KR102220758B1 - Moisture-curable polyurethane hot melt resin composition, and laminate - Google Patents

Moisture-curable polyurethane hot melt resin composition, and laminate Download PDF

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KR102220758B1
KR102220758B1 KR1020197023092A KR20197023092A KR102220758B1 KR 102220758 B1 KR102220758 B1 KR 102220758B1 KR 1020197023092 A KR1020197023092 A KR 1020197023092A KR 20197023092 A KR20197023092 A KR 20197023092A KR 102220758 B1 KR102220758 B1 KR 102220758B1
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moisture
resin composition
polyol
curable polyurethane
polyurethane hot
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KR20190097288A (en
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신고 다케다
도요쿠니 후지와라
아츠시 니노미야
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디아이씨 가부시끼가이샤
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • C08L75/08Polyurethanes from polyethers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/302Water
    • C08G18/307Atmospheric humidity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/48Polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

본 발명은 120℃에 있어서의 용융 점도가 160∼800mPa·s의 범위이며, 또한, 80℃에 있어서의 용융 점도가 850∼10,000mPa·s의 범위인 것을 특징으로 하는 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 제공하는 것이다. 또한, 본 발명은 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물의 경화물층, 및 수지 필름 또는 섬유 기재(基材)가 순차 적층되어 있는 것을 특징으로 하는 적층체를 제공하는 것이다. 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물은, 폴리올(a)과 폴리이소시아네이트(b)와의 반응물이며, 이소시아네이트기를 갖는 우레탄 프리폴리머(i)를 함유하는 것임이 바람직하고, 상기 폴리올(a)은 특정의 것을 사용하는 것이 바람직하다.The present invention is a moisture curable polyurethane hot melt resin composition characterized in that the melt viscosity at 120°C is in the range of 160 to 800 mPa·s, and the melt viscosity at 80°C is in the range of 850 to 10,000 mPa·s. Is to provide. In addition, the present invention provides a layered product in which a cured product layer of the moisture-curable polyurethane hot-melt resin composition and a resin film or a fiber substrate are sequentially laminated. The moisture-curable polyurethane hot melt resin composition is a reaction product of a polyol (a) and a polyisocyanate (b), and preferably contains a urethane prepolymer (i) having an isocyanate group, and a specific polyol (a) is used. It is desirable to do.

Description

습기 경화형 폴리우레탄 핫멜트 수지 조성물, 및 적층체Moisture-curable polyurethane hot melt resin composition, and laminate

본 발명은 습기 경화형 폴리우레탄 핫멜트 수지 조성물, 및 그 경화물층을 갖는 적층체에 관한 것이다.The present invention relates to a moisture-curable polyurethane hot-melt resin composition, and a laminate having a cured product layer thereof.

등산복이나 스포츠웨어 등에는, 일반적으로 착용시의 움직이기 쉬움이나 가벼움 외에, 우수한 투습성이나 방수성 등이 요구된다. 그 중에서도 투습성은, 발한 등으로 체내로부터 발생한 수분이 의복 내에 머무름으로써 야기되는 땀참에 의한 불쾌감을 억제하는데 있어서 중요한 특성이다.In general, mountaineering clothes, sportswear, etc., in addition to ease of movement and lightness when worn, excellent moisture permeability and waterproofness are required. Among them, moisture permeability is an important characteristic in suppressing the discomfort caused by sweating caused by moisture generated from the body due to sweating and the like staying in the clothes.

상기 투습성을 갖는 투습성 재료로서는, 예를 들면, 폴리옥시에틸렌글리콜을 주성분으로 하는 폴리올, 쇄(鎖) 신장제, 및 폴리이소시아네이트를 원료로 한 투습성 폴리우레탄이 개시되어 있다(예를 들면, 특허문헌 1을 참조).As the moisture-permeable material having moisture permeability, for example, a polyol containing polyoxyethylene glycol as a main component, a chain extender, and a moisture-permeable polyurethane made from polyisocyanate as raw materials are disclosed (for example, Patent Documents See 1).

상기 투습성 폴리우레탄은, 친수성이 높은 폴리옥시글리콜을 원료의 주성분으로 하고 있기 때문에, 우수한 투습성을 갖는 반면, 박리 강도가 낮다는 문제점이 있었다. 또한, 최근에는, 투습성 재료의 하지(下地)에는, 지금까지 섬유 기재(基材)뿐만 아니라, 이것에 발수(撥水) 처리가 실시된 것이나, 수지를 원료로 한 필름 등이 이용되도록 되어 오고 있으며, 이들 다양한 기재를 사용해도 우수한 접착 강도를 갖는 재료의 개발이 요구되고 있었다.The moisture permeable polyurethane has a problem in that it has excellent moisture permeability, but has a low peel strength, since it contains polyoxyglycol having high hydrophilicity as a raw material. In addition, in recent years, not only a fiber substrate, but also a film made of a resin as a raw material has been used as a base material of a moisture-permeable material. There has been a demand for development of a material having excellent adhesive strength even when these various substrates are used.

일본국 특개2003-246832호 공보Japanese Unexamined Patent Publication No. 2003-246832

본 발명이 해결하고자 하는 과제는, 접착 강도가 우수한 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 제공하는 것이다.The problem to be solved by the present invention is to provide a moisture-curable polyurethane hot melt resin composition having excellent adhesive strength.

본 발명은 120℃에 있어서의 용융 점도가 160∼800mPa·s의 범위이며, 또한, 80℃에 있어서의 용융 점도가 850∼10,000mPa·s의 범위인 것을 특징으로 하는 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 제공하는 것이다. 또한, 본 발명은 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물의 경화물층, 및 수지 필름 또는 섬유 기재가 순차 적층되어 있는 것을 특징으로 하는 적층체를 제공하는 것이다.The present invention is a moisture curable polyurethane hot melt resin composition characterized in that the melt viscosity at 120°C is in the range of 160 to 800 mPa·s, and the melt viscosity at 80°C is in the range of 850 to 10,000 mPa·s. Is to provide. In addition, the present invention is to provide a laminate, characterized in that the cured product layer of the moisture-curable polyurethane hot-melt resin composition and a resin film or a fiber substrate are sequentially laminated.

본 발명의 습기 경화형 폴리우레탄 핫멜트 수지 조성물은, 우수한 접착 강도를 갖는 것이다.The moisture curing polyurethane hot melt resin composition of the present invention has excellent adhesive strength.

본 발명의 습기 경화형 폴리우레탄 핫멜트 수지 조성물은, 120℃에 있어서의 용융 점도가 160∼800mPa·s의 범위이며, 또한, 80℃에 있어서의 용융 점도가 850∼10,000mPa·s의 범위인 것이다. 상기 용융 점도가 이러한 범위 내임으로써, 기재에의 양호한 젖음성이 발현되고, 우수한 접착 강도를 얻을 수 있다. 또한, 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물의 120℃ 및 80℃에 있어서의 용융 점도는, 콘플레이트 점도계에 의해 측정한 값을 나타내고, 그 측정 방법은 후술하는 실시예에서 기재한다.The moisture-curable polyurethane hot melt resin composition of the present invention has a melt viscosity at 120°C of 160 to 800 mPa·s, and a melt viscosity at 80°C of 850 to 10,000 mPa·s. When the melt viscosity is within such a range, good wettability to the substrate is expressed, and excellent adhesive strength can be obtained. In addition, the melt viscosity at 120° C. and 80° C. of the moisture-curable polyurethane hot melt resin composition represents a value measured by a cone plate viscometer, and the measurement method is described in Examples described later.

상기 120℃에 있어서의 용융 점도로서는, 적당한 젖음성에 보다 한층 우수한 접착 강도가 얻어지는 점에서, 200∼700mPa·s의 범위가 보다 바람직하고, 300∼600mPa·s의 범위가 더 바람직하다.The melt viscosity at 120°C is more preferably in the range of 200 to 700 mPa·s, and still more preferably in the range of 300 to 600 mPa·s, from the viewpoint of obtaining even more excellent adhesive strength with moderate wettability.

상기 80℃에 있어서의 용융 점도로서는, 적당한 젖음성에 보다 한층 우수한 접착 강도가 얻어지는 점에서, 1,500∼8,000mPa·s의 범위가 보다 바람직하고, 2,000∼6,000mPa·s의 범위가 더 바람직하고, 2,200∼5,500mPa·s의 범위가 특히 바람직하다.The melt viscosity at 80°C is more preferably in the range of 1,500 to 8,000 mPa·s, more preferably in the range of 2,000 to 6,000 mPa·s, and 2,200 from the viewpoint of obtaining even more excellent adhesive strength with moderate wettability. The range of -5,500 mPa·s is particularly preferred.

또한, 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물로서는, 적당한 젖음성에 보다 한층 우수한 접착 강도가 얻어지는 점에서, 상기 80℃에 있어서의 용융 점도와, 120℃에 있어서의 용융 점도의 비[80℃에 있어서의 용융 점도/120℃에 있어서의 용융 점도]가, 6∼13의 범위인 것이 바람직하고, 6.5∼10의 범위가 보다 바람직하고, 7∼9.5의 범위가 더 바람직하다.Further, as the moisture-curable polyurethane hot-melt resin composition, the ratio of the melt viscosity at 80°C and the melt viscosity at 120°C [at 80°C] from the viewpoint of obtaining even more excellent adhesive strength with moderate wettability. The melt viscosity/melt viscosity at 120°C] is preferably in the range of 6 to 13, more preferably in the range of 6.5 to 10, and still more in the range of 7 to 9.5.

상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물로서는, 구체적으로는, 예를 들면, 폴리올(a)과 폴리이소시아네이트(b)와의 반응물인, 이소시아네이트기를 갖는 우레탄 프리폴리머(i)를 함유하는 것을 들 수 있다.Specific examples of the moisture-curable polyurethane hot melt resin composition include those containing a urethane prepolymer (i) having an isocyanate group, which is a reaction product of a polyol (a) and a polyisocyanate (b).

상기 폴리올(a)로서는, 예를 들면, 폴리에테르폴리올, 폴리에스테르폴리올, 폴리카보네이트폴리올, 폴리카프로락톤폴리올, 폴리부타디엔폴리올, 다이머디올 등을 사용할 수 있다. 이들 폴리올은 단독으로 사용해도 2종 이상을 병용해도 된다.As the polyol (a), for example, polyether polyol, polyester polyol, polycarbonate polyol, polycaprolactone polyol, polybutadiene polyol, dimerdiol, and the like can be used. These polyols may be used alone or in combination of two or more.

상기 폴리올(a)의 수평균 분자량으로서는, 300∼10,000의 범위인 것이 바람직하고, 350∼5,000의 범위가 보다 바람직하다. 또한, 상기 폴리올(a)의 수평균 분자량은, 겔·퍼미에이션·크로마토그래피(GPC)법에 의해, 하기의 조건에서 측정한 값을 나타낸다.The number average molecular weight of the polyol (a) is preferably in the range of 300 to 10,000, and more preferably in the range of 350 to 5,000. In addition, the number average molecular weight of the polyol (a) represents a value measured under the following conditions by a gel permeation chromatography (GPC) method.

측정 장치: 고속 GPC 장치(도소 가부시키가이샤제 「HLC-8220GPC」)Measuring device: High-speed GPC device ("HLC-8220GPC" manufactured by Tosoh Corporation)

칼럼: 도소 가부시키가이샤제의 하기의 칼럼을 직렬로 접속하여 사용했다.Column: The following columns manufactured by Tosoh Corporation were connected in series and used.

「TSKgel G5000」(7.8㎜I.D.×30cm)×1개「TSKgel G5000」(7.8㎜I.D.×30cm)×1ea

「TSKgel G4000」(7.8㎜I.D.×30cm)×1개「TSKgel G4000」(7.8㎜I.D.×30cm)×1ea

「TSKgel G3000」(7.8㎜I.D.×30cm)×1개「TSKgel G3000」(7.8㎜I.D.×30cm)×1

「TSKgel G2000」(7.8㎜I.D.×30cm)×1개「TSKgel G2000」(7.8㎜I.D.×30cm)×1ea

검출기: RI(시차 굴절계)Detector: RI (differential refractometer)

칼럼 온도: 40℃Column temperature: 40°C

용리액: 테트라히드로퓨란(THF)Eluent: Tetrahydrofuran (THF)

유속: 1.0mL/분Flow rate: 1.0 mL/min

주입량: 100μL(시료 농도 0.4질량%의 테트라히드로퓨란 용액)Injection amount: 100 μL (tetrahydrofuran solution with a sample concentration of 0.4% by mass)

표준 시료: 하기의 표준 폴리스티렌을 사용하여 검량선을 작성했다.Standard sample: A calibration curve was prepared using the following standard polystyrene.

(표준 폴리스티렌)(Standard polystyrene)

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 A-500」"TSKgel Standard Polystyrene A-500" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 A-1000」"TSKgel Standard Polystyrene A-1000" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 A-2500」"TSKgel Standard Polystyrene A-2500" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 A-5000」"TSKgel Standard Polystyrene A-5000" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-1」"TSKgel Standard Polystyrene F-1" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-2」"TSKgel Standard Polystyrene F-2" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-4」"TSKgel Standard Polystyrene F-4" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-10」"TSKgel Standard Polystyrene F-10" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-20」"TSKgel Standard Polystyrene F-20" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-40」``TSKgel Standard Polystyrene F-40'' manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-80」"TSKgel Standard Polystyrene F-80" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-128」"TSKgel Standard Polystyrene F-128" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-288」"TSKgel Standard Polystyrene F-288" manufactured by Tosoh Corporation

도소 가부시키가이샤제 「TSKgel 표준 폴리스티렌 F-550」"TSKgel Standard Polystyrene F-550" manufactured by Tosoh Corporation

상기 폴리올(a)로서는, 상기한 것 중에서도, 저점도성을 구비하고, 적당한 젖음성에 보다 한층 우수한 접착 강도가 얻어지는 점에서, 수평균 분자량이 1,000 미만인 폴리올(a-1) 단독, 또는, 수평균 분자량이 1,000 미만인 폴리올(a-1)과 1,000 이상인 폴리올(a-2)과의 병용이 바람직하고, 수평균 분자량이 500∼800의 범위의 폴리올 단독, 또는, 수평균 분자량이 300∼600의 범위의 폴리올과 1,000∼5,000의 범위의 폴리올과의 병용이 보다 바람직하다. 또한, 상기 폴리올 (a-1) 및 (a-2)로서는, 각각 폴리에테르폴리올 및/또는 23℃에서 액상의 폴리에스테르폴리올인 것이 바람직하다. 또한, 상기 「액상」이란 23℃에서 유동성을 나타내는 폴리에스테르폴리올을 나타낸다.As the polyol (a), among the above, a polyol (a-1) having a number average molecular weight of less than 1,000 alone, or a number average molecular weight, from the viewpoint of having a low viscosity and obtaining even more excellent adhesive strength with moderate wettability. The combined use of the polyol (a-1) of less than 1,000 and the polyol (a-2) of 1,000 or more is preferable, and the number average molecular weight is the polyol alone in the range of 500 to 800, or the number average molecular weight is in the range of 300 to 600 The combination of a polyol and a polyol in the range of 1,000 to 5,000 is more preferable. Moreover, as said polyol (a-1) and (a-2), it is preferable that it is a polyether polyol and/or a liquid polyester polyol at 23 degreeC, respectively. In addition, the "liquid" refers to a polyester polyol exhibiting fluidity at 23°C.

상기 폴리올(a)로서, 수평균 분자량이 1,000 미만인 폴리올(a-1)과 1,000 이상인 폴리올(a-2)과의 병용할 경우에 있어서의, 상기 폴리올(a-1)의 사용량으로서는, 폴리올(a-1)과 폴리올(a-2)과의 합계 질량 중 10질량% 이상인 것이 바람직하고, 20질량% 이상이 보다 바람직하고, 30질량% 이상이 더 바람직하다.As the polyol (a), when used in combination with a polyol (a-1) having a number average molecular weight of less than 1,000 and a polyol (a-2) having a number average molecular weight of 1,000 or more, the amount of the polyol (a-1) is polyol ( It is preferably 10% by mass or more, more preferably 20% by mass or more, and still more preferably 30% by mass or more of the total mass of a-1) and the polyol (a-2).

상기 폴리에테르폴리올로서는, 예를 들면, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리테트라메틸렌글리콜, 폴리옥시에틸렌폴리옥시프로필렌글리콜, 폴리옥시에틸렌폴리옥시테트라메틸렌글리콜, 폴리옥시프로필렌폴리옥시테트라메틸렌글리콜 등을 사용할 수 있다. 이들 폴리에테르폴리올은 단독으로 사용해도 2종 이상을 병용해도 된다. 이들 중에서도, 보다 한층 양호한 젖음성에 한층 우수한 접착 강도가 얻어지는 점에서, 폴리프로필렌글리콜이 바람직하다.As the polyether polyol, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyoxyethylene polyoxypropylene glycol, polyoxyethylene polyoxytetramethylene glycol, polyoxypropylene polyoxytetramethylene glycol, and the like can be used. I can. These polyether polyols may be used alone or in combination of two or more. Among these, polypropylene glycol is preferable from the viewpoint of obtaining even more favorable wettability and even more excellent adhesive strength.

상기 23℃에서 액상의 폴리에스테르폴리올로서는, 23℃에 있어서의 점도가 3,000mPa·s 이하인 것을 나타내고, 예를 들면, 2개 이상의 수산기를 갖는 화합물과 다염기산과의 반응물을 사용할 수 있다.The liquid polyester polyol at 23°C indicates that the viscosity at 23°C is 3,000 mPa·s or less. For example, a reaction product of a compound having two or more hydroxyl groups and a polybasic acid can be used.

상기 2개 이상의 수산기를 갖는 화합물로서는, 예를 들면, 에틸렌글리콜, 프로필렌글리콜, 부탄디올, 펜탄디올, 헥산디올, 헵탄디올, 옥탄디올, 노난디올, 데칸디올, 트리메틸올프로판, 트리메틸올에탄, 글리세린 등을 사용할 수 있다. 이들 화합물은 단독으로 사용해도 2종 이상을 병용해도 된다.Examples of the compound having two or more hydroxyl groups include ethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol, heptanediol, octanediol, nonanediol, decanediol, trimethylolpropane, trimethylolethane, glycerin, etc. You can use These compounds may be used alone or in combination of two or more.

상기 다염기산으로서는, 예를 들면, 옥살산, 말론산, 숙신산, 아디프산, 세바스산, 아젤라산, 도데칸이산을 사용할 수 있다. 이들 다염기산은 단독으로 사용해도 2종 이상을 병용해도 된다.As the polybasic acid, for example, oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, and dodecanedioic acid can be used. These polybasic acids may be used alone or in combination of two or more.

또한, 상기 폴리올(a)로서는, 적당한 젖음성에 보다 한층 우수한 접착 강도가 얻어지는 점에서, 폴리에테르폴리올을 폴리올(a) 중 50질량% 이상 함유하는 것이 바람직하고, 60질량% 이상 함유하는 것이 보다 바람직하다.In addition, as the polyol (a), it is preferable to contain 50% by mass or more of the polyether polyol in the polyol (a), more preferably 60% by mass or more, from the viewpoint of obtaining even more excellent adhesive strength with moderate wettability. Do.

상기 폴리이소시아네이트(B)로서는, 폴리메틸렌폴리페닐폴리이소시아네이트, 디페닐메탄디이소시아네이트, 카르보디이미드 변성 디페닐메탄디이소시아네이트이소시아네이트, 자일릴렌디이소시아네이트, 페닐렌디이소시아네이트, 톨릴렌디이소시아네이트, 나프탈렌디이소시아네이트 등의 방향족 폴리이소시아네이트; 헥사메틸렌디이소시아네이트, 시클로헥산디이소시아네이트, 이소포론디이소시아네이트, 디시클로헥실메탄디이소시아네이트, 테트라메틸자일릴렌디이소시아네이트 등의 지방족 또는 지환족 폴리이소시아네이트 등을 사용할 수 있다. 이들 폴리이소시아네이트는 단독으로 사용해도 2종 이상을 병용해도 된다. 이들 중에서도, 우수한 반응성, 및 접착 강도가 얻어지는 점에서, 방향족 폴리이소시아네이트를 사용하는 것이 바람직하고, 디페닐메탄디이소시아네이트가 보다 바람직하다.Examples of the polyisocyanate (B) include polymethylene polyphenyl polyisocyanate, diphenylmethane diisocyanate, carbodiimide-modified diphenylmethane diisocyanate isocyanate, xylylene diisocyanate, phenylene diisocyanate, tolylene diisocyanate, naphthalene diisocyanate, and the like. Aromatic polyisocyanate; Aliphatic or alicyclic polyisocyanates such as hexamethylene diisocyanate, cyclohexane diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, and tetramethylxylylene diisocyanate can be used. These polyisocyanates may be used alone or in combination of two or more. Among these, since excellent reactivity and adhesive strength are obtained, it is preferable to use an aromatic polyisocyanate, and diphenylmethane diisocyanate is more preferable.

상기 폴리이소시아네이트(B)의 사용량으로서는, 폴리올(a)과 폴리이소시아네이트(b)와의 합계 100질량부에 대하여, 5∼60질량부의 범위인 것이 바람직하고, 35∼49질량부의 범위가 보다 바람직하고, 37∼45질량부가 더 바람직하다.The amount of the polyisocyanate (B) used is preferably 5 to 60 parts by mass, more preferably 35 to 49 parts by mass, based on 100 parts by mass of the total of the polyol (a) and the polyisocyanate (b), 37 to 45 parts by mass is more preferable.

상기 핫멜트 우레탄 프리폴리머(i)는, 상기 폴리올(a)과 상기 폴리이소시아네이트(b)를 반응시켜 얻어지는 것이며, 공기 중이나 습기 경화형 폴리우레탄 핫멜트 수지 조성물이 도포되는 기재 중에 존재하는 수분과 반응하여 가교 구조를 형성할 수 있는 이소시아네이트기를 갖는 것이다.The hot-melt urethane prepolymer (i) is obtained by reacting the polyol (a) and the polyisocyanate (b), and reacts with moisture present in the substrate to which the moisture-curable polyurethane hot-melt resin composition is applied to form a crosslinked structure. It has an isocyanate group which can be formed.

상기 핫멜트 우레탄 프리폴리머(i)의 제조 방법으로서는, 예를 들면, 상기 폴리이소시아네이트(b)가 들어간 반응 용기에, 상기 폴리올(a)을 넣고, 상기 폴리이소시아네이트(b)가 갖는 이소시아네이트기가, 상기 폴리올(a)이 갖는 수산기에 대하여 과잉이 되는 조건에서 반응시킴으로써 제조할 수 있다.As a method for producing the hot-melt urethane prepolymer (i), for example, the polyol (a) is put in a reaction vessel containing the polyisocyanate (b), and the isocyanate group of the polyisocyanate (b) is selected from the polyol ( It can be produced by reacting under conditions in which a) has an excess of hydroxyl groups.

상기 핫멜트 우레탄 프리폴리머(i)를 제조할 때의, 상기 폴리이소시아네이트(b)가 갖는 이소시아네이트기와 상기 폴리올(a)이 갖는 수산기와의 당량비(이소시아네이트기/수산기)로서는, 보다 한층 우수한 박리 강도가 얻어지는 점에서, 1.1∼5의 범위인 것이 바람직하고, 1.3∼3의 범위인 것이 보다 바람직하다.When preparing the hot-melt urethane prepolymer (i), as the equivalent ratio (isocyanate group/hydroxyl group) of the isocyanate group of the polyisocyanate (b) and the hydroxyl group of the polyol (a), a more excellent peel strength is obtained. Here, it is preferable that it is a range of 1.1-5, and it is more preferable that it is a range of 1.3-3.

이상의 방법에 따라 얻어진 핫멜트 우레탄 프리폴리머(i)의 이소시아네이트기 함유율(이하, 「NCO%」라고 약기함)로서는, 보다 한층 우수한 박리 강도가 얻어지는 점에서, 1.5∼10의 범위인 것이 바람직하고, 3∼8의 범위가 보다 바람직하다. 또한, 상기 핫멜트 우레탄 프리폴리머의 NCO%는, JISK1603-1:2007에 준거하여, 전위차 적정법에 의해 측정한 값을 나타낸다.The isocyanate group content (hereinafter abbreviated as "NCO%") of the hot-melt urethane prepolymer (i) obtained by the above method is preferably in the range of 1.5 to 10 from the viewpoint of obtaining a more excellent peel strength, and 3 to The range of 8 is more preferable. In addition, the NCO% of the hot-melt urethane prepolymer represents a value measured by a potential difference titration method in accordance with JISK1603-1:2007.

본 발명의 습기 경화형 폴리우레탄 핫멜트 수지 조성물은, 상기 핫멜트 우레탄 프리폴리머(i)를 필수 성분으로서 함유하지만, 필요에 따라 그 밖의 첨가제를 함유해도 된다.The moisture-curable polyurethane hot-melt resin composition of the present invention contains the hot-melt urethane prepolymer (i) as an essential component, but may contain other additives as necessary.

상기 그 밖의 첨가제로서는, 예를 들면, 경화 촉매, 산화 방지제, 점착 부여제, 가소제, 안정제, 충전재, 염료, 안료, 형광 증백제, 실란커플링제, 왁스, 열가소성 수지 등을 사용할 수 있다. 이들 첨가제는 단독으로 사용해도 2종 이상을 병용해도 된다.As the other additives, for example, curing catalysts, antioxidants, tackifiers, plasticizers, stabilizers, fillers, dyes, pigments, optical brighteners, silane coupling agents, waxes, thermoplastic resins, and the like can be used. These additives may be used alone or in combination of two or more.

다음으로, 본 발명의 적층체에 대해서 설명한다.Next, the laminate of the present invention will be described.

상기 적층체는, 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물의 경화물층, 및 수지 필름 또는 섬유 기재가 순차 적층된 것이다. 또한, 상기 적층체는, 수지 필름과 섬유 기재가, 습기 경화형 폴리우레탄 핫멜트 수지 조성물에 의해 첩합(貼合)되어 있어도 된다.The laminate is one in which a cured product layer of the moisture-curable polyurethane hot-melt resin composition and a resin film or a fiber substrate are sequentially laminated. Moreover, in the said laminated body, a resin film and a fiber base material may be bonded together by a moisture-curable polyurethane hot-melt resin composition.

상기 수지 필름으로서는, 폴리에틸렌테레프탈레이트, 폴리에틸렌나프탈레이트, 폴리부틸렌테레프탈레이트 등의 폴리에스테르, 올레핀 수지, 폴리아크릴레이트, 폴리염화비닐, 폴리에틸렌, 폴리프로필렌에틸렌비닐알코올, 폴리우레탄 수지, 폴리아미드 수지, 폴리이미드 수지, 불소 수지 등을 원료로 한 것을 사용할 수 있다. 이들 중에서도, 투습 용도로 최근 이용이 높아지고 있는 열가소성 우레탄 수지(TPU) 등의 우레탄 수지 필름, 불소 수지 필름, 올레핀 수지 필름 등을 사용했을 경우에도, 본 발명의 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 사용함으로써, 우수한 접착 강도를 얻을 수 있다.As the resin film, polyester such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate, olefin resin, polyacrylate, polyvinyl chloride, polyethylene, polypropylene ethylene vinyl alcohol, polyurethane resin, polyamide resin, What made a polyimide resin, a fluororesin, etc. a raw material can be used. Among these, even when a urethane resin film such as a thermoplastic urethane resin (TPU), which has recently been increasingly used for moisture permeability, a fluororesin film, an olefin resin film, etc., is used, by using the moisture-curable polyurethane hot melt resin composition of the present invention , Excellent adhesive strength can be obtained.

상기 섬유 기재로서는, 예를 들면, 폴리에스테르 섬유, 폴리에틸렌 섬유, 나일론 섬유, 아크릴 섬유, 폴리우레탄 섬유, 아세테이트 섬유, 레이온 섬유, 폴리젖산 섬유, 면, 마, 견, 양모, 글래스 파이버, 탄소 섬유, 그들 혼방 섬유 등에 의한 부직포, 직포, 편직물 등을 사용할 수 있다. 또한, 본 발명에 있어서는, 이들을 원료에 의해 제작된 섬유 기재에 공지(公知)의 방법에 따라 발수 처리된 것을 사용했을 경우에도, 우수한 접착 강도를 얻을 수 있다.As the fiber base material, for example, polyester fiber, polyethylene fiber, nylon fiber, acrylic fiber, polyurethane fiber, acetate fiber, rayon fiber, polylactic acid fiber, cotton, hemp, silk, wool, glass fiber, carbon fiber, Non-woven fabrics, woven fabrics, and knitted fabrics made of these blended fibers or the like can be used. Further, in the present invention, even when a fiber substrate made of a raw material is water-repelled according to a known method, excellent adhesive strength can be obtained.

상기 수지 필름 또는 섬유 기재 상에, 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물의 경화물층을 형성하는 방법으로서는, 예를 들면, 상기 수지 필름 또는 섬유 기재 상에, 예를 들면, 50∼130℃에서 용융된 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 도공하는 방법; 이형지(離型紙) 상에, 예를 들면, 50∼130℃에서 용융된 상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 도공하고, 그 후, 이 경화물층을 상기 수지 필름 또는 섬유 기재에 첩합하는 방법 등을 들 수 있다.As a method of forming a cured product layer of the moisture-curable polyurethane hot melt resin composition on the resin film or fiber substrate, for example, melting at 50 to 130°C on the resin film or fiber substrate. A method of coating the moisture-curable polyurethane hot melt resin composition; A method of coating the moisture-curable polyurethane hot-melt resin composition melted at, for example, 50 to 130°C on a release paper, and then bonding the cured product layer to the resin film or fiber substrate, etc. Can be mentioned.

상기 어떠한 방법에 있어서도, 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 도공하는 방법으로서는, 예를 들면, 롤 코터, 나이프 코터, 스프레이 코터, 그라비아 코터, 콤마 코터, T-다이 코터, 애플리케이터 등을 사용하는 방법을 들 수 있다.In any of the above methods, as a method of coating the moisture-curable polyurethane hot melt resin composition, for example, a method of using a roll coater, a knife coater, a spray coater, a gravure coater, a comma coater, a T-die coater, an applicator, etc. Can be lifted.

상기 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 도공 후는, 공지의 방법에 따라 건조·양생할 수 있다.After coating the moisture-curable polyurethane hot melt resin composition, it can be dried and cured according to a known method.

상기 습기 경화형 우레탄 핫멜트 수지 조성물의 경화물층의 두께로서는, 예를 들면, 5∼200㎛의 범위이다.The thickness of the cured product layer of the moisture-curable urethane hot-melt resin composition is, for example, in the range of 5 to 200 μm.

[실시예][Example]

이하, 실시예를 이용하여 본 발명을 보다 상세하게 설명한다.Hereinafter, the present invention will be described in more detail using examples.

[실시예 1][Example 1]

온도계, 교반기, 불활성 가스 도입구 및 환류 냉각기를 구비한 사구 플라스크에, 폴리프로필렌글리콜(수평균 분자량; 700, 이하 「PPG700」이라고 약기함)을 100질량부를 넣고, 혼합하고, 70℃에서 감압 가열함으로써, 플라스크 내의 수분이 0.05질량% 이하가 될 때까지 탈수했다.100 parts by mass of polypropylene glycol (number average molecular weight; 700, hereinafter abbreviated as "PPG700") was added to a four-necked flask equipped with a thermometer, stirrer, inert gas inlet and reflux condenser, mixed, and heated under reduced pressure at 70°C. By doing this, it dehydrated until the moisture in a flask became 0.05 mass% or less.

그 다음에, 플라스크 내를 90℃로 냉각하고, 70℃에서 용융한 4,4'-디페닐메탄디이소시아네이트(이하 「MDI」라고 약기함)를 65.2질량부 더하고, 질소 분위기 하에서 이소시아네이트기 함유량이 일정해질 때까지 110℃에서 약 3시간 반응시킴으로써, NCO%; 5.9질량%의 핫멜트 우레탄 프리폴리머를 얻었다.Then, the flask was cooled to 90°C, and 65.2 parts by mass of 4,4′-diphenylmethane diisocyanate (hereinafter abbreviated as “MDI”) melted at 70°C was added, and the isocyanate group content was NCO% by reacting at 110° C. for about 3 hours until it becomes constant; A 5.9 mass% hot melt urethane prepolymer was obtained.

다음으로, 얻어진 우레탄 프리폴리머를 80℃에서 1시간 용융한 후, 그라비아 코터(속도; 8m/분)를 사용하여 열가소성 우레탄 수지 필름(이하 「TPU」라고 약기함) 상에, 도포량 15g/㎡가 되도록 도포했다. 그 다음에, 폴리에스테르 섬유 기재를 첩합하고, 온도 23℃, 상대 습도 65%의 조건 하에서 3시간 방치함으로써 적층체 (1)을 얻었다.Next, after melting the obtained urethane prepolymer at 80°C for 1 hour, using a gravure coater (speed: 8 m/min) on a thermoplastic urethane resin film (hereinafter abbreviated as “TPU”), the applied amount is 15 g/m 2 Applied. Then, the polyester fiber base material was bonded and left to stand for 3 hours under conditions of a temperature of 23°C and a relative humidity of 65% to obtain a laminate (1).

또한, 폴리에스테르 섬유 기재 대신에, 나일론 섬유 기재를 사용하여, 마찬가지로 적층체 (2)를 제작했다.In addition, instead of the polyester fiber base material, a nylon fiber base material was used to similarly produce the laminate (2).

[실시예 2∼5, 비교예 1∼4][Examples 2 to 5, Comparative Examples 1 to 4]

우레탄 프리폴리머(i)의 제조에 사용하는 원료의 종류 및 배합량을, 표 1∼2에 나타내는 바와 같이 변경한 것 이외는, 실시예 1과 마찬가지로 하여 습기 경화형 폴리우레탄 핫멜트 수지 조성물, 및 적층체를 얻었다.A moisture-curable polyurethane hot-melt resin composition and a laminate were obtained in the same manner as in Example 1, except that the types and blending amounts of the raw materials used in the production of the urethane prepolymer (i) were changed as shown in Tables 1-2. .

[습기 경화형 폴리우레탄 핫멜트 수지 조성물의 용융 점도의 측정 방법][Measurement Method of Melt Viscosity of Moisture Curing Polyurethane Hot Melt Resin Composition]

실시예 및 비교예에서 얻어진 습기 경화형 폴리우레탄 핫멜트 수지 조성물을 80℃ 또는 120℃에서 1시간 용융한 후에, 1ml를 샘플링하고, 콘플레이트 점도계(M·S·T 엔지니어링 가부시키가이샤제 디지털 비스코미터 「CV-1S RT 타입」, 40P 콘, 로터 회전수: 50rpm)로 (40P 콘, 로터 회전: 50rpm)로 용융 점도(80℃ 또는 120℃ 용융 점도)를 측정했다.After melting the moisture-curable polyurethane hot-melt resin composition obtained in Examples and Comparative Examples at 80°C or 120°C for 1 hour, 1 ml was sampled and a cone plate viscometer (M·S·T Engineering Co., Ltd. digital viscometer “ CV-1S RT type”, 40P cone, rotor rotation: 50 rpm), and (40P cone, rotor rotation: 50 rpm), the melt viscosity (80°C or 120°C melt viscosity) was measured.

[접착 강도의 평가 방법][Adhesion Strength Evaluation Method]

얻어진 적층체에 대하여, 텐시론(오리엔테크 가부시키가이샤제 텐시론 만능 시험기 「RTC-1210A」)을 사용하여, 크로스헤드 측도; 200㎜/분의 조건에서 박리 강도를 측정하고, 접착 강도로 했다.About the obtained laminated body, the crosshead measurement was carried out using Tenshiro (Tenshiro universal testing machine "RTC-1210A" manufactured by Orientech Co., Ltd.); The peel strength was measured under the conditions of 200 mm/min, and it was set as the adhesive strength.

「○」; 10N/inch 이상"○"; 10N/inch or more

「×」; 10N/inch 미만"X"; Less than 10N/inch

[표 1][Table 1]

Figure 112019080404167-pct00001
Figure 112019080404167-pct00001

[표 2][Table 2]

Figure 112019080404167-pct00002
Figure 112019080404167-pct00002

표 1∼2 중에 있어서의 약어는 이하의 것이다.Abbreviations in Tables 1 to 2 are as follows.

「PPG400」; 폴리프로필렌글리콜(수평균 분자량; 400)"PPG400"; Polypropylene glycol (number average molecular weight; 400)

「PEs1」; 디에틸렌글리콜, 네오펜틸글리콜, 헥산디올 및 아디프산을 반응시킨 것, 수평균 분자량; 2000, 상온에서 액상인 것"PEs1"; What made diethylene glycol, neopentyl glycol, hexanediol, and adipic acid react, and the number average molecular weight; 2000, liquid at room temperature

「PPG1000」; 폴리프로필렌글리콜(수평균 분자량; 1,000)"PPG1000"; Polypropylene glycol (number average molecular weight; 1,000)

「PPG2000」; 폴리프로필렌글리콜(수평균 분자량; 2,000)"PPG2000"; Polypropylene glycol (number average molecular weight; 2,000)

본 발명의 습기 경화형 폴리우레탄 핫멜트 수지 조성물은, 우수한 접착 강도를 갖는 것을 알 수 있었다.It was found that the moisture-curable polyurethane hot-melt resin composition of the present invention has excellent adhesive strength.

한편, 비교예 1 및 2는, 120℃ 및 80℃에 있어서의 용융 점도가 어느 것이나, 본 발명에서 규정하는 범위를 하회하는 것을 사용한 태양이지만, 접착 강도가 불충분했다.On the other hand, in Comparative Examples 1 and 2, both of the melt viscosity at 120°C and 80°C were used, which were less than the range specified in the present invention, but the adhesive strength was insufficient.

비교예 3 및 4는, 120℃ 및 80℃에 있어서의 용융 점도가 어느 것이나, 본 발명에서 규정하는 범위를 초과하는 것을 사용한 태양이지만, 접착 강도가 불충분했다.In Comparative Examples 3 and 4, both of the melt viscosity at 120°C and 80°C were used which exceeded the range specified in the present invention, but the adhesive strength was insufficient.

Claims (12)

120℃에 있어서의 용융 점도가 160∼600mPa·s의 범위이며, 또한, 80℃에 있어서의 용융 점도가 850∼6,000mPa·s의 범위이며, 상기 80℃에 있어서의 용융 점도와, 120℃에 있어서의 용융 점도와의 비[80℃에 있어서의 용융 점도/120℃에 있어서의 용융 점도]가, 7∼9.5의 범위인 것을 특징으로 하는 습기 경화형 폴리우레탄 핫멜트 수지 조성물.The melt viscosity at 120°C is in the range of 160 to 600 mPa·s, and the melt viscosity at 80°C is in the range of 850 to 6,000 mPa·s, and the melt viscosity at 80°C is in the range of 120°C. The moisture-curable polyurethane hot-melt resin composition characterized in that the ratio [melt viscosity at 80°C/melt viscosity at 120°C] is in the range of 7 to 9.5. 삭제delete 제1항에 있어서,
폴리올(a)과 폴리이소시아네이트(b)와의 반응물이며, 이소시아네이트기를 갖는 우레탄 프리폴리머(i)를 함유하는 것인 습기 경화형 폴리우레탄 핫멜트 수지 조성물.
The method of claim 1,
A moisture-curable polyurethane hot-melt resin composition comprising a urethane prepolymer (i) which is a reaction product of a polyol (a) and a polyisocyanate (b) and has an isocyanate group.
제3항에 있어서,
상기 폴리올(a)이, 수평균 분자량이 1,000 미만인 폴리올(a-1) 단독, 또는, 수평균 분자량이 1,000 미만인 폴리올(a-1)과 1,000 이상인 폴리올(a-2)을 병용한 것인 습기 경화형 폴리우레탄 핫멜트 수지 조성물.
The method of claim 3,
Moisture wherein the polyol (a) is a polyol (a-1) having a number average molecular weight of less than 1,000, or a combination of a polyol (a-1) having a number average molecular weight of less than 1,000 and a polyol (a-2) having a number average molecular weight of 1,000 or more Curable polyurethane hot melt resin composition.
제3항에 있어서,
상기 폴리올(a)이, 폴리에테르폴리올을 50질량% 이상 함유하는 것인 습기 경화형 폴리우레탄 핫멜트 수지 조성물.
The method of claim 3,
The moisture curable polyurethane hot melt resin composition, wherein the polyol (a) contains 50% by mass or more of a polyether polyol.
제5항에 있어서,
상기 폴리에테르폴리올이, 폴리프로필렌글리콜인 습기 경화형 폴리우레탄 핫멜트 수지 조성물.
The method of claim 5,
The polyether polyol is a moisture-curable polyurethane hot melt resin composition in which polypropylene glycol.
제3항에 있어서,
상기 우레탄 프리폴리머(i)의 원료인 폴리이소시아네이트(b)의 사용량이, 폴리올(a)과 폴리이소시아네이트(b)와의 합계 100질량부에 대하여, 35∼49질량부의 범위인 습기 경화형 폴리우레탄 핫멜트 수지 조성물.
The method of claim 3,
Moisture-curable polyurethane hot-melt resin composition in which the amount of polyisocyanate (b) as a raw material for the urethane prepolymer (i) is in the range of 35 to 49 parts by mass based on 100 parts by mass of the total of the polyol (a) and the polyisocyanate (b) .
제3항에 있어서,
상기 폴리이소시아네이트(b)가, 디페닐메탄디이소시아네이트인 습기 경화형 폴리우레탄 핫멜트 수지 조성물.
The method of claim 3,
The polyisocyanate (b) is a moisture-curable polyurethane hot melt resin composition, wherein the polyisocyanate (b) is diphenylmethane diisocyanate.
제1항에 기재된 습기 경화형 폴리우레탄 핫멜트 수지 조성물의 경화물층과, 수지 필름 또는 섬유 기재(基材)가 순차 적층되어 있는 것을 특징으로 하는 적층체.A laminate comprising: a cured product layer of the moisture-curable polyurethane hot-melt resin composition according to claim 1, and a resin film or a fibrous substrate are sequentially laminated. 제9항에 있어서,
상기 섬유 기재가, 발수(撥水) 처리된 것인 적층체.
The method of claim 9,
A laminate in which the fibrous substrate has been subjected to a water repellent treatment.
제9항에 있어서,
수지 필름이, 불소 수지, 우레탄 수지, 또는 올레핀 수지에 의해 형성된 것인 적층체.
The method of claim 9,
A laminate in which the resin film is formed of a fluororesin, a urethane resin, or an olefin resin.
제9항에 있어서,
상기 수지 필름이, 열가소성 우레탄 수지인 적층체.
The method of claim 9,
The laminated body wherein the resin film is a thermoplastic urethane resin.
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WO2021054129A1 (en) * 2019-09-20 2021-03-25 Dic株式会社 Moisture-curable polyurethane resin composition, adhesive, and laminate
JP6981578B2 (en) * 2019-09-20 2021-12-15 Dic株式会社 Moisture-curable polyurethane resin composition, adhesive, and laminate
KR102499148B1 (en) * 2019-12-02 2023-02-14 주식회사 삼양사 Isocyanate prepolymer, polyurethane prepared by using the same, and adhesive comprising the polyurethane
CN111409336A (en) * 2020-04-06 2020-07-14 河南功能高分子膜材料创新中心有限公司 Composite waterproof membrane and preparation method thereof
CN113185943B (en) * 2021-04-15 2022-12-20 上海抚佳精细化工有限公司 Polyurethane hot melt adhesive and preparation method and application thereof
WO2024095530A1 (en) * 2022-11-01 2024-05-10 Dic株式会社 Moisture-curable polyurethane hot melt resin composition, adhesive, and synthetic leather

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010235767A (en) * 2009-03-31 2010-10-21 Aica Kogyo Co Ltd Moisture-curable reactive hot-melt adhesive
KR101299975B1 (en) 2007-07-19 2013-08-27 디아이씨 가부시끼가이샤 Moisture-curable polyurethane hot-melt adhesive, laminates made with the same, and moisture-permeable film
JP2016204541A (en) 2015-04-24 2016-12-08 積水フーラー株式会社 Moisture-curable hot melt adhesive
WO2017038195A1 (en) 2015-09-02 2017-03-09 Dic株式会社 Moisture curable hot melt urethane composition, method for producing cured foam of same, synthetic leather and method for producing synthetic leather

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246832A (en) 2001-12-21 2003-09-05 Mitsubishi Heavy Ind Ltd Moisture-permeable polyurethane, moisture-permeable molded product and moisture-permeable tube
EP1873177B1 (en) * 2005-04-22 2010-10-20 Asahi Glass Company, Limited Isocyanate-terminated urethane prepolymer, process for producing the same, and adhesive comprising the urethane prepolymer
JP2006348232A (en) * 2005-06-20 2006-12-28 Sekisui Chem Co Ltd Polyurethane adhesive and method for producing laminated optical medium
US7641968B2 (en) * 2006-12-01 2010-01-05 Dic Corporation Moisture-curable polyurethane hot melt adhesive and multilayer sheet using the same
EP1975187A1 (en) * 2007-03-28 2008-10-01 Sika Technology AG Method for manufacturing polyurethane compounds with low isocyanate-monomer content
TWI534165B (en) * 2011-10-24 2016-05-21 迪愛生股份有限公司 Moisture-curable polyurethane hot-melt resin composition, adhesive and article
CN104245769B (en) * 2012-04-12 2016-08-17 Dic株式会社 Moisture-curable polyurethane hot-melt resin combination, bonding agent and article
JPWO2015016029A1 (en) * 2013-07-31 2017-03-02 Dic株式会社 Moisture curable hot melt urethane composition and adhesive
WO2015056478A1 (en) * 2013-10-15 2015-04-23 Dic株式会社 Resin composition
CN104449537B (en) * 2014-11-26 2017-02-22 上海天洋热熔粘接材料股份有限公司 PTMG (polyoxytetramethylene glycol) modifying moisture curing polyurethane melt adhesive and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101299975B1 (en) 2007-07-19 2013-08-27 디아이씨 가부시끼가이샤 Moisture-curable polyurethane hot-melt adhesive, laminates made with the same, and moisture-permeable film
JP2010235767A (en) * 2009-03-31 2010-10-21 Aica Kogyo Co Ltd Moisture-curable reactive hot-melt adhesive
JP2016204541A (en) 2015-04-24 2016-12-08 積水フーラー株式会社 Moisture-curable hot melt adhesive
WO2017038195A1 (en) 2015-09-02 2017-03-09 Dic株式会社 Moisture curable hot melt urethane composition, method for producing cured foam of same, synthetic leather and method for producing synthetic leather

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