KR102247006B1 - Fiber composites laminate comprising self-assembled conductive bonding paste and method for preparing the same - Google Patents

Abstract

Disclosed are a fiber composite laminate comprising a self-assembled conductive paste and a method for manufacturing the same. The fiber composite laminate may include a fiber-based circuit unit including a fiber base material and a circuit electrode positioned on the fiber base material; A composite binder part located on the fiber-based circuit part; And a connection part including a connection electrode disposed on the composite binder part, and a flexible substrate disposed on the composite binder part and the connection electrode. The fiber composite laminate can be applied to a wearable device having improved conductivity and durability of the joint, minimizing foreign body sensation, and improving fit. In addition, there is an effect that productivity is improved and mass production is possible through a simple manufacturing process.

Description

Fiber composite laminate containing self-assembled conductive paste and its manufacturing method {FIBER COMPOSITES LAMINATE COMPRISING SELF-ASSEMBLED CONDUCTIVE BONDING PASTE AND METHOD FOR PREPARING THE SAME}

The present invention relates to a fiber composite laminate and a method of manufacturing the same, and more particularly, by applying a self-assembled conductive paste, the conductivity and durability of the joint is improved, the feeling of foreign objects is minimized, and it can be applied to a wearable device having an improved fit. It relates to a fiber composite laminate and a method for producing the same.

Recently, as wearable electronic devices have become a paradigm of the times, research on electronic textiles in which the functions of electronic devices are combined with textiles such as clothes is actively progressing. Since the fabric is flexible and comfortable, people feel less tired even if they wear it all day, and it is attracting attention as an ideal platform for wearable electronic devices.

However, electronic devices mounted on clothing or textiles need to be installed to maintain the user's free activity, and they need to be manufactured as devices that can be washed and have high durability, and research on this is underway.

In the conventional electronic functional fiber products, electronic components and wires that function as electronic are packaged so that they are not visible with fibers, or they are connected to the electronic parts by using conductive yarns instead of using wires.

Conventional products in which the wires and electronic parts are not visible make the wires and electronic parts feel a foreign body feeling, and are not elastic and thus have a poor fit. In addition, in the case of a conventional product process in which electronic parts are connected using a conductive thread, separate operations such as soldering, seam sealing, embroidery, and sewing for connecting the conductive part and the electronic part part are required in the middle of the manufacturing process. The soldering operation is performed at a high temperature, so there is a risk of damage to the fabric and fire, and a product manufactured using a seam sealing film has problems of durability and contact resistance of the joint.

These problems of the prior art made the process process of the electronic functional fiber complicated, and eventually, it is difficult to enter the mass production stage due to problems such as productivity and durability, and thus, it is difficult to expand the electronic functional fiber market.

An object of the present invention is to solve the above problems, and by applying a self-assembled conductive paste, the conductivity and durability of the joints are improved, the feeling of foreign objects is minimized, and the fiber composite laminate and conductivity applicable to a wearable device having an improved fit. It is to provide a fiber composite laminate.

In addition, it is to provide a method of manufacturing a fiber composite laminate and a conductive fiber composite laminate that can improve productivity and mass-produce through a simple process.

According to an aspect of the present invention, a fiber-based circuit unit 100 including a fiber base 110 and a circuit electrode 120 positioned on the fiber base 110; A composite binder part 200 positioned on the fiber-based circuit part 100; And a connection part 300 including a connection electrode 310 disposed on the composite binder part 200 and a flexible substrate 320 disposed on the composite binder part 200 and the connection electrode 310; A fiber composite laminate 10 comprising a is provided.

In addition, the fiber-based circuit part 100 may be adhered to the connection part 300 by the composite binder part 200.

In addition, the composite binder portion 200 includes a binder portion 210 and a conductive portion 220, the binder portion 200 is located between the fiber substrate 110 and the flexible substrate 320, the conductive portion 220 may be positioned between the circuit electrode 120 and the connection electrode 310.

In addition, the conductive part 220 may include a conductor, and the circuit electrode 120 and the connection electrode 310 may be electrically connected.

In addition, the conductor may include at least one selected from the group consisting of gallium, indium, tin, silver, bismuth, copper, zinc, antimony, nickel, and alloys thereof.

In addition, the conductor may include at least one selected from the group consisting of a gallium-indium alloy and a gallium-indium-Stannum alloy.

In addition, the binder portion contains at least one selected from the group consisting of acrylic resin, epoxy resin, phenoxy resin, urethane resin, polyester resin, polyamide resin, polyvinyl alcohol resin, nitrile resin, polyvinyl chloride resin, and polyethylene. can do.

In addition, the acrylic resin is bisphenol A diglycidyl ether diacrylate (BAGEDA), 1,4-butanediol diglycidyl ether diacrylate (1,4-butanediol diglycidyl ether diacrylate, BDGEDA) ), 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy)phenyl]propane (Bis-GMA), ethylene glycol dimethacrylate (EGDMA), triethylene glycol dimethacrylate (TEGDMA), ethoxylate bisphenol A dimethacrylate (Bis-EMA), urethane dimethacrylate (UDMA), dipentaerythritol pentaacrylate monophosphate (PENTA), 2-hydroxyethyl Consisting of methacrylate (2-hydroxyethyl methacrylate (HEMA)), polyalkenoic acid (polyalkenoic acid), biphenyl dimethacrylate (BPDM), and glycerol phosphate dimethacrylate (GPDM) It may include one or more selected from the group.

In addition, the composite binder part may include 10 to 1,000 parts by weight of the conductive part based on 100 parts by weight of the binder part.

In addition, the composite binder portion may further include at least one selected from the group consisting of a thermal initiator and a curing agent.

In addition, the thermal initiator may be an azo-based compound or a peroxide-based compound.

In addition, the thermal initiator is Azobisisobutyronitrile (AIBN), 2,2-azobis (2-methylbutylonitrile), dibenzoyl peroxide, tertiary butyl peroxy benzoate, di tertiary butyl peroxide, tertiary butyl peroxy 2-ethylhexanoate, tertiary butyl peroxy acetate, cumyl hydroperoxide, dicumyl peroxide, and tertiary butyl hydroperoxide.

In addition, the content of the thermal initiator may be 0.1 to 10 parts by weight based on 100 parts by weight of the binder part.

In addition, the curing agent may include at least one selected from the group consisting of dicyandiamide, phenol novolak curing agent, imidazole, and amine-based curing agent.

In addition, the fiber base material is polyamide, polyester, polyurethane, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene, vinylon resin, polyvinyl alcohol, polyacrylonitrile, acrylic resin, epoxy resin and poly It may include one or more polymers selected from the group consisting of propylene.

In addition, the circuit electrode may include a conductive yarn.

In addition, the conductive yarn may include a fiber and a conductive layer coated on the fiber.

In addition, the fiber is from the group consisting of polyamide, polyester, polyurethane, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene, vinylon, polyvinyl alcohol, polyacrylonitrile, acrylic, and polypropylene. It may contain one or more selected polymers.

In addition, the conductive layer may include at least one selected from the group consisting of silver, gold, aluminum, copper, platinum, palladium, tin, graphene, and carbon nanotubes (CNT).

In addition, the flexible substrate may include one or more selected from the group consisting of polyimide, polyamide, polyester, polytetrafluoroethylene, polyethylene, polypropylene, and polyethylene terephthalate.

In addition, the connection electrodes may each independently include at least one selected from the group consisting of silver, gold, aluminum, copper, platinum, palladium, tin, graphene, and carbon nanotubes (CNT).

In addition, the connection portion may be for electrically connecting the electronic device.

According to another aspect of the present invention, a fiber-based circuit unit 100 including a fiber base 110 and a circuit electrode 120 positioned on the fiber base 110; A composite binder part 200 positioned on the fiber-based circuit part 100; A connection part 300 including a connection electrode 310 disposed on the composite binder part 200 and a flexible substrate 320 disposed on the composite binder part 200 and the connection electrode 310; And an electronic device electrically connected to the connection part.

According to another aspect of the present invention, (a) providing a fiber-based circuit unit 100 including a fiber base 110 and a circuit electrode 120 positioned on the fiber base 110; (b) providing a connection part 300 including a flexible substrate 320 and a connection electrode 310 positioned on the flexible substrate 320; (c) manufacturing a fiber-based circuit part/composite binder/connecting part by placing a composite binder including a binder and a conductor between the fiber-based circuit part 100 and the connection part 300; And (d) melting the composite binder of the fiber-based circuit part 100/composite binder/connecting part 300 to self-assemble the conductive part 220 including the conductor to the circuit electrode 120 and the connection electrode 310. ), and positioning the binder part 210 including the binder between the fibrous substrate 110 and the flexible substrate 320; a method of manufacturing a fiber composite laminate comprising a.

By applying the self-assembled conductive paste, the fiber composite laminate of the present invention can be applied to a wearable device that improves the conductivity and durability of the joint, minimizes foreign body sensation, and has an improved fit.

In addition, the manufacturing method of the fiber composite laminate of the present invention has the effect of improving productivity and enabling mass production through a simple process.

These drawings are for reference only in describing exemplary embodiments of the present invention, and thus the technical idea of the present invention should not be limited to the accompanying drawings.
1 is a schematic diagram showing the structure of a fiber composite laminate according to the present invention.
2 is a schematic diagram showing a method of manufacturing a fiber composite laminate according to the present invention.
3 is a schematic diagram showing a process in which a fiber composite laminate is manufactured as the composite binder is melted in the method of manufacturing a fiber composite laminate according to the present invention.
Figure 4 shows an actual picture of the fiber composite laminate prepared according to Example 1.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention.

However, the following description is not intended to limit the present invention to a specific embodiment, and in describing the present invention, when it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted. .

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the existence of features, numbers, steps, actions, elements, or combinations thereof described in the specification, but one or more other features or It is to be understood that the possibility of addition or presence of numbers, steps, actions, components, or combinations thereof is not preliminarily excluded.

In addition, terms including ordinal numbers such as first and second to be used hereinafter may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

In addition, when a component is referred to as being "formed" or "laminated" on another component, it may be formed or laminated by being directly attached to the front surface or one surface on the surface of the other component. It should be understood that there may be more other components in the.

1 shows the structure of a fiber composite laminate according to the present invention. Hereinafter, a fiber composite laminate of the present invention will be described in detail with reference to FIG. 1. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.

The present invention includes a fiber-based circuit unit 100 including a fiber base 110 and a circuit electrode 120 positioned on the fiber base 110; A composite binder part 200 positioned on the fiber-based circuit part 100; And a connection part 300 including a connection electrode 310 disposed on the composite binder part 200 and a flexible substrate 320 disposed on the composite binder part 200 and the connection electrode 310; It provides a fiber composite laminate (10) comprising a.

In addition, the fiber-based circuit part 100 may be adhered to the connection part 300 by the composite binder part 200.

In addition, the composite binder portion 200 includes a binder portion 210 and a conductive portion 220, the binder portion 200 is located between the fiber substrate 110 and the flexible substrate 320, the conductive portion 220 may be positioned between the circuit electrode 120 and the connection electrode 310.

In addition, the conductive part 220 may include a conductor, and the circuit electrode 120 and the connection electrode 310 may be electrically connected.

In addition, the conductor may include at least one selected from the group consisting of gallium, indium, tin, silver, bismuth, copper, zinc, antimony, nickel, and alloys thereof, preferably gallium, indium, tin, and alloys thereof. It may include at least one selected from the group consisting of, and more preferably, one selected from the group consisting of a gallium-indium alloy and a gallium-indium-Stannum. It may include more than one.

In addition, the binder portion contains at least one selected from the group consisting of acrylic resin, epoxy resin, phenoxy resin, urethane resin, polyester resin, polyamide resin, polyvinyl alcohol resin, nitrile resin, polyvinyl chloride resin, and polyethylene. It may, and preferably include at least one selected from the group consisting of acrylic resins and phenoxy resins.

In addition, the acrylic resin is bisphenol A diglycidyl ether diacrylate (BAGEDA), 1,4-butanediol diglycidyl ether diacrylate (1,4-butanediol diglycidyl ether diacrylate, BDGEDA) ), 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy)phenyl]propane (Bis-GMA), ethylene glycol dimethacrylate (EGDMA), triethylene glycol dimethacrylate (TEGDMA), ethoxylate bisphenol A dimethacrylate (Bis-EMA), urethane dimethacrylate (UDMA), dipentaerythritol pentaacrylate monophosphate (PENTA), 2-hydroxyethyl Consisting of methacrylate (2-hydroxyethyl methacrylate (HEMA)), polyalkenoic acid (polyalkenoic acid), biphenyl dimethacrylate (BPDM), and glycerol phosphate dimethacrylate (GPDM) It may include one or more selected from the group, and preferably may include bisphenol A diglycidyl ether diacrylate.

In addition, the composite binder part may include 10 to 1,000 parts by weight of the conductive part based on 100 parts by weight of the binder part, preferably 100 to 900 parts by weight, more preferably 300 to 800 parts by weight, even more preferably May include 450 to 700 parts by weight. If the amount of the conductor is less than 10 parts by weight, it is not preferable because problems may occur in self-assembly, and if it exceeds 1,000 parts by weight, a problem may occur in adhesion, and residual particles that have not been self-assembled may be left behind. Not desirable.

In addition, the composite binder portion may further include at least one selected from the group consisting of a thermal initiator and a curing agent.

Thermal initiators that can be used in the present invention are preferably azo-based compounds or peroxide-based compounds, for example Azobisisobutyronitrile (AIBN), 2,2-azobis (2-methylbutylonitrile), di Benzoyl peroxide, tertiary butyl peroxy benzoate, tertiary butyl peroxide, tertiary butyl peroxy 2-ethylhexanoate, tertiary butyl peroxy acetate, cumyl hydroperoxide, dicumyl peroxide, tersher review Tyl hydroperoxide, etc. can be used.

The content of the thermal initiator is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the resin. When the content is less than 0.1 parts by weight, sufficient radical initiation reaction is difficult to occur, and when the content is more than 10 parts by weight, deterioration of the resin may occur due to the unreacted initiator, resulting in a decrease in physical properties.

As the curing agent usable in the present invention, dicyandiamide, phenol novolac curing agent, imidazole, and amine curing agent can be used.

In addition, the fiber base material is polyamide, polyester, polyurethane, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene, vinylon resin, polyvinyl alcohol, polyacrylonitrile, acrylic resin, epoxy resin and poly It may include one or more polymers selected from the group consisting of propylene.

In addition, the circuit electrode may include a conductive yarn.

In addition, the conductive yarn may include a fiber and a conductive layer coated on the fiber.

In addition, the fiber is from the group consisting of polyamide, polyester, polyurethane, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene, vinylon, polyvinyl alcohol, polyacrylonitrile, acrylic, and polypropylene. It may include one or more selected polymers, and may preferably include polyamide.

In addition, the conductive layer may include at least one selected from the group consisting of silver, gold, aluminum, copper, platinum, palladium, tin, graphene, and carbon nanotubes (CNT), preferably silver. can do.

In addition, the flexible substrate may include one or more selected from the group consisting of polyimide, polyamide, polyester, polytetrafluoroethylene, polyethylene, polypropylene, and polyethylene terephthalate.

In addition, the connection electrodes may each independently include at least one selected from the group consisting of silver, gold, aluminum, copper, platinum, palladium, tin, graphene, and carbon nanotubes (CNT).

In addition, the connection portion may be for electrically connecting the electronic device.

The present invention includes a fiber-based circuit unit 100 including a fiber base 110 and a circuit electrode 120 positioned on the fiber base 110; A composite binder part 200 positioned on the fiber-based circuit part 100; A connection part 300 including a connection electrode 310 disposed on the composite binder part 200 and a flexible substrate 320 disposed on the composite binder part 200 and the connection electrode 310; And an electronic device electrically connected to the connection part.

FIG. 2 is a schematic diagram showing a method of manufacturing a fiber composite laminate according to the present invention, and FIG. 3 is a schematic diagram showing a process in which a fiber composite laminate is manufactured as the composite binder is melted in the manufacturing method of the fiber composite laminate according to the present invention. to be. Hereinafter, a method of manufacturing a fiber composite laminate of the present invention will be described with reference to FIGS. 2 and 3.

First, a fiber-based circuit unit 100 including a fiber base 110 and a circuit electrode 120 positioned on the fiber base 110 is provided (step a).

Next, a connection part 300 including a flexible substrate 320 and a connection electrode 310 positioned on the flexible substrate 320 is provided (step b).

Next, a fiber-based circuit part/composite binder/connecting part is manufactured by placing a composite binder including a binder and a conductor between the fiber-based circuit part 100 and the connection part 300 (step c).

Finally, the composite binder of the fiber-based circuit part 100/composite binder/connector 300 is melted and self-assembled to form a conductive part 220 including the conductor into the circuit electrode 120 and the connection electrode 310. It is positioned between, and a binder portion 210 including the binder is positioned between the fibrous substrate 110 and the flexible substrate 320 (step d).

The fiber-based circuit unit of step a may be manufactured by forming a circuit electrode on a fiber substrate by using at least one method selected from embroidery, knitting, weaving, and printing using conductive ink using conductive yarn.

[Example]

Hereinafter, a preferred embodiment of the present invention will be described. However, this is for illustrative purposes only, and thus the scope of the present invention is not limited thereto.

Composite binder (self-assembled conductive Paste )

Manufacturing example One

100 parts by weight of Bisphenol A diglycidyl ether diacrylate (BAGEDA) as a binder, 300 parts by weight of gallium-indium eutectic alloy as a conductor, 165 parts by weight of Ethyl Carbitol Acetate as a solvent, and 11 parts by weight of Azobisisobutyronitrile (AIBN) as an initiator are mixed Thus, a composite binder was prepared. The gallium-indium eutectic alloy had 75.5 wt% of gallium and 24.5 wt% of indium.

Manufacturing example 2 to 7

Composite binders of Preparation Examples 2 to 7 having the composition shown in Table 1 were prepared in the same manner as in Preparation Example 1.

Manufacturing example 8

A composite binder in the same manner as in Preparation Example 1 except that 700 parts by weight of a gallium-indium-tin eutectic alloy (eutectic gallium-indium-stannum) was used instead of 300 parts by weight of a gallium-indium eutectic alloy (eutectic gallium-indium). Was prepared. The gallium-indium-tin eutectic alloy had 68.5wt% of gallium, 21.5wt% of indium, and 10wt% of tin.

Manufacturing example 9

Instead of using 300 parts by weight of gallium-indium eutectic gallium-indium, 700 parts by weight are used, Phenoxy Resin is used instead of Bisphenol A diglycidyl ether diacrylate, and dicyandiamide is used instead of Azobisisobutyronitrile (AIBN). Except for using the composite binder was manufactured in the same manner as in Preparation Example 1.

Manufacturing example 10

Instead of using 300 parts by weight of gallium-indium eutectic gallium-indium, 700 parts by weight are used, instead of using Bisphenol A diglycidyl ether diacrylate, Phenoxy Resin is used, and instead of 11 parts by weight of Azobisisobutyronitrile (AIBN) A composite member was manufactured in the same manner as in Preparation Example 1, except that 5.5 parts by weight of Azobisisobutyronitrile (AIBN) and 5.5 parts by weight of dicyandiamide were used.

Table 1 below summarizes the components and contents (parts by weight) of the composite binders according to Preparation Examples 1 to 10.

division bookbinder conductor AIBN
(Part by weight) Dicyandiamide
(Part by weight) menstruum
(Part by weight) Kinds content
(Part by weight) Kinds content
(Part by weight) Manufacturing Example 1 BAGEDA 100 Ga-In 300 11 0 165 Manufacturing Example 2 BAGEDA 100 Ga-In 400 11 0 206 Manufacturing Example 3 BAGEDA 100 Ga-In 500 11 0 248 Manufacturing Example 4 BAGEDA 100 Ga-In 700 11 0 330 Manufacturing Example 5 BAGEDA 100 Ga-In 900 11 0 413 Manufacturing Example 6 BAGEDA 100 Ga-In 1,000 11 0 454 Manufacturing Example 7 BAGEDA 100 Ga-In 1,100 11 0 495 Manufacturing Example 8 BAGEDA 100 Ga-In-Sn 700 11 0 330 Manufacturing Example 9 Phenoxy Resin 100 Ga-In 700 0 11 330 Manufacturing Example 10 Phenoxy Resin 100 Ga-In 700 5.5 5.5 330

Fiber composite Laminate And electronic parts

Fiber composite according to the composition ratio of composite binder Laminate And electronic component manufacturing ( Example 1 to 7)

Example One

Communication modules, signal processing modules, driving circuits, and amplifier circuits, which are electronic devices with functions that are difficult to replace with fiber circuits, were mounted on F-PCB (Flexible PCB) using imide film by soldering.

In addition, a conductive yarn with a silver content of 41wt% (Amann, Silver-tech 120), which is an Ag coated yarn made of a nylon yarn coated with silver (Ag) on a polyester nonwoven fabric, is used for parallel connection of LEDs and contact with the electrode of the driving part. The circuit was embroidered.

A composite binder (self-assembled conductive paste) prepared according to Preparation Example 1 was applied to the electrode portion of the F-PCB (Flexible PCB).

After the self-assembly conductive paste is applied to the F-PCB (Flexible PCB) electrode part and the fiber-based circuit electrode part and press-bonded, self-assembly and curing in a drying oven at 140°C for 20 minutes to obtain a fiber composite laminate and An electronic component to be included was manufactured.

3 shows an electronic component including an LED including a fiber composite laminate manufactured according to the first embodiment.

Example 2

Instead of using the composite binder prepared according to Preparation Example 1, instead of using the composite binder prepared according to Preparation Example 2, self-assembly and curing in a drying oven at 140°C for 20 minutes, and self-assembly in a drying oven at 130°C for 20 minutes And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 3

Instead of using the composite binder prepared according to Preparation Example 1, the composite binder prepared according to Preparation Example 3 was used, and self-assembly in a drying oven at 130°C for 10 minutes instead of self-assembly and curing in a drying oven at 140°C for 20 minutes. And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 4

Instead of using the composite binder prepared according to Preparation Example 1, instead of using the composite binder prepared according to Preparation Example 4, self-assembly and curing in a drying oven at 140°C for 20 minutes, and self-assembly in a drying oven at 130°C for 10 minutes And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 5

Instead of using the composite binder prepared according to Preparation Example 1, the composite binder prepared according to Preparation Example 5 was used, and instead of self-assembly and curing in a drying oven at 140°C for 20 minutes, self-assembly in a drying oven at 130°C for 10 minutes And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 6

A fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1, except that the composite binder prepared according to Preparation Example 6 was used instead of using the composite binder prepared according to Preparation Example 1.

Example 7

A fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1, except that the composite binder prepared according to Preparation Example 7 was used instead of using the composite binder prepared according to Preparation Example 1.

Example 8

Instead of using the composite binder prepared according to Preparation Example 1, the composite binder prepared according to Preparation Example 8 was used, and instead of self-assembly and curing in a drying oven at 140°C for 20 minutes, self-assembly in a drying oven at 130°C for 10 minutes And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 9

Instead of using the composite binder prepared according to Preparation Example 1, instead of using the composite binder prepared according to Preparation Example 9, self-assembly and curing in a drying oven at 140°C for 20 minutes, and self-assembly in a drying oven at 130°C for 10 minutes And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 10

Instead of using the composite binder prepared according to Preparation Example 1, instead of using the composite binder prepared according to Preparation Example 10, self-assembly and curing in a drying oven at 140°C for 20 minutes, and self-assembly in a drying oven at 130°C for 10 minutes And a fiber composite laminate and an electronic component including the same were manufactured in the same manner as in Example 1 except for curing.

Example 11

In place of the conductive yarn having a silver content of 41 wt%, a conductive yarn having a silver content of 38 wt% (Qingdao, 70D/24F) was used, and a composite binder prepared according to Preparation Example 4 was used instead of using the composite binder prepared according to Preparation Example 1. Fiber composite laminate and electronic components including the same in the same manner as in Example 1, except for using and self-assembling and curing in a drying oven at 140° C. for 20 minutes, and self-assembling and curing in a drying oven at 130° C. for 10 minutes. Was prepared.

Example 12

A composite prepared according to Preparation Example 4 instead of using a conductive yarn having a silver content of 87 wt% (Imbut, 234/f34_PA/Ag) instead of a conductive yarn having a silver content of 41 wt%, and using the composite binder prepared according to Preparation Example 1 Using a binder, and instead of self-assembling and curing in a drying oven at 140° C. for 20 minutes, self-assembly and curing in a drying oven at 130° C. for 10 minutes, and a fiber composite laminate including the same in the same manner as in Example 1 Electronic components were manufactured.

Table 2 below summarizes the fiber composite laminates according to Examples 1 to 12 and components of electronic components including the same, self-assembly temperature and time, adhesion, and connection resistance.

division Composite binder missionary Self-assembly Kinds Silver content (wt%) Temperature(℃) Time(min) Example 1 Manufacturing Example 1 Silver coated yarn 41 140 20 Example 2 Manufacturing Example 2 Silver coated yarn 41 130 20 Example 3 Manufacturing Example 3 Silver coated yarn 41 130 10 Example 4 Manufacturing Example 4 Silver coated yarn 41 130 10 Example 5 Manufacturing Example 5 Silver coated yarn 41 130 10 Example 6 Manufacturing Example 6 Silver coated yarn 41 140 20 Example 7 Manufacturing Example 7 Silver coated yarn 41 140 20 Example 8 Manufacturing Example 8 Silver coated yarn 41 130 10 Example 9 Manufacturing Example 9 Silver coated yarn 41 130 10 Example 10 Manufacturing Example 10 Silver coated yarn 41 130 10 Example 11 Manufacturing Example 4 Silver coated yarn 38 130 10 Example 12 Manufacturing Example 4 Silver coated yarn 87 130 10

[Test Example]

Test example 1: Evaluation of self-assembly performance according to the content of the composite binder composition

The conditions for self-assembly of the composite binder between the fiber base and the flexible base of Examples 1 to 7 are shown in Table 3 below.

division Composite binder Conductor content
(Part by weight) Requirements for self-assembly Temperature(℃) Time(min) Example 1 Manufacturing Example 1 300 140 20 or more Example 2 Manufacturing Example 2 400 130 20 or more Example 3 Manufacturing Example 3 500 130 over 10 Example 4 Manufacturing Example 4 700 130 over 10 Example 5 Manufacturing Example 5 900 130 over 10 Example 6 Manufacturing Example 6 1,000 140 20 or more Example 7 Manufacturing Example 7 1,100 140 20 or more

Referring to Table 3, the composite binders of Preparation Examples 3 and 4 were self-assembling at a low temperature and a short time, so that the self-assembly performance was the best, and the self-assembly performance of Preparation Examples 2 and 5 was good, and Preparation Example 1 , The self-assembly performance of the composite binders of 6 and 7 was moderate. It can be seen that the self-assembly performance of the composite binder increases to a certain extent as the content of the conductor increases, and then decreases thereafter.

Test example 2: Evaluation of adhesion and connection resistance of the composite binder composition

The adhesion and connection resistance of Examples 4 and 8 to 12 were measured and shown in Table 4 below.

Adhesion is measured by using a UTM measuring machine (Universal Testing Machine), and the strength applied when peeling while the fiber fabric part and F-PCB adhered by self-assembly are clamped in the fixed clamp of the tensile tester, and the tensile tester is operated at a speed of 20mm/min Was measured.

Connection resistance was measured at both ends of the connection when a test current of 1mA was applied through a measuring device (Keithley SourceMeter 2400).

division Composite binder missionary AIBN/amide Adhesion
(kgf/cm ² ) Connection resistance
(Ω/cm) bookbinder conductor Kinds Silver content
(wt%) AIBN
(Part by weight) amides
(Part by weight) Example 4 BAGEDA Ga-In Silver coated yarn 41 11 0 1.8 1.0 Example 8 BAGEDA Ga-In
-Sn Silver coated yarn 41 11 0 1.8 1.5 Example 9 Phenoxy Resin Ga-In Silver coated yarn 41 0 11 2.5 0.8 Example 10 Phenoxy Resin Ga-In Silver coated yarn 41 5.5 5.5 2.3 0.8 Example 11 BAGEDA Ga-In Silver coated yarn 38 11 0 1.8 1.0 Example 12 BAGEDA Ga-In Silver coated yarn 87 11 0 1.3 0.5

Referring to Table 4 above, adhesion and connection resistance according to the type of conductor can be confirmed under the same conditions from Examples 4 and 8. When a gallium-indium-tin alloy is used as the conductor (Example 8), it can be seen that the adhesion is the same, but the connection resistance value is increased.

In addition, it can be seen that the connection resistance is lower in Examples 9 and 10 in which the binder is used as a phenoxy resin than in Example 4 in which the binder is used as Bisphenol A diglycidyl ether.

In addition, when the binder was used as a phenoxy resin, it can be seen that the adhesive strength was higher than that of Example 10 in which the 9-valent AIBN and dicyandiamide were used in a 50:50 weight ratio in the implementation using dicyandiamide.

In addition, when the silver content of the conductor is 41% and 38%, the adhesion and connection resistance show the same value, but when the silver content is increased to 87%, the adhesion ^{decreases to 1.3 kgf/cm 2} , and the connection resistance is It can be seen that it decreases to 0.5 Ω/cm.

The scope of the present invention is indicated by the claims to be described later rather than the detailed description, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.

Claims (20)

A fiber-based circuit unit including a fiber base and a circuit electrode positioned on the fiber base;
A composite binder part positioned on the fiber-based circuit part; And
A connection part including a connection electrode disposed on the composite binder part, and a flexible substrate disposed on the composite binder part and the connection electrode;
Fiber composite laminate comprising. The method of claim 1,
The fiber composite laminate, characterized in that the fiber-based circuit portion is bonded to the connection portion by the composite binder portion. The method of claim 1,
The composite binder portion includes a binder portion and a conductive portion,
The binder part is located between the fibrous substrate and the flexible substrate,
The fiber composite laminate, characterized in that the conductive portion is located between the circuit electrode and the connection electrode. The method of claim 3,
Wherein the conductive portion includes a conductor, and electrically connects the circuit electrode and the connection electrode. The method of claim 4,
The fiber composite laminate, characterized in that the conductor comprises at least one selected from the group consisting of gallium, indium, tin, silver, bismuth, copper, zinc, antimony, nickel, and alloys thereof. The method of claim 5,
The fiber composite laminate, characterized in that the conductor comprises at least one selected from the group consisting of a gallium-indium alloy and a gallium-indium-Stannum alloy. The method of claim 3,
That the binder part contains at least one selected from the group consisting of acrylic resin, epoxy resin, phenoxy resin, urethane resin, polyester resin, polyamide resin, polyvinyl alcohol resin, nitrile resin, polyvinyl chloride resin, and polyethylene. Fiber composite laminate, characterized in that. The method of claim 7,
The acrylic resin is bisphenol A diglycidyl ether diacrylate (BAGEDA), 1,4-butanediol diglycidyl ether diacrylate (1,4-butanediol diglycidyl ether diacrylate, BDGEDA), 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy)phenyl]propane (Bis-GMA), ethylene glycol dimethacrylate (EGDMA), triethylene glycol dimethacrylate (TEGDMA) ), ethoxylate bisphenol A dimethacrylate (Bis-EMA), urethane dimethacrylate (UDMA), dipentaerythritol pentaacrylate monophosphate (PENTA), 2-hydroxyethyl methacrylate From the group consisting of 2-hydroxyethyl methacrylate (HEMA), polyalkenoic acid, biphenyl dimethacrylate (BPDM), and glycerol phosphate dimethacrylate (GPDM). A fiber composite laminate comprising at least one selected. The method of claim 3,
Fiber composite laminate, characterized in that the composite binder portion comprises 10 to 1,000 parts by weight of the conductive portion based on 100 parts by weight of the binder portion. The method of claim 1,
The fiber composite laminate, characterized in that the composite binder portion further comprises at least one selected from the group consisting of a thermal initiator and a curing agent. The method of claim 1,
The fiber base is made of polyamide, polyester, polyurethane, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene, vinylon resin, polyvinyl alcohol, polyacrylonitrile, acrylic resin, epoxy resin and polypropylene. A fiber composite laminate comprising at least one polymer selected from the group consisting of. The method of claim 1,
The fiber composite laminate, characterized in that the circuit electrode includes a conductive yarn. The method of claim 12,
The conductive yarn, characterized in that the fiber composite laminate comprising a fiber and a conductive layer coated on the fiber. The method of claim 13,
The fiber is 1 selected from the group consisting of polyamide, polyester, polyurethane, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyfluoroethylene, vinylon, polyvinyl alcohol, polyacrylonitrile, acrylic, and polypropylene. A fiber composite laminate comprising a polymer of more than one species. The method of claim 13,
The conductive layer is a fiber composite laminate comprising at least one selected from the group consisting of silver, gold, aluminum, copper, platinum, palladium, tin, graphene, and carbon nanotubes (CNT). The method of claim 1,
Fiber composite laminate, characterized in that the flexible substrate comprises at least one selected from the group consisting of polyimide, polyamide, polyester, polytetrafluoroethylene, polyethylene, polypropylene, and polyethylene terephthalate. The method of claim 1,
Each of the connecting electrodes independently comprises at least one selected from the group consisting of silver, gold, aluminum, copper, platinum, palladium, tin, graphene, and carbon nanotubes (CNT). . The method of claim 1,
Fiber composite laminate, characterized in that the connection portion for electrically connecting the electronic device. A fiber-based circuit unit including a fiber base and a circuit electrode positioned on the fiber base;
A composite binder part positioned on the fiber-based circuit part;
A connection part including a connection electrode disposed on the composite binder part, and a flexible substrate disposed on the composite binder part and the connection electrode; And
An electronic device electrically connected to the connection part;
Electronic components to include. (a) providing a fiber-based circuit unit including a fiber base material and a circuit electrode positioned on the fiber base material;
(b) providing a connection part including a flexible substrate and a connection electrode positioned on the flexible substrate;
(c) manufacturing a fiber-based circuit part/composite binder/connecting part by placing a composite binder including a binder and a conductor between the fiber-based circuit part and the connection part; And
(d) melting and self-assembling the composite binder of the fiber-based circuit part/composite binder/connecting part to place a conductive part including the conductor between the circuit electrode and the connection electrode, and the binder part including the binder in the fiber base material And positioning between the flexible substrate;
Method for producing a fiber composite laminate comprising.

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