KR102196481B1 - Plasma processing apparatus for powder using horizontal transfer - Google Patents

Abstract

According to an embodiment of the present invention, there is provided a horizontally movable powder plasma processing apparatus for plasma processing of powder through a plasma reactor, comprising: a chamber unit having a hollow interior; A plasma reaction unit disposed inside the chamber unit and receiving power from a power supply to generate plasma; A powder supply unit for moving the powder to the plasma reaction unit; And an adsorption means for varying the pressure inside the chamber part and adsorbing and plasma-processing powder to the plasma reaction part therefrom, wherein the plasma reaction part is hollow inside, shares a central axis, and from the central axis It provides a horizontally movable powder plasma processing apparatus including; a plurality of processing units having different distances to the inner wall.

Description

Plasma processing apparatus for powder using horizontal transfer

Embodiments of the present invention relate to a horizontally movable powder plasma processing apparatus.

In general, fine powder materials are widely used in a wide range of high-tech high value-added industries such as information, electronics industry, chemical catalysts, lightweight nano, eco-friendly materials, and energy fields, and technologies that can mass-produce various nano powders, furthermore, nano functionalization and The technology and commercialization research that applied it, such as composite materials, is being actively conducted.

Fine particles have a very close distance between particles, so the van der waals force between particles is much greater than the gravity of the particles themselves, and mutual aggregation is likely to occur in order to lower the high surface energy, which degrades the intrinsic properties of the fine particles. In addition, it is becoming an obstacle to actual commercialization in all fields such as mixing, dispersion, coating, and composite materialization of fine particles.

In particular, in the case of carbon-based microparticles such as graphene, nanotubes, nanofibers, graphite, carbon black, etc., it is a material that has a very stable chemical structure as a material with a large attraction between molecules, so it is difficult to use it by dispersing it in other materials. It is known to be difficult.

Therefore, it is necessary to improve the dispersibility by introducing a functionalizer on the surface of the fine particles. Currently, the mechanical method (ball milling, calendering, etc.) and the wet method relying on chemical reactions are complex processes, low productivity, and non-environmental problems. It is having difficulty in commercialization due to such problems (see Ma PC, Siddiqui NA, Marom G and Kim JK, composites: part A 41, pp1345, 2010).

On the other hand, in consideration of mass production and environmental friendliness, a dry treatment method using plasma is preferred, which can be largely divided into two. A plasma reactor using or applying a fluidized-bed reactor that transfers fine powders using a carrier gas has difficulty in uniform functionalization treatment and control of process conditions, and has limitations in mass production. A plasma reactor using agitation (mechanical agitation) can provide sufficient reaction time and can be mass-produced, so that some commercialization has been achieved, but it is difficult to perform uniform functionalization of fine particles (Arpagus C et al., Chem. Eng. Technol). 2005, V28, p87 and Kooshki S et al., Vacuum, 2018, V156, p224).

As the size of the particles decreases, it is technically difficult to treat the uniform surface of the three-dimensional fine powder, and it is difficult to expect uniform treatment and mass production even in the treatment effect, so the dry treatment device to meet this problem is still in the research stage. There is a situation.

In the conventional dry treatment method using plasma, the total space of the chamber is 6 times or more compared to the electrode filter part, the powder treatment efficiency is lowered, and powder is lost due to repeated treatment essential to increase the functionalization and uniformity of the powder.

The present invention was devised to improve the above problems, in which the powder is horizontally moved parallel to the adsorption surface formed in the treatment unit to increase the adsorption surface area of the powder, and the powder moves in a direction perpendicular to the extension direction of the treatment unit. Compared to that, it is intended to provide a horizontally movable powder plasma processing apparatus capable of increasing the throughput and processing efficiency of the powder by preventing loss through the hole formed in the processing unit.

However, these problems are exemplary, and the scope of the present invention is not limited thereby.

According to an embodiment of the present invention, there is provided a horizontally movable powder plasma processing apparatus for plasma processing of powder through a plasma reactor, comprising: a chamber unit having a hollow interior; A plasma reaction unit disposed inside the chamber unit and receiving power from a power supply to generate plasma; A powder supply unit for moving the powder to the plasma reaction unit; And an adsorption means for varying the pressure inside the chamber part and adsorbing and plasma-processing powder to the plasma reaction part therefrom, wherein the plasma reaction part is hollow inside, shares a central axis, and from the central axis It provides a horizontally movable powder plasma processing apparatus including; a plurality of processing units having different distances.

In the present invention, the processing unit may have openings formed at both ends in the longitudinal direction.

In the present invention, the processing unit may be formed in a cylindrical shape.

In the present invention, the processing unit may include an inner wall portion and an outer wall portion, and powder may be adsorbed and plasma-treated from the inner wall portion and the outer wall portion.

In the present invention, a plate portion coupled to the inner wall of the chamber portion, electrically connected to the processing portion, and fixing a position of the processing portion within the chamber portion may further include.

In the present invention, the plate portion, the through-hole portion is formed on the movement path of the powder inside the chamber portion, the plate body coupled to the inner wall of the chamber portion; And a porous filter coupled to the plate body to cover the through hole and provided with a nano- or micro-sized hole.

In the present invention, the powder supply unit, a placement unit installed inside the chamber unit, the powder is disposed; And a gas supply unit communicating with the chamber unit and supplying gas to the placement unit.

In the present invention, the placement unit and the gas supply unit may be disposed below the processing unit.

In the present invention, the thin film coating using plasma polymerization further includes a configuration equipped with a bubbler for injecting a liquid monomole, and powder by injecting at least one of O2, N2, NH3, CF4, and precursors Plasma-chemical vapor deposition (CVD) can be performed on the powder surface by controlling the functional groups on the surface or the physical properties of the thin film.

In the present invention, the chamber unit may be provided with a chamber filter that generates plasma by receiving power from the power supply device, and includes a plurality of nano- or micro-sized holes on an inner surface thereof.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

In the horizontally movable powder plasma treatment apparatus according to the present invention, the powder is horizontally moved with respect to the adsorption surface formed in the treatment unit along one direction, thereby increasing the surface area of the treatment unit on which the powder is adsorbed or separated, and the powder is perpendicular to the extension direction of the treatment unit. Compared to moving in the direction, it is possible to increase the processing amount and processing efficiency of the powder by preventing loss through the hole formed in the processing unit.

In addition, as the powder moves vertically with respect to the adsorption surface of the treatment unit by passing through and moving between the inner and outer wall parts of a plurality of different treatment units, the adsorption section and the adsorption surface area are increased to increase the throughput and treatment efficiency of the powder. There is an effect that can be made.

In addition, since the plasma surface treatment can be performed in a state in which the powder, which is fine particles, is uniformly adsorbed on the surface of the treatment unit, it is possible to functionalize even the small nano and micro particles, and the plasma reaction time can be adjusted to the optimum conditions. At the same time, uniform and effective powder surface treatment is possible in a stable plasma atmosphere.

In addition, as a plurality of treatment units are provided, the surface area on which fine particles such as powder can be adsorbed increases in proportion, so that functionalization of fine particles can be uniformly achieved, and economical mass production is possible.

Of course, the scope of the present invention is not limited by these effects.

1 is a diagram schematically showing the configuration of a horizontally movable powder plasma processing apparatus according to an embodiment of the present invention.
FIG. 2 is a top cross-sectional view showing a cross-section A-A' of FIG. 1.
3 is a plan cross-sectional view showing a cross-sectional view taken along line B-B' of FIG. 1.
4 is a plan cross-sectional view showing a state in which powder is plasma-treated by the horizontally movable powder plasma processing apparatus according to an embodiment of the present invention.
5 is a diagram illustrating a state in which the powder moves horizontally in FIG. 1.
6 and 7 are views showing a heating unit installed in the horizontally movable powder plasma processing apparatus according to an embodiment of the present invention.
8 is a diagram schematically showing the configuration of a horizontally movable powder plasma processing apparatus including a porous filter according to another embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them will be apparent with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding constituent elements are assigned the same reference numerals, and redundant descriptions thereof will be omitted. .

In the following embodiments, terms such as first and second are not used in a limiting meaning, but are used for the purpose of distinguishing one component from another component.

In the following examples, the singular expression includes the plural expression unless the context clearly indicates otherwise.

In the following embodiments, terms such as include or have means that the features or elements described in the specification are present, and do not preclude the possibility of adding one or more other features or elements in advance.

In the following embodiments, when a part such as a film, a region, or a component is on or on another part, not only the case directly above the other part, but also another film, region, component, etc. are interposed therebetween. This includes cases where there is.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and the present invention is not necessarily limited to what is shown.

When a certain embodiment can be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

In the following embodiments, when a film, a region, a component, etc. are connected, not only the film, the region, and the components are directly connected, but other films, regions, and components are interposed between the film, the region, and the components. It includes cases that are connected indirectly. For example, in this specification, when a film, region, component, etc. are electrically connected, not only the film, region, component, etc. are directly electrically connected, but also other films, regions, components, etc. are interposed therebetween. This includes indirect electrical connections.

1 is a diagram schematically showing the configuration of a horizontally movable powder plasma processing apparatus according to an embodiment of the present invention. FIG. 2 is a top cross-sectional view showing a cross-section A-A' of FIG. 1. 3 is a top cross-sectional view showing a cross-sectional view taken along line B-B' of FIG. 1. 4 is a cross-sectional plan view showing a state in which powder is plasma-treated by a horizontally movable powder plasma processing apparatus according to an embodiment of the present invention. 5 is a diagram illustrating a state in which the powder moves horizontally in FIG. 1. 6 and 7 are views showing a heating unit installed in the horizontally movable powder plasma processing apparatus according to an embodiment of the present invention.

1 to 7, a horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention includes a chamber 100, a plasma reaction 200, a plate 300, and a powder supply. 400), may include a powder adsorption means 500, a powder collection unit 600.

1, 2, and 5, the chamber unit 100 according to an embodiment of the present invention has a hollow interior, and a plasma reaction unit 200 is disposed in the interior space of the chamber unit 100. Can be installed.

1, 2, and 5, a chamber filter 105 may be formed on an inner surface of the chamber unit 100 according to an embodiment of the present invention.

The chamber filter 105 generates plasma PL by receiving power from the power supply device 120, and may be provided with a plurality of nano- or micro-sized holes (no reference numerals).

The chamber filter 105 according to the embodiment of the present invention may be formed as an electrode. Since the chamber filter 105 is formed of a filter having a plurality of holes in nano or micro size units, the working gas is passed through and exhausted, and the powder P is transferred to the chamber filter 105 by transferring the powder P of the working gas. ) Can be adsorbed.

Although not shown in the drawing, a chamber pressurizing unit (drawing number not set) is formed on the outside of the chamber filter 105 to pressurize by injecting gas in the direction toward the chamber filter 105, that is, in the center direction of the chamber unit 100. In addition, gas is supplied from the chamber pressurizing unit, and the amount of powder P is absorbed by the inner surface of the chamber unit 100 to be reduced.

1 to 7, the plasma reaction unit 200 according to an embodiment of the present invention is disposed inside the chamber unit 100, and generates plasma by receiving power from the power supply unit 120. I can.

1, 2, 4, and 5, the plasma reaction unit 200 according to an embodiment of the present invention may include a processing unit 210 and a heating unit 220.

The processing unit 210 forms the exterior of the plasma reaction unit 200, and shares a central axis C with the chamber unit 100, and an inner wall portion 211 is formed on one surface facing the central axis C. , An outer wall portion 215 may be formed on the other surface facing the inner wall portion 211.

Referring to FIG. 1, the processing unit 210 according to an embodiment of the present invention may be formed as an electrode, and the processing unit 210 receives power from the power supply 120 and generates plasma. Can be generated.

Referring to FIG. 5, the processing unit 210 according to an embodiment of the present invention is coupled to a plate unit 300 to be described later, specifically a plate body 310, and a plurality of penetrations formed in the plate body 310 It may be disposed between the hole portions 311.

For this reason, when the powder P disposed in the placement unit 450 to be described later is supplied with the gas G from the gas supply unit 460 and moves from the lower side toward the through-hole part 311 in the upper side (see FIG. 1) The powder P may be moved in a horizontal direction with respect to the inner wall part 211 and the outer wall part 215 of the treatment part 210 in parallel with the extending direction of the treatment part 210 (up and down direction based on FIG. 1 ).

In addition, powder (P) is moved in the extending direction of the processing unit 210 (up and down directions based on Fig. 5) and in a vertical direction (left and right directions based on Fig. 5) and is adsorbed by the processing unit 210, when moving in the vertical direction It is possible to prevent the loss of (P) passing through the hole formed in the processing unit 210, and there is an effect of increasing the adsorption surface area of the powder P to the processing unit 210 during horizontal movement.

The processing unit 210 according to an embodiment of the present invention may be formed of a heat-resistant porous body or a porous mesh.

The effect of maintaining the state in which the powder P is adsorbed and collected on the surface of the processing unit 210 because the processing unit 210 according to an embodiment of the present invention is formed of a heat-resistant porous body or a porous mesh processed in nano or micro unit size There is. It is preferable to manufacture the processing unit 210 by selecting a material with less thermal deformation.

1, 2, 5 to 7, the processing unit 210 according to an embodiment of the present invention shares the central axis (C) with the chamber unit 100, the interior of the chamber unit 100 It is installed in, and may be formed to extend along the central axis (C) in the vertical direction (see FIG. 1).

1, 2, and 5, the processing unit 210 according to an embodiment of the present invention has a hollow interior, shares a central axis (C), and an inner wall portion from the central axis (C). A plurality of pieces may be provided so that the distances 211 or the outer wall portion 215 are different from each other.

1, 2, and 5, the processing unit 210 according to an embodiment of the present invention has openings formed at both ends in the longitudinal direction (upper and lower ends of Fig. 1), and in the arrangement unit 450 to be described later. The disposed powder P may be horizontally moved in parallel with the inner wall portion 211 or the outer wall portion 215 of the processing unit 210 in a direction from the lower side to the upper side (refer to FIG. 5 ).

Since the powder P is horizontally moved in parallel with the inner wall portion 211 or the outer wall portion 215 of the processing unit 210, the powder P is in a vertical direction to the extending direction of the processing unit 210 (up and down directions based on FIG. 5) Compared to being moved in the left and right direction (as shown in FIG. 5) and adsorbed to the processing unit 210, the powder P can be prevented from being lost through the hole formed in the processing unit 210, and when horizontally moving, the processing unit 210 ) There is an effect of increasing the adsorption surface area of the powder (P).

1, 2, 4, and 5, the processing unit 210 according to an embodiment of the present invention has a hollow interior, an inner circumferential surface may be formed in a cylindrical shape, and an inner wall portion 211 And the outer wall portion 215 may be formed. The powder P may be adsorbed and plasma-treated from the inner wall portion 211 and the outer wall portion 215 formed in the processing unit 210.

2, a plurality of processing units 210 according to an embodiment of the present invention share a central axis (C), and the distance from the central axis (C) to the inner wall portion 211 or the outer wall portion 215 May be formed differently and arranged radially.

Accordingly, the powder P is moved between the inner wall part 211 of one treatment part 210 and the outer wall part 215 of the other treatment part 210 in a plurality of adjacent treatment parts 210, and each inner wall part The powder P may be adsorbed and plasma-treated on the outer wall portion 211 and 215.

In the present invention, the cylindrical processing unit 210 has a different inner diameter or outer diameter and four are arranged radially, but the present invention is not limited thereto, and various modifications such as two, three, five or more are possible.

Since the powder P is horizontally moved between the inner wall part 211 and the outer wall part 215 in parallel with the extending direction of the treatment part 210, the adsorption surface area of the powder P on the treatment part 210 is increased, and plasma treatment is performed. It is possible to increase the throughput and processing efficiency of the powder (P).

In addition, there is an effect that the functionalization of the powder P, which is a fine particle, can be uniformly achieved and economical mass production is possible.

In addition, when the high-pressure gas is pressurized after the surface treatment and coating of the powder P is completed, it is uniformly pressurized along the inner circumference of the treatment unit 210 to remove the adsorbed powder P from the treatment unit 210. .

Referring to FIG. 4, the powder P is adsorbed on the surface of the processing unit 210 formed as an electrode under the condition that the suction pressure V is applied to the inside of the plasma reaction unit 200 according to an embodiment of the present invention. And can be stacked.

Specifically, the suction pressure V is applied through the through hole 311 formed in the plate body 310 to be described later, and the powder P is transferred from the lower side by the gas G supplied from the gas supply unit 460. When moving upward (refer to FIG. 5 ), it is horizontally moved in parallel with the extension direction of the adsorption surface formed on the processing unit 210 (up and down direction of FIG. 5 ), and may be adsorbed to the processing unit 210.

However, the present invention is not limited thereto, and a plurality of nano- or micro-sized holes may be formed in the treatment unit 210, and the powder P may be adsorbed on the surface of the treatment unit 210 by applying a suction pressure V. Modification can be implemented.

4 and 5, the processing unit 210 of the plasma reaction unit 200 according to an embodiment of the present invention includes all of the surface area as an adsorption area, but is not limited thereto, and at least one portion, or More than that portion may be included as a non-adsorption area.

6 and 7, the plasma reaction unit 200 according to an embodiment of the present invention, specifically, the processing unit 210 is any one of a built-in or integrated heating unit 220, or It can contain any combination.

Referring to FIG. 6, the heating unit 220 may be distributedly arranged in a built-in type on the thickness of the processing unit 210 according to an embodiment of the present invention.

The powder (P) is adsorbed and laminated on the surface of the processing unit 210 under the condition that the suction pressure (V) is applied inside the plasma reaction unit 200, and the entire surface area of the processing unit 210 of the plasma reaction unit 200 is adsorbed. Can be included as a domain.

Referring to FIG. 6, there is an effect of directly heating the powder P, which is fine particles, due to the heating unit 220 installed in the processing unit 210 according to an embodiment of the present invention.

Referring to FIG. 7, the heating unit 220 according to an embodiment of the present invention may be disposed between the plasma reaction unit 200, specifically, the processing unit 210 and the chamber unit 100. The heating unit 220 may be spaced apart from the processing unit 210 formed as an electrode at regular intervals, and the heating unit 220 may be arranged between the chamber units 100.

Referring to FIG. 7, powder P is adsorbed and laminated on the surface of the processing unit 210 under the condition that the suction pressure V is applied to the plasma reaction unit 200, specifically, the plasma reaction unit 210. All of the surface area of the processing unit 210 of the unit 200 may be included as an adsorption area.

Referring to FIG. 7, the powder P, which is fine particles, may be directly heated by the heating unit 220 installed between the chamber unit 100 and the processing unit 210 according to an embodiment of the present invention.

1 to 7, the plasma reaction unit 200 according to an embodiment of the present invention, specifically, the processing unit 210 on which the electrode is formed, is structurally different according to the arrangement of the heating unit 220 and the arrangement of the adsorption region. There may be.

The plasma reaction unit 200 according to an embodiment of the present invention shown in FIGS. 1 to 7, specifically, the processing unit 210 is for adsorbing powder P having a size of several nanometers to several hundred microparticles or fine particles in common. It may be formed of a filter provided with a hole portion of an appropriate size.

In addition, the powder (P) may be adsorbed to the processing unit 210 by the suction pressure V generated by the vacuum pump 510, but it is prevented from passing, and the powder P is added to the porous processing unit 210. Plasma surface treatment and coating on fine particles such as powder (P) adsorbed while uniformly adsorbing and laminating can be performed simultaneously.

After that, the powder (P), which has been surface-treated or coated by plasma (PL), is pressurized with gas to shake off the fine powder (P) from the porous treatment unit 210 and collect it through the powder collection unit 600. have.

1 to 7, the plate unit 300 according to an embodiment of the present invention is coupled to the inner wall of the chamber unit 100, and is electrically connected to the plasma reaction unit 200, specifically, the processing unit 210. It is connected to, and the position of the processing unit 210 inside the chamber unit 100 may be fixed.

The plate part 300 according to an embodiment of the present invention may include a plate body 310 and a porous filter 320. The plate body 310 has a through-hole part 311 formed on the moving path of the powder P inside the chamber part, and may be coupled to the inner wall of the chamber part 100.

Specifically, the through-hole part 311 is formed in a region in the plate body 310 to which the treatment part 210 is coupled, that is, a position corresponding between the inner wall part 211 and the outer wall part 215 of the plurality of treatment parts 210. I can.

1, 2, and 5, the porous filter 320 according to an embodiment of the present invention is coupled to the plate body 310 so as to cover the through hole 311, and is a nano or micro-sized hole. Additional can be formed.

As the porous filter 320 is formed with a plurality of holes in the nano- or micro-sized unit, the working gas is passed through and exhausted, and a plurality of processing units 210 having different powders P by transferring the powder P of the working gas It is moved between the inner wall portion 211 and the outer wall portion 215 of, and has an effect of being adsorbed to the processing portion 210.

1, 2, and 5, the porous filter 320 according to an embodiment of the present invention may be coupled to the plate body 310 so as to be disposed inside the through hole 311.

However, the present invention is not limited thereto, and FIG. 8 is a view schematically showing the configuration of a horizontally movable powder plasma processing apparatus including a porous filter according to another embodiment of the present invention, and the upper side of the plate body 310 as shown in FIG. It goes without saying that various modifications, such as covering the plate body 310 in which the through hole 311 is formed by being disposed and coupled to (based on FIG. 8) are possible.

1 and 5, the powder supply unit 400 according to an embodiment of the present invention supplies the powder P to the plasma reaction unit 200, and processes the powder P by plasma (PL) reaction. There is an effect that can be effectively supplied to the plasma reaction unit 200 to be able to do so.

The powder supply unit 400 according to an embodiment of the present invention communicates with the chamber unit 100 to send the powder P from the powder supply device 110 to the plasma reaction unit 200, and a feeder valve 410 is installed. It may include a runner 420 to be used, a heating unit 430 installed on the runner 420, a collision plate 440, a placement unit 450, and a gas supply unit 460.

In this way, the heating unit 430 installed on the runner 420 applies heat to the powder P injected into the plasma reaction unit 200 to first dry the powder agglomerated by moisture, etc. so that the pulverization action can easily occur. Through this, there is an effect of inducing dispersion and diffusion in the plasma reaction unit 200 to be adsorbed to an even area of the processing unit 210 formed as an electrode.

Referring to FIG. 1, the powder supply unit 400 according to an embodiment of the present invention moves the powder P before the powder P supplied from the powder supply device 110 reaches the plasma reaction unit 200. It is disposed on the path and may include a collision plate 440 colliding with the powder (P).

Referring to FIG. 1, in the present invention, the powder supply unit 400 may transport the powder P as a gas and inject it into the plasma reaction unit 200.

The collision plate 440 according to an embodiment of the present invention induces a collision of the powder P moving to the plasma reaction unit 200 through the runner 420 to crush the powder P, thereby pulverizing the powder ( The P) is dispersed so that the electrode is uniformly adsorbed to the porous treatment unit 210.

The powder P dried by the heating unit 430 according to an embodiment of the present invention has an effect of improving dispersibility as compared to that of not.

Referring to FIG. 1, the collision plate 440 according to an embodiment of the present invention is installed near the end of the runner 420, but is not limited thereto, and the inside of the chamber unit 100, the plasma reaction unit 200 ), specifically the outer portion of the processing unit 210, may be installed at the outlet portion of the runner 420 supplying the powder (P), thereby always colliding before the powder (P) reaches the plasma reaction unit (200) Can cause.

The collision plate 440 according to an exemplary embodiment of the present invention may be installed in an inclined shape with an angle open toward the top (based on FIG. 1) so that dispersion of the powder P occurs quickly after collision.

The placement unit 450 according to an embodiment of the present invention is a region in which the powder P injected toward the plasma reaction unit 200 disposed inside the chamber unit 100 is disposed, and the lower side of the processing unit 210 (Fig. 1 standard).

Referring to FIG. 1, in a state of atmospheric pressure in which the vacuum pump 510 does not operate, the powder P sinks on the surface of the placement unit 450.

Specifically, in the standby mode before the plasma functionalization treatment of the powder P by the plasma reaction unit 200, the operation of the vacuum pump 510 is stopped and most of the powder P is operated to accumulate on the surface of the placement unit 450 You can choose the mode.

1 shows a state in which the powder P is accumulated on the placement unit 450, and in the powder plasma functionalization processing mode, the suction force generated by driving the vacuum pump 510 and the gas G supplied from the gas supply unit 460 are used. Due to this, the powder P accumulated in the placement unit 450 is moved upward (based on FIG. 5 ), and may pass between the inner wall portions 211 and the outer wall portions 215 of the plurality of processing units 210. .

Compared to the powder (P) is moved in a vertical direction with respect to the adsorption surface area of the processing unit 210 because the powder (P) is horizontally moved from the lower side to the upper direction (see Fig. 5) parallel to the adsorption surface of the processing unit 210 There is an effect of increasing the adsorption surface area of the powder P with respect to the processing unit 210.

1 and 5, the gas supply unit 460 according to an embodiment of the present invention is in communication with the chamber unit 100 and is located in the placement unit 450 disposed inside the chamber unit 100 Gas (G) can be injected and supplied toward the powder (P) side.

By activating the flow of the powder P due to the gas supply unit 460 according to an embodiment of the present invention, flow adsorption to the adsorption surface of the plasma reaction unit 200, specifically, the processing unit 210 is uniformly and stably induced There is an effect that can be done.

1 and 5, the gas supply unit 460 according to an embodiment of the present invention may include a gas guide tube 461.

The gas guide pipe 461 provides a flow path of the gas G flowing into the chamber unit, and may be formed to be inclined to be inclined at a predetermined angle so as to be concentrated at the center of the placement unit 450.

Accordingly, the powder (P) collected in the placement unit (450) is floated so that it is moved in the upward direction (as shown in FIG. 5), and specifically, each of the plurality of processing units (210) that share the central axis (C) and are radially disposed The powder P is horizontally moved parallel to the adsorption surface of the treatment unit 210 between the outer wall part 215 and the inner wall part 211, thereby increasing the adsorption surface area.

1 and 5, the powder adsorption means 500 according to an embodiment of the present invention is connected to the chamber unit 100 or the plasma reaction unit 200, and the plasma reaction unit 200 or the chamber unit (100) There is an effect of varying the internal pressure, from which the powder (P) is adsorbed onto the processing unit 210 and subjected to plasma treatment.

1 and 5, the powder adsorption means 500 according to an embodiment of the present invention is a pressure so that the suction pressure V is applied to the processing unit 210 by varying the internal pressure of the plasma reaction unit 200. A vacuum pump 510 that transmits energy, a vacuum pump valve 530 capable of applying or controlling the pumping pressure of the vacuum pump 510 to the plasma reaction unit 200, and the chamber unit 100 or plasma It may include a flow path 550 connecting the reaction unit 200 and the vacuum pump 510.

1 to 4, the pumping pressure of the vacuum pump 510 according to an embodiment of the present invention may generate a suction pressure V in the chamber unit 100 or the plasma reaction unit 200. .

The mechanism by which the powder P is adsorbed to the plasma reaction unit 200, specifically the processing unit 210, is the principle that the powder P is adsorbed by a pressure difference due to the suction pressure V, and the potential difference in the plasma PL is When generated and the powder (P) is charged by the plasma (PL), it is due to the existence of an electrostatic adsorption mechanism by the electrostatic phenomenon.

Referring to FIG. 1, a flow path 550 according to an exemplary embodiment of the present invention may be formed of an insulating tube having insulation performance in order to maintain insulation between an electrode and a ground.

The electrode tube 130 to which the flow path 550 is connected is formed as a tube through which electricity is passed through the metal tube flow path 550 and through which gas can flow, and an electrode is used to insulate the electrode tube 130 and the chamber unit 100. Electrical insulation can be secured by treating the tube 130 with an insulator 140.

In addition, the electrode tube 130 and the processing unit 210 according to an embodiment of the present invention are electrically connected, and the electric line of the power supply device 120 is connected to the electrode tube 130. I can.

1 and 5, a reverse pressure is applied to the electrode tube 130 according to an embodiment of the present invention to maintain or release the vacuum inside the plasma reaction unit 200, that is, the suction pressure V. A reverse pressure valve 570 for controlling the inflow may be installed.

The reverse pressure valve 570 may be installed by providing a reverse pressure inlet extending from the flow path 550. Referring to FIG. 1, the arrow direction'c' denotes exhaust, and'd' denotes reverse pressure inlet.

Referring to FIGS. 1 and 5, a powder collecting unit 600 may be integrated and connected to the plasma reaction unit 200 according to an exemplary embodiment of the present invention through an opening/closing valve 610.

Through the integrated structure of the plasma reaction unit 200 and the powder collection unit 600 according to an embodiment of the present invention, the powder P fine powder, which has been surface-treated and coated through the plasma PL, is opened and closed with the valve 610. After opening and shaking off from the processing unit 210 of the plasma reaction unit 200, it can be collected from the powder collection unit 600 immediately.

1 and 5, a vent gas flow path 620 into which a vent gas'e' is introduced is connected to the powder collection unit 600, and a vent valve 630 is installed in the vent gas flow path 620. The vent gas flow path 620 may be connected through a flow path 550 for transmitting the pumping pressure of the vacuum pump 510 and a branch flow path 650 in which the collection part vacuum valve 640 is installed.

Referring to FIGS. 1 and 5, a gas induction path 240 for supplying and supplying an external gas to the plasma reaction unit 200 according to an embodiment of the present invention may be installed.

1 and 5, the arrow direction mark'b' is a fresh gas supplied from the outside, and a fresh gas is supplied around the insulator 140 through the gas induction path 240 so that the conductive fine powder is converted into It has the effect of suppressing the phenomenon of being adsorbed to the periphery and maintaining electrical insulation.

1 to 7, the horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention is a bubbler for injecting a liquid monomole in a thin film coating using plasma polymerization, although not specifically shown in the drawings. bubbler) may be further included.

In addition, by injecting one or more of O2, N2, NH3, CF4, and precursors to control the functional groups on the surface of the powder P or the physical properties of the thin film, plasma-CVD (plasma-chemical vapor) is applied to the surface of the powder P. Deposition) may be selectively included.

The operating principle and effect of the horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention as described above will be described.

1 to 7, with the horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention, powder injection for plasma treatment, plasma treatment of the powder, and recovery treatment after completion of the plasma treatment of the powder are performed. Hereinafter, the introduction of powder for plasma treatment and plasma treatment of the powder will be described in detail.

The powder P stored in the powder supply device 110 is transferred to the plasma reaction unit 200 at high speed through the runner 420 in the direction'a' of FIG. 1.

When the vacuum pump 510 is operated, a suction pressure (V) is formed in the plasma reaction unit 200, and the powder P is sucked into the plasma reaction unit 200 or the powder supply device 110 ) You can move the powder (P) by pressing itself.

The heating unit 430 installed on the runner 420 of the powder supply unit 400 dries the powder P and sends it to the plasma reaction unit 200. When passing through the runner 420 where the heating unit 430 is installed, Dry the lumped powder (P) by moisture, etc. so that the lumped powder (P) can be crushed well.

Referring to FIGS. 1 and 5, the powder P exiting the runner 420 does not immediately reach the plasma reaction unit 200 and hits the collision plate 440 again.

The agglomerated powder (P) collides with the collision plate 440 at high speed, and the lumped powder (P) is divided into its original particle state and dispersed, and the plasma reaction unit 200, specifically the processing unit 210 in which the electrode is formed. It can be adsorbed evenly on the circumferential surface area.

The powder P that is pulverized by colliding with the collision plate 440 is disposed under the chamber unit 100, specifically, the processing unit 210 disposed inside the chamber unit 100 (see FIG. 1). 450).

1 and 5, gas is injected and supplied from a gas supply unit 460, specifically a gas guide tube 461 according to an embodiment of the present invention, and the powder P accumulated in the placement unit 450 Since it is sprayed toward the center, there is an effect of stably moving the powder P to the processing unit 210.

Powder (P) by the suction pressure (V) of the vacuum pump 510 and the gas injected from the gas supply unit 460 is each inner wall portion 211 or outer wall portion 215 of the processing unit 210 of different sizes It passes through and moves in an upward direction (refer to FIG. 5 ), and horizontally moves parallel to the adsorption surface of the processing unit 210 to be adsorbed and plasma treated.

As a result, the powder P is moved in a vertical direction with respect to the adsorption surface of the treatment unit 210 to increase the adsorption section due to the movement, and the powder P passes through the hole formed in the treatment unit 210. There is an effect of relatively reducing the generated loss.

In the process of sending the powder P to the plasma reaction unit 200 for plasma treatment, fresh external gas'b' is injected through the gas induction furnace 240 to conduct the insulator 140 surrounding the electrode tube 130. By preventing the powder P from sticking, there is an effect of maintaining electrical insulation and maintaining a stable plasma PL.

In the horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention, the powder supply device 110, the heating unit 430, the gas supply unit 460, the vacuum pump 510, and the power supply unit 120 are respectively By operating, plasma treatment of the powder P may be performed.

At this time, the valves opened are feeder valves 410 installed on the runner 420 that injects powder P into the plasma reaction unit 200, and the suction force of the vacuum pump 510 is the suction pressure of the plasma reaction unit 200 (V ) To form a vacuum pump valve 530 installed in the flow path 550, an opening/closing valve 610 connecting the plasma reaction unit 200 and the powder collecting unit 600, and the remaining valves are maintained in a closed state.

In the powder plasma treatment process by the horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention, the runner 420 to which the heating unit 430 is continuously installed and the powder P flowing through the collision plate The plasma treatment is continuously plasma-treated while being adsorbed to the surface of the processing unit 210 by the suction pressure V of the vacuum pump 510, and when the powder P is deposited on the processing unit 210 to some extent, the plasma processing is stopped, and the powder ( P) It can be converted to collection operation.

It goes without saying that the plasma (PL) reaction time can be freely determined and adjusted according to the components of the powder P to be plasma treated and the purpose of treatment.

Plasma reaction unit 200 according to an embodiment of the present invention may exhibit the characteristics of the adsorption type by the action of the suction pressure (V) by the vacuum pump 510.

Apart from the porous filter 320, the processing unit 210 according to an embodiment of the present invention may be formed as a filter having a hole portion having a size of several nanometers to several hundreds of microns. It is also possible to freely design the volume of the surface area according to specifications and treatment capacity, and a mesh-like member may be selected and applied as the treatment unit 210.

1 to 7, the processing unit 210 according to an embodiment of the present invention shares a central axis (C) with the chamber unit 100, and a plurality of different distances from the central axis (C). The four processing units 210 may be radially arranged.

Due to this, the powder P passes between the inner wall portion 211 and the outer wall portion 215 of each of the plurality of different processing units 210 and is horizontally moved in parallel with the adsorption surface of the processing unit 210, and the processing unit 210 Compared to the movement of the powder (P) in the vertical direction with respect to the adsorption surface of ), the adsorption section and the adsorption surface area are increased, and the powder (P) throughput is increased.

Plasma reaction unit 200 according to an embodiment of the present invention by the suction pressure (V) generated by the vacuum pump 510 powder (P) fine particles of the outer circumferential surface or outer circumferential surface of the processing unit 210, that is, the inner wall ( 211), the powder P that is adsorbed on the outer wall part 215 but does not pass through it is uniformly laminated on the treatment part 210 and at the same time is formed as an electrode by the plasma PL on the surface of the treatment part 210 The surface treatment or coating of the powder (P) microparticles adsorbed on may be selectively treated.

Referring to FIG. 6, the plasma reaction unit 200 according to an embodiment of the present invention may be installed in a built-in type having a heating unit 220 embedded therein. As shown in FIG. 7, the plasma reaction unit 200 and the processing unit 210 By arranging the heating unit 220 between the chamber units 100 to supply heat to the processing unit 210 or its periphery, the powder (P) fine particles are removed during the surface treatment and coating process for the powder (P) fine particles. Can be heated.

Accordingly, there is an effect of increasing the efficiency of the surface treatment and coating treatment for the powder (P) fine particles.

After the surface treatment and coating are completed, it is pressurized with high-pressure gas to shake off the fine powder from the processing unit 210 and can be recovered directly through the powder collection unit 600 without a separate recovery equipment, so that plasma-treated powder (P) can be easily recovered. It can be quickly and economically recovered.

The adsorption type plasma reaction unit 200 according to an embodiment of the present invention is equipped with a bubbler (not shown) capable of injecting a liquid monomole during thin film coating of the powder (P) fine powder using plasma polymerization, Since gas (O2, N2, NH3, CF4, various precursors, etc.) can be injected to control the functional groups on the surface or physical properties of the thin film, plasma (PL)-CVD can be freely performed on the surface of the powder (P). .

Meanwhile, the horizontally movable powder plasma processing apparatus 1 according to an embodiment of the present invention may perform a recovery treatment of the powder P after completion of the powder plasma treatment as follows.

When the operation of the powder supply device 110 and the power supply device is stopped, plasma processing is also stopped. At this time, the valves that are closed are the feeder valve 410 on the runner 420 side, the on/off valve 610 installed between the plasma reaction unit 200 and the powder collection unit 600, and a collection unit vacuum valve installed in the branch flow path 650 It is a reverse pressure valve 570 installed in the flow path 550 and 640.

The valves that are open are vacuum pump valves 530 and vent valves 630 that make the inside of the powder collection unit 600 at atmospheric pressure. At this time, the powder P collected in the powder collecting part 600 is the powder P that has not properly undergone plasma treatment.

That is, as powders P that have not adhered to the processing unit 210 and thus have fallen into a state in which plasma treatment is uncertain, the powder collection unit 600 may be attached to the plasma reaction unit 200 again after being separated and collected.

Then, the vent valve 630 and the vacuum pump valve 530 are closed, and the inside of the powder collecting unit 600 is vacuumed by opening the vacuum valve 640 of the collection unit, and when the internal pressure of the chamber unit 100 is the same, it is opened and closed. The valve 610 is opened, and the collection part vacuum valve 640 is closed.

Then, by opening the reverse pressure valve 570, the forward reverse pressure gas'd' flows into the processing unit 210 along the flow path 550 and enters the processing unit 210 of the plasma reaction unit 200 at a relatively high pressure. Shake off the attached powder (P) toward the chamber part (100).

The powder P to be shaken falls into the powder collection unit 600, and the powder P for which plasma treatment is completed can be selectively obtained by collecting the dropped powder P.

Referring to FIGS. 1 and 5, according to the plasma reaction unit 200 according to the present invention, the size of the plasma surface treatment is performed while uniformly adsorbing the fine particles of the powder P on the surface of the processing unit 210. In the case of small nanoparticles or micro-sized fine particle powder (P), there is an effect that can be functionalized.

In addition, since the adsorption state of the powder (P) can be maintained, the reaction time of the plasma (PL) can be freely controlled under optimal conditions, thereby enabling uniform and effective surface treatment of fine particles.

In addition, it is also possible to inject the monomole in the gaseous state into the plasma reaction unit 200 at the same time as the powder (P) fine particles, or to inject it later to coat the surface of the fine particles using plasma polymerization.

In addition, due to the chamber filter 105 formed on the inner circumferential surface of the chamber unit 100, there is an effect of reducing the amount of powder P that is adsorbed on the inner circumferential surface of the chamber unit 100 and is lost.

The processing unit 210 according to an embodiment of the present invention is provided with a plurality of different distances from the central axis C and arranged in a radial manner, so that fine particles such as powder P are moved from the lower side to the upper side (see FIG. 5). It is moved, passes between the inner wall portion 211 and the outer wall portion 215 of the different treatment units 210, and has an effect of increasing the adsorption section and the adsorption surface area.

As the plurality of processing units 210 are provided, the surface area can be proportionally increased, so that the functionalization of fine particles can be uniformly achieved, and the mass production of the plasma surface-treated or coated high-quality powder P is possible. In addition to this, it is possible to economically treat and recover the powder (P).

According to the horizontally movable powder plasma processing apparatus 1 according to the embodiments of the present invention, it is possible to mass-produce various nano powders used in a wide range of industrial fields such as information, electronics industry, chemical catalysts, lightweight nano-environmental materials, and energy fields. It can be commercialized by mass-producing nano functionalization and composite materials in various forms.

In particular, graphene, nanotubes, nanofibers, graphite, carbon black, etc., which are carbon-based microparticles classified as materials with high intermolecular attraction, can be treated with a functionalizer that can be used by dispersing in other materials. Productivity and environmentally friendly functionalization treatment is possible.

The specific implementations described in the present invention are examples and do not limit the scope of the present invention in any way. For brevity of the specification, descriptions of conventional electronic configurations, control systems, software, and other functional aspects of the systems may be omitted. In addition, the connection or connection members of the lines between the components shown in the drawings exemplarily represent functional connections and/or physical or circuit connections, and in an actual device, various functional connections or additional physical Connections, or circuit connections, may be represented. In addition, if there is no specific mention such as "essential", "important", etc., it may not be an essential component for the application of the present invention.

In the specification of the present invention (especially in the claims), the use of the term "above" and a similar reference term may correspond to both the singular and the plural. In addition, when a range is described in the present invention, the invention to which an individual value falling within the range is applied (unless otherwise stated), and each individual value constituting the range is described in the detailed description of the invention. Same as Finally, if there is no explicit order or contrary to the steps constituting the method according to the present invention, the steps may be performed in a suitable order. The present invention is not necessarily limited according to the order of description of the steps. The use of all examples or illustrative terms (for example, etc.) in the present invention is merely for describing the present invention in detail, and the scope of the present invention is limited by the above examples or illustrative terms unless limited by the claims. It does not become. In addition, those skilled in the art can recognize that various modifications, combinations, and changes may be configured according to design conditions and factors within the scope of the appended claims or their equivalents.

The embodiment according to the present invention described above may be implemented in the form of a computer program that can be executed through various components on a computer, and such a computer program may be recorded in a computer-readable medium. In this case, the medium may continue to store a program executable by a computer, or may be stored for execution or download. In addition, the medium may be a variety of recording means or storage means in a form in which a single piece of hardware or several pieces of hardware are combined, but is not limited to a medium directly connected to a computer system, and may be distributed on a network. Examples of media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical recording media such as CD-ROMs and DVDs, magnetic-optical media such as floptical disks, and And a ROM, RAM, flash memory, and the like, and may be configured to store program instructions. In addition, examples of other media include an app store that distributes applications, a site that supplies or distributes various software, and a recording medium or storage medium managed by a server.

In the above, the present invention has been described by specific matters such as specific elements and limited embodiments and drawings, but this is provided only to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. Anyone with ordinary knowledge in the technical field to which the invention belongs can make various modifications and changes from these descriptions.

Accordingly, the spirit of the present invention is limited to the above-described embodiments and should not be defined, and all ranges equivalent to or equivalently changed from the claims to be described later as well as the claims to be described later are the scope of the spirit of the present invention. It will be said to belong to.

1: Horizontally movable powder plasma processing device C: Central axis
G: gas PL: plasma
P: powder V: suction pressure
100: chamber part 105: chamber filter
110: powder supply device 120: power supply
130: electrode tube 140: insulator
200: plasma reaction unit 210: processing unit
211: inner wall portion 215: outer wall portion
220, 430: heating unit 240: gas induction furnace
300: plate portion 310: plate body
311: through hole 320: porous filter
400: powder supply unit 410: feeder valve
420: runner 440: collision plate
450: placement unit 460: gas supply unit
461: gas guide tube 500: powder adsorption means
510: vacuum pump 530: vacuum pump valve
550: Euro 570: reverse pressure valve
600: powder collection unit 610: opening and closing valve
620: vent gas flow path 630: vent valve
640: collection part vacuum valve 650: branch flow path

Claims (10)

In the horizontally movable powder plasma processing apparatus for plasma processing the powder through a plasma reactor,
A chamber part having a hollow inside;
A plasma reaction unit disposed inside the chamber unit and receiving power from a power supply to generate plasma;
A powder supply unit for moving the powder to the plasma reaction unit; And
Adsorption means for varying the pressure inside the chamber unit and adsorbing and plasma-processing powder to the plasma reaction unit therefrom; and
The plasma reaction unit includes a plurality of processing units having a hollow interior, sharing a central axis, and having different distances from the central axis.
A plate portion coupled to an inner wall of the chamber portion, electrically connected to the processing portion, and fixing a position of the processing portion within the chamber portion; and a horizontally movable powder plasma processing apparatus. The method of claim 1,
The processing unit, the horizontally movable powder plasma processing apparatus having openings formed at both ends in the longitudinal direction. The method of claim 1,
The processing unit is formed in a cylindrical shape, horizontally movable powder plasma processing apparatus. The method of claim 1,
The processing unit includes an inner wall portion and an outer wall portion, and the powder is adsorbed and plasma-treated from the inner wall portion and the outer wall portion. delete The method of claim 1,
The plate part,
A plate body having a through-hole formed on the moving path of the powder in the chamber part and coupled to the inner wall of the chamber part; And
Containing, a horizontally movable powder plasma processing apparatus that is coupled to the plate body to cover the through hole and has a nano- or micro-sized hole part. The method of claim 1,
The powder supply unit,
A placement unit installed inside the chamber unit and in which the powder is disposed; And
A gas supply unit communicating with the chamber unit and supplying gas to the placement unit side; further comprising, a horizontally movable powder plasma processing apparatus. The method of claim 7,
The arrangement unit and the gas supply unit are disposed below the processing unit, a horizontally movable powder plasma processing apparatus. The method of claim 1,
In the thin film coating using plasma polymerization, it further includes a configuration equipped with a bubbler for injecting a liquid monomole,
Horizontally movable powder plasma treatment that performs plasma-chemical vapor deposition (CVD) on the powder surface by injecting one or more of O2, N2, NH3, CF4, and precursors to control functional groups on the powder surface or physical properties of the thin film Device. The method of claim 1,
The chamber part,
A horizontal movable powder plasma processing apparatus, wherein a plasma is generated by receiving power from the power supply device, and a chamber filter having a plurality of nano- or micro-sized holes is formed on an inner surface thereof.

Images