KR102213887B1 - Apparatus and method for transferring wafer using roller - Google Patents

Abstract

A wafer transfer device using a roller according to an embodiment of the present invention is a wafer transfer device using a roller that transfers a transfer object composed of integrated circuit elements of a sawed wafer, and an adhesive is applied to the transfer object and the upper part. A transfer unit for transferring the first substrate and the roller having an adhesive layer on the surface thereof to a rolling position or another position, respectively; And an attachment process in which the transfer object is attached to the adhesive layer by rolling the transfer object at the rolling position, and the transfer process in which the transfer object is transferred to the upper part of the first substrate by rolling the upper part of the first substrate while the transfer object is attached to the adhesive layer. It characterized in that it includes; rollers for performing each.

Description

Apparatus and method for transferring wafer using roller

The present invention relates to a wafer transfer apparatus and method using a roller, and more particularly, to a wafer transfer apparatus and method for transferring each integrated circuit element of a sawed wafer to a substrate using a roller.

The semiconductor manufacturing process is divided into a front-end process of forming an integrated circuit on a wafer W and a back-end process of performing a semiconductor packaging process.

At this time, the semiconductor packaging process refers to a process of connecting signals between the integrated circuit device (IC) cut out of the integrated circuit formed through the entire process and the main PCB, and packaging the integrated circuit device so that it can be protected from external moisture or impurities. .

These semiconductor packaging processes include (1) a back grinding process that thinly grinds the rear surface of the wafer processed in the previous process, and (2) a net die of the wafer (hereinafter referred to as “Integrated Circuit Device (IC )”), (3) attaching the cut integrated circuit device to a substrate (S), and (4) attaching a wire to the integrated circuit device. Bonding process that connects electrically, (5) Molding process that wraps the substrate on which the integrated circuit device is mounted with EMC material, and (6) cuts into individual semiconductor packages so that they can be mounted on modules/boards/cards. Each includes a package sawing process.

In particular, in the conventional bonding process, a process of attaching each integrated circuit device of a sawed wafer to a substrate was performed. That is, in the conventional bonding process, the integrated circuit device is individually moved to the first substrate S1 (eg, PCB, etc.) using a robot arm or the like, that is, transferred.

Accordingly, in the conventional bonding process, not only it takes a lot of time, but also there is a problem that the manufacturing cost is inevitably increased as a complex device for precise control such as a robot arm for transfer must be provided.

In order to solve the problems of the prior art as described above, the present invention provides a wafer transfer device and method capable of transferring each integrated circuit element of a sawed wafer to a substrate at once using a roller. There is this.

A wafer transfer apparatus using a roller according to an embodiment of the present invention for solving the above problems is a wafer transfer apparatus using a roller for transferring a transfer object made of integrated circuit elements of a sawed wafer. , (1) a transfer unit that transfers the transfer object, the first substrate coated with the adhesive on the top, and the roller with the adhesive layer on the surface to a rolling position or another position, and (2) the transfer object by rolling the transfer object at the rolling position. And a roller for performing an attaching step of attaching to the adhesive layer and a transfer step of rolling an upper portion of the first substrate to transfer the transfer object to the upper portion of the first substrate while the object to be transferred is attached to the adhesive layer.

The wafer transfer apparatus using a roller according to an embodiment of the present invention further includes a light irradiation unit for irradiating light toward a roller having a transfer object attached to the adhesive layer, or a heat treatment unit for heating a roller having a transfer object attached to the adhesive layer. Can include.

The roller may selectively roll some of the integrated circuit devices when performing the attaching process.

When performing the attaching process, the roller may selectively roll the integrated circuit elements in one row and then rotate by a predetermined angle, and then selectively roll the integrated circuit elements in another row.

The transfer unit transfers the second substrate to a rolling position or another position and rotates the second substrate or roller by 90° with respect to the vertical axis after the first transfer process of the roller,

The roller includes (1) a first attaching process of selectively rolling the integrated circuit elements of a specific row at the rolling position to attach the integrated circuit elements to the adhesive layer for each column, and attaching the integrated circuit elements to be spaced apart from each other by columns, and (2) ) A first transfer process of rolling the upper portion of the second substrate in a rolling position with the integrated circuit elements spaced apart by column attached to the upper portion of the second substrate by rolling the upper portion of the second substrate, and (3) ) A second attaching process of selectively rolling the integrated circuit elements of a specific row in the rolling position to attach the integrated circuit elements on the second substrate to the adhesive layer by row, and attaching the integrated circuit elements so that they are spaced apart from each other, (4 ) A second transfer process of rolling the upper part of the first substrate in a rolling position with the integrated circuit elements spaced apart by column and row attached to transfer the integrated circuit elements spaced apart by column and row to the upper part of the first substrate. Each of these can be performed, and when integrated circuit elements in any one row or one row are attached to the adhesive layer during the first attachment process and the second attachment process, they can be rotated by a predetermined angle.

A wafer transfer method using a roller according to an embodiment of the present invention is a wafer transfer method for transferring a transfer object consisting of integrated circuit elements of a sawed wafer, wherein (a) a transfer unit rolls the transfer object And a roller having an adhesive layer on its surface rolls the transfer object to attach the transfer object to the adhesive layer, (b) the transfer unit places the first substrate coated with the adhesive on the top at the rolling position, and the roller is removed. Rolling an upper portion of the first substrate to transfer the transfer object attached to the adhesive layer to the upper portion of the first substrate.

The step (b) may further include a step of selectively rolling some of the integrated circuit elements by the roller.

The step (b) includes: (b1) selectively rolling the integrated circuit elements in one row by a roller, (b2) rotating the roller by a certain angle, and (b3) selecting the integrated circuit elements in another row by the roller. It may further include the step of rolling.

In the step (b), (b1) the roller selectively rolls the integrated circuit elements of a specific row at the rolling position to attach the integrated circuit elements to the adhesive layer for each row, but after attaching the integrated circuit elements of one row to the adhesive layer, Attaching the other row of integrated circuit elements to the adhesive layer after rotating the angle, (b2) positioning the second substrate at the rolling position by the transfer unit, (b3) rolling the upper portion of the second substrate at the rolling position, Transferring the integrated circuit elements spaced apart for each row attached to the adhesive layer to the top of the second substrate, (b4) rotating the second substrate or roller by 90° with respect to the vertical axis of the transfer unit, (b5) the roller In the rolling position, the integrated circuit elements of a specific row are selectively rolled to attach the integrated circuit elements on the second substrate to the adhesive layer by row, but after attaching the integrated circuit elements of one row to the adhesive layer, rotating a certain angle It may further include attaching the other row of integrated circuit devices to the adhesive layer.

The wafer transfer method using a roller according to an embodiment of the present invention may further include irradiating light toward the roller or heating the roller before step (b3) and after step (b5), respectively.

The wafer transfer apparatus and method using a roller according to an embodiment of the present invention configured as described above can transfer each integrated circuit element of a sawing-treated wafer to a substrate at once using a roller, and accordingly There is an advantage that can reduce the time and cost of the process.

1 is a view showing a wafer transfer apparatus using a roller according to an embodiment of the present invention.
2 is a view showing a wafer transfer method using a roller according to the first embodiment of the present invention.
3 is a view showing a process of performing a wafer transfer method using a roller according to the first embodiment of the present invention.
4 is a view showing a wafer transfer method using a roller according to a second embodiment of the present invention.
5 is a view showing a process in which the first process of the wafer transfer method using a roller according to the second embodiment of the present invention is performed.
6 is a view showing a process of performing a secondary process of the wafer transfer method using a roller according to the second embodiment.
7 is a view showing integrated circuit elements transferred to a first substrate as a result of performing a wafer transfer method using a roller according to a second embodiment of the present invention.

The above objects and means of the present invention, and effects thereof, will become more apparent through the following detailed description in connection with the accompanying drawings, and accordingly, a person having ordinary knowledge in the technical field to which the present invention belongs can facilitate the technical idea of the present invention. It will be possible to do it. In addition, in describing the present invention, when it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

In addition, terms used in the present specification are for describing embodiments, and are not intended to limit the present invention. In the present specification, the singular form also includes the plural form in some cases, unless specifically stated in the phrase. Terms such as "to include", "to have", "to prepare" or "have" used in the specification do not exclude the presence or addition of one or more other elements other than the mentioned elements.

In the present specification, expressions such as “or” and “at least one” may represent one of words listed together, or a combination of two or more. For example, “or B” “at least one of “and B” may include only one of A or B, and may include both A and B.

In this specification, according to expressions such as "for example," the description may not exactly match the information presented, such as a recited characteristic, variable, or value, and may not be consistent with tolerances, measurement errors, and limits of measurement accuracy. The embodiments of the invention according to various embodiments of the present invention should not be limited to effects such as modifications including other factors known as.

In the present specification, when a component is referred to as being'connected' or'connected' to another component, it may be directly connected or connected to the other component, but the other component is It should be understood that it may exist. On the other hand, when a component is referred to as being'directly connected' or'directly connected' to another component, it should be understood that there is no other component in the middle.

Unless otherwise defined, all terms used in the present specification may be used as meanings that can be commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not interpreted ideally or excessively unless clearly defined specifically.

Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a wafer transfer apparatus using a roller according to an embodiment of the present invention.

The wafer transfer apparatus using a roller according to an embodiment of the present invention may be used in a semiconductor packaging process, and in particular, may be used in a sawing process or an attaching process. At this time, the semiconductor packaging (Pakaging) process, sawing (Sawing) process, and bonding (Attaching) process has been described above in the [Technology Background of the Invention], so a detailed description thereof will be omitted below.

The wafer transfer device using a roller according to an embodiment of the present invention is a device for transferring a transfer object to the first substrate S1, and as shown in FIG. 1, the transfer unit 100, the roller 200 And it may include at least one of the light irradiation unit 300. In this case, the transfer object is the integrated circuit elements (IC) of the wafer (W) processed by sawing (sawing). In particular, the wafer transfer apparatus using a roller according to an embodiment of the present invention may transfer all integrated circuit elements IC of the sawed wafer W to the first substrate S1 at once.

The transfer unit 100 is configured to transfer the transfer object, the first substrate S1, the second substrate S2, and the roller 200, respectively. The transfer unit 100 can transfer and rotate each object at any position in the vertical, left and right. For example, the transfer unit 100 may transfer the transfer object, the first substrate S1, the second substrate S2, and the roller 200 from another position to a rolling position or from a rolling position to another position, respectively.

In this case, the rolling position means a position at which the roller 200 is rolled to the top of a specific object. That is, the rolling position need not be a specially fixed position, and the position may vary depending on the situation.

For example, the transfer unit 100 may include at least one of the first transfer device 110, the second transfer device 130, and the third transfer device 150. At this time, the first transfer device 110 may transfer the transfer object. The second transfer device 120 may transfer the first substrate S1 or the second substrate S2. The third transfer device 150 may transfer the roller 200. In addition, the transfer unit 100 may further include a first support 120 or a second support 140. At this time, the first support 120 is transferred by the first transfer device 110 and may accommodate and support the transfer object or the wafer support P at the top. In addition, the second support 140 is transported by the second transfer device 130 and may accommodate and support the first substrate S1 or the second substrate S2 thereon. On the other hand, the wafer pedestal P is a structure that seats and supports a transfer object, and a layer composed of a material or structure with high frictional force (for example, an uneven structure) is added to the upper surface so that the seated transfer object does not slip. Can include.

In addition, although not shown in FIG. 1, the transfer unit 100 may further include a fourth transfer device (not shown). At this time, the fourth transfer device may transfer the light irradiation unit 300.

The roller 200 is configured to roll in a rolling position. In particular, the roller 200 includes an adhesive layer (A) on its surface. That is, the roller 200 may roll the upper portion of the transfer object at the rolling position to attach the transfer object to the adhesive layer (A).

In addition, after attaching the transfer object to the adhesive layer (A), the roller 200 rolls the upper portion of the first substrate S1 coated with the adhesive A'at the rolling position to transfer the transfer object to the first substrate S1. Can be transferred to the top of the (transferring). In this case, the adhesive force of the adhesive A'of the first substrate S1 may be equal to or greater than the adhesive force of the adhesive layer A. This is to reduce the occurrence of separation errors, which will be described later.

In addition, after attaching the transfer object to the adhesive layer (A), the roller 200 rolls the upper portion of the second substrate (S2) at the rolling position to transfer the transfer object to the upper portion of the second substrate (S2). May be. At this time, the second substrate S2 may also include an adhesive thereon.

However, a detailed description of the transfer process by the roller 200 will be described later in the wafer transfer method using a roller.

The light irradiation unit 300 is configured to irradiate light toward the roller 200 to which the transfer object is attached to the adhesive layer A, and may be provided at a position close to the roller 200. That is, the light irradiation unit 300 may weaken the adhesive force of the adhesive layer (A) to which the transfer object is attached by irradiating light. Further, when the second substrate S2 includes an adhesive thereon, the light irradiation unit 300 may weaken the adhesive force of the adhesive of the second substrate S2 by irradiating light.

For example, the light irradiated by the light irradiation unit 300 may be ultraviolet light (UV), but is not limited thereto, and may be light of various wavelength bands (including electron beams or laser beams) in addition to ultraviolet light. In addition, the light irradiated by the light irradiation unit 300 may include all kinds of electromagnetic waves, and a Gaussian beam, a light beam, a laser beam, or a particle beam As such, it may include a beam through which particles (electrons or protons, etc.) are concentrated in one direction and flow.

The wafer transfer apparatus using a roller according to an embodiment of the present invention may further include a heat treatment unit (not shown) that heats the roller 200 having the transfer object attached to the adhesive layer (A). That is, the heat treatment unit may weaken the adhesive force of the adhesive layer (A) to which the transfer object is attached by heating the roller 200. In addition, when the second substrate S2 includes an adhesive thereon, the heat treatment unit may weaken the adhesive force of the adhesive of the second substrate S2 by heating the second substrate S2.

For example, the heat treatment unit may heat the target object by contacting the target object with a plate or a separate roller in a form having a heating wire therein, or heat the target object by discharging the heated fluid to the target object.

For more detailed functions of the configuration of the wafer transfer device using a roller according to an embodiment of the present invention, that is, the transfer unit 100, the supply unit 200, the roller 200, and the light irradiation unit 300, wafer transfer using a roller It will be described later in the method.

Meanwhile, the wafer transfer apparatus using a roller according to an embodiment of the present invention may further include a control unit (not shown) or a storage unit (not shown). In this case, the control unit may control each configuration to perform wafer transfer according to a program related to a wafer transfer method using a roller to be described later. In addition, the storage unit may store a program related to a wafer transfer method using a roller to be described later.

For example, the storage unit is a hard disk type, magnetic media type, compact disc read only memory (CD-ROM), optical media type, magnetic-optical medium type. (Magneto-optical media type), multimedia card micro type, card type memory (eg SD or XD memory, etc.), flash memory type, read only memory (ROM) ), RAM (random access memory; RAM), or a buffer made of a memory formed of a combination thereof, a main memory, or an auxiliary memory, but is not limited thereto.

In addition, a program related to the wafer transfer method is a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or these It may be stored in an attachable storage device that can be accessed through a communication network composed of a combination of

Hereinafter, a wafer transfer method using a roller according to the first and second embodiments of the present invention will be described.

The wafer transfer method using a roller according to the first and second embodiments of the present invention may be included in a semiconductor packaging process, and in particular, may be included in a sawing process or an attaching process. At this time, the semiconductor packaging (Pakaging) process, sawing (Sawing) process, and bonding (Attaching) process has been described above in the [Technology Background of the Invention], so a detailed description thereof will be omitted below.

The wafer transfer method using rollers according to the first and second embodiments of the present invention is performed using the wafer transfer apparatus using the rollers described above according to FIG. 1. The wafer transfer method using a roller according to the first and second embodiments of the present invention is a pre-treatment of mounting the transfer object on the first support 120 or the wafer support P, before the step S1 and step S10, respectively. It may further include a step.

In the pre-processing step, the transfer object may be mounted on the first support 120 or the wafer support P manually or by using a separate transfer device (not shown). At this time, in the pretreatment step of the wafer transfer method using a roller according to an embodiment of the present invention, after the wafer W before sawing is mounted on the correct position of the first support 120 or the wafer support P , Each region of the wafer W on which the integrated circuit is formed may be sawing.

2 is a diagram showing a wafer transfer method using a roller according to a first embodiment of the present invention, and FIGS. 3(a) to 3(g) are a wafer transfer method using a roller according to the first embodiment of the present invention. It is a diagram showing the process in which this is performed. However, FIG. 3 illustrates only some of the integrated circuit devices IC of the wafer W, but is not limited thereto.

The wafer transfer method using a roller according to the first embodiment of the present invention includes steps S1 to S4 as shown in FIG. 2.

Step S1 is a wafer transfer step, as shown in FIGS. 3(a) and 3(b), placing the integrated circuit elements (ICs) of the wafer W in the rolling position. In this case, in step S1, the integrated circuit elements IC of the wafer W may be transferred to the rolling position by using the first transfer device 110. In addition, in step S1, the roller 200 may be transferred to the rolling position by using the third transfer device 150.

Step S2 is an attaching step, and as shown in FIG. 3(c), the roller 200 rolls the upper portions of the integrated circuit elements IC of the wafer W, and the wafer W is applied to the adhesive layer A. This is the step of attaching the integrated circuit devices (ICs) of ). At this time, in step S2, while fixing the first support 120 in place, the roller 200 may be rolled while transferring the roller 200 from one end to the other end using the third transfer device 150. In addition, in step S2, while the roller 200 is fixed in place, the first support 120 is transferred from the other end to one end using the first transfer device 110, and the roller 200 may be rolled. In addition, in step S2, the first support 120 is transferred from the other end to one end using the first transfer device 110, and the roller 200 is transferred from one end to the other end using the third transfer device 150. While making it possible to roll the roller 200.

In addition, step S2 may further include a step of selectively rolling the upper portions of some of the integrated circuit devices (ICs) by the roller 200. In this case, step S2 may sequentially include a first rolling step, an angular rotation step, and a second rolling step. In addition, step S2 may include repeating the first rolling step, the angular rotation step, and the second rolling step.

The first rolling step is a step in which the roller 200 selectively rolls the upper portions of the integrated circuit elements (ICs) of one column (or row). The angular rotation step is a step in which the transfer unit 100 rotates the roller 200 at a predetermined angle. At this time, the roller 200 rotates a certain angle by itself without rolling the top of the other integrated circuit devices (ICs). In the second rolling step, the roller 200 moves the tops of the integrated circuit devices of another row (or row). This is the step of selectively rolling. As the first rolling step, the angular rotation step, and the second rolling step are sequentially performed, the integrated circuit devices ICs may be attached to the adhesive layer A in a state spaced apart from each other for each column (or row). However, a more detailed process for the first rolling step, the angular rotation step, and the second rolling step is the same as the process of the wafer transfer method using a roller according to the second embodiment of the present invention, which will be described later. Do it.

Step S3 is a first substrate transfer step, as shown in Fig. 3(e), a step of positioning the first substrate S1 on which the adhesive A'is applied on the rolling position. At this time, a roller 200 to which the integrated circuit elements IC are attached to the adhesive layer A is positioned above the rolling position. In step S3, the first substrate S1 may be transferred to the rolling position by using the second transfer device 130. In addition, in step S3, the roller 200 may be transferred to the rolling position by using the third transfer device 150.

Step S4 is a transfer step. As shown in FIG. 3(f), the roller 200 rolls the upper portion of the first substrate S1, and the integrated circuit device (IC) attached to the adhesive layer (A) is ) Are transferred to the upper portion of the first substrate S1 to which the adhesive A'is applied. In this case, in step S4, the roller 200 may be rolled while the first substrate S1 is fixed in place and the roller 200 is transferred from one end to the other end using the third transfer device 150. In addition, in step S4, the roller 200 may be rolled while transferring the first substrate S1 from the other end to one end using the second transfer device 130 while fixing the roller 200 in place. In addition, in step S4, the first substrate S1 is transferred from the other end to one end using the second transfer device 130, and the roller 200 is transferred from one end to the other end using the third transfer device 150. While making it possible to roll the roller 200.

Meanwhile, a separation error may occur in step S4. Here, the separation error refers to a phenomenon in which the integrated circuit devices (ICs) are separated from the adhesive layer (A) and are not transferred to the adhesive (A') but continue to adhere to the adhesive layer (A). To reduce the occurrence of such separation errors, the wafer transfer method using a roller according to the first embodiment of the present invention may further include a light irradiation step or a heat treatment step performed before step S4 or together with step S4.

The light irradiation step is a step in which the light irradiation unit 300 irradiates light toward the roller 200 on which the integrated circuit elements (ICs) are attached to the adhesive layer (A), and weakens the adhesive force of the adhesive layer (A) according to the light irradiation. I can. At this time, in the light irradiation step, the light irradiation unit 300 is transferred from the other end to one end by the transfer unit 100 to irradiate light to the roller 200 or irradiate light to the roller 200 when the roller 200 rotates. can do.

In particular, the light irradiation step is a portion in which the light irradiation unit 400 selectively irradiates an area of the roller 200 corresponding to some of the integrated circuit elements IC attached to the adhesive layer A. It may include an investigation step. Thereafter, a transfer step may be performed, and a partial transfer step of transferring only some of the integrated circuit devices IC corresponding to the region of the roller 200 selectively irradiated with light to the first substrate S1 may be performed. The partial irradiation step and the partial transfer step may be repeatedly performed, and accordingly, all the integrated circuit devices IC attached to the adhesive layer A may be transferred to the first substrate S1.

The heat treatment step is a step in which the heat treatment unit (not shown) heats the roller 200 to which the integrated circuit elements IC are attached to the adhesive layer A, and the adhesive strength of the adhesive layer A may be weakened by heating. In this case, in the heat treatment step, the heat treatment unit may heat the roller 200 while being transferred from the other end to one end by the transfer unit 100 or heat the roller 200 when the roller 200 rotates.

In particular, the heat treatment step includes a partial heating step in which the heat treatment unit selectively heats a region of the roller 200 corresponding to some of the integrated circuit elements IC among the integrated circuit elements IC attached to the adhesive layer A. Can include. Thereafter, a transfer step may be performed, and a partial transfer step of transferring only a partial integrated circuit device IC corresponding to an area of the roller 200 that is selectively irradiated with light to the first substrate S1 may be performed. The partial heating step and the partial transfer step may be repeatedly performed, and accordingly, all the integrated circuit devices IC attached to the adhesive layer A may be transferred to the first substrate S1.

Next, a wafer transfer method using a roller according to a second embodiment of the present invention will be described.

4 is a view showing a wafer transfer method using a roller according to a second embodiment of the present invention. In addition, FIGS. 5(a) to 5(j) are views showing a process in which the first process of the wafer transfer method using a roller according to the second embodiment of the present invention is performed. 6(a) and 6(k) are views showing a process in which a secondary process of the wafer transfer method using a roller according to the second embodiment is performed. However, FIGS. 5 and 6 illustrate only some of the integrated circuit devices IC of the wafer W, but are not limited thereto.

The wafer transfer method using a roller according to the second embodiment of the present invention includes steps S10 to S80 as shown in FIG. 4. In this case, steps S10 to S40 are referred to as “first process”, and steps S50 to S80 are referred to as “second process”. The first process includes a process of separating the integrated circuit elements (ICs) of the wafer (W) by column, and the second process is to separate the integrated circuit elements (ICs) of the wafer (W) already separated by columns by row. Including the process.

Step S10 is a wafer transfer step, as shown in FIGS. 5(a) and 5(b), positioning the integrated circuit elements (ICs) of the wafer W in the rolling position. In this case, in step S10, the integrated circuit elements IC of the wafer W may be transferred to the rolling position by using the first transfer device 110. In addition, in step S10, the roller 200 may be transferred to the rolling position using the third transfer device 150.

Step S20 is a primary attachment step, as shown in Figs. 5(c) to 5(g), in the rolling position, the roller 200 is one of the integrated circuit elements IC1 to IC6 in a row. This is a step of selectively rolling the upper surface (any one of L1 to L6) of any one). Accordingly, the integrated circuit elements in any one row of the integrated circuit elements IC are attached to the adhesive layer A. At this time, when the integrated circuit elements (any one of IC1 to IC6) of any one row are attached to a certain region of the adhesive layer A by selective rolling of the roller 200, the roller 200 rotates a certain angle. Thereafter, the roller 200 selectively rolls the upper surface (the other one of L1 to L6) of the other row of the integrated circuit elements (the other one of IC1 to IC6). Accordingly, the integrated circuit elements of the other row among the integrated circuit elements (IC) are attached to the adhesive layer (A) in a state that is spaced apart from the integrated circuit elements of the previously attached row. When this process is repeated, as a result, in step S20, the integrated circuit devices (ICs) are disposed to be spaced apart from each other for each column (IC1 to IC6) and attached to the adhesive layer (A), as shown in FIG. 5(g). .

For example, the roller 200 selectively rolls the upper surface L1 of IC1, which is the first row of the wafer W, as shown in FIG. 5(c), so that IC1 is one of the adhesive layer A. Attach to the area. Subsequently, the roller 200 rotates at a certain angle, as shown in FIG. 5(d). Subsequently, the roller 200 selectively rolls the upper surface L2 of IC2, which is the second row of the wafer W, as shown in FIG. 5(e), so that the IC2 is applied to another area of the adhesive layer A. Attach. Subsequently, the roller 200 rotates at a certain angle, as shown in FIG. 5(f). When this process is repeated, IC1 to IC6 are arranged spaced apart from each other by row, as shown in FIG. 5(g), so that they can be attached to the adhesive layer (A).

In step S20, the roller 200 may be rolled while the first support 120 is fixed in place and the roller 200 is transferred using the third transfer device 150. In addition, in step S20, while the roller 200 is fixed in place, the first support 120 may be transferred using the first transfer device 110, while the roller 200 may be rolled. In addition, in step S20, the first support 120 is transferred using the first transfer device 110, while the roller 200 is transferred using the third transfer device 150, while the roller 200 is rolled. I can make it.

Step S30 is a second substrate transfer step, and is a step of positioning the second substrate S2 in the rolling position, as shown in FIG. 5(h). At this time, a roller 200 in which the integrated circuit elements IC are attached to the adhesive layer A to be spaced apart from each other is positioned above the rolling position. In step S30, the second substrate S2 may be transferred to the rolling position by using the second transfer device 130. In addition, in step S30, the roller 200 may be transferred to the rolling position by using the third transfer device 150.

Step S40 is the first transfer step, as shown in Fig. 5(i), by rolling the upper part of the second substrate S2 by the roller 200 at the rolling position, and attaching them to the adhesive layer (A) in a row. This is a step of transferring the integrated circuit devices (IC) onto the second substrate (S2). At this time, in step S40, while fixing the second substrate S2 in place, the roller 200 may be rolled while transferring the roller 200 from one end to the other end using the third transfer device 150. In addition, in step S40, while the roller 200 is fixed in place, the second substrate S2 is transferred from the other end to one end using the second transfer device 130, and the roller 200 may be rolled. In addition, in step S40, the second substrate (S2) is transferred from the other end to one end using the second transfer device 130, and the roller 200 is transferred from one end to the other end by using the third transfer device 150. While making it possible to roll the roller 200.

Meanwhile, a first separation error may occur in step S40. Here, the primary separation error refers to a phenomenon in which the integrated circuit devices (ICs) are separated from the adhesive layer (A) and are not transferred to the second substrate (S2) but continue to adhere to the adhesive layer (A). In order to reduce the occurrence of such a primary separation error, the wafer transfer method using a roller according to the second embodiment of the present invention further includes a primary light irradiation step or a primary heat treatment step performed before or in conjunction with step S40. It may include, and an adhesive (not shown) may be provided on the second substrate S2.

The first light irradiation step is a step in which the light irradiation unit 300 irradiates light toward the roller 200 on which the integrated circuit elements ICs spaced apart from each other by columns are attached to the adhesive layer A, and the adhesive layer A ) Can weaken the adhesion. At this time, in the first light irradiation step, the light irradiation unit 300 is transferred from the other end to one end by the transfer unit 100 to irradiate light to the roller 200, or light to the roller 200 when the roller 200 rotates. You can investigate.

In particular, in the first light irradiation step, the area of the roller 200 corresponding to the integrated circuit device (IC) in some rows among the integrated circuit devices (IC) in which the light irradiation unit 400 is attached to the adhesive layer (A) to be spaced apart by columns. It may include a first partial irradiation step of selectively irradiating light. Thereafter, a first transfer step is performed, and a first partial transfer step of transferring only a partial row of integrated circuit elements (IC) corresponding to the region of the roller 200 that is selectively irradiated with light to the second substrate S2 is performed. Can be. The first partial irradiation step and the first partial transfer step may be repeatedly performed, and accordingly, all the integrated circuit devices IC attached to the adhesive layer A may be transferred to the second substrate S2.

The first heat treatment step is a step in which the heat treatment unit (not shown) heats the roller 200 to which the integrated circuit elements (IC) are attached to the adhesive layer (A) for each row, and weakens the adhesion of the adhesive layer (A) by heating. I can make it. In this case, in the first heat treatment step, the heat treatment unit may heat the roller 200 while being transferred from the other end to one end by the transfer unit 100 or heat the roller 200 when the roller 200 rotates.

In particular, in the first heat treatment step, the heat treatment unit selectively selects a region of the roller 200 corresponding to the integrated circuit device (IC) in some rows among the integrated circuit devices (IC) attached to the adhesive layer (A) to be spaced apart by columns. Heat treatment may include a first partial heating step. Thereafter, a first transfer step is performed, but a first partial transfer step of transferring only a partial row of integrated circuit elements (IC) corresponding to the region of the selectively irradiated roller 200 to the second substrate S2 is performed. I can. The first partial heating step and the first partial transfer step may be repeatedly performed, and accordingly, all the integrated circuit devices IC attached to the adhesive layer A may be transferred to the second substrate S2.

Step S50 is a rotation step, as shown in FIGS. 6(a) and 6(b), a step of rotating the second substrate S2 or the roller 200 by 90° with respect to the vertical axis. As step S50 is performed, the integrated circuit elements IC of the wafer W separated by columns by the first process may be separated by rows by the secondary process. However, FIGS. 6(a) and 6(b) illustrate that the second substrate S2 is rotated by 90°, but is not limited thereto. At this time, in step S50, while fixing the roller 200 in place, the second substrate S2 may be rotated by 90° using the second transfer device 130. In addition, in step S50, while fixing the second substrate S2 in place, the roller 200 may be rotated by 90° using the third transfer device 150.

Step S60 is a secondary attachment step, as shown in Figs. 6(d) to 6(h), in the rolling position, the roller 200 is selected from among the integrated circuit elements IC7 to IC10 in any one row. This is a step of selectively rolling the upper surface (any one of L7 to L10) of any one). Accordingly, the integrated circuit elements in any one row of the integrated circuit elements IC are attached to the adhesive layer A. At this time, when one row of integrated circuit elements (any one of IC7 to IC10) is attached to a certain area of the adhesive layer A by selective rolling of the roller 200, the roller 200 rotates a certain angle. Then, the roller 200 selectively rolls the upper surface (the other one of L7 to L10) of the other row of the integrated circuit elements (the other one of IC7 to IC10). Accordingly, the integrated circuit elements of the other row among the integrated circuit elements (IC) are attached to the adhesive layer (A) while being spaced apart from the integrated circuit elements of any one row that are already attached. If this process is repeated, as a result, in step S50, the integrated circuit devices (ICs) are disposed spaced apart from each other for each row (IC7 to IC10) and attached to the adhesive layer (A), as shown in FIG. 6(h). . Of course, the integrated circuit elements (IC) in one row are attached to the adhesive layer (A) in a state that is already spaced apart by each column.

For example, the roller 200 selectively rolls the upper surface L7 of IC7, which is the first row of the wafer W, as shown in FIG. 6(d), so that the IC7 is one of the adhesive layer A. Attach to the area. Subsequently, the roller 200 rotates at a certain angle, as shown in Fig. 6(e). Subsequently, the roller 200 selectively rolls the upper surface L8 of the IC8, which is the second row of the wafer W, as shown in FIG. 6(f), so that the IC8 is applied to another area of the adhesive layer A. Attach. Subsequently, the roller 200 rotates at a certain angle, as shown in FIG. 6(g). When this process is repeated, IC7 to IC10 are arranged spaced apart from each other by row, as shown in FIG. 6(h), so that they can be attached to the adhesive layer (A).

In step S60, while the first support 120 is fixed in place, the roller 200 may be transferred by using the third transfer device 150, while the roller 200 may be rolled. In addition, in step S60, the roller 200 may be rolled while transferring the first support 120 using the first transfer device 110 while fixing the roller 200 in place. In addition, in step S60, the first support 120 is transferred using the first transfer device 110, while the roller 200 is transferred using the third transfer device 150 while rolling the roller 200. I can make it.

On the other hand, when the second substrate S2 includes an adhesive thereon, an adhesion error may occur in step S60. Here, the adhesion error refers to a phenomenon in which the integrated circuit devices (ICs) are separated from the adhesive of the second substrate S2 and are not adhered to the adhesive layer A but continue to adhere to the adhesive of the second substrate S2. In order to reduce the occurrence of such adhesion errors, the wafer transfer method using a roller according to the second embodiment of the present invention further includes a second light irradiation step or a second heat treatment step performed before step S60 or in conjunction with step S60. I can.

The secondary light irradiation step is a step in which the light irradiation unit 300 irradiates light toward the second substrate S2, and may weaken the adhesive force of the adhesive of the second substrate S2 according to the light irradiation. In this case, in the second light irradiation step, the light irradiation unit 300 may be transferred from the other end to one end by the transfer unit 100 to irradiate light onto the second substrate S2.

The second heat treatment step is a step in which a heat treatment unit (not shown) heats the second substrate S2, and the adhesive strength of the adhesive of the second substrate S2 may be weakened by heating. In this case, in the second heat treatment step, the heat treatment unit may be transferred from the other end to one end by the transfer unit 100 to heat the second substrate S2.

Step S70 is a first substrate transfer step, as shown in Fig. 6(i), a step of positioning the first substrate S1 in a rolling position. At this time, a roller 200 in which the integrated circuit elements (IC) are attached to the adhesive layer (A) to be spaced apart by column and row is positioned above the rolling position. In addition, an adhesive A'is applied on the first substrate S1. In step S70, the second substrate S2 may be transferred to the rolling position by using the second transfer device 130. In addition, in step S30, the roller 200 may be transferred to the rolling position by using the third transfer device 150.

Step S80 is a secondary transfer step, as shown in FIG. 6(j), by rolling the upper part of the second substrate S2 by the roller 200 at the rolling position, and spaced apart by columns and rows in the adhesive layer (A). This is a step of transferring the attached integrated circuit devices (ICs) onto the first substrate (S1). In this case, in step S80, the roller 200 may be rolled while the first substrate S1 is fixed in place and the roller 200 is transferred from one end to the other end using the third transfer device 150. In addition, in step S80, while the roller 200 is fixed in place, the first substrate S1 is transferred from the other end to one end using the second transfer device 130, and the roller 200 may be rolled. In addition, in step S80, the first substrate S1 is transferred from the other end to one end using the second transfer device 130, and the roller 200 is transferred from one end to the other end using the third transfer device 150. While making it possible to roll the roller 200.

Meanwhile, a secondary separation error may occur in step S80. Here, the secondary separation error refers to a phenomenon in which the integrated circuit devices (ICs) are separated from the adhesive layer (A) and are not transferred to the first substrate (S2) but continue to adhere to the adhesive layer (A). In order to reduce the occurrence of such a primary separation error, the wafer transfer method using a roller according to the second embodiment of the present invention further includes a third light irradiation step or a third heat treatment step performed before step S80 or in conjunction with step S80. Can include.

The third light irradiation step is a step in which the light irradiation unit 300 irradiates light toward the roller 200 to which the integrated circuit elements (ICs) spaced apart from each other by columns and rows are attached to the adhesive layer (A). It is possible to weaken the adhesion of (A). At this time, in the third light irradiation step, the light irradiation unit 300 is transferred from the other end to one end by the transfer unit 100 to irradiate light to the roller 200, or light to the roller 200 when the roller 200 rotates. You can investigate.

In particular, in the third light irradiation step, the light irradiation unit 400 is a roller 200 corresponding to the integrated circuit device (IC) in some rows among the integrated circuit devices (IC) that are attached to the adhesive layer (A) in columns and rows. ) May include a third partial irradiation step of selectively irradiating the area with light. Thereafter, a third transfer step is performed, and a third partial transfer step of transferring only a partial row of integrated circuit elements IC corresponding to the region of the roller 200 selectively irradiated with light to the first substrate S1 is performed. Can be done. The third partial irradiation step and the third partial transfer step may be repeatedly performed, and accordingly, all the integrated circuit devices IC attached to the adhesive layer A may be transferred to the first substrate S1.

The third heat treatment step is a step in which the heat treatment unit (not shown) heats the roller 200 to which the integrated circuit elements (ICs) are attached to the adhesive layer (A) by columns and rows, and the adhesion of the adhesive layer (A) by heating Can weaken. In this case, in the third heat treatment step, the heat treatment unit may heat the roller 200 while being transferred from the other end to one end by the transfer unit 100 or heat the roller 200 when the roller 200 rotates.

In particular, in the third heat treatment step, the area of the roller 200 corresponding to the integrated circuit device (IC) in some rows among the integrated circuit devices (IC) in which the heat treatment unit is attached to the adhesive layer (A) to be spaced apart by columns and rows. It may include a second partial heating step of selectively heat treatment. Thereafter, a third transfer step is performed, and a third partial transfer step of transferring only the integrated circuit elements (IC) of some rows corresponding to the region of the roller 200 that is selectively irradiated to the first substrate (S1) is performed. Can be. The third partial heating step and the third partial transfer step may be repeatedly performed, and accordingly, all the integrated circuit elements IC attached to the adhesive layer A may be transferred to the first substrate S1.

7 is a view showing integrated circuit elements transferred to a first substrate as a result of performing a wafer transfer method using a roller according to a second embodiment of the present invention.

If steps S10 to S80 are performed according to the wafer transfer method using a roller according to the second embodiment of the present invention, as shown in FIG. 7, an integrated circuit device (IC) of the wafers W spaced apart by columns and rows. ) Can be transferred to the first substrate S1 at once.

In the detailed description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention is not limited to the described embodiments, and should be determined by the scope of the claims to be described later and those equivalents to the scope of the claims.

A: Adhesive layer A': Adhesive
IC: Integrated circuit device P: Wafer stand
S: Substrate W: Wafer
100: transfer unit 110: first transfer device
120: first support 130: second transfer device
140: second support 150: third transfer device
200: roller 300: light irradiation unit

Claims (10)

It is used in the sawing process in which the wafer is cut into individual integrated circuit devices, or in the adhesion process in which the cut integrated circuit devices are attached to a substrate and fixed, and the integrated circuit of the wafer processed by sawing As a wafer transfer device that transfers a transfer object composed of elements separated by columns and rows using a roller,
Transfer the object to be transferred, the first substrate, the second substrate, and the roller to which the adhesive is applied to the upper part, respectively, to a rolling position or another position, and after the first transfer process of the roller, the second substrate or roller is 90° with respect to the vertical axis. A transfer unit that rotates as much as; And
An adhesive layer is provided on the surface, and the transfer object is rolled at a rolling position to attach the transfer object to the adhesive layer, and the transfer object is rolled over the first substrate or the second substrate while the transfer object is attached to the adhesive layer. Including; a roller that performs a transfer process for transferring to an upper portion of the first substrate or the second substrate, and selectively rolls some of the integrated circuit elements during the attaching process,
The roller,
In the rolling position, the integrated circuit elements in a specific row are selectively rolled with respect to the transfer object, but the integrated circuit elements in one row are selectively rolled and then rotated by a certain angle, and then the integrated circuit elements in the other row are selectively rolled. A first attaching process of attaching circuit elements to the adhesive layer of the roller so as to be spaced apart by row,
A first transfer process of rolling the upper portion of the second substrate in a rolling position while the integrated circuit elements spaced apart by column are attached to the upper portion of the second substrate by rolling the upper portion of the second substrate to transfer the integrated circuit elements spaced apart by row to the upper portion of the second substrate;
In the rolling position, among the integrated circuit elements transferred to the top of the second substrate, the integrated circuit elements of a specific row are selectively rolled, but the integrated circuit elements of one row are selectively rolled and rotated by a certain angle, and then the other A second attaching process of selectively rolling the integrated circuit elements in a row to attach the integrated circuit elements to the adhesive layer of the roller so as to be spaced apart from each other by row,
A second transfer process of rolling the top of the first substrate at the rolling position while attaching the integrated circuit devices spaced apart by columns and rows to transfer the integrated circuit devices spaced apart by columns and rows to the top of the first substrate. Wafer transfer device using a roller, characterized in that performing each. The method of claim 1,
A wafer transfer apparatus using a roller, further comprising: a light irradiation unit for irradiating light toward a roller having a transfer object attached to the adhesive layer or a heat treatment unit for heating a roller having a transfer object attached to the adhesive layer. delete delete delete It is used in the sawing process in which the wafer is cut into individual integrated circuit devices, or in the adhesion process in which the cut integrated circuit devices are attached to a substrate and fixed, and the integrated circuit of the wafer processed by sawing As a wafer transfer method in which a transfer object composed of elements is transferred by spaced apart by column and row using a roller,
(a) A roller with an adhesive layer on its surface selectively rolls the integrated circuit elements in a specific row with respect to the transfer object at the rolling position, but selectively rolls the integrated circuit elements in one row and then rotates it by a certain angle and then the other. Attaching the integrated circuit elements to the adhesive layer so as to be spaced apart from each other by selectively rolling the integrated circuit elements in a row;
(b) rolling an upper portion of the second substrate at a rolling position by a roller in a state in which the integrated circuit elements spaced apart by columns are attached, and transferring the integrated circuit elements spaced apart by columns to the upper portion of the second substrate;
(c) rotating the second substrate or roller by 90° about the vertical axis by the transfer unit; And
(d) The roller selectively rolls the integrated circuit elements of a specific row among the integrated circuit elements transferred to the top of the second substrate at the rolling position, and selectively rolls the integrated circuit elements of any one row by a certain angle. Attaching the integrated circuit elements to the adhesive layer of the roller so as to be spaced apart by row by selectively rolling the other row of integrated circuit elements after rotation; And
(e) A roller in a state in which integrated circuit elements spaced apart by column and row are attached rolls the upper part of the first substrate at the rolling position to transfer the integrated circuit elements spaced apart by column and row to the upper part of the first substrate. Step; Wafer transfer method using a roller comprising a. delete delete delete The method of claim 6,
Before the step (b) and after the step (d), the wafer transfer method using a roller further comprising the steps of irradiating light toward the roller or heating the roller, respectively.

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