KR102195459B1 - Flexible organic light emitting display and method of manufacturing the same - Google Patents

Abstract

A new flexible organic light emitting display device according to an exemplary embodiment of the present invention is provided. The flexible display device includes a flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area. A display unit including a thin film transistor and an organic light emitting device is disposed in the display area. A first insulating layer formed on a part of the non-display area extending from the display area is formed on the flexible substrate. The first insulating layer includes a zigzag pattern. The plurality of wirings are electrically connected to the display unit. The plurality of wirings extend to cross the non-display area and the bent area, and are positioned on the first insulating layer in a portion of the non-display area. A passivation layer is formed on the first insulating layer and the plurality of wirings. The frequency of cracks in the passivation layer is reduced by the structure of the zigzag pattern of the first insulating layer. In addition, even when cracks are generated in the passivation layer due to the structure of the zigzag pattern, the frequency of the cracks in the passivation layer leading to the cracks in the passivation layer in contact with the wiring can be reduced.

Description

A flexible organic light-emitting display device and a method of manufacturing a flexible organic light-emitting display device {FLEXIBLE ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a flexible organic light emitting display device and a method of manufacturing a flexible organic light emitting display device, and more particularly, to prevent cracking of a passivation layer due to stress when bending the flexible organic light emitting display device. The present invention relates to a flexible organic light emitting display device for minimizing and a method of manufacturing the flexible organic light emitting display device.

In recent years, a flexible display device, which is manufactured to display an image even if it is bent like paper by forming a display portion and a wiring on a flexible substrate such as plastic, which is a flexible material, has attracted attention as a next-generation display device.

As the range of application of the flexible display device to personal portable devices as well as computer monitors and TVs is diversified, research on a flexible display device having a large display area and reduced volume and weight is in progress. In particular, an organic light emitting display (OLED) does not require a separate light source, unlike a liquid crystal display (LCD), and thus can be implemented with a relatively thin thickness. Efforts to manufacture a flexible display device continue.

[Related technical literature]

1. Narrow bezel type display device (Korean Patent Application No. 2012-0039851)

2. Narrow bezel type liquid crystal display device (Korean Patent Application No. 2011-0131149)

Recently, as demands for flexible organic light emitting diodes increase, it is necessary to secure flexibility of a substrate, various insulating layers formed on the substrate, and wiring formed of a metal material. In the case of the substrate, the flexibility of the substrate may be secured by using a flexible material such as plastic.

Meanwhile, in the organic light-emitting display device, by bending the bending area of the area where the light does not emit light, the area in which the light does not emit may be minimized. When the bending region is bent, the wiring formed in the bending region and the passivation layer, which is an inorganic or organic film, may be disconnected due to stress due to bending.

In order to minimize disconnection between the wiring and the passivation layer, a method of removing the multi-buffer layer, the gate insulating layer, and the interlayer insulating layer from the bending region may be employed. When all of the multi-buffer layer, the gate insulating layer, and the interlayer insulating layer are removed from the bending area, only the wiring and the passivation layer remain in the bending area, thereby reducing the thickness of the flexible OLED display in the bending area. When the thickness of the flexible OLED display device is reduced in the bending area, the stress applied to the wiring and the passivation layer formed in the bending area is reduced, and the generation of cracks in the wiring and the passivation layer formed in the bending area is significantly reduced.

In addition, when the multi-buffer layer, the gate insulating layer, and the interlayer insulating layer are removed from the bending region, the occurrence of cracks in the wiring and the passivation layer in the bending region decrease, but the multi-buffer layer, the gate insulating layer, and the interlayer insulating layer are removed. In addition, cracks in the passivation layer may increase in areas where a step occurs. The phenomenon that the crack generation of the passivation layer increases in the portion where the step difference occurs may be due to the step coverage of the passivation layer formed to cover the step difference and a shim generated under the passivation layer.

Step coverage refers to the ability to deposit a film having a uniform thickness on the bottom and wall surfaces of trenches or holes having a large aspect ratio. That is, if the step coverage of the passivation layer is not excellent, the passivation layer is formed with a low thickness on the side of the portion where the step occurs. The passivation layer having a low thickness may be more susceptible to stress caused by bending in a portion where a step occurs.

In addition, a shim may be formed at the lower end of the side surface of the portion where the step occurs. A shim is a gap in which the side ends. Since the thickness of the passivation layer is rapidly reduced at the point where the shim is formed by the shim, there is a high probability that a crack of the passivation layer will occur around the shim. Therefore, the passivation layer formed on the side of the portion where the step occurs is more vulnerable to stress caused by bending.

When at least some of the multi-buffer layer, the gate insulating layer, and the interlayer insulating layer are removed from the bending region, there is a problem that cracks in the passivation layer generated at the boundary from which some of the multi-buffer layer, the gate insulating layer, and the interlayer insulating layer are removed are propagated. have.

Cracks in the passivation layer due to bending stress may propagate at the point where the crack occurs. Crack propagation means that the crack continues from the point where the crack occurs to the point where it is vulnerable to stress.

In particular, cracks in the passivation layer are closely related to cracks in wiring. A crack in the passivation layer may be generated first, and the crack in the passivation layer may be extended to extend to a region where the wiring and the passivation layer are in contact. In this case, as the crack extends in the passivation layer, cracks may also occur in the wiring below. It can be explained for various reasons that the occurrence of a crack in the passivation layer affects the wiring below as well, but it is known that the force generated when the crack in the passivation layer occurs causes a crack in the wiring.

When the wiring is cracked, the thin film transistor or the organic light emitting element cannot operate normally because normal signal transmission is not performed, and the crack of the wiring leads to a defect in the flexible OLED display.

As a result, when at least some of the buffer layer, the gate insulating layer, and the interlayer insulating layer are removed from the bending region, cracks in the wiring and the passivation layer in the bending region are reduced. However, since cracks in the passivation layer and propagation of the generated cracks occur at the boundary from which some of the multi-buffer layer, gate insulating layer, and interlayer insulating layer are removed, it is important to improve the crack generation and propagation of the generated cracks in the passivation layer. need.

Accordingly, the problem to be solved by the present invention is that when at least some of the buffer layer, the gate insulating layer, and the interlayer insulating layer are removed from the bent region, it is possible to reduce the stress that causes cracks in the wiring and the passivation layer in the portion where the step occurs. It is to provide a flexible organic light emitting display device.

In addition, another problem to be solved by the present invention is to provide a flexible organic light emitting display device in which the crack of the passivation layer does not propagate to the wiring below the passivation layer even if a crack occurs in the passivation layer.

The problems of the present invention are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A new flexible organic light emitting display device according to an exemplary embodiment of the present invention is provided. The flexible display device includes a flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area. A display unit including a thin film transistor and an organic light emitting device is disposed in the display area. A first insulating layer formed in a portion of the non-display area extending from the display area is formed on the flexible substrate. The first insulating layer includes a zigzag pattern. The plurality of wirings are electrically connected to the display unit. The plurality of wirings extend to cross the non-display area and the bent area, and are positioned on the first insulating layer in a portion of the non-display area. A passivation layer is formed on the first insulating layer and the plurality of wirings. The frequency of cracks in the passivation layer is reduced by the structure of the zigzag pattern of the first insulating layer. In addition, even when cracks are generated in the passivation layer due to the structure of the zigzag pattern, the frequency of the cracks in the passivation layer leading to the cracks in the passivation layer in contact with the wiring can be reduced. As a result, it is possible to reduce defects such as thin film transistors due to cracks in wiring by preventing cracks in wiring.

A new flexible organic light emitting display device according to an exemplary embodiment of the present invention is provided. The flexible organic light emitting display device includes a flexible substrate having a non-bending area and a bent area extending from the non-bending area. The flexible organic light-emitting display device also includes a first insulating layer formed on a flexible substrate in a non-bending area and a passivation layer formed on the first insulating layer. The first insulating layer has a zigzag pattern between the non-bending region and the bent region, and the frequency of cracks in the passivation layer is reduced by the zigzag pattern.

According to an embodiment of the present invention, a method of manufacturing a new flexible organic light emitting display device is provided. First, a second insulating layer is deposited on a flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area. Thereafter, a first insulating layer is deposited on the second insulating layer, and the second insulating layer and the first insulating layer are patterned in a zigzag pattern in a part of the non-display area. Thereafter, the first insulating layer is patterned in a zigzag pattern in another part of the non-display area so that the second insulating layer is exposed, and wiring is formed on the first insulating layer and the second insulating layer to cross the bending area from the display area. To form. A passivation layer is deposited on the wiring, and the bending region of the flexible substrate is bent.

According to an embodiment of the present invention, a method of manufacturing a new flexible organic light emitting display device is provided. First, a second insulating layer is deposited on a flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area. The second insulating layer is patterned in a zigzag pattern to be formed in a portion of the display area and the non-display area. Thereafter, a first insulating layer is deposited to cover the second insulating layer, and the first insulating layer is patterned in a zigzag pattern so as to be formed between the zigzag pattern of the second insulating layer formed in a part of the non-display area and the bending region. A wiring is formed on the patterned first insulating layer so as to cross the bending area from the display area, and a passivation layer is deposited on the wiring. The flexible OLED display manufactured by the present manufacturing method can reduce the frequency of occurrence of cracks in the passivation layer and reduce the frequency in which cracks in the passivation layer extend to cracks in the passivation layer in contact with the wiring.

Details of other embodiments are included in the detailed description and drawings.

1A is a schematic perspective view illustrating a shape of a wiring and a first insulating layer before a bending region of a flexible OLED display according to an exemplary embodiment is bent.
FIG. 1B is a cross-sectional view of a flexible organic light emitting diode display according to Ib-Ib' of FIG. 1A.
FIG. 1C(a) is an enlarged view of a zigzag pattern of the first insulating layer in the non-display area of FIG. 1B to explain a reduced crack incidence rate in the passivation layer.
FIG. 1C(b) is an enlarged plan view illustrating a direction in which a crack line extends in a zigzag pattern of a flexible OLED display according to an exemplary embodiment.
FIG. 1C(c) is an enlarged plan view illustrating a zigzag pattern shape of a flexible organic light emitting display device according to an exemplary embodiment of the present invention.
FIG. 1D is a schematic perspective view illustrating a shape of a wiring and a first insulating layer when a bending area of a flexible organic light emitting display device according to an exemplary embodiment is bent.
FIG. 2A is a schematic perspective view illustrating a shape of a wiring, a first insulating layer, and a second insulating layer before a bending region of the flexible OLED display according to an exemplary embodiment is bent.
FIG. 2B is a cross-sectional view of the flexible organic light emitting display device according to IIb-IIb' of FIG. 2A.
3 is a cross-sectional view illustrating an embodiment of a structure in which a first insulating layer covers a second insulating layer having a zigzag pattern in a flexible organic light emitting display device according to an exemplary embodiment.
4 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention.
FIG. 5 is a flowchart illustrating a method of manufacturing a flexible organic light emitting display device having a structure in which a first insulating layer covers a second insulating layer having a zigzag pattern.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms different from each other, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have it, and the invention is only defined by the scope of the claims.

When an element or layer is referred to as “on” another element or layer, it includes all cases in which another layer or other element is interposed directly on or in the middle of another element.

Although the first, second, and the like are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical idea of the present invention.

The same reference numerals refer to the same components throughout the specification.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not limited to the size and thickness of the illustrated component.

Each of the features of the various embodiments of the present invention can be partially or entirely combined or combined with each other, and as a person skilled in the art can fully understand, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other. It may be possible to do it together in a related relationship.

A flexible organic light emitting display device refers to a display device to which flexibility is provided, and is a bendable display device, a rollable display device, an unbreakable display device, and a foldable display. A device, a twistable display device, a stretchable display device, a wrinkable display device, a resilient display device, and an elastic display device are used interchangeably. A type of flexible organic light-emitting display device includes a curved display device, and the curved display device refers to a display device in which the flexible organic light-emitting display device is bent in a specific direction and fixed.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A is a schematic perspective view illustrating a shape of a wiring and a first insulating layer before a bending region of a flexible OLED display according to an exemplary embodiment is bent. 1B is a cross-sectional view of a flexible organic light emitting display device according to Ib-Ib of FIG. 1A.

In the present specification, referred to as bending, referring to FIG. 1A, one side of the flexible substrate 110 positioned on the XY plane in the positive X-axis direction passes from the positive X-axis direction through the negative Z-axis direction. It means gradually bending toward the negative X-axis direction. In addition, when bending the flexible substrate 110 in a specific direction, such a specific direction is referred to as a bending direction.

Referring to FIG. 1A, the flexible organic light emitting display device 100 includes a flexible substrate 110, a display unit 120, a first insulating layer 130, a plurality of wirings 140, a multi-buffer layer 150, and a pad unit ( 190).

The flexible substrate 110 is a substrate for supporting various elements of the organic light emitting display device 100 and is formed of a flexible material to enable bending. The flexible substrate 110 has a display area DA, a non-display area NDA extending from the display area DA, a bending area BA extending from the non-display area NDA, and a pad area PA. A display unit 120 is formed in the display area DA, and the display unit 120 displays an image. The non-display area NDA refers to an area that is not bent among areas that do not display an image. The bending area BA refers to an area where the flexible substrate 110 is bent among areas that do not display an image. A pad portion 190 is formed in the pad area PA.

1A and 1B, the multi-buffer layer 150 is formed in the display area DA, the non-display area NDA, the bending area BA, and the pad area PA on the flexible substrate 110. In the bending area BA, the multi-buffer layer 150 protects the plurality of wirings 140 from moisture or air that may penetrate from the flexible substrate 110. The multi-buffer layer 150 may have a structure in which organic and inorganic materials are alternately stacked.

A first insulating layer 130 is formed in a portion of the display area DA and the non-display area NDA. The first insulating layer 130 is formed in the entire area of the display area DA, extends from the display area DA to form a part of the non-display area NDA, and the remaining part of the non-display area NDA, It is not formed in the bending area BA and the pad area PA. The first insulating layer 130 is formed only in a part of the non-display area NDA, so that cracks of the passivation layer 170 in the bending area BA may be minimized. When the first insulating layer 130 is not formed in the bending area BA, the stress applied to the passivation layer 170 formed in the bending area BA is reduced, so that the passivation layer 170 formed in the bending area BA The occurrence of cracks is significantly reduced.

1A and 1B, the first insulating layer 130 in the non-display area NDA is formed in a zigzag pattern 160. The zigzag pattern 160 is a pattern made of angled corners. The zigzag pattern 160 is formed to reduce the occurrence of cracks in the passivation layer 170 formed thereon.

The plurality of wirings 140 are formed on the multi buffer layer 150. The plurality of wirings 140 electrically connect the display unit 120 formed in the display area DA of the flexible substrate 110 and a driving circuit unit, a gate driver IC, a data driver IC, and the like to transmit signals. In order to minimize the occurrence of cracks in the wiring 140 when the flexible substrate 110 is bent, the wiring 140 is formed of a conductive material having excellent flexibility.

The plurality of wirings 140 extend to cross the non-display area NDA and the bending area DA. At least a portion of each of the plurality of wirings 140 positioned in the bending area BA extends in a diagonal direction with respect to the bending direction. Each of the plurality of wirings 140 extends in a straight line in a part of the non-display area NDA and extends in a shape in which a rhombus shape is continuously connected.

1A and 1B, in the non-display area NDA near the display area DA, a plurality of wirings 140 are on the first insulating layer 130 and a zigzag pattern of the first insulating layer 130 It is formed on 160. In the circle of the dashed-dotted line of FIG. 1A, a shape in which a plurality of wirings 140 are formed on the zigzag pattern 160 of the first insulating layer 130 is enlarged and shown. In the zigzag pattern 160 of the first insulating layer 130, a step difference between the first insulating layer 130 and the multi-buffer layer 150 is shown, and a shape in which the wiring 140 is formed on the zigzag pattern 160 is shown. do. The thickness of the wiring 140 is not expressed in order to more simply show the drawing within the circle of the dashed-dotted line of FIG. 1A.

In the enlarged view of FIG. 1A, the rhombus-shaped wiring 140 is formed on the first insulating layer 130 and formed on the side surface 162 of the first insulating layer 130. In addition, the wiring 140 is formed on a portion of the zigzag pattern 160. When the wiring 140 is formed on a portion of the zigzag pattern 160, a portion where a step difference occurs between the first insulating layer 130 and the multi-buffer layer 150, that is, the side surface 162 of the first insulating layer 130 ), and at a portion where the side surface 162 of the first insulating layer 130 and the multi-buffer layer 150 are connected, the wiring 140 has better step coverage and flexibility than the passivation layer 170, so that the occurrence of cracks can be minimized. .

In addition, the zigzag pattern 160 of the first insulating layer 130 may further reduce stress that generates cracks in the passivation layer 170 as compared to a linear pattern. Accordingly, the frequency of occurrence of cracks in the passivation layer 170 around the jig peg pattern 160 is reduced. In addition, even if a crack occurs in the passivation layer 170, since the propagation of the crack is guided in the direction in which the zigzag pattern 160 is formed, the generated crack propagation of the passivation layer 170 is minimized.

The wiring 140 is formed to correspond to the zigzag pattern 160 in the circle of the dashed-dotted line of FIG. 1A, which is shown enlarged. The wiring 140 formed corresponding to the zigzag pattern 160 has a boundary parallel to the zigzag pattern 160. When the wiring 140 is formed to correspond to the zigzag pattern 160, the wiring 140 is in contact with the zigzag pattern 160 in a wider area than when not formed to correspond to the zigzag pattern 160. Meanwhile, the passivation layer 170 is formed on the entire surface of the flexible substrate 110, but since it is formed on the wiring 140, the passivation layer 170 increases as the area in which the wiring 140 and the zigzag pattern 160 contact increases. The contact area of the zigzag pattern 160 is relatively reduced. As a result, when the contact area between the wiring 140 with excellent step coverage and the zigzag pattern 160 increases, the contact area between the passivation layer 170 and the zigzag pattern 160 with poor step coverage is relatively reduced, so that the zigzag pattern The occurrence of cracks in the passivation layer 170 at 160 is reduced.

In FIG. 1A, the side surface 162 of the first insulating layer 130 is shown as a plane perpendicular to the multi-buffer layer 150, but the first insulating layer 130 may have an inclined surface in the zigzag pattern 160. have. When the side surface of the first insulating layer 130 is inclined, the wiring 140 is formed on the inclined surface.

In FIG. 1A, it is shown that the zigzag pattern 160 is formed only in the non-display area NDA between the bending area BA and the display area DA, but the pad area PA is also the same as in the non-display area NDA. The first insulating layer 130 may be formed in a zigzag pattern 160. That is, when the bending area BA is bent, the stress that generates cracks is also transmitted to the pad area PA, so the zigzag pattern 160 of the first insulating layer 130 is formed in the pad area PA, The occurrence of cracks in the passivation layer 170 in the pad area PA may be reduced, and propagation of cracks may be minimized.

In FIGS. 1A and 1B, each of the plurality of wirings 140 is formed in a rhombus shape, so that at least a portion of each of the plurality of wirings 140 extends in a diagonal direction with respect to the bending direction, but is not limited thereto. Specifically, each of the plurality of wirings 140 may include a portion formed in at least one of a rhombus shape, a triangular wave shape, a sine wave shape, and a trapezoidal wave shape.

In FIGS. 1A and 1B, it is shown that all of the plurality of wirings 140 are formed in the same shape, but the present invention is not limited thereto, and each of the plurality of wirings 140 has a rhombus shape, a triangular wave shape, a sine wave shape, and a trapezoidal wave shape. It can be formed in the shape of.

Referring to FIG. 1B, the passivation layer 170 includes a display area DA, a non-display area NDA, and a bending area BA on the first insulating layer 130, the multi-buffer layer 150, and the plurality of wirings 140. ) Is formed on the front side. That is, the passivation layer 170 is formed on the first insulating layer 130 in a partial region of the non-display region NDA, and directly in contact with the plurality of wirings 140 in another region. In addition, the passivation layer 170 is formed on the multi-buffer layer 150 in some areas of the zigzag pattern 160 to the bending area BA of the non-display area NDA, and a plurality of wirings 140 in other areas. It is formed to be in direct contact with. The passivation layer 170 is formed to directly contact the plurality of wirings 140 to protect the plurality of wirings 140 from moisture, air, or physical impact that may penetrate from the outside.

The passivation layer 170 is made of an inorganic film or an organic film. However, an inorganic layer or an organic layer, which is a material constituting the passivation layer 170, has a property that is fragile and has lower flexibility than the plurality of wirings 140. When the bending area BA is bent, a crack may occur in the passivation layer 170 due to stress generated in the bending area BA. In addition, cracks generated in the passivation layer 170 may propagate to the plurality of wirings 140 formed to directly contact the passivation layer 170, thereby causing cracks in the plurality of wirings 140. However, the zigzag pattern 160 of the first insulating layer 130 of the flexible organic light emitting display device 100 according to an exemplary embodiment of the present invention has a stress that causes a crack in the passivation layer 170 compared to a linear pattern. Contains more of the reduced part. Accordingly, the frequency of occurrence of cracks in the passivation layer 170 around the jig peg pattern 160 is reduced. In addition, even if a crack occurs in the passivation layer 170, since the propagation of the crack is guided in the direction in which the zigzag pattern 160 is formed, the generated crack propagation of the passivation layer 170 is minimized.

Referring to FIG. 1B, a multi-buffer layer 150 is formed on the flexible substrate 110. The active layer 172 is formed on the multi-buffer layer 150, the gate insulating layer 173 is formed, the gate electrode 174 is formed on the gate insulating layer 173, and the interlayer insulating layer 175 is formed. The source electrode 176 and the drain electrode 177 are electrically connected to the active layer 172 through a contact hole between the gate insulating layer 173 and the interlayer insulating layer 175.

The thin film transistor T is a thin film transistor T having a coplanar structure including an active layer 172, a gate electrode 174, a source electrode 176, and a drain electrode 177. The thin film transistor T having a coplanar structure is a thin film transistor having a structure in which the source electrode 176, the drain electrode 177, and the gate electrode 174 are positioned above the active layer 172. In the present specification, it has been described that the thin film transistor T has a coplanar structure, but the present invention is not limited thereto, and thin film transistors having various structures may be used.

In addition, in FIG. 1B, it is assumed that the thin film transistor T is a P-type thin film transistor T, and it has been described that the anode 180 is connected to the drain electrode 177, but the thin film transistor T is N- In the case of a type thin film transistor, the anode 180 may be connected to the source electrode 176.

On the thin film transistor T, a passivation layer 170 for protecting the thin film transistor T and an overcoat layer 178 for planarizing the upper portion of the thin film transistor T are formed. An anode 180 in contact with the drain electrode 177 through a contact hole between the overcoat layer 178 and the passivation layer 170, an organic emission layer 182 formed on the anode 180, and a cathode formed on the organic emission layer 182 183 is formed. A reflective layer 179 is interposed between the overcoat layer 178 and the anode 180 under the organic emission layer 182, and a bank 181 is formed on the side of the anode 180. An encapsulation part 184 is formed on the cathode 183. In FIG. 1B, a top-emission type organic light emitting diode (top-emission) method including an anode 180, an organic emission layer 182, and a cathode 183, and in which light from the organic emission layer 182 is transmitted toward the cathode 183 Although a light emitting device is shown, an organic light emitting device of a bottom-emission method through which light is transmitted in the direction of the anode 180 may be used.

A connection part 142 is formed in the display area DA of the flexible substrate 110. The connection part 142 is a component for connecting the wiring 140 and an arbitrary component formed in the display area DA, and is formed of the same material as any one of various conductive components formed in the display part 120. In FIG. 1B, a case where the connection part 142 is formed of the same material as the gate electrode 174 is illustrated.

The wiring 140 is formed of the same material as any one of various conductive elements formed in the display area DA. In FIG. 1B, a case where the wiring 140 is formed of the same material as the source electrode 176 and the drain electrode 177 is illustrated. The wiring 140 is formed of the same material from the display area DA to the bending area BA, and may be formed by the same process.

The first insulating layer 130 in the non-display area NDA is formed of the same material as any one of various insulating layers formed in the display area DA. As shown in FIG. 1B, when the wiring 140 is formed of the same material as the source electrode 176 and the drain electrode 177, the first insulating layer 130 is formed in the display area DA of the flexible substrate 110. It is formed of the same material as the formed gate insulating layer 173 and the interlayer insulating layer 175.

The first insulating layer 130 is patterned to be formed in a portion of the display area DA and the non-display area NDA. The pattern of the first insulating layer 130 is spaced apart by 30 μm or more from the display area DA. When the zigzag pattern 160 and the display area DA are spaced apart by an interval of 30 μm or more, the encapsulation portion 184 of the display area DA can be patterned to a sufficient width, and between the encapsulation portion 184 and the zigzag pattern 160 A sufficient margin for the gap can be secured.

In FIG. 1B, it is illustrated that the wiring 140 is formed of the same material as the source electrode 176 and the drain electrode 177, but is not limited thereto, and the wiring 140 includes a gate electrode 174 and a source electrode 176. , The drain electrode 177, the reflective layer 179, and the cathode 183 are formed of the same material.

1B shows that the first insulating layer 130 is formed of the same material as the gate insulating layer 173 and the interlayer insulating layer 175, but is not limited thereto, and the first insulating layer 130 is a multi-buffer layer 150 ), the gate insulating layer 173 and the interlayer insulating layer 175 may be formed of the same material.

1C(a), (b), and (c) are enlarged plan views illustrating zigzag patterns and cracks of the flexible OLED display according to an exemplary embodiment. In FIGS. 1C (a), (b), and (c), for convenience of explanation, the passivation layer 170 of FIG. 1B will be described.

FIG. 1C(a) is an enlarged view of the zigzag pattern 160 of the first insulating layer 130 in the non-display area NDA of FIG. 1B in order to explain the reduced crack incidence rate of the passivation layer 170 .

The non-display area NDA is an area located next to the bending area BA and is not actually bent. However, the passivation layer 170 of the non-display area NDA is affected by stress from the bending area BA as the bending area BA is bent. Accordingly, cracks may also occur in the passivation layer 170 of the non-display area NDA due to stress caused by bending. The zigzag pattern 160 of the flexible OLED display 100 according to an exemplary embodiment of the present invention reduces the occurrence of cracks in the passivation layer 170.

Referring to (a) of FIG. 1C, point A is positioned at a point where the direction of the pattern changes in the zigzag pattern 160, and point B is positioned at a point where the zigzag pattern 160 is formed in a diagonal direction with respect to the bending direction. do. The sum of the stresses applied to points A and B is the same. However, the crack inducing stress applied to point A and point B is different. Accordingly, the frequency or probability of cracking the passivation layer 170 at points A and B is different. The stress that generates cracks in the passivation layer 170 formed at the point A is the stress in the direction indicated by arrows on both sides of the point A in (a) of FIG. 1C. That is, cracks generated in the passivation layer 170 are not generated only by the sum of stresses received by the passivation layer 170, but are generated differently depending on the direction in which the passivation layer 170 is subjected to the stress. The passivation layer 170 formed at the point A is very susceptible to stress due to low step coverage at the step and shims that may be formed at the bottom of the step.

When the bending direction is a direction parallel to the arrows shown at point A, the stress that causes cracking of the passivation layer 170 at point A is maximized. That is, when the bending direction and the arrows of the point A are parallel, the stress generating the crack of the passivation layer 170 is close to the sum of the stresses caused by bending. When the stress that generates cracks in the passivation layer 170 exceeds the threshold, cracks are generated in the passivation layer 170 formed at point A.

Meanwhile, the stress that generates cracks in the passivation layer 170 at point B is the stress in the direction indicated by arrows on both sides of point B in (a) of FIG. 1C. When the arrow shown at point B and the bending direction are not parallel and inclined, the sum of the stresses caused by bending applied to the point B does not change as compared to the point A. However, the stress that generates cracks applied to the passivation layer 170 at point B decreases according to the slope of the zigzag pattern 160 with respect to the bending direction. Accordingly, at point B, as the stress that generates cracks in the passivation layer 170 is reduced, the frequency of occurrence of cracks in the passivation layer 170 is reduced despite the low step coverage of the passivation layer 170 and the presence of shims.

The zigzag pattern 160 shown in (a) of FIG. 1C minimizes the number of points to which the stress that generates cracks is applied to the maximum, such as point A, and stress that generates reduced cracks, such as point B, is applied. It is a structure to maximize the number of points. That is, the zigzag pattern 160 includes more portions of the passivation layer 170 in which the stress causing cracks is reduced compared to the linear pattern. Accordingly, the frequency of occurrence of cracks in the passivation layer 170 around the jig peg pattern 160 is reduced.

Hereinafter, minimization of crack propagation of the passivation layer 170 by the zigzag pattern 160 will be described in detail.

FIG. 1C(b) is an enlarged plan view illustrating a direction in which a crack line extends in a zigzag pattern of a flexible OLED display according to an exemplary embodiment of the present invention. Referring to FIG. 1C(b), a zigzag pattern 160 of the first insulating layer 130 and the first insulating layer 130 is shown. Point C is the location of the crack generated in the passivation layer 170. The line D-D' is a line connecting points that are subjected to the greatest stress that causes a crack in the passivation layer 170 based on the location of the generated crack. Lines C-E and C-E' are lines parallel to the zigzag pattern 160.

Cracks generated in the passivation layer 170 propagate to a point vulnerable to stress. The line D-D' perpendicular to the bending direction based on point C is the area where the surrounding area can receive the most stress causing cracks. In the flexible organic light emitting display device 100 according to the exemplary embodiment, the first insulating layer 130 is not patterned with lines D-D', but is patterned in a direction parallel to lines CE and C-E'. . Accordingly, there is no step difference in the region around the line D-D', and a step difference between the first insulating layer 130 and the multi-buffer layer 150 occurs in the region around the line C-E and line C-E' parallel to the zigzag pattern 160. In other words, since the first insulating layer 130 is formed in the zigzag pattern 160, the area around the zigzag pattern 160 becomes an area more susceptible to stress than the area around the line D-D'. However, as described above, since the points on the zigzag pattern 160 receive less stress that generates cracks in the passivation layer 170 than the point C, even if a crack of the passivation layer 170 occurs at the point C, the crack It does not spread easily. That is, the zigzag pattern 160 causes the propagation of the crack in the passivation layer 170 to be guided in the direction in which the zigzag pattern 160 is formed when a crack occurs in the passivation layer 170. In addition, since the zigzag pattern 160 is formed to have a longer length than that of a straight pattern, the length for propagating the crack generated in the passivation layer 170 to the plurality of wirings 140 is also increased. Accordingly, even if a crack occurs in the passivation layer 170, the frequency of propagating the generated crack to the plurality of wirings 140 is reduced.

FIG. 1C(c) is an enlarged plan view illustrating a zigzag pattern shape of a flexible organic light emitting display device according to an exemplary embodiment of the present invention. In (c) of FIG. 1C, the shape of the zigzag pattern 160 for reducing the occurrence of cracks in the passivation layer 170 and minimizing the propagation of cracks in the zigzag pattern 160 is described.

Referring to (c) of FIG. 1C, a part of the zigzag pattern 160 has a slope of θ with respect to the bending direction. θ may be within the range of 10 degrees to 80 degrees. When lines of the zigzag pattern 160 are formed in the range of 10 degrees to 80 degrees, the stress that generates cracks in the passivation layer 170 is reduced. θ may preferably be within the range of 60 to 80 degrees. When θ is greater than or equal to 60 degrees, the frequency of occurrence of cracks in the passivation layer 170 is sufficiently reduced, and when θ is less than or equal to 80 degrees, the zigzag pattern 160 may make the progression direction of the crack generated in the passivation layer 170 discontinuously.

FIG. 1D is a schematic perspective view illustrating a shape of a wiring and a first insulating layer when a bending area of a flexible organic light emitting display device according to an exemplary embodiment is bent. The flexible organic light emitting display device 100 according to FIG. 1D differs only in that the bending area BA of the flexible substrate 110 of the flexible organic light emitting display device 100 described in FIG. 1A is a bent shape. Substantially the same. Referring to FIG. 1D, the bending area BA of the flexible substrate 110 is bent, and stress caused by bending reaches the non-display area NDA. However, the occurrence of cracks in the passivation layer formed on the zigzag pattern 160 by the zigzag pattern 160 of the first insulating layer 130 is reduced, and even if a crack occurs in the passivation layer, it is not propagated to the plurality of wirings 140. Does not.

In FIGS. 1A to 1D, it has been described that the flexible substrate has various regions, but the flexible substrate may be described as a non-bending region and a bent region outside the non-bending region. For example, the first insulating layer may be formed in the non-bending region. The first insulating layer may have a zigzag pattern between the non-bending region and the bent region of the flexible substrate. The zigzag pattern of the first insulating layer may be formed in an oblique line with respect to the boundary between the non-bending area and the bent area. Here, as the angle between the zigzag pattern and the boundary between the non-bending area and the bent area increases, the frequency of occurrence of cracks in the passivation layer decreases. In addition, the zigzag pattern may have a shape such that when a crack is generated in the passivation layer formed on the first insulating layer, propagation of the crack is guided in the direction in which the zigzag pattern is formed. The shape of the zigzag pattern for inducing the propagation of the crack may be a shape in which the distance between the bending points in the zigzag pattern is sufficiently separated so that the crack of the passivation layer is not propagated by connecting the points where the pattern is bent in the zigzag pattern .

That is, in the flexible organic light-emitting display device according to the exemplary embodiment of the present invention, the expression of the zigzag pattern and the expression of the various areas and the shape of the pattern described in the flexible OLED display according to the exemplary embodiment are only expressions used to aid understanding of the present invention. Accordingly, as long as the functions of the first insulating layer and the zigzag pattern described above can be performed, an expression for defining a region or pattern in which the first insulating layer is disposed is not limited.

FIG. 2A is a schematic perspective view illustrating a shape of a wiring, a first insulating layer, and a second insulating layer before a bending region of the flexible OLED display according to an exemplary embodiment is bent. FIG. 2B is a cross-sectional view of the flexible organic light emitting display device according to IIb-IIb' of FIG. 2A.

The flexible OLED display 200 of FIGS. 2A and 2B includes a flexible substrate 210, a display unit 220, a first insulating layer 230, a second insulating layer 235, a plurality of wirings 240, and a passivation layer. Includes 270. The flexible substrate 210, the display unit 220, the first insulating layer 230, the multi-buffer layer 250, and the passivation layer 270 of the flexible OLED display 200 of FIGS. 2A and 2B are shown in FIGS. 1A and 1B. Since the flexible substrate 110, the display unit 120, the first insulating layer 130, the multi-buffer layer 150, and the passivation layer 170 are substantially the same, a detailed description will be omitted.

The flexible OLED display 200 of FIGS. 2A and 2B includes a second insulating layer 235 formed between the multi-buffer layer 250 and the first insulating layer 230. A second insulating layer 235 is formed in a portion of the display area DA and the non-display area NDA to minimize cracks between the plurality of wirings 240 and the passivation layer 270 in the bending area BA. The second insulating layer 235 is formed in the display area DA, extends from the display area DA and is formed in a part of the non-display area NDA, and is formed in the bending area BA and the pad area PA. It doesn't work. The second insulating layer 235 is formed in a zigzag pattern 265 between the zigzag pattern 260 of the first insulating layer 230 and the bending area BA in the non-display area NDA.

The thickness of the flexible OLED display 200 is further reduced in the bending area BA due to the structure in which the second insulating layer 235 is removed from the bending area BA and the non-display area NDA. Accordingly, the occurrence rate of cracks in the plurality of wirings 240 and the passivation layer 270 in the bending area BA is lowered.

In addition, the zigzag pattern 265 of the second insulating layer 235 reduces the occurrence of cracks in the passivation layer 270 formed on the second insulating layer 235 and the multi-buffer layer 250, and the generated cracks are continuous. Do not connect with

The zigzag pattern 260 of the first insulating layer 230 and the zigzag pattern 265 of the second insulating layer 235 are spaced apart by at least 10 μm. The width of the zigzag pattern 265 of the second insulating layer 235 may be about 10 μm. Since the zigzag pattern 260 of the first insulating layer 230 and the zigzag pattern 265 of the second insulating layer 235 should not be designed to overlap, preferably the zigzag pattern 260 of the first insulating layer 230 The zigzag patterns 265 of the and the second insulating layer 235 are spaced apart by at least 10 μm. When the zigzag pattern 260 of the first insulating layer 230 and the zigzag pattern 265 of the second insulating layer 235 are separated by 10 μm or less, the step difference in each of the zigzag patterns 260 and 265 is substantially one. It is formed by the steps of When the step difference is too large, the passivation layer 270 formed on the side surfaces of the first insulating layer 230 and the second insulating layer 235 is too thin due to the low step coverage of the passivation layer 270. ) May increase the occurrence of cracks. Also, the width of the zigzag patterns 260 and 265 may range from 1 μm to 10 μm. The width must be 1 μm or more, and when the crack of the passivation layer 270 propagates, the length of the passivation layer 270 to a portion in direct contact with the plurality of wirings 240 increases, and cracks in the plurality of wirings 240 Radio waves can be reduced. In addition, when the width is 10 μm or less, the zigzag pattern 260 and the zigzag pattern 265 can be sufficiently separated. When the width of the zigzag patterns 260 and 265 is 10 μm or more, the zigzag pattern 260 and the zigzag pattern 265 may overlap or be formed too close to each other. When the zigzag pattern 260 and the zigzag pattern 265 overlap, the step difference in the zigzag patterns 260 and 265 becomes too large, and the wiring 240 or the passivation layer 270 formed on the zigzag patterns 260 and 265 by a seam or the like ), the occurrence of cracks may increase.

2A and 2B, the zigzag pattern 260 of the first insulating layer 230 and the zigzag pattern 265 of the second insulating layer 235 are formed in substantially the same zigzag pattern. Here, the substantially identical zigzag pattern means that when the zigzag pattern 260 of the first insulating layer 230 and the zigzag pattern 265 of the second insulating layer 235 overlap along an imaginary line, the pattern is matched. it means. When the patterning process of the first insulating layer 230 and the patterning process of the second insulating layer 235 use the same mask, the zigzag pattern 260 and the zigzag pattern 265 may be formed substantially the same, Manufacturing costs can be reduced.

The multi-buffer layer 250 is formed by alternately stacking inorganic and organic layers. Also, like the multi-buffer layer 250, the second insulating layer 235 is formed by alternately stacking inorganic and organic layers. In FIG. 2B, the multi-buffer layer 250 and the second insulating layer 235 are illustrated as different layers, but in the multi-buffer layer 250 and the second insulating layer 235, the second insulating layer is zigzag in the non-display area NDA. The only difference is that the pattern 265 is formed, and the structure in which the inorganic and organic layers are alternately stacked is the same. Referring to FIG. 2B, the second insulating layer 235 also has an inclined surface in the zigzag pattern 265, and the wiring 240 is formed on the inclined surface of the second insulating layer 235.

3 is a cross-sectional view illustrating an embodiment of a structure in which a first insulating layer covers a second insulating layer having a zigzag pattern in a flexible organic light emitting display device according to an exemplary embodiment. In the flexible organic light emitting display device 300, the flexible organic light emitting display device 200 described in FIG. 2B and the first insulating layer 230 and the second insulating layer 235 differ only in positions having a zigzag pattern. Is substantially the same.

Referring to FIG. 3, the second insulating layer 335 is formed on the plurality of buffer layers 350 and includes a zigzag pattern 365 in a portion of the non-display area NDA. Since the first insulating layer 330 is formed to cover the zigzag pattern 365 of the second insulating layer 335 and the second insulating layer 335, the position of the zigzag pattern 365 of the second insulating layer 335 Has a step difference in The first insulating layer 330 includes a gate insulating layer 373 and an interlayer insulating layer 375. The first insulating layer 330 includes a zigzag pattern 360 between the zigzag pattern 365 of the second insulating layer 335 and the bending area BA.

The wiring 340 and the passivation layer 370 are formed on the first insulating layer 330 from the display area DA to the zigzag pattern 365 of the first insulating layer 330, and exceed the zigzag pattern 365. From now on, it is formed on the multi-buffer layer 350. The frequency of occurrence of cracks in the passivation layer 370 is reduced by the structure shown in FIG. 3. The principle and effect of minimizing the propagation of generated cracks are the same as described above.

4 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention. FIG. 4 is a flowchart illustrating processes in which components are formed in the non-display area NDA and the bending area BA of the flexible OLED display 100 described in FIG. 1A. Components such as a display unit other than components in the non-display area NDA and the bending area BA may be formed, for example, as illustrated in FIG. 1B.

First, a second insulating layer is deposited on a flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area (S110).

The flexible substrate may be formed of a flexible insulating material. Flexible insulating materials that can be used include polyimide (PI), polyetherimide (PEI), polyethylene terephthalate (PET), polycarbonate (PC), polymetalmethylacrylate (PMMA), It may be polystyrene (PS), styrene acryl nitrile copolymer (SAN), silicone-acrylic resin, and the like. The second insulating layer may be a part of a multi-buffer layer in which an organic layer and an inorganic layer are alternately deposited.

A first insulating layer is deposited on the second insulating layer (S120). The first insulating layer may be formed of the same material as the interlayer insulating layer or the gate insulating layer by the same process.

The second insulating layer and the first insulating layer are patterned in a zigzag pattern so that the second insulating layer and the first insulating layer are formed in a part of the non-display area (S130). Patterning of the first insulating layer and the second insulating layer may be performed by, for example, a photoresist process using a zigzag patterned mask.

The first insulating layer is patterned in a zigzag pattern in another part of the non-display area so that the second insulating layer is exposed (S140). The step of patterning the first insulating layer so that the second insulating layer is exposed is a step of removing only the first insulating layer of the first insulating layer and the second insulating layer by a photoresist process using a mask. By patterning the first insulating layer in a zigzag pattern so that the second insulating layer is exposed, the first insulating layer has a zigzag pattern on the second insulating layer in a non-display area.

A wiring is formed on the first insulating layer and the second insulating layer so as to cross the bending area from the display area (S150). The wiring is also formed on the inclined surface of the zigzag pattern. The wiring is formed on the first insulating layer between the zigzag pattern of the first insulating layer and the zigzag pattern of the second insulating layer, and is formed on the multi-buffer layer between the zigzag pattern of the second insulating layer and the bending region. In addition, as for the wiring, the zigzag pattern wiring of the first insulating layer is formed in at least one of a rhombus shape, a triangular wave shape, a sine wave shape, and a trapezoidal wave shape. The wiring may be formed in a zigzag pattern.

A passivation layer is deposited on the wiring, the first insulating layer, and the second insulating layer (S160). The passivation layer is formed to cover the wiring, the first insulating layer and the second insulating layer. Accordingly, the passivation layer is also formed on the inclined surface of the zigzag pattern of the first insulating layer. The passivation layer may be formed by alternately stacking inorganic layers and organic layers, or may be formed by stacking inorganic layers alone.

Additionally, the bending area of the flexible substrate is bent. Even if the bending region is bent, the frequency of occurrence of cracks in the passivation layer formed on the insulating layer is reduced by the zigzag pattern of the first insulating layer, and cracks do not continue even if cracks occur.

FIG. 5 is a flowchart illustrating a method of manufacturing a flexible organic light emitting display device having a structure in which a first insulating layer covers a second insulating layer having a zigzag pattern.

First, a second insulating layer is deposited on a flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area (S210). The second insulating layer is a layer in which an inorganic layer and an organic layer are alternately stacked a plurality of times, and may be a part of the multi-buffer layer.

Patterning is performed in a zigzag pattern so that the second insulating layer is formed in a portion of the display area and the non-display area (S220). A part of the second insulating layer is removed from a part of the non-display area using a mask having a zigzag pattern.

Next, a first insulating layer is deposited to cover the second insulating layer (S230). The first insulating layer may include a gate insulating layer, an interlayer insulating layer, or both a gate insulating layer and an interlayer insulating layer. The first insulating layer is formed to cover a step formed by patterning the second insulating layer.

The first insulating layer is patterned in a zigzag pattern so that the first insulating layer is formed between the zigzag pattern of the second insulating layer formed in a part of the non-display area and the bending area (S240). Patterning the first insulating layer between the zigzag pattern of the second insulating layer and the bending region is performed by a photoresist process using a mask. By patterning the first insulating layer in a zigzag pattern, the first insulating layer in the non-display area has a zigzag pattern on the multi-buffer layer.

A wiring is formed on the patterned first insulating layer so as to cross the bending area from the display area (S250). In addition, a passivation layer is deposited on the wiring (S260). Additionally, the bending area of the flexible substrate is bent. Steps S250 and S260 are substantially the same as steps S150 and S160 described above.

In the flexible organic light emitting display device manufactured by the manufacturing method according to an exemplary embodiment of the present invention, even if the bending area is bent, the occurrence of cracks in the passivation layer is reduced by the zigzag pattern of the first insulating layer and the second insulating layer, Even if a crack occurs, the crack does not continue.

Hereinafter, various features of the flexible organic light emitting display device of the present invention will be described.

According to another feature of the present invention, a part of the flexible substrate in the bending area is bent in a specific direction.

According to another feature of the invention, a part of the zigzag pattern is characterized in that it is inclined at least 60 degrees to 80 degrees with respect to the direction.

According to another feature of the present invention, each of the plurality of wirings extends in a diagonal direction with respect to the direction.

According to another feature of the present invention, a plurality of wirings are formed in correspondence with a zigzag pattern.

According to another feature of the present invention, each of the plurality of wirings includes a portion formed in at least one of a rhombus shape, a triangular wave shape, a sinusoidal wave shape, and a trapezoidal wave shape.

According to another feature of the present invention, the flexible substrate further has a pad region extending from the bending region, further includes a pad portion disposed in the pad region, and a plurality of wirings are electrically connected to the pad portion.

According to another feature of the present invention, the zigzag pattern is spaced apart by 30 μm or more from the display area.

According to another feature of the present invention, the first insulating layer has an inclined surface in a zigzag pattern, and a plurality of wirings are formed on the inclined surface.

According to another feature of the present invention, the flexible display device is disposed in a portion of the display area and the non-display area, further includes a second insulating layer formed between the flexible substrate and the first insulating layer, the second insulating layer, It is characterized in that it includes a zigzag pattern that is substantially the same between the zigzag pattern of the first insulating layer and the bending region.

According to another feature of the present invention, the second insulating layer has an inclined surface in a zigzag pattern, and a plurality of wirings are formed on the inclined surface of the second insulating layer.

According to another feature of the present invention, the zigzag pattern of the first insulating layer and the zigzag pattern of the second insulating layer are spaced apart by at least 10 μm.

According to another feature of the present invention, the thin film transistor includes an active layer, a gate electrode, a source electrode and a drain electrode, and the thin film transistor includes a gate insulating layer formed between the active layer and the gate electrode, and the gate electrode, the source electrode, and the drain electrode. It characterized in that it further comprises an interlayer insulating layer formed between the electrodes.

According to another feature of the present invention, the first insulating layer is formed of the same material as the interlayer insulating layer through one process.

According to another feature of the present invention, the plurality of wirings are formed of the same material as the source electrode and the drain electrode through one process.

Hereinafter, various features of the flexible organic light emitting display device of the present invention will be described.

According to another feature of the present invention, the zigzag pattern is formed so that when a crack occurs in the passivation layer, the propagation of the crack is guided in the direction in which the zigzag pattern is formed.

According to another feature of the present invention, as the angle between the zigzag pattern and the boundary between the non-bending region and the bent region increases, the frequency of occurrence of cracks in the passivation layer is reduced.

Hereinafter, various features of the method of manufacturing the flexible organic light emitting display device of the present invention will be described.

According to another feature of the present invention, the wiring is formed on the first insulating layer between the zigzag pattern of the first insulating layer and the zigzag pattern of the second insulating layer.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

100, 200, 300: flexible organic light emitting display device
110, 210, 310: flexible substrate
120, 220: display
130, 230, 330: first insulating layer
235, 335: second insulating layer
140, 240, 340: wiring
142: connection
150, 250, 350: multi buffer layer
160, 260, 265, 360, 365: zigzag pattern
162: side of the first insulating layer
170, 270, 370: passivation layer
172, 372: active layer
173, 373: gate insulating layer
174, 374: gate electrode
175, 375: interlayer insulating layer
176, 376: source electrode
177, 377: drain electrode
178, 378: overcoat layer
179, 379: reflective layer
180, 380: anode
181, 381: bank
182, 382: organic light emitting layer
183, 383: cathode
184, 384: sealing part
190, 290: pad

Claims (21)

A flexible substrate having a display area, a non-display area extending from the display area, and a bending area extending from the non-display area;
A first insulating layer in all of the display area and a part of the non-display area;
A wiring line extending across the non-display area and the bending area and positioned on the first insulating layer;
A connection part connected to the wiring through a contact hole of the first insulating layer; And
It includes a passivation layer covering the wiring,
Further comprising a second insulating layer between the flexible substrate and the first insulating layer,
The second insulating layer is in all of the display area and a part of the non-display area,
An organic light emitting display device, wherein an end of the second insulating layer is closer to the bending area than an end of the first insulating layer. delete The method of claim 1,
The wiring is positioned above the first insulating layer and the second insulating layer. delete The method of claim 1,
An organic light emitting display device, wherein an end of the first insulating layer and an end of the second insulating layer are spaced apart by at least 10 μm. The method of claim 1,
The first insulating layer and the second insulating layer are patterned through a photoresist process and removed from the bending area. The method of claim 1,
The passivation layer is an organic light emitting display device made of an organic layer. The method of claim 1,
In the flexible substrate, a portion of the bending area is bent in a specific direction. The method of claim 1,
An end of the first insulating layer or the second insulating layer in the bending area direction has a pattern shape for reducing cracks in the passivation layer. The method of claim 9,
The pattern shape is a zigzag pattern shape inclined at least 60 degrees to 80 degrees with respect to the direction, the organic light emitting display device. The method of claim 10,
When a crack occurs in the passivation layer, propagation of the crack is guided in a direction in which the zigzag pattern shape is formed. The method of claim 1,
The flexible substrate further has a pad area extending from the bending area,
The wiring is electrically connected to a pad portion disposed in the pad area. delete delete delete delete delete delete delete delete delete

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