KR102273245B1 - Pressure sensor structure and manufacturing method thereof - Google Patents

Abstract

A pressure sensor structure is disclosed. The pressure sensor structure according to an embodiment of the present invention comprises: a support structure having a shape of an elongated beam so that both ends thereof are supported on the structure to measure the weight or pressure; a sensor unit provided on the upper surface of the support structure to measure the deformation of the support structure, thereby measuring the weight or pressure; and a circuit unit provided on the upper surface of the support structure to process a signal from the sensor unit, wherein the support structure includes an opening partly cut off at a position corresponding to the sensor unit.

Description

Pressure sensor structure and manufacturing method thereof

The present invention relates to a pressure sensor structure and a method for manufacturing the same. More specifically, it relates to a pressure sensor structure supported at both ends capable of measuring the weight or pressure while being supported at both ends of the structure to measure the pressure in a specific area or the weight of a specific object, and a method for manufacturing the same.

In general, the pressure sensor is a technology field of the sensor part that is widely used in automobiles, home appliances, refrigerators, washing machines, medical devices, etc. In devices that require measurement of pressure, such as an environment in which a lot of vibration is generated or there is a sudden change in pressure. used The principle of measurement uses the point that the resistance value of the semiconductor changes when the shape of the semiconductor changes in proportion to the pressure applied to the semiconductor, and the configuration of the pressure sensor includes a Wheatstone bridge equipped with a semiconductor and applied with a voltage. Therefore, when an external pressure is applied to the Wheatstone bridge, the resistance value of the semiconductor included in the Wheatstone bridge is changed due to physical bending, so that the degree of pressure is sensed.

Japanese Patent Laid-Open No. 2013-242148 (2013.12.05.)

The present invention provides a pressure sensor structure having a structure capable of improving the sensitivity of the pressure sensor by maximizing deformation of the support structure in a pressure sensor mounted on a support structure provided to measure weight or pressure, and a method for manufacturing the same want to

A pressure sensor structure according to an embodiment of the present invention includes a support structure having an elongated beam shape so that both ends are supported by the structure to measure weight or pressure; a sensor unit provided on the upper surface of the support structure to measure the deformation of the support structure, thereby measuring the weight or the pressure; and a circuit unit provided on the upper surface of the support structure to process the signal from the sensor unit, wherein the support structure may include an opening partly cut off at a position corresponding to the sensor unit.

In addition, the opening may have a shape that passes through the support structure under a corresponding position of the sensor unit and is also opened on a lower surface of the support structure.

In addition, the opening may include a first portion extending in a longitudinal direction of the support structure and a second portion connected to the first portion and open to a lower surface of the support structure.

In addition, the sensor unit may be spaced apart from each other by a predetermined distance at the opposite ends of the support structure, and the opening may be provided as a pair to correspond to the position of the sensor unit.

In addition, a downwardly recessed groove portion may be provided in the center of the support structure so that a link physically connected to an object to be weighed through the support structure is engaged.

In addition, the opening may pass through the support structure under a corresponding position of the sensor unit, and may have a closed shape with a lower surface of the support structure.

Also, the sensor unit may have a micro-electro-mechanical system (MEMS) structure.

In addition, the sensor unit may include a first connection pad, a second connection pad, a third connection pad, a fourth connection pad, and a fifth connection pad, each having a plate shape of a conductive material and arranged to be spaced apart from each other; and four semiconductor resistor units that connect any one of the connection pads of the connection pads to each other, and whose resistance value changes in proportion to a change in length according to pressure, wherein the five connection pads include two full-wheat units. Can form stone bridges.

In addition, the sensor unit may be fixed to the upper surface of the support structure, and the circuit unit may include a penetrating unit to expose the sensor unit at a position corresponding to the sensor unit, and the sensor unit and the circuit unit may be electrically connected through a wire. .

A method of manufacturing a pressure sensor structure according to an embodiment of the present invention includes: forming a support structure having a long beam shape so that both ends are supported on the structure to measure weight or pressure; forming a sensor unit on an upper surface of the support structure to measure the deformation of the support structure; and forming a circuit part on the upper surface of the support structure to process the signal from the sensor part, wherein the forming of the support structure includes an opening partly cut off at a position corresponding to the sensor part. may include forming.

The pressure sensor structure according to an embodiment of the present invention can improve the sensitivity of the pressure sensor by maximizing the deformation of the support structure.

In addition, a sensor unit is mounted on both ends of the support structure at both ends, and a more precise and accurate measurement of weight or pressure is possible using an output value from each sensor unit.

1 is a view showing a pressure sensor structure according to an embodiment of the present invention.
FIG. 2 is a view for explaining the pressure sensor structure of FIG. 1 in detail.
3 is a view showing various pressure sensor structures according to another embodiment of the present invention.
FIG. 4 is a view for explaining in detail the embodiment (d) of FIG. 3 .
FIG. 5 is a view for explaining the pressure distribution of the pressure sensor structure when a load is applied in the embodiment of FIG. 4 .
6 is a view for explaining a MEMS type semiconductor pressure sensor according to an embodiment of the present invention.
FIG. 7 is a diagram illustrating an output change of a pressure sensor according to a change in weight according to the embodiments illustrated in FIG. 3 .
8 is a view showing a pressure sensor structure according to various embodiments of the present invention.
9 is a flowchart illustrating a method of manufacturing a pressure sensor structure according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily carry out the present invention. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. And, in order to clearly describe the embodiment of the present invention in the drawings, parts irrelevant to the description are omitted.

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression may include the plural expression unless the context clearly dictates otherwise.

In the present specification, terms such as "comprise", "have" or "include" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, and one It may be understood that this does not preclude the possibility of the presence or addition of or more other features or numbers, steps, operations, components, parts, or combinations thereof.

In addition, it should not be understood that the scope of the present invention is limited by the specific embodiments, as it does not mean that the objects or effects presented in the present invention should be included in all or only such effects. Meanwhile, the detailed description of the technical configuration and functions widely known and applied among the technical configurations described in the present invention and the functions exhibited by the technical configurations will be omitted.

In addition, the following embodiments are provided to more clearly explain to those of ordinary skill in the art, and the shapes and sizes of elements in the drawings may be exaggerated for more clear description.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment according to the present invention will be described.

FIG. 1 is a view showing a pressure sensor structure according to an embodiment of the present invention, and FIG. 2 is a view for explaining the pressure sensor structure of FIG. 1 in detail.

1 and 2 , the pressure sensor structure 100 according to an embodiment of the present invention is supported on a predetermined structure and is provided to measure the weight or pressure acting on the pressure sensor structure 100 . . The pressure sensor structure 100 may include a support structure 110 , a sensor unit 130 , and a circuit unit 120 .

The support structure 110 may have an elongated beam shape, and both ends may be supported by the structure 10 . The support structure 110 may be, for example, a stainless steel (SUS)-based metal, but is not limited thereto.

The sensor unit 130 may measure the weight or pressure acting on the support structure 110 by being provided on the upper surface of the support structure 110 and measuring the tensile or compression deformation of the support structure 110 . In one embodiment, the sensor unit 130 may be a MEMS (Micro-Electro-Mechanical System) type semiconductor pressure sensor. The sensor unit 130 may be provided only at one end of both ends of the support structure 110 , or may be provided in a form symmetrical to each other at both ends. The sensor unit 130 may be fixedly attached to the upper surface of the support structure 110 .

The circuit unit 120 may be provided on the upper surface of the support structure 110 to process a signal from the sensor unit 130 . The circuit unit 120 may include a printed circuit board (PCB) on which various analog or digital devices for signal processing are mounted. A through part 126 may be provided in the circuit part 120 corresponding to the position where the sensor part 130 is disposed so that the sensor part 130 is exposed to the outside. Thanks to the through portion 126 , the sensor unit 130 and the plurality of terminals 124 provided in the circuit unit 120 may be connected through wires.

In addition, in the support structure 110 , openings 112a and 112b in which portions are cut may be provided at positions corresponding to the sensor unit 130 . In this embodiment, the sensor unit 130 is provided as a pair, each of which may be located at a position symmetrical to each other at both ends of the support structure 110 and spaced apart by a predetermined distance, and the pair of sensor units 130 A pair of openings 112a and 112b may be provided at corresponding positions, respectively.

On the other hand, in the present embodiment, in the middle portion of the support structure 110, a link that is physically connected to an object to be weighed through the support structure 110, for example, a connection part 114 that can be caught by a spring or a wire is provided. can be The connection part 114 may be provided in the form of an opening as in the present embodiment, or may be provided in the form of a groove recessed downward.

3 is a view showing various pressure sensor structures according to another embodiment of the present invention, and FIG. 4 is a view for explaining the embodiment (d) of FIG. 3 in detail.

Referring to FIG. 3 , the embodiment (a) has the form of a support structure 100a having both ends, but an opening penetrating the support structure 100a is not provided. In the embodiment (b), as compared with the embodiment (a), a pair of openings having a circular cross section are provided at both ends, and a pair of sensor units are provided on the upper side of the support structure 100b corresponding to each of the openings. will be prepared In Example (c), the cross-section of the opening has a square shape with rounded corners compared to Example (b). The openings in the embodiments (b) and (c) both laterally penetrate the support structure, but have a closed shape on the lower surface.

Referring to FIG. 4 , the pressure sensor structure 100d shown in the embodiment (d) may include a support structure 110d having an elongated beam shape, a pair of sensor units 130 and a circuit unit (not shown). . The circuit part performs the same function as that shown in FIG. 2, and illustration is omitted in this embodiment.

In the present embodiment, a pair of openings 116a and 116b are provided in the support structure 110d at a location corresponding to a position where the pair of sensor units 130 are disposed, and the shape is different from the above-described embodiments. . Each of the openings 116a and 116b passes through the support structure 110d in the lateral direction, but has an open shape on the lower surface of the support structure 110d. More specifically, in the present embodiment, each of the openings 116a and 116b includes a first portion extending in the longitudinal direction of the support structure 110d, and a second portion connected to the first portion and open to the lower surface of the support structure. Including, the openings (116a, 116b) have a shape symmetrical to each other.

FIG. 5 is a view for explaining a pressure distribution of the pressure sensor structure when a load is applied in the embodiment of FIG. 4 , and FIG. 6 is a view for explaining a MEMS type semiconductor pressure sensor according to an embodiment of the present invention. FIG. 7 is a diagram illustrating an output change of a pressure sensor according to a change in weight according to the embodiments illustrated in FIG. 3 .

First, referring to FIGS. 4 to 6 , each of the sensor units 130 is a MEMS type semiconductor pressure sensor, and five connection pads may constitute two Wheatstone bridges, for example, one common power source P3 . and two ground (P2, P4) and two output pads (P1, P5). The figure on the left of FIG. 5 shows an example of one Wheatstone bridge among two Wheatstone bridges, wherein the Wheatstone bridge has one common power supply (P3), two grounds (P2, P4), and two outputs (P1). , P5). The sensor unit 130 may be disposed at a position corresponding to where the openings 116a and 116b are provided on the upper surface of the support structure 110d. When a load is applied to the support structure 110d, the support structure 110d according to the shape of the openings 116a and 116b is deformed. Depending on the shape of the openings 116a and 116b, a portion in which tension of the support structure 110d occurs and a portion in which compression occurs may both occur.

Referring to the right side of FIG. 5 , the support structure 110d of FIG. 4 is deformed by a load, and a portion in which tension occurs and a portion in which compression occurs simultaneously appear, so that the upper surface of the support structure 110d has a shape in which deformation occurs. can The resistance R1 is increased in the portion where tension occurs, and the resistance R2 is decreased in the portion where compression occurs. Accordingly, the output P1 is decreased and similarly, through the configuration of the arrangement positions of the resistors R3 and R4, the resistance R4 of the portion in which the tension occurs increases, and the resistance R3 of the portion in which the compression occurs. ) will decrease. Accordingly, the output P5 is increased. When the difference between the outputs P1 and P5 is large, the measurement sensitivity, that is, the resolution, of the sensor unit 160 may be increased, and a more precise measurement of weight or pressure may be possible.

6 is a view for explaining a MEMS type semiconductor pressure sensor according to an embodiment of the present invention.

Referring to FIG. 6 , the semiconductor pressure sensor according to an embodiment of the present invention is installed on the pressure deformation surface of the measurement object to measure the external pressure applied to the measurement object. The semiconductor pressure sensor may include five connection pads (P: P1 to P5) and four semiconductor resistance units (R: R1 to R4).

In the present specification, the connection pad P includes all of the first connection pad P1 , the second connection pad P2 , the third connection pad P3 , the fourth connection pad P4 , and the fifth connection pad P5 . referred to at the same time Each of the five connection pads P may be made of a conductive material and may have a thin rectangular shape arranged in parallel with each other. Each of the four semiconductor resistors R may connect a pair of connection pads P to each other, and a resistance value may change in proportion to a change in length according to the external pressure.

FIG. 7 is a diagram illustrating an output change of a pressure sensor according to a change in weight according to the embodiments illustrated in FIG. 3 .

3 and 7 , in the case of a long beam shape in which the support structure 100a does not have an opening as in the embodiment (a), the values at the outputs P1 and P5 of the sensor unit 160 are different. appears to be absent, which may correspond to a case in which the sensitivity of the sensor unit 160 is the worst. In the case of the embodiment (b), the support structure 100b has a pair of openings having a circular cross section, and the difference between the outputs P1 and P5 of the sensor unit 160 occurs, and the difference increases as the load increases. can be seen to increase. In the case of embodiment (c), as compared with embodiment (b), the shape of the cross-section of the open part is different, and when the short-lived shape is a square shape with rounded corners, the sensor unit 160 compared to the case where the cross-section is circular. ), it can be seen that the difference between the outputs P1 and P5 is getting larger. However, even in this case, since both the outputs P1 and P5 show output values indicating tension, the support structure 100c near the sensor unit 160 has a slightly different degree of tension and only tension occurs as a whole. can be understood as

In the case of embodiment (d), it can be seen that the open portion has a structure in which the lower surface of the support structure 100d is also opened, and the polarities of the outputs P1 and P5 of the sensor unit 160 are opposite to each other. That is, it can be seen that the tension of the support structure 100d occurs in the vicinity where the one output P1 is located, and the compression of the support structure 100d occurs in the vicinity where the other output P5 is located. have. The two outputs P1 and P5 have different polarities, and as the difference increases accordingly, the sensitivity of the sensor unit 160 may be improved. That is, it is possible to exhibit more precise resolution even with less weight or pressure.

8 is a view showing a pressure sensor structure according to various embodiments of the present invention.

Referring to FIG. 8 , the pressure sensor structure according to various embodiments of the present disclosure includes an open structure (open type 1 to open type 4) having a structure that penetrates through the side surface of the support structure of the support structure and is opened to the lower surface of the support structure and , But passing through the side of the support structure, the lower surface of the support structure may have a closed closed structure (closed type 1 to closed type 3).

9 is a flowchart illustrating a method of manufacturing a pressure sensor structure according to an embodiment of the present invention.

Referring to FIG. 9 , the method 900 for manufacturing a pressure sensor structure according to an embodiment of the present invention includes the step of forming a support structure in the shape of an elongated beam so that both ends are supported by the structure to measure weight or pressure ( S901 ) includes For example, the support structure may be made of a SUS-based metal. Next, the method 900 for manufacturing the pressure sensor structure includes forming a sensor part on the upper surface of the support structure to measure the deformation of the support structure ( S902 ). The sensor unit is a MEMS-type semiconductor pressure sensor, and may be attached by an adhesive or the like after the surface of the support structure is treated. Next, the method 900 of manufacturing the pressure sensor structure may include forming a circuit portion on the upper surface of the support structure to process a signal from the sensor portion ( S903 ). Here, the circuit unit may include various circuit elements, and an opening may be formed in a portion corresponding to the sensor unit to expose the sensor unit to the outside.

Forming the support structure ( S901 ) may include forming an opening partly cut off at a position corresponding to the sensor unit.

According to the pressure sensor structure according to the above-described embodiments, when the support structure is used for weight or pressure measurement, the deformation of the support structure can be maximized to improve the sensitivity of the pressure sensor.

In addition, the sensor units are mounted on both ends of the supporting structures at both ends, and the weight or pressure can be measured more precisely and accurately by using the output values from the respective sensor units.

Although representative embodiments of the present invention have been described in detail above, those of ordinary skill in the art to which the present invention pertains will understand that various modifications are possible without departing from the scope of the present invention with respect to the above-described embodiments. .

Therefore, the scope of the present invention should not be limited to the described embodiments, and should be defined by the claims described below as well as the claims and equivalents.

100: pressure sensor structure 110: support structure
112a, 112b, 116a, 116b: opening 114: connection part
120: circuit unit 124: terminal
126: penetrating portion 130: sensor unit

Claims (10)

a support structure in the shape of an elongated beam so that both ends are supported on the structure to measure weight or pressure;
a sensor unit provided on the upper surface of the support structure to measure the deformation of the support structure, thereby measuring the weight or the pressure; and
Including a; circuit unit provided on the upper surface of the support structure to process the signal from the sensor unit,
The support structure includes an opening partly cut off at a position corresponding to the sensor unit,
The sensor unit is located at the both ends of the support structure symmetrical to each other and spaced apart by a predetermined distance
The opening is provided as a pair to correspond to the position of the sensor unit,
A pressure sensor structure in which a downwardly recessed groove portion is provided in the center of the support structure so that a link physically connected to an object to be measured by weight through the support structure is engaged.
According to claim 1,
The opening is below the corresponding position of the sensor unit, penetrating the support structure, the pressure sensor structure of a shape that is also open to the lower surface of the support structure.
3. The method of claim 2,
The opening may include a first portion extending in the longitudinal direction of the support structure and a second portion connected to the first portion and open to a lower surface of the support structure.
delete delete According to claim 1,
The opening is below the corresponding position of the sensor unit, through the support structure, the pressure sensor structure is a closed shape to the lower surface of the support structure.
delete A pressure sensor structure comprising:
a support structure in the shape of an elongated beam so that both ends are supported on the structure to measure weight or pressure;
a sensor unit provided on the upper surface of the support structure to measure the deformation of the support structure, thereby measuring the weight or the pressure; and
Including a; circuit unit provided on the upper surface of the support structure to process the signal from the sensor unit,
The support structure includes an opening partly cut off at a position corresponding to the sensor unit,
The sensor unit is a MEMS (Micro-Electro-Mechanical System) structure,
The sensor unit,
a first connection pad, a second connection pad, a third connection pad, a fourth connection pad, and a fifth connection pad, each having a plate shape of a conductive material and arranged to be spaced apart from each other; and
including; four semiconductor resistor units connecting a pair of connection pads among the connection pads to each other and having a resistance value that changes in proportion to a change in length according to pressure;
and the five connection pads form two full Wheatstone bridges.
According to claim 1,
The sensor unit is fixed to the upper surface of the support structure,
The circuit unit includes a penetrating portion so that the sensor unit is exposed at a position corresponding to the sensor unit,
The pressure sensor structure in which the sensor unit and the circuit unit are electrically connected through a wire.
A method of manufacturing a pressure sensor structure comprising:
forming an elongated beam-shaped support structure so that both ends are supported on the structure to measure weight or pressure;
forming a sensor unit on an upper surface of the support structure to measure the deformation of the support structure; and
Including; forming a circuit portion on the upper surface of the support structure to process the signal from the sensor portion,
The step of forming the support structure includes forming an opening partly cut off at a position corresponding to the sensor unit,
The sensor unit is located at the both ends of the support structure symmetrical to each other and spaced apart by a predetermined distance,
The openings are provided in pairs to correspond to the position of the sensor unit,
A method of manufacturing a pressure sensor structure in which a groove recessed downward so that a link physically connected to an object to be measured is provided through the support structure is provided in the center of the support structure.

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