KR102268268B1 - Resin composition and battery module comprising the same - Google Patents

Abstract

The present application relates to a resin composition, a battery module including a cured product of the resin composition, a manufacturing method, and a battery pack. According to an example of the present application, it is possible to improve the injection processability of the resin composition, prevent overload of injection equipment, and provide a battery module having excellent insulation.

Description

Resin composition and battery module comprising the same

This application relates to a resin composition. Specifically, the present application relates to a resin composition, a battery module including a cured product of the resin composition, a method for manufacturing a battery module, a battery pack, and a vehicle.

The secondary battery includes a nickel cadmium battery, a nickel hydride battery, a nickel zinc battery, or a lithium secondary battery, and a typical example is a lithium secondary battery.

Lithium secondary batteries mainly use lithium oxide and carbon materials as positive and negative active materials, respectively. A lithium secondary battery includes an electrode assembly in which a positive electrode plate and a negative electrode plate to which a positive electrode active material and a negative electrode active material are respectively applied with a separator interposed therebetween, and a casing for sealing and housing the electrode assembly together with an electrolyte, depending on the shape of the casing. and pouch-type secondary batteries. Such a single secondary battery may be referred to as a battery cell.

In the case of a medium or large-sized device such as a vehicle or a power storage device, a battery module in which a large number of battery cells are electrically connected to each other or a battery pack in which a plurality of such battery modules are connected may be used to increase capacity and output.

One of the methods of configuring the battery module or battery pack as described above is to use an adhesive material capable of fixing a plurality of battery cells to the inside of the battery module. In this case, the adhesive material may be injected into the battery module through an injection hole formed on the surface of the battery module.

An object of the present application is to improve injection processability and prevent overload of injection equipment in a resin composition that can be used to fix battery cells in a battery module.

Another object of the present application is to provide a composition capable of providing excellent insulation, adhesion, heat generation, and the like, after being injected into a battery module and cured.

Another object of the present application is to provide a battery module, a manufacturing method, and a battery pack including a cured product of the resin composition.

In an example related to the present application, the present application relates to a resin composition used for a battery module or a battery pack. Specifically, as described below, the composition of the present application may be a composition that is injected into the case of a battery module and is used to contact one or more battery cells present in the battery module to fix the battery cells within the battery module. .

In this regard, the resin composition, for example, the adhesive composition may be a resin composition that includes a main resin and a curing agent, and satisfies the following general formulas 1 and 2.

[General formula 1]

10 ≤ Initial load value (Li) ≤ 40

[General Formula 2]

1 ≤ Load change rate (Lf/Li) ≤ 3

In Formulas 1 and 2, Li is the initial load value (kgf) measured immediately after the main resin and the curing agent are mixed, and Lf is the aging load value (kgf) measured 3 minutes after the main resin and the curing agent are mixed, , the load values Li and Lf represent the maximum value of the force required to discharge the resin composition at a constant speed through a mixer having a constant cross section, respectively.

In the present application, the term "room temperature" is a state that is not particularly heated, and any one temperature within the range of about 10°C to 30°C, for example, about 15°C or more, 18°C or more, 20°C or more, or about 23°C. or more, and may mean a temperature of about 27° C. or less. Among the physical properties mentioned in this specification, when the measured temperature affects the physical properties, unless otherwise specified, the physical properties may be those measured at room temperature.

In the present application, the initial load value (Li) measured immediately after the main resin and the curing agent are mixed is by injecting the main resin and the curing agent into two cartridges to be described later, respectively, and pressurizing them at a constant speed of 1 mm/s with a pressing means to be described later. , the main resin and the curing agent are injected into a mixer to be described later, and the force required for the pressing means is measured from the time it is first discharged after mixing in the mixer, and the maximum value is set at the point where the force becomes the maximum value. It was set as the load value (Li). The maximum value is a maximum value initially identified in the process, and is a maximum value at a point where the required force is initially decreased while increasing, or a maximum value at a point where it first converges. And, when the time points at which the maximum values are checked in the two pressing means are different, the initial load value Li is the maximum value initially checked.

In the present application, the aging load value (Lf) measured 3 minutes after the main resin and the curing agent are mixed is the main resin and the curing agent are injected into the mixer by a pressurizing means to be described later, respectively, and the resin composition injected into the mixer is the capacity of the mixer. When the pressure is about 95% of the (volume), stop the pressurization, and after the stop time has elapsed 3 minutes, pressurize again with a mixer at a constant speed of 1 mm / s, from when the resin composition is first discharged through the discharge part of the mixer, The required force was measured, and the maximum value at the point at which the force became the maximum value was taken as the load value over time (Lf). The maximum value is a maximum value initially identified in the process, and is a maximum value at a point where the required force is initially decreased while increasing, or a maximum value at a point where it first converges. In addition, when the time points at which the maximum values are confirmed in the two pressing means are different, the load value Lf over time is the maximum value initially checked.

After filling the main resin in any one of the two cartridges described later, and after filling the other cartridge with a curing agent, a constant force is applied by a pressing means to be described later and mixed in a mixer to be described later via the discharge part of the cartridge to be described later. The load value was measured while allowing it to be discharged to the discharge part of the . The initial load value (Li) measured immediately after the main resin and the curing agent were mixed in the resin composition may be about 10 kgf or more to about 40 kgf or less. For example, the initial load value Li may be about 10 kgf or more, 12 kgf or more, or about 14 kgf or more, and may be about 40 kgf or less, 38 kgf or less, or about 36 kgf or less.

In addition, the aging load value (Lf) measured 3 minutes after the main resin and the curing agent are mixed may be about 50 kgf or less, and the lower limit thereof may be, for example, about 20 kgf or more. For example, the load value over time measured after curing for 3 minutes may be about 50 kgf or less or about 48 kgf, and may be about 20 kgf or more, 22 kgf or more, or about 24 kgf or more.

Such a load value is particularly advantageous for the formation of a battery module having a specific structure as will be described later. If the load value is too low, overflow may occur after injection or the storage stability of the resin composition may be deteriorated. In addition, too high a load value, by giving a burden to the injection equipment of the resin composition may shorten the life of the equipment or the productivity of the battery module may be reduced.

In one example, the load change rate of the resin composition may have a range of about 1 or more to about 3 or less. In the present application, the term load change rate is a ratio of an initial load value (Li) measured immediately after mixing the main resin and the curing agent to the over-time load value (Lf) measured 3 minutes after the main resin and the curing agent are mixed. That is, it may be defined as Lf/Li.

A load change rate of more than 3 means that the increase in the load value is large, which means that the curing rate of the resin composition is fast, and thus may cause overload of the injection equipment. On the other hand, if the hatching change rate is less than 1, it means that the increase in the load value is not large, it means that the curing rate of the resin composition is slow, and the productivity of the battery module may be reduced.

Therefore, when the initial load value (Li) of the resin composition satisfies the above general formula (1) and the load change rate (Lf/Li) satisfies the range of the above general formula (2), the injection process of the resin composition is excellent and the injection equipment overload can be prevented.

In the present application, Li and Lf may be referred to as provisional curing load values. In the present application, temporary hardening may mean that the hardening state has not been reached. The hardening state means that the material injected into the module to manufacture the battery module is hardened enough to function as an adhesive with functions such as actual heat dissipation. It can mean a state that can be seen as being. Taking a urethane resin as an example, the true cured state is based on 24 hours of curing at room temperature and 30 to 70% relative humidity conditions, and the conversion rate of the NCO peak in the vicinity of ^{2250 cm -1 confirmed by FT-IR analysis (} conversion) can be confirmed from 80% or more.

In the present application, the mixer may include two cartridges and one mixer coupled with the cartridge. 1 is a cross-sectional view showing an exemplary mixer 1 of the present application. The mixer 1 may be composed of two cartridges 2a and 2b and one mixer 5 .

The cartridge 2 is not particularly limited, and a known cartridge can be used as long as it can accommodate the main resin and the curing agent. In one embodiment, the diameters of the cartridges 2a and 2b containing the main resin or curing agent are circular in the range of about 15 mm to about 20 mm, and the diameter of the discharge portions of the first discharge units 4a and 4b for discharging the main resin or curing agent is It has a circular shape of about 2 mm to about 5 mm, a height of about 80 mm to 300 mm, and a total capacity of 10 ml to 100 ml.

The cartridges 2a, 2b may have pressing means 3a, 3b. The pressing means (3a, 3b) is not particularly limited, and known pressing means (3a, 3b) can be used. For example, the pressing means may use a TA (Texture Analyser). The pressing means (3a, 3b) can press the cartridge (2a, 2b) to discharge the main resin and curing agent inside the cartridge through the mixer (5). The pressing speed of the pressing means 3a and 3b may be about 0.01 to about 1 mm/s. For example, the pressing speed may be about 0.01 mm/s or more, 0.05 mm/s or more, or about 0.1 mm/s or more, and about 1 mm/s or less, 0.8 mm/s or less, 0.6 mm/s or less, 0.4 mm/s or less. s or less or about 0.2 mm/s or less. On the other hand, the mixer 5 is not particularly limited as long as it can mix the resin composition discharged by the two cartridges, and a known mixer can be used. For example, the mixer may be a static mixer 5 . In one embodiment, the static mixer 5 is mixed by the static mixer 5 and two accommodating parts 6a and 6b for accommodating the main resin and the curing agent respectively from the two cartridges 2a and 2b. It has one second discharge part 7 for discharging the resin composition, and the size of the receiving parts 6a and 6b is a circular shape with a diameter of about 2 mm to about 5 mm, respectively, and the diameter of the second discharge part 7 is 1 mm. It has a circular shape of 3 mm to 3 mm, and the number of elements may be from about 5 to about 20. Meanwhile, the capacity of the mixer 5 may have a capacity satisfying the range of Formula 3 below.

[General Formula 3]

V < t2/td * Q

In Formula 3, V is the capacity of the static mixer, t2 is the time for doubling the viscosity of the resin composition, td is the dispensing process time, and Q is the injection amount per process unit time. When the capacity of the static mixer is large compared to the time (t2) for which the viscosity is doubled, the residence time exceeds the amount per unit process and the viscosity increases, and the process speed is slowed down, or in severe cases, the mixer is hardened. There is a possibility of blockage.

In one example, the viscosity value of the resin composition may be about 500,000 cP or less. The lower limit may be, for example, about 150,000 cP or greater. For example, the viscosity value of the resin composition may be about 450,000 cP or less, 400,000 cP or less, or about 350,000 cP or less, and may be about 160,000 cP or more, 180,000 cP or more, or about 200,000 cP or more. When the corresponding range is satisfied, it is advantageous to satisfy the above general formulas 1 and 2, and accordingly, appropriate fairness can be secured.

On the other hand, if the viscosity in the present application is not otherwise stated, the shear rate from 0.01 to 10.0/s using a rheometer (ARES) at room temperature within 60 seconds after mixing the main resin and the curing agent ), the viscosity value measured at 2.5/s.

In one example, the thixothropic index of the resin composition may be about 1.5 or more, and the upper limit thereof may be, for example, about 5.0 or less. For example, the thixotropic index may be about 1.5 or more, 1.6 or more, or about 1.7 or more, and may be about 5.0 or less, 4.5 or less, 4.0 or less, or about 3.5 or less.

The thixotropic index represents a viscosity ratio of the resin composition. The thixotropic index in the present application is measured in a shear rate range of 0.01 to 10.0/s using a rheometer (ARES) at room temperature, a point where the shear rate is 0.25/s and 2.5/s The viscosity ratio of the resin composition measured at the phosphorus point is shown.

A thixotropic index of less than 1.5 means that the viscosity of the resin composition at the shear rate of 0.25/s and the viscosity of the resin composition at the point of 2.5/s are not large, so it is not suitable for use in the injection process and has the same viscosity. Even if it has a resin composition, it is not preferable because there is a possibility that a flow may occur before curing. On the other hand, if the viscosity of the resin composition at the point of 2.5/s is small, an overflow may occur in the pressurizing device that pressurizes the resin composition in the mixer and injects it into the battery module due to insufficient curing of the resin composition. Therefore, when the thixotropic index is in the range of about 1.5 or more to about 5.0 or less, appropriate fairness can be ensured.

The type of the resin composition is not particularly limited as long as it has the load value of the general formula 1 and the load change rate of the general formula 2, and has adhesiveness suitable for the use after curing.

In one example, a room temperature curable composition may be used as the resin composition. The room temperature curable composition refers to a composition having a system capable of exhibiting a predetermined adhesive ability through a curing reaction at room temperature, and may be, for example, a two-component resin composition including a main resin and a curing agent. As the main resin, a silicone resin, a polyol resin, an epoxy resin, or an acrylic resin can be used. Meanwhile, as the curing agent, a known curing agent suitable for the main resin may be used. For example, when the main resin is a silicone resin, the curing agent can use a siloxane compound, when the main resin is a polyol resin, the curing agent can use an isocyanate compound, when the main resin is an epoxy resin, the curing agent can use an amine compound. In the case where the main resin is an acrylic resin, an isocyanate compound may be used as the curing agent.

In one example, the subject resin may have a viscosity of about 10,000 cP or less. Specifically, the resin component may have a viscosity of about 8,000 cP or less, 6,000 cP or less, 4,000 cP or less, 2,000 cP or about 1,000 CP or less. Preferably, the upper limit of the viscosity may be about 900 cP or less, 800 cP or less, 700 cP or less, 600 cP or less, 500 cP or less, or about 400 cP or less. Although not particularly limited, the lower limit of the viscosity of the main resin may be about 50 cP or more or about 100 cP or more. If the viscosity is too low, fairness may be good, but as the molecular weight of the raw material is lowered, the possibility of volatilization increases, and heat resistance / cold resistance, flame retardancy, and adhesion may be deteriorated. By satisfying the lower limit, this disadvantage can be prevented. The viscosity of the resin may be measured at room temperature using, for example, a Brookfield LV type viscometer.

In one example, the resin composition may be a two-part urethane-based composition. When a two-part urethane-based composition is used, the composition may have the following configuration. In the case of the two-component polyurethane, the curing agent may be cured by reacting the main agent including a polyol and the like with a curing agent including an isocyanate, etc. at room temperature. The curing reaction may be assisted by a catalyst such as, for example, dibutyltin dilaurate (DBTDL). Accordingly, the two-part urethane-based composition may include a physical mixture of the main component (polyol) and the curing agent component (isocyanate), and/or may include a reactant (cured product) of the main component and the curing agent component.

The two-part urethane-based composition may include a main resin including at least a polyol resin and a curing agent including at least an isocyanate. Accordingly, the cured product of the resin composition may include both the polyol-derived unit and the polyisocyanate-derived unit. In this case, the polyol-derived unit may be a unit formed by a urethane reaction of a polyol with a polyisocyanate, and the polyisocyanate-derived unit may be a unit formed by a urethane reaction of a polyisocyanate with a polyol.

The main resin and the curing agent may each include a filler. For example, in order to secure thixotropy as needed in the process, and/or to secure heat dissipation (thermal conductivity) within a battery module or battery pack, the composition of the present application contains an excess of filler as described below. may be included. Specific details are described in detail in the following related description.

In one example, an ester polyol resin may be used as the polyol resin included in the main resin. When the ester polyol resin is used, it is advantageous to secure excellent adhesion and adhesion reliability in the battery module after curing the resin composition.

In one example, as the ester polyol resin, for example, carboxylic acid polyol or caprolactone polyol may be used.

The carboxylic acid polyol may be formed by reacting a component including a carboxylic acid and a polyol (eg, a diol or a triol), and the caprolactone polyol includes caprolactone and a polyol (eg, a diol or a triol). It can be formed by reacting the components. In this case, the carboxylic acid may be a dicarboxylic acid.

In one example, the polyol resin may be a polyol resin represented by the following Chemical Formula 1 or 2.

[Formula 1]

[Formula 2]

In Formulas 1 and 2, X is a unit derived from a carboxylic acid, and Y is a unit derived from a polyol. The polyol-derived unit may be, for example, a triol unit or a diol unit. In addition, n and m may be any number, for example, n is a number within the range of 2 to 10, m is a number within the range of 1 to 10, and R ₁ and R ₂ are each independently 1 to 14 carbon atoms. alkylene within the range of

As used herein, the term “carboxylic acid-derived unit” may mean a portion excluding a carboxyl group in a carboxylic acid compound. Similarly, as used herein, the term “polyol-derived unit” may mean a portion of a polyol compound structure excluding a hydroxyl group.

That is, when the hydroxyl group of the polyol and the carboxyl group of the carboxylic acid react, water (H ₂ O) molecules are desorbed by the condensation reaction to form an ester bond. As such, when the carboxylic acid forms an ester bond by the condensation reaction, the carboxylic acid-derived unit may mean a portion of the carboxylic acid structure that does not participate in the condensation reaction. In addition, the polyol-derived unit may refer to a portion of the polyol structure that does not participate in the condensation reaction.

In addition, Y in Formula 2 also represents a portion excluding the ester bond after the polyol forms an ester bond with caprolactone. That is, when the polyol-derived unit, Y, in Formula 2 forms an ester bond between the polyol and caprolactone, it may mean a portion of the polyol structure that does not participate in the ester bond. The ester bond is shown in Formulas 1 and 2, respectively.

On the other hand, when the polyol-derived unit of Y in the formula is a unit derived from a polyol including three or more hydroxyl groups, such as a triol unit, a branched structure may be implemented in the Y portion in the formula structure.

In Formula 1, the type of the carboxylic acid-derived unit of X is not particularly limited, but in order to secure desired physical properties, a fatty acid compound, an aromatic compound having two or more carboxyl groups, an alicyclic compound having two or more carboxyl groups, and 2 It may be a unit derived from at least one compound selected from the group consisting of aliphatic compounds having at least two carboxyl groups.

The aromatic compound having two or more carboxyl groups may be, for example, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid or tetrachlorophthalic acid.

The alicyclic compound having two or more carboxyl groups may be, for example, tetrahydrophthalic acid or hexahydrophthalic acid or tetrachlorophthalic acid.

In addition, the aliphatic compound having two or more carboxyl groups is, for example, oxalic acid, adipic acid, azelaic acid, sebacic acid, succinic acid, malic acid, glutaric acid, malonic acid, pimelic acid, suberic acid, 2,2-dimethyl succinic acid, 3,3-dimethylglutaric acid, 2,2-dimethylglutaric acid, maleic acid, fumaric acid or itaconic acid.

Considering the low glass transition temperature of the range described above, units derived from aliphatic carboxylic acids may be preferred over units derived from aromatic carboxylic acids.

Meanwhile, in Formulas 1 and 2, the type of the polyol-derived unit of Y is not particularly limited, but in order to secure desired physical properties, from the group consisting of an alicyclic compound having two or more hydroxyl groups and an aliphatic compound having two or more hydroxyl groups. may be derived from one or more selected compounds.

The alicyclic compound having two or more hydroxyl groups may be, for example, 1,3-cyclohexanedimethanol or 1,4-cyclohexanedimethanol.

In addition, the aliphatic compound having two or more hydroxyl groups is, for example, ethylene glycol, propylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,2-ethylhexyldiol, 1,5-pentanediol, 1,9-nonanediol, 1,10-decanediol, glycerin or trimethylol It may be propane.

Meanwhile, in Formula 1, n is an arbitrary number, and the range may be selected in consideration of the desired physical properties of the resin composition or the cured resin layer thereof. For example, n can be about 2 to 10 or 2 to 5.

In addition, in Formula 2, m is an arbitrary number, and the range may be selected in consideration of desired physical properties of a resin composition or a resin layer that is a cured product thereof. For example, m is about 1 to 10 or 1 to 5 days. can

When n and m in Chemical Formulas 1 and 2 are out of the above ranges, the crystallinity of the polyol may be strengthened and the injection processability of the composition may be adversely affected.

In Formula 2, R ₁ and R ₂ are each independently alkylene having 1 to 14 carbon atoms. The number of carbon atoms may be selected in consideration of the desired physical properties of the resin composition or a resin layer that is a cured product thereof.

The molecular weight of the polyol may be adjusted in consideration of the low viscosity characteristics described below, durability or adhesiveness, and the like, for example, may be in the range of about 300 to 2,000. Unless otherwise specified, in the present specification, "molecular weight" may be a weight average molecular weight (Mw) measured using Gel Permeation Chromatograph (GPC). If out of the above range, the reliability of the resin layer after curing may be poor or problems related to volatile components may occur.

In the present application, the type of polyisocyanate included in the curing agent is not particularly limited, but a non-aromatic isocyanate compound that does not contain an aromatic group may be used to secure desired physical properties. When the aromatic polyisocyanate is used, the reaction rate is too fast and the glass transition temperature of the cured product may be high, so it may be difficult to secure processability and physical properties suitable for the use of the composition of the present application.

Examples of the non-aromatic isocyanate compound include aliphatic polyisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate or tetramethylene diisocyanate. ; alicyclic polyisocyanates such as transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate or dicyclohexylmethane diisocyanate; Or any one or more of the above-mentioned carbodiimide-modified polyisocyanate or isocyanurate-modified polyisocyanate; etc. may be used. Also, mixtures of two or more of the compounds listed above may be used.

The ratio of the polyol-derived resin component and the polyisocyanate-derived resin component in the resin composition is not particularly limited, and may be appropriately adjusted to enable a urethane reaction between them.

As described above, in order to secure heat dissipation (thermal conductivity) or to secure thixotropy as needed in the process, an excess of filler may be included in the composition. When an excess of filler is used, the viscosity of the composition increases and the battery module Fairness when injecting the composition into the case of may deteriorate. Accordingly, it is necessary to have sufficient low-viscosity properties that do not interfere with processability while including an excess of filler. In addition, if only low viscosity is shown, proper thixotropy is required because it is also difficult to secure fairness, exhibits excellent adhesion while curing, and curing itself may be required to proceed at room temperature. In addition, although ester polyols are advantageous in securing adhesion after curing, they have a high crystallinity, so there is a high possibility of becoming a wax state at room temperature, and there is a disadvantage in securing proper injection processability due to an increase in viscosity. Even if the viscosity is lowered through melting, due to the crystallinity that occurs naturally during storage, the viscosity rises due to crystallization in the injection or application process of the composition, which may be followed after mixing with the filler. and, as a result, fairness may be reduced. In consideration of this point, the ester polyol used in the present application may satisfy the following properties.

In the present application, the ester polyol may be amorphous or a polyol having sufficiently low crystallinity. As used herein, the meaning of the term “amorphous” is known to those skilled in the art. For example, "amorphous" means a case in which the crystallization temperature (Tc) and the melting temperature (Tm) are not observed in differential scanning calorimetry (DSC) analysis. At this time, the DSC analysis can be performed within the range of -80 to 60 °C at a rate of 10 °C / min, for example, after raising the temperature from 25 °C to 60 °C at the above rate, the temperature is reduced to -80 °C again, It can be made in a way that the temperature is raised to 60 ℃ again. In addition, in the above, "sufficiently low crystallinity" means that the melting point (Tm) observed in DSC analysis is less than 15 °C, about 10 °C or less, 5 °C or less, 0 °C or less, -5 °C or less, -10 °C or less, or about -20°C or less. At this time, the lower limit of the melting point is not particularly limited, but, for example, the melting point may be about -80°C or more, about -75°C or more, or about -70°C or more. When the polyol is crystalline or does not satisfy the above melting point range, when the crystallinity is strong (at room temperature), the viscosity difference according to the temperature tends to be large, so the dispersion degree of the filler and the viscosity of the final mixture in the process of mixing the filler and the resin It may adversely affect the performance and reduce fairness, and as a result, it may be difficult to satisfy the cold resistance, heat resistance and water resistance required in the adhesive composition for a battery module.

In one example, the resin component included in the urethane-based composition may have a glass transition temperature (Tg) of less than 0° C. after curing (single curing).

When the glass transition temperature range is satisfied, brittle characteristics can be secured in a relatively short time even at a low temperature at which a battery module or a battery pack can be used, and accordingly, impact resistance or vibration resistance is guaranteed. can On the other hand, if the above range is not satisfied, there is a possibility that the tacky of the cured product may be too high or thermal stability may be deteriorated. In one example, the lower limit of the glass transition temperature of the urethane-based composition after curing may be about -70°C or more, -60°C or more, -50°C or more, -40°C or more, or about -30°C or more, and the upper limit is about −5° C. or less, −10° C. or less, −15° C. or less, or about −20° C. or less.

In addition, in the present application, an additive may be used to secure a function required according to the use of the resin composition and its use. For example, the resin composition may include a predetermined filler in consideration of the thermal conductivity, insulation, and heat resistance (TGA analysis) of the resin layer. The form or method in which a filler is contained in a resin composition is not restrict|limited in particular. For example, the filler may be used to form the urethane-based composition in a state previously included in the main resin and/or the curing agent. Alternatively, in the process of mixing the main resin and the curing agent, a separately prepared filler may be used in a manner in which it is mixed together.

In one example, at least, the filler included in the composition may be a thermally conductive filler. In the present application, the term thermally conductive filler may refer to a material having a thermal conductivity of about 1 W/mK or more, 5 W/mK or more, 10 W/mK or more, or about 15 W/mK or more. Specifically, the thermal conductivity of the thermally conductive filler may be about 400 W/mK or less, 350 W/mK or less, or about 300 W/mK or less. The type of the thermally conductive filler that can be used is not particularly limited, but may be a ceramic filler in consideration of insulation and the like. For example, _{ceramic particles such as alumina (Al 2} O ₃ ), aluminum nitride, boron nitride, silicon nitride, SiC or BeO may be used. The shape or ratio of the filler is not particularly limited, and it is appropriately adjusted in consideration of the viscosity of the urethane-based composition, the possibility of sedimentation in the resin layer in which the composition is cured, the desired thermal resistance or thermal conductivity, insulation, filling effect or dispersibility, etc. can be In general, as the size of the filler increases, the viscosity of the composition including the same increases, and the possibility that the filler settles in the resin layer increases. Also, the smaller the size, the higher the thermal resistance tends to be. Therefore, in consideration of the above points, a filler of an appropriate type and size may be selected, and if necessary, two or more types of fillers may be used together. In addition, although it is advantageous to use a spherical filler in consideration of the amount to be filled, a filler in the form of needles or plates may also be used in consideration of network formation or conductivity.

In one example, the composition may include a thermally conductive filler having an average particle diameter in a range of about 0.001 μm to about 80 μm. In another example, the average particle diameter of the filler may be about 0.01 μm or more, 0.1 μm or more, 0.5 μm or more, 1 μm or more, 2 μm or more, 3 μm or more, 4 μm or more, 5 μm or more, or about 6 μm or more. In another example, the average particle diameter of the filler is about 75 μm or less, 70 μm or less, 65 μm or less, 60 μm or less, 55 μm or less, 50 μm or less, 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 15 μm or less, 10 μm or less, or about 5 μm or less.

In order to obtain excellent heat dissipation performance, it may be considered that a high content of the thermally conductive filler is used. For example, the filler may be used within the range of about 50 to 2,000 parts by weight, based on 100 parts by weight of the total resin component, that is, the sum of the contents of the ester polyol resin and polyisocyanate. In another example, the content of the filler may be used in excess of the total resin component. Specifically, based on 100 parts by weight or more, 150 parts by weight or more, 200 parts by weight or more, 250 parts by weight or more, 300 parts by weight or more, 350 parts by weight or more, 400 parts by weight or more, 500 parts by weight or more, 550 parts by weight or more, 600 parts by weight or more, or about 650 parts by weight or more of the filler may be used.

As described above, when the thermally conductive filler is used in a high content, the viscosity of the main resin including the filler, the curing agent, or a composition including the same may increase.

As described, when the viscosity of the resin composition is too high, the injection processability is not good, and accordingly, the physical properties required for the resin layer may not be sufficiently implemented in the entire resin layer. In consideration of this, it is preferable to use a liquid or low-viscosity component capable of having sufficient flow as the resin component.

In addition to the above, various types of fillers may be used. For example, in order to secure the insulating properties of the resin layer in which the resin composition is cured, the use of a carbon (based) filler such as graphite may be considered. Alternatively, fillers such as, for example, fumed silica, clay, calcium carbonate, zinc oxide (ZnO) or aluminum hydroxide (Al(OH) ₃ ) may be used. The form or content ratio of these fillers is not particularly limited, and may be selected in consideration of the viscosity of the resin composition, the possibility of sedimentation in the resin layer, thixotropy, insulation, filling effect or dispersibility, and the like.

The composition may contain a viscosity modifier, for example, a thixotropic agent, a diluent, a dispersant, a surface treatment agent or a coupling agent, etc. to control the required viscosity, for example, to increase or decrease the viscosity or to control the viscosity according to shear force. It may contain additional

The thixotropic agent may adjust the viscosity according to the shear force of the resin composition so that the manufacturing process of the battery module can be effectively performed. As the thixotropic agent that can be used, fumed silica and the like can be exemplified.

Diluents or dispersants are generally used to lower the viscosity of the resin composition, and as long as they can exhibit the above action, various types of known in the art may be used without limitation.

The surface treatment agent is for surface treatment of the filler introduced into the resin layer, and various types known in the art may be used without limitation as long as it can exhibit the above-described action.

In the case of the coupling agent, for example, it may be used to improve the dispersibility of the thermally conductive filler such as alumina, and if it can exhibit the above action, various types of known in the art may be used without limitation.

In addition, the resin composition may further include a flame retardant or a flame retardant auxiliary agent. In this case, a known flame retardant may be used without any particular limitation, for example, a flame retardant in the form of a solid filler or a liquid flame retardant may be applied. Examples of the flame retardant include organic flame retardants such as melamine cyanurate and inorganic flame retardants such as magnesium hydroxide. When the amount of filler filled in the resin layer is large, a liquid type flame retardant material (TEP, Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate, etc.) may be used. In addition, a silane coupling agent capable of acting as a flame retardant synergist may be added.

The resin composition is another example for controlling the required viscosity, and the viscosity of the main composition and the curing agent composition can be adjusted by controlling the manufacturing conditions of the main composition containing the polyol resin or the curing agent composition containing the isocyanate, and through this, the main composition and the curing agent composition can be adjusted. The viscosity of the resin composition, which is a mixture of the composition and the curing agent composition, may also be adjusted. For example, when preparing a main composition including a main resin, a filler, and a catalyst, increasing the mixing time or mixing rpm may increase the viscosity of the main composition. As another example, when preparing a curing agent composition including isocyanate and a filler, increasing the mixing time or mixing rpm may increase the viscosity of the curing agent composition.

The resin composition may include the composition as described above, and may be a solvent-based composition, an aqueous composition, or a non-solvent composition, but in consideration of the convenience of the manufacturing process, the solvent-free type may be appropriate.

The resin composition of the present application may have physical properties suitable for uses described below after curing. In relation to physical properties, the expression “after curing” may be used in the same meaning as the deep curing described above.

In one example, the resin composition may have a _{predetermined adhesive strength (S 1 ) at room temperature after curing.} Specifically, the resin layer may have an adhesive strength of about 150 gf/10mm or more, 200 gf/10mm or more, 250 gf/10mm or more, 300 gf/10mm or more, 350 gf/10mm or more, or about 400 gf/10mm or more. When the adhesive force satisfies the above range, appropriate impact resistance and vibration resistance can be ensured. The upper limit of the adhesive strength of the resin layer is not particularly limited, and for example, about 1,000 gf/10mm or less, 900 gf/10mm or less, 800 gf/10mm or less, 700 gf/10mm or less, 600 gf/10mm or less, or about 500 gf or less. It may be about /10mm or less. If the adhesive force is too high, there is a risk of tearing the cured composition and the pouch portion to which it is attached. Specifically, if an impact occurs to the extent that the shape of the battery module is deformed due to an accident while driving, if the battery cell is attached too strongly through the cured resin layer, the pouch is torn and hazardous substances inside the battery are exposed or exploded can do. The adhesion can be measured for an aluminum pouch. For example, an aluminum pouch used for manufacturing a battery cell is cut to a width of about 10 mm, a resin composition is loaded on a glass plate, and the cut aluminum pouch is placed on the PET (poly(ethylene terephthalate)) of the pouch. After loading so that the surface and the resin composition are in contact, the resin composition is cured for 24 hours at 25° C. and 50 %RH conditions, and the aluminum pouch is subjected to a peeling angle of 180° and 300 mm/min with a tensile tester (texture analyzer). The adhesive force can be measured while peeling at a peeling rate of .

In another example, the adhesive strength after curing of the resin composition may be maintained at a significant level even under high temperature/high humidity. _{Specifically, in the present application, with respect to the adhesive force (S 1} ) after curing measured at room temperature, the adhesive _{force (S 2} ) measured in the same manner after a high temperature/high humidity acceleration test performed under a predetermined condition is % The ratio [(S ₂ /S ₁ ) x 100] may be 70% or more, or 80% or more. In one example, the high-temperature/high-humidity accelerated test may be measured after storing the same specimen as the specimen used to measure the room temperature adhesion at a temperature of 40 to 100° C. and a humidity condition of 75% RH or more for 10 days. When the above adhesive force and relationship are satisfied, excellent adhesion durability may be maintained even if the usage environment of the battery module is changed.

In one example, the resin composition may have excellent heat resistance after curing. In this regard, in the composition of the present application, the temperature of 5 % weight loss is 120° C. during thermogravimetric analysis (TGA) measured for a cured product of only the resin component in a state that does not include a filler. may be more than In addition, the composition of the present application may have a residual amount of 800° C. of 70% by weight or more during thermogravimetric analysis (TGA) measured on the cured product of the resin composition in a state including the filler. In another example, the remaining amount at 800°C may be about 75% by weight or more, 80% by weight or more, 85% by weight or more, or about 90% by weight or more. The remaining amount at 800°C may be about 99% by weight or less in another example. At this time, thermogravimetric analysis (TGA), 60 cm ³ / min nitrogen (N ₂ ) It can be measured in the range of 25 to 800 ℃ at a temperature increase rate of 20 ℃ / min in an atmosphere. The heat resistance properties related to the thermogravimetric analysis (TGA) can be secured by adjusting the type or content of the resin and/or filler.

In one example, the resin composition may provide excellent electrical insulation after curing. When the resin layer exhibits electrical insulation in the battery module structure to be described below, the performance of the battery module may be maintained and stability may be secured. For example, when the dielectric breakdown voltage of the cured product is measured after 24 hours of mixing the components of the resin composition, the breakdown voltage is about 10 kV/mm or more, 15 kV/mm or more, or about 20 kV/mm may be more than The higher the breakdown voltage, the higher the resin layer exhibits excellent insulation, so the upper limit is not particularly limited, but considering the composition of the resin layer, about 50 kV/mm or less, 45 kV/mm or less, 40 kV/mm or less, 35 kV/mm or less, or about 30 kV/mm or less. The dielectric breakdown voltage may be measured in accordance with ASTM D149, as described in Examples below. In addition, the dielectric breakdown voltage in the above range may be secured, for example, by adjusting the filler or resin component or their content used in the resin composition.

In another example related to the present application, the present application relates to a battery module. The module includes a module case and a battery cell. The battery cell may be accommodated in the module case. One or more battery cells may be present in the module case, and a plurality of battery cells may be accommodated in the module case. The number of battery cells accommodated in the module case is not particularly limited as it is adjusted according to the use or the like. The battery cells accommodated in the module case may be electrically connected to each other.

The module case may include at least a side wall and a lower plate that form an internal space in which the battery cell can be accommodated. In addition, the module case may further include an upper plate sealing the inner space. The side wall, the lower plate, and the upper plate may be integrally formed with each other, or the module case may be formed by assembling the separate side walls, the lower plate, and/or the upper plate, respectively. The shape and size of the module case are not particularly limited, and may be appropriately selected depending on the purpose or the shape and number of battery cells accommodated in the inner space.

In the above, the terms upper plate and lower plate are terms of a relative concept used to distinguish between at least two plates constituting the module case. That is, it does not mean that the upper plate necessarily exists in the upper part and the lower plate necessarily exists in the lower part in an actual use state.

2 is a view showing an exemplary module case 10, and is an example of a box-shaped case 10 including one lower plate 10a and four side walls 10b. The module case 10 may further include an upper plate 10c sealing the inner space.

FIG. 3 is a schematic view of the module case 10 of FIG. 2 in which the battery cells 20 are accommodated, as viewed from above.

A hole may be formed in the lower plate, the side wall, and/or the upper plate of the module case. The hole may be an injection hole used to inject a material for forming the resin layer, that is, a resin composition, when the resin layer is formed by an injection process. The shape, number, and position of the holes may be adjusted in consideration of injection efficiency of the resin layer forming material. In one example, the hole may be formed in at least the lower plate and/or the upper plate.

In one example, the hole may be formed at about 1/4 to 3/4 of the entire length of the side wall, the lower plate, or the upper plate, or about 3/8 to 7/8, or approximately in the middle. By injecting the resin composition through the injection hole formed at this point, the resin layer can be injected so as to have a wide contact surface. The 1/4, 3/4, 3/8 or 7/8 point is, for example, as shown in FIG. 4, the total length (L) measured based on the end face (E) of any one of the lower plate or the like. ), the ratio of the distance (A) to the formation location of the hole. In addition, the end (E) at which the length (L) and the distance (A) are formed may be any end (E) as long as the length (L) and the distance (A) are measured from the same end (E). have. In FIG. 4 , the injection hole 50a is positioned approximately in the middle of the lower plate 10a.

The size and shape of the injection hole are not particularly limited, and may be adjusted in consideration of injection efficiency of the resin layer material. For example, the hole may have a polygonal or amorphous shape such as a circle, an ellipse, a triangle or a square. The number and spacing of the injection holes are not particularly limited, and the resin layer may be adjusted to have a large contact area with the lower plate and the like.

An observation hole (eg, 50b in FIG. 4 ) may be formed at the ends of the upper plate and the lower plate in which the injection hole is formed. This observation hole, for example, may be formed to observe whether the injected material is well injected to the end of the side wall, the lower plate, or the upper plate when the resin layer material is injected through the injection hole. The position, shape, size, and number of the observation holes are not particularly limited as long as they are formed so as to confirm whether the injected material is properly injected.

The module case may be a thermally conductive case. The term thermally conductive case refers to a case having an overall thermal conductivity of 10 W/mk or more, or at least including a portion having the above-described thermal conductivity. For example, at least one of the aforementioned sidewall, lower plate, and upper plate may have the aforementioned thermal conductivity. In another example, at least one of the side wall, the lower plate, and the upper plate may include a portion having the thermal conductivity. For example, the battery module of the present application may include a first filler-containing cured resin layer in contact with the upper plate and the battery cell, and a second filler-containing cured resin layer in contact with the lower plate and the battery cell. The cured resin layer containing two fillers may be a thermally conductive resin layer, and thus at least the lower plate may have thermal conductivity or may include a thermally conductive portion.

The thermal conductivity of the thermally conductive upper plate, lower plate, sidewall, or thermally conductive portion is, in another example, about 20 W/mk or more, 30 W/mk or more, 40 W/mk or more, 50 W/mk or more, 60 W /mk or more, 70 W/mk or more, 80 W/mk or more, 90 W/mk or more, 100 W/mk or more, 110 W/mk or more, 120 W/mk or more, 130 W/mk or more, 140 W/mk or more or more, 150 W/mk or more, 160 W/mk or more, 170 W/mk or more, 180 W/mk or more, 190 W/mk or more, or about 195 W/mk or more. The higher the thermal conductivity, the more advantageous in terms of heat dissipation characteristics of the module, and the upper limit thereof is not particularly limited. In one example, the thermal conductivity is about 1,000 W/mK or less, 900 W/mk or less, 800 W/mk or less, 700 W/mk or less, 600 W/mk or less, 500 W/mk or less, 400 W/mk or less, 300 W/mk or about 250 W/mK or less, but is not limited thereto. The type of material exhibiting the above thermal conductivity is not particularly limited, and for example, a metal material such as aluminum, gold, silver, tungsten, copper, nickel, or platinum may be used. The module case may be entirely made of the thermally conductive material as described above, or at least a portion of the module case may be made of the thermally conductive material. Accordingly, the module case may have thermal conductivity within the above-mentioned range, or may include at least one portion having the above-mentioned thermal conductivity.

In the module case, a portion having thermal conductivity within the above range may be a portion in contact with a resin layer and/or an insulating layer, which will be described later. In addition, the portion having the thermal conductivity may be a portion in contact with a cooling medium such as cooling water. In the case of having such a structure, heat generated from the battery cells may be effectively dissipated to the outside.

The type of battery cell accommodated in the module case is also not particularly limited, and all known various battery cells may be applied. In one example, the battery cell may be of a pouch type. Referring to FIG. 5 , the pouch-type battery cell 100 may include an electrode assembly, an electrolyte, and a pouch case.

5 is an exploded perspective view schematically showing the configuration of an exemplary pouch-type cell, and FIG. 6 is a combined perspective view of the configuration of FIG. 5 .

The electrode assembly 110 included in the pouch-type cell 100 may have a form in which one or more positive plates and one or more negative plates are disposed with a separator interposed therebetween. The electrode assembly 110 may be a winding type in which one positive electrode plate and one negative electrode plate are wound together with a separator, or a stack type in which a plurality of positive electrode plates and a plurality of negative electrode plates are alternately stacked with a separator interposed therebetween.

The pouch case 120 may be configured in a form including, for example, an outer insulating layer, a metal layer, and an inner adhesive layer. The exterior material 120 protects internal elements such as the electrode assembly 110 . The metal layer of the electrode assembly 110 may include a metal thin film such as aluminum to protect internal elements such as an electrolyte, and to compensate for electrochemical properties and heat dissipation by the electrode assembly 110 and the electrolyte. The metal thin film may be interposed between insulating layers formed of an insulating material in order to secure electrical insulation with elements such as the electrode assembly 110 and electrolyte or other elements outside the battery 100 . In addition, the pouch may further include a polymer resin layer (substrate) such as PET.

In one example, the exterior material 120 may include an upper pouch 121 and a lower pouch 122 , and at least one of the upper pouch 121 and the lower pouch 122 has a concave inner space (I). can be formed. The electrode assembly 110 may be accommodated in the inner space I of the pouch. A sealing part S is provided on the outer peripheral surfaces of the upper pouch 121 and the lower pouch 122 , and the sealing parts S are adhered to each other, so that the inner space in which the electrode assembly 110 is accommodated may be sealed.

Each electrode plate of the electrode assembly 110 is provided with an electrode tab, and one or more electrode tabs may be connected to an electrode lead. The electrode lead is interposed between the sealing part S of the upper pouch 121 and the lower pouch 122 and exposed to the outside of the exterior material 120 , thereby serving as an electrode terminal of the secondary battery 100 .

The shape of the pouch-type cell described above is only an example, and the battery cell applied in the present application is not limited to the above type. In the present application, all known pouch-type cells or other types of batteries may be applied as battery cells.

The battery module of the present application may further include a resin layer. Specifically, the battery module of the present application may include a cured resin layer in which the filler-containing composition is cured. The cured resin layer may be formed from the resin composition described above.

The battery module may include, as the resin layer, a first filler-containing cured resin layer in contact with the upper plate and the battery cell, and a second filler-containing cured resin layer in contact with the lower plate and the battery cell. At least one of the first and second filler-containing cured resin layers may include a cured product of the above-described resin composition, and thus may have the predetermined adhesive strength, cold resistance, heat resistance, and insulation properties described above. In addition, the first and second filler-containing cured resin layers may have the following characteristics.

In one example, the resin layer may be a thermally conductive resin layer. In this case, the thermal conductivity of the thermally conductive resin layer may be about 1.5 W/mK or more, 2 W/mK or more, 2.5 W/mK or more, 3 W/mK or more, 3.5 W/mK or more, or about 4 W/mK or more. . The thermal conductivity is about 50 W/mK or less, 45 W/mk or less, 40 W/mk or less, 35 W/mk or less, 30 W/mk or less, 25 W/mk or less, 20 W/mk or less, 15 W/ mk or less, 10 W/mK or less, 5 W/mK or less, 4.5 W/mK or less, or about 4.0 W/mK or less. When the resin layer is a thermally conductive resin layer as described above, the lower plate, the upper plate, and/or the sidewall to which the resin layer is attached may be a region having the aforementioned thermal conductivity of 10 W/mK or more. In this case, the portion of the module case showing the thermal conductivity may be a portion in contact with a cooling medium, for example, cooling water. The thermal conductivity of the resin layer is, for example, a value measured according to ASTM D5470 standard or ISO 22007-2 standard. The thermal conductivity of the resin layer as described above can be ensured, for example, by appropriately adjusting the filler included in the resin layer and the content ratio thereof, as described above.

In one example, the thermal resistance of the battery module to which the resin layer or the resin layer is applied in the battery module is about 5 K/W or less, 4.5 K/W or less, 4 K/W or less, 3.5 K/W or less, 3 K/W or less or about 2.8 K/W or less. When the resin layer or the battery module to which the resin layer is applied is adjusted so that the thermal resistance in the above range is displayed, excellent cooling efficiency or heat dissipation efficiency can be secured. A method of measuring the thermal resistance is not particularly limited, and for example, the thermal resistance may be measured according to ASTM D5470 standard or ISO 22007-2 standard.

In one example, the resin layer may be a resin layer formed to maintain durability even in a predetermined thermal shock test. For example, when one cycle consists of maintaining the temperature at a low temperature of about -40°C for 30 minutes and then raising the temperature to 80°C again and maintaining it for 30 minutes, after a thermal shock test in which the cycle is repeated 100 times, the module case of the battery module or It may be a resin layer that may not be peeled off from the battery cell or cracked. For example, when the battery module is applied to a product requiring a long warranty period (in the case of a vehicle, about 15 years or more), such as a vehicle, the above-described level of performance may be required to secure durability.

In one example, the resin layer may be a flame retardant resin layer. In the present application, the term flame retardant resin layer may mean a resin layer showing a V-0 grade in UL 94 V Test (Vertical Burning Test). This ensures safety against fires and other accidents that may occur in the battery module.

In one example, the resin layer may have a specific gravity of about 5 or less. The specific gravity may be about 4.5 or less, 4 or less, 3.5 or less, or about 3 or less in another example. The resin layer exhibiting specific gravity in this range is advantageous for manufacturing a lighter battery module. Since the specific gravity is advantageous in reducing the weight of the module as the numerical value is lower, the lower limit thereof is not particularly limited. For example, the specific gravity may be about 1.5 or more or about 2 or more. In order for the resin layer to exhibit specific gravity in the above range, the component added to the resin layer may be adjusted. For example, when the filler is added, a filler capable of ensuring desired thermal conductivity even at a low specific gravity, that is, a filler having a low specific gravity by itself or a method of applying a surface-treated filler may be used.

In one example, the resin layer preferably does not include a volatile material. For example, the resin layer may have a ratio of non-volatile components of 90 wt% or more, 95 wt% or more, or 98 wt% or more. In the above, the nonvolatile component and its ratio may be defined in the following manner. That is, the portion remaining after the resin layer is maintained at 100° C. for about 1 hour may be defined as a non-volatile component. Accordingly, the ratio of the non-volatile component may be measured based on the initial weight of the resin layer and the ratio after maintaining the resin layer at 100° C. for about 1 hour.

In one example, it may be advantageous for the resin layer to have a low shrinkage during or after curing. Through this, it is possible to prevent peeling or voids that may occur during the manufacturing or use of the module. The shrinkage rate may be appropriately adjusted within a range capable of exhibiting the above-described effects, and may be, for example, less than 5%, less than 3%, or less than about 1%. Since the shrinkage ratio is advantageous as the numerical value is lower, the lower limit thereof is not particularly limited.

In one example, the resin layer may have a low coefficient of thermal expansion (CTE) to prevent delamination or voids that may occur during the manufacturing or use of the module. The coefficient of thermal expansion may be, for example, less than about 300 ppm/K, less than 250 ppm/K, less than 200 ppm/K, less than 150 ppm/K, or less than about 100 ppm/K. Since the coefficient of thermal expansion is advantageous as the numerical value is lower, the lower limit thereof is not particularly limited.

In one example, in order to impart excellent durability or impact resistance to the battery module, the resin layer may have an appropriate level of tensile strength. For example, the resin layer may be configured to have a tensile strength of about 1.0 MPa or more.

In one example, the elongation of the resin layer may be appropriately adjusted. Through this, excellent impact resistance and the like are secured, and a module showing appropriate durability can be provided. The elongation may be adjusted in the range of, for example, about 10% or more or about 15% or more.

In one example, it may be advantageous for the resin layer to exhibit an appropriate hardness. For example, when the hardness of the resin layer is too high, the reliability may be adversely affected because the resin layer has a brittle characteristic. Considering this point, by adjusting the hardness of the resin layer, it is possible to secure impact resistance and vibration resistance, and to ensure durability of the product. The resin layer, for example, has a hardness of about 100 or less, 99 or less, 98 or less, 95 or less, or about 93 or less in a shore A type, or a hardness of less than 80, 70 or less in a shore D type, 65 or less or about 60 or less. The lower limit of the hardness is not particularly limited. For example, the hardness may be about 60 or more in the shore A type, or about 5 or more or about 10 or more in the shore 00 type. The hardness in the above range can be secured by adjusting the content of the filler.

By forming the cured resin layer satisfying the above characteristics in the battery module as described above, a battery module having excellent durability against external shock or vibration can be provided.

In the battery module of the present application, at least one of the sidewall, the lower plate, and the upper plate in contact with the resin layer may be the aforementioned thermally conductive sidewall, lower plate, or upper plate. On the other hand, in this specification, the term contact means, for example, that the resin layer and the upper plate, lower plate and/or sidewall or battery cell are in direct contact, or other elements, for example, an insulating layer, etc. exist between them. It could mean the case. In addition, the resin layer in contact with the thermally conductive sidewall, the lower plate, or the upper plate may be in thermal contact with the object. At this time, in the thermal contact, the resin layer is in direct contact with the lower plate or the like, or there is another element, for example, an insulating layer to be described later, between the resin layer and the lower plate, etc., but the other element is the It may mean a state in which heat transfer from the battery cell to the resin layer and from the resin layer to the lower plate is not prevented. In the above, the fact that the transfer of heat is not hindered means that even when another element (eg, an insulating layer or a guiding part to be described later) exists between the resin layer and the lower plate, the total thermal conductivity of the other element and the resin layer. is about 1.5 W/mK or more, 2 W/mK or more, 2.5 W/mK or more, 3 W/mK or more, 3.5 W/mK or more, or about 4 W/mK or more, or is in contact with the resin layer and its It means that the total thermal conductivity of the lower plate, etc. is included in the above range even if the other elements are present. The thermal conductivity of the thermal contact is about 50 W/mK or less, 45 W/mk or less, 40 W/mk or less, 35 W/mk or less, 30 W/mk or less, 25 W/mk or less, 20 W/mk or less, 15 W/mk or less, 10 W/mK or less, 5 W/mK or less, 4.5 W/mK or less, or about 4.0 W/mK or less. Such thermal contact may be achieved by controlling the thermal conductivity and/or thickness of the other element, if present.

The thermally conductive resin layer may be in thermal contact with the lower plate and the like, and may also be in thermal contact with the battery cell. Through the adoption of the above structure, the heat dissipation characteristics are secured, and the unit volume while significantly reducing the various fastening parts or cooling equipment of the module, etc., which were previously required in the configuration of a general battery module or a battery pack, which is an aggregate of such modules. It is possible to implement a module in which more battery cells are accommodated per unit. Accordingly, in the present application, it is possible to provide a more compact, light and high-output battery module.

7 is an exemplary cross-sectional view of the battery module. In Figure 7, the module, the case 10 including a side wall (10b) and a lower plate (10a); It may have a form including a plurality of battery cells 20 accommodated inside the case and a resin layer 30 in contact with both the battery cells 20 and the case 10 . Although FIG. 7 is a view of the resin layer 30 present on the lower plate 10a side, the battery module of the present application may include a resin layer positioned on the upper plate side in the same manner as in FIG. 7 .

In the structure, the lower plate in contact with the resin layer 30 may be a thermally conductive lower plate as described above.

The contact area between the resin layer and the lower plate may be about 70% or more, about 75% or more, about 80% or more, about 85% or more, about 90% or more, or about 95% or more of the total area of the lower plate or the like. The upper limit of the contact area is not particularly limited, and may be, for example, 100% or less or less than about 100%.

When the upper plate or lower plate is thermally conductive and the cured resin layer in contact with it is also thermally conductive, the thermally conductive portion or the thermally conductive lower plate may be a portion in contact with a cooling medium such as cooling water. That is, as schematically shown in FIG. 7, heat (H) can be easily discharged to the lower plate by the above structure, and by contacting the lower plate and the like with the cooling medium (CW), even in a more simplified structure Heat can be easily dissipated.

The resin layer may have a thickness, for example, in the range of about 100 μm to 5 mm or in the range of about 200 μm to 5 mm. In the structure of the present application, the thickness of the resin layer may be set to an appropriate thickness in consideration of a desired heat dissipation characteristic or durability. The thickness may be the thickness of the thinnest part of the resin layer, the thickness of the thickest part, or the average thickness.

7, at least one surface of the inside of the module case 10, for example, a surface 10a in contact with the resin layer 30, a guiding part capable of guiding the battery cell 20 accommodated ( 10d) may be present. At this time, the shape of the guiding part 10d is not particularly limited, and an appropriate shape may be adopted in consideration of the shape of the applied battery cell. The guiding part 10d may be formed integrally with the lower plate or the like, or may be attached separately. The guiding part 10d may be formed using a thermally conductive material, for example, a metal material such as aluminum, gold, silver, tungsten, copper, nickel, or platinum in consideration of the above-described thermal contact. Also, although not shown in the drawings, an interleaving paper or an adhesive layer may exist between the battery cells 20 to be accommodated. In the above, the interleaf may serve as a buffer during charging and discharging of the battery cell.

In one example, the battery module may further include an insulating layer between the module case and the battery cell or between the resin layer and the module case. FIG. 8 exemplarily illustrates a case in which the insulating layer 40 is formed between the guiding portion 10d formed on the lower plate 10a of the case and the resin layer 30 . By adding an insulating layer, it is possible to prevent problems such as electric short circuit or fire caused by contact between the cell and the case due to an impact that may occur during use. The insulating layer may be formed using an insulating sheet having high insulating properties and thermal conductivity, or may be formed by coating or injecting a material exhibiting insulating properties. For example, in a method of manufacturing a battery module to be described later, a process of forming an insulating layer before injection of the resin composition may be performed. A so-called TIM (thermal interface material) or the like may be applied to the formation of the insulating layer. Alternatively, the insulating layer may be formed of an adhesive material. For example, the insulating layer may be formed using a resin layer with little or no filler such as a thermally conductive filler. As a resin component that can be used to form the insulating layer, acrylic resin, olefin resin such as PVC (poly(vinyl chloride)), PE (polyethylene), epoxy resin, silicone, or EPDM rubber ((ethylene propylene diene monomer rubber) The insulating layer may have a breakdown voltage of about 5 kV/mm or more, 10 kV/mm or more, 15 kV/mm measured according to ASTM D149, but is not limited thereto. or more, it may be 20 kV/mm or more, 25 kV/mm or more, or about 30 kV/mm or more.The breakdown voltage is not particularly limited as it shows excellent insulation as the value increases. For example, the insulation The dielectric breakdown voltage of the layer may be about 100 kV/mm or less, 90 kV/mm or less, 80 kV/mm or less, 70 kV/mm or less, or about 60 kV/mm or less. It can be set in an appropriate range in consideration of insulation or thermal conductivity, for example, about 5 μm or more, 10 μm or more, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm or more, 60 μm or more, 70 μm or more. or more, 80 μm or more, or about 90 μm or more The upper limit of the thickness is not particularly limited, for example, about 1 mm or less, 200 μm or less, 190 μm or less, 180 μm or less, 170 μm or less , 160 μm or less or about 150 μm or less.

In another example related to the present application, the present application relates to a battery module, for example, a method of manufacturing the above-mentioned battery module.

The manufacturing method of the present application includes the steps of injecting the resin composition in the above-described module case; It may include accommodating a battery cell in the module case and curing the resin composition to form the resin layer.

The order of the step of injecting the resin composition into the module case and the step of accommodating the battery cells in the module case is not particularly limited. For example, the resin composition may be injected into the module case first, and then the battery cells may be accommodated in that state, or the resin composition may be injected after the battery cells are first accommodated in the module case.

As a resin composition, the above-mentioned resin composition can be used.

A method of injecting the resin composition into the module case is not particularly limited, and a known method may be applied. For example, the resin composition is injected by pouring the resin composition into the opening of the module case, or the resin composition is injected by the above-described injection hole formed in the module case, the resin composition in both the battery cell and the battery module. A method of applying , etc. may be applied. For proper fixation, the injection process may be performed while constantly vibrating the battery module or battery cell.

A method of accommodating the battery cell in the module case in which the resin composition is injected or the module case in which the composition is injected is not particularly limited.

The storage of the battery cells may be performed by arranging the battery cells at a suitable position in the module case in consideration of a desired arrangement or the like. In addition, when the cartridge structure is present, the above step may be performed by placing the battery cell in an appropriate position of the cartridge structure, or inserting the cartridge structure in which the battery cell is located in the module case.

After accommodating the battery cells, the adhesion between the battery cells or the adhesion between the battery cells and the module case may be formed by curing the injected resin composition. A method of curing the resin composition is not particularly limited. In one example, when the composition is used, the resin composition may be cured by maintaining the resin composition at room temperature for a predetermined time (about 24 hours). Curing may be accelerated by applying heat for a certain period of time at a level that does not impair the thermal stability of the cell. For example, before curing or during the curing process or before or during storage of the battery cell, a temperature of less than 60 ° C, more specifically, heat in the range of about 30 ° C to 50 ° C is applied to reduce the tact time and improve fairness can be improved A cured product capable of forming adhesion between battery cells or adhesion between battery cells and a module case may have a conversion rate of at least 80% or more as described above.

In another example related to the present application, the present application relates to a battery pack, for example, a battery pack including two or more of the above-described battery modules. In the battery pack, the battery modules may be electrically connected to each other. A method of configuring a battery pack by electrically connecting two or more battery modules is not particularly limited, and any known method may be applied.

The present application also relates to a device including the battery module or the battery pack. Examples of the device include, but are not limited to, a vehicle such as an electric vehicle, and may be a device for any purpose requiring a secondary battery as an output. In addition, a method of configuring the vehicle using the battery module or battery pack is not particularly limited, and a general method known in the related art may be applied.

According to an example of the present application, by presenting the load value and the load change rate of the resin composition as a reference, the injection process into the battery module is excellent, and a resin composition capable of preventing overload of injection equipment is provided. In addition, the composition has excellent insulation, heat dissipation, and adhesion after curing.

1 shows an exemplary mixer that may be applied in the present application.
2 shows an exemplary module case that can be applied in the present application.
3 schematically shows a form in which a battery cell is accommodated in a module case.
4 schematically shows an exemplary lower plate in which injection holes and observation holes are formed.
5 and 6 schematically illustrate exemplary battery pouches that may be used as battery cells.
7 and 8 schematically show the structure of an exemplary battery module.
9 is a photograph of an exemplary mixer.
10 is a photograph of an exemplary static mixer applied to the mixer.

Hereinafter, the resin composition of the present application will be described through Examples and Comparative Examples, but the scope of the present application is not limited by the ranges presented below.

Assessment Methods

1. Viscosity/TI

Viscosity was measured at a shear rate of 0.01/s to 10.0/s at room temperature using a rheometer (ARES). The viscosity mentioned in the examples is the viscosity at the point of the shear rate of 2.5/s, and the thixotropic index (TI) can be determined through the ratio of the viscosity at the point where the shear rate is 0.25/s and the point of 2.5/s.

2. Load value and load change rate

The load value (kgf) of the resin composition was measured using a mixer 1 constructed by combining two cartridges 2a and 2b and a static mixer 5 as shown in FIG. 1 .

As for the cartridges 2a and 2b (Sulzer, AB050-01-10-01) in the mixer configured as shown in FIG. 1, the resin injection part is a circle with a diameter of 18 mm, and the discharge parts 4a and 4b are circular with a diameter of 3 mm. , the cartridges (2a, 2b) are 100mm in height and have an internal volume of 25ml. In addition, as the static mixer 5 (Sulzer, MBH-06-16T), a circular discharge part 7 having a diameter of 2 mm was used. The static mixer is of a stepped type, and the number of elements is 16. 9 is a photograph of the manufactured mixer, and FIG. 10 is a photograph of a static mixer applied to the mixer.

As the pressing means 3, 3a, 3b in the configuration as shown in FIG. 1, TA (Texture Analyser) was applied.

After the main resin is filled in any one of the two cartridges 2a and 2b, and the curing agent is filled in the other cartridge, a certain force is applied to the pressing means 3, 3a, 3b through the discharge parts 4a and 4b. After mixing in the static mixer (5), the load value was measured while allowing it to be discharged to the discharge unit (7).

The initial load value (Li) is obtained by injecting the main resin and the curing agent into the two cartridges 2a and 2b, respectively, and pressurizing it with a texture ananlyer (TA) 3a, 3b at a constant speed of 1 mm/s, and the static mixer In (5), the main resin and curing agent are injected, and the force required for the pressing means is measured from the time it is first discharged after mixing in the mixer (5), and the maximum value is obtained at the point where the force becomes the maximum value. It was set as the said initial load value (Li). The maximum value is a maximum value initially identified in the process, and is a maximum value at a point where the required force is initially decreased while increasing, or a maximum value at a point where it first converges. And, when the time points at which the maximum values are checked are different from the two pressing means 3a and 3b, the initial load value Li is the maximum value initially checked.

The time-dependent load value (Lf) is obtained by injecting the main resin and the curing agent into the static mixer 5 using the pressurizing means TA, 3a, and 3b, respectively, in the same manner as described above, and the resin composition injected into the static mixer 5 is When the pressure reaches 95% of the capacity (volume) of the mixer 5, the pressurization is stopped, and after the stop time has elapsed for 3 minutes, the TA (Texture ananlyer) 3a, 3b is used again at a constant speed of 1 mm/s. When the resin composition is first discharged through the discharge unit of the static mixer under pressure, the required force is measured, and the maximum value at the point at which the force becomes the maximum value was taken as the load value over time (Lf). The maximum value is a maximum value initially identified in the process, and is a maximum value at a point where the required force is initially decreased while increasing, or a maximum value at a point where it first converges. And, when the timing at which the maximum value is confirmed in the two pressing means 3a and 3b is different, the time-lapse load value Lf is the maximum value initially checked.

The load change rate (Lf/Li) can be determined through the ratio of the initial load value (Li) measured immediately after the main resin and curing agent are mixed and the load value over time (Lf) measured 3 minutes after the main resin and curing agent are mixed. have.

3. Fairness

If the filling time for dispensing is less than 3 minutes and there is no overflow in the jig manufactured by dispensing, it is marked as O, and the filling time for dispensing has passed 3 minutes or the jig manufactured by dispensing In case of overflow, it is indicated by X.

4. Equipment load

When the main resin and hardener are mixed and the measured load value (kgf) over time (kgf) exceeds 50 kgf 3 minutes after mixing, when the equipment material itself is deformed, such as warpage, or when the equipment makes noise It is marked with X, and O is indicated if there is no relevant item.

Example 1

Main resin: The main resin is a caprolactone-based polyol represented by the following Chemical Formula 2, wherein the number of repeating units (m in Chemical Formula 2) is at a level of about 1 to 3, and R ₁ and R ₂ each have 4 carbon atoms. of alkylene, and as a polyol-derived unit (Y in Formula 2), a polyol containing a 1,4-butanediol unit mixed with a filler and a catalyst as described below was used.

[Formula 2]

Curing agent: As the curing agent, a mixture of polyisocyanate (HDI, Hexamethylene diisocyanate) with a filler as described below was used.

Filler: As the filler, an alumina filler was used, and an alumina filler in an amount equal to about 700 parts by weight relative to 100 parts by weight of the total of the polyol resin and polyisocyanate was divided and blended in equal amounts with the main resin and the curing agent.

Catalyst: Dibutyltin dilaurate (DBTDL: dibutyltin dilaurate) was used by mixing the amount as shown in Table 2 into the main resin.

The main resin was prepared by mixing the polyol resin, alumina filler, and catalyst with a planetary mixer. The mixing time applied during the mixing and the mixing speed (rpm) of the planetary mixer are summarized in Table 1 below. Meanwhile, the curing agent was prepared by mixing the polyisocyanate and the filler with a planetary mixer, and the mixing time and speed (rpm) at this time are summarized in Table 1 below.

The load value was measured with the two-part composition including the main resin and the curing agent prepared as described above.

Example 2

A two-part composition was prepared in the same manner as in Example 1, except that the amounts of filler and catalyst and mixing conditions were adjusted as shown in Tables 1 and 2 below, and this was applied to the measurement of the load value.

Example 3

A two-part composition was prepared in the same manner as in Example 1, except that the amounts of filler and catalyst and mixing conditions were adjusted as shown in Tables 1 and 2 below, and this was applied to the measurement of the load value.

Example 4

A two-part composition was prepared in the same manner as in Example 1, except that the amounts of filler and catalyst and mixing conditions were adjusted as shown in Tables 1 and 2 below, and this was applied to the measurement of the load value.

Comparative Example 1

A two-part composition was prepared in the same manner as in Example 1, except that the amounts of filler and catalyst and mixing conditions were adjusted as shown in Tables 1 and 2 below, and this was applied to the measurement of the load value.

Comparative Example 2

A two-part composition was prepared in the same manner as in Example 1, except that the amounts of filler and catalyst and mixing conditions were adjusted as shown in Tables 1 and 2 below, and this was applied to the measurement of the load value.

Comparative Example 3

A two-part composition was prepared in the same manner as in Example 1, except that the amounts of filler and catalyst and mixing conditions were adjusted as shown in Tables 1 and 2 below, and this was applied to the measurement of the load value.

In Table 1 below, the viscosity is the viscosity of the prepared resin composition in which the main resin and the curing agent are mixed, and the filler amount is a weight part based on 100 parts by weight of a total of 100 parts by weight of the polyol resin of the main resin and the polyisocyanate of the curing agent. It was divided in half, and half was mixed with the main resin, and the other half was mixed with the curing agent. In addition, the relative value of the catalyst in Table 2 means the content of the catalyst in the entire resin composition. From Table 1 below, it can be seen that the viscosity of the final resin composition can be controlled by adjusting the amount of filler and mixing conditions to be blended.

Viscosity
(cP) filler amount
(parts by weight) Conditions for preparing the subject composition Curing agent composition preparation conditions mixing time mixing rpm mixing time mixing rpm Example 1 250,000 700 4 10 4 10 Example 2 310,000 700 6 5 6 5 Example 3 200,000 700 3 10 3 10 Example 4 260,000 700 4 10 4 10 Comparative Example 1 120,000 600 4 10 4 10 Comparative Example 2 450,000 800 4 10 4 10 Comparative Example 3 240,000 700 4 5 4 5

TI catalyst content
Relative value (% by weight) Load value (Li)
(kgf) Load value (Lf)
(kgf) load change rate
(Lf/Li) Example 1 2.2 0.1 22 28 1.27 Example 2 1.5 0.1 35 39 1.11 Example 3 2.6 0.12 15 25 1.67 Example 4 2.3 0.3 19 48 2.53 Comparative Example 1 1.2 0.2 8 28 3.50 Comparative Example 2 3.0 0.1 42 49 1.17 Comparative Example 3 1.3 0.3 13 65 5.0

fairness equipment load Example 1 O O Example 2 O O Example 3 O O Example 4 O O Comparative Example 1 X
(Over flow) O Comparative Example 2 X
(Filling time more than 3 minutes) O Comparative Example 3 O X

From Tables 2 and 3, Examples 1 to 4 that satisfy the conditions related to the load value and the load change rate of the present application have excellent fairness, and no load is generated on the equipment, but do not satisfy the conditions of the load value and the load change rate In the case of Comparative Examples 1 to 3, it can be seen that fairness is not good, or a load occurs on the equipment.

Specifically, when the initial load value is less than 10 as in Comparative Example 1, overflow may occur in the jig due to insufficient curing of the resin composition, and as in Comparative Example 2, the initial load value exceeds 40 In this case, the filling time of the resin composition may be 3 minutes due to overcuring of the resin composition. And as in Comparative Example 3, when the main resin and the curing agent are mixed and the load value (Lf) over time measured after 3 minutes is more than 50 kgf or the load change rate is more than 3, warpage of the equipment material itself and/or noise may occur. can

1: mixer
2, 2a, 2b: cartridge
3, 3a, 3b: pressurizing means
4, 4a, 4b: first discharge unit
5: mixer
6, 6a, 6b: receiving part
7: second discharge unit
10: module case
10a: lower plate
10b: side wall
10c: top plate
10d: guiding part
20: battery cell
30: resin layer
50a: injection hole
50b: observation hall
40: insulating layer
100: pouch type cell
110: electrode assembly
120: exterior material
121: upper pabuchi
122: lower pouch
S: sealing part

Claims (22)

comprising a main resin and a curing agent;
The main resin includes a filler and a polyol resin, the curing agent includes a filler and a polyisocyanate,
Comprising 100 to 2,000 parts by weight of the filler, relative to the total of 100 parts by weight of the polyol resin and polyisocyanate,
A resin composition satisfying the following general formulas 1 and 2:
[General formula 1]
10 ≤ Initial load value (Li) ≤ 40
[General Formula 2]
1 ≤ Load change rate (Lf/Li) ≤ 3
In Formulas 1 and 2, Li is the initial load value (kgf) measured immediately after mixing the main resin and the curing agent, and Lf is the aging load value (kgf) measured 3 minutes after mixing the main resin and the curing agent to be. The resin composition according to claim 1, wherein Lf of the general formula 2 is 50 kgf or less. The viscosity of claim 1, wherein the viscosity measured at 2.5/s is 150,000 to 500,000 when measured in a shear rate range of 0.01 to 10.0/s at room temperature within 60 seconds after mixing the main resin and the curing agent. cP resin composition. The resin composition according to claim 1, wherein the thixotropic index measured at room temperature within 60 seconds after mixing the main resin and the curing agent is 1.5 or more. delete The resin composition of claim 1, wherein the polyol resin has a viscosity of less than 10,000 cP measured at a point of 2.5/s when measured in a shear rate range of 0.01 to 10.0/s at room temperature. delete The resin composition of claim 1, wherein the polyol resin is represented by the following Chemical Formula 1 or 2:
[Formula 1]

[Formula 2]

In Formulas 1 and 2, X is a carboxylic acid-derived unit, Y is a polyol-derived unit, n is a number within the range of 2 to 10, m is a number within the range of 1 to 10, and R ₁ and R ₂ are each independently alkylene having 1 to 14 carbon atoms. According to claim 8, wherein the carboxylic acid-derived unit X is selected from the group consisting of a fatty acid compound, an aromatic compound having two or more carboxyl groups, an alicyclic compound having two or more carboxyl groups, and an aliphatic compound having two or more carboxyl groups. A resin composition derived from one or more compounds. The resin composition according to claim 9, wherein the aromatic compound having two or more carboxyl groups is phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, tetrahydrophthalic acid, hexahydrophthalic acid or tetrachlorophthalic acid. The resin composition according to claim 9, wherein the alicyclic compound having two or more carboxyl groups is tetrahydrophthalic acid or hexahydrophthalic acid. 10. The method of claim 9, wherein the aliphatic compound having two or more carboxyl groups is oxalic acid, adipic acid, azelaic acid, sebacic acid, succinic acid, malic acid, glutaric acid, malonic acid, pimelic acid, suberic acid, 2,2- A resin composition comprising dimethylsuccinic acid, 3,3-dimethylglutaric acid, 2,2-dimethylglutaric acid, maleic acid, fumaric acid or itaconic acid. The resin composition according to claim 8, wherein the polyol-derived unit Y is derived from at least one compound selected from the group consisting of an alicyclic compound having two or more hydroxyl groups and an aliphatic compound having two or more hydroxyl groups. The resin composition according to claim 13, wherein the alicyclic compound having two or more hydroxyl groups is 1,3-cyclohexanedimethanol or 1,4-cyclohexanedimethanol. 14. The method of claim 13, wherein the aliphatic compound having two or more hydroxyl groups is ethylene glycol, propylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, 1,3-propanediol, 1,3-butanediol , 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,2-ethylhexyldiol, 1,5-pentanediol, 1,9-nonanediol, 1,10-decanediol, glycerin or trimethyl A resin composition which is roll propane. The resin composition according to claim 1, wherein the polyisocyanate is an alicyclic polyisocyanate, a carbodiimide-modified polyisocyanate of an alicyclic polyisocyanate, or an isocyanurate-modified polyisocyanate of an alicyclic polyisocyanate. According to claim 1, wherein the filler is, fumed silica, clay, calcium carbonate (CaCO ₃ ), zinc oxide (ZnO), aluminum hydroxide (Al(OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (aluminum nitride) ), boron nitride (boron nitride), silicon nitride (silicon nitride), SiC, BeO or a resin composition comprising a carbon filler. delete a module case having an upper plate, a lower plate, and a side wall, and having an internal space formed by the upper plate, lower plate, and side wall;
a plurality of battery cells present in the inner space of the module case; and
The cured layer of the resin composition according to claim 1, and a battery module comprising a resin layer in contact with at least one of the plurality of battery cells and a lower plate or a side surface. injecting the resin composition according to claim 1 into a module case having an upper plate, a lower plate, and a side wall, and having an internal space formed by the upper plate, the lower plate, and the side wall;
accommodating a plurality of battery cells in the module case; and
Method of manufacturing a battery module comprising the step of curing the resin composition. A battery pack comprising one or more other battery modules according to claim 19 . A motor vehicle comprising the battery pack according to claim 21 .

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