KR102186929B1 - A functional silicone adhesives having high adhesion, light diffusion function and various double-sided adhesive strength and a film using it - Google Patents

Abstract

The present invention relates to a functional silicone adhesive having high adhesion, light diffusion function and various double-sided release adhesive strength and a film using the same, and more particularly, high transparency, heat resistance, low reflectance, vibration resistance, impact resistance, and more than 3,000 gf/inch A functional silicone adhesive that has a high adhesive strength and has a high adhesive strength equal to or higher than that of acrylic and urethane when manufactured as a film, and a release adhesive strength of different types, which is advantageous for functional laminates, and a functional silicone adhesive that has various functions using the same. It relates to a silicone adhesive film.

Description

A functional silicone adhesives having high adhesion, light diffusion function and various double-sided adhesive strength and a film using it}

The present invention relates to a functional silicone adhesive having high adhesion, light diffusion function and various double-sided release adhesive strength and a film using the same, and more particularly, high transparency, heat resistance, low reflectance, vibration resistance, impact resistance, and more than 3,000 gf/inch A functional silicone adhesive that has a high adhesive strength and has a high adhesive strength equal to or higher than that of acrylic and urethane when manufactured as a film, and a release adhesive strength of different types, which is advantageous for functional laminates, and a functional silicone adhesive that has various functions using the same. It relates to a silicone adhesive film.

The content described below merely provides background information related to the present invention and does not constitute the prior art.

Recently, in the field of semiconductors or displays, highly transparent adhesives and optical adhesive materials are widely used. The highly transparent type of adhesive means that the transmittance is 90% or more.

Conventionally, acrylic and urethane-based polymers used in transparent type adhesives were mainly used. In particular, acrylic and urethane types have excellent transparency, easy design, and are inexpensive, so they have been widely used.However, due to the problem of discoloration due to yellowing due to poor heat resistance and low weather resistance, thick film type that needs to be applied in many areas in the future And there is a need for improvement in semiconductor and display fields that require high heat operation requiring high heat resistance and adhesion stability.

In response to this request, transparent type dots and adhesives using silicone resins were developed, but there was a limit to simultaneously satisfying high transparency, low reflectance, high adhesion, and thick film types with a high thickness of 300 µm or more, and backlight units including LEDs There is an urgent need to develop a transparent type of point and adhesive suitable for a film that can dramatically simplify the manufacturing process of

Korean Patent Publication 10-2016-0085768 (2016.07.08)

The present invention is to solve the above-described problems, and has high transparency, high heat resistance, low reflectance, vibration resistance, impact resistance, and high adhesive strength of 3,000 gf/inch or more, and high adhesive strength equal to or higher than acrylic and urethane when manufactured as a film. It is to provide a functional silicone adhesive film having various functions and a functional silicone adhesive having advantageous properties for functional laminate by having different types of release adhesive strength on both sides.

In addition, the present invention is to solve the above-described problems, a silicone adhesive film having high transparency, high heat resistance, low reflectance, vibration resistance, impact resistance, and high adhesion, and simultaneously having special lamination properties such as single-sided lamination and single-sided exposure. Is to provide.

In addition, the present invention is to provide a light guide plate and a backlight unit that can be manufactured with high productivity using the functional silicone adhesive film.

However, the problems to be solved by the present invention are not limited to those mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention for solving these technical problems

a) silsesquioxane resin represented by the following formula (1);

b) a silane compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group;

c) a silane compound containing a hydrosilyl group; And

d) catalyst;

It provides a silicone pressure-sensitive adhesive comprising:

[Formula 1]

In Formula 1,

Each R is independently a hydroxy group, an alkoxy group, an aryl group, -Si(CH ₃ ) ₃ , -OSi(CH ₃ ) ₃ , -Si(CH ₃ ) ₂ CH=CH ₂ or -OSi(CH ₃ ) ₂ CH= CH ₂ and at least one is -Si(CH ₃ ) ₂ CH=CH ₂ or -OSi(CH ₃ ) ₂ CH=CH ₂ ,

n is an integer from 1 to 100.

Specifically, the silsesquioxane resin represented by Formula 1 is represented by the following Formula 2:

[Formula 2]

In Chemical Formula 2,

R is CH ₃ , Ph is phenyl, and E is Si.

Specifically, the b) silane compound is one of those represented by the following Chemical Formulas 3 to 6:

[Formula 3]

[Formula 4]

[Formula 5]

[Formula 6]

In Formulas 3 to 6,

'-' connected to Si is a hydrogen, alkyl group, aryl group, amine group, halogen or alkylhalogen bonded,

’는 수소, 알킬기, 아릴기, 아민기, 할로겐 또는 알킬할로겐이 각각 독립적으로 3개 결합된 것이며,Connected to Si'

'Is hydrogen, an alkyl group, an aryl group, an amine group, a halogen or an alkylhalogen each independently bonded to three,

R is an alkyl group, an aryl group, or a divalent linking group derived from an alkylhalogen,

n is an integer from 1 to 1,000.

Specifically, c) the silane compound containing a hydrosilyl group is one of those represented by the following formulas 7 to 10:

[Formula 7]

[Formula 8]

[Formula 9]

[Formula 10]

In Formulas 7 to 10,

m and n are each independently an integer of 1 to 1,000.

Preferably, the silicone adhesive is

a) 100 parts by weight of a silsesquioxane resin represented by the following formula (1);

b) 1 to 30 parts by weight of a silane compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group;

c) 5 to 50 parts by weight of a silane compound containing a hydrosilyl group; And

d) 0.01 to 1 part by weight of a catalyst;

Includes.

In addition, the present invention provides a silicone film obtained by coating the silicone pressure-sensitive adhesive on a film and then drying it by thermal curing or light curing.

The silicone film may have different upper and lower adhesive strengths.

The upper and lower films having different adhesive strength may be formed by laminating silicone adhesive portions with each other after coating and drying silicone adhesives having different adhesive strengths on two films, or may be two coatings of silicone adhesives having different adhesive strengths. At this time, the silicone pressure-sensitive adhesive may be a fully cured type or a semi-cured type.

In addition, the present invention provides a light guide plate including the silicon film.

In addition, the present invention provides a backlight unit including the silicon film.

According to the present invention, it has high transparency, high heat resistance, low reflectance, vibration resistance, impact resistance, and high adhesive strength of 3,000 gf/inch or more.When manufactured as a film, high adhesive strength equal to or higher than acrylic and urethane and adhesive strength on both sides are different. By having a release adhesive force, it will be possible to provide a functional silicone adhesive having advantageous properties for functional laminates and a functional silicone adhesive film having various functions using the same.

In addition, the present invention can provide a silicone adhesive film having high transparency, high heat resistance, low reflectance, vibration resistance, impact resistance, and high adhesion, and simultaneously having advantageous properties for lamination.

In addition, the present invention can provide a light guide plate and a backlight unit that can be manufactured with high productivity using the silicone adhesive film.

1 to 3 are views each showing a silicone adhesive film according to an embodiment of the present invention.
4 and 5 are diagrams illustrating a backlight unit using micro LED local dimming according to an embodiment of the present invention.
6 is a diagram illustrating a cross-section of a backlight unit using micro LED local dimming according to an embodiment of the present invention.
7 is a diagram showing the progress of a light source in a backlight unit using micro LED local dimming according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted. In addition, terms used in the present specification are terms used to properly express a preferred embodiment of the present invention, which may vary depending on the intention of users or operators, or customs in the field to which the present invention belongs. Accordingly, definitions of these terms should be made based on the contents throughout the present specification. The same reference numerals in each drawing indicate the same members.

Throughout the specification, when a member is said to be positioned "on" another member, this includes not only the case where a member is in contact with another member, but also the case where another member exists between the two members.

Throughout the specification, when a part "includes" a certain component, it means that other components may be further included rather than excluding other components.

The silicone adhesive of the present invention

a) silsesquioxane resin represented by the following formula (1);

b) a silane compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group;

c) a silane compound containing a hydrosilyl group; And

d) catalyst;

Includes:

[Formula 1]

In Formula 1,

Each R is independently a hydroxy group, an alkoxy group, an aryl group, -Si(CH ₃ ) ₃ , -OSi(CH ₃ ) ₃ , -Si(CH ₃ ) ₂ CH=CH ₂ or -OSi(CH ₃ ) ₂ CH= CH ₂ and at least one is -Si(CH ₃ ) ₂ CH=CH ₂ or -OSi(CH ₃ ) ₂ CH=CH ₂ ,

n is an integer from 1 to 100.

Specifically, the silsesquioxane resin represented by Formula 1 is represented by the following Formula 2:

[Formula 2]

In Chemical Formula 2,

R is CH ₃ , Ph is phenyl, and E is Si.

Specifically, the b) silane compound is one of those represented by the following Chemical Formulas 3 to 6:

[Formula 3]

[Formula 4]

[Formula 5]

[Formula 6]

In Formulas 3 to 6,

'-' connected to Si is a hydrogen, alkyl group, aryl group, amine group, halogen or alkylhalogen bonded,

’는 수소, 알킬기, 아릴기, 아민기, 할로겐 또는 알킬할로겐이 각각 독립적으로 3개 결합된 것이며,Connected to Si'

'Is hydrogen, an alkyl group, an aryl group, an amine group, a halogen or an alkylhalogen each independently bonded to three,

R is an alkyl group, an aryl group, or a divalent linking group derived from an alkylhalogen,

n is an integer from 1 to 1,000.

Specifically, c) the silane compound containing a hydrosilyl group is one of those represented by the following formulas 7 to 10:

[Formula 7]

[Formula 8]

[Formula 9]

[Formula 10]

In Formulas 7 to 10,

m and n are each independently an integer of 1 to 1,000.

Preferably, the silicone pressure-sensitive adhesive of the present invention

a) 100 parts by weight of a silsesquioxane resin represented by the following formula (1);

b) 1 to 30 parts by weight of a silane compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group;

c) 5 to 50 parts by weight of a silane compound containing a hydrosilyl group; And

d) 0.01 to 1 part by weight of a catalyst;

Includes.

In this case, it has high transparency, high heat resistance, low reflectance, vibration resistance, impact resistance, and high adhesion, and can simultaneously satisfy properties advantageous for fast curing and lamination when manufactured as a film.

In the present invention, the catalyst d) is one or more selected from the group consisting of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), osmium (Os), and ruthenium (Ru) as the central metal. It can be used, and preferably contains platinum (Pt).

In addition, the present invention may further include e) a solvent to dissolve the adhesive components and coat the substrate. The e) solvent is not particularly limited, and specifically, one or a mixture of two or more of aromatic hydrocarbon-based, aliphatic hydrocarbon-based, and ketone-based solvents may be used. More specifically, the solvent may include at least one of xylene, methyl ethyl ketone, ethyl acetate, toluene, butyl cellosolve, and isopropyl alcohol, but is not limited thereto.

The amount of the e) solvent may be arbitrarily adjusted, and specifically, may be included in an amount of 50 to 500 parts by weight based on 100 parts by weight of the silsesquioxane resin represented by Chemical Formula 1.

The silicone pressure-sensitive adhesive according to the present invention has high transparency, heat resistance, low reflectance, vibration resistance, impact resistance, and high adhesive strength, and simultaneously has advantageous properties for fast curing and lamination when manufactured into a film. In particular, the silicone pressure-sensitive adhesive according to the present invention has an adhesive strength of 3000 to 6000 gf/inch, preferably 4000 gf/inch or more, thereby dramatically improving the adhesion (2500 gf/inch or less) of the previously weak silicone pressure-sensitive adhesive. Have.

In addition, the present invention is after coating the silicone adhesive on the film Dried Provide a silicone film. If necessary, a release film may be further included on the silicone adhesive. The film may be a release film, an optical film or a hard coating layer, and a primer may be applied to the release film, an optical film or a hard coating layer as necessary. The release film, optical film, or hard coating layer may be a known film. For example, the release film may be a fluorine-coated release film, and the optical film may be a PET film, and at least one functional layer is provided on each layer. It can further include.

In the silicone film of the present invention, the thickness of the silicone pressure-sensitive adhesive layer and the film layer may be arbitrarily adjusted, and as a specific example, the thickness of the silicone pressure-sensitive adhesive layer: the film layer may be in a ratio of 1-10:10-1. As an example, the thickness of the silicone pressure-sensitive adhesive layer may be 10 to 1000 um.

In the present invention, the coating method is not particularly limited, and the thickness can be adjusted using a comma knife or a slot die coating head.

In addition, the drying may be performed at a temperature capable of volatilizing the solvent, and if necessary, the drying may be performed by dividing into 1 to 8 steps. The drying temperature may be changed depending on the solvent used, and for a specific example, it may be performed at 80 to 200°C.

1 to 3 each show a silicone film according to an embodiment of the present invention.

1 shows a thick film type, high adhesive type silicone film including a release film on both sides, FIG. 2 shows a silicone film including a release film on one side and a PET film on the other side, and FIG. 3 is On the other side of the release film is shown a silicon film including a hard coating layer.

In addition, the silicone film of the present invention may have different upper and lower adhesive strengths. The upper and lower films with different adhesive strength may be formed by laminating silicone adhesive portions after coating and drying silicone adhesives with different adhesive strengths on two films, or by double-coating silicone adhesives with different adhesive strengths to have different adhesive strengths on both sides. Functional silicone OCA films can be prepared. In this case, it can be usefully applied to a pressure-sensitive adhesive layer that requires different adhesive strength up and down.

In addition, the present invention provides a light guide plate and a backlight unit including the silicon film. As a specific example, the backlight unit may be a surface-emitting backlight unit.

4 and 5 are diagrams showing a separation and coupling state of a backlight unit using micro LED local dimming according to an embodiment of the present invention, and FIG. 6 is a diagram illustrating a microcomputer according to an embodiment of the present invention. A cross-sectional view of a backlight unit using LED local dimming is shown, and FIG. 7 is a view showing the progress of a light source in the backlight unit using micro LED local dimming according to an embodiment of the present invention.

4 to 7, a backlight unit using micro LED local dimming according to an embodiment of the present invention,

A board 300 on which the micro LEDs 310 are flatly arranged at predetermined intervals so that the light source can spread to the top;

A first silicon film 210 positioned on the upper surface of the board 300 in the form of a film and serving as an adhesive sheet;

It is located on the upper surface of the first silicon film 210, and in the section corresponding to the micro LED 310, the hole 110 is perforated to pass the light source, and the rest except for the section corresponding to the micro LED 310 A reflective sheet 100 formed to block the silver light source;

It is positioned on the upper surface of the reflective sheet 100 in a film form, and includes a second silicon film 220 that diffuses a light source output from the reflective sheet 100.

The hole 110 is characterized in that the first silicon film 210 and the second silicon film 220 are in close contact with the reflective sheet 100 so that a vacuum is formed.

The board 300 is characterized in that the micro LED 310 is formed horizontally and vertically at 2mm intervals.

The thickness of the second silicon film 220 may be thicker than that of the first film 210.

In the present invention, the size and spacing of the micro LED 310 serving as a light source can be arbitrarily adjusted so that the light source can be spread evenly in the plane section of the light guide plate 100. In particular, in the case of the present invention, the size of the micro LED is 0.1 mm or less. It is suitable, and the micro LED spacing may be arranged in an array of 2 to 4 mm as a specific example.

In addition, in order to prevent loss of reflected light in the same manner as in the section of the micro LED 310, only the direct section in contact with the light source of the reflective sheet 100 is left and blocked.

In addition, a hole 110 is drilled in the reflective sheet 100 according to the intervals of the micro LEDs 310 to induce a direction of light in the direction of the screen.

The first silicon film 210 and the second silicon film 220 are in close contact with the reflective sheet 100 through vacuum lamination.

The micro LED 310 may be a rectangular parallelepiped having one side of 0.1 mm.

The hole 110 is characterized in that it is formed in the shape of a cylindrical or rectangular parallelepiped.

The thickness of the first silicon film 210 may be 0.025 mm.

The thickness of the reflective sheet 100 may be 0.075mm.

The thickness of the second silicon film 210 may be 0.4 mm.

As shown in FIG. 6 or 7, the first silicon film 210, the reflective sheet 100, and the second silicon film 220 are in close contact and attached to each other, and components of the first silicon film or the second silicon film 220 In this vacuum state, the gap between the hole 110 of the reflective sheet 100 and the LED 310 of the board 300 may be filled.

To this end, the first silicon film 210, the reflective sheet 100, and the second silicon film 220 may be in close contact with each other and attached to each other by vacuum compression, and then the board may be in close contact and attached to each other.

Here, the light guide plate may be made of a first silicon film 210, a reflective sheet 100, and a second silicon film 220, and further includes a protective film or a light diffusion film on the upper surface of the second silicon film 220 can do. As an example of a specific protective film, a PET film may be used. The adhesive force of the second silicone film 220 may be adjusted depending on whether the protective film or the light diffusion film is present.

The first silicone film 210 may be formed of a material having a light transmittance (measured by UV-VIS Minolta CM-5) of 92% or more, and a film having an adhesive strength of 4000 to 6000 gf/inch.

As the material of the second silicon film 220, a material having a light transmittance (measured by UV-VIS Minolta CM-5) of 92% or more may be used, and a material having a refractive index (measured ABBE) of 1.3 to 1.7 may be used. In this case, the adhesion can be arbitrarily adjusted, and as an example, it may be a film having 4000 to 6000 gf/inch.

The first silicon film 210 and the second silicon film 220 may further include metal and ceramic powder to improve light guiding performance, if necessary. As a specific example, the powder may be a phosphor, alumina, or silica, and if necessary, may include an organic powder. In this case, the performance of the light guide plate can be further improved. The powder is preferably a powder having a refractive index of 0.2 to 1.5 higher than the refractive index of the film, and may be included within a range that does not impair other physical properties of the light guide plate, and specifically, the first silicone film 210 And 0.01 to 5 parts by weight of 100 parts by weight of the second silicone film 220.

The light guide plate and the backlight unit according to the present invention generate heat as the brightness of the light source is brighter. The reverse use of this is reversed to reduce the size of the light source and minimize the area of the light source to apply the side light source as the entire light source of the bottom plate, but While reducing, the loss of brightness can be minimized.

In addition, by disposing the silicon film-type light guide plate of the present invention on both sides of the reflective sheet, diffusion occurs when the LED light source is received, and the effect of the light source can be maximized by allowing diffusion to occur again while passing through the reflective film.

In addition, in the present invention, by adjusting the brightness of the LED light source by using a dimming method for adjusting the brightness of the light source, the difference in shade to a partial area of the screen brightness can be maximized, thereby increasing the visible effect of the external environment, that is, the sunlight state.

Hereinafter, examples will be described in detail to illustrate the present invention in detail. However, the embodiments according to the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the present invention are provided to more completely describe the present invention to those of ordinary skill in the art.

[Example 1] to [Comparative Example 1]

A silicone pressure-sensitive adhesive was prepared by uniformly mixing the components shown in Table 1 below. The silsesquioxane resin of Examples 1 to 4 was a silsesquioxane resin represented by Chemical Formula 2, a platinum-based catalyst was used as a catalyst, and toluene was used as a solvent. As a comparative example, silsesquioxane resin (MQ resin) represented by Chemical Formula 11 was used. The unit of content is parts by weight.

division Silsesquioxane resin Silane compound containing a functional group Silane compound containing a hydrosilyl group catalyst solvent Example 1 100 Formula 3
15 parts by weight Formula 7
35 parts by weight 0.2 200 Example 2 100 Formula 4
15 parts by weight Formula 8
35 parts by weight 0.2 200 Example 3 100 Formula 5
15 parts by weight Formula 9
35 parts by weight 0.2 200 Example 4 100 Formula 6
15 parts by weight Formula 10
35 parts by weight 0.2 200 Comparative Example 1 100 Formula 3
15 parts by weight Formula 7
35 parts by weight 0.2 200

[Formula 11]

In Formula 11, m is an integer of 1 to 100.

Experiment

The silicone adhesives of Examples 1 to 4 and Comparative Example 1 were coated on a 100 um thick PET film, and dried at 150° C. for 1 minute to form a silicone adhesive layer.

A fluorine-based release film was bonded to the top of the silicone adhesive layer, and left at room temperature for 24 hours. After cutting the sample to a width of 25 mm, the release film was removed. The saponified TAC film fixed on the glass was bonded to the top of the release film using a double-sided adhesive.

The prepared samples (TAC/OCA/PET) were left at room temperature for 24 hours, and then peeled at 180 ^° using an autograph to measure the peel force, and the results are shown in Table 2 below.

In addition, the prepared samples (TAC/OCA/PET) were folded at an angle of 0 ^o and 180 ^{o in} the direction of the TAC film to evaluate the crack and peeling resistance of PET up to 200,000 times every 10,000 times, and the results were evaluated. It is shown in Table 2 below.

division adhesiveness
(Unit: gf/inch) Cracking Peelability Example 1 4500 Not occurring Not occurring Example 2 5500 Not occurring Not occurring Example 3 4200 Not occurring Not occurring Example 4 4800 Not occurring Not occurring Comparative Example 1 2000 150,000 occurrences 50,000 occurrences

As shown in Table 2, the silicone pressure-sensitive adhesives of Examples 1 to 4 of the present invention have significantly improved cracking and peeling properties compared to Comparative Example 1, and in particular, the adhesive strength of the conventional silicone-based pressure-sensitive adhesives was 4000 gf/inch or more. It can be seen that (2500 gf/inch or less) was significantly improved.

As described above, although the embodiments have been described by the limited embodiments and drawings, various modifications and variations are possible from the above description by those of ordinary skill in the art. For example, even if the described techniques are performed in a different order from the described method, and/or the described components are combined or combined in a form different from the described method, or are replaced or substituted by other components or equivalents. Appropriate results can be achieved. Therefore, other implementations, other embodiments, and claims and equivalents fall within the scope of the claims to be described later.

Claims (11)

It is characterized in that the silicone pressure-sensitive adhesives having different adhesion to the two films are coated and dried, and then the silicone pressure-sensitive adhesive parts are laminated or double-coated,
The silicone adhesive,
a) silsesquioxane resin represented by the following formula (1);
b) a silane compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group;
c) a silane compound containing a hydrosilyl group; And
d) catalyst; And
Silicone film containing:
[Formula 1]

In Formula 1,
Each R is independently a hydroxy group, an alkoxy group, an aryl group, -Si(CH ₃ ) ₃ , -OSi(CH ₃ ) ₃ , -Si(CH ₃ ) ₂ CH=CH ₂ or -OSi(CH ₃ ) ₂ CH= CH ₂ and at least one is -Si(CH ₃ ) ₂ CH=CH ₂ or -OSi(CH ₃ ) ₂ CH=CH ₂ ,
n is an integer from 1 to 100. The method of claim 1,
The silsesquioxane resin represented by Formula 1 is a silicone film, characterized in that it is represented by the following Formula 2:
[Formula 2]

In Formula 2,
R is CH ₃ , Ph is phenyl, and E is Si. The method of claim 1,
The b) silane compound is a silicone film, characterized in that one of those represented by the following formulas 3 to 6:
[Formula 3]

[Formula 4]

[Formula 5]

[Formula 6]

In Formulas 3 to 6,
'-' linked to Si is a hydrogen, alkyl group, aryl group, amine group, halogen or alkylhalogen bonded,
Connected to Si'

'Is hydrogen, an alkyl group, an aryl group, an amine group, a halogen or an alkylhalogen each independently bonded to three,
R is an alkyl group, an aryl group, or a divalent linking group derived from an alkylhalogen,
n is an integer from 1 to 1,000. The method of claim 3,
The c) a silane compound containing a hydrosilyl group is a silicone film, characterized in that one of those represented by the following formulas 7 to 10:
[Formula 7]

[Formula 8]

[Formula 9]

[Formula 10]

In Formulas 7 to 10,
m and n are each independently an integer of 1 to 1,000. The method of claim 1,
a) 100 parts by weight of a silsesquioxane resin represented by the following formula (1);
b) 1 to 30 parts by weight of a silane compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group;
c) 5 to 50 parts by weight of a silane compound containing a hydrosilyl group; And
d) 0.01 to 1 part by weight of a catalyst;
Silicone film comprising a. The method of claim 1,
Silicone film, characterized in that it further comprises a solvent. delete delete delete A light guide plate comprising the silicone film according to any one of claims 1 to 6. A backlight unit comprising the silicon film of any one of claims 1 to 6.

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