KR102253452B1 - Transfer method of thin films using van der waals force - Google Patents

Abstract

A thin film transfer method using Van der Waals force according to an embodiment of the present invention includes the steps of: (a) forming a polymer substrate having a first surface energy; (b) forming a polymer layer having a second surface energy; (c) peeling the thin film material on the polymer substrate; (d) transferring the thin film material exfoliated on the polymer substrate to the first substrate using the polymer layer; And (e) transferring the thin film material transferred to the first substrate to the second substrate, wherein the second surface energy is greater than the first surface energy.

Description

Thin film transfer method using van der Waals force {TRANSFER METHOD OF THIN FILMS USING VAN DER WAALS FORCE}

The present invention relates to a thin film transfer method using van der Waals force.

Existing thin film transfer technology is divided into wet transfer and dry transfer. In the case of wet transfer, PMMA (polymethyl methacrylate), which has been removed from the thin film material, is floated in a buffered oxide etching solution (BOE) or DI water, and then transferred to a target substrate and dried. In the case of dry transfer, a thin film material is transferred from a peeled substrate to a substrate to be manufactured using physical bonding energy without water or a solvent.

However, in the case of wet transfer using conventional PMMA, there is a problem that the thin film material is exposed to water or a solvent when removing the lower layer of PMMA, and precise transfer is difficult. In the case of conventional dry transfer using polydimethylsiloxane (PDMS), there is a problem that transfer is difficult only with physical bonding energy at a location where the upper portion of the substrate is not flat. In addition, in the case of pickup technology using PPC or PMMA, which uses polypropylene carbonate (PPC) or hexagonal boron nitride (hBN) attached to PMMA to lift the thin film material and transfer it to the target substrate, materials other than hBN There is a problem that the process is impossible without first attaching hBN due to poor adhesion, and it is possible only when certain temperature conditions are satisfied.

In order to solve the above-described problem, the present invention is to provide a method of transferring a thin film material using only a difference in surface energy of the material and a difference in bonding energy resulting therefrom from a thin film material peeled on an elastomer such as PDMS.

However, the technical problem to be achieved by the present embodiment is not limited to the technical problems as described above, and other technical problems may further exist.

A thin film transfer method using Van der Waals force according to an embodiment of the present invention for achieving the above technical problem includes the steps of: (a) forming a polymer substrate having a first surface energy; (b) forming a polymer layer having a second surface energy; (c) peeling the thin film material on the polymer substrate; (d) transferring the thin film material exfoliated on the polymer substrate to the first substrate using the polymer layer; And (e) transferring the thin film material transferred to the first substrate to the second substrate, wherein the second surface energy is greater than the first surface energy.

An embodiment of the present invention has the advantage of performing transfer using only van der waals force. Accordingly, there is an effect of reducing the possibility that unnecessary residues remain between the transferred materials or cause a chemical reaction, and decreases electrical characteristics of the thin film device and prevents abnormalities.

1 is a flow chart for explaining a thin film transfer method using van der Waals force according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a method of forming a polymer substrate having a first surface energy of FIG. 1.
FIG. 3 is a diagram illustrating a method of forming a polymer layer having a second surface energy of FIG. 1.
FIG. 4 is a diagram illustrating a method of peeling a thin film material on the polymer substrate of FIG. 1.
FIG. 5 is a diagram illustrating a method of transferring a thin film material peeled off a polymer substrate to a first substrate using the polymer layer of FIG. 1.
6 is a diagram illustrating a method of transferring the thin film material of FIG. 1 to a second substrate.
7 is a view for explaining a method of sequentially stacking n thin film materials on a polymer layer and transferring them to a second substrate according to an embodiment of the present invention.
8 is a view for explaining a thin film transfer method using a van der Waals force of the present invention by replacing a polymer substrate or a polymer layer according to an embodiment of the present invention with an existing substrate.
FIG. 9 is an optical micrograph of a test performed by the dry transfer method of FIG. 8 using molybdenum disulfide (MoS₂).
10 is a view for explaining a method of transferring a thin film material (MoS₂) to a second substrate (silicon dioxide substrate) using a polymer layer (PMMA) formed on a first substrate (PDMS) according to an embodiment of the present invention to be.
11 is an optical microscope photograph of the transfer process of FIG. 10.
12 is a diagram illustrating a device manufactured by the method of transferring n thin-film materials of FIG. 7.
13 is an optical microscope photograph of the process of laminating n thin-film materials of FIG. 7.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is said to be "connected" with another part, this includes not only "directly connected" but also "electrically connected" with another element interposed therebetween. . In addition, when a part "includes" a certain component, it means that other components may be further included, and one or more other features, not excluding other components, unless specifically stated to the contrary. It is to be understood that it does not preclude the presence or addition of any number, step, action, component, part, or combination thereof.

1 is a flow chart for explaining a thin film transfer method using van der Waals force according to an embodiment of the present invention.

Referring to FIG. 1, in the method of transferring a thin film using Van der Waals force of the present invention, forming a polymer substrate having a first surface energy (S110), forming a polymer layer having a second surface energy (S120) , The step of peeling the thin film material on the polymer substrate (S130), the step of transferring the thin film material peeled on the polymer substrate to the first substrate using the polymer layer (S140), and the thin film material transferred to the first substrate It includes a step (S150) of transferring to the second substrate. Here, the second surface energy is greater than the first surface energy.

Accordingly, the present invention has the advantage that dry transfer can be performed using only van der Waals force. In addition, there is an effect of reducing contamination of bonding surfaces between thin film materials and chemical reactions in the transfer process.

Hereinafter, a thin film transfer method using van der Waals force according to the present invention will be described in detail with reference to FIGS. 2 to 6.

FIG. 2 is a diagram illustrating a method of forming a polymer substrate having a first surface energy of FIG. 1.

Referring to Figure 2, in the step of forming a polymer substrate having a first surface energy (S110), the polymer substrate is PDMS (polydimethylsiloxane), PBT (Polybutylene terephthalate), CTFE (Chlorotrifluoroethylene), PP (Polypropylene), PU (Polyurethane) ), PE (Polyethylene), PVF (Polyvinyl fluoride), PVDF (Polyvinylidene fluoride), PDMS (Polydimethylsiloxane), FEP (Fluorinated ethylene propylene), and PTFE (Polytetrafluoroethylene). The materials listed above are listed starting with materials with strong surface energy. Preferably, the polymer substrate may be made of PDMS, but is not limited thereto, and may be made of a material having a relatively weaker surface energy than the polymer layer.

In step S110, the steps of mixing the PDMS elastomer base 200 and the PDMS curing agent 201 and removing the air bubbles generated in the mixed PDMS mixture 203a are cured to have a certain thickness. It may include forming a polymer substrate 203 including PDMS.

For example, referring to Figure 2 (a), a container 100 from which dust has been removed is prepared, and a PDMS elastomer base 200 and a PDMS curing agent 201 are added to the prepared container 100 in a weight ratio of 10: Transfer to 1.

Next, referring to FIG. 2B, the PDMS elastomer base 200 and the PDMS curing agent 201 contained in the container 100 are stirred and mixed for about 5-10 minutes until the foam turns white. For example, you can use a solid, dust-free rod as a stirrer.

Next, referring to (c) of FIG. 2, the sufficiently mixed PDMS mixture 203a may be poured into the culture dish 101. For example, the culture dish 101 may be placed on a scale and weighed, and the PDMS mixture solution 203a may be poured. Since the PDMS mixture 203a has a large difference in deformability according to the thickness, the weight of each culture dish 101 into which the PDMS mixture 203a is poured is kept constant. As another example, in order to increase the flatness, the PDMS mixture solution 203a may be poured while the substrate is placed in the culture dish 101. Here, the substrate may be made of a material that does not strongly bond with the flat and cured PDMS mixture 203a.

Next, referring to (d) of FIG. 2, the culture dish 101 may be placed in a desiccator or stored at room temperature for a long time in order to remove air bubbles (bubbles) generated while mixing the PDMS mixture solution 203a. Here, the bubble removal process may be performed first in the process of FIG. 2B. Subsequently, when the air bubbles are removed, the culture dish 101 is maintained so that the equilibrium does not deviate and can be cured using an oven. Here, the heating temperature and time may be set within a range in which the culture dish 101 containing PDMS is not deformed due to heat when curing of the PDMS proceeds. Next, the polymer substrate 203 including the cured PDMS may be cut to form a block shape.

FIG. 3 is a diagram illustrating a method of forming a polymer layer having a second surface energy of FIG. 1.

Referring to Figure 3, in the step of forming the polymer layer 302 having a second surface energy (S120), the polymer layer 302 is PMMA (polydimethylsiloxane), PES (Polyethersulfone), PPO (Polyphenylene oxide), PC ( Polycarbonate), PET (Polyethlene terephthalate), PMMA (Polymethylmethacrylate), SAN (Styrene acrylonitirile), PVCr (Polyvinyl chloride), ABS (Acrylonitrile butadiene styrene), PPS (Polyphenylene sulfide), PVA (Polyvinyl alcohol), PVCp (Polyvinyl chloride with plasticizer) and PS (Polystyrene). The materials listed above are listed in order, starting with the material having strong surface energy. In addition to the materials listed above, the polymer layer 302 may be made of a material having a relatively higher surface energy than the polymer substrate 203.

Step S120 includes forming a spherical material 301 on the first substrate 300 and forming a polymer layer 302 on the spherical material using spin coating, but the spherical material 301 ) May be made of the same material as the first substrate 300 or a material having high bonding energy between the first substrate 300 and the polymer layer 302.

For example, referring to FIG. 3A, the first substrate 300 may be cut and cleaned within a size range that can be used during the transfer process. At this time, the first substrate 300 may be made of a material that is transparent and has sufficiently high adhesion to a material to be coated thereon.

Subsequently, referring to FIG. 3B, the geometry of the first substrate 300 may be changed through etching or attaching an additional spherical material 301 to selectively adhere the thin film material. . For example, when attaching the spherical material 301 to the first substrate 300, the spherical material 301 is the same material as the first substrate 300 or the first substrate 300 and the polymer layer 302 ) And high adhesion, and can be made of a transparent material.

Next, referring to FIG. 3C, the polymer layer 302 may be coated on the spherical material 301 attached to the first substrate 300 using a spin coating process. In this case, the coating thickness of the polymer layer 302 may be improved within a limit capable of maintaining light transmittance for alignment when the polymer layer 302 is transferred. Thereafter, the coated polymer layer 302 may be dried or heated.

FIG. 4 is a diagram illustrating a method of peeling a thin film material on the polymer substrate of FIG. 1.

Referring to FIG. 4, in the step of peeling the thin film material 403 on the polymer substrate 203 (S130), after placing the crystal 401 of the thin film material between the tapes 400, the tape 400 ) May include the step of attaching and detaching.

For example, referring to FIG. 4A, the crystal 401 of the thin film material to be transferred may be made thin through peeling. For example, an appropriate amount of the crystal 401 of the thin film material is put on the adhesive surface of the tape 400, and the crystal 401 of the thin film material is removed by attaching and peeling the tape 400 located on both sides of the crystal 401 of the thin film material. It can be formed in the form of a thin film by spreading thinly and widely.

Next, referring to (b) of FIG. 4, the thin film material 403 attached to the thin film material 403 thin enough in the form of a thin film on the polymer substrate 203 is attached and peeled off, while the thin film material 403 on the polymer substrate 203 Can be peeled off. In this case, the bonding energy between the thin film material 403 and the tape 400 may be much greater than the bonding energy between the thin film material 403 and the polymer substrate 203. That is, the faster the peeling speed, the less affected by the difference in bonding energy, so that the tape 400 can be peeled off at a high speed within a short time in order to peel a sufficient amount of the thin film material 403 to the polymer substrate 203. . Meanwhile, the strength, time, and peeling speed of attaching the tape 400 to the polymer substrate 203 may be set differently according to the type of the thin film material 403. Here, the tape 400 is not limited to a means for performing peeling, and may include all materials that can be used in the peeling process.

5 is a view for explaining a method of transferring a thin film material peeled on a polymer substrate to a first substrate by using the polymer layer of FIG. 1.

5, the step of transferring the thin film material 403 peeled off on the polymer substrate 203 to the first substrate 300 using the polymer layer 302 (S140), the polymer layer 302 The step of attaching the first substrate 300 to the transfer slit 500 by turning it over to face, after fixing the polymer substrate 203 on the top of the stage 501, the first substrate 300 using an optical microscope 502 A step of bonding the polymer layer 302 of) to match the thin film material 403 of the polymer substrate 203, and peeling the polymer layer 302 of the first substrate 300 from the polymer substrate 203 at a predetermined speed. However, it may include a step of attaching the thin film material 403 to the polymer layer 302 of the first substrate 300.

For example, referring to FIG. 5A, the first substrate 300 coated with the polymer layer 302 may be attached to the transfer slit 500 with the first substrate 300 facing downward. The slit 500 may be made of a transparent material to enable alignment during transfer.

Next, referring to (b) of FIG. 5, the polymer substrate 203 on which the thin film material 403 is mounted is fixed on the stage 501, and the desired position of the first substrate 300 through the optical microscope 502 and By matching the positions of the thin film material 403, the polymer layer 302 and the thin film material 403 may be bonded to each other. At this time, the bonding energy between the polymer layer 302 and the thin film material 403 is stronger, and the bonding energy decreases due to the deformability of the polymer substrate 203, so that the thin film material 403 is more strongly adhered to the polymer layer 302. That is, the second bonding energy between the polymer layer 302 and the thin film material 403 is greater than the first bonding energy between the polymer substrate 203 and the thin film material 403, and is further bonded to the surface of the thin film material 403. The bonding energy with the thin film material may be stronger than the second bonding energy. Therefore, before transferring, a desired thin film material may be further bonded to the surface of the polymer layer 302 or the thin film material 403 bonded thereto. Thereafter, a plurality of additionally bonded thin film materials may be transferred at once. A detailed description of a method of transferring such a plurality of thin film materials will be described later with reference to FIG. 7. In this case, the type and number of the bonded thin film materials are not limited and may be variously selected according to the surface energy of the material.

Next, referring to (c) of FIG. 5, the polymer layer 302 may be removed from the polymer substrate 203 when all portions of the thin film material 403 to be transferred touch the polymer substrate 203. . In this case, the appropriate range of the peeling speed may be set differently according to the physical properties of the thin film material 403 and the polymer layer 302, the first substrate 300, and the polymer substrate 203.

6 is a diagram illustrating a method of transferring the thin film material of FIG. 1 to a second substrate.

Referring to FIG. 6, as an example, in the step of transferring the thin film material 403 to the second substrate 600 (S150), the thin film material 403 attached to the polymer layer 302 of the first substrate 300 Bonding to the second substrate 600, after heating the stage 501 to which the second substrate 600 is fixed, and removing the polymer layer 302 of the first substrate 300 from the second substrate 600 Transferring the thin film material 403 including a part of the polymer layer 302 onto the second substrate 600 and removing the polymer layer 302 included in the thin film material 403 may be included. . As another example, step S150 is a step of bonding the thin film material 403 attached to the polymer layer 302 of the first substrate to the second substrate 600 and the polymer of the first substrate 300 from the second substrate 600 The step of removing the layer 302 and transferring only the thin film material 403 onto the second substrate 600 may be included. In this case, the second substrate 600 may have a third surface energy and may have a third surface energy greater than the second surface energy of the polymer layer 302. Accordingly, the bonding energy between the thin film material 403 and the second substrate 600 may be greater than the bonding energy between the polymer layer 302 and the thin film material 403. For example, the second substrate 600 is a silicon (Si) or germanium (Ge) substrate on which an insulating layer such as silicon dioxide (SiO₂), aluminum oxide (Al₂O₃), and hafnium oxide (HfO₂) is grown or deposited. Alternatively, it may include glass or the like.

For example, referring to (a) of FIG. 6, the polymer layer 302 with the thin film material 403 attached thereto can be attached to a desired position on the second substrate 600 on which the device is to be manufactured through the optical microscope 502. have.

Next, as an example, referring to FIG. 6B, by heating the temperature of the stage 501 in which the transfer is performed higher than the glass transition temperature (Tg) of the polymer layer 302, the polymer layer ( A portion of the 302 may also be transferred together with the thin film material 403 onto the second substrate 600 on which the device is to be manufactured. At this time, the transferred polymer layer 302 may be removed according to an existing method such as melting.

As another example, referring to (c) of FIG. 6, when the bonding energy with the second substrate 600 is significantly greater than the bonding energy with the polymer layer 302 according to the thin film material 403, the thin film using only the bonding energy Only the material 403 may be transferred onto the second substrate 600 and the polymer layer 302 may be removed. Here, the bonding energy between the second substrate 600 on which the device is to be manufactured and the thin film material 403 may be greater than the bonding energy between the polymer layer 302 and the thin film material 403. In addition, the rate at which the polymer layer 302 is removed may be set differently according to the surface energy of the thin film material 403 and the second substrate 600 and the polymer layer 302.

7 is a view for explaining a method of sequentially stacking n thin film materials on a polymer layer and transferring them to a second substrate according to an embodiment of the present invention.

Referring to FIG. 7, in the method of transferring a thin film using the Van der Waals force of the present invention, a first step of peeling a thin film material (S130) and a step of transferring the thin film material to a first substrate (S140) are repeated n times. The step of sequentially laminating n number of thin film materials 403 on the polymer layer 302 formed on the substrate 300 may be further included.

For example, as shown in (a) of FIG. 7, the first thin film material 700 may be peeled on the polymer substrate 203. Subsequently, as shown in (b) of FIG. 7, the first thin film material 700 may be transferred to the first substrate 300 using the polymer layer 302. Next, in the same method as the method of transferring the first thin film material 700 to the polymer layer 302 of the first substrate 300, 4 times for each thin film material 700-703, the ( As shown in c), a first thin film material 700, a second thin film material 701, a third thin film material 702, and a fourth thin film material 703 are sequentially stacked on the polymer layer 302. I can. Thereafter, as shown in (d) of FIG. 7, the bonding energy between each thin film material 700-703 and the second substrate 600 is greater than the bonding energy between the polymer layer 302 and each thin film material 700-703. Each of the thin film materials 700-703 can be transferred to the second substrate 600 by using a large one.

Hereinafter, the result of transferring the thin film using the van der Waals force of the present invention will be described with reference to FIGS. 8 to 13.

First, a thin film transfer method using van der Waals force according to an embodiment of the present invention and a conventional dry transfer method were compared and tested.

8 is a view for explaining a thin film transfer method using a van der Waals force of the present invention by replacing a polymer substrate or a polymer layer according to an embodiment of the present invention with an existing substrate. ,

Referring to FIG. 8, the upper first substrate 300 may be made of PDMS, and a drop of PDMS is dropped and cured to form a spherical material 301 on the first substrate 300 (PDMS). I did. In addition, the two-dimensional thin film material 403 may be made of molybdenum disulfide (MoS2), tungsten iselenide (WSe2), rhenium disulfide (ReS2), or hafnium disulfide (HfS2). For example, as shown in (a) of FIG. 8, when the first substrate 300 coated with the polymer layer 302 of the present invention is used, the polymer substrate (PDMS) is replaced with a silicon dioxide substrate 203a. I did. As another example, as shown in (b) of FIG. 8, in the case of using the polymer substrate 203 from which the thin film material 403 of the present invention is peeled off, the first substrate 300 on which the polymer layer 302 is not coated Replaced with. For example, as the silicon dioxide substrate 203a, a product manufactured to a thickness of 90 nm using a thermal oxidation process on a P++ silicon substrate was used.

FIG. 9 is an optical microscope photograph tested by the dry transfer method of FIG. 8 using molybdenum disulfide (MoS₂).

9A shows the first substrate 300 coated with the polymer layer 302 shown in FIG. 8A on the silicon dioxide substrate 203a from which MoS₂ (thin film material 403) is peeled off. It is an optical micrograph before and after the peeling, and FIG. 9(b) is an optical micrograph before and after the first substrate 300 shown in FIG. 8(b) is attached to the polymer substrate 203 from which MoS₂ has been peeled off. . Here, the surface energies of silicon dioxide, PMMA, and PDMS are 115-200mJ/m², 41mJ/m², and 23mJ/m², respectively, and the bonding energy between the two materials is proportional to the square root of the product of the surface energy of the two materials. MoS₂ (thin film material) is unlikely to be transferred.

As shown in (a) of FIG. 9, even when the first substrate (PDMS) and the silicon dioxide substrate were attached and removed, MoS2 did not come off. This is expected to be due to the fact that the surface energy of the silicon dioxide substrate is greater than the surface energy of the polymer layer PMMA on the first substrate PDMS. In addition, as shown in (b) of FIG. 9, even when the first substrate (PDMS) and the polymer substrate (PDMS) were attached and removed, MoS₂ did not come off. This is expected to be due to the fact that after peeling on the polymer substrate (PDMS), a material having the same bonding energy (PDMS not coated with PMMA) was attached and removed in a stable state.

10 is a view for explaining a method of transferring a thin film material (MoS₂) to a second substrate (silicon dioxide substrate) using a polymer layer (PMMA) formed on a first substrate (PDMS) according to an embodiment of the present invention to be.

10A and 10B, a two-dimensional thin film material 403 on a polymer substrate 203 (PDMS) is used as a polymer in order to perform a transfer process using only the difference in surface energy of the materials without an additional process such as heat treatment. The layer 302 (PMMA) was transferred onto the second substrate 600 (silicon dioxide substrate) using the coated first substrate 300 (PDMS). Here, the thin film material 403 was MoS₂.

11 is an optical microscope photograph of the transfer process of FIG. 10.

Figure 11 (a) is before attaching the polymer layer 302 (PMMA) to a piece of MoS₂ (thin film material), Figure 11 (b) is when it is attached, and Figure 11 (c) is when the polymer layer 302 is lifted. This is an optical microscope picture of the time. Here, MoS2 (thin film material) was easily transferred to the first substrate 300 regardless of the rate at which the polymer layer 302 is removed from the polymer substrate 203.

12 is a diagram illustrating a device manufactured by the method of transferring n thin-film materials of FIG. 7.

12 is a structure in which four thin film materials 700-703 are stacked in vertical and horizontal directions. Specifically, several thin film materials 700-703 should be overlapped through precise alignment, and there should be few foreign substances between the materials. After sequentially stacking a plurality of thin film materials 700-703 using the bonding energy by the method illustrated in FIG. 7 described above, it may be transferred to the second substrate 600 at one time.

13 is an optical microscope photograph of the process of laminating n thin-film materials of FIG. 7. 13A is a state in which the first and second thin film materials 700 and 701 are stacked, and FIG. 13B is a state in which the first to third thin film materials 700 to 702 are stacked, 13C is an optical micrograph of a state in which the first to fourth thin film materials 700-703 are stacked.

Compared with the existing processes, the thin film transfer method using the van der Waals force of the present invention has the following advantages. When applying the conventional transfer method using PMMA, it takes 2 hours to remove PMMA every time one thin film material is attached, and there is a possibility that PMMA residues exist between each material. In the case of a process using only PDMS, the possibility of the presence of PMMA residue is small, but there is a problem that other unwanted thin film materials are transferred to the substrate because the flat PDMS is used. That is, as shown in FIG. 12, in the case of a form in which a plurality of thin film materials 700-703 having a step difference between the substrate 600 and each of the thin film materials 700-703 overlap, the conventional With the dry process method, there is a problem that transfer is difficult. In addition, there is a problem in that it is inconvenient to perform a wide multiple transfer process parallel to the substrate.

However, the present invention has the effect of solving the above-described problem, reducing the possibility of causing an unnecessary residue or causing a chemical reaction between transferred materials, and reducing electrical properties and preventing abnormalities of the thin film device.

The above description of the present invention is for illustrative purposes only, and those of ordinary skill in the art to which the present invention pertains will be able to understand that other specific forms can be easily modified without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as being distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the claims to be described later rather than the detailed description, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.

100: Courage
200: PDMS elastomer base
201: PDMS curing agent
203a: PDMS mixture
203: polymer substrate
300: first substrate
301: spherical matter
302: polymer layer
400: tape
401: Determination of thin film material
403: thin film material
500: transcription slit
501: stage
502: optical microscope
600: second substrate
700: first thin film material
701: second thin film material
702: third thin film material
704: fourth thin film material

Claims (10)

In the thin film transfer method using van der Waals force,
(a) forming a polymer substrate having a first surface energy;
(b) forming a polymer layer having a second surface energy;
(c) After placing the thin film material crystal between the tapes so that the adhesive side of the tape is in contact with both sides of the thin film material crystal, the tape is detached to form a thin film material on one side of the tape, and the thin film material is formed on one side of the tape. Attaching and attaching a tape to the upper portion of the polymer substrate to form a thin film material on the polymer substrate;
(d) inverting the first substrate so that the polymer layer faces downward and attaching it to a transfer slit to transfer the thin film material formed on the polymer substrate to the first substrate; And
(e) transferring the thin film material transferred to the first substrate to the second substrate,
Characterized in that the second surface energy is greater than the first surface energy,
Thin film transfer method using van der Waals force. The method of claim 1,
It further comprises the step of sequentially laminating n thin film materials on the polymer layer by repeating the step (c) and step (d) n times,
Thin film transfer method using van der Waals force. The method of claim 1,
In step (a)
Mixing a PDMS elastomer base and a PDMS curing agent; And
It comprises the step of forming a polymer substrate containing PDMS by curing to have a predetermined thickness after removing the air bubbles generated in the mixed PDMS mixture,
Thin film transfer method using van der Waals force. The method of claim 1,
The polymer substrate is
PDMS (polydimethylsiloxane), PBT (Polybutylene terephthalate), CTFE (Chlorotrifluoroethylene), PP (Polypropylene), PU (Polyurethane), PE (Polyethylene), PVF (Polyvinyl fluoride), PVDF (Polyvinylidene fluoride), PDMS (Polydimethylsiloxane), FEP ( It is made of at least one of fluorinated ethylene propylene) and PTFE (Polytetrafluoroethylene),
Thin film transfer method using van der Waals force. In the thin film transfer method using van der Waals force,
(a) forming a polymer substrate having a first surface energy;
(b) forming a polymer layer having a second surface energy;
(c) After placing the thin film material crystal between the tapes so that the adhesive side of the tape is in contact with both sides of the thin film material crystal, the tape is detached to form a thin film material on one side of the tape, and the thin film material is formed on one side of the tape. Attaching and attaching a tape to the upper portion of the polymer substrate to form a thin film material on the polymer substrate;
(d) inverting the first substrate so that the polymer layer faces downward and attaching it to a transfer slit to transfer the thin film material formed on the polymer substrate to the first substrate; And
(e) transferring the thin film material transferred to the first substrate to the second substrate,
The second surface energy is greater than the first surface energy,
The step (b) is
Forming a spherical material on the first substrate; And
Including the step of forming the polymer layer using spin coating on the spherical material,
The spherical material is the same material as the first substrate or is made of a material having high bonding energy between the first substrate and the polymer layer,
Thin film transfer method using van der Waals force. The method of claim 1,
The polymer layer
PMMA (polydimethylsiloxane), PES (Polyethersulfone), PPO (Polyphenylene oxide), PC (Polycarbonate), PET (Polyethlene terephthalate), PMMA (Polymethylmethacrylate), SAN (Styrene acrylonitirile), PVCr (Polyvinyl chloride), ABS (Acrylonitrile butadiene styrene) , PPS (Polyphenylene sulfide), PVA (Polyvinyl alcohol), PVCp (Polyvinyl chloride with plasticizer) and PS (Polystyrene),
Thin film transfer method using van der Waals force. delete The method of claim 1,
The step (d) is
Fixing the polymeric substrate to the upper portion of the stage and bonding the polymer layer of the first substrate to match the thin film material of the polymeric substrate using an optical microscope; And
Separating the polymer layer of the first substrate from the polymer substrate at a predetermined rate, and attaching the thin film material to the polymer layer,
Thin film transfer method using van der Waals force. The method of claim 8,
The step (e) is
Bonding a thin film material attached to the polymer layer of the first substrate to the second substrate; And
Removing the polymer layer of the first substrate from the second substrate and transferring only the thin film material onto the second substrate,
The second substrate has a third surface energy,
The third surface energy is greater than the second surface energy,
Thin film transfer method using van der Waals force. The method of claim 8,
The step (e) is
Bonding a thin film material attached to the polymer layer of the first substrate to the second substrate;
Heating the stage on which the second substrate is fixed, removing the polymer layer of the first substrate from the second substrate, and transferring a thin film material including a portion of the polymer layer onto the second substrate; And
Including the step of removing the polymer layer contained in the thin film material,
Thin film transfer method using van der Waals force.

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