KR102233357B1 - Powering electronic devices in the data center - Google Patents

Abstract

The data center power system includes a power conductor comprising a live conductor surface and configured to deliver direct current (DC) power from a power source through a human-occupiable workspace of the data center; A grounded conductor located in a human-occupied workspace away from the power conductor; A first electrical connector configured to mount in a data center rack supporting a plurality of electronic devices, the first electrical connector being movable to electrically contact a live conductor surface of the power conductor; And a second electrical conductor positioned on the rack and configured to electrically contact a grounded conductor.

Description

Powering electronic devices in the data center

[0001] The present disclosure relates to systems and methods for powering electronic devices, such as servers, network devices, and other electronic devices in a data center.

[0002] Data center planning, structure and operational arrangement typically involve a long time to market factor. Shortening time to market for commercial data centers can be a big business driver for financial success. One of the drivers of long time to market is rack and server placement in the finished data center building. Conventionally, data center information technology (IT) architecture, racks and servers need to be physically installed, cabling and powered up. Mechanical and human errors may exist during the physical installation and powering of racks and servers.

[0003] In a general implementation, a data center power system includes a power conductor comprising a live conductor surface and configured to deliver direct current (DC) power from a power source through a human-occupied workspace of the data center; A grounded conductor located in a human-occupied workspace away from the power conductor; A first electrical connector configured to mount in a data center rack supporting a plurality of electronic devices, the first electrical connector being movable to electrically contact a live conductor surface of the power conductor; And a second electrical conductor positioned on the rack and configured to electrically contact a grounded conductor.

[0004] In a typical implementation, a data center power system includes an enclosure defining an inner volume; A first direct current (DC) power bus mounted on the inner volume and extending outward from the enclosure to electrically couple to the main power source; A second DC power bus mounted on the inner volume and extending outward from the enclosure to electrically couple to the main power source; A plurality of transfer switches mounted on the inner volume, each transfer switch electrically coupled to one of the first DC power bus or the second DC power bus; A plurality of DC power conductors, each DC power conductor comprising one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus. Electrically coupled to the pair of transfer switches; Each DC power conductor is configured to electrically couple to a data center rack supporting a plurality of electronic devices.

[0005] In a typical implementation, a data center power connector includes a conduit defining an inner volume; And power to at least one electronic device extended through the inner volume of the conduit and mounted on a rack disposed in a human-occupied workspace of the data center from the main power source of the data center, and at least one electronic device and data. And at least one conductor configured to transfer data between the center control system.

In an aspect combinable with the general implementation, at least a portion of the live conductor surface is exposed to a human-occupiable workspace.

[0007] In a further aspect combinable with any of the previous aspects, the live conductor surface comprises a catenary conductor, and the first electrical connector is configured to mount to a top portion of a data center rack.

In a further aspect combinable with any of the previous aspects, the live conductor surface includes a rail configured to mount to a floor of a data center, and the first electrical connector is configured to mount to a bottom portion of the data center rack.

[0009] In a further aspect combinable with any of the previous aspects, the grounded conductor is embeddable within the floor of the data center.

[0010] In a further aspect combinable with any of the previous aspects, the live conductor surface comprises a mesh or flat conductor surface.

[0011] In a further aspect combinable with any of the previous aspects, the mesh or flat conductor surface includes at least a portion of a ceiling structure at least partially enclosing a human-occupiable workspace.

[0012] In a further aspect combinable with any of the preceding aspects, the mesh conductor surface includes a grid of cruciform electrical conductors embedded or attached to a ceiling structure at least partially enclosing a human-occupiable workspace.

[0013] In a further aspect combinable with any of the previous aspects, the first electrical connector is deflected to move away from the data center rack to electrically contact the live conductor surface of the power conductor.

In a further aspect combinable with any of the previous aspects, the first electrical connector comprises a pantograph.

In a further aspect combinable with any of the previous aspects, the power conductor includes a first power conductor.

An additional aspect combinable with any of the previous aspects further includes a second power conductor configured to deliver DC power from the power source through the human-occupied workspace of the data center.

[0017] In a further aspect combinable with any of the preceding aspects, the second power conductor comprises a live conductor surface, and the first electrical connector is movable to electrically contact the live conductor surface of the second power conductor.

In a further aspect combinable with any of the previous aspects, the first electrical connector is movable to simultaneously electrically contact live conductor surfaces of the first and second power conductors.

In an aspect combinable with a general implementation, at least some of the plurality of transfer switches comprise an automatic transfer switch.

In a further aspect combinable with any of the previous aspects, at least some of the plurality of transfer switches include a fuse contact.

In a further aspect combinable with any of the previous aspects, the main power source is electrically coupled to the first and second DC power buses via a power converter.

In a further aspect combinable with any of the previous aspects, the main power source includes at least one of a utility grid power source or a backup power source.

In a further aspect combinable with any of the previous aspects, the backup power source includes at least one of a generator power source or a renewable power source.

In a further aspect combinable with any of the previous aspects, the first DC power bus and the second DC power bus are separated from each other within the enclosure.

In an aspect combinable with a general implementation, the at least one conductor comprises a DC electrical conductor configured to deliver direct current (DC) power.

In a further aspect combinable with any of the previous aspects, the DC power includes DC power that is a voltage of less than 1000 volts.

In a further aspect combinable with any of the previous aspects, the at least one conductor comprises an AC electrical conductor configured to deliver alternating current (AC) power that is a voltage of less than 600 volts.

[0028] In a further aspect combinable with any of the previous aspects, the at least one conductor comprises a power line communication conductor.

[0029] In a further aspect combinable with any of the previous aspects, the power line communication conductor is one of a CAN-bus, a LIN-bus (DC-LIN) over a power line, DC-BUS, LonWorks, or SAE J1772 power line communication conductor. Includes.

[0030] In a further aspect combinable with any of the previous aspects, the at least one conductor comprises a dual conductor coupled in the conduit, one of the dual conductors being configured to transfer power and the other of the dual conductors Is configured to transmit data.

[0031] In a further aspect combinable with any of the previous aspects, the data includes identification data of the at least one electronic device.

[0032] In another general implementation, a method of delivering direct current (DC) power to a data center rack includes providing DC power from a data center power source to a power conductor, wherein the power conductor is a human-occupied operation of the data center. Expands through space ―; Moving the data center rack to a location within a human-occupied workspace near the power conductors; Moving a first electrical connector mounted on the data center rack into electrical contact with the live conductor surface of the power conductor based on the data center rack being in its location; Based on what the data center rack is in its location, to complete the power circuit, a grounded conductor located in a human-occupied workspace away from the power conductor is in electrical contact with a second electrical conductor located on the rack. step; And providing DC power from the power conductor to the plurality of electronic devices supported by the data center rack based on the completed power circuit.

[0033] In an aspect combinable with a general implementation, the power conductor comprises a catenary conductor, and the step of moving the first electrical connector moves the first electrical connector away from the top portion of the data center rack, the top portion of the data center rack. And moving into electrical contact with a catenary conductor that is exposed to and extends through the human-occupiable workspace above.

[0034] In a further aspect combinable with any of the previous aspects, the power conductor comprises a rail conductor mounted to the floor of the data center, and moving the first electrical connector comprises: moving the first electrical connector into the data center rack. Moving away from the bottom portion of the data center rack in electrical contact with a rail conductor that is exposed to and extends through a human-occupied workspace below the data center rack.

[0035] In a further aspect combinable with any of the previous aspects, a grounded conductor is embedded within the floor of the data center.

[0036] In a further aspect combinable with any of the previous aspects, the live conductor surface comprises a mesh or flat conductor surface.

[0037] In a further aspect combinable with any of the previous aspects, the mesh or flat conductor surface includes at least a portion of a ceiling structure at least partially enclosing a human-occupiable workspace.

[0038] In a further aspect combinable with any of the previous aspects, the mesh conductor surface includes a grid of cruciform electrical conductors embedded or attached to a ceiling structure at least partially enclosing a human-occupiable workspace.

[0039] An additional aspect combinable with any of the preceding aspects is that the step of moving the first electrical connector comprises, using a deflection device, the first away from the data center rack to electrically contact the live conductor surface of the power conductor. And deflecting the electrical connector.

In a further aspect combinable with any of the previous aspects, the deflection device includes a pantograph.

[0041] In a further aspect combinable with any of the previous aspects, the power conductor includes a first power conductor.

[0042] An additional aspect combinable with any of the previous aspects includes providing DC power from a data center power source to a second power conductor, wherein the second power conductor extends through the human-occupied workspace of the data center. -; And moving the first electrical connector to electrically contact a live conductor surface of at least one of the first or second power conductors, based on the data center rack being in its location.

[0043] In another general implementation, a method of delivering direct current (DC) power to a data center rack includes providing DC power from a main power source to a first DC power bus mounted on an inner volume of an enclosure; Providing DC power from the main power source to a second DC power bus mounted to the inner volume of the enclosure; Feeding DC power from the first DC power bus to the first plurality of transfer switches mounted on the inner volume; Feeding DC power from the second DC power bus to the second plurality of transfer switches excluding the first plurality of transfer switches mounted on the inner volume; (i) DC power from one of the first plurality of transfer switches, or (ii) DC power from one of the second plurality of transfer switches, electrically coupled to a data center rack supporting a plurality of electronic devices. Supplying the ringed DC power conductor; And supplying power to the plurality of electronic devices with the supplied DC power.

In an aspect combinable with a general implementation, each of the plurality of transfer switches includes an automatic transfer switch.

In a further aspect combinable with any of the previous aspects, each of the plurality of transfer switches includes a fuse contact.

[0046] In a further aspect combinable with any of the previous aspects, the main power source comprises alternating current (AC) power, and the method prior to providing DC power to the first DC power bus and the second DC power bus. And inverting the AC power to DC power.

In a further aspect combinable with any of the previous aspects, the main power source includes at least one of a utility grid power source or a backup power source.

[0048] An additional aspect combinable with any of the previous aspects further comprises electrically coupling the first and second DC power buses, via a power converter, to both a utility grid power source and a backup power source. do.

An additional aspect combinable with any of the previous aspects includes: detecting a loss of main power from a utility power grid; And based on the detected loss, from providing DC power from the utility power grid to the first and second DC power buses, providing DC power from the backup power source to the first and second DC power buses. It further comprises the step of switching to the one to do.

[0050] An additional aspect combinable with any of the previous aspects may include electrically decoupling one of the first or second DC power buses from a main power source; Performing maintenance on one of the first or second DC power buses; And simultaneously with performing the maintenance, feeding DC power from the other one of the first or second DC power buses to the DC power conductor through each of the first or second plurality of transfer switches. .

[0051] In another general implementation, a data center power connection system includes a data center power-control system electrically coupled to a main power source for the data center; And a plurality of power connectors communicatively and electrically coupled to the data center power-control system, each of the plurality of power connectors being (i) in a rack disposed in a human-occupied workspace of the data center. A power conductor configured to transfer power from the main power source to the mounted plurality of electronic devices, and (ii) data between the plurality of electronic devices and the data center power-control system.

In an aspect combinable with a general implementation, a data center power-control system includes at least one processor; And, when executed by the at least one processor, causing the at least one processor to receive data from the plurality of electronic devices via a power conductor, the data including identification information associated with the plurality of electronic devices; And at least one memory storing instructions for performing operations comprising generating at least one virtual model of the data center based at least in part on the received identification information.

[0053] In a further aspect combinable with any of the previous aspects, the identification information includes at least one of a name, model, or serial number of a particular electronic device among the plurality of electronic devices.

In a further aspect combinable with any of the previous aspects, the identification information includes at least one of a rack designation name of a particular rack of a plurality of racks supporting at least some of the plurality of electronic devices.

[0055] In a further aspect combinable with any of the previous aspects, one of the plurality of virtual models includes a geographic topology model.

[0056] In a further aspect combinable with any of the previous aspects, generating at least one virtual model of the data center based at least in part on the received identification information comprises a geographic topology for each of the plurality of racks. Creating a model, determining a geographic location of the rack in a human-occupied workspace; Allocating some of the plurality of electronic devices to the rack based at least in part on the received identification information; And allocating the determined geographic location of the rack to the allocated portion of the electronic devices.

[0057] In a further aspect combinable with any of the previous aspects, one of the plurality of virtual models includes a cooling topology model.

[0058] In a further aspect combinable with any of the previous aspects, generating at least one virtual model of the data center based at least in part on the received identification information comprises a cooling topology for each of the plurality of racks. Generating a model, determining a geographic location of the rack in the human-occupiable workspace based at least in part on the received identification information; Determining, among the plurality of cooling domains in the data center, a cooling domain associated with the geographic location of the rack; And allocating the rack to the determined cooling domain, wherein the cooling domain includes at least one cooling device operative to cool electronic devices supported in the rack.

[0059] In a further aspect combinable with any of the previous aspects, one of the plurality of virtual models includes a power topology model.

[0060] In a further aspect combinable with any of the previous aspects, generating at least one virtual model of the data center based at least in part on the received identification information comprises a power topology for each of the plurality of racks. Generating a model, determining a geographic location of the rack in the human-occupiable workspace based at least in part on the received identification information; Determining a power domain associated with a geographic location of the rack from among the plurality of power domains in the data center; And allocating the rack to the determined power domain, wherein the power domain includes at least one power device operative to deliver power to electronic devices supported in the rack.

[0061] In a further aspect combinable with any of the previous aspects, one of the plurality of virtual models includes a networking topology model.

[0062] In a further aspect combinable with any of the previous aspects, generating at least one virtual model of the data center based at least in part on the received identification information comprises a networking topology for each of the plurality of racks. Generating a model, determining a geographic location of the rack in the human-occupiable workspace based at least in part on the received identification information; Determining a networking domain associated with the geographic location of the rack from among the plurality of networking domains in the data center; And allocating the rack to the determined networking domain, wherein the networking domain includes at least one networking device operative to communicatively couple electronic devices supported in the rack to a network of the data center.

In a further aspect combinable with any of the previous aspects, the received data includes data received from a plurality of electronic devices via a power conductor at a first instant.

[0064] In a further aspect combinable with any of the previous aspects, the operations include receiving, from a plurality of electronic devices, additional data via the power conductor at a second moment following the first moment, wherein the additional data is Including updated identification information associated with the plurality of electronic devices; And updating at least one virtual model of the data center based at least in part on the received updated identification information.

In another general implementation, the data center power system includes a first direct current (DC) switchboard module; And a first plurality of racks, wherein the first DC switchboard module comprises: an enclosure, a first DC power bus mounted to the enclosure and extending outward from the enclosure to electrically couple to a main power source, mounted to the enclosure and a main A second DC power bus extending outward from the enclosure to electrically couple to the power source, a plurality of transfer switches mounted in the enclosure-each transfer switch is electrically connected to either the first DC power bus or the second DC power bus. And a plurality of DC power conductors, each DC power conductor having one transfer switch electrically coupled to the first DC power bus and one electrically coupled to the second DC power bus. Electrically coupled to a pair of transfer switches including a transfer switch of The first plurality of racks includes a plurality of electronic devices, and each of at least some of the first plurality of racks is electrically coupled to a specific DC power conductor of the first DC switchboard module.

[0066] An aspect combinable with a general implementation is an enclosure, a first DC power bus mounted in the enclosure and extending outward from the enclosure to electrically couple to a main power source, mounted in the enclosure and electrically coupled to a main power source. A second DC power bus that extends outward from the enclosure so that, a plurality of transfer switches mounted in the enclosure-each transfer switch is electrically coupled to one of the first DC power bus or the second DC power bus -, and a plurality Further comprising a second DC switchboard module comprising DC power conductors, each DC power conductor is electrically coupled to a second DC power bus and one transfer switch electrically coupled to the first DC power bus. It is electrically coupled to a pair of transfer switches comprising one ringed transfer switch.

[0067] In a further aspect combinable with any of the previous aspects, including a second plurality of racks including a plurality of electronic devices, at least some of the second plurality of racks each It is electrically coupled to a DC power conductor.

[0068] In a further aspect combinable with any of the previous aspects, each of the other portions of the second plurality of racks is electrically coupled to a specific DC power conductor of the first DC switchboard module, and Each of the other portions is electrically coupled to a specific DC power conductor of the second DC switchboard module.

In a further aspect combinable with any of the previous aspects, some of the second plurality of racks and another of the second plurality of racks are located in separate rows of the plurality of rows of racks in the data center.

In a further aspect combinable with any of the previous aspects, portions of the first and second plurality of racks are located in a particular row of one of the plurality of rows of racks.

[0071] In another general implementation, a method for powering electronic devices in a data center includes electrically coupling a plurality of power connectors to a power source of the data center through a power-control system of the data center; Delivering power from the power source, through respective conductors of the plurality of power connectors, to a plurality of electronic devices in the data center; And transmitting, via respective conductors, data from the plurality of electronic devices to the power-control system.

In an aspect combinable with a general implementation, the power source comprises a direct current (DC) power source and the delivered power comprises DC power.

[0073] In a further aspect combinable with any of the previous aspects, the data includes identification information associated with the plurality of electronic devices.

[0074] An additional aspect combinable with any of the previous aspects further comprises generating, with at least one hardware processor of the power-control system, generating at least one virtual model of the data center based at least in part on the identification information. Includes.

[0075] In a further aspect combinable with any of the previous aspects, the at least one virtual model comprises a geographic topology model.

[0076] An additional aspect combinable with any of the previous aspects may include determining a geographic location of each of a plurality of racks in a human-occupiable workspace; Allocating some of the plurality of electronic devices to each rack based at least in part on the received identification information; And allocating the determined geographic location of the rack to the allocated portion of the electronic devices.

[0077] In a further aspect combinable with any of the previous aspects, the at least one virtual model includes a cooling topology model.

[0078] A further aspect combinable with any of the previous aspects may include determining a geographic location of each of the plurality of racks in a human-occupiable workspace based at least in part on the identification information; Determining, among the plurality of cooling domains in the data center, a cooling domain associated with a geographic location of each rack; And allocating the rack to the determined cooling domain, wherein the cooling domain includes at least one cooling device operative to cool electronic devices supported in the rack.

[0079] In a further aspect combinable with any of the previous aspects, the at least one virtual model comprises a power topology model.

[0080] A further aspect combinable with any of the previous aspects may include determining a geographic location of each of the plurality of racks in a human-occupiable workspace based at least in part on the identification information; Determining, among a plurality of power domains in the data center, a power domain associated with a geographic location of each rack; And allocating the rack to the determined power domain, wherein the power domain includes at least one power device operative to deliver power to electronic devices supported in the rack.

[0081] In a further aspect combinable with any of the previous aspects, the at least one virtual model includes a networking topology model.

[0082] A further aspect combinable with any of the previous aspects may include determining a geographic location of each of the plurality of racks in a human-occupiable workspace based at least in part on the identification information; Determining, among a plurality of networking domains in the data center, a networking domain associated with a geographic location of each rack; And allocating the rack to the determined networking domain, wherein the networking domain includes at least one networking device operative to communicatively couple electronic devices supported in the rack to the network of the data center.

[0083] In a further aspect combinable with any of the previous aspects, each of the power connectors is a first respective conductor configured to deliver power from a power source to at least some of the plurality of electronic devices in the data center, and And a second respective conductor configured to transmit data from some of the plurality of electronic devices to the power-control system.

Implementations according to this disclosure may include one or more of the following features. For example, implementations in accordance with the present disclosure may significantly perform the deployment, identification, inventory, and maintenance of electronic devices in a data center more efficiently than conventional techniques. Additionally, implementations according to the present disclosure may provide safer, faster, and more flexible power delivery for electronic devices in a data center. Further, implementations according to the present disclosure may facilitate greater redundancy of power delivery for electronic devices in a data center.

Details of one or more implementations of the subject matter described in this disclosure are set forth in the accompanying drawings and the description below. Other features, aspects and advantages of the subject matter will become apparent from the description, drawings, and claims.

1A is a schematic illustration of a top view of an exemplary implementation of a data center power system.
1B is a schematic diagram of a top view of another exemplary implementation of a data center power system.
1C is a schematic diagram of a side view of an exemplary implementation of a data center power system.
1D is a schematic diagram of a side view of another exemplary implementation of a data center power system.
2A and 2B are schematic diagrams of top and side views, respectively, of another exemplary implementation of a data center power system.
3A is a schematic diagram of a direct current (DC) data center power module.
3B and 3C are schematic diagrams of example implementations of data centers having racks powered by one or more DC data center power modules of FIG. 3A.
4 is a schematic diagram of a data center including a control system using a data center power connector to transfer power and data between one or more server racks.
5 is a schematic diagram of an exemplary controller for a data center cooling system according to the present disclosure.

This disclosure describes implementations, such as systems, apparatus and methods of data center power systems. In some aspects, data center power systems supply direct current (DC) power from one or more main power sources (e.g., one or more transformers and/or DC power delivery systems that supply server racks (via one or more rectifiers). In some example implementations, the data center power system is provided with overhead conductors (e.g., lines or bus bars), e.g., on the data center floor or as part of a rack support structure. Includes catenary conductors installed in the workspace of the data center enclosing server racks with a return path (ground). In some aspects, server racks may include electrical connectors such as electrical conductors, eg, pantographs that allow the racks to be rolled on the floor, grounded, and connected to overhead conductors. These power systems allow server racks to be of variable dimensions (eg, height, width or both) and can be installed anywhere on the floor to allow for flexible placement.

In other example implementations, a data center power system includes floor mount conductors (eg, rails) overlying a data center floor adjacent to server racks. The configuration installed on the floor of the data center includes floor-mounted conductors (eg, rails) and a ground return path. Server racks include electrical connectors, for example current collectors or conductive shoes that electrically couple the racks to floor-mount conductors. Floor-mount conductors are electrically connected to the data center's main power source to conduct DC electricity to the server racks.

In other example implementations, a data center power system includes a DC power module that includes a number of simultaneously maintainable conductors (eg, bus bars). Each DC power module is electrically connected to a specific server rack and delivers power to the rack through one separate path to the main power source, from delivering power to the rack through one path to the main power source. It includes a transfer switch coupled directly to a specific server rack for switching (eg, manually or automatically). Thus, each rack is dual sourced from the main power source(s), enabling loss of the power path to the server rack in the event of a shutdown, e.g. the path is shut down for maintenance or due to malfunction. .

[0098] In another example implementation, the data center power system electrically connects the server racks to a main DC power source that delivers power to the server racks and transmits data from the racks (or to the racks) to the control system (or from). Includes DC power connectors that couple. The control system receives data from the server racks and virtually models the data center based at least in part on the received data. In some aspects, DC power connectors include an interlockable connector that does not require a human installer to have a specific training/license for electrically coupling server racks to a main power source with DC power connectors. When electrically coupled to server racks, DC power connectors can also facilitate communication between the rack and the connector to enable a power handshake before power is applied to the rack. Thus, the DC power connector facilitates a secure power connection to the server rack.

1A is a schematic illustration of a top view of an exemplary implementation of a data center power system 100. In general, DC power system 100 provides power to electronic devices, such as servers, processors, memory modules, networking devices, and other IT and data processing devices within data center building 102. Work to do it. In some aspects, the power delivered directly to electronic devices is the main power source, e.g., a utility power grid, on-site power from generators, solar or wind power sources, hydro power sources, nuclear power It is direct current (DC) power from sources or other types of power sources. In some aspects, the main power source provides alternating current (AC) power that is converted to DC power prior to being delivered to electronic devices. In some aspects, one or more transformers connect the main power source from medium voltage power (e.g., 13.5 kVAC, 4160 VAC) to low voltage power (e.g., 460 VAC, 230 VAC), and then the electronic device. Converts to DC power (eg 750 VDC, 1500 VDC) before being delivered to the field. DC power is delivered to electronic devices by conductors that are at least partially exposed to the human-occupied workspace 104 within the data center building 102.

In certain discussions herein, a distinction may be made between utility or grid power and local or on-site power. Unless otherwise stated, utility or grid power is generally the power provided by the utility to multiple customers, the generation and control of which is handled by the utility. This utility power can also be generated at long distances from data center utilities. Local or on-site power is mostly used only by facilities at the data center site and is under the control of the operator of the data center site compared to the wider utility company. On-site power is typically co-located with a data center farm (e.g., a large bank of engine-driven generators, fuel cells or solar cells), or near a facility with a power connection that is essentially dedicated to the facility (For example, a data center contracts to purchase a certain amount of power from a nearby wind generator, and the power is connected directly to the data center site through the farm rather than through the typical utility electricity grid). have.

As shown in FIG. 1A, a number of data center racks 106 are arranged in a human-occupied workspace 104 of a data center building 102. In some aspects, the racks 106 physically by providing structure for the devices to be deployed, and by providing power to the devices (e.g., via a rectifier, transformer, or both) from a main power source. Electrically, it supports electronic devices. In general, each illustrated rack 106 (also referred to as a “server rack”) may be one of a number of server racks within the data center building 102, and the data center building 102 is a variety of rack-mounted computers. It may include a server farm containing systems or a co-location facility. Each server rack 106 may define a number of slots arranged in an orderly and repeating manner within the server rack 106, each slot being a corresponding server rack sub-assembly 134 (Fig. 1c and 1d) is a space in a rack that can be placed and removed. For example, the server rack sub-assembly may be supported on rails that protrude from opposite sides of the rack 106 and may define the location of the slots. Also, although multiple server rack sub-assemblies 134 are illustrated to be mounted within rack 106, there may be only a single server rack sub-assembly.

The slots and server rack sub-assemblies 134 may be oriented in the illustrated horizontal arrangement (relative to gravity) as shown in FIGS. 1C and 1D. Alternatively, the slots and server rack sub-assemblies 134 can be oriented vertically (relative to gravity). When the slots are oriented horizontally, they can be stacked vertically on the rack 106, and when the slots are oriented vertically, they can be stacked horizontally on the rack 106.

For example, a server rack 106 as part of a larger data center may provide data processing and storage capacity. In operation, a data center may be connected to a network and may receive and respond to various requests from the network to retrieve, process, and/or store data. In operation, for example, the server rack 106 is typically networked with user interfaces created by web browser applications of users requesting services provided by applications running on computers in the data center. It facilitates the communication of information through. For example, the server rack 106 may serve or help present to a user who is using a web browser to access web sites on the Internet or the World Wide Web.

The server rack sub-assembly 134 may be one of various structures that can be mounted in a server rack. For example, in some implementations, the server rack sub-assembly 134 may be a “tray” or tray assembly that may be slidably inserted into the server rack 106. The term "tray" is not limited to any particular arrangement, but instead applies to the motherboard or other relatively flat structures attached to the motherboard to support the motherboard in the position of the rack structure. In some implementations, the server rack sub-assembly 134 can be a server chassis or server container (eg, server box). In some implementations, the server rack sub-assembly 134 can be a hard drive cage.

Each server rack sub-assembly 134 includes a frame or cage, a printed circuit board, eg, a motherboard supported on the frame, and one or more electronic devices 136, eg, a printed circuit board It may include a processor or memory mounted thereon. Electronic devices 136 may include, for example, processors, memories, hard drives, network switches or other IT components. Other accessories, e.g., cooling devices, fans, uninterruptible power supplies (UPS) (e.g., battery modules) can be mounted on the server rack sub-assembly 134 (or otherwise rack 106). have.

1A and 1B, one or more rows 108 of data center racks 106 are arranged in data center building 102. In general, as illustrated in FIGS. 1A and 1B, multiple DC conductor assemblies 114 extend through the human-occupied workspace 104 in parallel (in this example) to rows 108. In these examples, DC conductor assemblies 114 extend in parallel to rows 108 of server racks 106, with each row 108 positioned near or adjacent to front surface 111 of racks 106. Each DC conductor assembly 114. Each DC conductor assembly 114 is at least one live conductor that delivers DC power from a main DC power branch 116 that is electrically coupled to a main power source (e.g., via one or more transformers and rectifiers). Includes.

As further shown in FIGS. 1A and 1B, multiple ground conductors 118 also extend through the human-occupied workspace 104 in parallel (in this example) in rows 108 do. In these examples, ground conductors 118 extend in parallel to rows 108 of server racks 106, with each row 108 carrying a respective ground conductor 118 located near the racks 106. Have. Each ground conductor 118 provides a “earth” or low impedance path to ground for the DC power delivered by the DC conductor assemblies 114.

Specifically with respect to FIG. 1A, the data center cooling system includes cooling units 112 located in warm air passages 110 between adjacent rows 108 of server racks 106. In general, each cooling unit 112 is shown here as one or more cooling coils (e.g., based on water, liquid or refrigerant) and six fans mounted on the top ends of the cooling units 112. Includes one or more fans. In this example, the cooling units 112 are located between adjacent rows 108 of server racks 106, ie in the warm air passage 110. In operation, the cooling units 112 circulate a cooling airflow 109 through the front surfaces 111 of the racks 106 (e.g., open to the human-occupied workspace 104). The cooling airflow 109 receives heat from the electronic devices 136 in the racks 106 and warms the airflow 109 with a heated airflow 107 entering the warm air passage 110. The heated airflow 107 is sucked into the cooling units 112 (e.g., by fans) and through one or more cooling coils (e.g., cooled liquid, condenser water, refrigerant, or an electric cooler, e.g. For example, it is cooled by the flow of a Peltier cooler. The cooled airflow is circulated (eg, by fans) back to the human-occupied workspace 104 adjacent the fronts 111 of the racks 106.

In some aspects, the cooling units 112 may include a cooler plant, one or more evaporative cooling units (eg, cooling towers), one or more condensing units (eg, in the case of direct expansion cooling), It may be fluidly coupled to a cooling liquid source such as a natural cooling liquid source (eg, lake, sea, river or other natural body of water), or a combination thereof. In some aspects, the cooling units 112 are fluidly coupled to one or more condensing units (eg, commonly known as “CRAC” units) located outside the data center building 102. Refrigerant-based (DX) cooling units.

1A shows the cooling units 112 as floor-mounted (eg, supported on the data center floor 132 shown in FIGS. 1C and 1D ), but the cooling units 112 The silver may be ceiling mounted or otherwise suspended on a finished floor (eg, a slab, raised floor or other). As shown in FIG. 1A, a specific cooling unit 112 may be positioned to cool a specific number of racks 106 in one or more rows 108. In some aspects, the cooling units 112 may be designed or located between the rows 108 for redundant operation, for example, so that the cooling units 112 adjacent to the specific unit 112 may be If 112 fails, it can have sufficient cooling capacity (e.g., airflow, coil size).

[00111] Specifically with respect to FIG. 1B, an alternative data center cooling system includes cooling units 120 located at the ends of the cooling passages 113 and between the rows 108 of the racks 106. . In general, each cooling unit 120 has one or more cooling coils (e.g., based on water, liquid or refrigerant) and one or more fans (e.g., cooling airflow 119) below the cooling passages 113. Mounted to circulate in the longitudinal direction of the furnace). In this example, the cooling units 120 are located between adjacent rows 108 of server racks 106 so that the cooling airflow 11 is below the aisles 113 and the open fronts of the racks 106 Go through (111). The cooling airflow 119 receives heat from the electronic devices 136 in the racks 106 and warms up with a heated airflow 121 that circulates the airflow 119 back to the return airflow inlet of the units 120. do. The heated airflow 121 is sucked into the cooling units 120 (e.g., by fans) and through one or more cooling coils (e.g., cooled liquid, condenser water, refrigerant, or an electric cooler, e.g. For example, it is cooled by the flow of a Peltier cooler. The cooled airflow is circulated (eg, by fans) back to the human-occupied workspace 104 adjacent to the fronts 111 of the racks 106 in the aisles 113.

[00112] In some aspects, the cooling units 120 may include a cooler plant, one or more evaporative cooling units (eg, cooling towers), one or more condensing units (eg, in the case of direct expansion cooling), It may be fluidly coupled to a cooling liquid source such as a natural cooling liquid source (eg, lake, sea, river or other natural body of water), or a combination thereof. In some aspects, the cooling units 120 are standalone fluidly coupled to one or more condensing units (eg, commonly known as “CRAC” units) located outside the data center building 102. Refrigerant-based (DX) cooling units.

1B shows the cooling units 120 as floor-mounted (eg, supported on the data center floor 132 shown in FIGS. 1C and 1D ), but the cooling units 120 The silver may be ceiling mounted or otherwise suspended on a finished floor (eg, a slab, raised floor or other). As shown in FIG. 1B, a specific cooling unit 120 may be positioned to cool a specific number of racks 106 in adjacent rows 108. In some aspects, although not shown, additional cooling units 120 are located on opposite ends of passages 113 such as those shown in FIG. 1B, for example, for redundancy or additional cooling capacity. Can exist. For example, for cooling units 120 mounted at each end of each passage 113, each particular cooling unit 120 is approximately half of the racks 106 in two adjacent rows (i.e. That particular unit 120 may be responsible for cooling the closest halves). However, if the cooling unit 120 at one end fails, the cooling unit 120 at the other end of the same passage 113 has sufficient capacity to cool all of the racks 106 in two adjacent rows 108 (e.g. For example, airflow and coil capacity).

Referring to FIG. 1C, these drawings illustrate a side view of an exemplary implementation of the data center power system 100 shown in either FIG. 1A or 1B. In the implementation of the system 100 shown in FIG. 1C, the DC conductor assembly 114 is such that the DC conductor assembly 114 is suspended above the top of the rows 108 of the racks 106 (e.g., a data center building (102) is supported by a ceiling or other overhead structure. In this example, DC conductor assembly 114 may form a catenary power conductor to which electronic devices 136 in racks 106 are electrically connected. As a catenary power system, the DC conductor assembly 114 is at least partially covered with a shroud 126 (or other non-conductive barrier) within a human-occupied workspace 104 and a hanger 128 Stiff (e.g., bus bar) or semi-rigid (e.g., a bus bar) as shown in FIG. 1C with a conductor surface 124 suspended (e.g., from a ceiling or other structure on tops of racks 106) by For example, a cable) may be a conductor.

[00115] In this example, the conductor surface 124 delivers electricity (eg, medium or low voltage) to the racks 106 when powered by a main power source (eg, DC power). It can be a live conductor. For example, in some aspects, the conductor surface 124 can deliver DC power (eg, 750 VDC, 1000 VDC). In other aspects, conductor surface 124 can carry medium voltage DC power (e.g., a voltage below 1000 VDC), which is a low voltage power in racks 106 to serve electronic devices 136. Can be further converted to

As shown in the example of FIG. 1C, each rack 106 (or at least a portion of the racks 106 in a particular row 108) is an electrical connector mounted to the rack(s) 106 ( It can be electrically coupled to the conductor surface 124 via 122 and can be electrically coupled to the electronic devices 136 in the server tray sub-assemblies 134 via a connector 138. For example, the electrical connector 122 may be biased (e.g., spring loaded, hydraulically operated, electrically operated, or otherwise) to pressurize the connector 122 into electrical contact with the conductor surface 124. Method) may be a pantograph (or current collector) comprising one or more connected arms. In some aspects, the connected arms can be pressed into electrical contact with the conductor surface 124 by a human operator.

In some aspects, the pantograph may be pressed or released into electrical contact with the conductor surface 124 when the rack 106 is moved to an operative position. For example, when the rack 106 is placed within the human-occupied workspace 104 and in a particular row 108, the rack 106 is attached to or coupled to the floor 132, the stop 130 You can get in touch with. The stop 130 may be positioned as a linear member (e.g., angle steel or other) that extends within the human-occupiable workspace 104 to define the arrangements of the rows 108, for example. I can. Thus, the placement of each rack 106 simply moves the rack 106 (with electronic devices 136 already installed and electrically coupled to the electrical connector 122) relative to the stop 130 ( For example, including rolling) to ensure that the rack 106 is electrically coupled to the DC conductor assembly 114 and positioned correctly within the row 108 to be electrically coupled to the ground conductor 118. I can.

[00118] As shown in this example, the ground conductor 118 is embedded within the floor 132 (eg, a slab, raised floor, or other support surface) and in a human-occupied workspace 104 And a conductor having at least a portion of the exposed conductor. Thus, when moved to a position relative to the stop 130, the rack 106 is ground conductor 118 through conductor casters 140 (or other conductive member electrically connected to the rack 106). ) Can be electrically coupled. In alternative implementations, the ground conductor 118 may be mounted over the floor 132 such that the contact between the racks 106 (eg, a conductive member of the rack 106) is above the floor level.

In operation, each rack 106 may be moved to a location within a particular row 108. Rack 106 may already include electronic devices 136 mounted on server-tray sub-assemblies 134 in rack 106 and electrically connected to electrical connector 122. When the rack 106 is moved (e.g., rolled) into an operative position relative to the stop 130 and is electrically connected to the ground connector 118, for example, the electrical connector 122 has a conductor surface 124 ) Can be pressed or otherwise moved to be electrically connected. In some aspects, the electrical connector 122 is pressed to be electrically connected (e.g., automatically without human intervention or by human operator intervention) only when the rack 106 is grounded to the ground conductor 118. Can be. The power (eg, DC power) may then be delivered to the electronic devices 136 of the rack 106 through the conductor surface 124, through the electrical connector 122.

In alternative embodiments, the DC conductor assembly 114 may be located at a location other than above the rows 108 of the racks 106. While over racks 106 (and not within walking areas within human-occupied workspace 104) may be desirable, in some aspects, for example, DC conductor assembly 114 may be And can be mounted to extend through the warm air passages 110 at a height between the top of the racks 106 (or above the racks 106 in 110).

Referring to FIG. 1D, these drawings illustrate another side view of an exemplary implementation of the data center power system 100 shown in either FIG. 1A or 1B. In the implementation of the system 100 shown in FIG. 1D, the DC conductor assembly 114 is located near the floor of the rows 108 of the racks 106 and the DC conductor assembly 114 is located near the bottom of the data center building 102. It is mounted on the floor 132 of the data center building 102 so that it extends long through. In this example, DC conductor assembly 114 may form a rail power conductor to which electronic devices 136 in racks 106 are electrically connected. As a rail power system, the DC conductor assembly 114 may be a rigid structural member as a conductor exposed to the human-occupied workspace 104. Although not shown in FIG. 1D, at least a portion of the rail conductor 114 may be covered or shrouded so that only the top surface of the rail conductor 114 is exposed to the human-occupiable workspace 104.

[00122] In this example, the rail conductor 114 delivers electricity (eg, medium or low voltage) to the racks 106 when powered by a main power source (eg, DC power). It can be a live conductor. For example, in some aspects, rail conductor 114 can deliver DC power (eg, 750 VDC, 1000 VDC). In other aspects, rail conductor 114 can carry medium voltage DC power (e.g., a voltage below 1000 VDC), which is a low voltage power in racks 106 to serve electronic devices 136. Can be further converted to

As shown in the example of FIG. 1D, each rack 106 (or at least a portion of the racks 106 in a particular row 108) is the bottom portion of the rack(s) 106 in this example May be electrically coupled to the rail conductor 114 via an electrical connector 122 mounted to the field and electrically coupled to the electronic devices 136 in the server tray sub-assemblies 134 via the connector 138 Can be ringed. For example, in this example, the electrical connector 122 includes one or more connected arms that are biased (e.g., spring loaded or otherwise) to force the connector 122 into electrical contact with the rail conductor 114. It may be a current collector/conductor shoe including them.

[00124] In some aspects, the current collector/conductor shoe is in an operating position in which the rack 106 is (eg, prior to installation of the rail conductor 114 or between the stop 130 and the rail conductor 114). When moved to the rail conductor 114 may be pressed or released to be in electrical contact. In this example, the rail conductor 114 is shown extending adjacent the front surfaces 111 of the racks 106. In alternative implementations, the rail conductor 114 is a human-occupied workspace 104 adjacent to the rear surfaces of the racks 106 opposite the front surfaces 111, for example in the warm air passages 110. ) Can be expanded.

[00125] For example, when the rack 106 is placed within the human-occupiable workspace 104 and in a particular row 108, the rack 106 is attached to or coupled to the floor 132 stops. You can get in touch with (130). The stop 130 may be positioned as a linear member (e.g., angle steel or other) that extends within the human-occupiable workspace 104 to define the arrangements of the rows 108, for example. I can. Thus, the placement of each rack 106 simply moves the rack 106 (with electronic devices 136 already installed and electrically coupled to the electrical connector 122) relative to the stop 130 ( For example, including rolling), it is possible to ensure that the rack 106 is positioned accurately within the row 108 to be electrically coupled to the rail conductor 114 and electrically coupled to the ground conductor 118. have.

[00126] As shown in this example, the ground conductor 118 is embedded within the floor 132 (eg, a slab, raised floor, or other support surface) and in a human-occupied workspace 104 And a conductor having at least a portion of the exposed conductor. Thus, when moved to a position relative to the stop 130, the rack 106 is ground conductor 118 through conductor casters 140 (or other conductive member electrically connected to the rack 106). ) Can be electrically coupled.

In operation, each rack 106 may be moved to a location within a particular row 108. Rack 106 may already include electronic devices 136 mounted on server-tray sub-assemblies 134 in rack 106 and electrically connected to electrical connector 122. When the rack 106 is moved (e.g., rolled) to an operative position relative to the stop 130, for example, and is electrically connected to the ground connector 118, the electrical connector 122 becomes the rail conductor 114 ) Can be pressed or otherwise moved to be electrically connected. In some aspects, the electrical connector 122 is pressed to be electrically connected (e.g., automatically without human intervention or by human operator intervention) only when the rack 106 is grounded to the ground conductor 118. Can be. The power (eg, DC power) may then be delivered to the electronic devices 136 of the rack 106 through the rail conductor 114, through the electrical connector 122. Of course, in some aspects, the electrical connector 122 may be simultaneously or substantially simultaneously with multiple (e.g., two or more) rail conductors 114 (or conductor surfaces 124) (e.g., a few seconds or more). Within) can be pressed or otherwise moved to be electrically connected.

2A and 2B are schematic diagrams of a top view and a side view of another exemplary implementation of a data center power system 200, respectively. In general, DC power system 200 provides power to electronic devices, such as servers, processors, memory modules, networking devices, and other IT and data processing devices within data center building 202. Work to do it. In some aspects, the power delivered directly to the electronic devices is a main power source, e.g., a utility power grid, generators, solar or wind power sources, hydro power sources, nuclear power sources or other forms of power. It is direct current (DC) power from power sources. In some aspects, the main power source provides alternating current (AC) power that is inverted to DC power before being delivered to electronic devices. In some aspects, one or more transformers deliver the main power source from medium voltage power (e.g., 13.5 kVAC, 4160 VAC) to low voltage power (e.g., 460 VAC, 230 VAC), and to electronic devices. It converts to DC power (for example, 750 VDC, 1000 VDC) before it becomes available. DC power is delivered to electronic devices by conductors that are at least partially exposed to the human-occupied workspace 204 within the data center building 202.

[00129] As shown in FIG. 2A, a number of data center racks 208 are arranged in a human-occupied workspace 204 of a data center building 202. In some aspects, the racks 208 power the devices physically and from the main power source (e.g., via a rectifier or power converter, transformer, or both) by providing a structure for the devices to be deployed. Electrically, electronic devices are supported by providing. In general, each illustrated rack 208 (also referred to as a “server rack”) may be one of a number of server racks within the data center building 202, and the data center building 102 is a variety of rack mounted computers. It may include a server farm containing systems or a co-location facility. Each server rack 208 may define a number of slots arranged in an orderly and repeating manner within the server rack 208, each slot being a corresponding server rack sub-assembly 218 (Fig. 2b) is the space in the rack that can be placed and removed. For example, the server rack sub-assembly may be supported on rails that protrude from opposite sides of the rack 208 and may define the location of the slots. Also, although multiple server rack sub-assemblies 218 are illustrated to be mounted within rack 208, there may be only a single server rack sub-assembly.

The slots and server rack sub-assemblies 218 may be oriented in the illustrated horizontal arrangement (relative to gravity) as shown in FIG. 2B. Alternatively, the slots and server rack sub-assemblies 218 can be oriented vertically (relative to gravity). When the slots are oriented horizontally, they can be stacked vertically to the rack 208, and when the slots are oriented vertically, they can be stacked horizontally to the rack 208.

For example, a server rack 208 as part of a larger data center may provide data processing and storage capacity. In operation, a data center may be connected to a network and may receive and respond to various requests from the network to retrieve, process, and/or store data. In operation, for example, the server rack 208 is typically a network with user interfaces created by web browser applications of users requesting services provided by applications running on computers in the data center. It facilitates the communication of information through. For example, the server rack 208 may serve or help present to a user who is using a web browser to access web sites on the Internet or the World Wide Web.

The server rack sub-assembly 218 may be one of various structures that can be mounted in a server rack. For example, in some implementations, the server rack sub-assembly 218 may be a “tray” or tray assembly that may be slidably inserted into the server rack 208. The term "tray" is not limited to any particular arrangement, but instead applies to the motherboard or other relatively flat structures attached to the motherboard to support the motherboard in the position of the rack structure. In some implementations, the server rack sub-assembly 218 can be a server chassis or server container (eg, server box). In some implementations, the server rack sub-assembly 218 can be a hard drive cage.

Each server rack sub-assembly 218 includes a frame or cage, a printed circuit board, eg, a motherboard supported on the frame, and one or more electronic devices 220, eg, a printed circuit board It may include a processor or memory mounted thereon. Electronic devices 220 may include, for example, processors, memories, hard drives, network switches or other IT components. Other accessories, e.g., cooling devices, fans, uninterruptible power supplies (UPS) (e.g., battery modules) can be mounted in the server rack sub-assembly 218 (or otherwise rack 208). have.

2A and 2B, data center racks 106 are arranged within groups 206 of racks 208 in data center building 202. In general, as illustrated in FIGS. 2A and 2B, the DC conductor assembly 210 is located planarly in a human-occupiable workspace 204 over groups 206 of racks 208. As shown, each group 206 of racks 208 may be in a circular arrangement. In other aspects, groups 206 of racks 208 may be in a non-linear (eg, non-row) arrangement other than circular.

In these examples, the DC conductor assembly 210 includes a conductor surface 211 extending in a planar direction through a human-occupied workspace 204 over groups 206 of server racks 208 . The DC conductor assembly 210 includes a number of live conductors 212 and 214 cross-crossing the planar assembly 210 that delivers DC power from a main DC power source (e.g., via one or more transformers and rectifiers). ). For example, as shown in FIG. 2A, live conductors 212 and 214 extend in respective orthogonal directions across the human-occupiable workspace 204. In some aspects, the live conductors 212 and 214 deliver power (e.g., DC power) to the planar surface 211 of the assembly 210 so that the planar surface 211 becomes an electrically conductive surface. Electric energy can be applied.

As further shown in FIG. 2B, multiple ground conductors 226 also extend through a human-occupied workspace 204. In this example, ground conductors 226 extend through the floor 228 of the data center building 202 in a parallel arrangement. Each ground conductor 226 provides a “earth” or low impedance path to ground (or alternatively, a high impedance or rigidly grounded system) for the DC power delivered by the DC conductor assembly 210.

[00137] Although not shown in FIG. 2A, the data center building 202 may also include a data center cooling system. For example, the data center cooling system may be similar or identical to the systems 112 or 120 shown in FIGS. 1A and 1B, respectively. In other aspects, the data center cooling system may include a conventional overhead cooling system or a conventional underfloor cooling system using a cooling liquid, direct expansion refrigerant, evaporative cooling, or otherwise.

[00138] Referring to FIG. 2B, these drawings illustrate a side view of an exemplary implementation of the data center power system 200 shown in FIG. 2A. In the implementation of the system 200 shown in FIG. 2B, the DC conductor assembly 210 includes racks of the DC conductor assembly 210 (and the cross conductors 212 and 214 supplying power to the conductor surface 211). It is supported (eg, by a ceiling or other overhead structure of the data center building 102) to be suspended above the top of the groups 206 of 206.

[00139] In this example, when the conductor surface 211 is powered by a main power source (eg, DC power) through conductors 212 and 214, the racks 208 may have electricity (eg For example, it may be a live conductor surface carrying medium or low voltage). For example, in some aspects, the conductor surface 211 can carry DC power (eg, 750 VDC, or another voltage below 1000 VDC). In other aspects, the conductor surface 211 can carry DC voltage power, which can be further converted to other voltage power in the racks 208 to serve the electronic devices 218.

As shown in the example of FIG. 2B, each rack 208 (or at least a portion of the racks 208 in a specific group 206) is an electrical connector mounted to the rack(s) 208 ( It can be electrically coupled to the conductor surface 211 via 216 and can be electrically coupled to the electronic devices 220 in the server tray sub-assemblies 218 via a connector 222. For example, the electrical connector 216 includes one or more connected arms that are biased (e.g., spring loaded or otherwise) to force the connector 216 into electrical contact with the conductor surface 211. It could be a pantograph.

In some aspects, the pantograph may be pressed or released into electrical contact with the conductor surface 211 when the rack 208 is moved to an operative position. For example, racks 208 are placed in specific groups 206 within human-occupied workspaces 204. Although FIG. 2B does not show the rack step, e.g., the stop 130 shown in FIGS. 1C and 1D, a similar stop or guide device is used to accurately position the racks 208 within the groups 206. Can be used. In other aspects, an operator may move a particular rack 208 into a group 206 without a stop or guide. For example, racks 208 are human because conductor surface 211 can provide conductive surface 211 over all or most of the area of human-occupied workspace 204 over racks 208. -May not be required to be placed in certain locations within occupiable workspace 204.

[00142] As shown in this example, each grounding conductor 226 is embedded within a floor 228 (eg, a slab, raised floor, or other support surface) and is a human-occupied workspace 204 ) And a conductor having at least a portion of the conductor exposed. Thus, when moved into position, the rack 208 will be electrically coupled to the ground conductor 226 through conductor casters 224 (or other conductive member electrically connected to the rack 208). I can.

In operation, each rack 208 may be moved to a location within a particular group 206 (or even randomly, ungrouped locations of the human-occupiable workspace 204 ). Rack 208 may already include electronic devices 220 mounted on server-tray sub-assemblies 218 in rack 208 and electrically connected to electrical connector 216. When the rack 208 is moved (e.g., rolled) to an operative position, for example, when electrically connected to the ground connector 226, the electrical connector 216 is electrically connected to the conductor surface 211. It can be pressed or otherwise moved. In some aspects, only the electrical connector 216 is pressed to be electrically connected (e.g., automatically without human intervention or by human operator intervention) when the rack 208 is grounded to the ground conductor 226. Can be. The power (eg, DC power) may then be delivered to the electronic devices 220 of the rack 208 through the conductor surface 211, through the electrical connector 216.

3A is a schematic diagram of a direct current (DC) data center power module 300 (“DC power module 300”). In general, DC power module 300 is electrically coupled to multiple data center racks or server racks to multiple electrical paths to a data center main power source (or sources). Additionally, DC power module 300 provides switchable power sources (e.g., manually or automatically) for each server rack in the data center, so that any particular rack is one of the main power for redundancy. It can be ensured to be connected by multiple power source paths to the above sources. Thus, if a particular path from the main power source is electrically decoupled from the server racks (eg, through malfunction or otherwise), an extra path for power to be delivered to the server racks is available.

As shown in FIG. 3A, the DC power module 300 includes a housing 302 (eg, an enclosure, cabinet or other) that encloses a number of transfer switches 320. In some aspects, the DC power module 300 is a multiple (e.g., double) number of server racks in a particular group of server racks (e.g., row, part of a row, non-linear group, or others). It may include transfer switches 320 of. Each transfer switch 320 may be an automatic transfer switch or a manual transfer switch. For example, each transfer switch 320 may control the transfer of power (eg, DC power) from one power source path to a specific server rack.

[00146] As shown in FIG. 3A, each transfer switch 320 is coupled to the main (or first) DC power bus 304 via a main (or first) power connection 316 or 2 It is coupled to a secondary (or second) DC power bus 306 via a secondary (or second) power connection 318. In general, the main and secondary power buses 304 and 306 may include bus bars (eg, copper bus bars). The main DC power bus 304 is electrically coupled to the main converter 314 out of the housing 302 (and possibly out of the data center building). The secondary DC power bus 306 is electrically coupled to the secondary converter 312 out of the housing 302 (and possibly out of the data center building). In some aspects, the main and secondary DC power buses 304 and 306 are separated (eg, physically, electrically, or both) within the housing 302.

[00147] Each converter 312 and 314 generally receives power from one or more sources 308 and 310 of main power and delivers regulated power to each of the DC power buses 304 and 306 do. For example, in some aspects, the main power sources may be a utility grid power source 308 and a backup generator power source 310. Other sources of main power may be independent of utility grid power source 308 and generator power source 310, e.g., solar power source, wind power source, nuclear power source, natural gas or coal power source or other May include.

The regulated power delivered by converters 312 and 314 may be adjusted from AC power to DC power. For example, main sources of power 308 and 310 can generate AC power, and converters 312 and 314 can invert AC power to DC power for delivery to DC power module 300. . Additionally, main power sources can generate medium voltage power (eg, 13.5 kV) or deliver to converters 312 and 314. Converters 312 and 314 (also operating as transformers) can convert high voltage power to low voltage power (e.g., 200V to 5000V) or even DC power (e.g., less than 1000 VDC). . Thus, each of the converters 312 and 314 can be represented as a power converter (eg, from AC to DC), or a power converter and transformer.

[00149] As shown in this example, each pair of transfer switches 320 is a housing 302 to be electrically coupled to a specific server rack (out of tens, hundreds, or even thousands of server racks) in the data center. ) Is connected to a single electrical conductor 322 that extends to the outside. Thus, in this exemplary implementation of DC power module 300, each server rack is electrically coupled to and receives power (eg, DC power) via a specific pair of transfer switches 320.

In some aspects, DC power buses 304 and 306 allow DC power to be delivered from DC power module 300 to server racks even when one of the buses 304 or 306 is not functioning. It provides separate and maintainable bus bars that are guaranteed. For example, in some cases, one of the power buses 304 or 306 may not function due to maintenance or repair. In such cases, each of the power buses 304 and 306 may be separately maintainable, while the other (not maintained) of the buses 304 or 306 may deliver DC power to the transfer switches 320. have.

3B and 3C are schematic diagrams of example implementations of data centers 350 having racks 358 powered by one or more DC data center power modules 300 of FIG. 3A. For example, in the exemplary data center 350 of FIG. 3A that includes a data center building 352 defining a human-occupiable workspace 354, there are two DC power modules 300, Each module 300 serves a specifically defined portion of server racks 358 within data center 350. In this example, a particular portion includes racks 358 located in two adjacent rows 356. Thus, in this example, there is a unique and independent DC power module 300 through which power (eg, DC power) is provided to two rows 356 of racks 358.

Alternatively, in some example configurations, a single row 356 of racks 358 may be served (eg, receive DC power) from a particular DC power module 300 (eg, For example, a one-to-one ratio of rows 358 to DC power modules 300). In some other example configurations, a single row 356 of racks 358 may be served (eg, receive DC power) from two or more DC power modules 300 (eg, rows (358) to 1 to n ratio of DC power modules 300, where n>1). In some other example configurations, two or more rows 356 of racks 358 may be served (eg, receive DC power) from a single DC power module 300 (eg, rows ( 358) to the n to 1 ratio of DC power modules 300, where n>1). Of course, in some example implementations, multiple racks 358 may be grouped in a non-linear arrangement (e.g., such as a cluster or other arrangement), and one or more DC power modules 300 may include racks 358 Can serve a specific group or groups of.

[00153] Referring to Figure 3B, in the exemplary data center 350 of this figure, there are two DC power modules 300, each module 300 is one or more racks of several rows 356 Serve (358). In this example, one of the DC power modules 300 serves a number of racks 358 in each row 356 shown in this exemplary arrangement. For example, as shown, a portion 360 of each row 356 of racks 358 is served by a respective DC power module 300. Thus, in case of malfunction or other inability of the power (e.g., DC power) to be delivered from a particular DC power module 300, the power (and therefore operation) is lost for the entire row 356 of the racks 358. It does not become. In this arrangement, diversity of power delivery is achieved so that a single row (or nonlinear grouping) of server racks 358 is not disabled by the loss of a single DC power module 300.

4 shows a power-control system 406 using one or more data center power connectors 412 to transfer power and data between one or more server racks 410 and a power-control system 406 A schematic diagram of a containing data center 400. For example, based on the transmitted data, the power-control system 406 can generate one or more virtual models of the data center 400. In some aspects, the virtual models may include, among other tasks, an inventory of server racks 410 and one or more electronic devices supported in racks 410; Geographically identifying the server racks 410 and one or more electronic devices supported in the racks 410 within the human-occupied workspace 404 of the data center 400; Identifying the server racks 410 and one or more electronic devices supported in the racks 410 within the network topology 404 of the data center 400; Identifying the server racks 410 and one or more electronic devices supported in the racks 410 within the cooling topology of the data center 400; And increased efficiency when performing tasks such as identifying server racks 410 and one or more electronic devices supported in racks 410 within the power topology of data center 400 (e.g., cost, time, Manpower and others).

[00155] The schematic diagram of the data center 400 of FIG. 4 is simplified in that specific structures such as a power transfer structure, a cooling structure, and a networking structure are not shown. Thus, an exemplary implementation of the data center 400 of FIG. 4 may include, for example, the DC power systems shown in any one of FIGS. 1A-1D, 2A and 2B, and 3A-3C, as well as a server. A DC power delivery system for delivering DC power to electronic devices in racks, a cooling system for cooling electronic devices in electronic devices in server racks and electronic devices as appropriate to one or more networks, for example a local area network (" LAN"), wide area network ("WAN"), peer-to-peer networks (with ad hoc or static members), grid computing infrastructures and other power including networking systems communicatively coupling to the Internet, It can be implemented with cooling or networking structures. The exemplary power-control system 406 is electrically coupled (eg, via one or more rectifiers and transformers) to the main power source 408.

As shown, the power-control system 406 is communicatively and electrically coupled to server racks 410 through power connectors 412. In some aspects, the power-power-control system 406 may be a controller-based power delivery system, eg, a micro-processor based power delivery system that delivers DC power to server racks 410. For example, the power connectors 406 may be a controller-based data center power module 300. Power connectors 406 may also be at least part of data center power system 100 or data center power system 200. Thus, the power connectors 412 may, in some aspects, be used to connect the server racks 410 to one or more DC power modules 300, DC power conductors 114 or DC conductor assembly 210. I can.

[00157] Each power connector 412 is AC or DC power to power electronic devices (eg, processors, memory, networking gear, cooling devices, eg, fans and others). Can be delivered to one or more server racks 410. Each power connector 412 may also transmit data between server racks and control system 406 (eg, between electronic devices). For example, in some aspects, each power connector 412 includes a power line communication (PLC) conductor that simultaneously transmits data and AC or DC power. PLC conductors can be broadband or narrowband PLC conductors and can carry DC power as well as digital information. For example, the PLC conductor may be one of a number of standard DC PLC conductors, for example a CAN-bus, a LIN-bus over a power line (DC-LIN), DC-BUS and LonWorks. As a further example, the power connectors 412 as DC PLC conductors may utilize the SAE J1772 standard for PLC.

As previously described, each power connector 412 may include a single conductor that transmits both power and data. Alternatively, each power connector 412 includes two conductors coupled within a single sheath or conduit. For example, one of the conductors can transmit data while the other of the conductors can transmit power.

[00159] In operation, following electrically connecting the power-control system 406 to the server racks 410 with the power connectors 412, the DC power is a power connector to supply power to the electronic devices. It is delivered to the server racks 410 through the s 412. When communicatively and electrically coupling the power connectors 406 to the server racks 410, the power connectors 406 are the racks 410 and the power connectors 406 to create one or more virtual models. Data transmission between can be initiated. For example, when connected, power connectors 406 may poll (or otherwise request information from) server racks 412 via power connectors 412. The requested information may be, for example, "identity" information for each of the server racks 410 and the electronic devices supported on the server racks, for example, each electronic device in each individual server rack 410 (e.g. For example, the name, model or serial number, server rack name or designation, and other identification information) of the processor, memory, switch or other. These requests or polls may be performed periodically, only once after installation of the server rack in the data center 400, in each case of the movement or replacement of an electronic device in the server rack or even the server rack, or in another way. .

Once the identification information is communicated to the power connectors 406, the power connectors 406 may build or complete one or more virtual models of the data center 400. One exemplary virtual model may be a geographic topology model. For example, power connectors 406 may transfer identification information for each electronic device within each server rack 410 and even each server rack 410 to the human-occupied workspace of the data center building 402. It can be associated with a specific geographic location within 404. In some aspects, the power connectors 406 may use GPS or other geographic association technology to associate identification information with a specific geographic location. In other aspects, prior to placement of the server racks 410, the power connectors 406 include the suggested locations of the server racks 410, but do not associate the proposed locations with the particular server racks 410. It may contain or store a “blank” geographic topology of data center 400 that also does not contain identification information (eg, in rows, groups or others). Thus, the received identification information can be entered into the proposed locations to generate a geographic topology virtual model. In some aspects, the generated geographic model may be used such that specific server racks 410 and specific locations of individual components within server racks 410 are known. Thus, for example, if a component fails or malfunctions, it can be efficiently located within data center 400 (which may contain hundreds, thousands or tens of thousands of such components).

[00161] Another example virtual model may be a networking topology model. For example, prior to deployment of server racks 410, power connectors 406 may contain or store a “blank” networking topology of data center 400 that includes the proposed networking domains of server racks 410. have. Each networking domain may define a number of server racks 410 (and electronic devices supported on such racks 410) communicatively coupled on a common network within data center 400. A “blank” networking topology will not include any identifying information that associates particular server racks 410 with proposed network domains (eg, defined by rows of racks, groups of racks or others). I can. Thus, the received identification information can be entered into the proposed domains to generate a networking topology virtual model. In some aspects, the generated networking model may be used such that specific server racks 410 and specific network domains in which individual components within server racks 410 are contained may be known. Thus, for example, if a network domain fails or malfunctions, certain racks 410 within the failed domain or electronic devices within such racks 410 may be rerouted to another domain, for example.

Another example virtual model may be a cooling topology model. For example, prior to deployment of the server racks 410, the power connectors 406 may contain or store a “blank” cooling topology of the data center 400 including the proposed cooling domains of the server racks 410. have. Each cooling domain is a specific cooling unit (e.g., fan coil unit, CRA unit, cooler, evaporative cooling unit, e.g., cooling tower, fan, pump, heat pump, condensing unit or others) within the data center 400. A number of server racks 410 (and electronic devices supported on these racks 410) may be defined by the). The “blank” cooling topology will not include any identifying information that associates particular server racks 410 with proposed cooling domains (eg, defined by rows of racks, groups of racks or others). I can. Thus, the received identification information can be entered into the proposed domains to generate a cooling topology virtual model. In some aspects, the generated cooling model may be used such that specific server racks 410 and specific cooling domains in which the individual components within server racks 410 are included may be known. Thus, for example, if a cooling domain fails or malfunctions (e.g., through failure of one or more cooling units for that domain), then certain racks 410 in the failed domain or electronic devices in such racks 410 For example, it may be moved to another cooling domain or the other cooling domain may be adjusted (eg, with increased airflow or other cooling fluid flow) to cool the racks 410 in the failed domain. Additionally, in some aspects, a cooling topology can be used to determine failure of one or more cooling units within the cooling domain. For example, a sensed parameter (e.g., temperature or something else) of a particular server rack 410, e.g., the temperature of an electronic device within a particular rack 410, present in a particular rack 410 (e.g. For example, based on the temperature or other parameter of the airflow (to the warm air aisle adjacent to the rack 410), the power connectors 406 provide one or more cooling to serve the cooling domain to which the specific server rack 410 is located. It can be determined that the units are failing or otherwise not functioning. Thus, maintenance or replacement of the failed cooling unit(s) can be performed.

[00163] Another example virtual model may be a power topology model. For example, prior to deployment of server racks 410, power connectors 406 may contain or store a “blank” power topology of data center 400 that includes the proposed power domains of server racks 410. have. Each power domain may define a number of server racks 410 (and electronic devices supported on such racks 410) that are electrically coupled on a common power domain within data center 400. In some aspects, the power domain is a specific power conductor in the data center power system, a specific DC power module in the data center power system, a specific transformer in the data center power system, a specific rectifier in the data center power system, a specific power in the data center power system. It may be defined as a group of one or more server racks 410, electronic devices, or other power consuming devices (e.g., cooling or lighting) that receive power from a source or combination of these components of a data center power system. . The “blank” power topology may not include any identifying information associating certain server racks 410 with the proposed power domains. Thus, the received identification information can be input into the proposed domains to create a power topology virtual model and link the deployed server racks 410 (and associated electronic devices) with at least one of the proposed power domains. have. In some aspects, the generated power model may be used such that specific server racks 410 and specific power domains in which the individual components within server racks 410 are included may be known. Thus, for example, if a power domain (e.g., a power component that is part of this domain) fails or malfunctions, certain racks 410 within the failed domain or electronic devices within such racks 410, for example, It is possible to receive rerouted power from another power domain.

[00164] One or more of the example virtual models are updated periodically (eg, occasionally, in predefined time periods, dynamically or otherwise in real time) based on the updated identification information Can be. For example, power connectors 406 may be initiated or polled for identification information to be transmitted between racks 410 and power connectors 406. This can occur periodically (eg, once a week, once a month, once a day or in some other way). This may also occur dynamically, eg, initiated by a data center operator, when one or more electronic devices or server racks are adjusted (eg, physically or virtually) or otherwise. Identity information for each of the server racks 410 and electronic devices supported on the server racks may be updated with subsequent data transmissions (eg, to the initial startup state of the server racks 410 or the data center). If the identity information is identified as being updated, the generated virtual model(s) may be updated with new identity information.

[00165] Creating the described virtual models may provide several advantages over conventional techniques for locating server racks and/or electronic devices within a data center. For example, prior techniques may include allowing a human operator to visually inspect and record individual locations of each server rack (of tens, hundreds or thousands of racks within a data center). This visual inspection and recording has many errors and imperfections, which are reduced or eliminated with virtual models created according to the present disclosure. For example, the generated virtual models may be more accurate because the identification and recording of server rack-specific and electronic device-specific identification information is performed automatically by the power-control system 406. In addition, such identification and recording of server rack-specific and electronic device-specific identification information by power-control system 406 can be performed at any time as well as more easily than conventional techniques, for example server racks or The electronic device can be initiated and completed multiple times on each instance of a move, removal or replacement. Also, replacement of certain data center infrastructure equipment (eg, cooling units, power delivery components, networking components) may not affect the virtual models created. In addition, the described virtual models may provide a dynamic or real-time state of cooling requirements, power requirements, server racks and/or electronic devices for asset diagnosis and management, as well as a dynamic mapping of the data center floor.

5 is a schematic diagram of an exemplary controller 500 (or control system) for a data center power system, such as a power-control system 406. For example, the controller 500 may be communicatively coupled with a data center power system including one or more power connectors, such as power connectors 412, to provide power to one or more racks supporting electronic devices. Or it could be part of it.

[00167] The controller 500 is intended to include various types of digital computers, such as printed circuit boards (PCBs), processors, digital circuitry or others that are part of a vehicle. Additionally, the system may include portable storage media such as Universal Serial Bus (USB) flash drives. For example, USB flash drives can store operating systems and other applications. USB flash drives may include input/output components such as a wireless transmitter or a USB connector that may be inserted into a USB port of another computing device.

The controller 500 includes a processor 510, a memory 520, a storage device 530, and an input/output device 540. Each of the components 510, 520, 530 and 540 are interconnected using a system bus 550. Processor 510 may process instructions for execution within controller 500. The processor can be designed using any of a number of architectures. For example, the processor 510 may be a Complex Instruction Set Computers (CISC) processor, a Reduced Instruction Set Computer (RISC) processor, or a Minimal Instruction Set Computer (MISC) processor.

[00169] In one implementation, the processor 510 is a single-threaded processor. In another implementation, processor 510 is a multi-threaded processor. Processor 510 may process instructions stored in memory 520 or on storage device 530 to display graphical information for a user interface on input/output device 540.

The memory 520 stores information in the controller 500. In one implementation, memory 520 is a computer executable medium. In one implementation, memory 520 is a volatile memory unit. In another implementation, memory 520 is a non-volatile memory unit.

The storage device 530 may provide mass storage for the controller 500. In one implementation, storage device 530 is a computer executable medium. In various different implementations, the storage device 530 can be a floppy disk device, a hard disk device, an optical disk device, or a tape device.

The input/output device 540 provides input/output operations for the controller 500. In one implementation, input/output device 540 includes a keyboard and/or pointing device. In another implementation, the input/output device 540 includes a display unit for displaying graphical user interfaces.

[00173] The features described may be implemented in digital electronic circuitry, or computer hardware, firmware, software, or combinations thereof. The apparatus may be implemented as a computer program product tangibly embodied in an information carrier, for example as a machine-readable storage device for execution by a programmable processor; The method steps may be performed by a programmable processor executing a program of instructions to perform the functions of the described implementations by operating on input data and generating output. The described features advantageously comprise a data storage system, a programming comprising at least one programmable processor coupled to receive data and instructions from and transmit data and instructions from at least one input device and at least one output device. It may be implemented as one or more computer programs executable on a capable system. A computer program is a set of instructions that can be used directly or indirectly on a computer to perform a specific activity or cause a specific result. Computer programs may be written in any form of programming language, including compiled or interpreted languages, and in any form including stand-alone programs or modules, components, subroutines, or other units suitable for use in a computing environment. Can be placed.

Processors suitable for execution of a program of instructions include, for example, both general and special purpose microprocessors, and one of a unique processor or a number of processors of a computer of any kind. In general, the processor will receive instructions and data from read-only memory or random access memory or both. Essential elements of a computer are a processor for executing instructions and one or more memories for storing instructions and data. In general, the computer will also include, or will be operatively coupled to communicate with one or more mass storage devices for storing data files; Such devices include magnetic disks, for example internal hard disks and removable disks; Magneto-optical disks; And optical disks. Storage devices suitable for tangibly implementing computer program instructions and data include, for example, semiconductor memory devices such as EPROM, EEPROM and flash memory devices; Magnetic disks, such as internal hard disks and removable disks; Magneto-optical disks; And all types of nonvolatile memory including CD-ROM and DVD-ROM disks. The processor and memory may be supplemented by or integrated into an application-specific integrated circuit (ASIC).

[00175] In order to provide interaction with a user, features include a display device such as a cathode ray tube (CRT) or a liquid crystal display (LCD) monitor for displaying information to the user and a keyboard and pointing device, for example, It may be implemented on a computer including a mouse or trackball that allows a user to provide input to the computer. Additionally, these activities can be implemented through touchscreen flat panel displays and other suitable mechanisms.

Features include a backend component, eg, a data server, or a middleware component, eg, an application server or an Internet server, or a frontend component, eg, a graphical user interface or Internet It can be implemented as a control system including a client computer with a browser or any combination thereof. The components of the system may be connected by any form or medium of digital data communication, for example a communication network. Examples of communication networks include a local area network (“LAN”), a wide area network (“WAN”), peer-to-peer networks (with ad hoc or static members), grid computing infrastructures, and the Internet.

[00177] While this specification includes many specific implementation details, these are not to be construed as limitations on the scope of any inventions or as limitations on what may be claimed, but rather a description of features that are specific to specific implementations of specific inventions Should be interpreted as. Certain features described herein in the context of separate implementations may also be implemented in combination in a single implementation. Conversely, the various features described in the context of a single implementation may also be implemented separately or in any suitable sub-combination in multiple implementations. In addition, although features are described above as acting in particular combinations and even initially claimed as such, in some cases, one or more features from the claimed combination may be removed from the combination, and the claimed combination is a sub-combination. Or it may involve a change in sub-binding.

[00178] Similarly, although the operations are shown in the figures in a specific order, this requires that such operations are performed in the specific order shown or in a sequential order, or that all illustrated operations are performed in order to achieve desirable results. It should not be understood as doing. In certain circumstances, multitasking and parallel processing can be advantageous. Further, the separation of the various system components in the implementations described above should not be understood as requiring such separation in all implementations, and the program components and systems described are generally integrated together in a single software product or It is to be understood that it can be packaged as a software product.

[00179] A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the present disclosure. For example, example operations, methods, or processes described herein may include more or fewer steps than those described. Additionally, steps of these exemplary operations, methods or processes may be performed in succession differently than described or illustrated in the figures. Accordingly, other implementations are within the scope of the following claims.

Claims (67)

As a data center power system,
An electrical power conductor comprising a live conductor surface and configured to deliver direct current (DC) power from a power source through a human-occupied workspace of a data center, wherein at least a portion of the live conductor surface comprises the A rail exposed to a human-occupied workspace and the live conductor surface configured to be mounted to a floor of the data center;
A grounded conductor located in the human-occupied workspace away from the power conductor;
A first electrical connector configured to be mounted in a data center rack supporting a plurality of electronic devices, the first electrical connector being movable to electrically contact the live conductor surface of the power conductor, the first electrical connector The electrical connector is configured to be mounted on a bottom portion of the data center rack; And
A second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor. delete delete delete The method of claim 1,
The grounded conductor is embeddable within the floor of the data center. delete delete delete The method of claim 1,
The first electrical connector is biased to move away from the data center rack to electrically contact the live conductor surface of the power conductor. The method of claim 9,
Wherein the first electrical connector comprises a pantograph. The method of claim 1,
The power conductor comprises a first power conductor,
The system further comprises a second power conductor configured to deliver DC power from the power source through the human-occupiable workspace of the data center, the second power conductor comprising a live conductor surface,
The first electrical connector is movable to electrically contact the live conductor surface of the second power conductor. The method of claim 11,
Wherein the first electrical connector is movable to simultaneously electrically contact live conductor surfaces of the first power conductor and the second power conductor. As a method of delivering direct current (DC) power to a data center rack,
Providing DC power from a data center power source to a power conductor, the power conductor extending through the human-occupied workspace of the data center;
Moving the data center rack to a location within the human-occupied workspace near the power conductor;
Moving a first electrical connector mounted on the data center rack into electrical contact with a live conductor surface of the power conductor based on the data center rack being in the position;
Based on the data center rack being in the location, to complete a power circuit, a grounded conductor located within the human-occupied workspace away from the power conductor with a second electrical conductor located on the rack. Making electrical contact; And
Based on the completed power circuit, providing DC power from the power conductor to a plurality of electronic devices supported by the data center rack,
The power conductor comprises a rail conductor mounted on the floor of the data center, and
The step of moving the first electrical connector comprises electrically contacting a rail conductor exposed to the human-occupiable workspace below the data center rack and extending through the human-occupiable workspace. Moving the electrical connector away from the bottom portion of the data center rack,
How to deliver DC power to data center racks. delete delete The method of claim 13,
Wherein the grounded conductor is embedded within the floor of the data center. delete delete delete The method of claim 13,
The step of moving the first electrical connector comprises deflecting the first electrical connector away from the data center rack to electrically contact the live conductor surface of the power conductor using a deflection device. How to deliver DC power to data center racks. The method of claim 20,
The deflection device comprises a pantograph. A method of delivering DC power to a data center rack. The method of claim 13,
The power conductor comprises a first power conductor,
The method is:
Providing DC power from the data center power source to a second power conductor, the second power conductor extending through the human-occupied workspace of the data center; And
Based on the data center rack being in the location, moving the first electrical connector to electrically contact a live conductor surface of at least one of the first power conductor or the second power conductor. Including, a method of delivering DC power to a data center rack. As a data center power system,
An enclosure defining an inner volume;
A first direct current (DC) power bus mounted on the inner volume and extending outward from the enclosure to be electrically coupled to a main power source;
A second DC power bus mounted on the inner volume and extending outward from the enclosure to be electrically coupled to the main power source;
A plurality of transfer switches mounted on the inner volume, each transfer switch electrically coupled to one of the first DC power bus or the second DC power bus; And
A plurality of DC power conductors, each DC power conductor comprising: one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus. Electrically coupled to the containing pair of transfer switches; Each DC power conductor is configured to be electrically coupled to a data center rack supporting a plurality of electronic devices. The method of claim 23,
At least some of the plurality of transfer switches comprises an automatic transfer switch. The method of claim 23,
At least some of the plurality of transfer switches include a fused contact. The method of claim 23,
The main power source is electrically coupled to the first DC power bus and to the second DC power bus through a power converter. The method of claim 26,
The main power source comprises at least one of a utility grid power source or a backup power source. The method of claim 27,
Wherein the backup power source comprises at least one of a generator power source or a renewable power source. The method of claim 23,
The first DC power bus and the second DC power bus are separated from each other within the enclosure. As a method of delivering direct current (DC) power to a data center rack,
Providing DC power from the main power source to a first DC power bus mounted to the inner volume of the enclosure;
Providing DC power from the main power source to a second DC power bus mounted to the inner volume of the enclosure;
Feeding DC power from the first DC power bus to a plurality of first transfer switches mounted on the inner volume;
Feeding DC power from the second DC power bus to a second plurality of transfer switches excluding the first plurality of transfer switches mounted on the inner volume;
(i) DC power from one of the first plurality of transfer switches, or (ii) DC power from one of the second plurality of transfer switches, to a data center rack supporting a plurality of electronic devices. Supplying to the DC power conductor coupled to each other; And
Powering the plurality of electronic devices with the supplied DC power. The method of claim 30,
Wherein each of the plurality of transfer switches comprises an automatic transfer switch. The method of claim 30,
Each of the plurality of transfer switches includes a fuse contact. A method of delivering DC power to a data center rack. The method of claim 30,
The main power source includes alternating current (AC) power,
The method further comprises inverting the AC power into the DC power prior to providing DC power to the first DC power bus and the second DC power bus, delivering DC power to a data center rack. How to. The method of claim 30,
The method of delivering DC power to a data center rack, wherein the main power source comprises at least one of a utility grid power source or a backup power source. The method of claim 34,
Electrically coupling the first DC power bus and the second DC power bus to both the utility grid power source and the backup power source via a power converter. How to pass on. The method of claim 35,
Detecting a loss of main power from the utility power grid; And
Based on the detected loss, from providing DC power from the utility power grid to the first DC power bus and the second DC power bus, DC power from the backup power source is converted to the first DC power. The method of delivering DC power to a data center rack, further comprising switching to a bus and providing to the second DC power bus. The method of claim 30,
Electrically decoupling one of the first DC power bus or the second DC power bus from the main power source;
Performing maintenance on one of the first DC power bus or the second DC power bus; And
Simultaneously with performing the maintenance, the DC power from the other one of the first DC power bus or the second DC power bus through each of the first plurality of transfer switches or the second plurality of transfer switches is transferred to the DC. The method of delivering DC power to a data center rack, further comprising feeding the power conductor. As a data center power system,
A first direct current (DC) switchboard module; And
Including a first plurality of racks,
The first DC switchboard module:
Enclosure,
A first DC power bus mounted in the enclosure and extending outwardly from the enclosure to be electrically coupled to a main power source,
A second DC power bus mounted in the enclosure and extending outwardly from the enclosure to be electrically coupled to the main power source,
A plurality of transfer switches mounted in the enclosure, each transfer switch being electrically coupled to one of the first DC power bus or the second DC power bus, and
A plurality of DC power conductors, each DC power conductor comprising: one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus. Electrically coupled to a pair of transfer switches including,
Wherein the first plurality of racks includes a plurality of electronic devices, and each of at least some of the first plurality of racks is electrically coupled to a specific DC power conductor of the first DC switchboard module. The method of claim 38,
A second DC switchboard module; And
Further comprising a second plurality of racks,
The second DC switchboard module:
Enclosure;
A first DC power bus mounted to the enclosure and extending outwardly from the enclosure to be electrically coupled to a main power source;
A second DC power bus mounted to the enclosure and extending outwardly from the enclosure to be electrically coupled to the main power source;
A plurality of transfer switches mounted in the enclosure, each transfer switch electrically coupled to one of the first DC power bus or the second DC power bus; And
A plurality of DC power conductors, each DC power conductor comprising: one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus. Electrically coupled to the containing pair of transfer switches;
Wherein the second plurality of racks includes a plurality of electronic devices, and each of at least some of the second plurality of racks is electrically coupled to a specific DC power conductor of the second DC switchboard module. The method of claim 39,
Other portions of the second plurality of racks are electrically coupled to a specific DC power conductor of the first DC switchboard module, and other portions of the first plurality of racks are each of the second DC switchboard module. A data center power system that is electrically coupled to a specific DC power conductor. The method of claim 40,
A portion of the second plurality of racks and another portion of the second plurality of racks are located in separate rows of a plurality of rows of racks in the data center. The method of claim 40,
Wherein portions of the first plurality of racks and the second plurality of racks are located in a specific row of the plurality of rows of racks.

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