KR102159556B1 - Construction method of laying type buffer material and sound insulation structure in floor using the same - Google Patents

Abstract

The present invention relates to a method of constructing a mounted type buffer material and a structure for sound insulation between floors of a building using the same. The method of constructing a mounted type buffer material comprises the steps of: attaching a side surface insulating material with a first display line for displaying a construction height of a mounted type buffer material to a side surface of a wall body from the floor of the slab; horizontally aligning a laser beam to the first display line of the side surface insulating material to install a laser level so that the other laser beam is horizontally irradiated according to the construction height of the mounted type buffer material; and laying the mounted type butter material on the floor of the slab and flattening an upper surface of the mounted type buffer material so that the upper surface is aligned with the laser beam by using a tool for flattening. According to the present invention, through the guide of flatness by the laser beam together with the display line by the side surface insulating material, the mounted type buffer material can be placed to have accurate and excellent flatness at a predetermined height, and accordingly, uniformity of impact sound buffering effect is improved and uniformity of a thickness of a mortar layer is increased. Therefore, it is possible to overcome a floor level difference of the slab, reduce unnecessary waste of the mortar, provide a uniform floor temperature during heating, increase excellency and reliability with respect to performance of blocking impact sound, and remarkably contribute to increase in convenience in constructing the mounted type buffer material and increase in the quality of the same.

Description

Construction method of laying type buffer material and sound insulation structure in floor using the same}

The present invention relates to a laying-type cushioning material construction method and a soundproof structure between floors of a building using the same, and more particularly, by enabling the placement of a laying-type buffering material to have an accurate and excellent flatness at a predetermined height, thereby improving the uniformity of the impact sound buffering effect. In addition, the present invention relates to a method of constructing an installation-type cushioning material to increase the uniformity of the thickness of the mortar layer, and to a soundproof structure between layers of buildings using the same.

In general, multi-family houses such as apartments or multi-family houses are formed of a wall-type structure constituting a single structure by connecting a column made of reinforced concrete having a certain thickness and a slab supported by a wall. In other words, after completing the foundation work by constructing the slab supported by the pillars and walls according to the number of floors in the building, cement mortar is installed in a predetermined thickness with pipes such as heating pipes and water supply pipes arranged at regular intervals on the concrete slab. Is to do.

Such a building structure has some degree of blocking performance against air transmission noise caused by dialogue or TV, but the floor that divides the floor and the floor, that is, the slab is constructed only with concrete, so the noise or impact generated inside the corresponding floor of the building There was a problem in that the vibration caused by it is easily transmitted to the adjacent household and the lower floor through the interlayer slab.

This noise problem is mainly inter-floor noise, which is a weight impact sound caused by shock or vibration generated from outside or inside. By not effectively blocking such inter-floor noise, the sound of children running and doors in apartment houses The sound of closing, the barking of a pet dog, the sound of using washing machines, vacuum cleaners, exercise equipment, etc. late or early, and the sound of flushing water from the bathroom and kitchen are transmitted to neighboring households, causing considerable discomfort, and even neighbors By causing civil complaints between generations, government ministries are also trying to further strengthen these soundproof standards, and various technologies have been proposed to prevent or reduce the occurrence of inter-floor noise.

On the other hand, in the apartment construction site, the smoothness of the floor is not constant, so that the level of the slab floor is deviated by a maximum of 40 mm, as shown in Table 1 below, with respect to the measurement position as in FIG. 1.

One 2 3 4 5 6 A 1526 1523 1521 1521 1523 1524 B 1512 1515 1516 1507 1534 1526 C 1499 1509 1515 1518 1540 1530 D 1512 1509 1517 1520 1542 1533 E 1523 1518 1518 1521 1540 1542 F 1507 1520 1507 1520 1534 1538 G 1511 1510 1517 1505 1533 1527

There are various causes of such a level error of the slab floor, but it is considered to be the most largely due to the deflection due to the load of the slab, the quality of the concrete, and the skill of the worker.

On the other hand, since the cushioning material so far is a pad-type product manufactured in advance in a factory, when it is in close contact with the floor of a slab that is not smooth and has irregularities, voids are generated between the slab and the pad-type cushioning material, causing defects. Therefore, after the construction of the cushioning material, foamed concrete that can be adjusted horizontally was poured on the upper surface.

In the conventional wet structure applying foamed concrete, the order of 1) buffering material installation 2) foamed concrete pouring and curing 3) hot water pipe installation, and 4) finishing mortar placement and curing. Here, the second foamed concrete has no other role except the role of setting the horizontal level and fixing the heating pipe.

On the other hand, compared to the conventional wet structure, the semi-dry structure without foamed concrete exhibits an average of 3-4 dB lower in performance to field impact sound, and thus many construction companies are applying it.

In this semi-dry structure, due to the problem of horizontal smoothness, when a pad-type product is used as a cushioning material, the thickness of the finished mortar may vary from 40 to 100 mm. The hot water piping embedded in this finished mortar does not have a certain depth, so it uses much more mortar than expected during work, causing unnecessary waste, and when heating after moving in, the temperature rise of the thick mortar slows down and the thin part As the temperature rises rapidly, there is a problem in that the floor does not show a homogeneous temperature.

For this reason, although the semi-dry structure is advantageous in terms of floor impact sound absorption performance, it is an obstacle to the expansion of the flatness of the slab thickness. Therefore, in order to keep the uneven thickness of the mortar constant, it is necessary to overcome the difference in the level of the floor by preparing the cushioning material in an on-site installation type rather than a pad type product. In this case, the flatness of the installation type buffer material made of particles is maintained. I needed to figure out a way for it.

Korean Patent Laid-Open Publication No. 10-2018-0131785, "Inter-floor noise prevention structure to mitigate inter-floor noise in apartment houses", 2018.12.

In order to solve the problems of the prior art as described above, the present invention enables the placement of a laying-type cushioning material to have an accurate and excellent flatness at a predetermined height, thereby improving the uniformity of the impact sound buffering effect and reducing the thickness of the mortar layer. Increased uniformity, thereby overcoming the difference in the floor level of the slab, reducing unnecessary waste of mortar, providing a homogeneous floor temperature during heating, and enhancing the excellence and reliability of the impact sound blocking performance. The purpose is to greatly contribute to the improvement of construction convenience and construction quality of the type buffer material.

Other objects of the present invention will be easily understood through the description of the following embodiments.

In order to achieve the object as described above, according to an aspect of the present invention, the steps of attaching a side insulating material provided with a first display line indicating the construction height of the installation type cushioning material on the side of the wall from the bottom of the slab; Arranging the laser beam horizontally on the first display line of the side insulating material, thereby installing a laser level so that another laser beam is irradiated horizontally according to the construction height of the installed buffer material; And a step of flattening the upper surface of the laying-type buffer material to be aligned with the laser beam by using a tool for planarization by spreading a laying-type buffer material on the floor of the slab.

The side insulating material may additionally be provided with a second display line indicating the construction height of the mortar above the first display line.

In the step of installing the laser level, at least one laser level may be installed on a side surface of the wall so as to irradiate a laser beam to the first display line of the side insulating material and the construction height of the installation type buffer material.

The laying-type buffering material includes TPU particles, EVA chips, and a binder, and 30-50v% of the TPU particles are included with respect to 100v% of the total volume of the laying-type buffering material, and 50-70v% of the EVA chips are included. I can.

The binder is for bonding the TPU particles and the EVA chip, and when the total weight of the TPU particles and the EVA chip is 100 parts by weight, it may be included in an amount of 15 to 25 parts by weight.,

The TPU particle may use a size of 3 to 7 mm, and the EVA chip may use a particle size of 5 to 10 mm.

By using the laying-type buffer material construction method according to an aspect of the present invention, there is provided an interlayer sound insulation structure in which the laying-type buffer material is constructed to have an interlayer sound insulation structure for the building.

According to the laying-type buffer construction method according to the present invention and the soundproofing structure between the floors of the building using the same, it is installed to have an accurate and excellent flatness at a predetermined height through a guide of flatness through a laser beam along with a display line by side insulation. By making it possible to place the type cushioning material, it is possible to improve the uniformity of the impact sound buffering effect and increase the uniformity of the thickness of the mortar layer, thereby reducing unnecessary waste of mortar while overcoming the difference in the floor level of the slab. In addition to providing a homogeneous floor temperature, excellence and reliability in blocking performance of impact sound can be improved, and it has the effect of greatly contributing to the convenience of construction and quality improvement of the laying-type cushioning material.

1 is a view showing a level measurement position with respect to a conventional slab bottom surface.
Figure 2 is a view comparing the field impact sound measurement performance of the conventional 30mm wet structure and 60mm semi-dry structure.
3 is a flowchart showing a method of constructing a laying-type buffer according to an embodiment of the present invention.
Figure 4 is a perspective view showing a state in which the side insulating material is installed in the installation method of a cushioning material according to an embodiment of the present invention.
5 is a drawing substitute photograph showing a state in which a laying-type buffer material is installed on the upper surface of an interlayer slab in the laying-type buffer material construction method according to an embodiment of the present invention.
6 is a side cross-sectional view for explaining a process of flattening the laying-type buffer material by installing a laser level in the laying-type buffer material construction method according to an embodiment of the present invention.
7 is a perspective view of FIG. 5.
8 is a perspective view showing a side insulating material in a method of constructing an installation type buffer according to an embodiment of the present invention.
9 is a perspective view showing another example of a side insulating material in the laying-type buffer material construction method according to an embodiment of the present invention.
FIG. 10 is a drawing substitute photograph showing that TPU particles in the form of spherical particles are contained in a container in the method of constructing a laying-type buffer according to an embodiment of the present invention.
11 is a drawing substitute photograph showing the size of an example of TPU particles in the laying-type buffer material construction method according to an embodiment of the present invention.
FIG. 12 is a drawing substitute photograph showing that finely cut EVA chips are contained in a container in a method of constructing an installation type buffer according to an embodiment of the present invention.
13 is a drawing substitute photograph showing in detail the EVA chip in the laying-type cushioning material construction method according to an embodiment of the present invention.
14 is a drawing substitute photograph showing the size of an example of an EVA chip in a method of constructing an installation type buffer according to an embodiment of the present invention.
15 is a drawing substitute photograph showing a state in which TPU particles and EVA chips are mixed together with a binder in the laying-type buffering material construction method according to an embodiment of the present invention.
16 is a table of results obtained by measuring a dynamic modulus of elasticity, a resonant frequency band, and a loss factor according to the volume ratio of TPU particles and EVA chips in the laying-type buffer construction method according to an embodiment of the present invention.
17 is a graph showing the measurement result of the weight impact sound blocking performance according to the volume ratio of the TPU particles and the EVA chip in the laying-type cushioning material construction method according to an embodiment of the present invention.

In the present invention, various changes may be made and various embodiments may be provided, and specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to a specific embodiment, and should be understood in a way that includes all changes, equivalents, or substitutes included in the technical spirit and scope of the present invention, and may be modified in various other forms. It can be, and the scope of the present invention is not limited to the following examples.

Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings, and the same reference numerals are assigned to the same or corresponding components regardless of the reference numerals, and redundant descriptions thereof will be omitted.

3 is a flow chart showing a method of constructing a laying-type cushioning material according to an embodiment of the present invention.

Referring to Figure 3, the installation method according to an embodiment of the present invention, the step of attaching the side insulating material (S11), the step of installing a laser level (S12), and the step of flattening the upper surface of the laying type buffer material ( S13) may be included.

4 and 8, according to the step of attaching the side insulating material (S11), the construction height of the laying-type cushioning material 12 (see FIG. 6) is displayed on the side of the wall 15 from the bottom of the slab 11 A side insulating material 13 on which one first display line 13a is provided is attached. The side insulating material 13 is attached to the lower end of the side of the wall 15 along the bottom edge of the slab 11 using an adhesive material or an adhesive member, and may be made of a material for heat insulation or sound absorption. In addition, the side insulating material 13 may be provided with a first display line 13a on the exposed surface by various methods such as printing, drawing, or taping.

5 to 8, according to the step of installing the laser level (S12), by horizontally aligning the laser beam to the first display line 13a of the side insulating material 13, other laser beams are installed Install the laser level 20 so as to be irradiated horizontally according to the construction height of (12). The side insulating material 13 guides the installation height V1 of the installation type buffer material 12 on the lower side thereof based on the first display line 13a, and a layer formed on the installation type buffer material 12 on the upper side thereof. , For example, it can guide the stacking height (V2) of the mortar layer. Here, the laser level 20 is at least one on the side of the wall 15 so as to irradiate a laser beam to the construction height of the first display line 13a of the side insulating material 13 and the installation type buffer material 12, respectively, For example, 1-3 units may be installed.

The laser leveler 20 may be fixed to the side of the wall 15 by a bracket 21 that is detachably fixed by bolting or other various methods. At this time, each of the irradiated laser beams is a side insulating material ( It is fixed so as to be positioned at a height to irradiate horizontally with respect to the construction height of the first display line 13a and the installation type buffer material 12 of 13). In addition, the laser level 20 is supplied with power from the outside, and at least one laser irradiation unit 22 for irradiating the laser beam may be installed horizontally at the bottom, for example. As in this embodiment, the laser oscillator 20 ), a plurality of laser irradiation units 22 for irradiating a plurality of laser beams in various directions around the main body may be horizontally installed at the bottom, and the irradiation trajectory of the laser beam from the laser irradiation unit 22 is a side insulating material (13). ) Of the first display line 13a and the installation height of the installation type buffer material 12, respectively.

Referring to FIG. 9, the side insulating material 14 according to another example includes a second display line indicating the construction height of the mortar on the upper side of the first display line 14a guiding the construction height of the installation type buffer material 12 ( 14b) may be additionally provided. Accordingly, the first display line 14a guides the upper construction height of the laying type cushioning material, while the second display line 14b guides the upper construction height of the mortar layer.

6 and 7, according to the step (S13) of flattening the upper surface of the laying-type buffer material, a tool for flattening by laying the laying-type buffer material 12 on the bottom of the slab 11, for example, a wooden shovel or trowel, etc. By using, the upper surface of the laying type buffer material 12 is planarized so that it is directly aligned with the laser beam.

This planarized laying-type buffer material 12 may be subjected to curing for about 1 day to perform a subsequent operation after adhesion between chips is completed.

In the method of constructing the laying-type buffer material according to the present invention, the laying-type buffer material is, for example, TPU (Thermoplastic Poly Urethane, thermoplastic polyurethane) particles in the form of spherical particles (grain form), and EVA (Ethylene- It is a composition that includes vinyl acetate copolymer) chips and a binder (binder, adhesive), and makes the TPU particles and EVA chips integrally bonded by the binder by mixing a binder with the elastic particles consisting of TPU particles and EVA chips.

As illustrated in FIGS. 10 and 11, the TPU particles included in the laying-type buffer material of the present invention are made in the form of round spherical small particles, and have a size (diameter) of 3 to 7 mm, for example, about 5 mm. will be. As illustrated in FIGS. 12 to 14, the EVA chip forms a shape of a chip cut into an irregular shape, and has a size of 5 to 10 mm and about 10 mm.

In the laying-type buffer material of the present invention, when the total volume of the laying-type buffer material is 100%, TPU particles are included to occupy a volume of 30-50% and EVA chips occupy a volume of 50-70%. That is, as a volume ratio, it may be included in 30-50v% of TPU particles and 50-70v% of EVA chips with respect to 100v% of the total volume of the laying-type buffer. In the laying-type buffer of the present invention, preferably, TPU particles and EVA chips may be included to occupy a volume of 50%, respectively (ie, 50v% of TPU particles and 50v% of EVA chips).

15, in the present invention, since the TPU particles are spherical and the EVA chips have an irregular shape, when laying the laying-type buffer material of the present invention composed of a mixture of such TPU particles and EVA chips, the shapes are different from each other. The TPU particles and the EVA chips fill the gaps between each other, and as a result, the cushioning material composition can be installed at a very high density, and accordingly, it is possible to deliver the impact and exhibit excellent blocking performance against noise caused by the impact.

Figure 16 shows a result table summarized by measuring the dynamic modulus, resonant frequency band, and loss coefficient according to the volume ratio of the TPU particles and the EVA chip included in the laying-type buffer of the present invention. The measurement result of the weight impact sound blocking performance according to the volume ratio of the included TPU particles and the EVA chip is shown in the graph. In the graph of FIG. 17, the vertical axis represents sound pressure, and the horizontal axis represents an audible sound band frequency.

As can be seen in FIGS. 16 and 17, when the laying-type buffer is composed of only TPU particles without EVA chips (indicated as “TPU (100%)” in FIGS. 16 and 17), 70% volume of TPU particles and 30% of EVA chips When included by volume (indicated as “TPU (70%) + EVA (30%)” in FIGS. 16 and 17), and when composed of only EVA chips without TPU particles (“EVA (100%)” in FIGS. 16 and 17 )”), assuming that the volume of the entire laying-type buffer is 100%, when the TPU particles and the EVA chips are each contained in a volume of 50% (“TPU(50%)+EVA” in FIGS. 16 and 17) (50%)”), and when contained in 30% volume of TPU particles and 70% volume of EVA chips (indicated as “TPU(30%)+EVA(70%)” in FIGS. 16 and 17) It exhibits better performance in the modulus of elasticity, resonant frequency, and loss factor. These results are the best impact sound in the laying-type cushioning material, when the total volume of the laying-type buffer is 100%, TPU particles occupy 30-50% volume and EVA chips occupy 50-70% volume. Let the blocking performance be exerted

The laying-type buffer material of the present invention includes a binder in order to bond and integrate the TPU particles and the EVA chips with each other, and such a binder is preferably added in a minimum amount while maintaining the bonding without separating the TPU particles and the EVA chips from each other. . To this end, in the present invention, when the total weight of the TPU particles and the EVA chip is 100 parts by weight, the binder may be included in 15 to 25 parts by weight, and the binder is very preferably included in 20 parts by weight. For reference, since the binder is added in the minimum amount in the laying buffer material of the present invention, the volume of the binder can be neglected.

As a binder included in the laying-type buffer of the present invention, a "urethane adhesive" in which urethane is bonded to a molecular chain may be used. In this case, the isocyanate group at the molecular end of the adhesive By bonding and curing, the TPU particles and the EVA chips are bonded. This urethane adhesive has a high elongation, and thus, it is possible to minimize the decrease in elasticity of each particle constituting the TPU particle and the EVA chip. In particular, since the urethane adhesive is not an organic solvent, the cushioning material for sound insulation and vibration insulation made by the laying-type buffer of the present invention using such a urethane adhesive becomes an eco-friendly material.

The laying-type cushioning material of the present invention is made by mixing TPU particles, EVA chips, and a binder in the above configuration.When a binder is added to the TPU particles and the EVA chip and mixed while evenly stirring, the binder becomes the cut end of the EVA chip. As it soaks in, the TPU particles and the EVA chips are integrally bonded to each other, and furthermore, when the laying-type cushioning material is laid on the upper surface of the interfloor slab of the building, the laying-type cushioning material is firmly bonded to the interlayer slab. Therefore, the laying-type cushioning material is laid on the upper surface of the interlayer slab with high density, thereby exhibiting elasticity, shock absorption, and excellent impact sound blocking performance.

Since the laying-type buffer material according to the present invention made by mixing TPU particles, EVA chips, and a binder has fluidity, it is laid on the top surface of the interlayer slab at a predetermined thickness and flattened to form a buffer material layer. Even if there is an irregular protrusion, it can be laid so that its top surface is flat.

When the laying and planarization of the laying-type buffer material is completed, a buffer material layer is formed, and a finished mortar layer is formed by placing mortar on the upper surface of the buffer material layer to the height of the vertical top of the side insulation material. In this way, the laying-type cushioning material according to the present invention made by mixing TPU particles, EVA chips, and a binder can easily adjust its laying thickness according to the site situation, so on the upper surface of the interlayer slab, the side of the column (or vertical wall) It is possible to prevent the finished mortar layer from being formed above the vertical height of the side insulating material while constructing the finished mortar layer to a design thickness with the side insulating material disposed on the side. On the other hand, it goes without saying that a separate layer for an additional function or finishing may be additionally provided before or after the formation of the finished mortar layer.

The soundproofing structure between the floors of a building in which the laying-type cushioning material is installed according to another embodiment of the present invention is for a structure on a slab formed by the laying-type buffering material construction method according to an embodiment of the present invention described above, and An insulating material and a laying-type buffer material may be included, and further, a finishing mortar layer may be additionally formed on the laying-type buffer material, and a description thereof will be omitted for the same description.

According to the method of constructing the laying-type buffer material according to the present invention and the soundproofing structure between the floors of the building using the same, it has an accurate and excellent flatness at a predetermined height through a guide of flatness through a laser beam along with a display line by side insulating material. By making it possible to place the cushioning material to be laid so that it is possible to improve the uniformity of the impact sound buffering effect and increase the uniformity of the thickness of the mortar layer, it is possible to reduce unnecessary waste of mortar while overcoming the difference in the floor level of the slab. In addition to providing a homogeneous floor temperature during heating, excellence and reliability in blocking performance of impact sound can be improved, and it has the effect of greatly contributing to the convenience of construction and quality improvement of the installation type cushioning material.

As described above, the present invention has been described with reference to the accompanying drawings, but, of course, various modifications and variations can be made without departing from the technical spirit of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims and equivalents as well as the claims to be described later.

11: slab 12: laying type cushioning material
13,14: side insulating material 13a,14a: first display line
14b: second display line 15: wall
20: laser level 21: bracket
22: laser irradiation unit

Claims (7)

Attaching a side insulating material provided with a first display line indicating the construction height of the installation type cushioning material on the side of the wall from the bottom of the slab;
Arranging the laser beam horizontally on the first display line of the side insulating material, thereby installing a laser level so that another laser beam is irradiated horizontally according to the construction height of the installed buffer material; And
Including; and a step of flattening the upper surface of the laying-type buffer material to be directly aligned with the laser beam by using a tool for planarization by laying a laying-type buffer material on the bottom of the slab, and
The step of installing the laser leveler,
At least one laser level is installed on the side of the wall so as to irradiate a laser beam to each of the first display line of the side insulating material and the construction height of the installation type buffer material,
The installation type cushioning material,
Including TPU particles, EVA chips, and a binder,
With respect to the total volume of 100v% of the laying-type buffer, the TPU particles are included in 30-50v%, the EVA chips are included in 50-70v%,
The side insulating material,
A second display line indicating the construction height of the mortar is additionally provided above the first display line,
The binder,
As for the bonding of the TPU particle and the EVA chip, when the total weight of the TPU particle and the EVA chip is 100 parts by weight, it is included in 15 to 25 parts by weight,
The TPU particles,
Use a size of 3~7mm,
The EVA chip,
Installation method of laying type cushioning material using a particle size of 5-10mm. delete delete delete delete delete A soundproofing structure between floors of a building in which an installation-type buffering material is installed, so as to have an interlayer soundproofing structure for a building by using the installation-type buffering material construction method according to claim 1.

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