KR102260421B1 - Heat radiation thin film comprising carbon material and method of fabricating of the same - Google Patents

Abstract

A high heat dissipation thin film comprising a carbon material is provided. The high heat dissipation thin film including the carbon material includes a first metal film and a first carbon layer in direct contact with the first surface of the first metal film, wherein the first carbon layer includes graphite powder and a binder Or, it may include a graphitic carbon layer.

Description

A high heat dissipation thin film comprising a carbon material, and a method for manufacturing the same

The present invention relates to a high heat dissipation thin film and a method for manufacturing the same, and more particularly, to a high heat dissipation thin film containing a carbon material, and a method for manufacturing the same.

Recently, electronic devices used in automobiles, electric and electronic fields, etc. are being pursued to be lightweight, thin, miniaturized, and multifunctional. As these electronic devices become highly integrated, more heat is generated, and the emitted heat not only degrades the device's function, but also causes malfunctions of peripheral devices and substrate deterioration. is being done

Looking at the material components of heat dissipation materials, most of them are composite materials in which high thermal conductivity filler materials such as carbon materials or ceramic materials and polymer materials are mixed. The thermally conductive polymer can impart the characteristics of metal and ceramic materials while maintaining the advantages of existing polymer materials, such as easy processability, low cost, light weight, and variety of product types. In addition, the reason for using the composite material is that the high thermal conductivity inorganic filler material has excellent thermal conductivity but no adhesion, and the polymer material has excellent adhesion but low thermal conductivity. However, in order to achieve high thermal conductivity of the polymer composite material, a large amount of filler is added. In this case, processing conditions become difficult and the physical properties of the product are impaired.

Republic of Korea Patent Registration No. 10-1534232 discloses an invention that effectively reduces the temperature of the heat source of electric and electronic products whose space has been narrowed due to integration by using a heat sink having a high heat dissipation radiation organic and inorganic composite coating thin film. .

One technical problem to be solved by the present invention is to provide a high heat dissipation thin film including a carbon material having improved heat dissipation properties and a method for manufacturing the same.

Another technical problem to be solved by the present invention is to provide a high heat dissipation thin film including a carbon material in which a manufacturing process is simplified and a manufacturing method thereof.

Another technical problem to be solved by the present invention is to provide a high heat dissipation thin film including a carbon material with reduced manufacturing cost and a method for manufacturing the same.

The technical problem to be solved by the present invention is not limited to the above.

· In order to solve the above technical problem, the present application provides a method of manufacturing a high heat dissipation thin film including a carbon material.

According to an embodiment, the method for manufacturing a high heat dissipation thin film including the carbon material includes the steps of preparing a first metal film, and forming a first carbon layer in direct contact with the first surface of the first metal film. However, the forming of the first carbon layer may include providing carbon ions to the first surface of the first metal layer and heat-treating the first metal layer provided with the carbon ions.

According to an embodiment, the method for manufacturing a high heat dissipation thin film including the carbon material further comprises forming a second carbon layer on a second surface facing the first surface of the first metal film, The forming of the second carbon layer may include preparing a carbon coating material including graphite powder and a binder, and coating the second surface of the first metal layer.

According to an embodiment, the first carbon layer may include a graphitic carbon layer, and the second carbon layer may include a thickness thicker than the first carbon layer.

According to an embodiment, the method of manufacturing the high heat dissipation thin film including the carbon material may include a carbon material further comprising adhering a second metal film on the first carbon layer.

In order to solve the above technical problem, the present application provides a high heat dissipation thin film including a carbon material.

According to an embodiment, the high heat dissipation thin film including the carbon material includes a first metal film and a first carbon layer in direct contact with the first surface of the first metal film, wherein the first carbon layer comprises: It may include a graphitic carbon layer.

According to an embodiment, the high heat dissipation thin film including the carbon material further includes a second carbon layer on a second surface facing the first surface of the first metal film, wherein the second carbon layer is graphite. It may include a powder and a binder.

According to an embodiment, the high heat dissipation thin film including the carbon material may further include a second metal film adhered to the first carbon layer by an adhesive layer.

A high heat dissipation thin film comprising a carbon material according to an embodiment of the present invention includes a first metal film, and a first carbon layer in direct contact with the first surface of the first metal film, wherein the first carbon layer is It may include a graphitic carbon layer.

Alternatively, the high heat dissipation thin film including the carbon material further includes a second carbon layer on a second surface facing the first surface of the first metal film, wherein the first carbon layer is a graphitic carbon layer and , The second carbon layer may include graphite powder and a binder.

Accordingly, a high heat dissipation thin film including a carbon material having improved heat dissipation characteristics may be provided.

1 is a view for explaining a high heat dissipation thin film including a carbon material and a method of manufacturing the same according to a first embodiment of the present invention.
2 is a view for explaining a high heat dissipation thin film including a carbon material and a method of manufacturing the same according to a second embodiment of the present invention.
3 is a view for explaining a high heat dissipation thin film including a carbon material and a method of manufacturing the same according to a third embodiment of the present invention.
4 is a view showing the structure of the heat dissipation thin film according to Experimental Examples 1-1 to 1-8 of the present invention.
5 is a view for explaining a method for measuring heat dissipation characteristics of a heat dissipation thin film according to Experimental Examples 1-1 to 1-8 of the present invention.
6 is a view for explaining another method of measuring the heat dissipation characteristics of the heat dissipation thin film according to Experimental Examples 1-1 to 1-8 of the present invention.
7 is a view showing the structure of a heat dissipation thin film according to Experimental Examples 2-1 to 2-12 of the present invention.
FIG. 8 is a graph of measuring the thermal conductivity of the heat dissipation thin films according to Experimental Example 3-1 to Experimental Example 3-3, Comparative Example 3-1, and Comparative Example 3-2 of the present invention.
9 is a graph of measuring the thermal conductivity according to the heat treatment temperature of the heat dissipation thin film according to Experimental Example 3-3 of the present invention.
10 is a graph of measuring the thermal conductivity of the high heat dissipation thin film according to Experimental Examples 4-1 to 4-6 of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In this specification, when a component is referred to as being on another component, it means that it may be directly formed on the other component or a third component may be interposed therebetween. In addition, in the drawings, thicknesses of films and regions are exaggerated for effective description of technical content.

Also, in various embodiments of the present specification, terms such as first, second, third, etc. are used to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another. Accordingly, what is referred to as a first component in one embodiment may be referred to as a second component in another embodiment. Each embodiment described and illustrated herein also includes a complementary embodiment thereof. In addition, in the present specification, 'and/or' is used to mean including at least one of the elements listed before and after.

In the specification, the singular expression includes the plural expression unless the context clearly dictates otherwise. In addition, terms such as "comprise" or "have" are intended to designate that a feature, number, step, element, or a combination thereof described in the specification is present, and one or more other features, numbers, steps, configuration It should not be construed as excluding the possibility of the presence or addition of elements or combinations thereof. Also, in the present specification, the term “connection” is used to include both indirectly connecting a plurality of components and directly connecting a plurality of components.

In addition, in the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

1 is a view for explaining a high heat dissipation thin film including a carbon material and a method of manufacturing the same according to a first embodiment of the present invention.

Referring to FIG. 1 , a high heat dissipation thin film 100a including a carbon material according to the first embodiment of the present invention may include a metal film 110 , a carbon layer 120 , and an adhesive layer 130 . .

The metal layer 110 may be made of copper, aluminum, or an alloy thereof. For example, the thickness of the metal layer 110 may be 72 μm.

The carbon layer 120 may be disposed on the first surface of the metal layer 110 . According to an embodiment, the forming of the carbon layer 120 may include providing carbon ions on the first surface of the metal film 110 to form a preliminary carbon layer, the metal film 110 . and heat-treating the preliminary carbon layer to form the carbon layer 120 on the metal film 110 .

According to an embodiment, the providing of the carbon ions on the metal layer 110 may include disposing the metal layer 110 in a chamber, and applying energy to a carbon source in the chamber, so that the carbon releasing the carbon ions from a source. Specifically, the carbon ions may be emitted by disposing a carbon ingot in a chamber and applying heat or electric energy to the carbon ingot. In this case, the chamber may be in an inert gas (eg, argon gas) atmosphere, and may have a pressure condition of 10 to 15 mTorr. The preliminary carbon layer may be formed by depositing the carbon ions on the metal layer 110 . According to an embodiment, the carbon atoms in the preliminary carbon layer may be in a randomly arranged state.

According to an embodiment, the metal layer 110 may be pretreated so that the carbon ions can be easily deposited on the metal layer 110 . Specifically, for example, a passivation film (eg, an oxide film) may be formed on the metal film 110 , and the carbon ions are inserted into the metal film 110 by the passivation film. can be reduced. On the other hand, when a plurality of the carbon ions are inserted into the metal layer 110 , it is not easy to form the preliminary carbon layer on the metal layer 110 . In this case, the heat treatment of the preliminary carbon layer It is not easy to manufacture the carbon layer 120 by For example, the passivation film may be an oxide film as described above, or a metal alloy film, specifically, an alloy film of nickel (Ni) and chromium (Cr) (nickel and chromium ratio of 95:5). . Accordingly, the carbon layer 120 may be easily fixedly attached to the metal film 110 .

By the heat treatment, the carbon atoms in the preliminary carbon layer may be rearranged in an arbitrarily arranged state. Accordingly, the carbon layer 120 may be a graphitic carbon layer formed by rearranging the carbon atoms in the preliminary carbon layer.

According to an embodiment, the heat treatment temperature may be controlled according to the type of the metal film 110 , and accordingly, the thermal conductivity of the thin film including the metal film 110 and the carbon layer 120 is controlled. can be Specifically, for example, when the metal layer 110 includes aluminum, when the heat treatment is performed at 350° C. or less or 500° C. or higher, thermal conductivity may be reduced. Accordingly, when the metal layer 110 includes aluminum, the heat treatment may be performed at a temperature greater than 350°C and less than 500°C. Alternatively, for another example, when the metal layer 110 includes copper, when the heat treatment is performed at 500° C. or less or 900° C. or higher, thermal conductivity may be reduced. Accordingly, when the metal layer 110 includes copper, the heat treatment may be performed at a temperature greater than 500°C and less than 900°C.

If the heat treatment is performed in an atmosphere containing oxygen or an atmosphere containing hydrogen, carbons included in the preliminary carbon layer react with oxygen and hydrogen to generate CO2 and CH3 gases, and thus, the preliminary carbon layer It is not easy to manufacture the carbon layer 120 from the carbon layer. Accordingly, according to an embodiment of the present invention, the heat treatment may be performed in an oxygen-free and anhydrous atmosphere. Specifically, the heat treatment may be performed in a nitrogen gas atmosphere or an inert gas (eg, argon) atmosphere.

The heat treatment may be performed in various ways. According to an embodiment, the heat treatment may be performed using a furnace. Alternatively, according to another embodiment, the heat treatment may be performed by a joule heating method. Specifically, the heat treatment may be performed by contacting a plurality of electrodes on the preliminary carbon layer and applying a current through the plurality of electrodes. In this case, a current path may be formed between the plurality of electrodes, and some regions of the preliminary carbon layer or the entire preliminary carbon layer adjacent to the current path are converted into the carbon layer 120 . can be Accordingly, the carbon layer 120 can be easily formed by locally applying high-temperature heat to the preliminary carbon layer while minimizing heat-induced damage to the metal layer 110 .

The adhesive layer 130 may be disposed on the carbon layer 120 . The adhesive layer 130 may be a pressure sensitive adhesive film. For example, the thickness of the adhesive layer 130 may be 32 μm.

2 is a view for explaining a high heat dissipation thin film including a carbon material and a method of manufacturing the same according to a second embodiment of the present invention.

Referring to FIG. 2 , a high heat dissipation thin film 100b including a carbon material according to a second embodiment of the present invention includes a metal film 110 , a first carbon layer 120a , a second carbon layer 120b , and an adhesive layer 130 .

The metal layer 110 may be made of copper, aluminum, or an alloy thereof. For example, the thickness of the metal layer 110 may be 70 μm.

The first carbon layer 120a may be disposed on the first surface of the metal layer 110 . The first carbon layer 120a may be the graphitic carbon layer described with reference to FIG. 1 . A thickness of the first carbon layer 120a may be thinner than a thickness of the second carbon layer 120b.

The second carbon layer 120b may be disposed on the second surface of the metal layer 110 . The second carbon layer 120b may include a carbon material (eg, graphite powder, graphene, CNT, etc.). For example, the thickness of the second carbon layer 120b may be 5 μm. According to an embodiment, the forming of the second carbon layer 120b includes preparing a carbon coating material including graphite powder and a binder, and coating the second surface of the metal film 110 . may include.

According to an embodiment, before the second carbon layer 120b is formed on the second surface of the metal film 110 , the first carbon layer 120a is larger than the second carbon layer 120b. First, it may be formed on the first surface of the metal layer 110 . Accordingly, damage and deterioration of the second carbon layer 120b may be prevented by the heat treatment process performed during the manufacturing process of the first carbon layer 120a.

The adhesive layer 130 may be disposed on the second carbon layer 120b. The adhesive layer 130 may be a pressure sensitive adhesive film. For example, the thickness of the adhesive layer 130 may be 25㎛.

3 is a view for explaining a high heat dissipation thin film including a carbon material and a method of manufacturing the same according to a third embodiment of the present invention.

Referring to FIG. 3 , a high heat dissipation thin film 100c including a carbon material according to a third embodiment of the present invention includes a first metal film 110a, a second metal film 110b, and a first carbon layer 120a. ), a second carbon layer 120b, a first adhesive layer 130a, and a second adhesive layer 130b.

The first metal layer 110a may be made of copper, aluminum, or an alloy thereof. For example, the thickness of the first metal layer 110 may be 25 μm.

The first carbon layer 120a may be disposed on the first surface of the first metal layer 110a. The first carbon layer 120a may be the graphitic carbon layer described with reference to FIG. 1 . A thickness of the first carbon layer 120a may be thinner than a thickness of the second carbon layer 120b.

The second carbon layer 120b may be disposed on the second surface of the first metal layer 110a. The second carbon layer 120b may include a carbon material (eg, graphite powder, graphene, CNT, etc.). For example, the thickness of the second carbon layer 120b may be 5 μm. According to an embodiment, the second carbon layer 120b may be formed by the method described with reference to FIG. 2 .

According to an embodiment, before the second carbon layer 120b is formed on the second surface of the metal film 110 , the first carbon layer 120a is larger than the second carbon layer 120b. First, it may be formed on the first surface of the first metal layer 110a.

The first adhesive layer 130a may be disposed on the second carbon layer 120b. The adhesive layer 130a may be a pressure sensitive adhesive film. For example, the thickness of the adhesive layer 130a may be 25 μm.

The second metal layer 110b may be made of copper, aluminum, or an alloy thereof. For example, the thickness of the second metal layer 110b may be 35 μm.

The second adhesive layer 130b may be provided between the second metal layer 110b and the first carbon layer 120a. That is, the second metal layer 110b may be adhered to the first carbon layer 120a by the second adhesive layer 130b.

The second adhesive layer 130b may be a pressure sensitive adhesive film. For example, the thickness of the second adhesive layer 130b may be 5 μm.

The first metal film 110a, the first carbon layer 120a, the second carbon layer 120b, and the first adhesive layer 130a are defined as a first film structure, and the second metal film 110b and the second adhesive layer 130b may be defined as a second film structure. According to an embodiment, after the first film structure and the second film structure are each manufactured, as described above, the first film structure and the second film structure are formed by the second adhesive layer 130b. Adhered to each other, it is possible to provide one high heat dissipation thin film.

Hereinafter, the characteristic evaluation result of the high heat dissipation thin film including the carbon material according to a specific experimental example of the present invention will be described.

4 is a view showing the structure of the heat dissipation thin film according to Experimental Examples 1-1 to 1-8 of the present invention.

Referring to FIG. 4 , as shown in FIG. 4 , heat dissipation thin films according to Experimental Examples 1-1 to 1-8 having the same thickness of 104 μm were prepared. In FIG. 4 , GB means a carbon layer prepared using the graphite powder and binder described with reference to FIGS. 2 and 3 , GCL means a graphitic carbon layer described with reference to FIG. 1 , and PSA is adhesive means layer.

5 is a view for explaining a method for measuring heat dissipation characteristics of a heat dissipation thin film according to Experimental Examples 1-1 to 1-8 of the present invention.

5, as shown in FIG. 5, prepare a heat source and specimen (heat dissipation thin film according to Experimental Example 1-1 to Experimental Example 1-8), and set the temperature in each region (Sp1 to Sp10) below. It was measured as shown in <Table 1> to <Table 4>. The temperature measurement was performed twice for each of the heat dissipation thin films according to Experimental Example 1-1 to Experimental Example 1-8, and the temperature condition of the heat source was set to 80°C, and in Experimental Examples 1-1 to 1-8 A 10 μm single-sided black PET tape was attached to the surface of the heat dissipation thin films.

As can be seen from <Table 1> to <Table 4> below, it can be confirmed that the use of the rolled copper film can improve the heat dissipation effect, compared to that using the electrolytically deposited copper film. In addition, it can be confirmed that the structure of Experimental Example 1-7, that is, the structure in which the adhesive layer, the graffiti carbon layer, and the metal film of rolled copper are sequentially stacked, has the best heat dissipation characteristics.

division Experimental Example 1-1 Experimental Example 1-2 round of experiments One 2 One 2 80℃ SP1 80.0 80.0 80.0 80.0 SP2 70.5 70.6 70.6 70.4 SP3 68.0 68.0 68.0 67.5 SP4 62.9 63.8 64.2 63.5 SP5 55.5 55.7 56.2 55.6 SP6 48.4 48.6 49.4 48.5 SP7 42.9 42.7 43.4 42.6 SP8 38.5 38.1 39.1 38.0 SP9 35.5 34.7 35.7 34.5 SP10 32.9 32.5 33.5 32.4 ΔT (SP2-SP10) 37.6 38.1 37.1 38.0 ΔT (SP2-SP10) average 37.9 37.6

division Experimental Example 1-3 Experimental Example 1-4 round of experiments One 2 One 2 80℃ SP1 80.0 80.0 80.0 80.0 SP2 70.7 70.8 71.1 70.4 SP3 68.5 68.6 68.9 68.1 SP4 64.0 63.8 64.8 64.1 SP5 56.1 55.9 57.2 56.4 SP6 48.9 49.1 50.0 49.4 SP7 43.2 43.4 44.3 43.3 SP8 38.7 38.9 39.7 38.8 SP9 35.7 35.8 36.4 35.3 SP10 33.2 33.2 34.1 33.1 ΔT (SP2-SP10) 37.5 37.6 37.0 37.3 ΔT (SP2-SP10) average 37.6 37.2

division Experimental Example 1-5 Experimental Example 1-6 round of experiments One 2 One 2 80℃ SP1 80.0 80.0 80.0 80.0 SP2 70.4 70.0 70.8 70.8 SP3 68.1 67.7 68.9 68.7 SP4 64.3 63.2 65.2 65.0 SP5 57.0 55.4 57.7 57.5 SP6 49.7 48.1 50.8 50.3 SP7 43.9 42.3 45.0 44.5 SP8 39.3 37.7 40.3 39.9 SP9 36.0 34.4 36.7 36.5 SP10 33.5 32.2 34.2 34.1 ΔT (SP2-SP10) 36.9 37.8 36.6 36.7 ΔT (SP2-SP10) average 37.4 36.7

division Experimental Example 1-7 Experimental Example 1-8 round of experiments One 2 One 2 80℃ SP1 80.0 80.0 80.0 80.0 SP2 70.5 70.5 70.6 70.5 SP3 68.0 68.0 68.3 68.2 SP4 64.5 63.5 64.2 63.9 SP5 57.0 56.7 56.7 56.3 SP6 50.5 49.9 50.1 49.5 SP7 44.6 44.5 44.6 43.7 SP8 40.3 40.0 40.0 39.3 SP9 36.8 36.7 36.7 36.2 SP10 34.7 34.3 34.5 34.1 ΔT (SP2-SP10) 35.8 36.2 36.1 36.4 ΔT (SP2-SP10) average 36.0 36.3

6 is a view for explaining another method of measuring the heat dissipation characteristics of the heat dissipation thin film according to Experimental Examples 1-1 to 1-8 of the present invention.

Referring to FIG. 6 , as shown in FIG. 6 , a heat source and a specimen (heat dissipation thin film according to Experimental Example 1-1 to Experimental Example 1-8) were prepared, and the specimen was set at 0 degrees, 90 degrees, 180 degrees, and 270 degrees. While rotating, the temperature in each region (Sp1 to Sp13) was measured as shown in <Table 5> to <Table 28> below. While varying the heat source temperature conditions to 50 °C, 80 °C, and 100 °C, temperature measurement was performed twice for the heat dissipation thin films according to Experimental Examples 1-1 to 1-8, respectively, and Experimental Examples 1-1 to A 10㎛ single-sided black PET tape was attached to the surface of the heat dissipation thin films according to Experimental Examples 1-8.

As can be seen from <Table 5> to <Table 28> below, when the rolled copper film is used, it can be confirmed that the heat dissipation effect is relatively high. In addition, it can be confirmed that the structure of Experimental Example 1-7, that is, the structure in which the adhesive layer, the graffiti carbon layer, and the metal film of rolled copper are sequentially stacked, has the best heat dissipation characteristics.

Classification (1st round) Experimental Example 1-1 Experimental Example 1-2 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 46.8 11.8 46.8 12 SP3 41.8 43 SP4 35 34.8 90°
rotation SP5 46.3 10.1 46.4 10.2 SP6 43.1 41.2 SP7 36.2 36.2 180°
rotation SP8 46.8 11.2 46.7 12 SP9 43 41.9 SP10 35.6 34.7 270°
rotation SP11 46.4 11.5 47 10.6 SP12 41.8 42.7 SP13 34.9 36.4 Ave. 11.2 11.2

Classification (1st round) Experimental Example 1-3 Experimental Example 1-4 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 47.1 11.7 47.8 11.3 SP3 42.7 43.3 SP4 35.4 36.5 90°
rotation SP5 45.7 11.3 46.5 12.4 SP6 41.6 41.3 SP7 34.4 34.1 180°
rotation SP8 47 10.5 46.3 13.6 SP9 43.1 39.5 SP10 36.5 32.7 270°
rotation SP11 45.4 11.7 46.2 10.4 SP12 39.9 43.1 SP13 33.7 35.8 Ave. 11.3 11.9

Classification (1st round) Experimental Example 1-5 Experimental Example 1-6 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 47 12.3 46.9 13 SP3 41.3 41.1 SP4 34.7 33.9 90°
rotation SP5 46.6 12.9 46.9 11.9 SP6 41.9 41.8 SP7 33.7 35 180°
rotation SP8 46.8 10.5 46.7 10.3 SP9 42.3 42.9 SP10 36.3 36.4 270°
rotation SP11 46.8 9.3 46.8 10.4 SP12 42.9 42.2 SP13 37.5 36.4 Ave. 11.3 11.4

Classification (1st round) Experimental Example 1-7 Experimental Example 1-8 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 46.8 11.1 46.5 12.5 SP3 40.8 41.3 SP4 35.7 34 90°
rotation SP5 46.6 11.1 46.5 11.2 SP6 41.9 41.9 SP7 35.5 35.3 180°
rotation SP8 46.8 10.9 46 11 SP9 42.9 42.2 SP10 35.9 35 270°
rotation SP11 46.2 10 46.5 9.5 SP12 41.8 42.9 SP13 36.2 37 Ave. 10.8 11.1

Classification (2nd round) Experimental Example 1-1 Experimental Example 1-2 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 46.5 12.7 47.5 11.9 SP3 41.5 43.2 SP4 33.8 35.6 90°
rotation SP5 46.9 10.3 45.9 12.9 SP6 43.3 40.6 SP7 36.6 33 180°
rotation SP8 47 11.9 46.9 10.1 SP9 41.6 43.3 SP10 35.1 36.8 270°
rotation SP11 46.9 10.9 46.6 11.1 SP12 43.3 42.7 SP13 36 35.5 Ave. 11.5 11.5

Classification (2nd round) Experimental Example 1-3 Experimental Example 1-4 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 47.3 11 47.7 11.1 SP3 43.9 43.8 SP4 36.3 37.6 90°
rotation SP5 45.9 10.8 48.6 11.2 SP6 41.7 44 SP7 35.1 37.4 180°
rotation SP8 47.1 10.2 46.4 12.6 SP9 42.9 41.3 SP10 36.9 33.8 270°
rotation SP11 47 13.4 46.7 11.2 SP12 40.7 42.4 SP13 33.6 35.5 Ave. 11.4 11.5

Classification (2nd round) Experimental Example 1-5 Experimental Example 1-6 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 46.9 12.8 46.5 12.2 SP3 40.6 41.6 SP4 34.1 34.3 90°
rotation SP5 45.9 13.9 46.3 10.1 SP6 39.6 42.1 SP7 32 36.2 180°
rotation SP8 46.4 10.3 47.9 13 SP9 42.9 42.4 SP10 36.1 34.9 270°
rotation SP11 46 10.8 45.8 10.7 SP12 42.2 41.2 SP13 35.2 35.1 Ave. 12.0 11.5

Classification (2nd round) Experimental Example 1-7 Experimental Example 1-8 heat source SP1 50.0 max-min 50.0 max-min 0° SP2 46.5 11.9 48 15.2 SP3 42.4 40.4 SP4 34.6 32.8 90°
rotation SP5 45.8 11.6 46.1 11.4 SP6 41.1 40.9 SP7 34.2 34.7 180°
rotation SP8 46.8 11.7 46.9 10.7 SP9 41.6 42.8 SP10 35.1 36.2 270°
rotation SP11 45.8 9.4 46 9.5 SP12 41.7 41.9 SP13 36.4 36.5 Ave. 11.2 11.7

Classification (1st round) Experimental Example 1-1 Experimental Example 1-2 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 73.1 29.6 72.2 29.1 SP3 60.7 61.1 SP4 43.5 43.1 90°
rotation SP5 71.3 27.0 72.0 26.8 SP6 59.3 57.5 SP7 44.3 45.2 180°
rotation SP8 72.6 30.6 72.7 29.7 SP9 60.3 60.0 SP10 42.0 43.0 270°
rotation SP11 68.0 25.6 72.9 28.4 SP12 59.2 62.0 SP13 42.4 44.5 Ave. 28.2 28.5

Classification (1st round) Experimental Example 1-3 Experimental Example 1-4 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 73.8 27.5 71.6 25.5 SP3 62.8 62.5 SP4 46.3 46.1 90°
rotation SP5 68.8 26.2 70.9 27.4 SP6 57.6 58.5 SP7 42.6 43.5 180°
rotation SP8 72.9 28.7 72.0 33.4 SP9 61.7 54.7 SP10 44.2 38.6 270°
rotation SP11 68.3 27.9 70.6 28.3 SP12 55.2 60.8 SP13 40.4 42.3 Ave. 27.6 28.7

Classification (1st round) Experimental Example 1-5 Experimental Example 1-6 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 73.2 30.5 73.1 30.4 SP3 58.1 57.4 SP4 42.7 42.7 90°
rotation SP5 72.4 29.6 72.0 29.7 SP6 59.1 57.9 SP7 42.8 42.3 180°
rotation SP8 72.7 29.4 72.7 28.9 SP9 58.2 60.4 SP10 43.3 43.8 270°
rotation SP11 71.9 26.6 68.3 23.7 SP12 59.6 58.6 SP13 45.3 44.6 Ave. 29.0 28.2

Classification (1st round) Experimental Example 1-7 Experimental Example 1-8 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 73.1 28.1 71.7 28.2 SP3 57.1 59.0 SP4 45.0 43.5 90°
rotation SP5 71.6 27.9 71.9 28.6 SP6 58.3 58.6 SP7 43.7 43.3 180°
rotation SP8 72.0 26.5 69.7 27.2 SP9 60.6 57.5 SP10 45.5 42.5 270°
rotation SP11 70.0 24.4 70.7 25.7 SP12 60.0 59.3 SP13 45.6 45.0 Ave. 26.7 27.4

Classification (2nd round) Experimental Example 1-1 Experimental Example 1-2 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 71.9 32.3 74.0 30.6 SP3 58.4 61.0 SP4 39.6 43.4 90°
rotation SP5 72.9 26.5 69.6 31.0 SP6 61.5 54.8 SP7 46.4 38.6 180°
rotation SP8 68.7 26.0 72.8 31.0 SP9 58.7 57.5 SP10 42.7 41.8 270°
rotation SP11 70.9 31.6 71.3 27.1 SP12 57.0 59.7 SP13 39.3 44.2 Ave. 29.1 29.9

Classification (2nd round) Experimental Example 1-3 Experimental Example 1-4 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 73.4 31.5 73.1 26.4 SP3 59.6 63.4 SP4 41.9 46.7 90°
rotation SP5 69.9 27.3 72.4 31.1 SP6 57.5 57.0 SP7 42.6 41.3 180°
rotation SP8 72.3 26.6 71.0 30.5 SP9 60.4 57.2 SP10 45.7 40.5 270°
rotation SP11 71.6 31.1 73.0 30.7 SP12 55.6 57.7 SP13 40.5 42.3 Ave. 29.1 29.7

Classification (2nd round) Experimental Example 1-5 Experimental Example 1-6 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 73.0 30.2 71.6 29.9 SP3 58.2 58.5 SP4 42.8 41.7 90°
rotation SP5 71.6 27.9 68.3 24.3 SP6 59.0 60.1 SP7 43.7 44.0 180°
rotation SP8 70.7 29.5 75.1 32.0 SP9 58.7 59.8 SP10 41.2 43.1 270°
rotation SP11 71.1 27.7 70.8 27.3 SP12 60.6 59.9 SP13 43.4 43.5 Ave. 28.8 28.4

Classification (2nd round) Experimental Example 1-7 Experimental Example 1-8 heat source SP1 80.0 max-min 80.0 max-min 0° SP2 71.4 26.2 75.8 32.0 SP3 60.8 60.3 SP4 45.2 43.8 90°
rotation SP5 69.0 27.2 71.5 28.1 SP6 56.3 57.9 SP7 41.8 43.4 180°
rotation SP8 71.6 28.0 72.4 26.7 SP9 59.7 61.8 SP10 43.6 45.7 270°
rotation SP11 68.7 23.0 69.3 28.3 SP12 58.5 55.8 SP13 45.7 41.0 Ave. 27.1 28.8

Classification (1st round) Experimental Example 1-1 Experimental Example 1-2 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 90.5 41.3 89.4 40.4 SP3 73.6 73.2 SP4 49.2 49.0 90°
rotation SP5 88.6 39.5 89.0 38.4 SP6 71.1 68.2 SP7 49.1 50.6 180°
rotation SP8 90.3 42.1 91.1 41.8 SP9 73.7 73.6 SP10 48.2 49.3 270°
rotation SP11 88.0 39.0 90.9 41.2 SP12 72.4 74.1 SP13 49.0 49.7 Ave. 40.5 40.5

Classification (1st round) Experimental Example 1-3 Experimental Example 1-4 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 91.9 38.9 92.9 39.9 SP3 77.4 78.3 SP4 53.0 53.0 90°
rotation SP5 84.4 37.0 87.8 39.5 SP6 69.1 70.0 SP7 47.4 48.3 180°
rotation SP8 87.8 39.0 87.3 44.3 SP9 72.4 65.9 SP10 48.8 43.0 270°
rotation SP11 84.1 39.2 87.8 38.6 SP12 66.0 75.0 SP13 44.9 49.2 Ave. 38.5 40.6

Classification (1st round) Experimental Example 1-5 Experimental Example 1-6 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 89.1 40.3 86.8 37.3 SP3 67.9 69.3 SP4 48.8 49.5 90°
rotation SP5 89.7 41.9 89.8 42.5 SP6 69.8 72.0 SP7 47.8 47.3 180°
rotation SP8 90.8 39.5 90.7 41.3 SP9 72.0 73.2 SP10 51.3 49.4 270°
rotation SP11 89.3 37.9 87.0 36.0 SP12 71.7 71.1 SP13 51.4 51.0 Ave. 39.9 39.3

Classification (1st round) Experimental Example 1-7 Experimental Example 1-8 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 89.9 38.9 89.9 39.6 SP3 69.0 72.1 SP4 51.0 50.3 90°
rotation SP5 88.3 38.3 89.1 39.3 SP6 72.5 70.8 SP7 50.0 49.8 180°
rotation SP8 88.5 37.5 90.2 38.1 SP9 73.3 75.0 SP10 51.0 52.1 270°
rotation SP11 83.8 31.5 87.3 33.8 SP12 68.2 72.8 SP13 52.3 53.5 Ave. 36.6 37.7

Classification (2nd round) Experimental Example 1-1 Experimental Example 1-2 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 89.3 43.2 92.5 42.4 SP3 71.8 74.1 SP4 46.1 50.1 90°
rotation SP5 90.5 38.5 86.5 42.5 SP6 73.4 67.2 SP7 52.0 44.0 180°
rotation SP8 89.8 40.7 90.4 41.2 SP9 70.4 70.9 SP10 49.1 49.2 270°
rotation SP11 88.9 42.2 88.3 39.1 SP12 72.0 71.0 SP13 46.7 49.2 Ave. 41.2 41.3

Classification (2nd round) Experimental Example 1-3 Experimental Example 1-4 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 90.8 40.4 90.7 36.4 SP3 74.2 77.3 SP4 50.4 54.3 90°
rotation SP5 87.2 37.5 89.9 40.8 SP6 71.4 72.2 SP7 49.7 49.1 180°
rotation SP8 89.8 37.9 86.5 42.5 SP9 72.0 67.2 SP10 51.9 44.0 270°
rotation SP11 89.2 41.6 85.7 36.4 SP12 69.4 71.7 SP13 47.6 49.3 Ave. 39.4 39.0

Classification (2nd round) Experimental Example 1-5 Experimental Example 1-6 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 92.6 40.1 89.0 41.4 SP3 78.4 72.5 SP4 52.5 47.6 90°
rotation SP5 89.2 39.1 85.3 35.2 SP6 71.7 70.7 SP7 50.1 50.1 180°
rotation SP8 88.5 39.2 93.7 43.5 SP9 74.1 73.7 SP10 49.3 50.2 270°
rotation SP11 87.9 37.0 87.7 38.7 SP12 74.5 72.4 SP13 50.9 49.0 Ave. 38.9 39.7

Classification (2nd round) Experimental Example 1-7 Experimental Example 1-8 heat source SP1 100.0 max-min 100.0 max-min 0° SP2 88.8 37.3 94.6 44.6 SP3 74.3 73.5 SP4 52.5 50.0 90°
rotation SP5 86.3 37.7 88.6 39.1 SP6 70.3 70.1 SP7 48.6 49.5 180°
rotation SP8 88.9 39.0 87.3 36.9 SP9 72.1 70.9 SP10 49.9 50.4 270°
rotation SP11 89.9 37.8 87.3 37.4 SP12 74.1 70.6 SP13 52.1 49.9 Ave. 37.7 39.5

7 is a view showing the structure of a heat dissipation thin film according to Experimental Examples 2-1 to 2-12 of the present invention.

Referring to FIG. 7 , as shown in FIG. 7 , heat dissipation thin films according to Experimental Examples 2-1 to 2-12 were prepared. In FIG. 7, GB means a carbon layer prepared using the graphite powder and binder described with reference to FIGS. 2 and 3, GCL means a graphitic carbon layer described with reference to FIG. 1, and PSA is means an adhesive layer.

On the back of the mobile phone, in video shooting mode and game mode (Lineage Red Knights version), the maximum saturation temperature and temperature over time after mode off were measured. Before measurement, Wi-Fi, GPS, Bluetooth, and data network functions were turned off, all data stored in the mobile phone was deleted, the battery charge rate was 80% or more, and the measurement temperature was set to about 24°C.

The measurement results are shown in <Table 29> and <Table 30> below. As can be seen from <Table 29> and <Table 30>, according to Experimental Example 2-4, Experimental Example 2-8, Experimental Example 2-11, and Experimental Example 2-12, having a GCL (graphitic carbon layer) In the case of the heat dissipation thin film having a heat dissipation film, it can be seen that the heat dissipation effect is the best in the video mode and the game mode.

Video mode On division Saturation
Temp. -5 min
Temp. -10 min
Temp. -15 min
Temp. Experimental Example 2-1 46.1 36.3 34.6 33.3 Experimental Example 2-2 46.2 35.6 33.7 32.3 Experimental Example 2-3 46.0 35.9 33.9 32.7 Experimental Example 2-4 46.0 35.7 33.9 31.5 Experimental Example 2-5 46.2 35.9 34.1 33.7 Experimental Example 2-6 46.3 36.1 33.5 32.5 Experimental Example 2-7 46.1 35.6 33.6 32.3 Experimental Example 2-8 45.9 35.3 32.7 31.6 Experimental Example 2-9 46.4 35.7 33.4 32.6 Experimental Example 2-10 46.2 35.4 33.1 32.3 Experimental Example 2-11 45.9 35.6 33.5 31.6 Experimental Example 2-12 46.0 36.3 33.9 31.7

Game mode On division Saturation
Temp. -5 min
Temp. -10 min
Temp. -15 min
Temp. Experimental Example 2-1 42.2 35.2 32.6 31.6 Experimental Example 2-2 42.5 36.0 34.2 32.8 Experimental Example 2-3 41.7 35.3 32.2 31.5 Experimental Example 2-4 41.7 35.2 31.3 30.6 Experimental Example 2-5 42.4 35.2 33.0 32.2 Experimental Example 2-6 42.5 34.8 32.7 32.1 Experimental Example 2-7 42.3 35.1 33.4 32.1 Experimental Example 2-8 42.2 34.7 32.4 30.6 Experimental Example 2-9 42.4 34.7 32.9 32.2 Experimental Example 2-10 42.4 36.1 34.1 32.3 Experimental Example 2-11 42.1 34.9 33.3 30.7 Experimental Example 2-12 42.1 34.8 32.3 30.8

In the heat dissipation thin film structure according to Experimental Example 2-4, the heat dissipation effect according to the thickness of the carbon layer (GB) using the graphite powder and the binder was measured as shown in <Table 31> below. As can be seen in <Table 31>, when the thickness of the carbon layer (GB) using graphite powder and binder in the heat dissipation thin film structure according to Experimental Example 2-4 is 5 to 7 μm, it can be confirmed that the heat dissipation effect is the best .

Video mode On GB thickness Saturation
Temp. -5 min
Temp. -10 min
Temp. -15 min
Temp. 3㎛ 45.9 36.0 34.3 32.3 5㎛ 46.0 35.7 33.9 31.5 7㎛ 46.1 35.9 33.7 31.6 10㎛ 46.2 36.2 34.2 32.1

In the heat dissipation thin film structure according to Experimental Example 2-8, the heat dissipation effect according to the thickness of the carbon layer (GB) using the graphite powder and the binder was measured as shown in <Table 32> below. As can be seen from <Table 32>, when the thickness of the carbon layer (GB) using the graphite powder and the binder in the heat dissipation thin film structure according to Experimental Example 2-8 is 5 μm, it can be confirmed that the heat dissipation effect is the most excellent.

Video mode On GB thickness Saturation
Temp. -5 min
Temp. -10 min
Temp. -15 min
Temp. 3㎛ 46.2 36.3 34.4 32.3 5㎛ 45.9 35.3 32.7 31.6 7㎛ 46.3 36.1 34.2 32.4 10㎛ 46.3 36.2 34.6 32.4

While controlling the heat treatment temperature according to the type of substrate, the heat dissipation characteristics were evaluated.

Preparation of high heat dissipation thin film according to Experimental Example 3-1 to Experimental Example 3-3

A 30 µm aluminum substrate was prepared as a metal substrate. Carbon ions were provided on the aluminum substrate to form a preliminary carbon layer, and a heat treatment process was performed at 400°C. Specifically, the heat treatment process was performed for 30 minutes while increasing the temperature at 15° C./min. According to Experimental Example 3-1 to Experimental Example 3-3 of the present invention, a heat dissipation thin film in which a 2.5 nm graphitic carbon layer, a 5 nm graphitic carbon layer, and a 10 nm graphitic carbon layer was formed on an aluminum substrate was prepared.

Thin film according to Comparative Example 3-1

As a comparative example of the heat dissipation thin film according to Experimental Example 3-1 to Experimental Example 3-3 of the present invention described above, an aluminum substrate having a thickness of 30 μm was prepared.

Thin film according to Comparative Example 3-2

As a comparative example for the heat dissipation thin film according to Experimental Example 3-1 to Experimental Example 3-3 of the present invention described above, an aluminum substrate of 30 μm was prepared, and Experimental Example 3-1 to Experimental Example 3- described above on the aluminum substrate A preliminary carbon layer having a thickness of 5 nm was formed by providing carbon ions in the same manner as in method 3 . Thereafter, unlike the methods according to Experimental Examples 2-1 to 3-3 described above, a heat treatment process was not performed.

The heat dissipation thin film according to the above-described Experimental Example 3-1 to Experimental Example 3-3, the thin film according to Comparative Example 3-1, and Comparative Example 3-2 may be organized as shown in [Table 33] below.

division metal substrate thickness of carbon layer heat treatment temperature thermal conductivity Experimental Example 3-1 Al 2.5nm 400℃ 339 W/mK Experimental Example 3-2 5nm 400℃ 384 W/mK Experimental Example 3-3 10nm 400℃ 297 W/mK Comparative Example 3-1 - - 221 W/mK Comparative Example 3-2 5nm - 236 W/mK

FIG. 8 is a graph of measuring the thermal conductivity of the heat dissipation thin films according to Experimental Example 3-1 to Experimental Example 3-3, Comparative Example 3-1, and Comparative Example 3-2 of the present invention.

Referring to FIG. 8 , the thermal conductivity of the heat-dissipating thin films according to the above-described Experimental Examples 3-1 to 3-3, Comparative Examples 3-1, and 3-2 was measured. Specifically, the thermal conductivity of the thin films according to the above-described Experimental Examples 3-1 to 3-3, Comparative Example 3-1, and Comparative Example 3-2 using the LFA equipment of NETZSH was measured. The measurement results are summarized as in [Table 34] and FIG. 9 below.

division thickness of carbon layer thermal conductivity Experimental Example 3-1 2.5nm 339 W/mK Experimental Example 3-2 5nm 384 W/mK Experimental Example 3-3 10nm 297 W/mK Comparative Example 3-1 - 221 W/mK Comparative Example 3-2 5nm 236 W/mK

As can be seen from FIGS. 8 and [Table 32], compared to the aluminum thin film according to Comparative Example 1-1 in which the graffiti carbon layer was not formed, the heat of the heat dissipation thin film according to Experimental Example 3-1 to Experimental Example 3-3 It can be confirmed that the conductivity is remarkably high.

In addition, in the case of the thin film according to Comparative Example 3-2 in which the heat treatment process was not performed after the preliminary carbon layer was formed on the aluminum substrate, according to Comparative Example 3-1 in which the preliminary carbon layer and the graffiti carbon layer were not formed Compared with the aluminum thin film, the thermal conductivity was measured to be somewhat higher, but compared to the heat dissipation thin film according to Experimental Examples 3-1 to 3-3 in which a carbon layer was formed by performing a heat treatment process, the thermal conductivity was significantly lower can be checked

In conclusion, it can be confirmed that providing carbon ions on an aluminum substrate to form a preliminary carbon layer and performing a heat treatment process is an efficient method for improving the thermal conductivity of a thin film.

In addition, comparing Experimental Example 3-1 to Experimental Example 3-3, it can be seen that the thermal conductivity is controlled according to the thickness of the graffiti carbon layer. Specifically, compared to the case where the thickness of the graffiti carbon layer was 2.5 nm according to Experimental Example 3-1 and the case where the thickness of the graffiti carbon layer was 10 nm according to Experimental Example 3-3, Experimental Example 3-2 Therefore, when the thickness of the graphitic carbon layer is 5 nm, it can be confirmed that the thermal conductivity is remarkably high. Specifically, in the case of the heat dissipation thin film according to Experimental Example 3-2, the thermal conductivity is about 13% or more higher than that of the heat dissipation thin film according to Experimental Example 3-1, and the thermal conductivity compared to the heat dissipation thin film according to Experimental Example 3-3 It can be seen that this is higher than about 29%.

In conclusion, it can be confirmed that controlling the thickness of the graphitic carbon layer formed on the metal substrate to be more than 2.5 nm and less than 10 nm is an effective method for improving the thermal conductivity of the thin film.

9 is a graph of measuring the thermal conductivity according to the heat treatment temperature of the heat dissipation thin film according to Experimental Example 3-3 of the present invention.

Referring to FIG. 9 , a carbon layer having a thickness of 10 nm is formed on an aluminum substrate according to Experimental Example 3-3 described above, and the heat treatment temperature is set to 300° C., 350° C., 400° C., 450° C., 500° C., and 600° C. Controlled. The thermal conductivity of the high heat-dissipation thin film at different heat treatment temperatures was measured using NETZSH LFA equipment. The measurement results are summarized as in [Table 35] and FIG. 10 below.

division metal substrate thickness of carbon layer heat treatment temperature thermal conductivity Experimental Example 3-3 Al 10nm 300℃ 245 W/mK 350℃ 256 W/mK 400℃ 297 W/mK 450℃ 290 W/mK 500℃ 241 W/mK 600℃ 203 W/mK

As can be seen from FIG. 9 and [Table 35], it can be seen that the thermal conductivity is controlled according to the heat treatment temperature. Specifically, when the heat treatment temperature is 300 to 350 ° C., and compared to the case where the heat treatment temperature is 500 to 600 ° C., when the heat treatment temperature is more than 350 ° C. and less than 500 ° C., it can be confirmed that the thermal conductivity is remarkably high. Specifically, when the heat treatment temperature is 400 °C, the thermal conductivity was measured to be the highest at 297 W/mK, about 21% compared to the case where the heat treatment temperature was 300 °C, and about 16% compared to the case where the heat treatment temperature was 350 °C , it was measured to be about 23% higher than the case where the heat treatment temperature was 500 °C, and about 46% higher than the case where the heat treatment temperature was 600 °C.

In conclusion, after forming the preliminary carbon layer on the aluminum substrate, adjusting the temperature of the heat treatment process for producing the graffiti carbon layer to more than 350 ° C and less than 500 ° C is an efficient way to improve the thermal conductivity of the thin film. can be checked

High heat dissipation thin film production according to Experimental Example 4-1 to Experimental Example 4-6

A copper substrate having a thickness of 35 µm was prepared as the metal substrate. Carbon ions were provided on the copper substrate to form a preliminary carbon layer, and a heat treatment process was performed while varying the temperature. Specifically, while raising the temperature at 15 °C / min, for 30 minutes, at 400 °C, 500 °C, 600 °C, 700 °C, 800 °C, and 900 °C, by performing a heat treatment process, Experimental Example 4- of the present invention According to Experimental Examples 1 to 4-6, a heat dissipation thin film in which a 5 nm graphitic carbon layer was formed on a copper substrate was prepared.

Thin film according to Comparative Example 4-1

As a comparative example of the heat dissipation thin film according to Experimental Examples 4-1 to 4-6 of the present invention described above, a copper substrate having a thickness of 35 μm was prepared.

Thin film according to Comparative Example 2-2

As a comparative example for the high heat dissipation thin film according to Experimental Example 4-1 to Experimental Example 4-6 of the present invention, a copper substrate of 35 μm was prepared, and Experimental Example 4-1 to Experimental Example 4 described above on the copper substrate Carbon ions were provided in the same manner as in -6 to form a preliminary carbon layer with a thickness of 5 nm. Thereafter, unlike the methods according to Experimental Examples 4-1 to 4-6 described above, a heat treatment process was not performed.

The high heat dissipation thin film according to Experimental Example 4-1 to Experimental Example 4-6, the thin film according to Comparative Example 4-1, and Comparative Example 4-2 can be organized as shown in [Table 36] below.

division metal substrate thickness of carbon layer heat treatment temperature Experimental Example 4-1 Cu 5nm 400℃ Experimental Example 4-2 500℃ Experimental Example 4-3 600℃ Experimental Example 4-4 700℃ Experimental Example 4-5 800℃ Experimental Example 4-6 900℃ Comparative Example 4-1 - - Comparative Example 4-2 5nm -

10 is a graph of measuring the thermal conductivity of the high heat dissipation thin film according to Experimental Examples 4-1 to 4-6 of the present invention.

10, the thermal conductivity of the high heat dissipation thin film according to Experimental Example 4-1 to Experimental Example 4-6, and the thermal conductivity of the thin films according to Comparative Example 4-1 and Comparative Example 4-2, NETZSH's LFA equipment was used. The measurement results are summarized as in [Table 37] and FIG. 11 below.

division heat treatment temperature thermal conductivity Experimental Example 2-1 400℃ 327 W/mK Experimental Example 2-2 500℃ 339 W/mK Experimental Example 2-3 600℃ 409 W/mK Experimental Example 2-4 700℃ 435 W/mK Experimental Example 2-5 800℃ 460 W/mK Experimental Example 2-6 900℃ 384 W/mK Comparative Example 2-1 - 298 W/mK Comparative Example 2-2 - 313 W/mK

As can be seen from FIGS. 10 and [Table 37], compared with the copper thin film according to Comparative Example 4-1 in which the graffiti carbon layer was not formed, the heat of the heat dissipation thin film according to Experimental Examples 4-1 to 4-6 It can be confirmed that the conductivity is remarkably high.

In addition, in the case of the thin film according to Comparative Example 4-2 in which the heat treatment process was not performed after forming the preliminary carbon layer on the copper substrate, according to Comparative Example 4-1 in which the preliminary carbon layer and the graphitic carbon layer were not formed Compared with the copper thin film, the thermal conductivity was measured to be somewhat higher, but compared to the heat dissipation thin films according to Experimental Examples 4-1 to 4-6 in which a graffiti carbon layer was formed by performing a heat treatment process, the thermal conductivity was significantly low can be seen.

In conclusion, it can be confirmed that providing carbon ions on a copper substrate to form a preliminary carbon layer and performing a heat treatment process is an efficient method for improving the thermal conductivity of a thin film.

In addition, it can be confirmed that the thermal conductivity is controlled according to the heat treatment temperature. Specifically, when the heat treatment temperature is 400 to 500 ° C., and compared with the case where the heat treatment temperature is 900 ° C., when the heat treatment temperature is more than 500 ° C. and less than 900 ° C., it can be confirmed that the thermal conductivity is remarkably high. Specifically, when the heat treatment temperature was 800 °C, the thermal conductivity was measured to be 460 W/mK, which was the highest, about 41% compared to the case where the heat treatment temperature was 400 °C, and about 36% compared to the case where the heat treatment temperature was 500 °C , it was measured to be about 20% higher than that in the case where the heat treatment temperature was 900 °C.

In conclusion, after forming the preliminary carbon layer on the copper substrate, adjusting the temperature of the heat treatment process for producing the graffiti carbon layer to more than 500 ° C and less than 900 ° C is an efficient way to improve the thermal conductivity of the thin film. can be checked

In addition, referring to [Table 35] and [Table 37], it can be seen that the heat treatment temperature range in which the thermal conductivity has the maximum value is different depending on the type of the metal substrate used. In other words, it can be confirmed that controlling the heat treatment temperature according to the type of the metal substrate is an effective method for improving the thermal conductivity.

100a, 100b, 100c: high heat dissipation thin film
110: metal film
110a: first metal film
110b: second metal film
120: carbon layer
120a: first carbon layer
120b: second carbon layer
130: adhesive layer
130a: first adhesive layer
130b: second adhesive layer

Claims (7)

preparing a first metal film; and
Comprising the step of forming a first carbon layer in direct contact with the first surface of the first metal film,
The forming of the first carbon layer includes providing carbon ions to the first surface of the first metal film, and heat-treating the first metal film provided with the carbon ions,
The first metal film provided with the carbon ions is heat-treated at 400 °C to 450 °C,
The first carbon layer has a thickness of 5 nm to 10 nm.
The method of claim 1,
Further comprising the step of forming a second carbon layer on a second surface facing the first surface of the first metal film,
The forming of the second carbon layer includes preparing a carbon coating material including graphite powder and a binder, and coating the second surface of the first metal film. Way.
3. The method of claim 2,
The first carbon layer comprises a graphitic carbon layer,
The second carbon layer is a method of manufacturing a high heat dissipation thin film comprising a carbon material that is thicker than the first carbon layer.
3. The method of claim 2,
Method of manufacturing a high heat dissipation thin film comprising a carbon material further comprising the step of adhering a second metal film on the first carbon layer.
a first metal film;
a first carbon layer in direct contact with the first surface of the first metal film;
a second carbon layer in direct contact with a second surface of the first metal film facing the first surface; and
Including an adhesive layer in direct contact with the second carbon layer,
The first carbon layer comprises a graphitic carbon layer,
The second carbon layer includes a carbon material including graphite powder and a binder,
The second carbon layer has a thickness of 5 μm to 7 μm.
6. The method of claim 5,
A high heat dissipation thin film comprising an additional adhesive layer in direct contact with one surface of the first carbon layer.
7. The method of claim 6,
A high heat dissipation thin film comprising an additional metal layer in direct contact with one surface of the additional adhesive layer.

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