KR102134471B1 - Test apparatus with adjustable horizontal level - Google Patents

Abstract

The technical idea of the present invention provides a test apparatus capable of horizontal adjustment, which can test in a use environment of a test object, that is, an arrangement structure in which the test object is mounted in a product in a substantially identical arrangement structure. The test apparatus comprises: a test socket; an upper structure in which the test socket is disposed so that contact pins of the test socket face downward; a housing guide on which the test object is disposed; a connector arranging table on which a micro-connector of the test object is arranged; and a lower structure in which the housing guide and the connector arranging table are disposed. When testing the test object, the level of the test object is adjusted by the housing guide, and horizontal adjustment is possible.

Description

Test apparatus with adjustable horizontal level

The technical idea of the present invention relates to a test apparatus, and more particularly, to a test apparatus capable of horizontal adjustment to test by adjusting the level of a test object.

2. Description of the Related Art Recently, electronic components have been miniaturized in accordance with the trend of multifunctionalization and miniaturization of semiconductor and digital home appliances. In particular, a product having a high-performance micro connector or a BtoB (Board to Board) connector that directly connects a board to a board, such as a small display module and a camera module, is rapidly increasing. Accordingly, there is a growing demand for the development of high-performance test sockets for testing these products in the industrial field. Test methods using a micro-connector include a method using a Pogo-Pin and a method of inserting a male connector into a female connector.

On the other hand, when a test object including a micro connector is tested through a test device, the test object is placed and tested in the test device, and the arrangement structure and the test object of the test object disposed in the test device are the same as the actual mobile or car camera. The placement structure when mounted and used on the product is different, and errors may occur in the test results by the test device.

The problem to be solved by the technical idea of the present invention is to provide a test apparatus capable of horizontally controlling a test object using environment, that is, a test object having a substantially identical arrangement structure to a placement structure mounted in a product. Is in

In order to solve the above problems, the technical idea of the present invention, the test socket; An upper structure in which the test socket is disposed such that contact pins of the test socket face downward; A housing guide on which the test object is placed; A connector placement table on which the micro connector of the test object is disposed; And a lower structure in which the housing guide and the connector placing table are disposed. When testing the test object, a horizontal adjustment of the test object is adjusted by the housing guide, and a test device capable of horizontal adjustment is provided. .

In one embodiment of the present invention, a plurality of horizontal adjustment pins are disposed inside the housing guide, the horizontal adjustment pins include an elastic member, and the length thereof varies, and the circuit board under test is the horizontal adjustment pins. It is supported by, and the horizontality of the test object may be adjusted by the length variation of the horizontal adjustment pin.

In one embodiment of the present invention, a first horizontal adjustment elastic member is disposed under the lower structure in which the housing guide is disposed, and the housing guide is horizontally adjusted by the first horizontal adjustment elastic member, and the The level of the test object can be adjusted by horizontal adjustment of the housing guide.

In one embodiment of the present invention, the test object includes a circuit board and a housing on the circuit board, and the test object is horizontally adjusted based on an upper surface of the housing, and the upper surface of the housing and the circuit board When the bottom surface of the circuit board is not parallel, the bottom surface of the circuit board may not be parallel to the bottom surface or top surface of the superstructure.

In one embodiment of the present invention, the test object is a camera module, the camera module, an image sensor, a circuit board on which the image sensor is disposed, a housing disposed on the circuit board covering the image sensor, And a barrel disposed on the housing and having at least one lens. When the upper surface of the housing and the lower surface of the circuit board are not parallel, the camera module is horizontally adjusted based on the upper surface of the housing. Resolution can be tested.

In one embodiment of the present invention, the test socket has a connector having a micro connector structure, and when the micro connector of the test socket has a female or male connector structure, the test object is The micro connector may have a male or female connector structure corresponding to the structure of the micro connector of the test socket.

In one embodiment of the present invention, the micro connector of the test socket is movable.

In one embodiment of the present invention, a second horizontal adjustment elastic member is disposed under the lower structure in which the connector mounting table is disposed, and the connector mounting table is horizontally adjusted by the second horizontal adjustment elastic member, and the The level of the micro connector can be adjusted by leveling the connector placement table.

In addition, the technical idea of the present invention, in order to solve the above problems, a test socket having a first micro connector; An upper structure in which the test socket is disposed such that contact pins of the first micro connector are exposed downward; A housing guide on which the camera module is disposed; A connector placement table on which a second micro connector of the camera module is arranged; And a lower structure in which the housing guide and the connector holder are disposed, wherein the camera module includes a circuit board on which an image sensor is disposed, and a housing on the circuit board covering the image sensor, and the camera. Provided is a test device capable of horizontal adjustment and a test device capable of horizontal adjustment, in which a level of the camera module is adjusted based on an upper surface of the housing through horizontal adjustment by the housing guide when testing the module.

In a test apparatus capable of horizontal adjustment according to the technical idea of the present invention, a horizontal adjustment pin or a horizontal adjustment elastic member may be disposed in a housing guide in which a main body of a test object is disposed. Accordingly, during the test of the test object, the test can be precisely performed by performing the test while maintaining the level of the test object in a state substantially equal to the user environment state through the housing guide. For example, the test apparatus according to the technical concept of the present invention uses the housing guide to test the resolution while maintaining the horizontal level of the camera module to be tested in a state substantially equal to the user environment state, so that the resolution test of the camera module is very precisely performed. It can be done.

In addition, the test apparatus capable of horizontal adjustment according to the technical idea of the present invention is stably tested by making the terminal pins of the micro connector to be tested easily contact with the contact pins of the micro connector of the test socket using a connector placement table. Can be done with

1A to 1C are perspective views and exploded perspective views of a test apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the camera module to be tested in the test apparatus of FIG. 1A.
3 is a cross-sectional view illustrating a state in which the camera module is disposed on the housing guide of the test apparatus of FIG. 1A when testing the camera module of FIG. 2.
4A to 4C are cross-sectional views of various structures of a horizontal adjustment pin disposed in a housing guide in the test apparatus of FIG. 1A.
5 is an exploded perspective view of a test apparatus according to an embodiment of the present invention.
6 is a cross-sectional view showing a state in which the camera module is disposed on the housing guide of the test apparatus of FIG. 5 when the camera module of FIG. 2 is tested.
7 is a cross-sectional view illustrating a state in which a camera module is disposed on a housing guide of a test apparatus of another embodiment when testing the camera module of FIG. 2.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided to more fully describe the present invention to those of ordinary skill in the art, and the following examples may be modified in various other forms, and the scope of the present invention is as follows. It is not limited to the Examples. Rather, these embodiments are provided to make the present disclosure more faithful and complete, and to fully convey the spirit of the present invention to those skilled in the art.

In the following description, when a component is described as being connected to another component, it may be directly connected to another component, but a third component may be interposed therebetween. Similarly, when a component is described as being on top of another component, it may be directly above another component, and a third component may be interposed therebetween. In addition, in the drawings, the structure or size of each component is exaggerated for convenience and clarity of description, and parts irrelevant to the description are omitted. The same reference numerals in the drawings refer to the same elements.

Unless otherwise defined, all terms used herein have the same meaning as commonly understood by those skilled in the art to which the inventive concept belongs, including technical terms and scientific terms. In addition, commonly used terms, as defined in the dictionary, should be interpreted as having meanings consistent with what they mean in the context of related technologies, and in excessively formal meanings unless explicitly defined herein. It should not be interpreted. On the other hand, the terms used are only used for the purpose of explaining the present invention and are not used to limit the scope of the present invention as defined in the claims or the claims.

1A to 1C are perspective views and exploded perspective views of a test apparatus according to an embodiment of the present invention.

1A to 1C, the test apparatus 100 according to the present exemplary embodiment includes a test socket 110, an upper structure 120, a housing guide 130, a connector holder 140, and a lower structure 150 It may include.

The test socket 110 may include a micro connector 112 having a plurality of contact pins therein. The test socket 110 is a structure in which the contact pins of the micro connector 112 are exposed and may be disposed by being coupled to the superstructure 120. In other words, the test socket 110 may be disposed to be coupled to the superstructure 120 such that the contact pins of the micro connector 112 are exposed toward the substructure 150.

The micro connector 112 of the test socket 110 may have a female or male connector structure. Specifically, when the micro connector 220 of the test object 200 has a male connector structure, the micro connector 112 of the test socket 110 may have a female connector structure. Conversely, when the micro connector 220 of the test object 200 has a female connector structure, the micro connector 112 of the test socket 110 may have a male connector structure. According to an embodiment, the micro connector 112 of the test socket 110 can move within a predetermined range on a horizontal plane. Due to the mobility of the micro connector 112 of the test socket 110, the micro connector 112 of the test socket 110 can be easily combined with the micro connector 220 of the test object 200.

Meanwhile, the connector included in the test socket 110 is not limited to the micro connector 112. For example, the test socket 110 may include a pogo pin structure, a rubber connector structure, or a blade connector structure (etching pin type) connector.

As shown in FIG. 1A, the test socket 110 is coupled to an FPCB 170 (Flexible PCB) disposed on the lower surface of the upper structure 120 and the main structure 150 is coupled through the FPCB 170. It may be electrically connected to the board 160. Here, the FPCB 170 may be referred to as a board to contact (BTC) board. For convenience, the main board 160 and the FPCB 170 are omitted in FIGS. 1A and 1C. Meanwhile, the test socket 110 is not connected to the main board 160 only through the FPCB 170. For example, according to an embodiment, the test socket 110 may be electrically connected to the main board 160 through wiring of the superstructure 120 and pogo pin-type connections between the superstructure 120 and the substructure 150. have.

The upper structure 120 is a structure to which the test socket 110 is coupled, and may be hinged to the lower structure 150 through a spring (not shown) and the coupling portion 155. The upper structure 120 and the lower structure 150 may be formed with a clasp 152 and a clasp 122 on opposite sides of a hinged portion. For example, the clasp 152 is formed on the lower structure 150, and the clasp 122 is formed on the superstructure, so that the clasp 152 and the clasp 122 are clasped, such that the superstructure 120 as shown in FIG. 1B. And the lower structure 150 may be kept closed. In addition, by pressing the clasp 152 downward to release the clasp, it is possible to maintain the upper structure 120 and the lower structure 150 as shown in Figure 1a.

On the other hand, when testing the test object 200, the upper structure 120 and the lower structure 150 maintain a closed state through the clasp coupling, the upper structure 120 presses a predetermined portion of the test object 200 can do. By pressing the superstructure 120 and the action of the housing guide 130, the horizontal level of the main body 210 of the test object 200 may be adjusted to a state substantially equal to a user environment state. The horizontal level adjustment of the test object 200 will be described in more detail in the description of FIGS. 2 to 7.

The housing guide 130 may be a portion where the main body 210 of the test object 200 is disposed. For example, during the test, the main body 210 of the test object 200 may be disposed and supported in a groove G0 formed on the upper surface of the housing guide 130. On the other hand, the housing guide 130 may adjust the level of the main body 210 of the test object 200 through the horizontal adjustment pin 135 disposed therein during the test.

Specifically, the housing guide 130, as shown in Figure 1c, it is possible to adjust the level of the main body 210 of the test object 200 through the horizontal adjustment pin 135. The horizontal adjustment pin 135 includes an elastic member, the length of which varies in the longitudinal direction, and the horizontality of the main body 210 of the test object 200 may be adjusted by the action of the horizontal adjustment pin 135. The horizontal adjustment pin 135 is disposed in a structure penetrating the housing guide 130, and accordingly, a through hole 135h in which the horizontal adjustment pin 135 can be accommodated may be formed in the housing guide 130. . Various structures of the horizontal adjustment pin 135 will be described in more detail in the description of FIGS. 4A to 4C. In addition, the horizontal adjustment of the test object 200 as described above will be described in more detail in the description of FIGS. 2 to 7.

The connector placement table 140 may be a part in which the micro connector 220 of the test object 200 is disposed. For example, during the test, the micro connector 220 of the test object 200 may be disposed and supported on the connector holder 140. The micro connector 220 may be disposed on the connector holder 140 while being connected to the main body 210 through the connection unit 230. On the other hand, the connector placement table 140 may be moved up and down for each part through the elastic member 145 disposed on the lower side.

Specifically, as shown in FIG. 1C, an elastic member 145 such as a spring may be disposed under the connector placing table 140. By the elastic member 145, the connector holder 140 may move up and down for each part, and accordingly, the micro connector 220 of the test object 200 may also move up and down for each part. As described above, as the connector holder 140 and the micro connector 220 of the test object 200 move up and down partly through the elastic member 145, the test socket on the superstructure 120 during the test ( The contact pins of the micro connector 112 of 110 can be stably coupled to the terminal pins of the micro connector 220 of the test object 200 to make contact.

In the test apparatus 100 of this embodiment, six springs are illustrated as the elastic member 145 disposed under the connector placing table 140, but the number and placement of the springs are not limited thereto. For example, the springs may be arranged in 7 or more or 5 or less. In addition, the spring may be disposed at positions that can optimize the vertical movement of the connector holder 140 and the micro connector 220 accordingly. Furthermore, in the test apparatus 100 of the present embodiment, the elastic member 145 disposed under the connector holder 140 is not limited to the spring. For example, the elastic member 145 may be formed of rubber having elasticity. In the case of a rubber, it may be divided into several pieces, such as a spring, or the entire body may be arranged in a single body form.

The lower structure 150 is a structure in which the housing guide 130 and the connector placement table 140 are disposed, and the lower structure 150 includes grooves G1 for accommodating the housing guide 130 and the connector placement table 140. G2) may be formed. In addition, as described above, the lower structure 150 may be hinged to the upper structure 120 through the spring and the engaging portion 155. Meanwhile, as shown in FIG. 1B, the main board 160 may be coupled to the lower surface of the lower structure 150.

Briefly describing the coupling structure of the upper structure 120 and the lower structure 150, the upper structure 120 and the lower structure 150 maintain either one of the open state or the closed state through the hinge engagement and the clasp engagement. Can. That is, when the clasp is made through the clasp 152 and the clasp 122, as shown in Figure 1b, the test device 100 is hinged to the opposite side of the upper structure 120 and the lower structure 150 ) It is possible to keep the closed parts in close contact with each other. If, when the test object 200 is disposed on the lower structure 150 through the housing guide 130 and the connector holder 140, when the closed state, the main body 210 of the test object 200 It is pressurized by the superstructure 120 and can be horizontally adjusted to a state substantially the same as the user environment state by the action of the housing guide 130. In addition, the terminal pins of the micro-connector 220 of the test object 200 are easily and stably contacting the contact pins of the micro-connector 112 of the test socket 110 by the action of the connector holder 140 to electrically Can be connected.

Meanwhile, as illustrated in FIGS. 1A to 1C, an open hole OH is formed in the upper structure 120, and an upper portion of the main body 210 of the test object 200 is through the open hole OH. It can be exposed outside. For example, the test object 200 may be a camera module, and the test device 100 may perform a resolution test of the camera module. Accordingly, the upper surface portion of the barrel of the camera module is exposed through the open hole OH, and at the time of testing, the resolution of the camera module can be tested by capturing a set subject. On the other hand, during the resolution test of the camera module by the test apparatus 100 of the present embodiment, the body part of the camera module corresponding to the body 210 of the test object 200 is connected to the user environment state by the housing guide 130. The level can be maintained in substantially the same state. Accordingly, the test apparatus 100 of the present embodiment can perform the resolution test of the camera module very precisely.

When the latch coupling is released, as shown in FIG. 1A, the upper structure 120 and the lower structure 150 portions on opposite sides of the hinge engagement may be kept open from each other by a spring. When in the open state, the state of pressing the main body 210 of the test object 200 by the superstructure 120 is released, and also, the terminal pins of the micro connector 220 are connected to the micro connector of the test socket 110 ( It may be electrically disconnected from the contact pins of 112).

In the test apparatus 100 of the present embodiment, the horizontal adjustment pin 135 may be disposed inside the housing guide 130 in which the main body 210 of the test object 200 is disposed. Accordingly, when testing the test object 200 by the test apparatus 100 of the present embodiment, while maintaining the level of the test object 200 in a state substantially the same as the user environment state through the housing guide 130 By performing the test, the test can be carried out precisely. For example, the test apparatus 100 of the present embodiment uses the housing guide 130 to test the resolution while maintaining the level of the camera module, which is the test target 200, in a state substantially the same as the user environment state, thereby testing the camera module. Resolution tests can be performed with great precision.

In addition, the test apparatus 100 of the present embodiment, using the connector holder 140, the terminal pins of the micro connector 220 of the test object 200, the contact pins of the micro connector 112 of the test socket 110 By easily contacting and making electrical connection, the test can be stably performed.

FIG. 2 is a cross-sectional view of the camera module to be tested in the test apparatus of FIG. 1A.

Referring to FIG. 2, in the test apparatus 100 of FIG. 1A, the test object 200 may be a camera module. In FIG. 2, a body portion of the camera module corresponding to the body 210 of the test object 200 is shown. Hereinafter, for convenience of description, for the camera module, reference numeral '200' is used in the same manner as the test object 200, and for the main body of the camera module, the same as the main body 210 of the test object 200 Reference number '210' is used. On the other hand, Figure 2 is a cross-sectional view of the main body 210 of the camera module 200, the micro-connector or the connecting portion of the camera module 200 is not shown.

The main body 210 of the camera module 200 may include an image sensor 211, a circuit board 213, a housing 215, a barrel 217, and a lens 219.

The image sensor 211 is a semiconductor device that generates an image by converting light received through the lens 219 into an electrical digital signal, and may be, for example, a CCD (Charge Coupled Device) image sensor or a CMOS image sensor (CIS). The circuit board 213 is a board on which the image sensor 211 is mounted, and may include wirings therein. The circuit board 213 may be implemented with, for example, a PCB or an FPCB. The circuit board 213 may be electrically connected to a micro connector (see 220 in FIG. 1A) through a connection (see 230 in FIG. 1A ).

The housing 215 is a portion that receives and supports the image sensor 211 and the barrel 217 and may occupy most of the main body 210. For example, the housing 215 is disposed on the circuit board 213 in a structure that covers the image sensor 211, and the barrel 217 is disposed in a structure inserted in the housing 215, and the upper part of the housing 215 is It may be arranged in a structure protruding from the upper surface of. The barrel 217 has a circular cylinder structure, and at least one lens 219 may be disposed therein. Although one lens 219 is illustrated inside the barrel 217 in FIG. 2, two or more lenses 219 may be actually disposed within the barrel 217. The housing 215 may be adhesively fixed to the circuit board 213 through an adhesive member 212 such as epoxy, glue, UV bond, and the like.

Recently, in order to improve resolution according to the tendency of light and small size reduction of the camera module 200, careful adjustment or active alignment equipment is used in the assembly of the image sensor 211 and the lens 219. Here, the careful adjustment may mean a process of finely adjusting the focus of the lens 219 so that the image sensor 211 is accurately aligned. Meanwhile, due to the assembly of the image sensor 211 and the lens 219 by the careful adjustment equipment, the upper surface FS of the housing 215 may not be parallel to the lower surface BS of the circuit board 213. For example, a first angle θ may be maintained between the upper surface FS of the housing 215 and the lower surface BS of the circuit board 213. In addition, when the upper surface FS of the housing 215 is a horizontal reference surface RS, it is said that the lower surface BS of the circuit board 213 has a state inclined by a first angle θ relative to the horizontal. Can.

In the case of the existing camera module that does not use the careful adjustment equipment, the upper surface FS of the housing 215 and the lower surface BS of the circuit board 213 can be maintained in parallel. However, in the case of a camera module assembled using the latest automated careful adjustment equipment, as described above, the upper surface FS of the housing 215 and the lower surface BS of the circuit board 213 may not be kept parallel. have. Accordingly, the lens 219 or the image sensor 211 may be perpendicular to the optical axis Lx of the incident light, but the upper surface FS of the housing 215 may not be perpendicular to the optical axis Lx.

When testing the resolution of the camera module 200 using the test apparatus 100 of the present embodiment, as described above, the camera module 200 may be disposed in the test apparatus 100 to perform the test. In addition, in the test apparatus 100 of the present embodiment, the camera module 200 may be tested for resolution in the same state as the actual use environment of the camera module 200 by the operation of the housing guide 130.

More specifically, in general, when the camera module 200 is mounted with a mobile camera or a vehicle camera, the upper surface FS of the housing 215 may be mounted as a reference surface RS. In other words, the camera module 200 is mounted such that the upper surface FS of the housing 215 is parallel to the outer surface of the mobile or car, and when the camera module 200 is mounted as such, the optical axis of external light is a lens. 219 or the image sensor 211.

On the other hand, in the case of the existing camera module, since the upper surface of the housing and the lower surface of the circuit board are parallel, in the resolution test by the test apparatus, the camera module is placed with the upper surface of the housing as the reference surface or the lower surface of the circuit board as the reference surface. There is no significant difference in the arrangement of the camera modules. In addition, in the case of an existing test apparatus, a camera module is disposed and a resolution test is performed using the lower surface of the circuit board as a reference surface, and the lower surface of the upper structure in close contact with the upper surface of the housing may have a structure that moves up and down.

However, in the case of the camera module 200 assembled through recent careful adjustment equipment, as described above, the upper surface FS of the housing 215 and the lower surface BS of the circuit board 213 may not be parallel. Therefore, when the camera module 200 is disposed and the resolution test is performed using the lower surface BS of the circuit board 213 as a reference surface, as in the existing test apparatus, the actual use environment of the camera module 200, that is, the housing An error may occur in the test result because the upper surface FS of 215 is changed from the mounted state as the reference surface RS. Here, the reference surface RS is a portion in close contact with the inner surface of the test device 100, and may be a surface parallel to the inner surface or the outer surface of the test device 100 during testing.

In the case of the test apparatus 100 of the present embodiment, the camera module 200 may be disposed using the upper surface FS of the housing 215 as a reference surface RS based on the housing guide 130 during the resolution test. have. Accordingly, the test apparatus 100 of the present embodiment may perform a resolution test for the camera module 200 in a substantially same state as the actual use environment of the camera module 200, and thus perform a precise resolution test. The error can be greatly reduced.

3 is a cross-sectional view illustrating a state in which the camera module is disposed on the housing guide of the test apparatus of FIG. 1A when testing the camera module of FIG. 2.

Referring to FIG. 3, in the test apparatus 100 of the present embodiment, in the resolution test for the camera module 200, the camera module 200, in particular, the body 210 of the camera module 200 is provided with a housing guide ( It may be disposed in the groove (G0) portion of 130). Meanwhile, a through hole 135h may be formed in a lower surface of the groove G0 of the housing guide 130, and a horizontal adjustment pin 135 may be disposed in the through hole 135h.

As illustrated in FIG. 3, the horizontal adjustment pin 135 may contact the lower surface of the circuit board 213 of the camera module 200 to support the camera module 200. The horizontal adjustment pin 135 includes an elastic member, the length of which varies in the longitudinal direction, and accordingly, the lengths of the horizontal adjustment pins 135 may be different from each other.

Meanwhile, the camera module 200 may be disposed on the housing guide 130 using the upper surface FS of the housing 215 as a reference surface RL during the resolution test. In other words, when the test device 100 is in the closed state (see FIG. 1B ), the upper surface FS of the housing 215 can be maintained parallel to the inner surface or the outer surface of the superstructure 120 of the test device 100. have. In addition, when the camera module 200 is carefully adjusted by the careful adjustment equipment, the upper surface FS of the housing 215 and the lower surface of the circuit board 213 are not parallel, as shown in FIG. 3. , The lower surface BS of the circuit board 213 is not parallel to the upper surface FS of the housing 215, and the lengths of the horizontal adjustment pins 135 supporting the lower surface BS of the circuit board 213 are different from each other. It can have a length. Accordingly, the upper surface FS of the housing 215 forms a horizontal reference surface RS, and the lower surface BS of the circuit board 213 can maintain a first angle θ with respect to the horizontal reference surface RS. have.

As described above, in the test apparatus 100 of the present embodiment, the camera module 200 is disposed on the housing guide 130 using the upper surface FS of the housing 215 as a reference surface RS, thereby making the camera module 200 It may be disposed in a substantially the same state as the actual use environment. Therefore, the test apparatus 100 of the present embodiment can perform the resolution test for the camera module 200 very precisely.

4A to 4C are cross-sectional views of various structures of a horizontal adjustment pin disposed in a housing guide in the test apparatus of FIG. 1A.

Referring to Figure 4a, in the test apparatus 100 of this embodiment, the horizontal adjustment pin (135-1) disposed in the housing guide 130, the body (135b), the spring (135s), and the upper contact (135t) It can contain. The body 135b has a hollow circular cylinder structure, and springs 135s may be disposed inside the body 135b. The upper contact portion 135t is disposed above the spring 135s and can move up and down by the elasticity of the spring 135s. The horizontal adjustment pin 135-1 of this structure may have a variable length in the longitudinal direction as the upper contact portion 135t moves up and down by the elastic action of the spring 135s.

Referring to Figure 4b, in the test apparatus 100 of the present embodiment, in the aspect that the horizontal adjustment pin (135-2) disposed in the housing guide 130 further comprises a lower contact portion (135d), for horizontal adjustment of Figure 4a It may be different from the pin 135-1. The upper contact portion 135t and the lower contact portion 135d are disposed above and below the spring 135s, and can move up and down respectively by the elasticity of the spring 135s. The horizontal adjustment pin 135-2 of this structure may also have a variable length in the longitudinal direction as the upper contact portion 135t and the lower contact portion 135d move up and down by the elastic action of the spring 135s.

Referring to Figure 4c, in the test apparatus 100 of the present embodiment, the horizontal adjustment pin (135-3) disposed in the housing guide 130 may include a body (135b), and the upper contact (135tr). The horizontal adjustment pins 135-3 may not include springs, unlike the horizontal adjustment pins 135-1 and 135-2 of FIGS. 4A and 4B. The horizontal adjustment pin 135-3 may instead be formed of a rubber having an upper contact portion 135tr having elasticity. Accordingly, the upper contact portion 135tr may be contracted and expanded by the elastic action of the rubber, and the horizontal adjustment pin 135-3 may have a variable length in the longitudinal direction. Meanwhile, the body 135b has a cylindrical structure, but may have an empty structure inside or a filled structure.

Depending on the embodiment, both the body 135b and the upper contact portion 135tr of the horizontal adjustment pin 135-3 may be formed of rubber. In addition, similar to the structure of the horizontal adjustment pin (135-2) of Figure 4b may further include a lower contact. The lower contact portion may also be formed of rubber.

So far, three types of horizontal adjustment pins 135-1, 135-2, and 135-3 have been described, but the structure of the horizontal adjustment pin is not limited thereto. For example, the structure of all horizontal adjustment pins having elasticity and whose length can be varied in the longitudinal direction can be applied to the test apparatus 100 of this embodiment.

5 is an exploded perspective view of a test apparatus according to an embodiment of the present invention, and may correspond to FIG. 1C. Descriptions already described in the description of FIGS. 1A to 2 are simply described or omitted.

Referring to FIG. 5, the test apparatus 100a of the present embodiment may be different from the test apparatus 100 of FIG. 1C in that it includes an elastic member 137 for horizontal adjustment instead of the horizontal adjustment pin 135. In more detail, the test apparatus 100a of this embodiment may include a spring-shaped elastic member 137 for horizontal adjustment that is disposed under the housing guide 130a. In addition, an elastic member receiving groove (see 137g in FIG. 6) is formed at a lower portion of the housing guide 130a, and at least a portion of the elastic member 137 for horizontal adjustment may be inserted into the elastic member receiving groove 137g. . On the other hand, the horizontal adjustment elastic member 137 in the test apparatus 100a of the present embodiment may have the same function as the horizontal adjustment pin 135 in the test apparatus 100 of FIG. 1A. Therefore, the test apparatus 100a of the present embodiment does not include a pin for horizontal adjustment, and a through hole may not be formed in the housing guide 130a.

In the test apparatus 100a of this embodiment, the housing guide 130a itself can be moved up and down partly by the elastic member 137 for horizontal adjustment, and accordingly, disposed in the groove G0 of the housing guide 130a The level of the test object 200, for example, a camera module, can be adjusted. The operation and structure of the housing guide 130a may be similar to the operation and structure of the connector holder 140 previously. Meanwhile, in FIG. 5, six horizontally adjustable elastic members 137 are disposed, but the number and placement of the horizontally adjustable elastic members 137 is not limited thereto. For example, the horizontal adjustment elastic member 137 may be arranged in 7 or more or 5 or less. In addition, the horizontal adjustment elastic member 137 may be disposed at positions that can optimize the vertical movement of the housing guide 130a and the body 210 of the test object 200 accordingly. Meanwhile, the elastic member 137 for horizontal adjustment is not limited to a spring, and may be formed of another member having elasticity. For example, the elastic member 137 for horizontal adjustment may be formed of rubber.

6 is a cross-sectional view showing a state in which the camera module is disposed on the housing guide of the test apparatus of FIG. 5 when the camera module of FIG. 2 is tested.

Referring to FIG. 6, in the resolution test of the camera module 200 by the test apparatus 100a of the present embodiment, the camera module 200, particularly the body 210 of the camera module 200, includes a housing guide 130a ) In the groove G0. Meanwhile, an elastic member receiving groove 137g may be formed under the housing guide 130a, and an elastic member 137 for horizontal adjustment may be disposed in the elastic member receiving groove 137g. The housing guide 130a may be moved up and down part by part by the elastic action of the elastic member 137 for horizontal adjustment. For example, the plurality of horizontal adjustment elastic members 137 may have different lengths depending on the amount of pressure applied through the housing guide 130a. Accordingly, as illustrated in FIG. 6, the horizontally-adjustable elastic member 137 has a first length L1, whereas the horizontally-adjustable elastic member 137 is longer than the first length L1. It may have 2 lengths (L2). As such, as the lengths of the elastic members 137 for horizontal adjustment vary according to positions, levels of the lower surface or the upper surface of each portion of the corresponding housing guide 130a may be different from each other.

Meanwhile, the camera module 200 may be disposed on the housing guide 130a using the upper surface FS of the housing 215 as a reference surface RL during the resolution test. In other words, when the test device 100a is in a closed state (see FIG. 1B ), the upper surface FS of the housing 215 may remain parallel to the inner surface or the outer surface of the superstructure 120 of the test device 100a. have. In addition, when the camera module 200 is carefully adjusted by the careful adjustment equipment, the upper surface FS of the housing 215 and the lower surface BS of the circuit board 213 are not parallel, illustrated in FIG. 6. As can be seen, the lower or upper surface of the housing guide 130a may be changed to be parallel to the lower surface BS of the circuit board 213 by the length variation of the horizontal adjustment elastic members 137. Accordingly, when the upper surface FS of the housing 215 is a horizontal reference surface RS, the lower surface BS of the circuit board 213 maintains a first angle θ relative to the horizontal, and the housing The top or bottom surface of the guide 130a can also maintain the first angle θ relative to the horizontal.

As described above, in the test apparatus 100a of the present embodiment, the camera module 200 is disposed on the housing guide 130a with the upper surface FS of the housing 215 as the reference surface RS, so that the camera module 200 It may be disposed in a substantially the same state as the actual use environment. Therefore, the test apparatus 100a of the present embodiment can perform the resolution test for the camera module 200 very precisely, and significantly reduce the error occurrence rate.

7 is a cross-sectional view illustrating a state in which a camera module is disposed on a housing guide of a test apparatus of another embodiment when testing the camera module of FIG. 2.

Referring to FIG. 7, the test apparatus 100b of the present embodiment may be different from the test apparatus 100a of the present embodiment of FIG. 5 in the material and structure of the elastic members 139 for horizontal adjustment. Specifically, in the test apparatus 100b of the present embodiment, the horizontal adjustment elastic members 139 may be formed of rubber, and the whole may be formed in one body shape. In addition, corresponding to the structure of the elastic member 139 for horizontal adjustment, an elastic member receiving groove 139g having one wide groove shape may be formed on the lower surface of the housing guide 130b.

The housing guide 130b may be moved up and down part by part by the elastic action of the elastic member 139 for horizontal adjustment. For example, the horizontal adjustment elastic member 139 may have different thicknesses of corresponding parts according to the amount of pressure applied through the respective parts of the housing guide 130b. Accordingly, as shown in FIG. 7, the left portion of the elastic member 139 for horizontal adjustment has a first thickness D1, while the right portion of the elastic member 139 for horizontal adjustment is greater than the first thickness D1. It may have a large second thickness D2. As described above, as the thickness of the elastic member 139 for horizontal adjustment varies by location, levels of the lower surface or the upper surface of each part of the corresponding housing guide 130b may be different from each other.

Even in the test apparatus 100b of this embodiment, the camera module 200 may be disposed on the housing guide 130 using the upper surface FS of the housing 215 as a reference surface RL during the resolution test. Accordingly, when the camera module 200 is carefully adjusted by the careful adjustment equipment, when the upper surface FS of the housing 215 and the lower surface of the circuit board 213 are not parallel, as shown in FIG. 7 , It may be changed so that the lower surface or the upper surface of the housing guide 130b is parallel to the lower surface BS of the circuit board 213 by the thickness variation of each portion of the elastic member 139 for horizontal adjustment. Accordingly, when the upper surface FS of the housing 215 is a horizontal reference surface RS, the lower surface BS of the circuit board 213 maintains a first angle θ relative to the horizontal, and the housing The upper or lower surface of the guide 130b can also maintain the first angle θ relative to the horizontal.

As described above, even in the test apparatus 100b of the present embodiment, the camera module 200 is disposed on the housing guide 130b with the upper surface FS of the housing 215 as the reference surface RS, so that the camera module 200 It may be disposed in a substantially the same state as the actual use environment. Therefore, the test apparatus 100a of the present embodiment can perform the resolution test for the camera module 200 very precisely, and significantly reduce the error occurrence rate.

Previously, in the test apparatuses 100, 100a, and 100b of the present embodiment, as a test object, the camera module in which the careful adjustment was performed by the careful adjustment equipment was mainly described. However, the test object of the test devices 100, 100a, and 100b in this embodiment is not limited to the camera module in which the careful adjustment is performed by the careful adjustment equipment. For example, of course, the test devices 100, 100a, and 100b of the present embodiment can be applied to an existing camera module in which the careful adjustment is not performed by the careful adjustment equipment. Furthermore, the test devices 100, 100a, and 100b of the present embodiment are not limited to the camera module, and can be applied to semiconductor devices requiring general electrical testing.

So far, the present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art can understand that various modifications and other equivalent embodiments are possible therefrom. will be. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

100, 100a, 100b: test device, 110: test socket, 112: micro connector, 120: superstructure, 122: brace, 130, 130a, 130b: housing guide, 135, 135-1, 135-2, 135- 3: Leveling pin, 135b: Body, 135s: Spring, 135t, 135tr: Upper contact, 135d: Lower contact, 137, 139: Leveling elastic member, 140: Connector holder, 150: Undercarriage, 152: Clasp, 155: connection, 160: main board, 170: FPCB, 200: test object, camera module, 210: main body, 211: image sensor, 212: adhesive member, 213: circuit board, 215: housing, 217: barrel, 219 : Tube, 220: micro connector, 230: connection, 213

Claims (16)

Test socket;
An upper structure in which the test socket is disposed such that contact pins of the test socket face downward;
A housing guide on which the test object is placed;
A connector placement table on which the micro connector of the test object is disposed; And
It includes; the housing guide and the lower structure on which the connector placement table is disposed;
When testing for the test object, the level of the test object is adjusted by the housing guide,
The test object includes a circuit board and a housing on the circuit board,
The test object is horizontally adjusted based on the upper surface of the housing,
When the upper surface of the housing and the lower surface of the circuit board are not parallel, the horizontally adjustable test apparatus characterized in that the lower surface or the upper surface of the superstructure is not parallel to the lower surface of the circuit board. According to claim 1,
A plurality of horizontal adjustment pins are disposed inside the housing guide,
The horizontal adjustment pin has a length that includes an elastic member,
A test apparatus capable of horizontal adjustment, wherein the circuit board of the test object is supported by the horizontal adjustment pin, and the level of the test object is adjusted by a change in the length of the horizontal adjustment pin. According to claim 2,
The elastic member is a test device capable of horizontal adjustment, characterized in that it comprises a spring, or a rubber. According to claim 2,
The horizontal adjustment pin has a pogo-pin structure, and a horizontally adjustable test device comprising a spring therein. According to claim 1,
A first horizontal adjustment elastic member is disposed under the lower structure in which the housing guide is disposed,
The housing guide is horizontally adjusted by the first horizontal adjustment elastic member,
A test apparatus capable of horizontal adjustment, wherein the level of the test object is adjusted by horizontal adjustment of the housing guide. The method of claim 5,
The first horizontal adjustment elastic member comprises a plurality of springs, or at least one rubber test device capable of horizontal adjustment. delete According to claim 1,
The test object is a camera module,
The camera module includes an image sensor, the circuit board on which the image sensor is disposed, the housing covering the image sensor and disposed on the circuit board, and a barrel disposed on the housing and having at least one lens. Includes,
When the upper surface of the housing and the lower surface of the circuit board are not parallel, the camera module is horizontally adjusted based on the upper surface of the housing to test the resolution. According to claim 1,
The test socket has a pogo-pin structure, a rubber connector structure, a blade connector structure, and a connector having any one of micro connector structures. According to claim 1,
The test socket is provided with a connector of a micro connector structure,
When the micro connector of the test socket has a female or male connector structure, the micro connector of the test object has a male or female connector structure corresponding to the structure of the micro connector of the test socket A test device capable of horizontal adjustment, characterized in that. The method of claim 10,
The micro-connector of the test socket is a horizontally adjustable test device, characterized in that movable. According to claim 1,
A second horizontal adjustment elastic member is disposed under the lower structure in which the connector placing table is disposed,
The connector placement table is horizontally adjusted by the second horizontal adjustment elastic member,
A test apparatus capable of horizontal adjustment, wherein the level of the micro connector is adjusted by horizontal adjustment of the connector placement table. A test socket having a first micro connector;
An upper structure in which the test socket is disposed such that contact pins of the first micro connector are exposed downward;
A housing guide on which the camera module is disposed;
A connector placement table on which a second micro connector of the camera module is arranged; And
It includes; the housing guide and the lower structure on which the connector placement table is disposed;
The camera module includes a circuit board on which the image sensor is disposed and a housing covering the image sensor and disposed on the circuit board,
In the test for the camera module, the horizontal adjustment of the camera module is adjusted to the level of the upper surface of the housing through the horizontal adjustment by the housing guide, a horizontally adjustable test apparatus. The method of claim 13,
A plurality of horizontal adjustment pins are disposed inside the housing guide,
The horizontal adjustment pin has a length that includes an elastic member,
The circuit board is supported by the leveling pin, a test device capable of leveling, characterized in that the level of the camera module is adjusted by a change in the length of the leveling pin. The method of claim 13,
An elastic member for horizontal adjustment is disposed under the lower structure in which the housing guide is disposed,
The housing guide is horizontally adjusted by the elastic member for horizontal adjustment,
A test apparatus capable of horizontal adjustment, wherein the level of the camera module is adjusted by horizontal adjustment of the housing guide. The method of claim 13,
When the first micro-connector has a male or female connector structure, the second micro-connector has a male or female connector structure corresponding to the structure of the first micro-connector.

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