CN217182908U - High-efficient heat dissipation low impedance intensive bus duct - Google Patents

Abstract

The utility model relates to a field of generating line installation especially relates to a low impedance intensive bus duct of high-efficient heat dissipation, include: the device comprises a shell, a first sealing ring, a second sealing ring and a sealing ring, wherein a closed cavity is formed in the shell along the extension direction of the shell; the two conductor groups are positioned in the closed cavity and clamped side by side; wherein the conductor set includes: the cross sections of the two heat conduction plates are L-shaped, and the two heat conduction plates surround to form an accommodating cavity; two conductor plates are arranged in the containing cavity side by side, and the two conductor plates are respectively attached to a heat conducting plate. This application has can high efficiency carry out radiating effect to the bus duct.

Description

High-efficient heat dissipation low impedance intensive bus duct

Technical Field

The application relates to the field of bus installation, in particular to a high-efficiency heat dissipation low-impedance intensive bus duct.

Background

The bus duct is a closed metal device formed from copper and aluminium bus posts, and is used for supporting electric wire. The intensive bus duct is one of bus ducts, and generally comprises a protective shell, a conductive bar and an insulating material, wherein the protective shell is usually made of a metal plate, and a closed cavity in the same extending direction as the protective shell is formed in the protective shell; the bus bars are provided with a plurality of buses, insulating materials are wound on the buses, and the buses are closely arranged in the sequence of L1, L2, L3 and N and assembled in the protective shell. The high-voltage transformer is generally used in power plants, industrial and mining enterprises and other places as an electrical connection between a generator and a main transformer, between a transformer and a high-voltage power distribution cabinet and between a main circuit of high-voltage equipment.

In addition, because the bus bar phase sequence of the traditional bus bar generally adopts L1, L2, L3 and N, the heat generated by the bus bar in the running process is transferred to the shell to be dissipated through convection, heat conduction and other forms. And the L2 and L3 phase buses with the largest heat productivity are arranged in the middle of the bus duct, and heat is gathered and difficult to dissipate, so that the temperature rise of the buses is generally increased, the electric energy loss is increased, the aging of insulating materials is accelerated, the service life of the bus duct is rapidly shortened, and even short-circuit accidents are caused.

SUMMERY OF THE UTILITY MODEL

In order to be able to high efficiency dispel the heat to the bus duct, this application provides a high-efficient heat dissipation low impedance intensive bus duct.

The application provides a high-efficient heat dissipation low impedance intensive bus duct adopts following technical scheme:

an efficient heat dissipating low impedance compact busway, comprising:

the device comprises a shell, a first sealing ring, a second sealing ring and a sealing ring, wherein a closed cavity is formed in the shell along the extension direction of the shell;

the two conductor groups are positioned in the closed cavity and clamped side by side;

wherein the conductor set includes:

the cross sections of the two heat conduction plates are L-shaped, and the two heat conduction plates surround to form an accommodating cavity;

two conductor plates are arranged in the containing cavity side by side, and the two conductor plates are respectively attached to a heat conducting plate.

By adopting the technical scheme, the four-phase conductors are divided into two conductor groups corresponding to each other in pairs, each conductor group comprises two-phase conductors, the arrangement of the four-phase conductors of L1, L2, L3 and N in the bus duct is realized, the heat-conducting plates are L-shaped, the two conductor plates of each conductor group are positioned in the area surrounded by the two L-shaped heat-conducting plates, and each conductor plate is tightly attached to one heat-conducting plate, so that the heat of each conductor plate during working can be quickly transferred to the heat-conducting plates, and the outer sides and the end parts of the heat-conducting plates on the far sides of the two conductor groups can be directly contacted with the two sides and the end parts of the shell in a large area, so that the heat dissipation of L1 and the two phases of N is realized; the heat-conducting plate tip of two conductor sets near side also all can extend to the tip and the casing direct contact of casing, reaches L2 and the double-phase heat dissipation of L3, to sum up, the heat in the conductor can transmit the both sides for the casing promptly, can transmit both ends that can again for whole casing becomes the radiator, has reached high efficiency and has carried out radiating effect to the bus duct.

Optionally, the heat conducting plate is an aluminum conductor;

the conductor plate is a copper conductor;

the corresponding aluminum conductor is electrically connected and compounded with the copper conductor;

and the conductor plate and the heat conducting plate are wrapped with an insulating layer after being compounded.

By adopting the technical scheme, the adopted heat-conducting plate is an aluminum conductor, the conductor plate is a copper conductor and is subjected to copper-aluminum compounding, on one hand, copper and aluminum are good conductors, the heat dissipation performance and the heat conduction performance are better, in addition, the parallel conductor formed by copper-aluminum compounding is greatly reduced in impedance compared with a single copper conductor copper bar, and further heat during bus running is greatly reduced.

Optionally, the two conductor sets are symmetrically arranged in the closed cavity side by side.

Optionally, at least the conductor plate extends out of the end of the housing;

the part of the conductor plate extending out of the housing forms a transition part and a connecting part.

By adopting the technical scheme, the connecting part formed by the conductor plate extending out of the shell part can be used for realizing the connection with the bus duct splicer.

Optionally, at least a transition portion of the conductor plate extending out of the housing portion has a thickness or width greater than a portion of the conductor plate within the housing.

By adopting the technical scheme, the conductor plate in the shell is compounded with the copper and aluminum adopted by the heat conducting plate, and the conductor plate only adopted by the shell part extends out of the shell part, so that compared with the copper and aluminum compounded part in the shell, the conductor plate only extending out of the shell part has higher impedance per unit length, the temperature rise of the part extending out of the shell part is higher when the shell part works, and the adopted part extending out of the shell of the conductor plate is thickened or widened, so that the impedance of the part extending out of the shell part of the conductor plate can be effectively reduced, the conductivity of the conductor plate is ensured, and the temperature rise of the conductor plate when the shell part works is reduced; when the bus duct connector is used for connecting the bus duct, because the inner conductor of the bus duct connector is connected with the conductor plate, the impedance of the connecting part of the conductor part is reduced equivalently through compensation, so that the impedance of the conductor plate is higher only at the transition part, and at the moment, only the transition part of the conductor plate needs to be thickened or widened, the impedance of the transition part of the conductor plate is reduced, the conductivity of the conductor plate can be ensured, and the working temperature rise is reduced.

Optionally, at least a transition portion of the conductor plate extending out of the housing portion is clad or wrapped with a supplemental conductor.

By adopting the technical scheme, the conductor plate in the shell is compounded with the copper and aluminum adopted by the heat conducting plate, and the conductor plate only adopted by the shell part extends out of the shell part, so that compared with the copper and aluminum compounded part in the shell, the conductor plate only extending out of the shell part has higher impedance per unit length, the temperature rise of the part extending out of the shell part is higher when in work, and the adopted supplementary conductor is wrapped or compounded on the part extending out of the shell of the conductor plate, so that the impedance of the part extending out of the shell part of the conductor plate can be effectively reduced, the conductivity of the conductor plate is ensured, and the temperature rise of the conductor plate when in work is reduced; when the bus duct connector is used for connecting the bus duct, the inner conductor of the bus duct connector is connected with the conductor plate, so that the impedance of the connection part of the conductor part is reduced equivalently through compensation, the impedance of the transition part of the conductor plate is higher, and the conductor plate only needs to be compounded or wrapped with a supplementary conductor to reduce the impedance of the transition part of the conductor plate, so that the conductivity of the conductor plate can be ensured, and the working temperature rise can be reduced.

Optionally, the housing includes:

two cover plates which are arranged oppositely in parallel;

the two side plates are arranged between the two cover plates in parallel and opposite, and the surface of any side plate is vertical to the surface of any cover plate;

the closed cavity is formed between the two cover plates and the two side plates.

By adopting the technical scheme, the forming of the closed cavity is finished after the matching form of the two side plates and the two cover plates is finished.

Optionally, two ends of the side plate are respectively fixed to the two cover plates.

By adopting the technical scheme, the two side plates and the two cover plates are connected and fixed in a split structure, the structure is simple, and the processing cost is low.

Optionally, one end of the side plate is integrally formed on the cover plate;

and the other end of the side plate is fixed on the other side plate.

Through adopting above-mentioned technical scheme, reform transform into two independent units with the casing by four independent pieces of both sides board and two apron, every independent unit is the integrated into one piece structure of curb plate and apron promptly, the protection level of improvement bus duct that can step forward, the laminating degree of improvement casing and conductor.

In summary, the present application includes at least one of the following beneficial technical effects:

the four-phase conductors are divided into two conductor groups corresponding to each other in pairs, each conductor group comprises two-phase conductors, the arrangement of the L1, L2, L3 and N four-phase conductors in the bus duct is realized, the heat conducting plates are L-shaped, the two conductor plates of each conductor group are positioned in the area surrounded by the two L-shaped heat conducting plates, and each conductor plate is tightly attached to one heat conducting plate, so that the heat of each conductor plate during working can be quickly transferred to the heat conducting plates, and the outer sides and the end parts of the heat conducting plates on the sides far away from the two conductor groups can be directly contacted with the two sides and the end parts of the shell in a large area, so that the heat dissipation of the L1 and the N two phases is realized; the heat conducting plate ends close to the two conductor sets can also extend to the end of the shell to be in direct contact with the shell, so that heat dissipation of the two phases of L2 and L3 is achieved, in sum, heat in the conductors can be transferred to two sides of the shell and can also be transferred to two ends, the whole shell becomes a radiator, and the effect of quickly and efficiently dissipating heat of the bus duct is achieved;

the heat conducting plate is an aluminum conductor, the conductor plate is a copper conductor and is subjected to copper-aluminum compounding, on one hand, copper and aluminum are good conductors, the heat dissipation performance and the heat conducting performance are both good, in addition, the impedance of a parallel conductor formed by copper-aluminum compounding is greatly reduced compared with that of a single copper conductor copper bar, and further, the heat in the operation of the bus is greatly reduced;

because the conductor plate in the shell is compounded with the copper and aluminum adopted by the heat conducting plate, and the conductor plate only adopted by the extended shell part, compared with the copper and aluminum compounded part in the shell, the impedance of the conductor plate only extended out of the shell part in unit length is higher, so that the temperature rise of the extended shell part is higher when the extended shell part works, and the adopted part of the conductor plate extended out of the shell is thickened or widened, so that the impedance of the conductor plate extended out of the shell part can be effectively reduced, the electric conductivity of the conductor plate is ensured, and the temperature rise of the conductor plate when the extended shell part works is reduced; when the bus duct connector is used for connecting the bus duct, because the inner conductor of the bus duct connector is connected with the conductor plate, the impedance of the connecting part of the conductor part is reduced equivalently through compensation, so that the impedance of the conductor plate is higher only at the transition part, and at the moment, only the transition part of the conductor plate needs to be thickened or widened, the impedance of the transition part of the conductor plate is reduced, the conductivity of the conductor plate can be ensured, and the working temperature rise is reduced.

Drawings

FIG. 1 is a schematic diagram of a high efficiency heat dissipation low impedance compact busway in an embodiment of the present application;

FIG. 2 is a schematic illustration of a first configuration of conductor sets in another embodiment of the present application;

FIG. 3 is a schematic illustration of a second configuration of conductor sets in another embodiment of the present application;

FIG. 4 is a schematic illustration of a third configuration of a conductor set in another embodiment of the present application;

FIG. 5 is a schematic illustration of a fourth form of construction of a conductor set in another embodiment of the present application;

FIG. 6 is a schematic view of another embodiment of the present application with the conductor extending out of the end of the housing;

FIG. 7 is a schematic view of a housing according to another embodiment of the present application;

fig. 8 is a schematic view of a second housing according to another embodiment of the present application.

Description of reference numerals: 1. a housing; 11. a closed cavity; 12. a cover plate; 13. a side plate; 2. a conductor set; 21. a conductor plate; 211. a transition section; 212. a connecting portion; 22. a heat conducting plate; 221. a long side; 222. a short side; 23. a receiving cavity.

Detailed Description

The present application is described in further detail below with reference to figures 1-8.

The embodiment of the application discloses a high-efficient heat dissipation low impedance intensive bus duct.

The bus-bar phase sequence mainly used for solving the problem that the traditional bus-bar slot generally adopts L1, L2, L3 and N, and heat generated by the bus in the operation process is transmitted to the shell to be dissipated through convection, heat conduction and other forms. And the L2, L3 phase bus that calorific capacity is the biggest is located in the middle of the bus duct, and the heat gathers and is difficult to give off, and then can cause the bus temperature rise overall rising, leads to the electric energy loss to increase, and insulating material is ageing to be accelerated, and the life of bus duct shortens rapidly, even causes the problem of short circuit accident, provides following technical scheme for this reason:

referring to fig. 1, a high-efficiency heat-dissipating low-impedance compact bus duct includes a housing 1 and a conductor set 2,

the casing 1 is provided with two groups of closed cavities 11 along the extending direction of the casing, the extending directions of the two conductor groups 2 are the same as the extending direction of the closed cavities 11, and the two conductor groups 2 are arranged in the closed cavities 11 of the casing 1 in a side-by-side pressing mode.

Each conductor set 2 comprises two conductor plates 21 and two heat-conducting plates 22, the cross section of each heat-conducting plate 22 is L-shaped, the two heat-conducting plates 22 of the same conductor set 2 surround to form a containing cavity 23, the two conductor plates 21 are arranged in the two containing cavities 23, and the two conductor plates 21 are respectively tightly attached to the two heat-conducting plates 22.

By adopting the mode, the four-phase conductors are divided into two conductor groups 2 corresponding to each other in pairs, each conductor group 2 comprises two-phase conductors, and the arrangement of four-phase conductors L1, L2, L3 and N in the bus duct is realized in the shell 1. Because the heat conducting plates 22 are L-shaped, the two conductor plates 21 of each conductor group 2 are located in the area surrounded by the two L-shaped heat conducting plates 22, and each conductor plate 21 is tightly attached to one heat conducting plate 22, heat generated when each conductor plate 21 works can be quickly transferred to the heat conducting plates 22, and the outer sides and the end parts of the heat conducting plates 22 on the far sides of the two conductor groups 2 can be directly contacted with the two sides and the end parts of the shell 1 in a large area, so that heat dissipation of L1 and N phases is achieved; the heat-conducting plate 22 tip of two conductor group 2 near sides also all can extend to the tip and the casing 1 direct contact of casing 1, reaches L2 and the double-phase heat dissipation of L3, to sum up, the heat in the conductor can transmit the both sides for casing 1 promptly, can transmit again for can both ends for whole casing 1 becomes the radiator, has reached high efficiency and has carried out radiating effect to the bus duct.

In another embodiment of the present application, the arrangement of the two conductor sets 2 in the closed cavity 11 is further illustrated:

in order to facilitate the description of the structure of the heat-conducting plate 22 in the closed cavity 11, the heat-conducting plate 22 is described below as having a cross-sectional shape, and since the heat-conducting plate 22 has an L-shaped cross-section, the longer portion of the cross-sectional length is designated as the long side 221, and the angular portion of the length is designated as the short side 222.

Referring to fig. 2 and 3, the combination of the conductor plate 21 and the heat-conducting plate 22 in the conductor set 2 is:

the length of the long side 221 and the thickness of the short side 222 of the heat-conducting plate 22 are the whole length of the closed cavity 11, while the length of the short side 222 of the heat-conducting plate 22 is equal to or slightly shorter than the sum of the thicknesses of the two heat-conducting plates 22 and the two conductor plates 21, and the short sides 222 of the two heat-conducting plates 22 face to the close sides and are oppositely arranged, so that the two heat-conducting plates 22 surround to form the closed accommodating cavity 23, and the length of the two conductor plates 21 is equal to or slightly shorter than the length of the accommodating cavity 23.

Referring to fig. 4 and 5, the combination of the conductor plate 21 and the heat-conducting plate 22 in the conductor set 2 is:

the length of the long side 221 of the heat-conducting plate 22 is the whole length of the closed cavity 11, the sum of the length of the short side 222 and the thickness of the long side 221 of the heat-conducting plate 22 is equal to or slightly shorter than the sum of the thicknesses of the two heat-conducting plates 22 and the two conductor plates 21, the short sides 222 of the two heat-conducting plates 22 face to the close sides and are oppositely arranged, so that the two heat-conducting plates 22 surround to form the closed accommodating cavity 23, and the length of the two conductor plates 21 is equal to or slightly shorter than the length of the accommodating cavity 23.

In any of the above forms, the two heat conduction plates 22 of each conductor set 2 can surround to form the accommodating cavity 23 for accommodating the two conductor plates 21, and in addition, when the first form is adopted and the length of the short side 222 of the heat conduction plate 22 is slightly shorter than the sum of the thicknesses of the two heat conduction plates 22 and the two conductor plates 21, or the second form is adopted and the sum of the length of the short side 222 and the thickness of the long side 221 of the heat conduction plate 22 is slightly shorter than the sum of the thicknesses of the two heat conduction plates 22 and the two conductor plates 21, the two heat conduction plates 22 can be tightly pressed on the two conductor plates 21, so that the structure of the closed cavity 11 is ensured to be compact.

Referring to fig. 4 and 5, the two conductor sets 2 in the closed cavity 11 may be arranged symmetrically at the middle of the width direction of the closed cavity 11 or may be arranged asymmetrically. All can realize that the four-phase conductors of L1, L2, L3 and N in the bus duct are arranged and positioned in the shell 1.

The heat-conducting plate 22 and conductor plate 21 structure is further described in another embodiment of the present application:

the heat conducting plate 22 is made of aluminum conductors, the conductor plate 21 is made of copper conductors, the conductor plate 21 and the heat conducting plate 22 are formed by good electrical connection and compounding through friction welding or penetrating riveting and other methods, and in order to ensure the insulation of each phase conductor in the closed cavity 11, the conductor plate 21 and the heat conducting plate 22 are compounded and then wrapped with insulating materials to form insulating layers, so that the insulation of each phase conductor in the closed cavity 11 is ensured.

Referring to fig. 6, in order to connect adjacent bus ducts, the end of each conductor plate 21 extends to the end of the housing 1, and the part of the conductor plate 21 extending out of the end of the housing 1 forms a transition portion 211 and a connection portion 212, where the connection portion 212 is a portion for connecting bus duct connectors, and the transition portion 211 is a transition portion 211 for connecting the conductor plate 21 in the housing 1 and the connection portion 212 outside the housing 1.

Because the conductor plate 21 of the part in the casing 1 is compound with the copper aluminium that the heat-conducting plate 22 adopted, and extend the conductor plate 21 that the casing 1 part only adopted, therefore compare in the casing 1 copper aluminium compound part, the impedance of the unit length of the conductor plate 21 that only extends the casing 1 part is higher for it is higher to extend the casing 1 part during operation temperature rise, consequently sets up in this application's another embodiment:

at least the transition part 211 of the part of the conductor plate 21 extending out of the housing 1 has a thickness or width larger than that of the part of the conductor plate 21 located in the housing 1, or at least the transition part 211 of the part of the conductor plate 21 extending out of the housing 1 is compounded or wrapped with a supplementary conductor, which may be a copper conductor or an aluminum conductor.

The adopted conductor is thickened or widened or supplemented compositely on the part of the conductor plate 21 extending out of the shell 1, so that the impedance of the part of the conductor plate 21 extending out of the shell 1 can be effectively reduced, the conductive performance of the conductor plate 21 is ensured, and the temperature rise in working is reduced; when the bus duct connector is used for connecting the bus duct, the internal conductor of the bus duct connector is connected with the conductor plate 21, which is equivalent to compensating and reducing the impedance of the conductor part connecting part 212, so that the impedance of only the transition part 211 of the conductor plate 21 is higher, and at the moment, the transition part 211 of the conductor plate 21 is only required to be thickened or widened, the impedance of the transition part 211 of the conductor plate 21 is reduced, and the conductivity of the conductor plate 21 can be ensured and the working temperature rise can be reduced.

The housing 1 is further described in another embodiment of the present application:

referring to fig. 1, the casing 1 includes two cover plates 12 and two side plates 13, and the two cover plates 12 and the two side plates 13 are made of metal plates with good thermal conductivity, such as steel plates and aluminum plates. The surfaces of the two cover plates 12 are relatively parallel and symmetrically arranged, the two side plates 13 are arranged between the two cover plates 12, the surfaces of the two side plates 13 are relatively parallel and symmetrically arranged, the surfaces of the two side plates 13 are perpendicular to the surface of the cover plates 12, the upper ends and the lower ends of the two side plates 13 tend to be away from each other, are bent and fixed on the sides, close to each other, of the two cover plates 12, a rectangular closed cavity 11 is defined between the two cover plates 12 and the two side plates 13 and used for wrapping a conductor, the length side of the closed cavity 11 is the side plate 13, and the width side of the closed cavity 11 is the cover plate 12.

Referring to fig. 7 and 8, further, in order to improve the protection level of the bus duct and improve the fit degree of the conductor and the housing 1, another housing 1 structure may also be adopted, that is, one end of the side plate 13 is integrally formed on one cover plate 12, and the other end of the side plate 13 is fixed to the other cover plate 12. The side plate 13 can be fixed on the cover body by adopting the forms of bolt connection, riveting, or fastening, pressing, buckling, deformation and fixation and the like.

So with casing 1 by two curb plates 13 and two apron 12 four independent pieces, reform transform into two independent units, every independent unit is curb plate 13 and apron 12's integrated into one piece structure promptly, the protection level of improvement bus duct that can be further improves the laminating degree of casing 1 and conductor.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (9)

1. The utility model provides a low impedance intensive bus duct of high-efficient heat dissipation which characterized in that includes:

the device comprises a shell (1), wherein a closed cavity (11) is formed in the shell (1) along the extending direction of the shell;

the two conductor sets (2) are positioned in the closed cavity (11) and clamped side by side;

wherein the conductor set (2) comprises:

the cross sections of the two heat conduction plates (22) are L-shaped, and the two heat conduction plates (22) surround to form an accommodating cavity (23);

two conductor plates (21) are arranged in the containing cavity (23) side by side, and the two conductor plates (21) are respectively attached to a heat conducting plate (22).

2. The high efficiency heat dissipation low impedance compact busway of claim 1, wherein:

the heat conducting plate (22) is an aluminum conductor;

the conductor plate (21) is a copper conductor;

the corresponding aluminum conductor is electrically connected and compounded with the copper conductor;

the conductor plate (21) and the heat conducting plate (22) are wrapped with insulating layers.

3. The high efficiency heat dissipation low impedance compact busway of claim 1, wherein:

the two conductor sets (2) are symmetrically arranged in the closed cavity (11) side by side.

4. A high efficiency heat dissipating low impedance dense bus duct of any of claims 1-3, wherein:

at least the conductor plate (21) extends beyond the end of the housing (1);

the portion of the conductor plate (21) extending out of the housing (1) forms a transition portion (211) and a connection portion (212).

5. The high efficiency heat dissipation low impedance compact busway of claim 4, wherein:

at least the transition part (211) of the part of the conductor plate (21) extending out of the shell (1) is thicker or wider than the part of the conductor plate (21) positioned in the shell (1).

6. An efficient heat dissipation low impedance dense bus duct as claimed in claim 1, wherein at least the transition (211) of the portion of the conductor plate (21) extending out of the housing (1) is clad or wrapped with a supplemental conductor.

7. An efficient heat dissipation low impedance dense bus duct as claimed in claim 1, wherein the housing (1) comprises:

two cover plates (12) arranged in parallel and oppositely;

two side plates (13) which are arranged between the two cover plates (12) in parallel and opposite, wherein the surface of any one side plate (13) is vertical to the surface of any one cover plate (12);

the closed cavity (11) is formed between the two cover plates (12) and the two side plates (13).

8. The high-efficiency heat-dissipation low-impedance dense bus duct of claim 7, wherein:

two ends of the side plate (13) are respectively and fixedly connected with the two cover plates (12).

9. The high efficiency heat dissipation low impedance compact busway of claim 7, wherein:

one end of the side plate (13) is integrally formed on the cover plate (12);

and the other end of the side plate (13) is fixedly connected with the other cover plate (12).

Images