KR102272038B1 - 적응성 척킹 시스템 - Google Patents
적응성 척킹 시스템 Download PDFInfo
- Publication number
- KR102272038B1 KR102272038B1 KR1020170174767A KR20170174767A KR102272038B1 KR 102272038 B1 KR102272038 B1 KR 102272038B1 KR 1020170174767 A KR1020170174767 A KR 1020170174767A KR 20170174767 A KR20170174767 A KR 20170174767A KR 102272038 B1 KR102272038 B1 KR 102272038B1
- Authority
- KR
- South Korea
- Prior art keywords
- shape
- template
- adaptive chuck
- chuck
- active region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/385,189 | 2016-12-20 | ||
| US15/385,189 US10578984B2 (en) | 2016-12-20 | 2016-12-20 | Adaptive chucking system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180071970A KR20180071970A (ko) | 2018-06-28 |
| KR102272038B1 true KR102272038B1 (ko) | 2021-07-02 |
Family
ID=62556290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170174767A Expired - Fee Related KR102272038B1 (ko) | 2016-12-20 | 2017-12-19 | 적응성 척킹 시스템 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10578984B2 (https=) |
| JP (1) | JP7085827B2 (https=) |
| KR (1) | KR102272038B1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10276455B2 (en) * | 2016-07-29 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for measurement of semiconductor device fabrication tool implement |
| JP7286391B2 (ja) | 2019-04-16 | 2023-06-05 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| US11728203B2 (en) | 2020-10-13 | 2023-08-15 | Canon Kabushiki Kaisha | Chuck assembly, planarization process, apparatus and method of manufacturing an article |
| US12463081B2 (en) | 2023-05-31 | 2025-11-04 | Canon Kabushiki Kaisha | Apparatus including a bonding head and a method of using the same |
| CN118009890B (zh) * | 2024-04-09 | 2024-06-21 | 佛山市仟安金属制品有限公司 | 一种五金件手持对比测量装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090140445A1 (en) * | 2007-12-04 | 2009-06-04 | Molecular Imprints | High Throughput Imprint Based on Contact Line Motion Tracking Control |
| US20100110409A1 (en) | 2008-10-30 | 2010-05-06 | Molecular Imprints, Inc. | Separation in an Imprint Lithography Process |
| JP2013138183A (ja) * | 2011-11-28 | 2013-07-11 | Canon Inc | インプリント装置、それを用いた物品の製造方法、およびインプリント方法 |
| US20140138875A1 (en) | 2011-08-11 | 2014-05-22 | Canon Kabushiki Kaisha | Imprint apparatus and article manufacturing method |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6873087B1 (en) | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
| US7077992B2 (en) | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
| US7019819B2 (en) | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
| US6932934B2 (en) | 2002-07-11 | 2005-08-23 | Molecular Imprints, Inc. | Formation of discontinuous films during an imprint lithography process |
| US6980282B2 (en) | 2002-12-11 | 2005-12-27 | Molecular Imprints, Inc. | Method for modulating shapes of substrates |
| US7179396B2 (en) | 2003-03-25 | 2007-02-20 | Molecular Imprints, Inc. | Positive tone bi-layer imprint lithography method |
| US7396475B2 (en) | 2003-04-25 | 2008-07-08 | Molecular Imprints, Inc. | Method of forming stepped structures employing imprint lithography |
| US7157036B2 (en) | 2003-06-17 | 2007-01-02 | Molecular Imprints, Inc | Method to reduce adhesion between a conformable region and a pattern of a mold |
| US8076386B2 (en) | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
| US7307697B2 (en) | 2004-05-28 | 2007-12-11 | Board Of Regents, The University Of Texas System | Adaptive shape substrate support system |
| JP2007242893A (ja) | 2006-03-08 | 2007-09-20 | Toshiba Corp | パターン転写方法およびパターン転写装置 |
| US8913230B2 (en) | 2009-07-02 | 2014-12-16 | Canon Nanotechnologies, Inc. | Chucking system with recessed support feature |
| JP2013110162A (ja) | 2011-11-17 | 2013-06-06 | Canon Inc | インプリント装置及び物品の製造方法 |
| DE102012111114B4 (de) | 2012-11-19 | 2018-10-04 | Ev Group E. Thallner Gmbh | Halbleiterbearbeitungsvorrichtung und -verfahren |
| JP2015050437A (ja) | 2013-09-04 | 2015-03-16 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
| WO2015070054A1 (en) | 2013-11-08 | 2015-05-14 | Canon Nanotechnologies, Inc. | Low contact imprint lithography template chuck system for improved overlay correction |
| JP6361317B2 (ja) | 2014-06-25 | 2018-07-25 | 大日本印刷株式会社 | 位置精度推定方法及び位置精度保証方法 |
-
2016
- 2016-12-20 US US15/385,189 patent/US10578984B2/en active Active
-
2017
- 2017-12-12 JP JP2017237854A patent/JP7085827B2/ja not_active Expired - Fee Related
- 2017-12-19 KR KR1020170174767A patent/KR102272038B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090140445A1 (en) * | 2007-12-04 | 2009-06-04 | Molecular Imprints | High Throughput Imprint Based on Contact Line Motion Tracking Control |
| US20100110409A1 (en) | 2008-10-30 | 2010-05-06 | Molecular Imprints, Inc. | Separation in an Imprint Lithography Process |
| US20140138875A1 (en) | 2011-08-11 | 2014-05-22 | Canon Kabushiki Kaisha | Imprint apparatus and article manufacturing method |
| JP2013138183A (ja) * | 2011-11-28 | 2013-07-11 | Canon Inc | インプリント装置、それを用いた物品の製造方法、およびインプリント方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180173119A1 (en) | 2018-06-21 |
| JP2018101779A (ja) | 2018-06-28 |
| US10578984B2 (en) | 2020-03-03 |
| JP7085827B2 (ja) | 2022-06-17 |
| KR20180071970A (ko) | 2018-06-28 |
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St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PE0902 | Notice of grounds for rejection |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
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