KR102219897B1 - An input-output terminal disconnected industrial computer main-board in non-cable type and an industrial computer using the same - Google Patents

Abstract

A non-cable type industrial computer main board with separate input/output terminals is a main board in which a plurality of circuits are implemented inside, a CPU socket part mounted on the front part of the main board and accommodating a central processing unit module, and the front side of the main board A chipset unit mounted on the unit, in which the north bridge and the south bridge are integrally implemented, an SSD storage connector mounted on the rear side of the main board and accommodating a solid state disk (SSD), and mounted on the rear side of the main board, A wireless communication connector accommodating a wireless communication module, a memory socket unit mounted on the rear side of the main board and accommodating a memory, and formed of a high thermal conductivity material having a predetermined thickness on the rear side of the main board to prevent the emission of electromagnetic waves. A heat dissipation plate part that shields and radiates heat from the entire main substrate, a PCIe slot for video that is formed on one side of the main substrate and includes a plurality of finger strips, and a plurality of fingers that are formed on the other side of the main substrate It includes a strip, and includes an input/output power slot for transmitting signals connected to a plurality of input/output devices and receiving power from an external device.

Description

Non-cable type industrial computer main board with separate input/output terminal and industrial computer using the same {AN INPUT-OUTPUT TERMINAL DISCONNECTED INDUSTRIAL COMPUTER MAIN-BOARD IN NON-CABLE TYPE AND AN INDUSTRIAL COMPUTER USING THE SAME}

The present invention relates to a non-cable type input/output terminal separated industrial computer main board and an industrial computer.

Existing desktop mainboards are manufactured in an integrated form of input and output terminals. If this is used for each industrial system, it must be customized separately. Industrial systems require a variety of types, starting with installing hundreds of USB ports and requiring more than 10 video output terminals.

It is very absurd and uneconomic to have to individually tailor the board for these input/output ports. Custom production requires a lot of cost of about 200 million won and development time of about 6 months.

In addition, a number of cables, including power supply wiring, are connected inside a general PC. This interferes with the gas flow inside, may cause malfunctions during assembly, and may cause various failures. In addition, the heat dissipation problem and electromagnetic wave problem have always been raised in the existing all-person system, and a solution to this problem is also needed.

The present invention is to solve the above problems, to minimize cable connection and provide a non-cable type input/output terminal-separated industrial computer mainboard and industrial computer with separated input/output terminals.

In order to solve these problems, the industrial computer main board of a non-cable type input/output terminal provided by the present invention is a main board in which a plurality of circuits are implemented, and is mounted on the front side of the main board, and includes a central processing unit module. A CPU socket unit to accommodate, a chipset unit mounted on the front side of the main board and integrated with a north bridge and a south bridge, and an SSD storage mounted on the rear side of the main board and accommodating a solid state disk (SSD) A connector, a wireless communication connector mounted on the rear side of the main board and accommodating a wireless communication module, a memory socket part mounted on the rear side of the main board and accommodating a memory, and having a predetermined thickness on the rear side of the main board A heat dissipation plate part formed of a high thermal conductivity material to shield the emission of electromagnetic waves and radiate heat from the entire main substrate, a PCIe slot for video including a plurality of finger strips and formed on one side of the main substrate, and the It is formed on the other side of the main substrate, includes a plurality of finger strips, and includes an input/output power slot for transmitting signals connected to a plurality of input/output devices, and receiving power from the outside.

In an embodiment, the input/output power slot may include an input/output terminal strip area and a power supply strip area.

In one embodiment, heat dissipation that is located in a region corresponding to the CPU socket on the rear surface of the main substrate and radiates heat generated by the central processing unit module from the rear surface of the main substrate to realize bidirectional heat dissipation. It may be characterized in that the module is further included.

In one embodiment, the input/output terminal strip region of the input/output power slot includes a video terminal, an HD audio terminal, a USB terminal, and a SATA terminal, and the power supply strip region includes a DC power supply terminal, a power on/off switching It may be characterized by including a terminal, a reset terminal, and a status terminal.

In one embodiment, the input/output power slot may be formed according to the PCIe standard.

In addition, in order to solve the present problem, the industrial computer provided by the present invention supplies a computer housing, a central processing unit, and a central processing unit module including a heat sink for the central processing unit, a computer main board, and DC power to the computer main board. And an input/output subboard including an external power supply device and at least one input/output port.

The computer main board, a main board in which a plurality of circuits are embodied therein, is mounted on the front side of the main board, a CPU socket part accommodating the central processing unit module, and mounted on the front side of the main board, A chip set unit in which the north bridge and the south bridge are integrated, mounted on the rear side of the main board, an SSD storage connector that accommodates a solid state disk (SSD), and mounted on the rear side of the main board, and accommodates a module for wireless communication A wireless communication connector mounted on the rear side of the main board, a memory socket unit accommodating a memory, and formed of a high thermal conductivity material having a predetermined thickness on the rear side of the main board to shield the emission of electromagnetic waves, and A heat dissipation plate portion for dissipating heat from the entire substrate, a PCIe slot for video including a plurality of finger strips, formed on one side of the main substrate, and a plurality of finger strips formed on the other side of the main substrate And an input/output power slot for transmitting signals connected to a plurality of input/output devices and receiving power from an external device.

The input/output power slot includes an input/output terminal strip area and a power supply strip area, the external power supply device is connected to the power supply strip area to supply DC power to the computer main board, and the input/output terminal strip area and the The input/output sub-board is electrically connected, and terminals for input/output devices are connected to the main board.

In one embodiment, heat dissipation that is located in a region corresponding to the CPU socket on the rear surface of the main substrate and radiates heat generated by the central processing unit module from the rear surface of the main substrate to realize bidirectional heat dissipation. It may be characterized in that the module is further included.

In one embodiment, the input/output terminal strip area of the input/output power slot includes a video terminal, an HD audio terminal, a USB terminal, and a SATA terminal, and the power supply strip area includes a DC power supply terminal, a power on/off switch terminal, A reset terminal and a status terminal may be included, and the input/output power slot may be formed according to the PCIe standard.

According to the computer main board of the present invention, a customized system can be manufactured by separately designing only an input/output board compared to a method of manufacturing a conventional industrial computer main board, so that a customized system can be constructed in a much cheaper way.

In addition, when a desktop computer is manufactured with the same specifications, a computer can be made up to 16 times smaller than the existing size.

In addition, since the heat dissipation device can be applied to both sides, and the heat dissipation plate disposed on the rear side radiates the entire substrate, heat generation can be reduced by up to 30% compared to a conventional computer system.

In addition, since the connection for the main board and the input/output terminals and the connection for power can all be connected through slots, the all-in-one system can be manufactured as an assembly type without cable connection.

In addition, the computer can be configured with fewer components and fewer fans than current computer systems, reducing noise by at least 30%.

1 is a conceptual diagram of an industrial computer main board according to an embodiment of the present invention.
2 is a plan view of an industrial computer main board according to the embodiment of FIG. 1.
3 is a rear view of the industrial computer main board according to the embodiment of FIG. 1.
4A to 4C are conceptual diagrams of an industrial computer according to another embodiment of the present invention.

Hereinafter, embodiments disclosed in the present specification will be described with reference to the accompanying drawings.

In particular, even if there is no reference numeral, elements that can be inferred from the description in the specification may be interpreted according to the content described literally.

Even a word used at the level of a person skilled in the art may not accurately reflect an actual function and role, and thus may be used incorrectly. In this case, it is in principle to be interpreted according to the intention of the inventor by analogy based on the unified contents in the specification, and it is not necessary to be interpreted only limited to the limitation of the text itself, and according to the interpretation of the name or function, etc. Should be judged more flexibly by referring to the overall contents.

The embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but identical or similar components are denoted by the same reference numerals regardless of the reference numerals, and redundant descriptions thereof will be omitted.

The suffixes "module" and "unit" for components used in the following description are given or used interchangeably in consideration of only the ease of preparation of the specification, and do not have meanings or roles that are distinguished from each other by themselves. In addition, in describing the embodiments disclosed in the present specification, when it is determined that a detailed description of related known technologies may obscure the subject matter of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are for easy understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the accompanying drawings, and all modifications included in the spirit and scope of the present invention It should be understood to include equivalents or substitutes.

When a component is referred to as being "connected" or "connected" to another component, it is understood that it may be directly connected or connected to the other component, but other components may exist in the middle. Should be. On the other hand, when a component is referred to as being "directly connected" or "directly connected" to another component, it should be understood that there is no other component in the middle.

Singular expressions include plural expressions unless the context clearly indicates otherwise. In addition, throughout the specification of the present application, when a certain part "includes" a certain component, it means that other components may be further included rather than excluding other components unless otherwise stated.

It is apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the essential features of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same reference numerals refer to the same elements.

System concept

1 is a conceptual diagram of a system to which an industrial computer main board is applied according to an embodiment of the present invention.

1, a system to which an industrial computer main board 100 according to an embodiment of the present invention is applied is composed of a central processing unit (CPU) and a chipset unit 130, and a central processing unit (CPU) and a chip The set unit 130 is connected via a direct media interface (DMI).

DMI 3.0 can be applied, and 8GT/s transmission rate per lane is allowed, and a total of 4 lanes, CPU-PCH link can have a data transmission rate of 3.93 GB/s. Various concepts of DMI may be applied according to the type of CPU, and as long as an interface responsible for data transmission between the central processing unit and the chipset 130 is applied, it is not limited to DMI 3.0 and is not used.

The chipset unit 130 may be applied in various forms depending on the supplier of the central processing unit (CPU). Typically, it is used in a form that includes both the North Bridge and the South Bridge, and can be used as a Platform Controller Hub (PCH) produced by Intel. It can be formed as a separate chip as long as it includes the north bridge and the south bridge, and other implementations can be included.

The central processing unit (CPU) is connected to a memory on the industrial computer main board 100. In addition, the chipset unit 130 including the south bridge and the north bridge includes a data storage device (Storage HDD, SSD), a wireless device, a BIOS, and a nonvolatile storage device (Bios / Firmware) in which ROM). All of these devices are formed by being mounted on the industrial computer main board 100.

In particular, even if only a memory, a storage device and a wireless communication device are included, an industrial computer can be driven with minimal functions, and additionally necessary equipment in addition to these basic peripheral devices can be designed using a separate sub-board as necessary. have.

The central processing unit (CPU) and the video card are connected through the PCIe slot 170 for video. In this case, they are connected by a slot including a plurality of finger strips formed in the PCI Express 3.0 x 16 standard. The video PCIe slot 170 may be formed of a golden finger strip.

Other HDMI, DisplayPort, VGA video output terminals, USB terminals connected to various devices, HD audio terminals connected to audio devices, SATA terminals connected to Serial AT Attachment (SATA), and network connectors include a plurality of finger strips. It is connected by the input/output power slot 180. The input/output power slot 180 may be formed of a golden finger strip.

Each of the external terminals can be formed according to various standards. HDMI 2.0 terminal, USB 2.0 or USB 3.0 terminal, SATA2 or SATA3 terminal, etc. are formed in various standards and versions.

Configuration of the main board

2 is a plan view of an industrial computer main board according to the embodiment of FIG. 1. 3 is a rear view of the industrial computer main board according to the embodiment of FIG. 1.

2 and 3, the industrial computer main board 100 according to the embodiment of FIG. 1 is formed of one main substrate 110a and 110b. Here, for convenience in referring to the main substrate, reference numerals divided into the front portion 110a and the rear portion 110b of the main substrate are assigned. The main substrates 110a and 110b have a size of about 150 to 160 cm in width and about 110 to 120 cm in height with reference to FIGS. 2 and 3, and have the size of a general postcard. If the external power supply is designed in the form of an adapter, the body can be made into any desired size and shape.

The main substrates 110a and 110b have a plurality of circuits implemented therein and include a front portion 110a and a rear portion 110b. In the front part 110a, a CPU socket part 120 for accommodating a central processing unit module, a chipset part 130 in which a north bridge and a south bridge are integrated, and an HDD storage connector 160 which is a socket for receiving a hard drive. Includes.

If HDD storage is used by connecting the HDD storage connector 160, a 2.5-inch HDD may be installed above the chipset 120.

An SSD storage connector 151 for receiving a solid state disk (SSD), a wireless communication connector 153 for receiving a module for wireless communication, and a memory socket 140 for receiving a memory are formed on the rear part 110b of the main board. .

In particular, since the memory socket unit 140 is installed on the rear portion 110b of the main substrate, the sizes of the main substrates 110a and 110b of the present embodiment may be further reduced. In a typical main board, almost all chipsets or sockets are mounted on the front side. Accordingly, in order to reduce the minimum size or more, a certain limit occurs. However, by forming the memory socket unit 140 on the rear surface, the size can be further reduced to a smaller size.

The SSD storage connector 151 is applied in the form of an m.2 module. In particular, an interface to which PCIe 3.0 is applied can be used. In addition, it supports NVMe and can be connected to SSD storage.

In addition, the wireless communication connector is applied in the form of an m.2 module and is connected to the wireless communication device. As described above, when connected to the wireless communication device, since one independent industrial computer can communicate with the outside, it is possible to perform functions without further needing other separate input/output devices. Therefore, the main board 100 is manufactured by accommodating only the minimum necessary functions.

A heat dissipation plate part 190 is provided on the rear part 110b of the main substrate, formed of a high thermally conductive material having a predetermined thickness, shields the emission of electromagnetic waves, and radiates heat from the entire main substrate. The heat dissipation plate part 190 can take charge of heat dissipation of the entire main board PCB, so that more effective heat dissipation is possible, and in general, the most electromagnetic waves are generated from the central processing unit, and the electromagnetic waves emitted from the heat dissipation plate part 190 The effect of shielding a large part of

Each of the main substrates 110a and 110b includes a PCIe slot 170 for video and an input/output power slot 180. The video PCIe slot 170 is formed by including a plurality of finger strips made of metal. The metal material may be formed of gold, for example.

Similar to the shape of the PCIe slot 170 for video, the input/output power slot 180 may also be formed according to the PCIe standard. The input/output power slot 180 is divided into an input/output terminal strip area 185 and a power supply strip area 183. The input/output terminal strip area 185 transmits signals connected to a plurality of input/output devices, and the power supply strip area 183 receives external power and supplies it to the main board 100.

The input/output terminal strip area 185 includes a video terminal, an HD audio terminal, a USB terminal, and a SATA terminal. Specifically, HDMI 2.0, DisplayPort, and VGA terminals are included, and can be connected to numerous peripheral devices and sensors through USB 2.0 or 3.0 terminals. It can be connected to additional data storage or optical reader through SATA 2.0 or 3.0 terminal.

The power supply strip region 183 may include a DC power supply terminal, a power on/off switching terminal, a reset terminal, and a status terminal.

By configuring the input/output port through the input/output power slot 180 without directly including the input/output port in the main board 100, it is possible to leave room for various design changes. As described above, if a system requiring about 100 USB 2.0 ports is required, it is only necessary to manufacture this as a separate dedicated board and connect it through the main board 100 and the input/output power slot 180.

In addition, it is located in the area corresponding to the CPU socket part 120 on the rear part 110b of the main board, and radiates heat generated by the central processing unit module from the rear part of the main board, thereby realizing bidirectional heat dissipation. A module 195 may be further included.

Industrial computer application

4A and 4B are conceptual diagrams of an industrial computer according to another embodiment of the present invention.

Referring to FIG. 4A, the industrial computer 1000 includes a housing 400 for a computer, a central processing unit module 300 including a central processing unit and a heat sink for the central processing unit, a computer main board 100, and the computer main board. And an external power supply device 500 for supplying DC power to and an input/output subboard 200 including at least one input/output port.

The configuration of the computer main board 100 is substantially the same as described in the embodiments of FIGS. 1 to 3. Accordingly, redundant descriptions are omitted, but reference numerals used for repeated description refer to those used in FIGS. 1 to 3 repeatedly. Using the same name and the same reference numeral refers to the same sub-element.

The computer main board 100 is connected through the input/output subboard 200 and the input/output power slot 180. Power from a separate external power supply device 500 may be supplied through the input/output sub-board 200 and may be connected to an external device through an HDMI terminal or a USB terminal. The main body can be configured with a minimum size, and additional functions can be added accordingly.

Referring to FIG. 4B, it can be seen that the input/output sub-board 200 includes substantially the same components as the embodiment of FIG. 4A, but the input/output sub-board 200 has a different configuration. The input/output sub-board 200 is connected to 48 USB ports 210. As can be seen in the example in an industrial computer that needs to control individual sensors or peripheral devices, it is possible to customize and configure the input/output terminals of the required configuration.

In addition, as in the embodiment illustrated in FIG. 4C, the input/output sub-board 200 may be configured to include both a plurality of USB ports 210 and a plurality of COM ports 220.

The present invention is not limited by the above-described embodiments and the accompanying drawings. It will be apparent to those of ordinary skill in the art to which the present invention pertains, that components according to the present invention can be substituted, modified, and changed within the scope of the technical spirit of the present invention.

100: main board
110a, 110b: front and rear of the main board
120: CPU socket part
130: chipset part
140: memory socket part
151, 153: SSD storage connector, wireless communication connector
160: HHD storage connector
170: PCIe slot for video
180: input/output power slot
200: I/O sub board
300: central processing unit module
400: computer housing
500: external power supply

Claims (8)

A main board having a plurality of circuits implemented therein;
A CPU socket unit mounted on the front side of the main substrate and accommodating a central processing unit module;
A chipset unit mounted on the front side of the main substrate and integrally implemented with a north bridge and a south bridge;
An SSD storage connector mounted on a rear surface of the main substrate and receiving a solid state disk (SSD);
A wireless communication connector mounted on the rear side of the main board and accommodating a wireless communication module;
A memory socket unit mounted on a rear surface of the main substrate and accommodating a memory;
A heat dissipating plate part formed of a high thermally conductive material having a predetermined thickness on the rear surface of the main substrate, shielding the emission of electromagnetic waves, and discharging heat of the entire main substrate;
A video PCIe slot formed on one side of the main substrate and including a plurality of finger strips; And
And an input/output power slot formed on the other side of the main substrate, including a plurality of finger strips, transmitting signals connected to a plurality of input/output devices, and receiving power from the outside; and
The heat dissipation module further comprises a heat dissipation module located on the rear part of the main board in an area corresponding to the CPU socket part and dissipating heat generated by the central processing unit module from the rear part of the main board to realize bidirectional heat dissipation. Non-cable type industrial computer mainboard with separate input/output terminals.
The method of claim 1,
The input/output power slot is
A non-cable type input/output terminal separated industrial computer mainboard, comprising: an input/output terminal strip area and a power supply strip area.
delete The method of claim 2,
The input/output terminal strip area of the input/output power slot,
Including video terminal, HD audio terminal, USB terminal, SATA terminal,
The power supply strip region,
DC power supply terminal, power on/off switching terminal, reset terminal, non-cable input/output terminal separate type industrial computer mainboard, characterized in that it comprises a status terminal.
The method of claim 1,
The input/output power slot is a non-cable type input/output terminal detachable industrial computer mainboard, characterized in that formed according to the PCIe standard.
Computer housing;
A central processing unit module including a central processing unit and a heat sink for the central processing unit;
Computer main board;
An external power supply for supplying DC power to the computer main board; And
Including; an input/output sub-board including at least one input/output port,

The computer main board,
A main board having a plurality of circuits implemented therein;
A CPU socket unit mounted on the front side of the main substrate and accommodating the central processing unit module;
A chipset unit mounted on the front side of the main substrate and integrally implemented with a north bridge and a south bridge;
An SSD storage connector mounted on a rear surface of the main substrate and receiving a solid state disk (SSD);
A wireless communication connector mounted on the rear surface of the main board and accommodating a wireless communication module;
A memory socket unit mounted on a rear surface of the main substrate and accommodating a memory;
A heat dissipating plate part formed of a high thermally conductive material having a predetermined thickness on the rear surface of the main substrate, shielding the emission of electromagnetic waves, and discharging heat of the entire main substrate;
A video PCIe slot formed on one side of the main substrate and including a plurality of finger strips; And
An input/output power slot formed on the other side of the main substrate, including a plurality of finger strips, transmitting signals connected to a plurality of input/output devices, and receiving power from the outside; and

The input/output power slot includes an input/output terminal strip area and a power supply strip area,
The external power supply is connected to the power supply strip region to supply DC power to the computer main board,
The input/output terminal strip region and the input/output subboard are electrically connected to each other to connect a terminal for an input/output device to the main board,

The heat dissipation module further comprises a heat dissipation module located on the rear part of the main board in a region corresponding to the CPU socket part, and radiating heat generated by the central processing unit module from the rear part of the main board to realize bidirectional heat dissipation Industrial computer characterized by.

delete The method of claim 6,
The input/output terminal strip area of the input/output power slot includes a video terminal, an HD audio terminal, a USB terminal, and a SATA terminal,
The power supply strip region is characterized by including a DC power supply terminal, a power on/off switch terminal, a reset terminal, and a status terminal,
The input/output power slot is an industrial computer, characterized in that formed according to the PCIe standard.

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