KR102169286B1 - Method for manufacturing minute pipe and minute pipe manufactured by this method - Google Patents

Abstract

The present invention relates to a method of manufacturing a fine pipe and a fine pipe manufactured thereby, comprising: (A) providing a linear material of a metal material or a synthetic resin material as a base member for having a structure of a fine pipe; (B) cleaning the surface for uniform deposition of the plating material during plating treatment for removing contaminants from the material and forming fine pipes; (C) forming a metal plating layer on the surface of the material through a process of performing electroplating or electroless plating on the material or mixing electroless plating and electroplating, but performing single-layer plating or multi-layer plating; (D) manufacturing a metallic fine pipe by separating the plating layer by immersing the resultant obtained through step (C) in a separation aqueous solution for material dissolution to dissolve only the material as the base member; A fine manufacturing method comprising, and a pipe-shaped body formed in a single-layer plating structure or formed in a multi-layer plating structure by this manufacturing method, and is formed with a length of 0.01mm to 1cm and a thickness of 0.1㎛ to 1cm. It features a pipe.

Description

A method for manufacturing a fine pipe, and a fine pipe manufactured by the method TECHNICAL FIELD [Method FOR MANUFACTURING MINUTE PIPE AND MINUTE PIPE MANUFACTURED BY THIS METHOD}

The present invention relates to a method of manufacturing a fine pipe and a fine pipe manufactured thereby, and more particularly, a metal pipe of a fine standard can be manufactured using a plating process, and can be manufactured with various sizes and thicknesses and various metal materials. The present invention relates to a method for manufacturing a fine pipe of a new configuration and a method of manufacturing a fine pipe that is capable of manufacturing a fine pipe that can be used in various fields in various industries, and a fine pipe manufactured thereby.

In the conventional method for manufacturing a pipe made of a metal material, three methods are largely used, and centrifugal casting, which makes a casting by pouring boiling iron water into a rotating formwork, is most often used, and a soft iron pipe is manufactured by such a centrifugal casting method.

Such conventional metal pipes are mainly made of steel, and since the 1970s, welded pipes using welding have been made by replacing seamless pipes.

Usually, pipes with a large diameter (more than 25cm) use Electric Resistance Welded (ERW) method, Electric Fusion Welded (EFW) method, and Submerged Arc Welded (SAW) method. In order to manufacture pipes of larger sizes, LSAW (Longitudinal Submerged Arc Welded) method and SSAW (Spiral Submerged Arc Welded) method are used.

However, in the manufacture of conventional metal pipes, there is a disadvantage in that the metal components constituting the pipe are limited, and it takes a lot of difficulty and cost to control the size and thickness of the inner diameter of the pipe, and in particular, the size of the pipe is made very small. It is almost impossible to manufacture.

Meanwhile, pipes made of metal are widely used in the electric and electronic field in recent years, and fine pipes having a very small size than a general pipe are being applied.

For example, the fine pipe is used to manufacture a pogo pin of a test apparatus including a Bare Board Test (BBT) tester for inspecting a pattern of a circuit board or an electrical characteristic of a semiconductor device.

1 is an exemplary view shown to explain the structure of a conventional pogo pin, showing an example of using a pogo pin as a means for connecting an external terminal of a semiconductor package and a circuit pattern on a PCB, and as shown in FIG. 6) is a casing 11 on the tubular body made of a metal pipe structure; An upper pin 12 made of a metal body coupled to the upper side of the casing 11 and in contact with the external terminal 3a of the semiconductor package 3; A lower pin 13 made of a metal body coupled to the lower side of the casing 11 and contacting the circuit pattern 5a of the PCB 5; It is disposed inside the casing 11 so that the upper end is in contact with the upper pin 12 and the lower end is in contact with the lower pin 13, and the upper pin 12 is an external terminal of the semiconductor package 3 ( 3a) and a spring 14 for resilient contact when the lower pin 13 contacts the circuit pattern 5a of the PCB 5;

A number of pogo pins 6 of this configuration are arranged at dense intervals, and the pogo pins are provided to be supported by an insulator 1 to protect from deformation or external physical impact, and It is used to check electrical properties.

However, such a pipe structure used as a casing such as a pogo pin has a fine size, and is currently manufactured and used through ultra-precision drilling, but it is reaching technical limits in reducing the size of the inner diameter. Efforts are being made to realize the high-performance and functional expansion and miniaturization and slimming of the product.

Accordingly, the number of pins for input/output information lines and connection is rapidly increasing, and the trend is to reduce the width and spacing of circuit patterns for wiring.Therefore, the contact pin of the pogo pin for electrical characteristic inspection is inevitably thinner. For this purpose, there is a problem of miniaturization such as reducing the inner diameter of the casing.

Korean Patent Application Publication No. 10-2004-0068842

The present invention has been devised in consideration of and improving the above-described problems, and allows a metal pipe of a fine standard to be manufactured using a plating process, and to be manufactured with various sizes and thicknesses and various metal materials. It is an object of the present invention to provide a method for manufacturing a fine pipe having a new configuration and a fine pipe manufactured by the method capable of manufacturing a fine pipe that can be used in various ways in the industrial field.

The present invention makes it possible to manufacture by controlling the size and thickness of the inner and outer diameters, but makes it possible to manufacture a fine pipe made of a metal material suitable for electrical characteristics inspection according to miniaturization of circuit patterns or semiconductor devices, etc., and fine pipes having various metal components It is an object of the present invention to provide a method for manufacturing a fine pipe that can be applied to various fields, such as to be applied to various fields, and a fine pipe manufactured thereby.

The present invention is to provide a method for manufacturing a fine pipe and a method for manufacturing a fine pipe that is capable of extending the service life as well as improving the manufacturing quality and durability by increasing the inner diameter flatness to be manufactured. have.

The method of manufacturing a fine pipe according to the present invention for achieving the above object comprises the steps of: (A) providing a linear material of a metal material or a synthetic resin material as a base member for giving a structure of a fine pipe; (B) cleaning the surface for uniform deposition of the plating material during plating treatment for removing contaminants from the material and forming fine pipes; (C) forming a metal plating layer on the surface of the material through a process of performing electroplating or electroless plating on the material or mixing electroless plating and electroplating, but performing single-layer plating or multi-layer plating; (D) separating the material by immersing the resultant obtained through the step (C) in a separation aqueous solution for dissolving the material to dissolve only the material as the base member, thereby producing a metallic fine pipe by leaving only the plating layer; It is a basic feature of the configuration that is made, including.

Here, (B1) can be carried out interposed between steps (B) and (C), and is a process for increasing plating efficiency by imparting a metal catalyst to the surface of the material. An activation step of pretreating and distributing the catalyst for activation treatment; It characterized in that it comprises a.

Here, in the step (B1), colloid molecules made from palladium (Pd ²⁺ ), tin (Sn ²⁺ ), and chlorine ions are immersed in the Pd/Sn colloidal catalyst filtrate mixed with an acidic solution. A first activation step for pre-treating the metal catalyst by attaching colloid molecules such as palladium (Pd) and tin (Sn) to the surface of the material to have an activation tendency by the metal catalyst; The palladium chloride (PdCl ₂ ·2H ₂ O) solution is immersed in an activating solution mixed with an acidic solution for the material that has undergone the first activation step, thereby reducing palladium (Pd) by the reduction action of tin (Sn) attached to the material surface. ) A second activation step for imparting a metal catalyst to enable electroless plating by depositing and distributing the metal on the material surface; It is characterized by dividing into.

Here, in the first activation step, the Pd/Sn colloidal catalyst imparting solution is formulated to contain 10 to 500 ppm palladium and 1 to 50 g/L of tin in an acidic solution, and the material is immersed at 10 to 50°C. Immersion treatment for 1 to 10 minutes under temperature conditions; In the second activation step, the activating solution is formulated to contain 0.2 to 1.0 g/L of palladium chloride (PdCl ₂ ·2H ₂ O) in 1 to 5 ml/L of the acidic solution, and the material is immersed therein, but 2.5 to 3.5 It is characterized in that the immersion treatment is performed for 1 to 3 minutes in the pH condition and the temperature condition of 20 ~ 30 ℃.

Here, the material as the base member provided in step (A) is, in the case of a metal material, a material in which one or two or more selected from Mg, Al, Cr, Zn, Nb, and Sn are alloyed; For synthetic resin materials, polycarbonate, polypropylene, nylon, polyacetal, polysulfone, noryl, ABS (acrylonitrile-butadiene-styrene), PVC (poly vinyl chloride), SAN (styrene acrylonitrile copolymer), PMMA (polymethyl methacrylate), styrene-based (PS, GPPS, HIPS), polyethylene, polyamide, it is characterized in that the material in a state in which any one or two or more selected from the synthetic state.

In addition, it can be characterized by various manufacturing methods.

In addition, the fine pipe according to the present invention for achieving the above object is a pipe-shaped body formed in a single-layer plating structure or a multi-layer plating structure by the above-described manufacturing method, and has a length of 0.01 mm to 1 cm and a length of 0.1 It is characterized in that it is formed to a thickness of ㎛ ~ 1cm.

According to the present invention, metal pipes of fine specifications can be easily manufactured using a plating process, and in particular, pipes can be manufactured from various sizes and thicknesses and various metal materials, so that the electric and electronic fields and semiconductor fields that require very fineness Including, it is possible to achieve useful effects that can be supplied by manufacturing and supplying fine pipes required in various industrial fields.

The present invention can easily manufacture pipes of fine specifications that cannot be manufactured by mechanical processing such as a drill, and can be manufactured by freely adjusting the size and thickness of the inner and outer diameters. In particular, according to the miniaturization of circuit patterns or semiconductor devices, etc. In addition to being able to easily manufacture fine pipes made of metal materials suitable for electrical property inspection, it is possible to apply them to various fields through the manufacture of fine pipes having various metal components. can do.

The present invention can achieve the usefulness of easily manufacturing a fine pipe of a tubular structure used for a pogo pin for a BBT tester, etc., and can be manufactured by increasing the flatness of the inner diameter, thereby improving manufacturing quality and durability. Usefulness that can extend the service life can be achieved.

1 is an exemplary view showing the structure of a conventional pogo pin to which a fine pipe is applied.
2 is a flowchart showing a method of manufacturing a fine pipe according to an embodiment of the present invention.
3 is a flow chart showing a method of manufacturing a fine pipe according to another embodiment of the present invention.
4 is a flow chart showing a method for manufacturing a fine pipe according to another embodiment of the present invention.
5 is a flow chart showing a method for manufacturing a fine pipe according to another embodiment of the present invention.
6 is a flowchart showing a method of manufacturing a fine pipe according to another embodiment of the present invention.
7 is a schematic process diagram illustrating a method for manufacturing a fine pipe according to the present invention.
8 is a schematic diagram of a facility configuration showing a method for manufacturing a fine pipe using a reel-to-reel facility according to the present invention.
9 is a cross-sectional view of a plating bath shown to explain a method for manufacturing a fine pipe using a reel-to-reel facility according to the present invention.
10 is a photomicrograph showing a fine pipe manufactured by the method for manufacturing a fine pipe according to the present invention.

A preferred embodiment of the present invention will be described with reference to the accompanying drawings, and it will be possible to better understand the objects and configurations of the present invention, and features thereof, through such detailed description.

The fine pipe 100 according to the embodiment of the present invention is mainly configured for use as a casing body for a pogo pin of a test device for inspecting electrical characteristics of a circuit board or semiconductor device. It can be applied to a variety of other fields that require standard pipe bodies.

The method for manufacturing a fine pipe according to the present invention for manufacturing such a fine pipe 100 includes a linear material of a metal or synthetic resin as a base member for having a structure of a fine pipe, as shown in FIGS. 2 to 7 ( S10).

At this time, the material provided as the base member is a linear material 1, as shown in Fig. 7(a), which is preferably circular, but may be provided as a polygonal body including a quadrangle as needed.

When the material is a metal material, it may be composed of a metal material in which one or two or more selected from Mg, Al, Cr, Zn, Nb, and Sn are alloyed.

In addition, in the case of synthetic resin materials, polycarbonate (PC), polypropylene (PP), nylon, polyacetal, polysulfone, noryl, ABS (acrylonitrile-butadiene-styrene), PVC (poly vinyl chloride), SAN (styrene acrylonitrile copolymer), PMMA ( Polymethyl methacrylate), styrene (PS, GPPS, HIPS), polyethylene (PE), polyamide (PA) can be composed of one or two or more synthetic resins.

Here, the metal or synthetic resin material provided as the base member may be provided as a linear material having a length of 0.01mm to 1m and a diameter of 0.01mm to 1cm, and the cutting operation is performed after forming the plating layer for the desired length. Can be done.

Here, the linear material provided as the base member may be fixed to a jig or rack according to its length, and then post-processes may be performed.

Sometimes, as in the example shown in Figs. 8 and 9, it is possible to perform various processes for manufacturing fine pipes in a continuous process by winding a linear material on a reel using a reel-to-reel facility, and in this case, the length of the material is limited. It can provide the advantage of being able to perform the process without.

The surface of the metal or synthetic resin material is cleaned in order to be able to uniformly deposit the plating material during the plating treatment for removing the pollutant source and forming a fine pipe (S20).

In this case, the cleaning step is a process of degreasing treatment, and depending on the material provided, only ultrasonic deposition and degreasing may be performed, or a process of continuously mixing ultrasonic deposition and degreasing with electrolytic degreasing may be performed.

Here, the ultrasonic deposition degreasing is immersed in an alkaline degreasing solution 35 to 65 g/L in which any one or two or more of caustic sodium, sodium carbonate, sodium silicate, sodium phosphate, sodium cyanide, and surfactant is dissolved, but ultrasonic oscillation It is preferable to perform the degreasing treatment for 1 to 5 minutes at a temperature condition of 45 to 65° C.

At this time, the alkaline degreasing liquid may be said to be good to increase the pH value for a strong degreasing action, but it is better to properly adjust the pH since it may be eroded by alkali depending on the material provided.

Here, the electrolytic degreasing is a material in 0.1 to 150 g/L of an electrolytic degreasing solution in which one or two or more of sodium cyanide, sodium hydroxide, sodium carbonate, sodium bicarbonate, regular sodium, trisodium phosphate, and surfactant are dissolved. However, it is preferable to perform degreasing treatment by electrolyzing a cathode or an anode for 1 to 5 minutes at a current density of 2 to 10 A/dm ² and a temperature of 40 to 60°C.

At this time, for the current density, 5 to 10 A/dm ^{2 for} degreasing the cathode and 2 to 5 A/dm ² for degreasing the anode would be preferable.

In addition, each component used in the electrolytic degreasing solution will be used in a different amount according to the material provided and its properties.

A metal plating layer is formed on the surface of the material through electroplating or electroless plating on the material that has undergone the cleaning step, or a process of mixing electroless plating and electroplating, but single-layer plating or multi-layer plating is performed (S30). ).

Here, in the case of electroless plating and electroplating together, it is desirable to perform electroless plating first and then electroplating to form the outer finish layer. This is when a large number of products are fixed and multiple products are plated. This is to prevent the plating thickness standard from becoming uneven due to the difference in the amount of current flowing in the plating bath depending on the fixed location of the wires. For this purpose, electroless plating is first performed so that the plating thickness is constant, and an advantageous electroplating is performed in the surface roughness. It is desirable to perform it later to finish the surface.

Here, in the case of performing only electroless plating, the number of processes can be reduced compared to the above-described process of combining electroless plating and electroplating, and standard uniformity of the plating thickness can be increased when producing large quantities, and it is weak compared to electroplating. One useful plating flatness can be matched.

At this time, when manufacturing a fine pipe to be applied to the pogo pin casing, it is desirable to maintain the flatness for the smoothness of the part into which the inner spring is inserted, but the flatness of the material of the base member and the useful level of plating through the plating pretreatment process Flatness can be created.

In addition, when only electroplating is performed, the number of processes can be reduced when a small amount is produced at a time or when plating is processed in a plating bath.

Furthermore, in the case of performing the above-described plating, it is possible to lead to continuous manufacturing and production while making the plating thickness uniform by using a reel-to-reel plating facility.

In the above configuration, in the plating step, among Cu, Ni, Cr, Sn, Zn, Au, Ag, Rh, Pt, Pd, Ti, Co, Cd, V, Nb, Mo, W, Hf on the surface of the material. A plating layer can be formed by depositing any one selected or two or more simultaneously, and a single-layer plating layer can be formed by plating one metal material as a single layer, and sometimes multiple metals having different components as needed. A multilayer plating layer can be formed by continuously plating a material in multiple layers.

At this time, the plating layer may be formed to a thickness of 0.1 μm to 1 cm according to single-layer plating or multi-layer plating, and may be formed by adjusting the sizes of the inner diameter and the outer diameter according to user requirements and needs.

For example, in the plating layer, any one selected from Cu, Ni, Cr, Sn, Zn, Au, Ag, Rh, Pt, Pd, Ti, Co, Cd, V, Nb, Mo, W, Hf is deposited. Alternatively, two or more can be simultaneously precipitated to form a single layer plating layer on the surface of the material.

For example, in the plating layer, a multilayer plating layer can be formed by plating on the surface of the material in the order of gold plating → first nickel plating → copper plating → second nickel plating → gold plating or silver plating. Two or more multilayer plating layers can be formed in various ways.

Incidentally, the plating layer can be formed as a single layer (2) on the outer surface of the provided material (1), as shown in Fig. 7 (b), and is formed in a multilayer (2) (3) (4) structure. You may.

Accordingly, in the present invention, the surface of the material can be plated with various thicknesses and various metal layers that can be used for a very suitable use in the application field, and since the pipe shape is formed by using plating, the size of the inner and outer diameters can be adjusted to a desired shape. It can provide many advantages, such as that it can be formed.

The resulting product (the result of forming a plating layer on the material) that has gone through the plating step is immersed in a separation aqueous solution for material dissolution to dissolve only the material as the base member, or decompose it by known methods such as oxidation, corrosion, etc. to separate the material and leave only the plating layer. As a result, a metallic fine pipe is manufactured (S40).

Here, in the material separation step (S40), when the material is a metal material, any one of a solution in which NaOH is dissolved in 1 to 500 g/L, HCl 1 to 100% solution, and H ₂ SO ₄ 1 to 100% solution It is preferable to select and use it as a separation aqueous solution for material dissolution, and by immersion treatment of the material in the separation aqueous solution for material dissolution, only the material is dissolved to separate the plating layer.

In this case, it is possible to increase the penetration effect of the separated aqueous solution for dissolving the material through ultrasonic oscillation, and it is carried out until the material is dissolved in a temperature condition of 20~90℃.

For example, when the material is aluminum (Al), a NaOH solution may be used, and when the material is zinc (Zn), a HCl solution or H ₂ SO ₄ solution may be used.

In addition, in the material separation step (S40), when the material is a synthetic resin material, a 20-50% concentration of KOH or NaOH solution, a solution in which 5-50% ethanol is mixed with 20-50% NaOH, and formic acid 10 It is preferable to select any one of ~100% solution and use it as a separation aqueous solution for material dissolution, and dissolve only the material by immersing the material in the separation aqueous solution for material dissolution to separate the plating layer.

In this case, it is possible to increase the penetration effect of the separated aqueous solution for dissolving the material through ultrasonic oscillation, and it is carried out until the material is dissolved in a temperature condition of 20~90℃.

For example, if the material is polycarbonate or polyethylene, a KOH solution, NaOH solution, or a mixture of NaOH and ethanol can be used, and for polyamide, formic acid can be used.

That is, through the material separation step (S40), as shown in Fig. 7(c), a fine pipe 100 of a tubular body that can be formed by adjusting the thickness of the inner and outer diameters having a thickness of a single layer or multiple layers is manufactured. can do.

Here, by dissolving only the material as the base member, the material is separated, and only the plating layer is left, and then the metal fine pipe can be manufactured by adjusting the required length through a cutting process according to the material length.

Further, in the present invention, as a process for increasing the plating efficiency in the plating step (S30) according to the kind and composition of the material provided, between the cleaning step (S20) and the plating step (S30) The activation step (S22) of activating the surface of the material can be performed, and a uniform metal layer can be formed over the entire surface of the material, thereby increasing the flatness of the inner diameter of the manufactured fine pipe, thereby manufacturing the fine pipe It can improve quality and durability.

Here, the activation step (S22) is a process that can be performed intervening between the cleaning step (S20) and the plating step (S30), the first activation step (S22A) and the second activation step (S22B) It can be divided into and carried out.

Here, the first activation step (S22A) is a Pd/Sn colloidal catalyst in which colloid molecules made from palladium (Pd ²⁺ ), tin (Sn ²⁺ ) and chlorine ions are mixed in an acidic solution including hydrochloric acid for the material. This is a process for pre-treating a metal catalyst by attaching colloid molecules, palladium (Pd) and tin (Sn) to the surface of the material by immersion in the imparting solution, thereby giving the tendency to be activated by the metal catalyst.

Here, as the acidic solution, as well as hydrochloric acid, sulfuric acid, nitric acid, acetic acid, and tartaric acid may be used.

At this time, in the first activation step, 10 to 500 ppm of palladium and 1 to 50 g/L of tin are contained in an acidic solution such as hydrochloric acid with respect to the Pd/Sn colloidal catalyst imparting solution, and the material is immersed at 10 to 50°C. It is preferable to immerse for 1 to 10 minutes at the temperature condition of.

More preferably, 150 to 300 ppm of palladium and 10 to 30 g/L of tin are included, and treatment is performed for 2 to 5 minutes at a temperature of 25 to 45°C.

Here, the second activation step (S22B) is a material by immersing a palladium chloride (PdCl ₂ · 2H ₂ O) solution in an activation solution mixed with an acidic solution including hydrochloric acid for the material that has passed the first activation step. This is a process for imparting a metal catalyst to enable electroless plating by depositing and distributing palladium (Pd) metal on the surface of the material through the reduction action of tin (Sn) attached to the surface.

Here, as the acidic solution, as well as hydrochloric acid, sulfuric acid, nitric acid, acetic acid, and tartaric acid may be used.

At this time, in the second activation step, 0.2 to 1.0 g/L of palladium chloride (PdCl ₂ ·2H ₂ O) is contained in 1 to 5 ml/L of an acidic solution such as hydrochloric acid, and the material is deposited therein. However, it is preferable to immerse for 1 to 3 minutes at a pH condition of 2.5 to 3.5 and a temperature of 20 to 30°C.

Further, in the present invention, as a process for increasing the plating efficiency in the plating step (S30) according to the type and component of the material provided, when the material provided as the base member is aluminum (Al), the Between the cleaning step (S20) and the plating step (S30), a pre-plating treatment step (S24) in which an etching process and a Zincate process are continuously performed may be performed, and the cleaning step (S20) And the plating step (S30) may be interposed between.

Here, the etching process of the pre-plating treatment step (S24) is a process for improving the adhesion between the material and the oxide film formed by zincate treatment by corroding the surface of the aluminum (Al) material.

At this time, in the etching process, the aluminum (Al) material is immersed in NaOH 5 to 100 g/L, but it is preferable to corrode the surface of the aluminum (Al) material by treating it for 30 seconds to 1 minute at a temperature condition of 20 to 60°C. .

In addition, the zincate process is a process for forming an oxide film on the surface of the material by immersing an aluminum (Al) material in the zincate treatment solution after the etching process. The oxide film formed on the aluminum surface is dissolved to oxidize zinc, etc. This is a process for removing factors that inhibit adhesion by forming a film.

At this time, the zincate process is used by diluting ATOTECH's Alumseal W-2000 with water at 550ml/L capacity, but it is preferable to treat it at room temperature (20~30℃) for 30 seconds to 90 seconds.

Further, in the present invention, as a process for increasing the plating efficiency in the plating step (S30) according to the type and component of the material provided, the cleaning is performed when the material provided as the base member is zinc (Zn). A copper plating step (S26) of forming a copper plating between the step (S20) and the plating step (S30) may be performed.

Here, the copper plating step (S26) may be interposed between the cleaning step (S20) and the plating step (S30), and is a process of forming a copper plating on the surface of a zinc (Zn) material.

In addition, in the present invention, as a process for increasing the plating efficiency in the plating step (S30) as well as the inner diameter flatness of the manufactured fine pipe according to the type of material provided, the cleaning step (S20) and the It may be carried out intervening between the plating step (S30) and the deposition step (S28) of performing metal deposition by physical vapor deposition (PVD) or chemical vapor deposition (CVD) on the surface of the material may be performed.

Here, the deposition step (S28) is a plating pretreatment step that can form a uniform deposition layer over the entire surface of the material, thereby increasing the flatness of the inner diameter of the manufactured fine pipe, which is the manufacturing quality of the manufactured fine pipe. And durability.

As described above, in the present invention, in the plating step (S30), by selectively performing the activation step (S22), the plating pretreatment step (S24), the copper plating step (S26), the deposition step (S28), etc. Plating efficiency can be improved, and the work of increasing the flatness of the inner diameter of the manufactured fine pipes can be performed.This step is used to inspect the electrical characteristics of the circuit board pattern or semiconductor device for the manufactured fine pipes. When used as a pogo pin casing (metal tube) of a test device including a BBT (Bare Board Test) tester, the overall flatness of the inner diameter does not impede the elastic force of the spring involved in the pin operation. It can provide an advantage of increasing the service life of the pogo pin while improving inspection efficiency.

Further, in the present invention, the processes of the above-described manufacturing method can be carried out as a continuous process using a reel-to-reel facility, a material preparation step (S10), a cleaning step (S20), an activation step (S22), and a plating pretreatment step (S24). , The copper plating step (S26), the plating step (S30), the material separation step (S40) may be selectively carried out according to the type of material provided and carried out in a continuous process.

On the other hand, in the method of manufacturing a fine pipe according to the present invention, an example will be described as follows.

(Example 1)

When the material is made of aluminum and single-layer plating is performed using electroless plating, a fine pipe can be manufactured through the following steps.

Aluminum material preparation step → cleaning step (ultrasonic deposition and degreasing) → plating pretreatment step (etching and zincate) → plating step (electroless plating, single layer plating) → material separation step.

(Example 2)

When the material is made of zinc and single-layer plating is performed using electroplating, a fine pipe can be manufactured through the following steps.

Zinc material preparation step → cleaning step (ultrasonic deposition degreasing and electrolytic degreasing) → copper plating step → plating step (electroplating, single layer plating) → material separation step.

(Example 3)

When a synthetic resin material is used as a material and single-layer plating is performed using electroless plating, a fine pipe can be manufactured through the following steps.

Synthetic resin material preparation step → washing step (ultrasonic deposition and degreasing) → activation step (first activation step and second activation step) → plating step (electroless plating, single layer plating) → material separation step.

(Example 4)

When the material is made of aluminum and multi-layer plating is performed using electroplating, a fine pipe can be manufactured through the following steps.

Aluminum material preparation step → washing step (ultrasonic deposition and degreasing) → plating pre-treatment step (etching and zincate) → plating step (electroplating, multi-layer plating) → material separation step.

(Example 5)

When the material is made of zinc and multi-layer plating is performed using electroplating, a fine pipe can be manufactured through the following steps.

Zinc material preparation step → cleaning step (ultrasonic deposition degreasing and electrolytic degreasing) → copper plating step → plating step (electroplating, multi-layer plating) → material separation step.

(Example 6)

When a synthetic resin material is used as a material and multilayer plating is performed using electroplating, a fine pipe can be manufactured through the following steps.

Synthetic resin material preparation step → washing step (ultrasonic deposition and degreasing) → activation step (first activation step and second activation step) → plating step (electroless plating and multi-layer electroplating) → material separation step.

Accordingly, in the present invention, as a pipe-shaped body formed in a single-layer plating structure or formed in a multi-layer plating structure by the manufacturing method through the above-described steps, the length of 0.01mm ~ 1cm and the thickness of 0.1㎛ ~ 1cm The fine pipe 100 can be easily manufactured through a method using a plating process.

On the other hand, Figure 10 is a micrograph of a product having a single-layer plated body manufactured by the method of manufacturing a fine pipe of the present invention.

The embodiments described above are only to describe preferred embodiments of the present invention, and are not limited to these embodiments, and various modifications made by those skilled in the art within the spirit and scope of the present invention Modification or substitution will be said to fall within the technical scope of the present invention.

S10: material preparation step
S20: washing step
S22: active stage
S24: plating pretreatment step
S26: Copper plating step
S28: deposition step
S30: plating step
S40: material separation step

Claims (14)

In the manufacturing method for manufacturing a fine pipe,
(A) providing a linear material of a metal material or a synthetic resin material as a base member for giving a structure of a fine pipe;
(B) cleaning the surface for uniform deposition of the plating material during plating treatment for removing contaminants from the material and forming fine pipes;
(C) forming a metal plating layer on the surface of the material through a process of performing electroplating or electroless plating on the material or mixing electroless plating and electroplating, but performing single-layer plating or multi-layer plating;
(D) separating the material by immersing the resultant obtained through step (C) in a separate aqueous solution for dissolving the material to dissolve only the material as the base member, and preparing a metallic fine pipe by leaving only the plating layer; including,
A method for manufacturing a fine pipe, characterized in that the manufacturing method is carried out in a continuous process using a reel-to-reel facility.
The method of claim 1,
(B1) It can be carried out intervening between steps (B) and (C), and is a process to increase plating efficiency by imparting a metal catalyst to the surface of the material, and pretreat the metal catalyst on the surface of the material. And an activation step of performing activation by distributing. Fine pipe manufacturing method comprising a.
The method of claim 2,
In step (B1),
The material was immersed in a Pd/Sn colloidal catalytic solution mixed with colloidal molecules made from palladium (Pd ²⁺ ), tin (Sn ²⁺ ) and chlorine ions in an acidic solution to obtain palladium (Pd) and colloidal molecules. A first activation step for pretreating the metal catalyst by attaching tin (Sn) to the material surface to have an activation tendency by the metal catalyst;
The palladium chloride (PdCl ₂ ·2H ₂ O) solution is immersed in an activating solution mixed with an acidic solution for the material that has undergone the first activation step, thereby reducing palladium (Pd) by the reduction action of tin (Sn) attached to the material surface. ) A second activation step for imparting a metal catalyst to enable electroless plating by depositing and distributing the metal on the material surface; Fine pipe manufacturing method, characterized in that carried out by dividing into.
The method of claim 3,
In the first activation step,
For the Pd/Sn colloidal catalyst imparting solution, the acidic solution contains 10 to 500 ppm of palladium and 1 to 50 g/L of tin, and the material is immersed in it, but immersion treatment for 1 to 10 minutes at a temperature of 10 to 50°C. And;
In the second activation step,
Palladium chloride (PdCl ₂ ·2H ₂ O) 0.2 to 1.0 g/L is contained in 1 to 5 ml/L of the activating solution, and the material is immersed therein, but at 2.5 to 3.5 pH conditions and at 20 to 30°C. Fine pipe manufacturing method, characterized in that the immersion treatment for 1 to 3 minutes at the temperature condition of.
The method of claim 1,
(B2) When the material provided in step (A) is aluminum (Al) as a metal material, it may be interposed between steps (B) and (C) to increase plating efficiency. As a process,
An etching process to improve the adhesion between the material and the oxide film formed by zincate treatment by corroding the surface of the aluminum (Al) material, and after the etching process, the aluminum (Al) material is added to the zincate treatment solution. Continuously performing a Zincate process for forming an oxide film on the surface of the material by immersion; Fine pipe manufacturing method comprising a.
The method of claim 1,
In step (B),
Material is immersed in 35~65g/L of alkaline degreasing solution in which any one or two or more of caustic sodium, sodium carbonate, sodium silicate, sodium phosphate, sodium cyanide, surfactant is dissolved, but ultrasonic oscillation and temperature condition of 45~65℃ Ultrasonic deposition degreasing is performed for 1 to 5 minutes in the degreasing process;
Alternatively, the ultrasonic deposition and degreasing process and the electrolytic degreasing process are continuously performed, and the electrolytic degreasing is performed by one or two or more of sodium cyanide, sodium hydroxide, sodium carbonate, sodium bicarbonate, sodium regular acid, trisodium phosphate, and surfactant. The material is immersed in 0.1 to 150 g/L of the dissolved electrolytic degreasing solution, characterized in that the degreasing treatment is performed by electrolyzing the cathode or the anode for 1 to 5 minutes at a current density of 2 to 10 A/dm ² and a temperature of 40 to 60°C. Fine pipe manufacturing method.
The method of claim 1,
In step (C),
On the surface of the material, any one selected from Cu, Ni, Cr, Sn, Zn, Au, Ag, Rh, Pt, Pd, Ti, Co, Cd, V, Nb, Mo, W, Hf or two A method for manufacturing a fine pipe, characterized in that the above is simultaneously precipitated to form a plating layer, and a single-layer plating layer or a multi-layer plating layer is formed.
The method of claim 1,

In step (D),
If the material is a metal material,
The separation aqueous solution for material dissolution is one of a solution in which NaOH is dissolved in 1 to 500 g/L, a solution in HCl concentration of 1 to 100%, and a solution in concentration of H2SO4 of 1 to 100% to separate the plating layer by dissolving only the material. It is carried out until the material is melted under ultrasonic oscillation and temperature conditions of 20 ~ 90 ℃;

If the material is a synthetic resin material,
The separated aqueous solution for dissolving the material is a solution of 20-50% concentration of KOH or NaOH, a solution of 20-50% concentration of NaOH and 5-50% concentration of ethanol, and a 10-100% concentration of formic acid solution A method for manufacturing a fine pipe, characterized in that by selecting any one of them and melting only the material to separate the plating layer, and performing ultrasonic oscillation and until the material is melted in a temperature condition of 20 to 90°C.

The method of claim 1,
(B3) As a plating pretreatment step that can be carried out interposed between steps (B) and (C), when the material provided in step (A) is zinc (Zn) as a metal material, plating efficiency can be improved. Performing copper plating on the surface of the material to ensure that it is; Fine pipe manufacturing method comprising a.
The method of claim 1,
(B4) As a plating pretreatment step that can be carried out intervening between steps (B) and (C), physical vaporization on the surface of the material to increase plating efficiency and inner diameter flatness of the manufactured fine pipes. Performing metal deposition by vapor deposition or chemical vapor deposition; Fine pipe manufacturing method comprising a.
The method of claim 1,
The material as the base member provided in step (A),
For metal,
It is a material in which one or two or more selected from Mg, Al, Cr, Zn, Nb, and Sn are alloyed;
For synthetic resin materials,
polycarbonate, polypropylene, nylon, polyacetal, polysulfone, noryl, ABS (acrylonitrile-butadiene-styrene), PVC (poly vinyl chloride), SAN (styrene acrylonitrile copolymer), PMMA (polymethyl methacrylate), styrene (PS, GPPS, HIPS) , polyethylene, polyamide, any one or two or more selected from the method of manufacturing a fine pipe, characterized in that the material in a state of being synthesized.
The method of claim 1 or 7,
The plating layer,
Fine pipe manufacturing method, characterized in that formed to a thickness of 0.1㎛ ~ 1cm.
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