KR102238028B1 - Closed Heat Treatment Apparatus for Substrate Treatment - Google Patents

Abstract

The present invention relates to a closed heat treatment apparatus for substrate treatment used in heat treatment of a display substrate. The present invention relates to a heat treatment furnace for heat-treating a substrate which comprises a cooler for cooling when the process gas injected into the heat treatment furnace is discharged; a gas purifier for purifying the process gas that has passed through the cooler; and a heater which heats the process gas that has passed through the gas purifier to increase the temperature and then supplies it to the heat treatment furnace. The heat treatment furnace may be provided with a heat treatment apparatus that is sealed to prevent the leakage of the injected process gas.

Description

Closed Heat Treatment Apparatus for Substrate Treatment

The present invention relates to a sealed heat treatment apparatus for processing a substrate used in heat treatment of a display substrate.

During the heating process of the display substrate, it is necessary to maintain a low oxygen and water vapor concentration inside a heat treatment furnace that heats the display substrate. For this, a method of replacing most of the gas inside the heat treatment furnace with nitrogen is used.

During the manufacturing process of the display substrate, for example, before coating a photoresist or in a baking process of a substrate coated with a photoresist film, it is necessary to heat the display substrate to dry or preheat the display substrate.

At this time, lowering the concentration of oxygen and moisture has become a necessary matter for maintaining the quality and yield of a good substrate. However, in the past, it was not easy to keep the oxygen and moisture concentrations down and maintained as the heat treatment furnace and surroundings were not efficiently sealed, and nitrogen substitution was used to maintain the concentration, but a large amount of nitrogen gas had to be consumed due to leakage to the surroundings. .

That is, in the past, a large amount of nitrogen was required to maintain the uniformity of the temperature of the glass substrate in the heat treatment furnace, and it was very wasteful because it was discharged once after use in the heat treatment furnace. In addition, it is difficult to construct a chamber that withstands high pressure because it has to be considered even for continuous pressurization of gas into the closed heat treatment furnace.

The present invention provides a sealed heat treatment apparatus for processing a substrate capable of managing and controlling the concentration of oxygen and moisture during a manufacturing process of a display substrate and preventing loss of gas.

The present invention is a heat treatment furnace for heat-treating a substrate; A cooler that cools when the processing gas injected into the heat treatment furnace is discharged; A gas purifier for purifying the process gas passed through the cooler; It includes a heater for heating the processed gas passed through the gas purifier to increase the temperature and then supplying it to the heat treatment furnace,

The heat treatment furnace may be provided with a heat treatment apparatus that is sealed so that there is no leakage of the injected treatment gas.

The present invention is a heat treatment furnace for heat-treating a substrate, a cooler that cools when the process gas injected into the heat treatment furnace is discharged, a gas purifier that purifies the process gas passed through the cooler, and heats the processed gas through the gas purifier to increase the temperature. Next, when heat treatment of the substrate including the heater supplied to the heat treatment furnace, the heat treatment furnace may be configured in a closed type to prevent leakage of the processing gas injected into the heat treatment furnace.

The processing gas that has been processed in the heat treatment furnace may be cooled to a temperature below a predetermined temperature by moving to a connected cooler. In the gas purifier, impurities including fume generated in the heating process existing in the processing gas can be removed through a filter, nitrogen is supplied to increase the pressure of nitrogen, and the concentration of oxygen can be lowered.

A sensor capable of sensing the pressure and concentration of nitrogen, oxygen, and water vapor may be provided inside the heat treatment furnace. When the pressure of nitrogen sensed through the sensor is below the predetermined value required for the heating process, or the concentration of oxygen and water vapor is higher than the predetermined value required for the heating process, the gas purifier automatically operates and can operate until the desired value is reached. have

1 is a plan view of a heat treatment furnace apparatus of the present invention.
2 is a perspective view of the heat treatment furnace of the present invention.
3 is a schematic side cross-sectional view of the heat treatment furnace of the present invention.
4 is a schematic diagram showing the gas circulation of the present invention.
5 is a side cross-sectional view of the heat treatment furnace of the present invention.
6 is a perspective view of a dispersion plate in which area B of FIG. 5 is enlarged according to the present invention.
7 is a flow chart showing a gas circulation operation step of the heat treatment apparatus of the present invention.

Hereinafter, specific details for carrying out the present invention will be described in detail with reference to the accompanying exemplary drawings.

1 is a plan view of a heat treatment furnace apparatus of the present invention. Referring to FIG. 1, the heat treatment apparatus 1 includes a heat treatment furnace 100 for heat treatment of a substrate, A cover 101 that surrounds the heat treatment furnace 100 and can be installed with an external control panel, It may be configured to include a substrate transfer unit 200 installed on one side of the heat treatment furnace 100.

In an embodiment of the present invention, the heat treatment furnace 100 may be provided in a pair, and a substrate transfer unit 200 may be provided between the pair of heat treatment furnaces 100.

By sensing the pressure or temperature inside the heat treatment furnace 100 with a sensor, the internal situation may be determined and controlled through a control panel installed on the cover 101.

In the substrate transfer unit 200, equipment such as a robot is installed to insert a substrate for heat treatment into the substrate entrance 106 of the heat treatment furnace 100 in the direction of A, and the heat treated substrate is placed at the substrate entrance of the heat treatment furnace 100. By withdrawing from (106), the next step can be carried out.

2 is a perspective view of a heat treatment furnace of the present invention, and referring to FIG. 2, the heat treatment furnace 100 may be provided with a casing 110 forming an exterior for sealing.

A heating plate 120 for heating the substrate S may be provided inside the casing 110 of the heat treatment furnace 100 of the present invention.

The substrate S may be stacked and introduced into the casing 110 at a predetermined height.

The heating plate 120 may be provided on the upper and lower portions of the substrate S at intervals, and may be formed in a plate shape for evenly applying heat to the entire area of the substrate S.

The heating plate 120 may radiate infrared rays in the upper and lower directions of the heating plate 120. The heating plate 120 may be provided with, for example, a sheath heater. In addition to the infrared radiation heating of the heating plate 120, the substrate S may be evenly heated by convection of heated air.

Doors 130 and 140 that can be opened and closed may be provided on both sides of the casing 110.

Figure 3 is a heat treatment furnace of the present invention It is a schematic side cross-sectional view showing the flow of the processing gas as the center. Referring to FIG. 3, the doors 130 and 140 are located on the side of the heat treatment furnace 100 and may be used when the heat treatment furnace 100 is opened for maintenance and repair.

The inlet 131 and the outlet 141 may be formed in the doors 130 and 140 provided on the side surfaces. The inlet 131 may introduce supplied gas, that is, nitrogen gas, into the interior of the heat treatment furnace 100, and discharge the high-temperature gas inside the heat treatment furnace 100 through the outlet 141.

When the heat treatment device 1 is first operated, nitrogen gas is injected into the heat treatment furnace 100, and when nitrogen gas is discharged from the heat treatment furnace 100, oxygen and water vapor present inside the heat treatment furnace 100 are accompanied. It is discharged in one state and passed through the cooler 150 and the gas purifier 160 and then supplied to the heat treatment furnace 100 in a heated state while passing through the heater 170, thereby creating a high-temperature atmosphere inside the heat treatment furnace 100. Can be created.

When the nitrogen gas heated up and supplied into the heat treatment furnace 100 is discharged to the outside of the heat treatment furnace 100 again, the cooler 150 and the gas purifier 160 are discharged together with oxygen remaining in the heat treatment furnace 100. And the process of resupplying into the heat treatment furnace 100 through the heater 170 may be repeated.

In other words, the gas injected during the initial operation of the heat treatment apparatus 1 is nitrogen gas, which is injected into the heat treatment furnace 100 and then discharged together with oxygen and water vapor remaining in the heat treatment furnace 100. Nitrogen, oxygen, water vapor, etc. are mixed) and may undergo a circulating process.

The gas introduced through the inlet 131 provided on one side of one door can be introduced into the interior of the heat treatment furnace 100 through a plurality of inlet holes 131 formed over the entire area of the other side of one door 130. have.

The gas injected into the heat treatment furnace 100 is discharged to the door 140 through a plurality of discharge holes 142 formed in the entire area of one side of the other door 140, and the other side of the other door 140 It can be discharged to the outside through the outlet 141 formed in.

The inlet 131 may be formed larger than the diameter of the inlet hole 132, and the outlet 141 may be formed larger in diameter than the discharge hole 142.

The inlet hole 132 or the outlet hole 142 may be provided on one surface of the doors 130 and 140 at predetermined intervals in the width (y direction) and height (z direction) directions.

The inlet hole 132 or the outlet hole 142 may not be formed on the same line as the substrate S in the height direction (z direction) of the doors 130 and 140, but may be formed at a position that is shifted.

Therefore, the processing gas introduced through the inlet hole 132 does not immediately collide with the end of the substrate S, but moves through the upper and lower portions of the substrate S, thereby reducing the interference of the processing gas flow and stabilizing the flow. To prevent the occurrence of eddy currents.

In other words, the processing gas flowing into the heat treatment furnace 100 through the inlet hole 132 may be guided to pass under and above the substrate S in parallel with the substrate S.

In addition, the inlet hole 132 or the outlet hole 142 may be formed in a width direction (y direction) of the doors 130 and 140 in parallel with the substrate S at predetermined intervals. However, the arrangement position of the inlet hole 132 or the discharge hole 142 is not limited thereto, and may be provided in another arrangement.

The discharge hole 142 through which the injected processing gas flows may be provided symmetrically with respect to the inlet hole 132 and the center of the substrate S. For the same reason as the inlet hole 132, it must flow parallel to the substrate S and be discharged through the discharge hole 142 to reduce the eddy current around the discharge hole 142.

A base member 102 may be provided in the lower portion of the heat treatment furnace 100, a rack 104 is provided in the lower portion thereof, and as shown in FIG. 4 in the rack 104, a cooler 150, a gas purifier 160 and the heater 170 may be fixedly installed.

A gas passage pipe between the heat treatment furnace 100 and the cooler 150, the cooler 150 and the gas purifier 160, the gas purifier 160 and the heater 170, and the heater 170 and the heat treatment furnace 100, respectively. Can be connected.

The gas passage pipe may include a first gas passage pipe 181, a second gas passage pipe 182, a third gas passage pipe 183, and a fourth gas passage pipe 184.

The gas heated by the heater 170 may be introduced into the interior of the heat treatment furnace 100 through the fourth gas passage pipe 184, and the gas that has passed through the interior of the heat treatment furnace 100 is a first gas passage pipe ( It can be moved to the cooler 150 through 181.

The cooler 150 may lower the introduced gas to a temperature equal to or less than a predetermined value to protect the filter provided in the gas purifier 160 and discharge it.

The gas that has passed through the cooler 150 is cooled to a predetermined temperature or lower, then flows into the gas purifier 160 through the second gas passage pipe 182 and is purified, and then the heater through the third gas passage pipe 183 After being introduced into 170 and heated, the process of flowing into the heat treatment furnace 100 may be repeated.

In other words, the gas that has passed through the cooler 150 and the gas purifier 160 may have a lowered temperature. Accordingly, the temperature of the gas may be increased through the heater 170 for a high temperature suitable for the heating process in the heat treatment furnace 100.

The atmosphere of the process of heating the substrate S may require a low concentration of oxygen and water vapor. To this end, most of the gas can be replaced with nitrogen and pressurized. If possible with only a small amount of nitrogen during the process of heating the substrate S, the cost can be significantly reduced.

The filter of the gas purifier 160 may be damaged by hot gas or a problem in durability. In order for the filter of the gas purifier 160 to perform the filtering function normally, it is necessary to supply a gas having a temperature of a predetermined or lower temperature. To this end, the high-temperature gas that has passed through the heat treatment furnace 100 may be lowered through the cooler 150.

The gas purifier 160 may increase the pressure of nitrogen gas, which is a gas passing through the filter, and decrease the concentration of oxygen and water vapor. Through this, a gas having a concentration ratio suitable for the heating process of the heat treatment furnace 100 may be produced.

5 is a side view of the heat treatment furnace of FIG. 2, and referring to FIG. 5, the doors 130 and 140 provided on both sides of the heat treatment furnace 100 may be symmetrically provided with respect to the inside of the heat treatment furnace 100. have. The following may be an embodiment of the door 130 through which external gas is introduced. In the door 140 through which the introduced gas is ejected, an arrow indicating the gas flow of FIG. 5 may be opposite.

Referring to FIG. 5, looking specifically at the door 130 of FIG. 3 schematically illustrated, an insulating material 133 and an inlet 131 may be provided on one side of the door 130, and the other The inlet hole 132 may be provided on the side.

The other side of the door 130 provided with the inlet hole 132 may have a smaller area than the one side of the door 130. A sealing member 130a may be provided on the outer peripheral surface of the other side of the door 130 having a small area.

The sealing member 130a may be provided in a'C' shape by the casing 110 and the guide 134 to maintain high sealing with the outside.

When connecting the inlet 131 and the fourth gas passage pipe 184, for example, a circular sealing member 131a may be provided between the inlet 131 and the fourth gas passage pipe 184.

The door 130 may be blocked from outside air by the sealing members 130a and 131a to have a high sealing rate.

In the above embodiment, the entire heat treatment furnace may be blocked from the outside by the sealing members 102a, 130a, and 131a.

Even if a design is partially different from the configuration of the present invention, the heat treatment furnace may be sealed using a sealing member in the same manner as described above.

In order to increase the heat insulation of the heat treatment furnace 100, an insulation material 133 may be provided on the doors 130 and 140 communicating with the external gas pipe. The doors 130 and 140, which have become heavy due to the heat insulating material 133, can be strongly bolted to the casing 110.

Referring to FIG. 5, the arrow of FIG. 5 may indicate the flow of the injected process gas in the door 130. A diffusion space 138 occupying a predetermined space may be provided inside the door 130 so that the gas introduced from the outside is evenly sprayed to each substrate S by the inlet hole 132.

The processing gas introduced into the door 130 through the inlet 131 may be dispersed into the diffusion space 138 by the dispersion unit 190.

A plurality of support members 137 may be supported in the diffusion space 138 at intervals. Accordingly, the doors 130 and 140 may be firmly maintained by the support member 137 even if the diffusion space 138 is formed therein.

The support member 137 may be provided in the diffusion space 138 in the width direction (x direction) of the door 130.

The sealing members 130a and 131a may be formed of a member that is not deformed even when exposed to a high-temperature gas while being sealed when the doors 130 and 140 are closed, that is, for example, viton.

The casing 110 of the heat treatment furnace 100 may be coupled to and fixed to the base member 102.

A flange portion 115 is formed at the lower end of the casing 110 and may be coupled to the base member 102 through a fastening member 116 such as a bolt or screw.

In addition, the base member 102 may be provided with a sealing member 102a so that when the casing 110 is coupled, it is in close contact with the flange portion 115 to be sealed. The sealing member 102a may be provided in a'ㅇ' shape.

6 is a perspective view of a dispersing unit in an enlarged area B of FIG. 5.

Referring to FIG. 6, the dispersion unit 190 may cause the processing gas injected through the inlet 131 to be dispersed into the diffusion space 138.

The dispersion unit 190 may include a support frame 191 facing the door 130 and 140, a dispersion plate 193, and a support 192 connecting the support frame 191 and the dispersion plate 193. have.

One surface of the support frame 191 may be fixed to the doors 130 and 140, and the other surface of the support frame 191 may be connected to the support 192.

The support frame 191 may be formed in, for example, a circle or a square, and a through hole 191a may be formed. The through hole 191a may pass through the processing gas injected through the inlet 131 and be sprayed to the dispersion plate 193. The diameter of the through hole 191a may be equal to or larger than the diameter of the inlet 131.

A plurality of supports 192 may be provided at intervals along the circumferential direction of the support frame 191. The support 192 may be connected to the dispersion plate 193 so that the dispersion plate 193 is positioned at a predetermined position in the diffusion space 138.

A passage space 192a through which the processing gas introduced through the inlet 131 may pass may be formed between the plurality of supports 192.

The length of the support 192 may vary depending on the position of the dispersion plate 193 in the diffusion space 138. The area of the passage space 192a may be influenced by a difference in the distance due to the length of the support 192 or the number of installations.

A plurality of dispersion holes 193a may be formed in the dispersion plate 193 over the entire area. The diameter of the dispersion hole 193a may be smaller than the diameter of the inlet 131.

Part of the process gas introduced into the inlet 131 moves to the diffusion space 138 through the passage space 192a, and some of the process gas is injected through the dispersion hole 193a of the dispersion plate 193. It moves to the diffusion space 138, and the rest hits the dispersion plate 193 and scatters up, down, left and right, and moves to the diffusion space 138, so that the processed gas introduced through the inlet 131 passes through the dispersion unit 190 It can spread evenly in the diffusion space 138.

In other words, the dispersion unit 190 may prevent the process gas injected into the inlet 131 from being strongly injected only into the inlet hole 132 adjacent to the inlet 131.

The dispersing unit 190 may be installed for each inlet 131 installed in the door 130 so that the processing gas can be spread evenly throughout the diffusion space 138.

7 is a flow chart showing a gas circulation operation step of the heat treatment apparatus of the present invention. Referring to FIG. 7, the gas circulation operation step may include a preparation step (S10), a normal operation step (S20), and a feeding step (S30).

The preparation step S10 may include a purge step S11 and a purification step S12.

In the purge step (S11), sufficient nitrogen gas is supplied into the heat treatment furnace to increase the pressure of nitrogen and lower the concentration of oxygen and water vapor.

In the purification step (S12), the gas containing high nitrogen sufficiently supplied to the heat treatment furnace by the purge step (S11) may be circulated through the gas circulation device. In this process, the gas purifier 160 may filter the concentrations of oxygen and water vapor contained in the circulating gas as much as possible to create an optimum gas concentration state for the heating process of the heat treatment furnace.

When the preparation step S10 is completed, the normal operation step S20 for the heating process of the heat treatment furnace 100 may be started. A high-temperature atmosphere may be required around the substrate S for the heating process. The gas is heated by the heater 170 and the heated gas may be supplied into the heat treatment furnace 100.

The gas that has been processed in the heat treatment furnace 100 moves to the connected cooler 150 and is cooled to a temperature below a predetermined temperature, and the gas purifier 160 removes impurities including fume generated in the heating process through a filter. Can be removed.

A sensor capable of sensing the pressure and concentration of nitrogen, oxygen, and water vapor may be provided inside the heat treatment furnace 100. When the pressure of nitrogen sensed through the sensor is less than the predetermined value required for the heating process or the concentration of oxygen and water vapor is higher than the predetermined value required in the heating process, the gas purifier 160 automatically operates until the desired value is reached. Can work.

In the preparation step (S10) and the normal operation step (S20), since it is operated with the amount of nitrogen gas, which is the gas initially supplied in the purge step (S11), there is no need to continuously supply nitrogen gas during the heating process of the heat treatment furnace 100. It may be advantageous in cost, and it is not necessary to design the heat treatment furnace 100 to withstand the high pressure due to the continuous supply of nitrogen during the process, thereby reducing the cost.

In one step of the preparation step (S10) and the normal operation step (S20), if a nitrogen pressure less than a predetermined value (reference value) is detected by a sensor inside the heat treatment furnace due to a defect or defect in the device, the feeding step ( S30).

When a pressure of nitrogen less than the reference value is detected, in the supplying step S30, the operation of each step is stopped and nitrogen of a predetermined pressure is introduced through the heat treatment furnace 100 or the gas purifier 160 to increase the nitrogen pressure. . When the nitrogen pressure rises above the reference value, the preparation step (S10) and the normal operation step (S20) may be repeated again.

The present invention is an apparatus for heat-treating a display substrate, wherein the concentration of oxygen and water vapor may be higher than a predetermined value during the heat treatment process, and a heat treatment furnace that heats the display substrate to increase the pressure of nitrogen and lower the concentration of oxygen and water vapor. By injecting a large amount of nitrogen inside, the concentration of oxygen and water vapor can be kept low and managed.

1... heat treatment equipment
100.... heat treatment furnace 101... cover
102... base member
102a... sealing member 104... rack
106... board entrance 110... casing
115... flange part 116... fastening member
120... hot plate 130,140... door
130a,131a... sealing member
131...inlet 132...inlet hole
141...Exhaust port 142...Exhaust hole
133... Insulation 134... Guide
135... dispersion plate 136... fixing member
137... support member 138... diffusion space
150... cooler
160... gas purifier 170... heater
181... the first gas passage pipe 182... the second gas passage pipe
183...3rd gas passage pipe 184...4th gas passage pipe
190... Dispersion part 191... Support frame
191a... through hole 192... support
192a... passing space 193... scatter plate
193a... dispersion ball
200... substrate transfer unit
S... substrate
S10... preparatory steps
S11...Purge step S12...Purge step
S20... Normal operation step S30... Feeding step

Claims (11)

A heat treatment furnace for heat-treating the substrate;
A cooler for cooling the processing gas supplied and discharged into the heat treatment furnace;
A gas purifier for purifying the process gas passed through the cooler;
A heater for heating the processed gas passed through the gas purifier to raise the temperature, and then supplying it to the heat treatment furnace;
Including,
The heat treatment furnace is sealed so that there is no leakage of the injected processing gas,
The heat treatment furnace consists of a casing and a door provided to be opened and closed on both sides of the casing,
An inlet is provided on one side of one of the doors, and a plurality of inlet holes are formed on the other side of the door,
In the interior of the door, a diffusion space for supplying the gas injected through the inlet to the interior of the casing through the plurality of inlet holes is formed,
A dispersion unit for dispersing the flow of gas introduced into the diffusion space is provided at a predetermined position in the diffusion space,
The dispersion unit,
A dispersion plate through which the processing gas injected through the inlet may collide and spread into the diffusion space;
A plurality of supports for supporting the dispersion plate to be positioned in a predetermined space of the diffusion space, and fixed to form a passage space at intervals along the circumferential direction of the dispersion plate;
A support frame connected to the support on one side and connected to the door on the other side to place the support and the dispersion plate in the diffusion space; Including,
The processing gas injected through the inlet passes through the through hole of the support frame and moves to the diffusion space through the passage space between the plurality of supports, and some of the processing gas collides with the dispersion plate and spreads in all directions. A heat treatment apparatus in which a portion of the processing gas moves to the diffusion plate and is dispersed by passing through the dispersion hole formed in the dispersion plate.
The method of claim 1,
A heat treatment apparatus provided with a sealing member for sealing the door when the door is closed.
The method of claim 1,
Consisting of a base member to which the casing is coupled to a lower portion of the casing,
A heat treatment apparatus provided with a sealing member configured to seal the heat treatment furnace when the base member is coupled with a flange portion formed under the casing.
The method of claim 1,
A heat treatment device in which one side of the other door among the doors is provided with a discharge hole through which the processing gas is discharged from the inside of the heat treatment furnace, and the other side of the other door is formed with a discharge hole through which the processing gas injected into the door is discharged to the outside. .
The method of claim 4,
A heat treatment apparatus in which a sealing member is provided at at least one of the inlet port, the outlet port, and a connection portion of the external gas pipe. The method of claim 5,
The inlet hole or the outlet hole is a heat treatment apparatus having a diameter smaller than the inlet or outlet, respectively.
delete delete delete The method of claim 1,
The processing gas injected into the heat treatment furnace is injected into the heat treatment furnace in a heated state through the heater to create a high temperature atmosphere,
When the processing gas is injected into the heat treatment furnace and then discharged, the heat treatment apparatus is discharged together with oxygen or water vapor to lower the concentration of oxygen or water vapor. A heat treatment furnace for heat-treating the substrate;
A cooler for cooling the processing gas supplied and discharged into the heat treatment furnace;
A gas purifier for purifying the process gas passed through the cooler;
A heater for heating the processed gas passed through the gas purifier to raise the temperature, and then supplying it to the heat treatment furnace;
Including,
The heat treatment furnace is sealed so that there is no leakage of the injected processing gas,
The heat treatment furnace consists of a casing and a door provided to be opened and closed on both sides of the casing,
An inlet is provided on one side of one of the doors, and a plurality of inlet holes are formed on the other side of the door,
In the interior of the door, a diffusion space for supplying the gas injected through the inlet to the interior of the casing through the plurality of inlet holes is formed,
A dispersion unit for dispersing the flow of gas introduced into the diffusion space is provided at a predetermined position in the diffusion space,
The dispersing part is made of a dispersing plate that can be evenly spread into the diffusion space by colliding with the processing gas injected through the inlet,
A plurality of dispersion holes are formed in the dispersion plate so that the processing gas passes and is dispersed into the diffusion space,
A plurality of support members are provided at intervals in the diffusion space,
The diffusion space is divided into a plurality of spaces by the support member,
A direction in which gas is injected through the inlet is set as a first direction, and a direction perpendicular to the first direction is set as a second direction,
Part of the processing gas passes through the dispersion hole and flows in the first direction, and a part of the processing gas is blocked by the dispersion hole and flows in the second direction,
The support member is provided with a plurality of holes,
A part of the flow of the processing gas in the second direction is turned in the first direction by the hole in the support member,
A heat treatment apparatus in which the processing gas is evenly spread into the partitioned diffusion space by the dispersion plate and the support member.

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