KR102245859B9 - A support separation apparatus and a support separation method - Google Patents
A support separation apparatus and a support separation methodInfo
- Publication number
- KR102245859B9 KR102245859B9 KR1020170069122A KR20170069122A KR102245859B9 KR 102245859 B9 KR102245859 B9 KR 102245859B9 KR 1020170069122 A KR1020170069122 A KR 1020170069122A KR 20170069122 A KR20170069122 A KR 20170069122A KR 102245859 B9 KR102245859 B9 KR 102245859B9
- Authority
- KR
- South Korea
- Prior art keywords
- support separation
- support
- separation method
- separation apparatus
- separation
- Prior art date
Links
- 238000000926 separation method Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016129427A JP6622661B2 (en) | 2016-06-29 | 2016-06-29 | Support body separating apparatus and support body separating method |
| JPJP-P-2016-129427 | 2016-06-29 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| KR20180002499A KR20180002499A (en) | 2018-01-08 |
| KR102245859B1 KR102245859B1 (en) | 2021-04-28 |
| KR102245859B9 true KR102245859B9 (en) | 2024-03-15 |
Family
ID=60946469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170069122A KR102245859B1 (en) | 2016-06-29 | 2017-06-02 | A support separation apparatus, and a support separation method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6622661B2 (en) |
| KR (1) | KR102245859B1 (en) |
| TW (1) | TWI703670B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019220666A1 (en) | 2018-05-17 | 2019-11-21 | 信越エンジニアリング株式会社 | Workpiece separation device and workpiece separation method |
| TWI747611B (en) * | 2020-11-13 | 2021-11-21 | 天虹科技股份有限公司 | Wafer pre-cleaning apparatus |
| TWI799120B (en) * | 2020-11-13 | 2023-04-11 | 天虹科技股份有限公司 | Wafer pre-cleaning apparatus |
| TWI761270B (en) * | 2020-11-13 | 2022-04-11 | 天虹科技股份有限公司 | Wafer pre-cleaning apparatus |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05136248A (en) * | 1991-11-15 | 1993-06-01 | Hitachi Ltd | Adhesion control device for adhesive tape and device thereof |
| JPH05190414A (en) | 1992-01-17 | 1993-07-30 | Nikon Corp | Substrate suction apparatus |
| JP2003025174A (en) | 2001-07-11 | 2003-01-29 | Nec Yamagata Ltd | Substrate suction method and substrate suction mechanism |
| JP5472616B2 (en) * | 2010-01-27 | 2014-04-16 | ウシオ電機株式会社 | Light irradiation device |
| KR101160158B1 (en) * | 2010-05-28 | 2012-06-27 | 주식회사 엘티에스 | substrate detaching apparatus of LLO process |
| JP6013850B2 (en) * | 2012-09-27 | 2016-10-25 | 株式会社ディスコ | Wafer processing method |
| JP5926700B2 (en) | 2013-04-30 | 2016-05-25 | 東京応化工業株式会社 | Support body separating apparatus and support body separating method |
| JP6298393B2 (en) * | 2014-10-30 | 2018-03-20 | 東京応化工業株式会社 | Support separation method |
| JP6418932B2 (en) * | 2014-12-15 | 2018-11-07 | 東京応化工業株式会社 | Ultraviolet irradiation apparatus, ultraviolet irradiation method, substrate processing apparatus, and manufacturing method of substrate processing apparatus |
-
2016
- 2016-06-29 JP JP2016129427A patent/JP6622661B2/en active Active
-
2017
- 2017-06-02 KR KR1020170069122A patent/KR102245859B1/en active IP Right Grant
- 2017-06-19 TW TW106120386A patent/TWI703670B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018006488A (en) | 2018-01-11 |
| TWI703670B (en) | 2020-09-01 |
| KR102245859B1 (en) | 2021-04-28 |
| KR20180002499A (en) | 2018-01-08 |
| TW201804563A (en) | 2018-02-01 |
| JP6622661B2 (en) | 2019-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| G170 | Re-publication after modification of scope of protection [patent] |