KR102249873B1 - Photographic assembly and packaging method thereof, lens module, electronic device - Google Patents

Abstract

A photographing assembly and a method of packaging the same, a lens module, and an electronic device, wherein the packaging method of the photographing assembly comprises: providing a photosensitive chip and a filter having a welding pad; Mounting the filter facing the welding pad of the photosensitive chip on the photosensitive chip; Providing a functional element having a welding pad and a first carrier substrate on which the filter is temporarily bonded, wherein the welding pad of the functional element faces the first carrier substrate; Forming a packaging layer covering the first carrier substrate and the functional device and covering at least a partial sidewall of the photosensitive chip; Removing the first carrier substrate; And after removing the first carrier substrate, forming a rewiring structure electrically connected to the welding pad of the photosensitive chip and the welding pad of the functional element on one side of the packaging layer adjacent to the filter. . The present invention improves the use performance of the lens module and reduces the overall thickness of the lens module.

Description

Photographic assembly and packaging method thereof, lens module, electronic device

Embodiments of the present invention pertain to the field of lens modules, and more particularly, to an imaging assembly and a packaging method thereof, a lens module, and an electronic device.

With the constant improvement of people's living standards, leisure life becomes more abundant, and photography is increasingly becoming a means commonly used by people to record travel and various daily lives, so an electronic device equipped with a photographing function (e.g. For example, mobile phones, tablet PCs, cameras, etc.) are increasingly used in people's daily life and work, and electronic devices equipped with a shooting function are becoming essential and important tools in modern life.

Lens modules are generally installed in electronic devices having a photographing function, and the design level of the lens modules is one of the important factors that determine photographing quality. The lens module generally includes a photographing assembly including a photosensitive chip and a lens assembly fixed above the photographing assembly to form a subject image.

In addition, in order to improve the imaging capability of the lens module, a photosensitive chip having a larger imaging area should be provided, and in general, passive elements such as resistors and capacitors and peripheral chips may be disposed in the lens module.

The problem to be solved by an embodiment of the present invention is to provide a photographing assembly and a packaging method thereof, a lens module, and an electronic device, which improves the use performance of a lens module and reduces the overall thickness of the lens module.

In order to solve the above problems, an embodiment of the present invention includes the steps of providing a photosensitive chip and a filter having a welding pad; Mounting the filter facing the welding pad of the photosensitive chip on the photosensitive chip; Providing a functional element having a welding pad and a first carrier substrate on which the filter is temporarily bonded, wherein the welding pad of the functional element faces the first carrier substrate; Forming a packaging layer covering the first carrier substrate and the functional device and covering at least a partial sidewall of the photosensitive chip; Removing the first carrier substrate; And after removing the first carrier substrate, forming a redistribution structure electrically connected to the welding pad of the photosensitive chip and the welding pad of the functional element on one side of the packaging layer adjacent to the filter. It provides a packaging method of an imaging assembly.

Correspondingly, an embodiment of the present invention includes a packaging layer, a photosensitive unit inserted into the packaging layer, a functional element, and a redistribution structure, wherein the photosensitive unit includes a photosensitive chip and a filter mounted on the photosensitive chip, The bottom surface of the packaging layer is higher than the functional element, the packaging layer covers at least a partial sidewall of the photosensitive chip, and both the photosensitive chip and the functional element have a welding pad, and the welding pad of the photosensitive chip is the packaging. Facing the uppermost surface of the layer, the welding pad of the functional element is exposed to the uppermost surface of the packaging layer, the redistribution structure is located at one side close to the filter in the packaging layer, and the redistribution structure is in the welding pad It further provides a photographing assembly that is electrically connected.

Correspondingly, an embodiment of the present invention includes a photographing assembly according to an embodiment of the present invention; And a lens assembly mounted on an uppermost surface of the packaging layer, including a holder surrounding the photosensitive unit and the functional element, and electrically connected to the photosensitive chip and the functional element.

Correspondingly, an embodiment of the present invention further provides an electronic device including a lens module according to an embodiment of the present invention.

The technical solution according to an embodiment of the present invention has the following advantages over the prior art.

The embodiment of the present invention integrates a photosensitive chip and a functional element on a packaging layer and realizes electrical connection through a redistribution structure. Since the distance between the photosensitive chips is shortened, and the electrical connection distance between the photosensitive chip and the functional element is correspondingly shortened, the speed of transmitting signals is remarkably improved, thereby improving the usability of the lens module (e.g., shooting speed And improves the storage speed). In addition, due to the packaging layer and the rewiring structure, a circuit board (eg, a PCB) is correspondingly omitted, thereby reducing the overall thickness of the lens module, thereby satisfying the need for miniaturization and thinning of the lens module.

1 to 16 are structural schematic diagrams corresponding to each step in an embodiment of a packaging method of a photographing assembly according to the present invention.
17 to 20 are structural schematic diagrams corresponding to each step in another embodiment of the packaging method of the photographing assembly according to the present invention.
21 is a schematic structural diagram of an embodiment of a lens module according to the present invention.
22 is a structural schematic diagram of an embodiment of an electronic device according to the present invention.

Currently, the use performance of the lens module needs to be improved, and it is difficult for the lens module to satisfy the demand for miniaturization and thinning of the lens module. As a result of analysis, the cause is as follows.

Conventional lens modules are mainly assembled with circuit boards, photosensitive chips, functional elements (eg, peripheral chips) and lens assemblies, and peripheral chips are generally mounted on peripheral main boards, and the photosensitive chips and functional elements are separated from each other. do. Here, the circuit board serves to support the photosensitive chip, the functional element, and the lens assembly, and realizes electrical connection between the photosensitive chip, the functional element, and the lens module through the circuit board.

However, in accordance with the demands of high-pixel and ultra-thin lens modules, the demand for imaging of the lens module is increasing, and the area of the photosensitive chip is correspondingly increased, and the functional elements are correspondingly increased, so that the size of the lens module is gradually increased. Therefore, it does not satisfy the demand for miniaturization and thinning of the lens module. In addition, since the photosensitive chip is generally installed inside the holder of the lens module, and the peripheral chip is generally installed outside the holder, there is a certain distance between the peripheral chip and the photosensitive chip, thereby reducing the speed of signal transmission. Since the peripheral chips generally include a digital signal processor (DSP) chip and a memory chip, it is easy to adversely affect the recording speed and the storage speed, thereby deteriorating the use performance of the lens module.

In order to solve the above technical problem, the embodiment of the present invention integrates a photosensitive chip and a functional element in a packaging layer and realizes electrical connection through a rewiring structure, compared to a solution means of mounting the functional element on a peripheral main board. Embodiments of the invention shorten the distance between the functional element and the photosensitive chip, and correspondingly shorten the electrical connection distance between the photosensitive chip and the functional element, thereby significantly improving the speed of signal transmission, thereby improving the use performance of the lens module. Let it. Further, due to the packaging layer and the redistribution structure, the circuit board is correspondingly omitted, thereby reducing the overall thickness of the lens module, thereby satisfying the need for miniaturization and thinning of the lens module.

Specific embodiments of the present invention will be described in detail with reference to the following drawings so that the objects, features, and advantages of the present invention may be more clearly and easily understood.

1 to 16 are structural schematic diagrams corresponding to each step in an embodiment of a packaging method of a photographing assembly according to the present invention.

1 to 3, FIG. 2 is an enlarged view of one photosensitive chip in FIG. 1, and FIG. 3 is an enlarged view of one filter in FIG. 1, and a photosensitive chip having a welding pad ( 200) and a filter 400 are provided, and the filter 400 facing the welding pad of the photosensitive chip 200 is mounted on the photosensitive chip 200.

The photosensitive chip 200 is an image sensor chip, and in this embodiment, the photosensitive chip 200 is a CMOS image sensor (CIS) chip. In another embodiment, the photosensitive chip may be a charge coupled device (CCD) image sensor chip.

In this embodiment, the photosensitive chip 200 includes an optical signal receiving surface 201 (as shown in FIG. 2), and the photosensitive chip 200 is Is received and sensed. Specifically, as shown in FIG. 2, the photosensitive chip 200 includes a photosensitive area 200C and a peripheral area 200E surrounding the photosensitive area 200C, and the optical signal receiving surface 201 is It is located in the photosensitive region 200C.

Since the photosensitive chip 200 includes a plurality of pixel units, the photosensitive chip 200 includes a plurality of semiconductor photosensitive devices (not shown), and a plurality of filter coatings (not shown) located on the semiconductor photosensitive device. ), and the filter coating selectively absorbs or passes the optical signal received by the optical signal receiving surface 201. The photosensitive chip 200 further includes a microlens 210 positioned on the filter coating, and the microlens 210 is a one-to-one correspondence with the semiconductor photosensitive device, thereby condensing the received light radiation signal beam to the semiconductor photosensitive device. . The optical signal receiving surface 201 is correspondingly the uppermost surface of the microlens 210.

The photosensitive chip 200 is generally a silicon substrate chip, and is manufactured by an integrated circuit manufacturing technology, and the photosensitive chip 200 includes a welding pad for realizing electrical connection between the photosensitive chip 200 and other chips or members. . In this embodiment, the photosensitive chip 200 includes a first chip welding pad 220 formed in the peripheral area 200E. Specifically, the surface of the photosensitive chip 200 positioned on the same side of the optical signal receiving surface 201 exposes the first chip welding pad 220.

The filter 400 is mounted on the photosensitive chip 200 to prevent contamination of the optical signal receiving surface 201 by a subsequent packaging process, and is advantageous in reducing the overall thickness of the subsequent lens module, thereby miniaturizing the lens module. , Satisfy the needs of thinner.

The filter 400 may be an infrared filter glass piece or an entire transmission glass piece. In this embodiment, the filter 400 is an infrared filter glass piece, and the effect of infrared rays in incident light on the performance of the photosensitive chip 200 is eliminated.

Specifically, the filter 400 is an infrared cut filter (IRCF), and the infrared cut filter may be a blue glass infrared cut filter, or an infrared cut filter located on the glass and the glass surface (IR cut filter). coating).

In this embodiment, the filter 400 includes an assembly surface 401 (as shown in Fig. 1). The assembly surface 401 is a surface on which the photosensitive chip 200 is mounted, that is, a surface facing the photosensitive chip 200.

Specifically, when the filter 400 is a blue glass infrared cut filter, a reflection reducing coating or an antireflection coating is plated on one surface of the blue glass infrared cut filter, and antireflection The surface of the coating or anti-reflective film and the other surface is the assembly surface 401. When the filter 400 includes glass and an infrared blocking coating positioned on the surface, the glass surface that is opposite to the infrared blocking coating is an assembly surface 401. In another embodiment, when the filter is a whole piece of transparent glass, either surface of the whole piece of transparent glass is an assembled surface.

As shown in FIG. 3, the filter 400 includes a light-transmitting area 400C and an edge area 400E surrounding the light-transmitting area 400C. After the lens module is subsequently formed, the light-transmitting area 400C allows external incident light to pass therethrough, so that the optical signal receiving surface 201 receives the optical signal, thereby ensuring a normal use function of the lens module. The edge region 400E leaves a space position for mounting the filter 400 and the photosensitive chip 200.

In this embodiment, after mounting the filter 400 on the photosensitive chip 200, the filter 400 and the photosensitive chip 200 constitute a photosensitive unit 250 (as shown in FIG. 1). do.

1, in this embodiment, the filter 400 is mounted on the photosensitive chip 200 through an adhesive structure 410, and the adhesive structure 410 attaches the optical signal receiving surface 201 to the Surround.

The adhesive structure 410 physically connects the filter 400 and the photosensitive chip 200. In addition, the filter 400, the adhesive structure 410, and the photosensitive chip 200 form a cavity (not shown) to prevent direct contact between the filter 400 and the photosensitive chip 200, so that the filter 400 ) Is prevented from adversely affecting the performance of the photosensitive chip 200.

In this embodiment, the adhesive structure 410 surrounds the optical signal receiving surface 201 so that the filter 400 above the optical signal receiving surface 201 is located in the photosensitive path of the photosensitive chip 200. .

Specifically, since the material of the bonding structure 410 is a material capable of photolithography, the bonding structure 410 can be formed using a photolithography process, which improves the shape quality and size precision of the bonding structure 410 In addition, it is advantageous in improving packaging efficiency and production capacity, and it is also possible to reduce the influence on the adhesive strength of the adhesive structure 410. In this embodiment, the material of the adhesive structure 410 is a photolithographic dry film. In another embodiment, the material of the adhesive structure may be a photolithographic polyimide, a photolithographic polybenzoxazole (PBO), or a photolithographic benzocyclobutene (BCB).

In this embodiment, in order to reduce the difficulty of forming the adhesive structure 410 and reduce the influence of the formation of the adhesive structure 410 on the optical signal receiving surface 201, the adhesive structure 410 is applied to the filter 400. ) To form.

Specifically, as shown in FIG. 1, the mounting step may include providing a third carrier substrate 340; Temporarily bonding a surface of the filter 400 against the assembly surface 401 to the third carrier substrate 340; Forming an annular adhesive structure 410 on the edge region 400E of the filter 400 after the temporary bonding step; And a peripheral area 200E (as shown in FIG. 2) of the photosensitive chip 200 so that the optical signal receiving surface 201 of the photosensitive chip 200 faces the annular adhesive structure 410. Attaching to the adhesive structure 410 to form the photosensitive unit 250.

The third carrier substrate 340 improves process operability by providing a process platform for the bonding step. In this embodiment, the third carrier substrate 340 is a carrier wafer. In another embodiment, the third carrier substrate may be a different type of substrate.

Specifically, the filter 400 is temporarily bonded to the third carrier substrate 340 through the first temporary bonding layer 345. The first temporary bonding layer 345 is a peeling layer and is easy for subsequent debonding.

In this embodiment, the first temporary bonding layer 345 is a foam film. Since the foam membrane includes a micro-adhesive surface and a foam surface facing each other, the foam membrane has adhesiveness at room temperature, and the foam surface is adhered to the third carrier substrate 340, the foam membrane is subsequently heated to adhere to the foam surface. Debonding can be realized by removing. In another embodiment, the first temporary bonding layer may be a die attach film (DAF).

Referring to FIG. 4 with reference to FIG. 4, the point to be described is the step of adhering a surface of the photosensitive chip 200 to the UV film 310 on the back surface of the photosensitive chip 200 after the mounting step; And performing a first debonding treatment after the bonding step to remove the third carrier substrate 340 (as shown in FIG. 1 ).

Through the bonding step, a process is prepared for temporarily bonding the photosensitive unit 250 (as shown in FIG. 1) to another carrier substrate, and the UV film 310 is a third carrier substrate 340 ) To provide a supporting action and a fixing action to the photosensitive unit 250 after removal. Here, since the adhesion of the UV film 310 may be reduced under the irradiation of ultraviolet rays, it is easy to subsequently remove the photosensitive unit 250 from the UV film 310.

Specifically, by using a laminator, the UV film 310 is in close contact with the light signal receiving surface 201 of the photosensitive chip 200 to the back surface, and adhered to the bottom of the frame 315 having a relatively large diameter, and the frame By tightening the film through 315, the photosensitive unit 250 is divided and fixed to the UV film 310. This embodiment does not describe the UV film 310 and the frame 315 in more detail.

In this embodiment, since the first temporary bonding layer 345 (as shown in Fig. 1) is a foam film, in the step of the first debonding treatment, heat treatment is performed on the first temporary bonding layer 345 The first temporary bonding layer 345 is removed by removing the third carrier substrate 340 by removing the adhesiveness of the foam surface of the foam film, and then removing it.

With reference to FIG. 5, it should be described that the packaging method further includes forming a stress buffer layer 420 covering a sidewall of the filter 400.

The stress buffer layer 420 decreases the probability that the filter 400 is ruptured by subsequently reducing the stress generated by the packaging layer on the filter 400, thereby improving the reliability and yield rate of the packaging process. And correspondingly improve the reliability of the lens module. In particular, since the filter 400 is an infrared filter glass piece or an entire transmission glass piece, there is a high possibility that the glass piece is ruptured under the influence of stress, and thus the probability that the filter 400 is ruptured through the stress buffer layer 420 is significantly reduced. Can be reduced.

Since the stress buffer layer 420 has adhesiveness, adhesiveness in the filter 400 is guaranteed. In this embodiment, the material of the stress buffer layer 420 is an epoxy-based adhesive. The epoxy-based adhesive is an epoxy resin adhesive, and the epoxy-based adhesive is implemented in various forms, and by changing its components to obtain a material having a different modulus of elasticity, according to the actual situation, the filter 400 ), you can control the stress.

In this embodiment, the stress buffer layer 420 also covers the sidewall of the adhesive structure 410 to reduce the stress generated by the packaging layer on the adhesive structure 410, thereby further improving the reliability and yield rate of the packaging process. Let it.

In this embodiment, after bonding the surface facing the light signal receiving surface 201 of the photosensitive chip 250 to the UV film 310, the stress buffer layer 420 is formed through a dispensing process. do. The step of forming the stress buffer layer 420 by selecting a dispensing process improves the compatibility between the current packaging process and the process is simple.

In another embodiment, before bonding the photosensitive chip and the filter, the stress buffer layer may be formed.

6, a first carrier substrate 320 is provided, and a functional element (not shown) and the filter 400 are temporarily bonded to the first carrier substrate 320, and the functional element is a welding pad ( (Not shown), and the welding pad of the functional element faces the first carrier substrate 320.

By temporarily bonding the functional device and the photosensitive chip 200 to the first carrier substrate 320, a process is prepared for packaging integration and electrical integration of the subsequent functional device and the photosensitive chip 200.

Subsequent debonding is convenient through a temporary bonding (TB) method. here. The first carrier substrate 320 also provides a processing platform for the subsequent formation of the packaging layer.

In this embodiment, the first carrier substrate 320 is a carrier wafer. In another embodiment, the first carrier substrate may be a different type of substrate.

Specifically, the filter 400 and the functional element are temporarily bonded to the first carrier substrate 320 through the second temporary bonding layer 325. For a detailed description of the second temporary bonding layer 325, reference may be made to the corresponding description of the first temporary bonding layer 345 (as shown in FIG. 1), which will not be described further here. .

In this embodiment, after temporarily bonding the filter 400 to the first carrier substrate 320, the first chip welding pad 220 of the photosensitive chip 200 faces the first carrier substrate 320.

Specifically, one photosensitive unit 250 (as shown in Fig. 1) UV film 310 (as shown in Fig. 5) at the location of the UV film 310 irradiated by UV irradiation to the UV film 310 Is removed, one photosensitive unit 250 is pushed through a piercing pin, and then the photosensitive unit 250 is lifted through an adsorption device, and the photosensitive unit 250 is removed from the UV film 310. They are sequentially peeled off and mounted on the first carrier substrate 320 at a predetermined position. By mounting the photosensitive units 250 to the first carrier substrate 320 one by one, the photosensitive unit 250 is advantageous in improving the positional accuracy of the first carrier substrate 320.

In this embodiment, only one photosensitive unit 250 has been described. In another embodiment, when the formed lens module is applied to a dual photographing or array module product, the number of the photosensitive units may be plural.

It should be explained that in this embodiment, after the photosensitive chip 200 and the filter 400 are mounted, the filter 400 is temporarily bonded to the first carrier substrate 320. In another embodiment, after temporarily bonding the filter to the first carrier substrate, the photosensitive chip and the filter may be mounted.

The functional element is a specific functional element other than the photosensitive chip 200 in the photographing assembly, and includes at least one of a peripheral chip 230 and a passive element 240.

In this embodiment, after temporarily bonding the functional element to the first carrier substrate 320 in order to reduce the difficulty in the process of subsequently forming the redistribution structure, the welding pad of the functional element is the first carrier substrate 320 ).

Here, the filter 400 is temporarily bonded to the first carrier substrate 320 and the welding pad of each functional element faces the first carrier substrate 320, so that the difference in thickness between the photosensitive chip 200 and the functional element is packaged. It is possible to prevent the influence on the layer forming process, and is advantageous in reducing the process complexity of subsequently forming the packaging layer.

In this embodiment, the functional element includes a peripheral chip 230 and a passive element 240.

The peripheral chip 230 is an active element, and when it is subsequently electrically connected to the photosensitive chip 200, a peripheral circuit is provided to the photosensitive chip 200, for example, an analog power supply circuit, a digital power supply. Circuits, voltage buffer circuits, shutter circuits, shutter driving circuits, and the like.

In this embodiment, the peripheral chip 230 includes one or both of a digital signal processor chip and a memory chip. In other embodiments, it may be a chip of another functional type. Although only one peripheral chip 230 is illustrated in FIG. 6, the number of peripheral chips 230 is not limited to one.

The peripheral chip 230 is generally a silicon substrate chip, manufactured by an integrated circuit manufacturing technology, and includes a welding pad for realizing electrical connection between the peripheral chip 230 and other chips or members. In this embodiment, the peripheral chip 230 includes a second chip welding pad 235, and after the peripheral chip 230 is temporarily bonded to the first carrier substrate 320, the second chip welding pad 235 faces the first carrier substrate 320.

The passive element 240 performs a specific action on the photosensitive operation of the photosensitive chip 200. The passive element 240 may include an electronic element having a relatively small volume, such as a resistor, a capacitance, an inductance, a diode, a triode, a potentiometer, a relay, or a driver. Although only one passive element 240 is shown in FIG. 6, the number of the passive elements 240 is not limited to one.

The passive element 240 also includes a welding pad for realizing electrical connection between the passive element 240 and another chip or member. In this embodiment, the welding pad of the passive element 240 is an electrode 245, and after temporarily bonding the passive element 240 to the first carrier substrate 320, the electrode 245 is a first carrier. It faces the substrate 320.

7 and 8, a packaging layer 350 (FIG. 8) covering the first carrier substrate 320 and a functional device (not shown) and at least covering a partial sidewall of the photosensitive chip 200 (FIG. 8). As shown in).

The packaging layer 350 serves to fix the photosensitive chip 200 and functional elements (for example, the peripheral chip 230 and the passive element 240), and package the photosensitive chip 200 and the functional element. Realize integration.

Here, not only the space occupied by the holder in the lens assembly can be reduced through the packaging layer 350, and the circuit board (eg, PCB) can be omitted, so that the total thickness of the subsequently formed lens module Is significantly reduced, thereby satisfying the demands of miniaturization and thinning of the lens module. In addition, compared to the solution means of mounting the functional element on the peripheral main board, the method of integrating both the photosensitive chip and the functional element on the packaging layer 350 reduces the distance between the photosensitive chip 200 and each functional element, and corresponds to It is advantageous in shortening the electrical connection distance between the photosensitive chip and each functional element, thereby improving the signal transmission speed and improving the use performance of the lens module (for example, improving the shooting speed and storage speed).

The packaging layer 350 also has insulating, sealing and moisture-proof functions, and is advantageous in improving the reliability of the lens module.

In this embodiment, the material of the packaging layer 350 is an epoxy resin. Epoxy resin has advantages such as low shrinkage, good adhesion, good corrosion resistance, excellent electrical properties, and relatively low cost. Therefore, it is widely used as a packaging material for electronic devices and integrated circuits.

Specifically, the packaging layer 350 is formed using an injection molding process. The injection molding process has features such as fast production speed, high efficiency, and possible operation automation, and is advantageous in improving production volume and reducing process cost. In another embodiment, the packaging layer may be formed using another molding process.

In this embodiment, the forming of the packaging layer 350 includes a packaging material layer 355 (as shown in FIG. 7) covering the first carrier substrate 320, the functional element, and the photosensitive chip 200. Equal to); And performing a grinding treatment on the packaging material layer 355 to form the packaging layer 350 parallel to the higher one of the photosensitive unit 250 and the functional element.

Since the thickness of the packaging layer 350 is reduced through the grinding treatment, the total thickness of the formed lens module is reduced.

Since the filter 400 is temporarily bonded to the first carrier substrate 320, in the process of forming the packaging material layer 355, there is no need to manufacture a mold required for the injection molding process, so the process is simple.

In this embodiment, since the total thickness of the photosensitive unit 250 is greater than the thickness of the functional element, after the grinding treatment, the surface of the packaging layer 350 facing the first carrier substrate 320 and the photosensitive chip ( Surfaces of the first carrier substrate 320 of 200 are parallel to each other, that is, the packaging layer 350 covers the sidewalls of the photosensitive chip 200.

In this embodiment, the packaging layer 350 further covers the sidewall of the filter 400 correspondingly, thereby improving the sealing property of the cavity among the photosensitive unit 250, and the probability that water vapor, oxidizing gas, etc. enter the cavity. Is reduced to ensure the performance of the photosensitive chip 200.

It should be explained that under the action of the packaging layer 350, the circuit board is omitted, thereby reducing the thickness of the lens module, so that the photosensitive chip 200 and the peripheral chip 230 are thinned. Since there is no need to proceed, the mechanical strength and reliability of the photosensitive chip 200 and the peripheral chip 230 are improved. In another embodiment, the thickness of the photosensitive chip and the peripheral chip may be appropriately reduced according to the process requirements, but the thinning amount is relatively small so that the mechanical strength and reliability thereof are not affected.

Referring to FIG. 9, a second debonding process is performed to remove the first carrier substrate 320 (as shown in FIG. 8 ).

The first carrier substrate 320 is removed to expose the welding pad of the functional device, thereby preparing a process for a subsequent electrical connection process.

In this embodiment, the step of the second debonding process includes sequentially removing the first carrier substrate 320 and the second temporary bonding layer 325 (as shown in FIG. 8 ). . For a detailed description of the second debonding process, reference may be made to the related description of the first debonding process, which will not be further described herein.

10 to 14, after removing the first carrier substrate 320 (as shown in FIG. 8), one side of the packaging layer 350 close to the filter 400 A redistribution layer (RDL) structure 360 electrically connected to the welding pad of the photosensitive chip 200 and the welding pad (not shown) of the functional element (not shown) (as shown in FIG. 14) To form.

The redistribution structure 360 realizes electrical integration of the formed photographing assembly. Here, by reducing the distance between the photosensitive chip 200 and the functional element through the packaging layer 350 and the redistribution structure 360, and correspondingly shortening the electrical connection distance, the speed of transmitting a signal is improved, Improves the use performance of the lens module. Specifically, since the peripheral chip 230 includes one or two of a digital signal processor chip and a memory chip, it is advantageous to increase a shooting speed and a storage speed accordingly.

In addition, by selecting the rewiring structure 360, the distance between the photosensitive chip 200 and the functional element can be reduced, and the possibility of an electrical connection process can be improved. Compared to the wire bonding process, the rewiring structure 360 Mass production is possible, and packaging efficiency can be improved.

In addition, after forming the rewiring structure 360 on one side of the packaging layer 350 close to the filter 400, and subsequently assembling the lens assembly to the packaging layer 350, the cultivation Since the wire structure 360 is correspondingly positioned in the holder of the lens assembly to protect the redistribution structure 360, it is advantageous to improve the reliability and stability of the lens module, and to facilitate subsequent packaging of the lens module.

In this embodiment, the redistribution structure 360 is electrically connected to the first chip welding pad 220, the second chip welding pad 235 and the electrode 245. Here, since the packaging layer 350 exposes the second chip welding pad 235 and the electrode 245, the process of forming the redistribution structure 360 is relatively simple.

Specifically, the step of forming the redistribution structure 360 includes the following steps.

Referring to FIGS. 10 and 11, a conductive column 280 (as shown in FIG. 11) electrically connected to the welding pad of the photosensitive chip 200 is formed in the packaging layer 350.

The conductive column 280 is electrically connected to the first chip welding pad 220 to serve as an external connection electrode of the photosensitive chip 200, and the photosensitive chip 200 is provided through the conductive column 280. It is electrically connected to the functional element. Here, the conductive column 280 may be electrically connected to a metal connection structure in the photosensitive chip 200, and may be directly electrically connected to the first chip welding pad 220 through the photosensitive chip 200. have.

The top surface of the conductive column 280 is exposed to the packaging layer 350, and an external connection electrode of the photosensitive chip 200 and a welding pad of the functional element are formed through the conductive column 280 to the packaging layer 350. By setting it to be located on the same side of, the difficulty in the process of forming the redistribution structure is reduced. The top surface of the conductive column 280 refers to a surface on which the conductive column 280 faces the photosensitive chip 200 along the extending direction of the conductive column 280.

In this embodiment, since the material of the conductive column 280 is copper, the conductivity of the conductive column 280 is improved and the difficulty of the process of the conductive column 280 is reduced. In another embodiment, the material of the conductive column may be another applicable conductive material such as tungsten.

Specifically, the forming of the conductive column 280 includes a conductive through hole 351 for exposing the first chip welding pad 220 in the packaging layer 350 by patterning the packaging layer 350 (Fig. As shown in Fig. 10); And forming the conductive column 280 in the conductive through hole 351.

In this embodiment, the conductive through hole 351 is formed through an etching process. Specifically, the conductive through hole 351 is formed by etching the packaging layer 350 through a laser etching process. Since the laser etching process has a relatively high precision, the formation position and size of the conductive through-hole 351 can be determined with relatively high precision.

In this embodiment, the conductive column 280 is formed in the conductive through hole 351 through an electroplating process.

Compared to the solution of bonding the conductive column into the conductive through-hole, the solution of forming the conductive column 280 in the conductive through-hole 351 through the filling method of the present embodiment is difficult in the process of forming the conductive column 280 , Prevents an alignment problem from occurring, and improves electrical connection reliability between the conductive column 280 and the first chip welding pad 220.

12 to 14, a connection line 290 electrically connected to the conductive column 280 and the welding pad of the functional element at one side of the packaging layer 350 close to the filter 400 To form.

In this embodiment, the step of forming the connection line 290 includes the following steps.

As shown in FIG. 12, a second carrier substrate 330 on which the connection line 290 is formed is provided.

Specifically, forming a third temporary bonding layer 331 on the second carrier substrate 330; Forming a first medium layer 332 on the third temporary bonding layer; Forming a first connection groove (not shown) in the first medium layer 332 by patterning the first medium layer 332; The connection line 290 is formed in the first connection groove.

In this embodiment, since the connection line 290 is filled in the first connection groove, the complexity of the process of forming the connection line 290 is correspondingly reduced.

Here, the third temporary bonding layer 331 is a peeling layer, and it is easy to subsequently separate the connection line 290 from the second carrier substrate 330. In this embodiment, the third temporary bonding layer 331 may be a foam film, and a detailed description of the third temporary bonding layer 331 is described in the second temporary bonding layer 345 (shown in FIG. 1 ). As described above), the corresponding description can be referred to, and no further explanation is made here.

The first connection groove in the first medium layer 332 is for defining the shape, position, and size of the connection line 290. In this embodiment, the material of the first medium layer 332 is a photosensitive material, and correspondingly, it may be patterned through a photolithography process. Specifically, the material of the first medium layer 332 is photosensitive polyimide, photosensitive benzocyclobutene, or photosensitive polybenzoxazole.

Since the first medium layer 332 of the above-described material has relatively strong corrosion resistance, after forming the connection line 290, by removing the first medium layer 332 using a reactive ion etching process, subsequent It provides a process basis for a more efficient electrical connection process.

It should be noted that in another embodiment, prior to the step of forming a third temporary bonding layer on the second carrier substrate, the step of forming a passivation layer on the second carrier substrate is further included. By preventing contamination of the second carrier substrate through the passivation layer, the second carrier substrate can be reused. In this embodiment, the material of the passivation layer may be silicon oxide or silicon nitride.

It should be further explained that, in another embodiment, when a material (eg, aluminum) that is easily patterned through etching is selected as the connection line, the connection line may be formed through an etching method. Correspondingly, the forming of the connection line may include forming a conductive layer on the third temporary bonding layer; And etching the conductive layer to form a connection line.

13 and 14, in the present embodiment, the step of forming the redistribution structure 360 (as shown in FIG. 14) includes the conductive column 280 and the welding pad of the functional element. Forming a conductive protruding block 365 on the; And bonding the connection line 290 to the conductive protruding block 365 to electrically connect the conductive protruding block 365 to the conductive protruding block 365.

The conductive column 280, the conductive protruding block 365, and the connection line 290 constitute the redistribution structure 360.

The conductive protruding block 365 protrudes from the conductive column 280, the second chip welding pad 235 and the electrode 245, and the connection line 290 and the conductive column 280 through the conductive protruding block 365. , It improves the bonding reliability between the second chip welding pad 235 and the electrode 245.

In addition, the method of forming the conductive protruding block 365 on the conductive column 280, the second chip welding pad 235 and the electrode 245 is advantageous in improving the positional accuracy of the conductive protruding block 365, and the conductive The difficulty of forming the protruding block 365 is reduced.

In this embodiment, the conductive protruding block 365 is formed using a bumping process. Selecting the bumping process is advantageous in improving the reliability of signal transmission between each chip and device and the redistribution structure 360. Specifically, the material of the conductive protruding block 365 may be tin.

In this embodiment, the connection line 290 is bonded to the conductive protruding block 365 using a metal bonding process.

Specifically, the metal bonding process is a thermal compression bonding process. In the metal bonding process, the contact surface of the connection line 290 and the conductive protrusion block 365 undergoes plastic deformation under the action of pressure so that the atoms of the contact surface come into contact with each other, and as the bonding temperature increases, the diffusion of atoms on the contact surface is accelerated. Crossover spread is made. After reaching a certain bonding time, the crystal lattice of the contact surface is recombined to perform bonding, and the bonding strength, electrical conduction thermal conductivity, electric field diffusion resistance, and mechanical connection performance are relatively high.

It should be explained that as the bonding temperature increases, the atoms on the contact surface acquire more energy, the diffusion between the atoms is more pronounced, and the increase in the bonding temperature can promote grain growth and acquire energy. Since one crystal grain can crossover grow, it is advantageous in removing the interface, thus allowing the material of the contact surface to be integrated. However, if the bonding temperature is too high, the photosensitive chip 200 and the peripheral chip 230, in particular, have a bad effect on the performance of the photosensitive element in the formed photographing assembly, and if the process temperature is too high, thermal stress may occur. Is lowered, process cost increases, and production efficiency decreases. Accordingly, in this embodiment, the metal bonding process is a metal low-temperature bonding process, and the bonding temperature of the metal bonding process is less than or equal to 250°C. Here, the minimum value of the bonding temperature only needs to be capable of bonding.

Under the setting of the bonding temperature, the bonding quality of the connection line 290 and the conductive protruding block 365 is improved by increasing the pressure to facilitate diffusion between atoms. Thus, in this embodiment, the pressure of the metal bonding process is greater than or equal to 200 kPa. Here, the pressure is generated by the pressing tool.

Bonding time can also increase bonding quality. Accordingly, in this embodiment, the bonding time of the metal bonding process is greater than or equal to 30 minutes.

It should be explained that in an actual process, the bonding temperature, pressure, and bonding time are rationally adjusted and mixed with each other to ensure metal bonding quality and efficiency. It should be further explained, in order to reduce the probability that the contact surface is oxidized or contaminated, the metal bonding process may be performed in a vacuum environment.

It should be further explained that in another embodiment, after forming the connection line on the second carrier substrate, the conductive protruding block may be formed on the connection line. Correspondingly, the conductive protruding block is bonded to the corresponding conductive column and the welding pad of the functional element using a metal bonding process, and the conductive column, the conductive protruding block, and the connection line constitute the redistribution structure.

In the above embodiment, the forming of the conductive protruding block on the connection line may include forming a second medium layer covering the second carrier substrate and the connection line; Forming a connection through hole in the second medium layer by patterning the second medium layer and exposing a portion of the connection line; Forming the conductive protruding block in the connection through hole using an electroplating process; And removing the second medium layer.

Correspondingly, the material of the conductive protruding block may be the same as the material of the conductive column and the connection layer.

After forming the conductive protruding block, the second medium layer is removed using a reactive ion etching process.

For the description of the second medium layer, reference may be made to the corresponding description of the first medium layer, which will not be further described herein.

In this embodiment, after the redistribution structure 360 is formed, a third debonding process is performed to remove the second carrier substrate 330 and the third temporary bonding layer 331. For a detailed description of the third debonding process, reference may be made to a related description of the first debonding process, which will not be further described herein.

Referring to FIG. 15, after the third debonding process step, a step of performing a dicing process on the packaging layer 350 is further included.

By forming one photographing assembly 260 whose size meets the process requirements through the dicing process, a process is prepared for subsequent mounting of the lens assembly. In this embodiment, the dicing treatment is performed using a laser cutting process.

Referring to FIG. 16, after the step of forming the redistribution structure 360, bonding a flexible printed circuit board (FPC) 510 to the redistribution structure 360 is further performed. Includes.

When the circuit board is omitted, the flexible circuit board (FPC) 510 realizes an electrical connection between the photographing assembly 260 and a subsequent lens assembly, and an electrical connection between the formed lens module and other elements. After the lens module is subsequently formed, the lens module can also be electrically connected to other elements of the electronic device through the flexible circuit board (FPC) 510, thereby realizing a normal photographing function of the electronic device.

In this embodiment, since the circuit structure is provided on the flexible circuit board (FPC) 510, by bonding the flexible circuit board (FPC) 510 to the redistribution structure 360 through a metal bonding process, electrical Realize the connection. Specifically, the flexible circuit board (FPC) 510 is bonded to the connection line 290.

In this embodiment, in order to improve the processability, after the third debonding and dicing treatment, the flexible circuit board (FPC) 510 is bonded to the redistribution structure 360.

It should be described that a connector 520 is formed on the flexible circuit board (FPC) 510 to electrically connect the flexible circuit board (FPC) 510 and other circuit elements. When the lens module is applied to an electronic device, the connector 520 is electrically connected to the main board of the electronic device, thereby realizing information transmission between the lens module and another element of the electronic device, and an image of the lens module. Information is transmitted to the electronic device. Specifically, the connector 520 may be a gold finger connector.

17 to 20 are structural schematic diagrams corresponding to each step in another embodiment of the packaging method of the photographing assembly according to the present invention.

The same parts of this embodiment and the above-described embodiment will not be described further herein. A different part of this embodiment and the above-described embodiment is that the step of forming the redistribution structure 360a includes forming the conductive column 280a and the connection line 290a in the same step.

Specifically, referring to FIG. 17, a conductive through hole 351a exposing the first chip welding pad 220a is formed in the packaging layer 250a by patterning the packaging layer 250a.

In this embodiment, the conductive through hole 351a is formed through a laser etching process. For a detailed description of the step of forming the conductive through hole 351a, reference may be made to the corresponding description in the above-described embodiment, and no further description will be made here.

18, forming a third medium layer 332a that covers the packaging layer 350a, a filter (not shown), and a functional element (not shown) and is located in the conductive through hole 351a; The third medium layer 332a is patterned to remove the third medium layer 332a located in the conductive through hole 351a and higher than the uppermost partial region of the packaging layer 350a. A second connection groove (338a) is formed, and the second connection groove (338a) exposes the second chip welding pad (235a) and the electrode (245a), the second connection groove (338a) and the conductive penetration The hole 351a is electrically connected.

For a detailed description of the third medium layer 332a, reference may be made to the description corresponding to the first medium layer in the above-described embodiment, which will not be further described herein.

Referring to FIG. 19, a conductive material is filled in the second connection groove 338a (as shown in FIG. 18) and the conductive through hole 351a (as shown in FIG. 18), and the conductive through hole A conductive column 280a is formed in 351a, a connection line 290a is formed in the second connection groove 338a, and the connection line 290a and the conductive column 280a are integrated with the redistribution structure ( 360a).

In this embodiment, a conductive column 280a is formed in the conductive through hole 351a through an electroplating process, and a connection line 290a is formed in the second connection groove 338a.

Referring to FIG. 20, the third medium layer 332a (as shown in FIG. 19) is removed.

In this embodiment, the third medium layer 332a is removed using a reactive ion etching process.

For a detailed description of the packaging method according to the present embodiment, reference may be made to the corresponding description in the above-described embodiment, which will not be further described herein.

Correspondingly, an embodiment of the present invention further provides an imaging assembly. With continued reference to FIG. 16, a schematic structural diagram of an embodiment of an imaging assembly according to the present invention is shown.

The photographing assembly 260 includes a packaging layer 350, a photosensitive unit 250 (as shown in FIG. 1) inserted into the packaging layer 350 (as shown in FIG. 1), a functional element (not shown), and a redistribution structure 360 Including, wherein the photosensitive unit 250 includes a photosensitive chip 200 and a filter 400 mounted on the photosensitive chip 200, and the top surface of the packaging layer 350 is the filter 400 and functions Exposing the device, the bottom surface of the packaging layer 350 is higher than the functional device, the packaging layer 350 covers at least a partial sidewall of the photosensitive chip 200, wherein the photosensitive chip 200 and All functional elements are provided with a welding pad, the welding pad of the photosensitive chip 200 faces the uppermost surface of the packaging layer 350, the welding pad of the functional element is exposed to the uppermost surface of the packaging layer 350, The redistribution structure 360 is located at one side of the packaging layer 350 adjacent to the filter 400, and the redistribution structure 360 is electrically connected to the welding pad.

The packaging layer 350 fixes the photosensitive chip 200 and functional elements, and realizes packaging integration for the photosensitive chip 200 and functional elements. Here, the space occupied by the holder in the lens assembly can be reduced through the packaging layer 350, and the circuit board can be omitted, thereby significantly reducing the overall thickness of the lens module, thereby miniaturizing the lens module, Satisfies the needs of thinner.

The material of the packaging layer 350 is a molding material, and the packaging layer 350 also has insulation, sealing, and moisture-proof effects, which is advantageous in improving the reliability of the lens module. In this embodiment, the material of the packaging layer 350 is an epoxy resin.

In this embodiment, the packaging layer 350 includes a top surface and a bottom surface facing each other. Here, the top surface of the packaging layer 350 is a surface for mounting the lens assembly.

In this embodiment, the bottom surface of the packaging layer 350 is parallel to the higher one of the photosensitive unit 250 and the functional element. Correspondingly, the process of forming the packaging layer 350 is prevented from being affected by the difference in thickness between the photosensitive chip 200 and the functional element, and in the process of forming the packaging layer 350, it is necessary to manufacture a mold. So, the process is simple.

In the present embodiment, since the total thickness of the photosensitive unit 250 is greater than the thickness of the functional element, the bottom surface of the packaging layer 350 and the surface facing the filter 400 of the photosensitive chip 200 are one It is in a plane, that is, the packaging layer 350 covers the sidewall of the photosensitive chip 200.

In addition, the packaging layer 350 further covers the sidewall of the filter 400, thereby improving the sealing property of the cavity in the photosensitive unit 250, and reducing the probability that water vapor, oxidizing gas, etc. enter the cavity, thereby reducing the photosensitive chip. To ensure the performance of 200.

The photosensitive chip 200 is an image sensor chip. In this embodiment, the photosensitive chip 200 is a CMOS image sensor chip. In another embodiment, the photosensitive chip may be a CCD image sensor chip.

In this embodiment, the photosensitive chip 200 includes a photosensitive area 200C (as shown in FIG. 2) and a peripheral area 200E surrounding the photosensitive area 200C (as shown in FIG. 2). Including, the photosensitive chip 200 further includes an optical signal receiving surface 201 located in the photosensitive region (200C).

The photosensitive chip 200 is generally a silicon substrate chip, and a welding pad of the photosensitive chip 200 is for realizing electrical connection between the photosensitive chip 200 and other chips or members. In this embodiment, the photosensitive chip 200 includes a first chip welding pad 220 positioned in the peripheral region 200E, and the first chip welding pad 220 faces the top surface of the packaging layer 350. .

Mounting the filter 400 on the photosensitive chip 200 prevents the packaging process from contaminating the optical signal receiving surface 201, and reduces the overall thickness of the lens module, thereby satisfying the need for miniaturization and thinning of the lens module.

In order to realize the normal function of the lens module, the filter 400 may be an infrared filter glass piece or an entire transmission glass piece. In this embodiment, the filter 400 is an infrared filter glass piece, and the infrared ray in incident light removes an effect on the performance of the photosensitive chip 200, and is advantageous in improving the imaging effect.

In this embodiment, the filter 400 is mounted on the photosensitive chip 200 through an adhesive structure 410, and the adhesive structure 410 surrounds the optical signal receiving surface 201. The adhesive structure 410 physically connects the filter 400 and the photosensitive chip 200. By preventing direct contact between the filter 400 and the photosensitive chip 200, it is prevented from exerting a bad influence on the optical performance of the photosensitive chip 200.

In this embodiment, the material of the adhesive structure 410 is a photolithographic dry film. In another embodiment, the material of the adhesive structure may be a photolithographic polyimide, a photolithographic polybenzoxazole, or a photolithographic benzocyclobutene.

In this embodiment, the adhesive structure 410 surrounds the optical signal receiving surface 201 so that the filter 400 above the optical signal receiving surface 201 is located in the photosensitive path of the photosensitive chip 200. Thus, the performance of the photosensitive chip 200 is guaranteed.

It should be described that only one photosensitive unit 250 has been described in this embodiment. In another embodiment, when the lens module is applied to a dual imaging or array module product, the number of photosensitive units may be plural.

It should be described further that, since the packaging layer 350 covers the sidewall of the filter 400, the photographing assembly 260 includes a stress buffer layer positioned between the packaging layer 350 and the sidewall of the filter 400 ( 420). The stress buffer layer 420 is advantageous in reducing the stress generated by the packaging layer 350 on the filter 400, and thus reduces the probability that the filter 400 is ruptured, thereby improving the reliability of the lens module.

In this embodiment, the material of the stress buffer layer 420 is an epoxy-based adhesive.

In this embodiment, the stress buffer layer 420 is also located between the packaging layer 350 and the sidewall of the adhesive structure 410, so that the packaging layer 350 is generated with respect to the adhesive structure 410. Since the stress is reduced, it is advantageous to further improve the reliability and yield rate of the photographing assembly 260.

The functional element is a specific functional element other than the photosensitive chip 200 in the photographing assembly, and includes at least one of a peripheral chip 230 and a passive element 240.

In this embodiment, the functional element includes a peripheral chip 230 and a passive element 240.

In this embodiment, the welding pad of the functional device is exposed on the top surface of the packaging layer 350, thereby reducing the complexity of a process of forming the connection structure 360.

The peripheral chip 230 is an active element, and provides a peripheral circuit to the photosensitive chip 200, for example, an analog power supply circuit, a digital power supply circuit, a voltage buffer circuit, a shutter circuit, a shutter driving circuit, etc. do.

In this embodiment, the peripheral chip 230 includes one or both of a digital signal processor chip and a memory chip. In another embodiment, the peripheral chip may be a chip of another functional type. Although only one peripheral chip 230 is illustrated in FIG. 16, the number of peripheral chips 230 is not limited to one.

The peripheral chip 230 is generally a silicon substrate chip, and a welding pad of the peripheral chip 230 is for realizing electrical connection between the peripheral chip 230 and other chips or members. In this embodiment, the peripheral chip 230 includes a second chip welding pad 235 exposed on the top surface of the packaging layer 350.

The passive element 240 performs a specific action on the photosensitive operation of the photosensitive chip 200. The passive element 240 may include an electronic element having a relatively small volume, such as a resistor, a capacitance, an inductance, a diode, a triode, a potentiometer, a relay, or a driver. Although only one passive element 240 is shown in FIG. 16, the number of the passive elements 240 is not limited to one.

The welding pad of the passive element 240 is for realizing electrical connection between the passive element 240 and another chip or member. In this embodiment, the welding pad of the passive element 240 is an electrode 245, and the electrode 245 is exposed on the top surface of the packaging layer 350.

The redistribution structure 360 realizes electrical integration of the imaging assembly. Through the redistribution structure 360 and the packaging layer 350, the use performance of the lens module is improved (for example, a photographing speed and a storage speed are improved). In addition, the possibility of an electrical connection process and packaging efficiency are improved through the redistribution structure 360.

The redistribution structure 360 is located on one side of the packaging layer 350 close to the filter 400, and after assembling the lens assembly on the top surface of the packaging layer 350, the redistribution structure 360 corresponds to Since it is positioned in the holder of the lens assembly, it is advantageous to improve the reliability and stability of the lens module, and it is easy for subsequent packaging of the lens module.

In this embodiment, the redistribution structure 360 is electrically connected to the first chip welding pad 220, the second chip welding pad 235 and the electrode 245.

The first chip welding pad 220 of the photosensitive chip 200 faces the filter 400, that is, the first chip welding pad 220 faces the uppermost surface of the packaging layer 350, and the second chip welding pad 235 ) And the electrode 245 are exposed on the top surface of the packaging layer 350, so the redistribution structure 360 is located in the packaging layer 350 and electrically connected to the first chip welding pad 220 ( 280); And a connection line 290 positioned on the second chip welding pad 235, the electrode 245 and the conductive column 280 and electrically connected to the second chip welding pad 235, the electrode 245 and the conductive column 280. Includes.

The conductive column 280 is electrically connected to the first chip welding pad 220 to act as an external connection electrode of the photosensitive chip 200, and the external connection electrode of the photosensitive chip 200 and the second chip welding pad ( By allowing the 235 and the electrode 245 to be positioned on the same side of the packaging layer 350, electrical connection between the photosensitive chip 200, the peripheral chip 230 and the passive element 240 is realized. Here, the conductive column 280 may be electrically connected to a metal connection structure in the photosensitive chip 200, and may be directly electrically connected to the first chip welding pad 220 through the photosensitive chip 200. have.

In this embodiment, the materials of the conductive column 280 and the connection line 290 are all copper. If the copper material is selected, it is advantageous to improve the electrical connection reliability and conductivity of the redistribution structure 360, and in addition, the difficulty of forming the conductive column 280 and the connection line 290 may be reduced. In another embodiment, the material of the conductive column and the connection line may be another applicable conductive material.

In this embodiment, since the conductive column 280 and the connection line 290 are formed in different formation steps, the connection line 290 and the conductive column 280, the second chip welding pad 235 and the electrode 245 are formed. The spaces are bonded to each other through a metal bonding method.

In this embodiment, the redistribution structure 360 further includes a conductive protruding block 365 positioned between the connection line 290 and the second chip welding pad 235, the electrode 245, and the conductive column 280, respectively. Includes. The conductive protruding block 365 protrudes from the conductive column 280, the second chip welding pad 235 and the electrode 245, and the connection line 290 and the conductive column 280, the second chip welding pad 235, and Bonding reliability between the electrodes 245 is improved.

In this embodiment, the conductive protruding block 365 is a bump. By selecting the bump, the reliability of signal transmission between each chip and device and the redistribution structure 360 is improved. Specifically, the material of the conductive protruding block 365 may be tin. In another embodiment, the material of the conductive protruding block may be the same as the material of the connection line.

In this embodiment, the photographing assembly 260 further includes a flexible circuit board (FPC) 510 positioned on the redistribution structure 360. When the circuit board is omitted, the flexible circuit board (FPC) 510 realizes an electrical connection between the photographing assembly 260 and the lens assembly, and between the lens module and other elements, and the lens module is the flexible circuit. The substrate (FPC) 510 can be electrically connected to other elements of the electronic device, thereby realizing a normal photographing function of the electronic device.

Specifically, the flexible circuit board (FPC) 510 is bonded to the connection line 290. The flexible circuit board (FPC) 510 is provided with a circuit structure, thereby realizing electrical connection between the flexible circuit board (FPC) 510 and the redistribution structure 360.

The point to be described is that the connector 520 is provided on the flexible circuit board (FPC) 510. When the lens module is applied to an electronic device, the connector 520 is electrically connected to the main board of the electronic device, thereby realizing information transmission between the lens module and other elements of the electronic device, and transmitting image information of the lens module. To the electronic device. Specifically, the connector 520 may be a gold finger connector.

The photographing assembly according to the present exemplary embodiment may be formed by the packaging method according to the first exemplary embodiment, or may be formed by another packaging method. For a detailed description of the photographing assembly according to the present embodiment, reference may be made to the corresponding description in the above-described first embodiment, and the present embodiment will not be described further herein.

With continued reference to FIG. 20, a schematic structural diagram of another embodiment of the photographing assembly is shown.

The same parts of this embodiment and the above-described embodiment will not be described further herein. A different part of this embodiment and the above-described embodiment is that the redistribution structure 360a includes only the conductive column 280a and the connection line 290a.

The photographing assembly according to the present embodiment may be formed by a packaging method different from that of the second embodiment, or may be formed by a different packaging method. For a detailed description of the photographing assembly according to the present embodiment, reference may be made to the corresponding description in the second embodiment, and the present embodiment will not be described further.

Correspondingly, an embodiment of the present invention further provides a lens module. As shown in Fig. 21, a structural schematic diagram of an embodiment of a lens module according to the present invention is shown.

The lens module 600 includes a photographing assembly (as shown in a dotted block in FIG. 21) according to an embodiment of the present invention. The lens assembly 530 includes a holder 535, and the holder 535 is mounted on an uppermost surface of the packaging layer (not shown) and surrounds the photosensitive unit (not shown) and a functional element (not shown), and the The lens assembly 530 is electrically connected to the photosensitive chip (not shown) and the functional element.

The lens assembly 530 generally includes a holder 535, a motor (not shown) mounted on the holder 535, and a lens system (not shown) mounted on the motor, and includes the holder 535 Through this, the lens assembly 530 is easily assembled, and the lens system is positioned in the photosensitive path of the photosensitive unit.

In this embodiment, the thickness of the photographing assembly is relatively small, and the overall thickness of the lens module 600 is reduced by reducing the thickness of the lens assembly 530 through the packaging layer.

In addition, when comparing the solution means for installing both the photosensitive unit and the functional element (for example, a peripheral chip) inside the holder 535 and the solution means for mounting the functional element on the peripheral main board, this embodiment is a lens Since the size of the module 600 is reduced and the distance of the electrical connection is shortened, the signal transmission speed of the lens module 600 is improved, and the use performance of the lens module 600 is improved (for example, the shooting speed and Improves the storage speed).

In addition, the photosensitive unit and the functional element are all integrated in the packaging layer, and the photosensitive unit, the functional element, and the redistribution structure are all installed inside the holder 535 to protect the photosensitive unit, the functional element, and the redistribution structure. Therefore, it is advantageous to improve the reliability and stability of the lens module 600, and the imaging quality of the lens module 600 can be guaranteed.

In this embodiment, since the flexible circuit board (FPC) is bonded to the rewiring structure, the motor in the lens assembly 530 is correspondingly electrically connected to each chip and element in the photographing assembly through the flexible circuit board (FPC). do.

For a detailed description of the photographing assembly according to the present embodiment, reference may be made to the corresponding description in the above-described embodiment, and no further description will be made herein.

Correspondingly, an embodiment of the present invention further provides an electronic device. Referring to FIG. 22, a schematic structural diagram of an embodiment of an electronic device according to the present invention is shown.

In this embodiment, the electronic device 700 includes a lens module 600 according to an embodiment of the present invention.

Since the reliability and performance of the lens module 600 is relatively high, the photographing quality, photographing speed, and storage speed of the electronic device 700 are correspondingly improved. In addition, since the overall thickness of the lens module 600 is relatively small, it is advantageous in improving the user experience.

Specifically, the electronic device 700 may be a device having various photographing functions such as a mobile phone, a tablet PC, a camera, or a video camera.

Although the present invention has been disclosed as described above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the scope of protection of the present invention should be based on the scope defined in the claims.

Claims (27)

As a packaging method of a photographic assembly,
Providing a photosensitive chip and filter having a welding pad;
Mounting the filter facing the welding pad of the photosensitive chip on the photosensitive chip;
Providing a functional element having a welding pad and a first carrier substrate on which the filter is temporarily bonded, wherein the welding pad of the functional element faces the first carrier substrate;
Forming a packaging layer covering the first carrier substrate and the functional device and covering at least a partial sidewall of the photosensitive chip;
Removing the first carrier substrate; And
After removing the first carrier substrate, forming a rewiring structure electrically connected to a welding pad of the photosensitive chip and a welding pad of the functional element on one side of the packaging layer adjacent to the filter. Packaging method of a photographing assembly, characterized in that. The method of claim 1,
The step of forming the redistribution structure,
Forming a conductive column electrically connected to the welding pad of the photosensitive chip in the packaging layer; And
And forming a connection line electrically connected to the conductive column and the welding pad of the functional element on one side of the packaging layer adjacent to the filter. The method of claim 2,
Forming the conductive column,
Forming a conductive through hole in the packaging layer by patterning the packaging layer to expose the welding pad of the photosensitive chip; And
And forming the conductive column in the conductive through hole. The method of claim 2,
The step of forming the connection line,
Including the step of providing a second carrier substrate on which the connection line is formed,
The step of forming the redistribution structure,
Forming a conductive protruding block on the conductive column and the welding pad of the functional element; And
And bonding the connection line to the conductive protruding block. The method of claim 2,
The step of forming the connection line,
Including the step of forming a second carrier substrate on which the connection line is formed,
The step of forming the redistribution structure,
Forming a conductive protruding block on the connection line; And
And bonding the conductive protruding block to the corresponding conductive column and the welding pad of the functional element. The method according to claim 4 or 5,
Forming the connection line on the second carrier substrate,
Forming a first medium layer on the second carrier substrate;
Forming a first connection groove in the first medium layer by patterning the first medium layer;
Forming the connection line in the first connection groove; And
And removing the first medium layer. The method of claim 5,
Forming the conductive protruding block on the connection line,
Forming a second medium layer covering the second carrier substrate and the connection line;
Forming a connection through hole in the second medium layer by patterning the second medium layer and exposing a portion of the connection line;
Forming the conductive protruding block in the connection through hole; And
And removing the second medium layer. The method of claim 3,
The step of forming the connection line,
After forming the conductive through hole, forming a third medium layer located in the conductive through hole covering the packaging layer and the filter;
The third medium layer is patterned to remove a third medium layer located in the conductive through hole and higher than a partial region of the uppermost portion of the packaging layer, forming a second connection groove in the third medium layer, and Exposing the welding pad and electrically connecting the second connection groove and the conductive through hole;
In the step of forming the conductive column in the conductive through hole, forming the connection line in the second connection groove; And
And removing the third medium layer. The method of claim 3,
A packaging method of an imaging assembly, characterized in that the packaging layer is patterned through a laser etching process. The method of claim 3,
Packaging method of a photographing assembly, characterized in that forming the conductive column in the conductive through hole by using an electroplating process. The method of claim 4,
Packaging method of a photographing assembly, characterized in that forming the conductive protruding block using a bumping process. The method of claim 8,
The packaging method of a photographing assembly, comprising forming the conductive column in the conductive through hole using an electroplating process and forming the connection line in the second connection groove. The method according to claim 4 or 5,
A packaging method of a photographing assembly, characterized in that the bonding step is performed using a metal bonding process. The method of claim 1,
After mounting the filter on the photosensitive chip, temporarily bonding the filter to the first carrier substrate; or
After temporarily bonding the filter to the first carrier substrate, the filter is mounted on the photosensitive chip. The method of claim 1,
Before the step of forming the packaging layer,
And forming a stress buffer layer covering the sidewall of the filter. The method of claim 1,
The step of forming the packaging layer,
Forming a packaging material layer covering the first carrier substrate, the functional element, and the photosensitive chip; And
And forming the packaging layer parallel to the photosensitive unit and the functional element by performing a grinding treatment on the packaging material layer. The method of claim 1,
After the step of forming a redistribution structure on one side of the packaging layer adjacent to the filter, bonding a flexible circuit board (FPC) to the redistribution structure. . The method of claim 13,
The process temperature of the metal bonding process is less than or equal to 250° C., the process pressure is greater than or equal to 200 kPa, and the process time is greater than or equal to 30 minutes. As a shooting assembly,
Including a packaging layer, a photosensitive unit inserted into the packaging layer, a functional element and a redistribution structure,
The photosensitive unit includes a photosensitive chip and a filter mounted on the photosensitive chip, the uppermost surface of the packaging layer exposes the filter and the functional element, the bottom surface of the packaging layer is higher than the functional element, and the packaging layer is the Covers at least a partial sidewall of the photosensitive chip, both of the photosensitive chip and the functional element have a welding pad, the welding pad of the photosensitive chip faces the uppermost surface of the packaging layer, and the welding pad of the functional element is of the packaging layer. Exposed on the top,
Wherein the redistribution structure is located at one side of the packaging layer adjacent to the filter, and the redistribution structure is electrically connected to the welding pad. The method of claim 19,
The rewiring structure,
A conductive column located in the packaging layer and electrically connected to a welding pad of the photosensitive chip; And
A photographing assembly comprising: a welding pad of the functional element and a connection line positioned on the conductive column and electrically connected to the welding pad of the functional element and the conductive column. The method of claim 20,
The redistribution structure further comprises a conductive protruding block positioned between the connection line and the welding pad and the conductive column of the functional element, respectively. The method of claim 19,
A photographing assembly, wherein a bottom surface of the packaging layer is parallel to a higher one of the photosensitive unit and the functional element. The method of claim 19,
The photographing assembly further comprises a stress buffer layer positioned between the sidewall of the filter and the packaging layer. The method of claim 19,
The functional element includes at least one of a peripheral chip and a passive element, and the peripheral chip includes one or two of a digital signal processor chip and a memory chip. The method of claim 19,
The photographing assembly further comprises a flexible circuit board (FPC) positioned on the redistribution structure. As a lens module,
The photographing assembly according to any one of claims 19 to 25; And
And a lens assembly mounted on an uppermost surface of the packaging layer, including a holder surrounding the photosensitive unit and the functional element, and electrically connected to the photosensitive chip and the functional element. An electronic device comprising the lens module according to claim 26.

Images