KR102220807B1 - Electrically Conductive Resin Composition and Display Apparatus Applying the Same - Google Patents

Abstract

The present invention relates to a conductive resin composition and a display device using the same.
One aspect of the present invention is a display panel, a display panel is installed and includes a frame having conductivity, the frame is made of a resin containing a polyester-based copolymer resin, a conductive resin composition containing carbon nanotubes (CNT) It provides a display device characterized by.
According to an aspect of the present invention, since it has electrical conductivity, electrostatic discharge can be prevented, and productivity can be improved by simplifying the manufacturing process. In addition, it can be used for forming a thin film due to the increase in formability, and can have a magnetic element function in case of fire by imparting flame retardancy.

Description

Electrically Conductive Resin Composition and Display Apparatus Applying the Same}

The present invention relates to a conductive resin composition and a display device using the same, and more particularly, to a conductive resin composition that can be molded so as to be used for an exterior material while having conductivity, and a display device using the same.

In general, a display device is a device that receives an image signal and displays an image, such as a television or a monitor.

As display devices become smaller, lighter, and multifunctional, the sensitivity of the system chip has increased. Accordingly, it is necessary to prevent electrostatic discharge (ESD), which is a phenomenon in which electric charges move between two objects. In the case of electrostatic discharge, the display device could not be operated normally due to damage to the internal components of the display device during assembly, production or use.

Conductive tape was attached to the frame to prevent electrostatic discharge, but in this case, since the conductive tape had to be attached after the assembly process, an additional process was required, resulting in lower productivity and additional cost.

In addition, in some cases, the frame was used as a metal material to impart electrical conductivity, but the weight of the display device was impossible due to the high specific gravity of the metal material.

An aspect of the present invention provides a conductive resin composition having electrical conductivity and easy molding, and a display device using the same.

One aspect of the present invention includes a display panel, a frame on which the display panel is installed and having conductivity, the frame is a resin containing a polyester-based copolymer resin, a conductive resin composition containing carbon nanotubes (CNT) It provides a display device characterized in that consisting of.

The polyester-based copolymer resin may be at least one of polyethylene terephthalate glycol (PETG) and polycyclohexylene dimethylene terephthalate glycol.

The resin may include a high-flow polycarbonate (PC) resin having a melt index of 60 to 70.

The resin may be composed of polycarbonate (PC) resin, polyethylene terephthalate glycol resin, rubber-modified vinyl-based graft copolymer resin, and styrene-acrylonitrile (SAN).

With respect to 100% by weight of the resin, the polyethylene terephthalate glycol resin may be 10 to 30% by weight.

With respect to 100% by weight of the resin, the acrylonitrile butadiene styrene resin may be 7 to 20% by weight.

The carbon nanotubes may be 1 to 3 parts by weight based on 100 parts by weight of the resin.

The conductive resin composition may further include glass fiber.

The glass fiber may be 15 to 30 parts by weight based on 100 parts by weight of the resin.

The conductive resin composition may further include a flame retardant.

The flame retardant may include at least one of bisphenol-A-bisdiphenyl phosphate (BDP) and red phosphorus.

The bisphenol bisdiphenyl phosphate may be 10 to 25 parts by weight based on 100 parts by weight of the resin.

The conductive resin composition may further include a wax.

The mixing weight ratio of the carbon nanotubes and the wax may be 4:1 to 12:1.

The conductive resin composition may further include an additive including at least one of carbon black, pigment, nanoclay, and antioxidant.

Another aspect of the present invention is polycarbonate, polyethylene terephthalate glycol, acrylonitrile butadiene styrene, 100 parts by weight of a four-component copolymer resin containing styrene acrylonitrile, 1 to 3 parts by weight of carbon nanotubes, 15 to 15 parts by weight of glass fibers 30 parts by weight;

It provides a conductive resin composition comprising a.

The polyethylene terephthalate glycol may be 10 to 30% by weight based on 100% by weight of the resin.

The acrylonitrile butadiene styrene may be 7 to 20% by weight based on 100% by weight of the resin.

The polycarbonate may include a high fluidity polycarbonate resin having a melt index of 60 to 70.

It may further include a flame retardant containing at least one of bisphenol bisdiphenyl phosphate and red phosphorus.

The bisphenol bisdiphenyl phosphate may be 10 to 25 parts by weight based on 100 parts by weight of the resin.

It may further include a wax.

An additive including at least one of carbon black, pigment, nanoclay, and antioxidant may be further included.

Another aspect of the present invention includes 100 parts by weight of a copolymer resin including polycarbonate, acrylonitrile butadiene styrene, and styrene acrylonitrile, 1 to 3 parts by weight of carbon nanotubes, and 15 to 30 parts by weight of glass fibers. It provides a characterized conductive resin composition.

It may further include a flame retardant containing at least one of bisphenol bisdiphenyl phosphate and red phosphorus.

It may further include a wax.

An additive including at least one of carbon black, pigment, nanoclay, and antioxidant may be further included.

Another aspect of the present invention includes a bottom chassis that supports the rear, a top chassis that is coupled to the front of the bottom chassis, a side case that is coupled to the side of the bottom chassis, and a rear case that is coupled to the rear of the bottom chassis, and , The bottom chassis, the top chassis, the side case, and at least a portion of the rear case provide an electronic device frame formed of a conductive resin composition.

The conductive resin composition is polycarbonate, acrylonitrile butadiene styrene, 100 parts by weight of a copolymer resin containing styrene acrylonitrile, 1 to 3 parts by weight of carbon nanotubes, 15 to 30 parts by weight of glass fiber, bisphenol bisdiphenyl phosphate It may contain a flame retardant containing at least one of and red phosphorus.

According to an aspect of the present invention, since it has electrical conductivity, electrostatic discharge can be prevented, and productivity can be improved by simplifying the manufacturing process.

In addition, it can be used for forming a thin film due to the increase in formability, and can have a magnetic element function in case of fire by imparting flame retardancy.

1 is a perspective view illustrating a front surface of a display device according to an exemplary embodiment of the present invention.
2 is an exploded view of a display unit according to an exemplary embodiment of the present invention.
3 is a view showing a manufacturing process of a conductive resin composition according to an embodiment of the present invention.
4 is a flow chart showing a manufacturing process of a conductive resin composition according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, a display device will be described as an example, but the present invention is not limited thereto, and the present invention is applicable to a frame of an electronic product requiring electrical conductivity and formability.

1 is a perspective view showing the front of a display device according to an exemplary embodiment of the present invention, and FIG. 2 is an exploded view illustrating a display unit according to an exemplary embodiment of the present invention.

1 and 2, the display device 1 includes a display panel 10 on which an image is displayed, and a frame 11 formed in a rectangular ring shape and in which the display panel 10 is installed. do. In addition, additionally, a support (not shown) may be included for maintaining the display panel 10 and the frame 11 stably standing on the floor.

As shown in FIG. 2, the display device 1 includes a display panel 10 on which an image is displayed, a bottom chassis 120 supporting the rear side of the display panel 10, and a front outer periphery of the display panel 10. It includes a top chassis 130 covering the side.

The display device 1 includes a side case 160 covering the sides of the display panel 10 and the bottom chassis 120 by forming four top, bottom, left, and right sides of the display device 1, and a rear side of the bottom chassis 120. A rear case 180 may be coupled to the display device 1 to form a rear surface of the display device 1 to cover the rear surface of the bottom chassis 120 and the printed circuit board 150 to be described later. The exterior of the display device 1 is formed by the side case 160 and the rear case 180.

The display panel 10 may be formed of an organic light emitting diode panel or a liquid crystal display panel.

A reinforcing member (not shown) for reinforcing the strength of the bottom chassis 120 is installed on the front side of the bottom chassis 120, and various prints to control the operation of the display device 1 on the rear side of the bottom chassis 120 Circuit boards 150 are installed.

The top chassis 130 is formed in a rectangular ring shape to support the outer periphery of the front surface of the display panel 10 so that the display panel 10 can be maintained in a state installed on the bottom chassis 120.

In addition, a heat dissipation sheet (not shown) formed of a material having a high heat transfer rate between the reinforcing member (not shown) and the display panel 10 so that heat generated from the display panel 10 can be dissipated and radiated within a faster time. , An insulating sheet (not shown) is formed of an insulating material and is disposed between the heat dissipation sheet (not shown) and the bottom chassis 120 to prevent heat generated from the display panel 10 from being transferred to the rear side. In this embodiment, the heat dissipation sheet (not shown) is made of a graphite sheet, and the heat insulation sheet (not shown) is made of a poron sheet.

The printed circuit board 150 includes various electric components mounted on a flat board, and is connected to an external power source to supply power to the display device 1, and power is supplied to the display panel 10. It includes a panel driving substrate for transmitting to the display panel 10 to be driven, a timing control substrate for transmitting image signals to the display panel 10, and a signal processing substrate for processing various image and sound signals. I can.

Insulation sheets 155 and 156 are disposed on the rear surface of the bottom chassis 130 to prevent electrical interference from occurring between the power board, the panel driving board, and the bottom chassis 130.

A woofer speaker 190 may be disposed on one side of the rear side of the bottom chassis 130. In an embodiment of the present invention, the woofer speaker 190 may be formed in an L shape.

The side case 160 may include a first side case 161 formed in an inverted U shape and a second side case 162 connecting the lower end of the first side case 161. The second side case 162 may be made of a resin material. This is to enable wireless communication with external devices such as a Wi-Fi module and a Bluetooth module built into the display device 1 through the second side case 162.

The rear case 180 includes a rear plate 181 forming the rear surface of the rear case 180 and a support plate 182 attached to the front surface of the rear plate 181 to support the printed circuit board 150 can do. An aluminum sheet (not shown) may be attached to the rear surface of the rear plate 181.

Hereinafter, a conductive resin composition that can be used for the frame 11 will be described. The conductive resin composition may be used in the side case 160, the rear case 180, the top chassis 130, and the bottom chassis 120 forming the exterior of the display device 1 of the present invention, but is not limited thereto and is not limited thereto. It can be used for parts that need to be prevented from occurring.

The conductive resin composition according to an aspect of the present invention may include a resin including a polyester-based copolymer resin and a carbon nanotube (CNT). Here, the polyester-based copolymer resin may be at least one of polyethylene terephthalate glycol (PETG) and polycyclohexylene dimethylene terephthalate glycol.

The resin may be composed of polycarbonate (PC) resin, polyethylene terephthalate glycol resin, rubber-modified vinyl-based graft copolymer resin, and styrene-acrylonitrile (SAN) resin.

The polycarbonate (PC) used in the preparation of the conductive resin composition of the present invention is not particularly limited, and is prepared by a method known to those of ordinary skill in the art, or commercially available polycarbonate resin. Can be used.

Polycarbonate (PC) represented by the following Formula 1 can be prepared by reacting a diphenol compound with phosgene, halogen formate, or carbonic acid diester.

[Formula 1]

Wherein A is a single bond, C1-C5 alkylene, C1-C5 alkylidene, substituted or unsubstituted C3-C6 cycloalkylene, substituted or unsubstituted C5-C6 cycloalkylidene, -CO-, It is selected from the group consisting of -S- or -SO2-. In addition, R1 and R2 are each independently selected from the group consisting of substituted or unsubstituted C1-C30 alkyl, and substituted or unsubstituted C6-C30 aryl, and n1 and n2 are each independently an integer of 0 to 4 to be. Herein, "substituted" means the group consisting of a hydrogen atom of a halogen group, a C1-C30 alkyl, a C1-C30 haloalkyl, a C6-C30 aryl, a C6-C30 heteroaryl, a C1-C20 alkoxy, and combinations thereof It means substituted with a substituent selected from

Specific examples of the compound represented by Formula 1 above include 4, 4'-dihydroxydiphenyl, 2, 2-bis-(4-hydroxyphenyl)-propane, 2,4-bis-(4-hydroxyphenyl) -2-Methylbutane, 1,1-bis-(4-hydroxyphenyl)-cyclohexane, 2, 2-bis-(3-chloro-4-hydroxyphenyl)-propane, 2, 2-bis-( 3, 5-dichloro-4-hydroxyphenyl)-propane, etc. are mentioned. In addition, as the diphenol chemical, compounds such as hytroquinone and resorcinol may be used. Among these, 2, 2-bis-(4-hydroxyphenyl)-propane, 2, 2-bis-(3, 5-dichloro-4-hydroxyphenyl-)propane, 1, 1-bis-(4- Hydroxyphenyl)-cyclohexane, and the like, and 2,2-bis-(4-hydroxyphenyl)-pro, also called bisphenol-A, can be used as the most commonly used polycarbonate.

A suitable polycarbonate used in the preparation of the conductive resin composition according to an embodiment of the present invention has a weight average molecular weight of 10,000 to 200,000 g/mol, and in particular, may be 15,000 to 80,000 g/mol, but is not limited thereto.

As a suitable polycarbonate used in the preparation of the conductive resin composition of the present invention, the resin may be a linear polycarbonate resin as well as a branched polycarbonate resin or a mixture of linear and branched polycarbonate resins.

Bisphenol A-based polycarbonate resin may be used as the linear polycarbonate resin, but is not limited thereto. The branched polycarbonate resin is prepared by adding 0.05 to 2 mol% of a tri- or higher polyfunctional compound, for example, a compound having a trivalent or higher phenol group, based on the total amount of the diphenol compound used for polymerization. I can.

The polycarbonate resin may be a homopolycarbonate resin or a copolycarbonate resin, and a blend of a copolycarbonate resin and a homopolycarbonate resin may also be used. The polycarbonate resin may be partially or entirely replaced with an aromatic polyester-carbonate resin obtained by polymerization reaction in the presence of an ester precursor, such as a difunctional carboxylic acid.

The polyester copolymer of the conductive resin composition of the present invention is generally terephthalic acid (TPA), isophthalic acid (IPA), 1,2-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxyl Acid, 1,5-naphthalene dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, 1, 7-naphthalene dicarboxylic acid, 1,8-naphthalene dicarboxylic acid, 2,3-naphthalene dicarboxylic acid Acid, 2, 6-naphthalene dicarboxylic acid, 2, 7-naphthalene dicarboxylic acid, dimethyl terephtalate (DMT), an aromatic dicarboxylate in which the acid is substituted with a dimethyl group, dimethyl iso Phthalate (Dimethyl Isophthalate, DMT), alkyl ester of naphthalene dicarboxylic acid or dimethyl-1, 2-naphthalate, dimethyl-1, 5-naphthalate, dimethyl-1, 7-naphthalate, dimethyl-1, 8- Naphthalate, dimethyl-2, 3-naphthalate, dimethyl-2, 6-naphthalate, dimethyl-2, 7-naphthalate or mixtures thereof, and C1-C12 ethylene glycol, 1,2-propylene glycol, as a diol, 1,3-propylene glycol, 2,2-dimethyl-1,3 propanediol, 2,2-dimethyl-1,3-propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol , 1,6-hexanediol, 1,3-cyclohexane dimethanol, 1,4-cyclohexane dimethanol, or a mixture thereof can be obtained by condensation polymerization, which can be obtained by those of ordinary skill in the field to which the present invention belongs. It can be easily implemented by.

In particular, the polyester-based copolymer of the present invention is a polyethylene terephthalate-based copolymer containing 1,4-cyclohexane dimethanol (CHDM) represented by the following [Chemical Formula 2] as a copolymerization component. This can be prepared by replacing a part of ethylene glycol constituting the polyethylene terephthalate resin with 1,4-cyclohexane dimethanol.

[Formula 2]

Polyethylene terephthalate glycol (PETG) may be 10 to 30% by weight based on 100% by weight of the resin. If the content of polyethylene terephthalate glycol (PETG) is less than 10% by weight, the heat deflection temperature may increase and the injection characteristics may deteriorate. In addition, when the content of polyethylene terephthalate glycol (PETG) is 30% by weight or more, flame retardant properties are lowered, and thermal deformation temperature is lowered, so that injection properties may be deteriorated.

The rubber-modified vinyl-based graft copolymer of the conductive resin composition of the present invention includes (1) styrene, -methylstyrene, halogen or C1-C4 alkyl substituted styrene, C1-C8 methacrylic acid alkyl esters, and C1-C8 acrylic acid alkyl esters. 40 to 95% by weight of compounds or mixtures thereof, and (2) acrylonitrile, methacrylonitrile, C1-C8 methacrylic acid alkyl esters, C1-C8 acrylic acid alkyl esters, maleic anhydride, C1-C4 alkyl Or 5 to 95% by weight of a monomer mixture ((1) and (2)) consisting of 5 to 60% by weight of a phenyl substituted maleimide or a mixture thereof, butadiene rubber, acrylic rubber, ethylene/propylene rubber, styrene/butadiene rubber, 5-95 rubbery polymer selected from one of acrylonitrile/butadiene rubber, isoprene rubber, terpolymer of ethylene-propylene-diene (EPDM), polyorganosiloxane/polyalkyl (meth)acrylate rubber composites, or mixtures thereof It can be obtained by graft polymerization in weight percent.

Examples of the rubber-modified vinyl-based graft copolymer include graft copolymerization of butadiene rubber, acrylic rubber, or styrene/butadiene rubber with styrene and acrylonitrile and optionally a (meth)acrylic acid alkyl ester monomer in the form of a mixture.

In particular, acrylonitrile butadiene styrene (ABS) graft copolymer or methacrylate butadiene styrene (MBS) may be used.

Acrylonitrile butadiene styrene may be 7 to 20% by weight based on 100% by weight of the resin. When the content of acrylonitrile butadiene styrene is less than 7% by weight, injection properties may be deteriorated. In addition, when the content of acrylonitrile butadiene styrene exceeds 20% by weight, injection properties may deteriorate and flame retardancy may deteriorate.

The styrene acrylonitrile (SAN) resin of the conductive resin composition of the present invention may be formed by copolymerizing 50 to 90% by weight of an aromatic vinyl monomer and 10 to 50% by weight of an unsaturated nitrile monomer. As the aromatic vinyl monomer, styrene, -methylstyrene, nuclear substituted styrene, and the like may be used.

As the unsaturated nitrile monomer, an unsaturated nitrile-based monomer such as acrylonitrile and methyl methacrylonitrile may be used.

The carbon nanotube (CNT) of the conductive resin composition of the present invention has a hollow tube shape in which a graphene made of a covalent bond of carbon atoms is rolled into a nano-sized diameter. Depending on the number of walls of the graphite surface, single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, bundles It can be classified as a type of carbon nanotube (Rope carbon nanotube). In one embodiment of the present invention, a multi-walled carbon nanotube is used, but is not limited thereto.

Carbon nanotube synthesis methods include arc-discharge method, laser vaporization method, plasma enhanced chemical vapor deposition method, thermal chemical vapor deposition method, and vapor phase synthesis method ( Vapor Phase Growth).

The carbon nanotubes may be coated with metal materials such as Ni, NiP3, Cu, Fe, Au, Ag, Pb, Co, and Sn.

Carbon nanotubes may have electrical conductivity, but they tend to aggregate with each other by the Van der Waals force, so uniform dispersion is difficult and mechanical properties are inferior.

1 to 3 parts by weight of carbon nanotubes may be included with respect to 100 parts by weight of the resin of the conductive resin composition according to an embodiment of the present invention. When the content of carbon nanotubes is less than 1 part by weight, electrical conductivity may be degraded, and when the content of carbon nanotubes exceeds 3 parts by weight, electrical conductivity is excellent, but molding properties may be deteriorated.

The conductive resin composition according to an embodiment of the present invention may further include glass fiber. The glass fiber may be any one selected from one-way glass fiber, lattice glass fiber, woven glass fiber, and equivalents thereof. The glass fiber may be in a prepreg state, that is, a semi-cured state in which resin is penetrated.

The glass fiber of the conductive resin composition of the present invention may be 15 to 30 parts by weight based on 100 parts by weight of the resin. When the content of the glass fiber is 14 parts by weight or less, injection properties and electrical conductivity may be deteriorated. In addition, when the content of the glass fiber exceeds 30 parts by weight, it cannot be used for an exterior material that must have a high gloss because the gloss is low, and the mold life may be reduced.

The conductive resin composition of the present invention may further include a flame retardant. The flame retardant may include at least one of bisphenol-A-bisdiphenyl phosphate (BDP) and red phosporus.

Bisphenol bisdiphenyl phosphate may be 10 to 25 parts by weight based on 100 parts by weight of the resin. When the content of bisphenol bisdiphenyl phosphate is less than 10 parts by weight, flame retardancy may be deteriorated, and when the content of bisphenol bisdiphenyl phosphate exceeds 25 parts by weight, flame retardancy is improved, but mechanical rigidity may be lowered and injection properties may be degraded.

More specifically, the mixed weight ratio of bisphenol bisdiphenyl phosphate and red phosphorus may be 10:1 to 25:1.

The conductive resin composition of the present invention may further include a wax. More specifically, the mixing weight ratio of the carbon nanotubes and the wax may be 4: 1 to 12: 1.

The conductive resin composition of the present invention may further include an additive. The additive may be at least one of carbon black, pigment, nanoclay, and antioxidant.

3 is a view showing a manufacturing process of the conductive resin composition according to an embodiment of the present invention, Figure 4 is a flow chart showing the manufacturing process of the conductive resin composition according to an embodiment of the present invention.

3 and 4, the conductive resin composition according to an embodiment of the present invention comprises polycarbonate, polyethylene terephthalate glycol, acrylonitrile butadiene styrene, styrene acrylonitrile, carbon nanotubes, wax, and additives. Mix in a mixer (S100)

Thereafter, the mixed material M1 is put into the first hopper 202 of the continuous twin screw extruder 200 (S200). After that, the first flame retardant M2 is put into the second hopper 203. (S300) A glass fiber (M3) is put into the third hopper 204. (S400) That is, M1 in FIG. 3 corresponds to the mixed material, M2 corresponds to the first flame retardant, and M3 corresponds to the glass fiber. can do. The first flame retardant may be bisphenol adiphenyl phosphate and a mixture comprising the same. The reason why bisphenol-adiphenyl phosphate and glass fiber are separately added in this way is because bisphenol-adiphenyl phosphate and glass fiber may be decomposed when the staying time in the twin screw extruder 200 is prolonged. An embodiment of the present invention to prevent this because bisphenol-adiphenyl phosphate and glass fiber are first fed to a twin screw extruder and are decomposed during the process, so that the effect of the bisphenol-adiphenyl phosphate and glass fiber in the conductive resin composition may be reduced. According to, the second hopper 203 and the third hopper 204 may be positioned so that the material (M1) obtained by mixing bisphenol-adiphenyl phosphate (M2_ and glass fiber M3) is fed after being fed.

Materials fed to each of the hoppers 202, 203, 204 pass through the compression unit 201 connected to the hoppers 202, 203, 204 and are cooled in the cooling unit 210 to be manufactured in the form of pellets. . Then, it is dried in the oven 220.

Thereafter, through a twin screw extruder, the conductive resin composition manufactured in the form of a pellet is injection-molded using a steam mold (S500). Through this, an injection mold that can be used as an exterior material for a display device and various electronic devices is manufactured. .

Next, the present invention will be described in more detail through examples, but the following comparative examples and examples are for illustrative purposes only, and the scope of the present invention is not limited thereto.

Polycarbonate (PC), polyethylene terephthalate glycol (PETG), acrylonitrile butadiene styrene (ABS), styrene acrylonitrile (SAN), carbon nanotubes (CNT), wax, and other additives are shown in Tables 1 and 2 below. It is mixed in a conventional mixer at the composition ratio shown, and the mixed material is fed into the first hopper of the twin screw extruder. Bisphenol bisdiphenyl phosphate (BDP) is fed to the second hopper, and glass fibers are fed to the third hopper. The material fed to the twin screw extruder goes through a melting/compression step, a dispersing step and a discharging step. Table 1 is a composition ratio of an Example, and Table 2 is a composition ratio of a comparative example. Here, the high-flow polycarbonate (PC) refers to a polycarbonate having a melt index (MI) of 60 to 70, which is an index indicating the ease of flow of the melt.

In the melting/compression step, the temperature was set to 250 to 255, the furnace was set to 240 to 250 in the dispersion step, and the temperature was set to 255 to 260 in the discharging step. In addition, the rotation speed of each step was set to 200 to 300 RPM.

The extrudate passing through the twin screw extruder is cooled in a water bath serving as a cooling unit 210 to be pelletized. The pellet was dried to 100 in an oven to prepare a specimen. After that, a steam mold was injected to manufacture a 1.5 T-thick molded part.

Physical properties were measured as follows using the prepared specimen, and the results are shown in Tables 3 and 4 below.

Volume resistivity was measured according to ASTM D257 standard.

The tensile strength was measured according to the ASTM D638 standard, the specimen standard was Type 1, the tensile speed was 3mm/min, and the value was measured five times and averaged.

Notched Izod impact strength was measured according to ASTM D265 standard, and the specimen standard was 63.5 * 12.7 * 6.4 mm, and was measured five times by the Izod notch method at room temperature and averaged.

The heat deflection temperature was measured according to ASTM D648 standard, the specimen standard is 127 * 12.7 * 6.4mm, and the stress load is 1.8Mpa.

Flame retardancy was measured using a specimen having a thickness of 1.5T according to the UL94 test, a method prescribed by Underwriter's Laboratory Inc. of the United States. This is to evaluate the flame retardancy by contacting the flame of the burner to the specimen of the size held vertically for 10 seconds, and then by the residual flame time or drip property. The after-salt time is the length of time for the specimen to continue flame-burning after moving the ignition source far away, and the ignition of the surface by drip is the dropping of the surface for the label about 300 mm below the bottom of the specimen from the specimen. (Drip) It is determined by being ignited by water, and the grade of flame retardancy is shown in Table 5 below.

The melt flow index (MFI) was measured according to ASTM D1238, and the melt flow index was measured under load conditions of 250 and 10 kgf.

The electrostatic discharge (ESD) withstand voltage test was performed using ESS-200AX equipment, and it was checked by whether line defects occurred at voltages of 8kV and 15kV. In Tables 3 and 4, "O" is a case where no line defect has occurred, and "X" is a case where a line defect has occurred.

Furtherance
Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Example 11 Suzy



PC 64 64 64 64 44 44 64 64 64 0 0 PETG 10 10 10 10 30 30 10 10 10 0 0 ABS 7 7 7 7 7 7 7 7 20 20 20 SAN 19 19 19 19 19 19 19 19 6 6 6 High flow PC 0 0 0 0 0 0 0 0 0 74 74 Fiberglass
15 15 30 30 15 15 15 15 15 15 15 CNT
1.0 3.0 1.0 3.0 1.0 3.0 1.5 1.5 1.0 1.5 3.0 Wax
0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 BDP
10 10 10 10 10 10 10 25 10 10 10 Red
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 additive
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0

Furtherance
Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Suzy


PC 60 60 65 43 64 64 64 64 64 64 PETG 14 14 9 31 10 10 10 10 10 10 ABS 7 7 7 7 7 7 7 7 6 21 SAN 19 19 19 19 19 19 19 19 20 5 Fiberglass
15 15 15 15 14 31 15 15 15 15 CNT
0.9 3.1 1.0 3.0 1.0 1.0 1.5 1.5 1.0 1.0 Wax
0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 BDP
10 10 10 10 10 10 9 26 10 10 Red
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 additive
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0

Properties Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Example 11 Volume resistance E6 E3 E5 E3 E5 E3 E5 E5 E5 E5 E3 The tensile strength
(kgf/cm ² ) 900 950 1,000 1,100 900 1,100 1,150 1,010 900 966 971 Notch Izod
(kgf.cm/cm) 5.0 4.5 5.5 4.0 5.0 4.0 4.7 4.2 5.3 5.5 4.2 Heat deflection temperature (℃) 95 95 95 95 80 80 93 85 90 86 84 Flame retardant V1 V1 V1 V1 V2 V1 V1 V0 V1 V1 V1 Melt flow index (g/10min) 20 20 18 18 28 25 18 25 20 10.5 0.9 Gloss 45 45 38 38 45 45 40 40 20 45 45 Withstand voltage 8kV 0 0 0 0 0 0 0 0 0 0 0 Withstand voltage 15kV 0 0 0 0 0 0 0 0 0 0 0 Thin film injection properties under 3T 0 0 0 0 0 0 0 0 0 0 0 Cycle time(sec) 60 60 60 60 60 60 60 60 60 60 60

Properties Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Volume resistance E12 E3 E5 E3 E6 E5 E5 E5 E5 E5 The tensile strength
(kgf/cm ² ) 1,000 1,150 900 1,100 832 1,200 1,050 1,080 890 850 Notch izod
(kgf.cm/cm) 5.1 3.2 5.0 4.0 3.7 5.7 5.3 3.0 3.5 5.3 Heat deflection temperature
(℃) 95 95 99 75 95 95 95 75 96 78 Flame retardant V1 V1 V1 HB V1 V1 HB V0 V1 HB Melt flow index (g/10min) 15 15 12 22 20 17 13 27 14 20 Gloss 45 45 43 43 45 20 44 43 45 46 Withstand voltage 8kV × ○ ○ ○ ○ ○ ○ ○ ○ ○ Withstand voltage 15kV × ○ ○ ○ ○ ○ ○ ○ ○ ○ 3T or less thin film injection properties ○ × ○ ○ × ○ × × × ○ Cycle time(sec) 60 60 60 65 60 60 62 64 60 63

division V2 V1 V0 HB After salt time of each sample 30 seconds or less 30 seconds or less 10 seconds or less Non-flammable

Total residual salt time of 5 samples 250 seconds or less 250 seconds or less 50 seconds or less Ignition of cotton by drip has exist none none

As in Example 1 and Example 2 of Table 3, when the carbon nanotubes (CNT) are 1 to 3 parts by weight, line defects do not occur in the electrostatic withstand voltage test at 8kV and 15kV, and all the antistatic withstand voltage tests were performed. Passed. However, as shown in Comparative Example 1 of Table 4, when the carbon nanotube (CNT) is less than 1 part by weight, a line defect occurred in the antistatic withstand voltage test of 8kV and 15kV, and the antistatic withstand voltage test failed. In addition, in the case of Comparative Example 2 in which the carbon nanotubes (CNT) exceeded 3 parts by weight, the anti-static withstand voltage test passed, but the anti-static withstand voltage test passed, but the notch Izod value was 3.2 (kgf.cm/cm), which was 3T. It can be seen that there is a problem in moldability due to the occurrence of cracks during thin film injection molding.

In addition, as in Examples 1, 2, 5, and 6 of Table 1, when the content of polyethylene terephthalate glycol (PETG) is 10 to 30% by weight based on the resin, the heat deflection temperature is 95 to 80. It can be seen that as the weight% of polyethylene terephthalate glycol (PETG) increases, the heat deflection temperature decreases. As shown in Comparative Example 3 of Table 2, when the content of polyethylene terephthalate glycol (PETG) is 9% by weight or less based on the resin, it can be seen that the heat deflection temperature is increased to 99. In addition, since the melt flow index is lowered to 12 (g/10min), a weld line e or a flowmark may occur during thin film injection, and it can be confirmed that a problem may occur during injection. In addition, as shown in Comparative Example 4 in Table 2, when the content of polyethylene terephthalate glycol (PETG) exceeds 30% by weight with respect to the resin, the flame retardancy is not flame-retardant with HB, and the heat deflection temperature is lowered to 75. It can be seen that the cycle tine during molding is extended from 60 seconds to 65 seconds.

In addition, as in Examples 1 to 4 of Table 1, when the glass fiber is 10 to 30 parts by weight, the tensile strength is 900 to 1100 (kgf/cm ² ), and the notched Izod is 4.0 to 5.5 (kgf.cm/cm). I can confirm that it is. However, as shown in Comparative Example 5 in Table 2, when the glass fiber is less than 14 parts by weight, the tensile strength is 832 (kgf/cm ² ), and the notched Izod is 3.7 (kgf.cm/cm) in thin film injection molding of 3T or less. You can see that there is a problem. In addition, as shown in Comparative Example 6 in Table 2, when the glass fiber exceeds 30 parts by weight, the tensile strength is 1200 (kgf/cm ² ), and the notched Izod is 5.7 (kgf.cm/cm), which is a problem for thin film injection of 3T or less. There is no glossiness, but a high gloss injection product cannot be manufactured with a glossiness of 20, and the mold life may be reduced.

In addition, as in Example 1 and Example 9 of Table 1, in the case of 7 to 20% by weight of acrylonitrile butadiene styrene (ABS) based on the resin, the notched Izod was 5.0 to 5.3 (kgf.cm/cm), and the heat deflection temperature Is 90 to 95, so it can be seen that there is no problem in physical properties. However, as shown in Comparative Example 9 in Table 2, when acrylonitrile butadiene styrene (ABS) is 6% by weight or less of the resin, the notched Izod is 3.5 (kgf.cm/cm), and the melt flow index is 14 (g/10min) As a result, it can be confirmed that there is a problem with mechanical properties and flowability during injection molding. In addition, as shown in Comparative Example 10 in Table 2, when acronitrile butadiene styrene (ABS) exceeds 20% by weight of the resin, the heat deflection temperature is 78, and the cycle time during injection molding is extended to 63 seconds, and the flame retardancy is HB. It can be seen that it is not flame retardant

In addition, as in Example 7 of Table 1, when the bisphenol bisdiphenyl phosphate (BDP) is 10 to 25 parts by weight, the heat deflection temperature is 85 to 93, the flame retardancy is V0 to V1, and the tensile strength is 1010. To 1150kgf/cm ² ), and the notched Izod was 4.2 to 4.7 (kgf.cm/cm), and it was confirmed that there was no problem in physical properties. However, as shown in Comparative Example 7 in Table 2, when the amount of bisphenol bisdiphenyl phosphate (BDP) is 9 parts by weight or less, the melt index is 13 (g/10 min), and the flame retardancy is HB, which is not flame retardant. You can see that there is. In addition, as shown in Comparative Example 8 of Table 2, when the amount of bisphenol bisdiphenyl phosphate (BDP) exceeds 26 parts by weight, the melt index is 27 (g/10 min) d, and there is no problem in melt flow and flame retardancy due to flame retardancy V0, Notch Izod is 3.0 (kgf.cm/cm), heat deflection temperature is 75, which does not satisfy the physical properties, and it can be seen that the cycle time is longer during injection molding.

In addition, Example 10 and Example 11 of Table 1 is a case where the high-flow polycarbonate (PC) resin is 74% by weight, and the carbon nanotubes (CNT) are 1.5 to 3 parts by weight. In this case, as described above, due to the carbon nanotubes (CNT), it was possible to pass the antistatic withstand voltage test. In addition, due to the high-flow polycarbonate (PC) resin, the tensile strength is 966 to 971 (kgf/cm ² ), and it can be confirmed that the notched Izod is 5.5 to 4.2 (kgf.cm/cm). There is no problem in injection molding. . In particular, although the melt flow index is 0.9 (g/10min) to 10.5 (g/10min), when the glossiness is measured at the same time, it shows 45, so it can be confirmed that there is no problem in injection molding.

As described above, the conductive resin composition according to an embodiment of the present invention may have electrical conductivity and at the same time satisfy mechanical properties and melt flow characteristics. Accordingly, it is possible to efficiently injection mold the exterior material, and it is possible to have a static electricity prevention effect when using a display device and a home appliance. In particular, it can be used as a conductive resin composition capable of satisfying injection properties and mechanical properties in molding an exterior material having a thickness of 3T or less.

1: display device 10: display panel
11: Frame 120: Bottom chassis
130: top chassis 160: side case
180: rear case 200: twin screw extruder
202: first hopper 203: second hopper
204: 3rd hopper

Claims (29)

Display panel;
Includes; a frame on which the display panel is installed and having conductivity,
The frame,
Resin containing a polyester-based copolymer resin;
Carbon nanotubes (CNT);
Made of a conductive resin composition comprising a,
The resin is a display device comprising a polycarbonate (PC) resin, a polyethylene terephthalate glycol resin, a rubber-modified vinyl-based graft copolymer resin, and styrene-acrylonitrile (SAN). The method of claim 1,
The polyester-based copolymer resin is at least one of polyethylene terephthalate glycol (PETG) and polycyclohexylene dimethylene terephthalate glycol. The method of claim 1,
The display device, characterized in that the resin comprises a high-flow polycarbonate (PC) resin having a melt index of 60 to 70. delete The method of claim 1,
A display device, characterized in that, based on 100% by weight of the resin, the polyethylene terephthalate glycol resin is 10 to 30% by weight. The method of claim 1,
A display device, characterized in that, based on 100% by weight of the resin, the acrylonitrile butadiene styrene resin is 7 to 20% by weight. The method of claim 1,
Display device, characterized in that the carbon nanotubes are 1 to 3 parts by weight based on 100 parts by weight of the resin. The method of claim 1,
The display device, characterized in that the conductive resin composition further comprises a glass fiber (glass fiber). The method of claim 8,
Display device, characterized in that the glass fiber is 15 to 30 parts by weight per 100 parts by weight of the resin. The method of claim 1,
The display device, characterized in that the conductive resin composition further comprises a flame retardant. The method of claim 10,
The flame retardant is a display device comprising at least one of bisphenol-A-bisdiphenyl phosphate (BDP) and red phosphorus. The method of claim 11,
The display device, characterized in that 10 to 25 parts by weight of the bisphenol bisdiphenyl phosphate based on 100 parts by weight of the resin. The method of claim 1,
The display device, characterized in that the conductive resin composition further comprises a wax (wax). The method of claim 13,
The display device, characterized in that the mixing weight ratio of the carbon nanotubes and the wax is 4:1 to 12:1. The method of claim 1,
The conductive resin composition further comprises an additive including at least one of carbon black, pigment, nanoclay, and antioxidant. 100 parts by weight of a four-component copolymer resin including polycarbonate, polyethylene terephthalate glycol, acrylonitrile butadiene styrene, and styrene acrylonitrile;
1 to 3 parts by weight of carbon nanotubes;
15 to 30 parts by weight of glass fibers;
Conductive resin composition comprising a. The method of claim 16,
Conductive resin composition, characterized in that the polyethylene terephthalate glycol is 10 to 30% by weight based on 100% by weight of the resin. The method of claim 17,
Conductive resin composition, characterized in that the acrylonitrile butadiene styrene is 7 to 20% by weight based on 100% by weight of the resin. The method of claim 16,
The polycarbonate is a conductive resin composition comprising a high-flow polycarbonate resin having a melt index of 60 to 70. The method of claim 16,
A conductive resin composition further comprising a flame retardant containing at least one of bisphenol bisdiphenyl phosphate and red phosphorus. . The method of claim 20,
Conductive resin composition, characterized in that the bisphenol bisdiphenyl phosphate is 10 to 25 parts by weight based on 100 parts by weight of the resin. The method of claim 16,
Conductive resin composition, characterized in that it further comprises a wax. The method of claim 16,
A conductive resin composition, characterized in that it further comprises an additive including at least one of carbon black, pigment, nanoclay, and antioxidant. 100 parts by weight of a copolymer resin including polycarbonate, acrylonitrile butadiene styrene, and styrene acrylonitrile;
1 to 3 parts by weight of carbon nanotubes;
15 to 30 parts by weight of glass fibers;
Conductive resin composition comprising a. The method of claim 24,
A conductive resin composition further comprising a flame retardant containing at least one of bisphenol bisdiphenyl phosphate and red phosphorus. The method of claim 24,
Conductive resin composition, characterized in that it further comprises a wax. The method of claim 24,
A conductive resin composition, characterized in that it further comprises an additive including at least one of carbon black, pigment, nanoclay, and antioxidant. Bottom chassis;
A top chassis coupled to the front of the bottom chassis;
A side case coupled to a side surface of the bottom chassis;
A rear case coupled to a rear surface of the bottom chassis;
Including,
At least a portion of the bottom chassis, the top chassis, the side case, and the rear case is molded from a conductive resin composition,
The conductive resin composition,
100 parts by weight of a copolymer resin including polycarbonate, acrylonitrile butadiene styrene, and styrene acrylonitrile;
1 to 3 parts by weight of carbon nanotubes;
15 to 30 parts by weight of glass fibers;
Containing at least one of bisphenol bisdiphenyl phosphate and red phosphorus
Flame retardant;
Electronic device frame comprising a.
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