallel side units, , the heat dissipation structure may be added to the surface of the side unit.

In addition, the stacked busbars disposed between the pair of side units include a first stacking end accommodated so that one end is in contact with the inner surface of the upper surface unit, and an inner surface and one end of the lower unit in a state spaced apart from the first stacking end. A second stacking end accommodated so as to be in contact with each other may be provided.

In this case, a spacer may be provided to space the other end of the first stacking end and the other end of the second stacking end in a state accommodated in the pair of side units.

And, the heat dissipation structure may be mounted at a position corresponding to the spacer among the outer surface of the side unit.

Here, the heat dissipation structure may be mounted on the outer surface of the pair of side units so as to be in surface contact with each other in the longitudinal direction thereof.

In addition, the heat dissipation structure may be mounted in the longitudinal direction at the center of the outer surface of the pair of side units.

In addition, the heat dissipation structure may include a contact portion in surface contact with the side unit, an extension portion bent and extended from an end of the contact portion, and an extension portion bent and extended from an end of the extension portion.

Here, the extension part and the extension part may be bent by 90 degrees, respectively.

In this case, a plurality of protruding convex portions and a plurality of recessed recessed portions may be provided in the extension portion and the extension portion.

In addition, a plurality of heat dissipation fins may be provided on the surface of the contact part.

Here, the convex part, the recessed part, and the heat dissipation fin may be formed along the longitudinal direction of the side unit.

In addition, the stacked busbars disposed between the pair of side units include a first stacking end accommodated with one end in contact with the inner surface of the upper surface unit, and an inner surface and one end of the lower surface unit in a state spaced apart from the first stacking end. A second stacking end accommodated so as to be in contact with this is provided, and a spacer for separating the other end of the first stacking end and the other end of the second stacking end in a state accommodated in the pair of side units is provided,

A width of the contact portion of the heat dissipation structure may be greater than a width of the spacer.

In addition, a distance between the ends of the extension part of the pair of heat dissipation structures may correspond to the width of the upper surface unit or the lower surface unit.

In addition, in order to solve the above problems, the present invention provides an enclosure accommodating a plurality of stacked busbars made of a conductor and an insulating material surrounding the outside of the conductor, wherein the enclosure is made of a metal material, and is formed on the outer surface of the enclosure. It is possible to provide an enclosure of the bus duct comprising a; a heat dissipation structure for increasing the heat dissipation area of the enclosure by being mounted to surface contact.

According to the multi-stage bus duct according to the present invention, the enclosure structure can efficiently dissipate heat generated in the bus bar during the power supply process to the outside.

In addition, according to the multi-stage bus duct according to the present invention, since the enclosure structure can efficiently dissipate heat generated from the bus bar during the power supply process to the outside, the bus bar constituting the bus duct can be further miniaturized or compacted to produce a product. competitiveness can be provided.

In addition, the multi-stage bus duct according to the present invention consists of multi-stage stacked bus bars to increase capacity, and effectively reduces heat generation in the boundary region of the stacked bus ducts constituting each stage in consideration of the heat generation characteristics of the multi-stage bus ducts. can heat up.

In addition, according to the multi-stage bus duct according to the present invention, it is possible to minimize the increase in cost by configuring a separate heat dissipation structure to have a structure similar to that of the enclosure.

In addition, since the heat dissipation structure of the multi-stage bus duct according to the present invention is mounted so as to be in surface contact with the side unit to improve the heat dissipation performance of the bus duct, if necessary, it can be applied to the heat dissipation structure of the existing bus duct.

1 shows a perspective view of a multi-stage bus duct according to the present invention.
2 shows a cross-sectional view of a multi-stage bus duct according to the present invention.
3 shows a temperature distribution diagram of a cross-section of a multi-stage bus duct according to the present invention.
4 shows a cross-sectional view and a temperature distribution diagram of a multi-stage bus duct of a conventional sandwich type.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and the spirit of the invention may be sufficiently conveyed to those skilled in the art. Like reference numbers refer to like elements throughout.

Figure 1 shows a perspective view of a multi-stage bus duct 100 according to the present invention, Figure 2 shows a cross-sectional view of the multi-stage bus duct 100 according to the present invention.

1 and 2, the bus duct 100 according to an embodiment of the present invention includes a plurality of bus bars 20 made of a conductor 21 and an insulating material 23 surrounding the outside of the conductor 21. , accommodating the plurality of busbars 20 therein, and may include an enclosure 30 made of a metal material, and a heat dissipation structure 40 added to the enclosure 30 to increase the heat dissipation area. there is.

First, looking at the basic structure of the bus duct 100 according to an embodiment of the present invention, the enclosure 30 having a predetermined space therein is provided. A bus bar 20 serving as a conductor or wire included in the cable is provided inside the enclosure 30 to conduct a large amount of current.

The conductor 21 of the bus bar 20 may be made of copper, aluminum, or the like. When the conductor 21 of the bus bar 20 is copper, a material having a conductivity of 99% or more is used, and in the case of aluminum, a conductivity of 61% or more is used.

The surfaces of the conductors 21 are each covered with an insulating material 23 such as an epoxy coating to be electrically insulated from each other.

The configuration of the bus bar 20 may be variously configured according to the installation target of the bus duct 100 , the installation environment, the power capacity to be supplied, and the like. For example, as shown in FIGS. 1 and 2 , the bus bar 20 may be formed of three phases: R, S, and T. However, the present invention is not limited thereto, and it is also possible to provide four of R, S, T, and N, or five busbars by combining R, S, T and two Ns.

Meanwhile, the bus bars 20 of the bus duct 100 according to an embodiment of the present invention may be arranged to be stacked in contact with each other. That is, as shown in FIGS. 1 and 2 , the plurality of bus bars 20 may be accommodated in the enclosure 30 in a state in which a plurality of bus bars 20 are stacked adjacently.

The direction in which the bus bars 20 are stacked is the left-right direction in FIG. 1 , but is not limited thereto, and both the up-down and left-right directions are possible. As described above, in this embodiment, the bus bars 20 are arranged in a sandwich type so as to contact each other, and accordingly, the size of the entire bus duct 100 can be made relatively small and compact. In recent years, if the bus duct 100 for supplying power of the same capacity is compactly configured, price competitiveness can be secured by the cost of raw materials, etc., and the occupied space can be reduced, so that compactness is the standard of competitiveness of the bus duct 100 . is becoming In order to make the bus duct 100 more compact, the bus bar 20 must be miniaturized. However, when the bus bar 20 is miniaturized, heat is increased, so that the bus bar 20 is not sufficiently heat-dissipating. 20) Or, since the miniaturization of the enclosure may cause an accident, it is necessary to improve the heat dissipation performance as will be described later.

In this embodiment, instead of disposing the busbars 20 in a sandwich type, as described above for phase-to-phase insulation, the plurality of busbars 20 have an insulating material 23 surrounding the outer surface of each conductor 21 . ) may be provided. The insulating material 23 may be formed of, for example, an epoxy coating, through which insulation performance can be strengthened and heat resistance performance of about 130° C. can be secured. As the insulating material 23 , in addition to epoxy, for example, polyethylene terephthalate (PET), Mica, or the like may be applied.

After the enclosure 30 accommodating the plurality of stacked bus bars 20 is manufactured as a unit having a predetermined length, a connection part (not shown) or a connection kit (not shown) for connecting the bus duct 100 (not shown) may be connected and installed. At this time, the end of the bus bar 20 inserted into the bus duct 100 connection part 100 is connected after the insulating material 23 is removed to expose the conductor 21 to the outside.

And, as shown in FIGS. 1 and 2 , on the other hand, the enclosure provided on the outside of the plurality of busbars 20 includes four units (panels) 32 , 34 , 36 to form a predetermined space therein. Can be combined to form.

The four units (panels) 32 , 34 , 36 may be divided into an upper surface unit 32 , a lower surface unit 34 , and a pair of side units 36 , respectively, and as in this embodiment, each separate unit can be made with

Here, the upper surface, the lower surface, and the side are defined based on the direction shown in FIG. 2 for convenience of explanation, and when the bus duct 100 is installed, the actual direction may vary depending on the installation method, installation space, power distribution design, etc. .

In the present embodiment, the coupling of the enclosure may be performed by applying a bolt (not shown), a nut (not shown), and a washer (not shown) to configure a fastening part through bolt fastening, but is not limited thereto, and may include various types such as rivets or welding. A fastening part may be formed through a fastening method.

In the multi-stage bus duct 100 according to the present invention, as shown in FIGS. 1 and 2 , the stacked bus bar 20 disposed between the pair of side units 36 is the upper surface of the unit 32 . A first stacking end 20A accommodated so that one end is in contact with the inner surface and a second stacking end 20B accommodated so that the inner surface and one end of the lower surface unit 34 are in contact with each other while being spaced apart from the first stacking end 20A ) may be provided.

When the magnitude of the power supplied to the bus duct 100 is large, a method of installing a plurality of bus ducts 100 or increasing the size of the conductors 21 constituting each bus bar 20 can also be used. However, in consideration of cost reduction and the skin effect of current, as shown in FIGS. 1 and 2 , a busbar duct is a method of accommodating a plurality of stacked busbar ends 20A and 20B in one duct, that is, an enclosure. can be used to configure

Although the bus duct 100 shown in FIGS. 1 and 2 shows an example in which the first stacking end 20A and the second stacking end 20B are provided inside the enclosure, the number of the stacking ends may be increased or decreased.

The two busbar stacking stages 20A and 20B may be accommodated together inside the enclosure. A plurality of bus bars 20 are stacked and accommodated in the enclosure 30 , and the enclosure 30 includes an upper surface unit 32 , a lower surface unit 34 and a pair of side units 36 . and the first stacking end 20A and the second stacking end 20B may be accommodated in the side unit 36 so that one end thereof is in contact with the upper surface unit 32 and the lower surface unit 34, respectively.

In addition, each of the stacked stages 20A and 20B is configured to be spaced apart as shown in FIGS. 1 and 2 , which is provided that each of the stacked stages 20A and 20B has a phase difference for each phase of three-phase AC power. Therefore, although the busbars 20 constituting the respective stacking stages 20A and 20B can be stacked, the busbar stacked ends 20A and 20B are preferably spaced apart from each other in order to minimize the generation of electromagnetic waves due to interference. do.

The conductor 21 constituting the bus bar 20 is made of copper or aluminum-based metal, and when power of the same size is supplied, heat is inversely proportional to the cross-sectional area of the conductor 21, so the bus duct 100 or bus bar ( In order to configure 20) compactly, it is premised that the heat of the bus bar 20 should be effectively dissipated.

In addition, in the case of the multi-stage bus duct 100 as shown in FIGS. 1 and 2 , since the width of the side unit 36 is increased, the heat dissipation structure is different from that of the bus duct having one stacked end and one end. It must also be differentiated.

Accordingly, in the bus bar 20 constituting the multi-stage bus duct 100 according to the present invention, at least one stacked bus bar stacking ends 20A and 20B are accommodated in an enclosure spaced apart from each other, and the enclosure is an upper surface unit. (32), is configured to include a lower surface unit 34 and a pair of side units 36, and a pair of busbar stacking ends 20A and 20B are accommodated between the parallel side units 36, and the The heat dissipation structure 40 may have a structure separately mounted on the surface of the side unit 36 .

The heat dissipation structure 40 is not integrally formed with the upper surface unit 32, the lower surface unit 34, or the side unit 36 constituting the enclosure, and as shown in FIGS. 1 and 2, manufactured separately The reason for using the method of attaching or installing each side unit 36 is that the side unit 36 has the largest heat dissipation area among the upper surface unit 32, the lower surface unit 34 and the side unit 36, Improving the heat dissipation performance of the side unit 36 is the most effective for heat dissipation of the entire bus duct 100, and since the side unit 36 is configured in the form of a large-area plate material, the side unit 36 is made of extrusion or sheet metal ( 36) because it is difficult to form a heat dissipation structure integrally.

Therefore, the multi-stage bus duct 100 according to the present invention accommodates a plurality of bus bar stacked ends 20A and 20B inside the enclosure, and has the largest area in a state where each bus bar stacked end 20A, 20B is spaced apart from each other. The heat dissipation performance of the bus duct 100 is improved by adding a heat dissipation structure 40 to the side unit 36 constituting the enclosure having a high heat generation.

Here, the stacked bus bars 20 disposed between the pair of side units 36 include a first stacking end 20A and the first stacking end 20A accommodated with one end in contact with the inner surface of the upper surface unit 32 . A second stacked end 20B accommodated so that the inner surface and one end of the lower surface unit 34 are in contact with the lower surface unit 34 in a state spaced apart from the stage 20A may be provided, and as shown in FIG. 1 , the bus bar 20 The bus duct 100 may be installed so as to be horizontally disposed, or as shown in FIG. 2 , the bus duct 100 may be installed so that the bus bar 20 is vertically disposed. Accordingly, the spacer 25 may be provided therebetween to prevent the bus bar stacking ends 20A and 20B accommodated in the pair of side units 36 from moving between the side units or from approaching each other.

As shown in FIGS. 1 and 2 , the spacer 25 may have a 'C' shape in cross section, but is not limited thereto.

Even when the bus duct 100 is installed in a vertical state with the bus bar 20 by the spacer 25, it is different from each other by the weight of the bus bar 20 constituting the stacked bus bar ends 20A and 20B. It is possible to prevent the busbars 20 constituting the stacked busbar stages 20A and 20B from approaching, and an air insulation space is formed between the respective stacked ends 20A and 20B to prevent mutual electromagnetic interference between the stacked ends. It is possible to minimize the generation of an induced current in the enclosure or the like.

As shown in Fig. 1, the heat dissipation structure 40 may be added to the outer surface of the pair of side units 36 along the longitudinal direction thereof, and more specifically, as shown in Fig. 2, Each heat dissipation structure 40 is mounted so as to be in surface contact with the side unit 36 of the enclosure to maximize the heat absorbing performance of the heat dissipation structure 40 .

In addition, the heat dissipation structure 40 is mounted in the longitudinal direction of the bus duct 100 , that is, in the center of the outer surface of the pair of side units 36 in the longitudinal direction, so that the entire area in the longitudinal direction of the bus duct 100 . It is possible to improve the heat dissipation performance in

And, as a result of comparing the case where the heat dissipation structure 40 is provided at the center of the outer surfaces of the pair of side units 36 and the case where the heat dissipation structure 40 is formed on the entire side unit 36 experimentally, the heat dissipation performance is large It was confirmed that there was no difference.

This means that when the heat dissipation structure 40 is installed near the upper surface unit 32 or the lower surface unit 34, the heat dissipation space due to conduction increases, but the effect of convection is less in the center of the side unit 36 is assumed to be the largest.

Therefore, the multi-stage bus duct according to the present invention adopts a structure in which a heat dissipation structure is added to the central portion of the outer surface of the side unit 36 along its longitudinal direction.

The heat dissipation structure 40 includes the contact portion 46 that is in surface contact with the side unit 36 as described above, and further extends portions 42a and 44a bent and extended from the end of the contact portion 46 . ), and may include extension portions 42b and 44b that are bent and expanded at the ends of the extension portions 42a and 44a.

The reason for forming the extension portions 42a and 44a in the contact portion 46 is that the contact portion 46 absorbs heat from the side unit 36 of the enclosure, and the absorbed heat is transferred to the extension portions 42a and 44a. This is to maximize the heat dissipation performance by convection in the open space after conduction.

The extension portions 42a and 44a may be bent at both ends of the contact portion 46 mounted to face the side unit 36, for example, bent vertically to extend. Accordingly, as shown in FIG. 2 , each of the extension portions 42a and 44a may extend in parallel with the side unit 36 of the enclosure, respectively. However, the bending angle of the extension parts 42a and 44a may be variously changed according to the characteristics of the product or the installation environment.

In addition, the extension portions 42b and 44b bent again may be formed at the ends of the extension portions 42a and 44a, respectively.

The reason for bending and expanding the extension portions 42b and 44b again in the extension portions 42a and 44a is that the extension portions 42a and 44a are expanded rather than forming the ends of the extension portions 42a and 44a as corners. When the heat dissipation area is expanded with the parts 42b and 44b and the extension parts 42b and 44b are configured to have the same area as that without the extension parts 42b and 44b, the overall width or height of the product can be reduced. am.

In general, as shown in FIG. 2 , the upper surface unit 32 and the lower surface unit 34 constituting the sandwich type enclosure have horizontal portions 32a and 34a and horizontal portions 32a and 34a in order to increase the heat dissipation area. ), the multi-stage bus duct 100 according to the present invention shown in FIG. 2 is provided with vertical portions 32b and 34b that are bent and extended in the upper surface unit 32 that is fastened to the upper end and lower end of the side unit 36. ) and the lower surface unit 34 may be fastened to the side unit 36 so that one end of the first stacking end 20A and one end of the second stacking end 20B of the bus bar 20 are in contact with each other on the inner surface thereof. there is.

Accordingly, the extended portions 42a and 44a of the heat dissipation structure are the upper surface unit 32 or the distance between the ends of the extended portions 42a and 44a of the pair of heat dissipation structures 40 for ease of storage, transport and installation. It may be configured to have a size corresponding to the width of the lower surface unit 34 or smaller.

In addition, the width of the contact portion 46 may be greater than the width of the spacer 25 provided between the first stacking end 20A and the second stacking end 20B. This is because both ends of each of the stacked ends 20A and 20B are places where heat is concentrated due to conduction, etc., and the heat is large, so that the contact portion 46 of the heat dissipation structure 40 covers the inner ends of both stacked ends. am.

And, the extension portions 42a, 44a and the extension portions 42b, 44b constituting the heat dissipation structure 40 have the same as the horizontal or vertical portion of the upper surface unit 32 or the lower surface unit 34 . A plurality of convex portions 142 and a plurality of recessed portions 144 may be provided to increase the heat dissipation area. When the plurality of convex portions 142 and the plurality of recesses 144 are provided in the extension portions 42a and 44a or the extension portions 42b and 44b of the heat dissipation structure 40, the heat exchange area is increased and the convex portions 142 and The heat exchange performance may be maximized by inducing the formation of local turbulence in the recess 144 .

In addition, a plurality of heat dissipation fins 46p for further increasing the heat dissipation area may be provided on the outer surface of the contact portion 46 of the pair of heat dissipation structures 40 .

A plurality of the heat dissipation fins 46p may be provided side by side in the longitudinal direction of the side unit 36 or the bus duct 100 .

The heat dissipation fin 46p means that the height is higher than the extension portions 42a and 44a of the heat dissipation structure 40 and the convex portions formed in the extension portions 42b and 44b, and the central region of the contact portion 46 is It may be formed concentrated in the excluded area.

Since the area in which the heat dissipation fins 46p are formed other than the central area of the contact portion 46 is the area in which heat conduction is most actively performed from the ends of each busbar stacking end 20A, 20B, a plurality of heat dissipation performance is further expanded. A heat dissipation fin 46p may be provided.

3 shows a temperature distribution diagram of a cross-section of a multi-stage bus duct 100 according to the present invention, and FIG. 4 shows a cross-sectional view and a temperature distribution diagram of a multi-stage bus duct 100 of a conventional sandwich type.

First, reviewing the structure of the conventional multi-stage bus duct 100, as shown in Fig. 4 (a), the conventional multi-stage bus duct 100 also has two booths like the multi-stage bus duct 100 according to the present invention. The bar stacking ends 20A and 20B are accommodated in a spaced state by the spacer 25 inside the enclosure.

Recently, the IEC 61439 standard requested by the consumer of the bus duct 100 requires that the limit temperature increase for the bus duct be 55K or less, which is verified through the test report proving the IEC 61439 standard satisfaction.

In the conventional bus duct 100 shown in FIG. 4(b), which is not provided with a heat dissipation structure for such a standard, the maximum temperature increase of the side unit 36 is about It was measured at 52K, and it was confirmed that the margin was not large at the limit temperature of 55K.

In particular, even when the temperature of the bus bar 20 accommodated in the side unit 36 approaches the limit temperature increase (higher temperature toward blue, green, yellow, and red), the temperature difference is sharp with the side unit as a boundary. Thus, it can be confirmed that heat dissipation through the side unit 36 is not smoothly achieved.

On the other hand, the upper surface unit 32 or the lower surface unit 34 is a region in which a heat dissipation area for dissipating heat conducted from each busbar stacking end 20A, 20B is expanded, and a plurality of convex portions and recesses are formed on the surface. It can be confirmed that the heat dissipation performance is good, and the temperature gradient with the surrounding atmosphere is gentle, so it can be confirmed that there is no significant problem in the heat dissipation performance.

Therefore, in order to improve the heat dissipation performance of the conventional multi-stage bus duct 100, the multi-stage bus duct 100 according to the present invention has a heat dissipation structure 40 that is in surface contact with the side unit 36 of the enclosure.

As a result, as shown in FIG. 3, compared to the conventional bus duct 100 shown in FIG. 4 (b), the overall temperature of the bus bar 20 accommodated in the side unit 36 constituting the enclosure was lowered. can be confirmed through the color change of area A.

It is assumed that the temperature change in area A is due to active heat dissipation by conduction of heat from the bus bar 20 to the heat dissipation structure 40 added to area B, that is, the central area of the side unit 36 .

That is, the heat generated from the stacked busbars 20 is not transmitted or radiated smoothly in the direction perpendicular to the stacked busbars 20, and will be conducted in the plane direction of the busbars 20. , the heat generated at the pair of busbar stacking ends 20A and 20B spaced apart by the spacer 25 is eventually a heat dissipation structure added to the upper surface unit 32 or the lower surface unit 34 and the side unit 36 ( 40) through heat exchange with the surrounding air and active heat dissipation can be performed.

That is, the heat generated from the stacked busbars 20, which is the area A, passes through the area C formed by the heat dissipation structure 40 of the area B and the horizontal or vertical portion of the upper surface unit 32 and the lower unit 34 of the lower surface unit 34. It can be actively dissipated.

Specifically, as a result of temperature analysis through the temperature distribution diagram, the maximum temperature increase of the upper unit 32 is 45.7K, and the maximum temperature increase of the lower unit 34 is 45.5K. Although there was no significant difference from the case of adding or not, it can be confirmed that the maximum temperature increase of the side unit 36 after adding the heat dissipation structure 40 is 49.3K, and the maximum temperature of about 3K in the side unit 36 It was confirmed that the reduction effect was obtained.

Therefore, according to the multi-stage bus duct 100 according to the present invention, the enclosure structure can efficiently dissipate the heat generated from the bus bar 20 during the power supply process to the outside, and the enclosure structure has the bus bar structure during the power supply process. Since the heat generated in 20 can be efficiently dissipated to the outside, it can be confirmed that the bus bar 20 constituting the bus duct 100 can be further miniaturized or compacted to provide competitiveness of the product.

In addition, in the multi-stage bus duct 100 according to the present invention, since the heat dissipation structure 40 is not integrally configured with the enclosure, it can be added as needed to the bus duct 100 that generates severe heat, and has a wide and thin structure. It has the advantage of being easily applied to the enclosure of the bus duct 100 .

Although the present specification has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims described below. will be able to carry out Therefore, if the modified implementation basically includes the elements of the claims of the present invention, all of them should be considered to be included in the technical scope of the present invention.

10: bus duct
20: bus bar
30: enclosure
32: top unit
34: lower unit
36: side unit
40: heat dissipation structure

Claims (15)

a plurality of stacked busbars made of a conductor and an insulating material surrounding the outside of the conductor;
an enclosure accommodating the plurality of busbars therein and made of a metal material; and;
It is added to the enclosure and a heat dissipation structure for increasing the heat dissipation area;
A plurality of bus bars are stacked and accommodated in the enclosure, and the enclosure includes an upper surface unit, a lower surface unit and a pair of side units, and the plurality of bus bars are accommodated between parallel side units, the A heat dissipation structure is added to the surface of the side unit,
The stacked busbars disposed between the pair of side units have a first stacked end accommodated so that one end is in contact with the inner surface of the upper surface unit, and an inner surface and one end of the lower surface unit in a state spaced apart from the first stacked end A second stacking stage accommodated to be in contact is provided,
A spacer is provided for separating the other end of the first lamination stage and the other end of the second lamination stage in a state accommodated in the pair of side units,
The heat dissipation structure is a bus duct, characterized in that it is mounted on the outer surface of the side unit at a position corresponding to the spacer. delete delete delete delete According to claim 1,
The heat dissipation structure is a bus duct, characterized in that it is mounted on the outer surface of the pair of side units so as to be in surface contact with each other along the longitudinal direction. 7. The method of claim 6,
The heat dissipation structure comprises a contact portion in surface contact with the side unit, an extension portion bent and extended at an end of the contact portion, and an extension portion bent and expanded at an end of the extension portion. 8. The method of claim 7,
The extension part and the extension part are each bent by 90 degrees. 9. The method of claim 8,
Bus duct, characterized in that a plurality of protruding convex portions and a plurality of recessed recessed portions are provided in the extension portion and the extension portion. 8. The method of claim 7,
A bus duct, characterized in that a plurality of heat dissipation fins are provided on the surface of the contact part. 10. The method of claim 9,
The convex portion or the concave portion is a bus duct, characterized in that formed along the longitudinal direction of the side unit. 11. The method of claim 10,
The heat dissipation fin is a bus duct, characterized in that formed along the longitudinal direction of the side unit. 8. The method of claim 7,
The stacked busbars disposed between the pair of side units include a first stacked end accommodated so that one end is in contact with the inner surface of the upper surface unit, and an inner surface and one end of the lower surface unit in a state spaced apart from the first stacked end together. A second stacking end accommodated in contact is provided, and a spacer is provided to space the other end of the first stacking end and the other end of the second stacking end in a state accommodated in the pair of side units,
The bus duct, characterized in that the width of the contact portion of the heat dissipation structure is greater than the width of the spacer. 8. The method of claim 7,
A distance between the ends of the pair of extension parts of the heat dissipation structure corresponds to the width of the upper surface unit or the lower surface unit. In an enclosure in which a pair of stacked busbar ends composed of a plurality of stacked busbars made of a conductor and an insulating material surrounding the outside of the conductor are accommodated while being spaced apart by a spacer,
The enclosure is made of a metal material, and is mounted so as to be in surface contact with the outer surface of the enclosure, and a heat dissipation structure for increasing the heat dissipation area of the enclosure.
The heat dissipation structure is an enclosure of the bus duct, characterized in that it is provided on the outer peripheral surface of the position corresponding to the spacer.

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