KR102247790B1 - Curved display device amd method of fabricating thereof - Google Patents

Abstract

A method of manufacturing a display device is provided. A method of manufacturing a display device includes a first substrate member, a driving connection film attached to one surface of the first substrate member at a first side end of the first substrate member, and one surface facing one surface of the first substrate member. Preparing a flat panel display device including a second substrate member; Masking the other surface, which is opposite to one surface of the first substrate member, and a side surface, and the other surface that is opposite to the one surface of the second substrate member, and a side surface of the first substrate member; Forming an exposed area by exposing the other surface of the first substrate member and a central portion of the other surface of the second substrate member; And first etching the other surface of the first substrate member and the other surface of the second substrate member.

Description

Curved display device and its manufacturing method TECHNICAL FIELD [CURVED DISPLAY DEVICE AMD METHOD OF FABRICATING THEREOF}

The present invention relates to a display device and a method of manufacturing the same, and more particularly, to a curved display device having a curved display area and a method of manufacturing the same.

A display device is an electronic device for displaying an image. In recent years, as technology advances, research on a curved display device has been conducted to increase the immersion of an image.

A curved display device provides a sense of immersion because it gives the viewer the feeling that the viewer is located in a space by bending the viewing side of the image.Generally, a curved display device is manufactured by making the flat panel display thinner and then bending the display panel. I can.

On the other hand, in order to manufacture a curved display device, the display device may be manufactured by designing a thin thickness of the display device at the time of initial manufacture, but if not, the produced display device may be manufactured by bending it after undergoing a process such as etching to decrease the thickness. . The etching process may be performed by disposing masking members except for a region where a thin thickness is to be formed, and spraying or flowing an etchant onto the substrate members. However, when the masking members are disposed in a specific region, since the etchant may pass through the interference region between the masking members, an elaborate etching process may be difficult.

An object to be solved by the present invention is to provide a method of manufacturing a display device capable of an elaborate etching process.

Another problem to be solved by the present invention is to provide a display device manufactured by the above manufacturing method.

The problems of the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A method of manufacturing a display device according to an exemplary embodiment for solving the above problem includes a first substrate member, a driving connection film attached to one surface of the first substrate member at a first side end of the first substrate member, and one surface thereof. Preparing a flat panel display device including a second substrate member facing one surface of the first substrate member; Masking the other surface, which is opposite to one surface of the first substrate member, and a side surface, and the other surface that is opposite to the one surface of the second substrate member, and a side surface of the first substrate member; Forming an exposed area by exposing the other surface of the first substrate member and a central portion of the other surface of the second substrate member; And first etching the other surface of the first substrate member and the other surface of the second substrate member.

The entire masking of the other surface, which is the opposite surface of the first substrate member, and the side surface and the other surface that is the opposite surface of the second substrate member, and the side surface may be performed using a masking film.

In the step of forming an exposed area by exposing the other surface of the first substrate member and the central portion of the other surface of the second substrate member, the masking film is applied to the other surface of the first substrate member and the border of the other surface of the second substrate member. It may be covering wealth.

In the step of forming an exposed area by exposing the other surface of the first substrate member and the central portion of the other surface of the second substrate member, cutting the masking film along the boundary of the central portion and the edge portion, and the masking film located in the central portion It may include the step of removing.

The masking film may cover the driving connection film.

After the step of first etching the other surface of the first substrate member and the other surface of the second substrate member, the step of secondary etching the other surface of the first substrate member and the other surface of the second substrate member I can.

In preparing the flat panel display device, a sealing material may be further disposed at the first side end to cover the driving connection film, side surfaces of the first substrate member, and side surfaces of the second substrate member.

After the step of first etching the other surface of the first substrate member and the other surface of the second substrate member, the masking between the step of second etching the other surface of the first substrate member and the other surface of the second substrate member It may further include the step of removing the film.

After the step of first etching the other surface of the first substrate member and the other surface of the second substrate member, further expanding the exposed area of the other surface of the first substrate member and the other surface of the second substrate member can do.

The step of further expanding the exposed area of the other surface of the first substrate member and the other surface of the second substrate member includes the masking film located on the other surface of the first substrate member and the edge of the other surface of the second substrate member. It may include the step of further removing some.

A display device according to another exemplary embodiment for solving the above problem includes: a first substrate; A driving connection film attached to one surface of the first substrate at one end of the first substrate; And a second substrate having one surface facing one surface of the first substrate, wherein the first substrate includes an overlapping region overlapping the second substrate in a thickness direction and a non-overlapping region non-overlapping the second substrate. The driving connection film is attached in the non-overlapping region of the first substrate, and the first substrate includes a first protruding region, a 1-1 etch region, and a 1-2 etch region, and the first substrate 2 The substrate includes a second protrusion region, a 2-1 etch region, and a 2-2 etch region, and the thickness of the 1-1 etch region is between the first protrusion region and the 1-2 etch region. The thickness is between the thicknesses, the thickness of the 2-1 etching area is between the thickness of the second protruding area and the 2-2 etching area, and the 1-1 etching area is the first protruding area and the 1-th etching area. It is located between the 2 etch regions, and the 2-1 etch region is located between the second protrusion region and the 2-2 etch region.

The first protruding region is located at an edge of the first substrate, the second protruding region is located at an edge of the second substrate, and the 1-2 etched region is located at the center of the first substrate, and the The 2-2 etch region may be located in the center of the second substrate.

A display device according to another exemplary embodiment for solving the above problem includes: a first substrate; A driving connection film attached to one surface of the first substrate at one end of the first substrate; A second substrate having one surface facing one surface of the first substrate; And a sealing material disposed at one end of the first substrate and the second substrate, wherein the first substrate includes an overlapping region overlapping the second substrate in a thickness direction and a non-overlapping region non-overlapping the second substrate. Including, the drive connection film is attached in the non-overlapping region of the first substrate, the sealing material is one surface of the first substrate in the non-overlapping region, a side surface of the one end of the first substrate, and the first 2 In contact with a side surface of the one end of the substrate, partially surrounding the driving connection film, the first substrate includes a first protruding region and a first etching region having a surface height smaller than that of the first protruding region, The second substrate includes a second protruding region and a second etching region having a surface height smaller than that of the second protruding region, the first etching region is smaller than the surface height of the sealing material, and the second etching region is the sealing material Is less than the surface height of

The sealing material may include an acid-resistant resin.

Details of other embodiments are included in the detailed description and drawings.

According to the method of manufacturing a display device according to an exemplary embodiment, an elaborate etching process may be possible.

Effects according to the embodiments are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment.
2, 4, 8, and 12 are perspective views of a display device sequentially illustrating a part of a manufacturing process of the display device.
3 is a cross-sectional view taken along line III-III' of FIG. 2.
5 is a plan layout view of a display device illustrating a part of a manufacturing process of the display device.
6 is a cross-sectional view taken along line VI-VI' of FIG. 4.
7 is a cross-sectional view taken along line VII-VII' of FIG. 4.
9 is a plan layout view of a display device showing a part of a manufacturing process of the display device.
10 is a cross-sectional view taken along line X-X' of FIG. 8.
11 is a cross-sectional view taken along line XI-XI′ of FIG. 8.
13 and 14 are cross-sectional views of the display device after the process step according to FIG. 12.
15 and 16 are cross-sectional views illustrating a part of a manufacturing process of the display device.
17 is a perspective view of a display device illustrating a part of a manufacturing process of the display device.
18 is a plan layout view of a display device illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.
19 and 20 are cross-sectional views illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.
21, 23, and 26 are perspective views sequentially illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.
22 is a cross-sectional view taken along line XXII-XXII' of FIG. 21.
24 is a plan layout view of a display device illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.
25 is a cross-sectional view taken along line XXV-XXV' of FIG. 23;
FIG. 27 is a cross-sectional view taken along line XXVII-XXVII' of FIG. 26;
28 is a cross-sectional view illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.
29 is a cross-sectional view illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.
30 is a cross-sectional view illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms different from each other, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to the possessor, and the invention is only defined by the scope of the claims.

When elements or layers are referred to as “on” of another element or layer includes all cases of interposing another layer or another element directly on or in the middle of another element. The same reference numerals refer to the same elements throughout the specification.

Although the first, second, and the like are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical idea of the present invention.

Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

1 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment, and FIGS. 2, 4, 8, and 12 are perspective views of a display device sequentially illustrating a part of a manufacturing process of the display device, and FIG. 3 Is a cross-sectional view taken along line III-III' of FIG. 2, FIG. 5 is a plan layout view of the display device showing a part of a manufacturing process of the display device, and FIG. 6 is a cross-sectional view taken along line VI-VI' of FIG. 4 7 is a cross-sectional view taken along line VII-VII' of FIG. 4, FIG. 9 is a plan layout view of a display device showing a part of a manufacturing process of the display device, and FIG. 10 is a line X-X' of FIG. FIG. 11 is a cross-sectional view taken along line XI-XI′ of FIG. 8, FIGS. 13 and 14 are cross-sectional views of the display device after the process step according to FIG. 12, and FIGS. 15 and 16 are They are cross-sectional views illustrating a part of the manufacturing process of the display device, and FIG. 17 is a perspective view of the display device illustrating a part of the manufacturing process of the display device.

1 to 17, if a display device manufactured by a method of manufacturing a display device according to an exemplary embodiment includes a display area for displaying an image or an image, the main purpose of the device, an added function or name Regardless of the like, it can be interpreted as corresponding to a display device. For example, display devices include small game machines, large game machines such as slot machines used in casinos, electronic boards, e-books, smartphones, mobile phones, tablet PCs, personal digital assistants (PDAs), portable multimedia players (PMPs), TVs, personal computer monitors, notebook computers, car navigation, car dashboards, digital cameras, camcorders, external billboards, electronic signs, various medical devices, various inspection devices, various home appliances including display units such as refrigerators and washing machines, Internet of Things devices And the like, but are not limited to the above-described examples.

A display device manufactured according to an exemplary embodiment may have a rectangular shape including two long sides facing each other and two short sides facing each other. One surface of the second substrate member may be a display screen. A display device manufactured according to an exemplary embodiment may have a long side horizontally arranged based on a normal display screen orientation, but a long side may be vertically arranged.

In the figure, three directional axes are defined. The first direction DR1 is a short side extending direction of the display device, the second direction DR2 is a long side extending direction of the display device, and the third direction DR3 is a thickness direction of the display device.

The display device manufactured according to an exemplary embodiment may have a shape in which an edge portion of a first substrate member and a second substrate protrudes in a direction facing one surface, and a central portion excluding the edge portion is depressed.

In addition, after the bending or bending process of the display device, the display device may be formed as a curved display device. The display surface or display screen of the curved display device may be bent to include a convex or concave curved surface. The curved display device may include a curved surface formed by bending the second direction DR2 axis while maintaining a straight line in the first direction DR1 axis. The second direction DR2 axis may be bent to be concave in the third direction DR3. That is, the curved surface of the curved display device may include a concave surface that is bent concave in the display direction when the display surface is viewed. The curved display device may be formed by bending a flat panel display device.

The curvature of the curved portion of the curved display device may be constant. That is, the curved portion of the display device may be placed on a part (circle) of a circle having a constant radius with respect to the center. The radius of curvature of the display device is not limited thereto, but may be 0.5m to 5m, or 1m to 2m.

A liquid crystal display (LCD) may be applied as a display device according to an exemplary embodiment. In the following embodiments, a liquid crystal display is described as an example of a display device, but the display device is not limited thereto, and an electrophoretic display device (EPD), an organic light emitting display device (OLED), and a micro-LED display device (micro-LED) are described. ), a plasma display device (PDP), a field emission display device (FED), a cathode ray display device (CRT), and the like.

1 to 3, a driving connection film 410 attached on the other surface, which is the opposite surface of the first substrate member 200 at one end of the first substrate member 200, and the opposite surface of the first substrate member 200 A flat panel display device including a second substrate member 300 whose other surface, which is the other surface, faces the other surface of the first substrate member 200 is prepared (S1). In this step, the flat panel display device may be a display device before undergoing an etching process and a bending process to be described later.

The first substrate member 200 and the second substrate member 300 correspond to a first substrate and a second substrate that have undergone an etching process and a bending process to be described later. That is, the first substrate member 200 and the second substrate member 300 refer to configurations before the first substrate and the second substrate are subjected to an etching process and a bending process.

Hereinafter, for convenience of description, a flat panel display device before undergoing an etching process and a bending process is simply referred to as a display device.

The display device is disposed on the first substrate member 200 and the first substrate member 200, and the second substrate member 300, the first substrate member 200, and the first substrate member 200 face the first substrate member 200. 2 A sealing member 110, a first substrate member 200, and a second substrate member disposed between the first substrate member 200 and the second substrate member 300 and disposed at the edge of the substrate member 300 300 and a liquid crystal layer 500 disposed in a space surrounded by the sealing member 110. The sealing member 110 may couple the first substrate member 200 and the second substrate member 300 and prevent liquid crystal molecules of the liquid crystal layer 500 from leaking to the outside.

The first substrate member 200 and the second substrate member 300 may each have a curved shape after an etching process and a bending process to be described later.

One of the first substrate member 200 and the second substrate member 300 may be a thin film transistor substrate member, and the other may be a color filter substrate member. In this embodiment, a case where the first substrate member 200 is a thin film transistor substrate and the second substrate member 300 is a color filter substrate is illustrated. The display direction may be a direction outside one surface of the second substrate member 300.

The first substrate member 200, which is a thin film transistor substrate, may protrude relatively from the second substrate member 300. For example, one end of the first substrate member 200 in the first direction DR1 may protrude more than one end of the second substrate member 300 in the first direction DR1. At least a part of a driver for driving each pixel of the thin film transistor substrate may be disposed at a portion where the first substrate member 200 protrudes from the second substrate member 300 and is non-overlapping thereon. For example, the driving unit may include a driving connection film 410 and a driving circuit board 420 connected thereto, and a double driving connection film 410 is attached on the non-overlapping portion of the first substrate member 200 Can be. That is, the driving connection film 410 may be non-overlapping with the second substrate member 300.

Although not shown in the drawings, the display device may further include a polarizing film. The polarizing film may be attached to the rear surfaces of the first and second substrate members 200 and 300. The attachment region of the polarizing film may be within an etching region to be described later, but is not limited thereto.

Each of the first substrate member 200 and the second substrate member 300 includes an insulating substrate made of glass, quartz, etc., and a structure such as a wiring disposed thereon, a metal, a semiconductor layer, an insulating film, a color filter, and a black matrix. I can. The structures may be disposed on one surface 204 and 304 opposite to each other of the insulating substrate of the first substrate member 200 and the insulating substrate of the second substrate member 300, respectively. The insulating substrate of the first substrate member 200 and one surface of the insulating substrate of the second substrate member 300 and the other surface may be flat.

In the drawings, for convenience, a structure disposed on the insulating substrate is omitted, and only shapes of the insulating substrates of the first substrate member 200 and the second substrate member 300 are illustrated. Hereinafter, when referring to the shape of the rear surface of the first substrate member 200 or the second substrate member 300, the shape is the shape of the rear surface of the insulating substrate of the first substrate member 200 or the second substrate member 300 May mean the shape of the back surface of the insulating substrate. However, the embodiment is not limited to the above example, and another additional layer may be disposed on the rear surfaces of the insulating substrates of the first and second substrate members 200 and 300. Even when another additional layer is disposed on the rear surfaces of the insulating substrate, the corresponding layer may have an overall flat shape.

Next, referring to FIGS. 1 and 4 to 7, one surface and side surfaces of the first substrate member 200 and one surface and side surfaces of the second substrate member 300 are entirely masked (S2).

The masking member 600 used for masking may entirely mask the first substrate member 200 and the second substrate member 300. The masking member 600 may completely mask one surface and side surfaces of the first substrate member 200 and the second substrate member 300. Further, the masking member 600 may entirely mask the driving connection film 410 attached to the protruding area compared to the second substrate member 300 of the first substrate member 200 and the driving circuit board 420 connected thereto. have.

In the drawings, the masking member 600 is illustrated as being in direct contact with one surface of the first substrate member 200 and the second substrate member 300 and spaced apart from the side surfaces, but the masking member 600 is not limited thereto. The first substrate member 200 and the second substrate member 300 may be disposed in direct contact with side surfaces.

The masking member 600 may include a masking film. In this case, an acid-resistant adhesive tape (not shown) is disposed between the masking film and the first substrate member 200 and the second substrate member 300, and the masking film is the first substrate member by the acid-resistant adhesive tape. It can be easily attached to 200 and the second substrate member 300. The acid-resistant adhesive tape may be disposed on the entire area of the masking film, but is not limited thereto, and may be partially disposed at a level that combines the masking film with the first substrate member 200 and the second substrate member 300. May be.

In some embodiments, when the masking member 600 includes a masking film, the acid-resistant adhesive tape is not interposed, and the masking film is directly attached to the first substrate member 200 and the second substrate member 300 by heat fusion. ) Can be attached.

Subsequently, referring to FIGS. 1, 8, 9, 10, and 11, one surface of the first substrate member 200 and the central portion of one surface of the second substrate member 300 are exposed to expose the exposed area or etching. Regions 220 and 320 are formed (S3).

More specifically, of the masking member 600 described above in FIG. 4, portions located at the edge of one surface of the first substrate member 200 and the second substrate member 300 are not removed and remain as they are. In addition, portions located at the center of one surface of the first substrate member 200 and one surface of the second substrate member 300 may be removed. The step of removing the portion located at the central portion of one surface of the first substrate member 200 and the surface of the second substrate member 300 includes a boundary between a portion located at the central portion of the masking member 600 and a portion for the edge portion. After scribing the masking member 600 through a cutting device along the following, the masking member located at the center may be removed.

Among the masking members 600, a portion 600a located at an edge of one surface of the first substrate member 200 and one surface of the second substrate member 300 is one surface of the first substrate member 200 and a second surface. The edge portions 200a2 and 300a2 of one surface of the substrate member 300 may be covered. Furthermore, side surfaces of the first substrate member 200 and side surfaces of the second substrate member 200 may also be covered by the remaining masking member 600a.

When the first substrate member 200 and the second substrate member 300 have the above-described rectangular shape, the edge portions of one surface of the first substrate member 200 and the second substrate member 300 have four side portions. Can include. That is, the first side portions of the first substrate member 200 and the second substrate member 300 may be the left short edge portions of the first substrate member 200 and the second substrate member 300 shown in FIG. 8, The second side portion may be a right short edge portion of the first substrate member 200 and the second substrate member 300 facing the first side portion, and the third side portion may be the first substrate member 200 and the second The lower long-side edge portion of the substrate member 300 may be a portion, and the fourth side portion may be an upper long-side edge portion of the first substrate member 200 and the second substrate member 300 facing the third side portion. An end portion of the first substrate member 200 in the first direction DR1 may protrude from the fourth side portion more than an end portion of the second substrate member 300 in the first direction DR1.

In addition, since portions of the masking member 600 located at the center of one surface of the first substrate member 200 and one surface of the second substrate member 300 are removed, one surface of the first substrate member 200 and the first substrate member 200 are removed. 2 The central portions 200a1 and 300a1 of one surface of the substrate member 300 may be exposed.

The central portions of the substrate members 200 and 300 exposed by the masking members 600a may be etching regions 220 and 320 etched by an etching solution to be described later, and are covered by the masking members 600a and not exposed. The edge portions of the non-etched substrate members 200 and 300 may be non-etched regions 210 and 310. Through an etching process to be described later, the etched regions 220 and 320 may have a shape that is depressed or depressed in the thickness direction compared to the non-etched regions 210 and 310. That is, the thickness from the other surfaces 200b and 300b of the first substrate member 200 and the second substrate member 300 to the one surface 200a1 and 300a1 in the etching regions 220 and 320 is the first substrate member ( 200), and from the other surfaces 200b and 300b of the second substrate member 300 to one surface 200a2 and 300a2 in the non-etched regions 210 and 310.

When the driving connection film 410 and the driving circuit board 420 connected to the driving connection film 410 are disposed together on the fourth side of the first substrate member 200, the masking member 600a is a driving connection film ( 410 and the driving circuit board 420 may be wrapped together.

The display device includes a display area located at the center and a non-display area (or bezel area) located at each side edge of the display area, and the etched areas 220 and 320 are disposed to overlap the display area, and are non-etched. The areas 210 and 310 may be disposed to overlap the non-display area. The etched regions 220 and 320 may extend to a part of the non-display area to further overlap the non-display area. On the other hand, the non-etched areas 210 and 310 may be non-overlapping with the display area. The etched regions 220 and 320 may be located inside the non-etched regions 210 and 310.

Subsequently, referring to FIGS. 1 and 12 to 14, one surface 200a1 of the first substrate member 200 and one surface 300a1 of the second substrate member 300 are first etched (S4).

The etching step S4 may be performed by wet etching using an etchant. The etching step S4 may be performed by spraying an etchant from both surfaces of the flat panel display device or by applying an etchant in a form of flowing the etchant from the top. In this case, in order to minimize the penetration of the etchant into the driving connection film 410, the flat panel display may perform etching in the form of flowing or spraying the etchant while the driving connection film 410 is positioned at the top. In FIG. 12, an etching process in which an etchant flows while the driving connection film 410 is positioned on the top of the flat panel display is illustrated.

Etching is performed on one surface of the first substrate member 200 and one surface of the second substrate member 300 that is not masked, but is exposed, and the regions 220a and 320a are masked through etching. ), the thickness becomes thinner. Accordingly, the masked regions 210 and 310 protrude relatively more than the etched regions 220a and 320a. As a result, as shown in FIGS. 13 and 14, the protruding or non-etching regions 210 and 310 located at the edges of each side of the first substrate member 200_1 and the second substrate member 300_1 , And etching regions 220a and 320a located at the center of the first substrate member 200_1 and the second substrate member 300_1 are formed.

In the non-etched regions 210 and 310, the first substrate member 200_1 and the second substrate member 300_1 are formed in a desired curved shape while the thickness of the first substrate member 200_1 or the second substrate member 300_1 is reduced. When it is bent, it may be formed to protect the driving connection film 410 or prevent damage to the first substrate member 200_1 or the second substrate member 300_1. In some embodiments, the locations of the non-etched regions 210 and 310 are not limited to those shown. The non-etched areas 210 and 310 are formed on the upper and lower sides of the upper, lower, left, and right sides of the display device, formed on the left and right sides, formed only on the lower side, or formed on the lower, left, and right sides of the display device. It can also be formed. In some other embodiments, the protruding region may be formed only on one of the first substrate member 200_1 and the second substrate member 300_1.

In an exemplary embodiment in which the first substrate member 200_1 protrudes from one side of the first direction DR1 than the second substrate member 300_1 and the other side of the first direction DR1 is aligned with each other, the first direction DR1 ) While the width of the protruding region 210 of the first substrate member 200_1 located on one side is larger than the width of the protruding region 310 of the second substrate member 300_1, The first substrate member 200_1 and the second substrate member 300_1 may have the same width.

The etched region 220a of the first substrate member 200_1 is surrounded by the protruding region 210 of the first substrate member 200_1, and the etched region 320a of the second substrate member 300_1 is a second substrate member It may be surrounded by the protruding area 310 of (300_1). The depressed surfaces 200a1_1 and 300a1_1 of the etched regions 220a and 320a have one surface of the first substrate member 200_1 and the second substrate member 300_1 together with the surfaces of the non-etched regions or protruding regions 210 and 310 do.

The etched region 220a of the first substrate member 200_1 and the etched region 320a of the second substrate member 300_1 may completely overlap in the thickness direction. Also, the width of the etched region 220a of the first substrate member 200_1 and the width of the etched region 320a of the second substrate member 300_1 may be the same. However, it is not limited thereto.

The etched region 220a of the first substrate member 200_1 and the etched region 320a of the second substrate member 300_1 may have a uniform thickness. The thickness of the etched region 220a of the first substrate member 200_1 and the etched region 320a of the second substrate member 300_1 may be the same, but is not limited thereto. The thickness t4 of the etching regions 220a and 320a of the first substrate member 200_1 and the second substrate member 300_1 is as described above, the first substrate member 200_1 and the second substrate member 300_1 It may be smaller than the thickness t3 of the non-etched areas or the protruding areas 210 and 310.

The thickness t4 of the etching regions 220a and 320a may be about 0.1 to about 0.8 times or 0.4 to 0.6 times, but is not limited thereto. As described above, since the etched regions 220a and 320a have a thin thickness, the corresponding regions may be well bent in the curved process.

The first substrate member 200_1 and the second substrate member 300_1 may include a connection surface between the protruding regions 210 and 310 and the etching regions 220a and 320a. The connection surface may form a right angle with respect to one surface of the etched region, or may be an inclined surface having an obtuse angle.

The sealing member 110 is formed along the edge of the second substrate member 300_1 between the first substrate member 200_1 and the second substrate member 300_1, and may be disposed to overlap the protruding regions 210 and 310. have.

In the method of manufacturing the display device according to the present exemplary embodiment, as described above, the masking member 600 used in the masking process step is first arranged so as to completely surround the first substrate member 200 and the second substrate member 300. After that, the etching region 220 is removed by removing the masking member 600 disposed on the etching regions 220 and 320 located at the center of the first substrate member 200 and the second substrate member 300. The masking process may be performed more precisely than when the masking member is directly formed in an area other than the area 320). For example, when the masking member is directly formed in an area other than the etching regions 220 and 320, it is preferable to continuously form the masking member along the edges of the first substrate member 200 and the second substrate member 300. It can be difficult. That is, the substrate members 200 and 300 include a long-side edge portion and a short-side edge portion arranged to be crossed or bent to each other, forming a masking member along the long-side edge portion, and then continuously masking the short-side edge portion connected to the long-side edge portion. It is difficult to form the member. In this case, a masking member may be formed along the long-side edge portion, and a masking member may be formed discontinuously along the short-side edge portion.At the point of the edge edge portion where the long-side edge portion and the short-side edge portion meet, the etching solution In order to prevent penetration, a masking member formed along the long side edge portion and a masking member formed along the short side edge portion may be disposed to overlap each other. That is, a stepped space may occur in the thickness direction at the edge portion. However, in the etching process, there is a possibility that the etchant penetrates into the non-etched regions 210 and 310 through the stepped space.

However, in the method of manufacturing a display device according to an exemplary embodiment, the masking member 600 used in the masking process step is first arranged to completely surround the first substrate member 200 and the second substrate member 300, and then The stepped space is generated by removing the masking member 600 disposed on the etching regions 220 and 320 located at the center of the first substrate member 200 and the second substrate member 300. As a result, it is possible to prevent the etchant from penetrating into the non-etched regions 210 and 310.

Subsequently, referring to FIGS. 15 and 16, secondary etching is performed.

Since the secondary etching can be performed through the same process as the first etching described above, a detailed description of the secondary etching process will be omitted.

The second etching is performed in an area exposed without being masked on one surface of the first substrate member 200_1 and one surface of the second substrate member 300_1, and the thickness t5 of the corresponding regions 220b and 320b through the second etching. ) Becomes thinner than the thickness t4 of the etched regions 220a and 320a after the first etching. As a result, as shown in FIGS. 15 to 17, the protruding or non-etching regions 210 and 310 located at the edges of each side of the first substrate member 200_2 and the second substrate member 300_2, And etching regions 220b and 320b positioned at the center of the first and second substrate members 200_2 and 300_2 are formed.

18 is a plan layout view of a display device illustrating a part of a manufacturing process of a display device according to another exemplary embodiment, and FIGS. 19 and 20 are cross-sectional views illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.

18 to 20, in the method of manufacturing the display device according to the present exemplary embodiment, between the first etching step S4 and the second etching step, a first substrate member 200_1 and a second substrate member ( It is different from the method of manufacturing the display device according to the exemplary embodiment in that it further includes a step of further exposing one surface of 300_1).

More specifically, in the method of manufacturing the display device according to the present exemplary embodiment, between the first etching step S4 and the second etching step, the first substrate member 200_1 and the second substrate member 300_1 are It may further include the step of further exposing one side.

18, in the step of further exposing one surface of the first substrate member 200_1 and the second substrate member 300_1, the inner surface of the masking member 600b is the first substrate member 200_1 in plan view. , And a masking member 600b positioned between one end of the non-etched regions 210 and 310 of the second substrate member 300_1 and the boundary between the non-etched regions 210 and 310 and the etched regions 220a and 320a It may include the step of further removing to the outside. As a result, the exposed areas of one surface of the first and second substrate members 200_1 and 300_1 may increase (corresponding to “300a11” in FIG. 18). That is, by further removing the masking member 600b to the outside, one surface of the first substrate member 200_1 and the second substrate member 300_1 may further include an exposed surface 300a11.

Subsequently, the first substrate member 200_1 and the second substrate member 300_1 are secondarily etched.

In the second etching process, the etching regions 220a and 320a exposed by the masking member 600b excluding the non-etched regions 210 and 310 of the first and second substrate members 200_1 and 300_1, and The sub-etched area including the more exposed surface 300a11 is etched by the etching solution. Accordingly, the sub-etched region 230 positioned between the non-etched region 210 and the etched region 220b is formed in the first substrate member 200_3, and the second substrate member 300_3 is the non-etched region 310 A sub-etched region 330 positioned between the and etch regions 320b may be formed. The heights of the one surfaces 200a11_1 and 300a11_1 of the sub-etched regions 230 and 330 are smaller than the heights of the one surfaces 200a2 and 300a2 of the non-etched regions 210 and 310, and one surface 200a1_2 and 300a1_2 of the etched regions 220b and 320b Can be greater than the height of ).

The thickness t6 of the sub-etched regions 230 and 330 may have a size between the thickness t3 of the non-etched regions 210 and 310 and the thickness t5 of the etched regions 220b and 320b.

That is, the first substrate member 200_3 and the second substrate member 300_3 may have a double chin shape. The first jaw is located between the non-etched areas 210 and 310 and the sub-etched areas 230 and 330, and the second jaw is located between the sub-etched areas 230 and 330 and the non-etched areas 210 and 310. I can.

21, 23, and 26 are perspective views of a display device sequentially illustrating a part of a manufacturing process of a display device according to another exemplary embodiment, and FIG. 22 is a cross-sectional view taken along line XXII-XXII' of FIG. 21 , FIG. 24 is a plan layout view of a display device showing a part of a manufacturing process of a display device according to another exemplary embodiment, FIG. 25 is a cross-sectional view taken along line XXV-XXV' of FIG. 23, and FIG. 27 is A cross-sectional view taken along line XXVII-XXVII′, FIG. 28 is a cross-sectional view illustrating a part of a manufacturing process of a display device according to another exemplary embodiment, and FIG. 29 is a part of a manufacturing process of a display device according to another exemplary embodiment. FIG. 30 is a cross-sectional view illustrating a part of a manufacturing process of a display device according to another exemplary embodiment.

21 to 30, the method of manufacturing the display device according to the present exemplary embodiment includes a driving connection film 410 attached to the other surface of the first substrate member 200 at one end of the first substrate member 200. ), and a second substrate member 300 having the other surface facing the other surface of the first substrate member 200, in the preparation step S1, the first substrate member 200 on which the driving unit is disposed , And the sealing material 130 is further disposed at the end of the second substrate member 300, which is different from the method of manufacturing the display device according to the exemplary embodiment.

More specifically, first referring to FIGS. 21 and 22, a sealing material 130 may be disposed at one end of the first substrate member 200 and the second substrate member 300 in the first direction DR1. . The sealing material 130 protects the sealing member 110. That is, the sealing material 130 serves to prevent damage to the sealing member 110, the liquid crystal layer 500, the connection area between the first substrate member 200 and the driving connection film 410 from the etching solution in the etching process. can do.

The sealing material 130 may be disposed on one edge of the display device on which the driving connection film 410 is disposed. The sealing material 130 may be disposed along the long side of the display device. The length of the sealing material 130 in the second direction DR2 may be substantially the same as the length of the long side of the display device. One end (side) of the sealing material 130 in the second direction is aligned with one end (side) of the first substrate member 200 and the second substrate member 300, and the other end of the sealing material 130 in the second direction ( Side) may be aligned with one end (side) of the first substrate member 200 and the second substrate member 300, but is not limited thereto.

The sealing material 130 is in contact with a side of the first substrate member 200 located on the fourth side, and in contact with a side surface of the second substrate member 300 located on the fourth side, and in one side of the first direction DR1 It can protrude. The sealing material 130 may be disposed to be spaced apart from the driving circuit board 420.

One side of the sealing material 130, which is one end of the first direction DR1, may be positioned between one end and the other end of the driving connection film 410. In a region where the driving connection film 410 is disposed, the sealing material 130 may surround one surface, the other surface, and side surfaces of the driving connection film 410 in the second direction DR2 and directly contact them. That is, the sealing material 130 in the cross-sectional view of FIG. 22 may be divided with the driving connection film 410 therebetween. The sealing material 130 also surrounds and seals a region where the driving connection film 410 is connected to one surface of the first substrate member 200. In a space where the driving connection film 410 is surrounded by the sealing material 130, the driving connection film 410 may be fixed by the sealing material 130. The driving connection film 410 may include a fixed area fixed by the sealing material 130 and a non-fixed area located outside the end of the sealing material 130. The fixed region of the driving connection film 410 is not bent, but the non-fixed region may be bent, so that the driving circuit board 420 attached to the driving connection film 410 may be folded in the direction of the rear surface of the first substrate member 200. I can. In the spaced space between the adjacent driving connection films 410, the sealing material 130 may be integrally connected in the third direction DR3, which is a thickness direction, without being divided.

One side of the sealing material 130 may be flat in the third direction DR3 regardless of whether one side of the first substrate member 200 protrudes from one side of the second substrate member 300. That is, the end of the sealing material 130 positioned at a portion extending in the first direction DR1 of the first substrate member 200 is a portion extending in the first direction DR1 side of the second substrate member 300 It may be substantially aligned with the end of the sealing material 130 located at.

The other side of the sealing material 130 may be disposed to be in contact with both one side of the first substrate member 200 and one side of the second substrate member 300. The sealing material 130 may be disposed so as to be in contact with the protruding surface of the first substrate member 200.

The surface of the sealing material 130 facing the same direction as the one surface 300a of the second substrate member 300 is the first surface of the sealing material 130, and the same direction as the one surface 200a of the first substrate member 200 When the facing surface is defined as the second surface of the sealing material 130, the first surface and the second surface of the sealing material 130 may be parallel to each other. In addition, the first surface of the sealing material 130 is substantially at the same level as the one surface 300a of the adjacent second substrate member 300, and the second surface of the sealing material 130 is adjacent to the first substrate member 200 It may be at substantially the same level as the one side 200a of. That is, the first surface of the sealing material 130 is generally located on the extended surface of the one surface 300a of the second substrate member 300, and the second surface of the sealing material 130 is generally the first substrate member 200 It may be located on the extended surface of one surface (200a) of. Here, being located at the same level or on the extended surface includes not only being at the exact same level or exactly on the extended surface, but also being positioned with an error of less than 5% of the total thickness of the display device. It is used in the sense of saying.

The sealing material 130 may include an acid-resistant resin. For example, the sealing material 130 is a silicone resin, an acrylic resin, an epoxy resin, a phenolic resin, a polyamides resin, a polyimide resin. ), unsaturated polyesters resin, polyphenylenes resin, polyphenylenesulfides resin, or benzocyclobutene (BCB). .

As described above, in the case of the display device according to the present exemplary embodiment, since the sealing material 130 surrounds a part of the driving connection film 410, the driving connection film 410 is strongly fixed to improve ease of processing. In addition, as the first and second surfaces of the sealing material 130 are formed substantially the same as the heights of the first and second surfaces 200a and 300a of the first and second substrate members 300, respectively, processing You can increase the precision. In addition, by minimizing the occurrence of gaps between the first substrate member 200, the second substrate member 300, and the sealing material 130, penetration of the etchant in the etching process can be suppressed, and thus damage failure can be prevented.

After the above-described first etching step (S4), the encapsulant 130 is formed at an edge portion of the fourth side of the first substrate member 200_1 in the second etching step (the second substrate member 200_2 from the fourth side). It can play a role of masking the more protruding part). Between the first etching step S4 and the second etching step, the masking member 600a may be removed from the first substrate member 200_1 and the second substrate member 300_1.

Referring next to FIGS. 23 to 25, the masking step S2 described above in FIGS. 1 and 4 to 7 is performed in a state in which the sealing material 130 is disposed.

The masking member 600 may be formed to surround one surface and side surfaces of the first substrate member 200, one surface and side surfaces of the second substrate member 300, as well as the sealing material 130 as a whole. The masking member 600 may be disposed to directly contact the first and second surfaces of the sealing material 130.

Masking step (S2) in the state in which the sealing material 130 is disposed, except that the sealing material 130 is disposed, the process, and the structure thereof are described above in FIGS. It should be.

Next, referring to FIGS. 26 and 27, one surface of the first substrate member 200 described above in FIGS. 1, 8, 9, 10, and 11 in a state in which the sealing material 130 is disposed, and A step S3 of forming the exposed or etched regions 220 and 320 by exposing the central portion of one surface of the second substrate member 300 is performed. In this embodiment, the sealing material 130 is covered by the masking member 600a.

In the step (S3) of forming the etching regions 220 and 320 in the state in which the sealing material 130 is disposed, the process, and the structure thereof, are shown in FIGS. 1, 8, and 9, except that the sealing material 130 is disposed. The redundant description as described above in FIGS. 10 and 11 will be omitted.

Next, referring to FIG. 28, in a state in which the sealing material 130 is disposed, one surface 200a1 of the first substrate member 200 described above in FIGS. 1 and 12 to 14, and the second substrate member 300 A first etching step (S4) of one surface 300a1 of is performed.

As described above, since the sealing material 130 is completely covered by the masking member 600a, the sealing material 130 is not etched in the first etching step S4.

The first etching step (S4) in the state in which the sealing material 130 is disposed, except that the sealing material 130 is disposed, the process, and the structure thereof are described above in FIGS. 1 and 12 to 14. I will omit it.

Next, referring to FIG. 29, after the first etching step S4, the masking member 600a is removed from the first substrate member 200_1, the second substrate member 300_1, and the sealing material 130.

Next, referring to FIG. 30, secondary etching is performed.

Since the secondary etching can be performed through the same process as the first etching described above, a redundant description of the secondary etching process will be omitted.

In the second etching process, the protruding region 210 of the first substrate member 200_1, the etch region 220a, the protruding region 310 of the second substrate member 300_1, and the etching region 320a are All are etched, and the thickness t6 of the protruding regions 210_1 and 310_1 of the first substrate member 200_3 and the second substrate member 300_3, the first substrate member 200_3, and the second substrate member 300_3 The thickness t5 of the etched regions 220b and 320b of may be formed. The thickness t5 of the etching regions 220b and 320b may be smaller than the thickness t6 of the protrusion regions 210_1 and 310_1.

On the other hand, the sealing material 130 is not etched by the etching solution in the secondary etching process or is not substantially etched, so the thickness t7 of the sealing material 130 may be greater than the thickness t6 of the protruding regions 210_1 and 310_1. have. In other words, the surface height of the sealing material 130 may be greater than the surface heights 200a1_1 and 300a1_1 of the protruding regions 210_1 and 310_1, and the surface heights 200a1_1 and 300a1_1 of the protruding regions 210_1 and 310_1 are etched regions 220b , 320b) may be greater than the surface heights 200a1_2 and 300a1_2.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. You will be able to understand. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects.

110: sealing member
200: first substrate member
300: second substrate member
410: drive connecting film
420: driving circuit board
500: liquid crystal layer

Claims (14)

A first substrate member, a driving connection film attached on one surface of the first substrate member at a first side end of the first substrate member, and a second substrate member having one surface opposite to one surface of the first substrate member Preparing a flat panel display device to perform;
Masking the other surface, which is opposite to one surface of the first substrate member, and a side surface, and the other surface that is opposite to one surface of the second substrate member, and a side surface of the first substrate member;
Forming an exposed area by exposing the other surface of the first substrate member and a central portion of the other surface of the second substrate member; And
And first etching the other surface of the first substrate member and the other surface of the second substrate member,
Masking the other surface, which is the opposite surface of the first substrate member, and the side surface and the other surface that is the opposite surface of the second substrate member, and the side surface as a whole is performed using a masking film,
After the step of first etching the other surface of the first substrate member and the other surface of the second substrate member, further comprising the step of secondary etching the other surface of the first substrate member and the other surface of the second substrate member, ,
In the step of preparing the flat panel display device, a sealing material is further disposed at the first side end to cover the driving connection film, the side surface of the first substrate member, and the side surface of the second substrate member,
After the first etching step, one surface of the first substrate member and the surface of the sealing material are located at the same level,
After the step of first etching the other surface of the first substrate member and the other surface of the second substrate member, the masking between the steps of secondary etching the other surface of the first substrate member and the other surface of the second substrate member A method of manufacturing a display device further comprising removing the film.
delete The method of claim 1,
In the step of forming an exposed area by exposing the other surface of the first substrate member and the central portion of the other surface of the second substrate member, the masking film may be applied to the other surface of the first substrate member, A method of manufacturing a display device covering a portion.
The method of claim 3,
The step of forming an exposed area by exposing the other surface of the first substrate member and the central portion of the other surface of the second substrate member includes cutting the masking film along the boundary of the central portion and the edge portion, A method of manufacturing a display device comprising the step of removing.
The method of claim 1,
The masking film is a method of manufacturing a display device covering the driving connection film.
delete delete delete The method of claim 1,
After the step of first etching the other surface of the first substrate member and the other surface of the second substrate member, further expanding the exposed area of the other surface of the first substrate member and the other surface of the second substrate member A method of manufacturing a display device.
The method of claim 9,
The step of further expanding the exposed area of the other surface of the first substrate member and the other surface of the second substrate member includes the masking film located on the other surface of the first substrate member and the edge of the other surface of the second substrate member. A method of manufacturing a display device comprising the step of further removing a portion.
A first substrate;
A driving connection film attached to one surface of the first substrate at one end of the first substrate; And
One side includes a second substrate facing one side of the first substrate,
The first substrate includes an overlapping region overlapping the second substrate in a thickness direction and a non-overlapping region non-overlapping the second substrate,
The driving connection film is attached in the non-overlapping region of the first substrate,
The first substrate includes a first protruding region, a 1-1 etch region, and a 1-2 etch region,
The second substrate includes a second protruding region, a 2-1 etch region, and a 2-2 etch region,
The thickness of the 1-1 etching area is between the thickness of the first protruding area and the 1-2 etching area,
The thickness of the 2-1 etching area is between the thickness of the second protruding area and the 2-2 etching area,
The 1-1 etching region is located between the first protruding region and the 1-2 etch region,
The 2-1 etching area is located between the second protruding area and the 2-2 etching area,
The 1-2 etching area and the 2-2 etching area are formed by a first etching and a second etching,
The 1-1 etching area and the 2-1 etching area are formed by the second etching,
The second etching is performed after the first etching, after removing the masking film so as to expose the sub-etched regions in which the 1-2 etch regions and the 2-2 etch regions are to be formed.
The method of claim 11,
The first protruding region is located at an edge of the first substrate, the second protruding region is located at an edge of the second substrate, and the 1-2 etched region is located at the center of the first substrate, and the A display device in which the 2-2 etch region is located in the center of the second substrate.

delete delete

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