KR102118821B1 - Adhesive resin composition - Google Patents

Abstract

Provided is an adhesive resin composition. The adhesive resin composition comprises polypropylene, modified polypropylene, rubber, petroleum resin, and an adhesive polymer compound. The adhesive polymer compound may include chemical formula 1. In the chemical formula 1, Ar represents a benzene ring, and A and B each represents a hydrocarbon group having 2-9 carbon atoms.

Description

Adhesive resin composition {ADHESIVE RESIN COMPOSITION}

The present invention relates to an adhesive resin composition.

Various polymer materials used as adhesives are known. However, the conventional adhesive polymer material does not meet the precise and uniform adhesion required in various technical fields and manufacturing processes of various products in recent years.

In order to solve the above problems, the present invention provides an adhesive resin composition having excellent physical properties.

Other objects of the present invention will become apparent from the following detailed description and accompanying drawings.

The adhesive resin composition according to the embodiments of the present invention includes polypropylene, modified polypropylene, rubber, petroleum resin, and adhesive polymer compounds.

The adhesive resin composition is 30 to 80 parts by weight of the polypropylene, 3 to 15 parts by weight of the modified polypropylene, 10 to 30 parts by weight of the rubber, 3 to 20 parts by weight of the petroleum resin, and the adhesive polymer compound 3 ~ 12 parts by weight may be included.

The adhesive resin composition may further include a flame retardant. The adhesive resin composition may include 1 to 15 parts by weight of the flame retardant.

The polypropylene may have a melt index of 1 to 10g/10 minutes (230℃, 2.16kg), and the modified polypropylene may have a melt index of 10 to 100g/10 minutes (230℃, 2.16kg) , The rubber may have a melt index of 0.05 ~ 10g/10 minutes (190 ℃, 2.16kg), the adhesive polymer compound may have a melt index of 1 ~ 15g / 10 minutes (190 ℃, 2.16kg) have. In addition, the adhesive resin composition may have a melt index of 5 ~ 15g / 10 minutes (230 ℃, 2.16kg).

The modified polypropylene may be formed by grafting maleic acid onto polypropylene.

The rubber may include EPR (Ethylene Propylene Rubber), EBR (Ethylene Butene Rubber), EOR (Ethylene Octene Rubber), or a combination thereof.

The petroleum resin may include a C5-based petroleum resin, a C9-based petroleum resin, or a combination thereof.

The adhesive polymer compound may include Formula 1 below.

[Formula 1]

In Chemical Formula 1, Ar represents a benzene ring, and A and B each represent a hydrocarbon group having 2 to 9 carbon atoms.

및

중에서 적어도 어느 하나를 나타낼 수 있고, -A-는 -(CH₂)_a-(a는 2 이상 9 이하의 정수)를 나타낼 수 있으며, -B-는 -(CH₂)_b-(b는 2 이상 9 이하의 정수)를 나타낼 수 있다.In Chemical Formula 1, -Ar- is

And

At least one of them, -A- can represent -(CH ₂ ) _a -(a is an integer of 2 or more and 9 or less), -B- is -(CH ₂ ) _b -(b is 2 And an integer of 9 or more).

대

의 비율은 1:1 ~ 10:1일 수 있다. -A-는 -(CH₂)₂-, -(CH₂)₃- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타내고, -B-는 -(CH₂)₂- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타낼 수 있다.In Chemical Formula 1,

versus

The ratio of may be 1:1 to 10:1. -A- represents at least one of -(CH ₂ ) ₂ -, -(CH ₂ ) ₃ -and -(CH ₂ ) ₄ -, and -B- represents -(CH ₂ ) ₂ -and -(CH ₂ ) ₄ -at least one may be represented.

In Formula 1, the molecular weight of the portion of Formula 3 may be 1,000 to 10,000.

[Formula 3]

The molecular weight of the adhesive polymer compound may be 100,000 ~ 200,000.

The adhesive polymer compound may have hot melt adhesiveness.

The adhesive resin composition according to the embodiments of the present invention may have excellent physical properties. For example, the adhesive resin composition is excellent in adhesiveness, processability, and electrolyte resistance. In addition, the adhesive resin composition may have excellent hot-melt adhesiveness, and is excellent in thermal adhesiveness when extrusion-coated on a metal such as aluminum.

Hereinafter, the present invention will be described in detail through examples. The objects, features, and advantages of the present invention will be readily understood through the following examples. The present invention is not limited to the embodiments described herein, but may be embodied in other forms. The embodiments introduced herein are provided to ensure that the disclosed contents are thorough and complete and that the spirit of the present invention is sufficiently transmitted to a person skilled in the art to which the present invention pertains. Therefore, the present invention should not be limited by the following examples.

Although terms such as first and second are used herein to describe various elements, the elements should not be limited by these terms. These terms are only used to distinguish the elements.

The adhesive resin composition according to the embodiments of the present invention includes polypropylene, modified polypropylene, rubber, petroleum resin, and adhesive polymer compounds. Preferably, the adhesive resin composition, the polypropylene 30 to 80 parts by weight, the modified polypropylene 3 to 15 parts by weight, the rubber 10 to 30 parts by weight, the petroleum resin 3 to 20 parts by weight, and the adhesive It may contain 3 to 12 parts by weight of the polymer compound.

The adhesive resin composition may further include a flame retardant. The adhesive resin composition may include 1 to 15 parts by weight of the flame retardant.

When the content of the polypropylene is less than 30 parts by weight, the heat resistance of the adhesive resin composition may be lowered, and when it is greater than 80 parts by weight, adhesiveness of the adhesive resin composition may be lowered.

If the content of the modified polypropylene is less than 3 parts by weight, the adhesive property of the adhesive resin composition may be deteriorated. have.

When the content of the rubber is less than 10 parts by weight, the adhesive property of the adhesive resin composition may be lowered, and when it is greater than 30 parts by weight, heat resistance of the adhesive resin composition may be lowered.

When the content of the petroleum resin is less than 3 parts by weight, the adhesiveness of the adhesive resin composition may be lowered, and when it is greater than 20 parts by weight, the surface of the adhesive film formed by the adhesive resin composition may be sticky.

If the content of the flame retardant is less than 1 part by weight, the flame retardant effect may be lowered, and when it is greater than 15 parts by weight, film formability may be reduced.

If the content of the adhesive polymer compound is less than 3 parts by weight, the adhesive property of the adhesive resin composition may be lowered, and when it is greater than 12 parts by weight, compatibility with the polypropylene may be reduced.

The adhesive resin composition may further include additives such as a heat stabilizer, a slip agent, and a neutralizing agent depending on the use or processing method.

The adhesive resin composition may have a melt index of 5 ~ 15g / 10 minutes (230 ℃, 2.16kg).

Polypropylene

The polypropylene may include homo polypropylene, random polypropylene, ter polypropylene, or a combination thereof. The polypropylene may have a melting temperature of 130 ~ 164 ℃. When the melting temperature of the polypropylene is lower than 130°C, the weatherability of the product coated by the adhesive resin composition may be lowered, and when it is higher than 164°C, the adhesiveness of the adhesive resin composition may be lowered. The polypropylene may have a melt index of 1 ~ 10g / 10 minutes (230 ℃, 2.16kg).

Modified polypropylene

The modified polypropylene may be formed by grafting maleic acid onto polypropylene. The modified polypropylene may have a density of 0.90 g/cm 3 or less. The modified polypropylene may have a melt index of 10 ~ 100g / 10 minutes (230 ℃, 2.16kg).

Rubber

The rubber may include EPR (Ethylene Propylene Rubber), EBR (Ethylene Butene Rubber), EOR (Ethylene Octene Rubber), or a combination thereof. The rubber may have a density of 0.89 g/cm 3 or less. The rubber may have a melt index of 0.05 to 10 g/10 minutes (190° C., 2.16 kg).

Oil balance

The petroleum resin may include a C5-based petroleum resin, a C9-based petroleum resin, or a combination thereof.

Flame retardant

The flame retardant may include a halogen-based flame retardant, an inorganic flame retardant, a phosphorus-based flame retardant, or a combination thereof.

Adhesive polymer compound

The adhesive polymer compound may have a density of 1.0 to 1.5 g/cm 3. Preferably, the adhesive polymer compound may have a density of 1.2 to 1.3 g/cm 3. The adhesive polymer compound may have a melting temperature of 70 ~ 145 ℃.

The adhesive polymer compound according to the embodiments of the present invention includes the following Chemical Formula 1.

[Formula 1]

In Chemical Formula 1, Ar represents a benzene ring, and A and B each represent a hydrocarbon group having 2 to 9 carbon atoms.

및

중에서 적어도 어느 하나를 나타낼 수 있다. 바람직하게, 상기 접착성 고분자 화합물은

및

를 모두 포함할 수 있다. 상기 접착성 고분자 화합물에서,

에 대하여

의 함량이 증가하면 상기 접착성 고분자 화합물의 접착력은 증가하나 녹는점은 감소할 수 있다. 따라서, 상기 접착성 고분자 화합물의 접착력과 녹는점을 고려하여

및

의 함량을 결정할 수 있다.

대

의 비율은 1:1 ~ 10:1일 수 있다. 바람직하게

대

의 비율은 3:1 ~ 7:1일 수 있다. In Chemical Formula 1, -Ar- is

And

At least one of them can be represented. Preferably, the adhesive polymer compound is

And

It can include all. In the adhesive polymer compound,

about

When the content of increases, the adhesive strength of the adhesive polymer compound increases, but the melting point may decrease. Therefore, considering the adhesive strength and melting point of the adhesive polymer compound

And

The content of can be determined.

versus

The ratio of may be 1:1 to 10:1. Preferably

versus

The ratio of may be 3:1 to 7:1.

In Chemical Formula 1, -A- may represent -(CH ₂ ) _a -(a is an integer of 2 or more and 9 or less). For example, -A- may represent at least one of -(CH ₂ ) ₂ -, -(CH ₂ ) ₃ -, and -(CH ₂ ) ₄ -. -B- may represent -(CH ₂ ) _b -(b is an integer of 2 or more and 9 or less). For example, -B- may represent at least one of -(CH ₂ ) ₂ -and -(CH ₂ ) ₄ -.

In Formula 1, the molecular weight of the portion of Formula 3 may be 1,000 to 10,000.

[Formula 3]

The molecular weight of the adhesive polymer compound may be 100,000 ~ 200,000.

The adhesive polymer compound may have excellent adhesiveness. For example, the adhesive polymer compound may have excellent hot melt adhesiveness.

Manufacturing method of adhesive polymer compound

A method of manufacturing an adhesive polymer compound according to embodiments of the present invention comprises the steps of polymerizing (a first polymerization reaction) a phthalate compound having the following formula 4 and a diol compound having the following formula 5 to form a first polymerization compound: And forming a second polymerized compound by polymerizing the first polymerized compound with a dicarboxylic acid compound having Formula 6 below (a second polymerized reaction).

[Formula 4]

[Formula 5]

[Formula 6]

In the above formulas 4 to 6, Ar represents a benzene ring, R ¹ and R ² represent an alkyl group having 1 to 9 carbon atoms, and A and B each represent a hydrocarbon group having 2 to 9 carbon atoms.

The manufacturing method of the adhesive polymer compound may further include a step of performing a polymerization reaction (third polymerization reaction) to increase the molecular weight of the second polymerization compound.

및

중에서 적어도 어느 하나를 나타낼 수 있다. -A-는 -(CH₂)_a-(a는 2 이상 9 이하의 정수)를 나타낼 수 있다. 예를 들어, -A-는 -(CH₂)₂-, -(CH₂)₃- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타내 수 있다. -B-는 -(CH₂)_b-(b는 2 이상 9 이하의 정수)를 나타낼 수 있다. 예를 들어, -B-는 -(CH₂)₂- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타낼 수 있다.In the above Chemical Formulas 4 to 6, -Ar- is

And

At least one of them can be represented. -A- may represent -(CH ₂ ) _a -(a is an integer of 2 or more and 9 or less). For example, -A- may represent at least one of -(CH ₂ ) ₂ -, -(CH ₂ ) ₃ -, and -(CH ₂ ) ₄ -. -B- may represent -(CH ₂ ) _b -(b is an integer of 2 or more and 9 or less). For example, -B- may represent at least one of -(CH ₂ ) ₂ -and -(CH ₂ ) ₄ -.

The phthalate compound may include at least one of a terephthalate compound and an isophthalate compound. Preferably, the phthalate compound may include both a terephthalate compound and an isophthalate compound. When the amount of the isophthalate compound increases with respect to the terephthalate compound, the adhesive strength of the adhesive polymer compound formed increases, but the melting point may decrease. Therefore, the amount of the terephthalate compound and the isophthalate may be determined in consideration of the adhesive strength and melting point of the adhesive polymer compound. The molar ratio of the terephthalate compound and the isophthalate compound may be 1:1 to 10:1. Preferably, the molar ratio of the terephthalate compound and the isophthalate compound may be 3:1 to 7:1.

The phthalate compound may include at least one of dimethyl terephthalate and dimethyl isophthalate. Preferably, the phthalate compound may include both dimethyl terephthalate and dimethyl isophthalate. The diol compound may include at least one of ethanediol, propanediol, and butanediol. The dicarboxylic acid compound may include at least one of succinic acid and adipic acid.

The diol compound is preferably added more than the number of moles of reaction with the phthalate compound so that unreacted products of the phthalate compound do not remain.

The first polymerization compound may have Formula 2 below.

[Formula 2]

및

중에서 적어도 어느 하나를 나타낼 수 있다. -A-는 -(CH₂)_a-(a는 2 이상 9 이하의 정수)를 나타낼 수 있다. 예를 들어, -A-는 -(CH₂)₂-, -(CH₂)₃- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타내 수 있다. In Chemical Formula 2, Ar represents a benzene ring, and A represents a hydrocarbon group having 2 to 9 carbon atoms. -Ar- silver

And

At least one of them can be represented. -A- may represent -(CH ₂ ) _a -(a is an integer of 2 or more and 9 or less). For example, -A- may represent at least one of -(CH ₂ ) ₂ -, -(CH ₂ ) ₃ -, and -(CH ₂ ) ₄ -.

The first polymerization compound may include Formula 3 below, and the second polymerization compound may include Formula 1 below.

[Formula 3]

[Formula 1]

및

중에서 적어도 어느 하나를 나타낼 수 있다. -A-는 -(CH₂)_a-(a는 2 이상 9 이하의 정수)를 나타낼 수 있다. 예를 들어, -A-는 -(CH₂)₂-, -(CH₂)₃- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타내 수 있다. -B-는 -(CH₂)_b-(b는 2 이상 9 이하의 정수)를 나타낼 수 있다. 예를 들어, -B-는 -(CH₂)₂- 및 -(CH₂)₄- 중에서 적어도 어느 하나를 나타낼 수 있다.In Chemical Formulas 1 and 3, Ar represents a benzene ring, R ¹ and R ² represent an alkyl group having 1 to 9 carbon atoms, and A and B each represent a hydrocarbon group having 2 to 9 carbon atoms. -Ar- silver

And

At least one of them can be represented. -A- may represent -(CH ₂ ) _a -(a is an integer of 2 or more and 9 or less). For example, -A- may represent at least one of -(CH ₂ ) ₂ -, -(CH ₂ ) ₃ -, and -(CH ₂ ) ₄ -. -B- may represent -(CH ₂ ) _b -(b is an integer of 2 or more and 9 or less). For example, -B- may represent at least one of -(CH ₂ ) ₂ -and -(CH ₂ ) ₄ -.

The forming of the first polymerization compound may include mixing the phthalate compound and the diol compound with a first catalyst, and the first catalyst may include TNBT (Tetra-n-butyltitanate). .

The step of forming the second polymerization compound may include mixing the first polymerization compound and the dicarboxylic acid compound with a second catalyst, and the second catalyst includes TNBT and TPP (Triphenylphosphate). can do.

The step of performing a polymerization reaction to increase the molecular weight of the second polymerization compound may include mixing the second polymerization compound and a third catalyst, and the third catalyst is TNBT, zinc acetate (ZA), And Trimethylphosphine (TMP).

The first to third polymerization reaction may be performed at 180 ~ 250 ℃. For example, the first polymerization reaction and the second polymerization reaction may be performed at 190°C, and the third polymerization reaction may be performed at 220°C. Also, the third polymerization reaction may be performed at 190°C and then changed to 220°C.

The molecular weight of the first polymerization compound may be 1,000 to 10,000, the molecular weight of the second polymerization compound may be 10,000 to 100,000, and the molecular weight of the adhesive polymer compound may be 100,000 to 200,000.

Of adhesive polymer compounds Manufacturing example

In the reactor, reactants 1,4-butanediol, dimethyl terephthalate, and dimethyl isophthalate and a catalyst, TNBT (Tetra-n-butyltitanate), are sequentially added. The dimethyl terephthalate and the dimethyl isophthalate are added in a molar ratio of 5:1. The 1,4-butanediol is preferably added more than the number of moles of reaction between the dimethyl terephthalate and the dimethyl isophthalate so that unreacted products of the dimethyl terephthalate and the dimethyl isophthalate do not remain. For example, 17.48 kg and 3.5 kg of the dimethyl terephthalate and the dimethyl isophthalate are added, respectively, and 21.9 kg of the 1,4-butanediol is added. The TNBT is added in 27g. The temperature of the reactor is set to 190° C. prior to the introduction of the reactants and the catalyst.

The stirrer in the reactor is operated, and the rotational speed of the stirrer is gradually increased to 100 rpm. The reactant is polymerized by the catalyst (first polymerization reaction), and a first polymerization compound having the following Chemical Formula 7 is formed.

[Formula 7]

및

을 나타낸다.In Chemical Formula 7, -Ar- is

And

Indicates.

The first polymerization compound includes the formula (8).

[Formula 8]

및

을 나타낸다.In Chemical Formula 8, -Ar- is

And

Indicates.

The first polymerization compound may be an oligomer having a molecular weight of 1,000 to 10,000. In addition, the first polymerization compound may be a transparent liquid at 190 ℃.

The reactants react to form the first polymerized compound and methanol is produced. The produced methanol is discharged through a column connected to the top of the reactor. The discharge amount of the methanol can be confirmed through the column. The end of the polymerization reaction may be determined through the amount of methanol discharged and/or the temperature of the column.

After completion of the polymerization reaction, adipic acid, a reactant, and triphenylphosphate (TPP) and TNBT, which are reactants, are sequentially added to the reactor. The adipic acid is added 10.52kg, the TPP is injected 18g, the TNBT is injected 38g.

The stirrer in the reactor is operated, and the rotational speed of the stirrer is gradually increased to 100 rpm. The first polymerization compound and the adipic acid are polymerized (second polymerization) by the catalyst to form a second polymerization compound comprising the following formula (9).

[Formula 9]

및

을 나타낸다.In Chemical Formula 9, -Ar- is

And

Indicates.

The second polymerization compound may have a molecular weight of 10,000 to 100,000.

The first polymerization compound and the adipic acid react to form the second polymerization compound, and water is generated. The produced water is discharged through a column connected to the top of the reactor. The discharge amount of the water can be confirmed through the column. The end of the polymerization reaction may be determined through the discharge amount of the water and/or the temperature of the column.

After completion of the polymerization, catalysts such as zinc acetate (ZA), trimethylphosphine (TMP), and TNBT are sequentially added to the reactor. The ZA is injected 18g, the TMP is injected 25g, and the TNBT is injected 38g.

The stirrer in the reactor is operated, and the rotational speed of the stirrer is gradually increased to 100 rpm. The second polymerization compound is polymerized by the catalyst (third polymerization reaction) to increase the molecular weight to form an adhesive polymer compound. The adhesive polymer compound may include Chemical Formula 9, and may have a molecular weight of 100,000 to 200,000.

The molecular weight and melt flow index (MFI) of the adhesive polymer compound may be controlled by adjusting the rotation speed of the stirrer. For example, the rotational speed of the stirrer may be reduced from 100 rpm to 15 rpm, then increased to 35 rpm, maintained, and gradually increased to 95 rpm. In addition, the temperature of the reactor can be changed from 190 ℃ to 220 ℃.

Unlike the preparation example, the third polymerization reaction may be completed in a separate reactor. When the catalyst is introduced into the reactor (first reactor) and the third polymerization reaction stabilizes after about 10 minutes, the mixture in the first reactor is transferred to another reactor (second reactor) connected to the first reactor. . At this time, the rotation speed of the stirrer in the first reactor is reduced from 100rpm to 15rpm. Before transferring the mixture, unnecessary gas and the like inside the second reactor are removed using a vacuum pump, and the temperature of the second reactor is set to 220°C. The molecular weight and the melt flow index (MFI) of the adhesive polymer compound may be controlled by adjusting the rotation speed of the stirrer in the second reactor. For example, when the mixture is transferred to the second reactor, the rotational speed of the stirrer in the second reactor may be maintained at 35 rpm and gradually increased to 95 rpm.

The adhesive resin composition according to the embodiments of the present invention may be prepared by mixing components and additives and then extruding them. The mixing may be performed using a kneader such as a kneader, a roll mill, or a Bunbury mixer, and the extrusion may be performed using a single-screw or twin-screw extruder.

The adhesive resin composition may be used as an extrusion coating material. For example, the adhesive resin composition may be extrusion coated by a T-die method to be molded into an adhesive film. The adhesive resin composition is excellent in adhesiveness and processability. For example, the adhesive resin composition has excellent adhesive strength to aluminum and can easily control workability, and thus can be used to form an adhesive film of an aluminum film.

[ Example ]

Example One

대

의 비율이 5:1) 3kg을 혼련하고 압출하여 10g/10분(230℃, 2.16kg)의 용융지수를 갖는 접착성 수지 조성물을 제조하였다. T-다이법을 이용하여 230℃의 온도에서 상기 접착성 수지 조성물을 알루미늄 필름에 압출 코팅하여 접착 필름을 형성하였다. Polypropylene 77 kg with a melt index of 5 g/10 min (230° C., 2.16 kg), modified polypropylene with a melt index of 20 g/10 min (230° C., 2.16 kg), maleic acid grafted, 5 kg, 1 g/ Adhesive polymer compound comprising 10kg (190℃, 2.16kg) of melt index and 0.89g/cm3 density of EOR (Ethylene Octene Rubber) 10kg, petroleum resin 5kg, and the formula (9)

versus

The ratio of 5:1) 3 kg was kneaded and extruded to prepare an adhesive resin composition having a melt index of 10 g/10 min (230° C., 2.16 kg). The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 2

대

의 비율이 5:1) 5kg을 혼련하고 압출하여 12g/10분(230℃, 2.16kg)의 용융지수를 갖는 접착성 수지 조성물을 제조하였다. T-다이법을 이용하여 230℃의 온도에서 상기 접착성 수지 조성물을 알루미늄 필름에 압출 코팅하여 접착 필름을 형성하였다. Polypropylene 56 kg having a melt index of 5 g/10 min (230° C., 2.16 kg), modified polypropylene having a melt index of 20 g/10 min (230° C., 2.16 kg) and maleic acid grafted, 7 kg, 1 g/ Adhesive polymer compound containing Ekg (Ethylene Octene Rubber) 25kg, petroleum resin 7kg, and formula 9 having a melt index of 10 minutes (190°C, 2.16 kg) and a density of 0.89 g/cm 3 (

versus

The ratio of 5:1) 5 kg was kneaded and extruded to prepare an adhesive resin composition having a melt index of 12 g/10 min (230° C., 2.16 kg). The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 3

대

의 비율이 5:1) 7kg을 혼련하고 압출하여 10g/10분(230℃, 2.16kg)의 용융지수를 갖는 접착성 수지 조성물을 제조하였다. T-다이법을 이용하여 230℃의 온도에서 상기 접착성 수지 조성물을 알루미늄 필름에 압출 코팅하여 접착 필름을 형성하였다. 65 kg of polypropylene having a melt index of 5 g/10 min (230° C., 2.16 kg), 8 kg of modified polypropylene having a melt index of 20 g/10 min (230° C., 2.16 kg) and maleic acid grafted. Adhesive polymer compound containing 15 kg of Ethylene Octene Rubber (EOR) having a melt index of 10 minutes (190°C, 2.16 kg) and a density of 0.89 g/cm 3, 5 kg of petroleum resin, and the formula (9)

versus

The ratio of 5:1) 7 kg was kneaded and extruded to prepare an adhesive resin composition having a melt index of 10 g/10 min (230° C., 2.16 kg). The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 4

대

의 비율이 5:1) 7kg을 혼련하고 압출하여 15g/10분(230℃, 2.16kg)의 용융지수를 갖는 접착성 수지 조성물을 제조하였다. T-다이법을 이용하여 230℃의 온도에서 상기 접착성 수지 조성물을 알루미늄 필름에 압출 코팅하여 접착 필름을 형성하였다. 53 g of polypropylene having a melt index of 5 g/10 min (230° C., 2.16 kg), 10 kg of modified polypropylene having a melt index of 20 g/10 min (230° C., 2.16 kg) and maleic acid grafted. An adhesive polymer compound comprising 20 kg of EOR (Ethylene Octene Rubber) having a melt index of 10 minutes (190° C., 2.16 kg) and a density of 0.89 g/cm 3, 10 kg of petroleum resin, and Chemical Formula 9 (

versus

The ratio of 5:1) 7 kg was kneaded and extruded to prepare an adhesive resin composition having a melt index of 15 g/10 min (230° C., 2.16 kg). The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 5

대

의 비율이 5:1) 8kg을 혼련하고 압출하여 8g/10분(230℃, 2.16kg)의 용융지수를 갖는 접착성 수지 조성물을 제조하였다. T-다이법을 이용하여 230℃의 온도에서 상기 접착성 수지 조성물을 알루미늄 필름에 압출 코팅하여 접착 필름을 형성하였다.Polypropylene 47 kg with a melt index of 5 g/10 min (230° C., 2.16 kg), 15 kg of modified polypropylene having a melt index of 20 g/10 min (230° C., 2.16 kg) and maleic acid grafted. An adhesive polymer compound comprising 25 kg of EOR (Ethylene Octene Rubber) having a melt index of 10 minutes (190° C., 2.16 kg) and a density of 0.89 g/cm 3, 5 kg of petroleum resin, and Chemical Formula 9 (

versus

The ratio of 5:1) 8 kg was kneaded and extruded to prepare an adhesive resin composition having a melt index of 8 g/10 min (230° C., 2.16 kg). The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 6

An adhesive resin composition was prepared in the same manner as in Example 1, except that 10 kg of a phosphorus-based flame retardant was added. The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 7

An adhesive resin composition was prepared in the same manner as in Example 2, except that 10 kg of a phosphorus-based flame retardant was added. The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 8

An adhesive resin composition was prepared in the same manner as in Example 1, except that 10 kg of a phosphorus-based flame retardant was added. The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 9

An adhesive resin composition was prepared in the same manner as in Example 1, except that 10 kg of a phosphorus-based flame retardant was added. The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

Example 10

An adhesive resin composition was prepared in the same manner as in Example 1, except that 10 kg of a phosphorus-based flame retardant was added. The adhesive resin composition was extruded onto an aluminum film at a temperature of 230° C. using a T-die method to form an adhesive film.

The physical properties (processability, adhesion, flame retardancy, and electrolyte resistance) for the adhesive films of Examples 1 to 10 were evaluated. The processability was evaluated by measuring the speed in the range where the adhesion to the aluminum film did not drop when the extruder was kept constant at 100 rpm and the coating speed was gradually increased. The adhesiveness was evaluated by measuring the peel strength of the adhesive film from the aluminum film by cutting the aluminum film coated with the adhesive film to a certain size. The flame retardancy was evaluated according to UL 94 regulations. The electrolyte resistance was evaluated by measuring the peel strength of the adhesive film from the aluminum film after immersing the aluminum film coated with the adhesive film in an electrolyte at 85° C. for 24 hours.

The adhesive films formed by the adhesive resin compositions of Examples 1 to 10 have excellent processability and adhesiveness, having a processability of 20 m/min or more and an adhesion of 600 g/15 mm or more. The adhesive film was found to be excellent in electrolytic solution resistance by maintaining adhesion even after the electrolyte was deposited. In addition, all of the adhesive films formed of the adhesive resin compositions of Examples 6 to 10 were extinguished within 30 seconds or 60 seconds, and were found to have excellent flame retardancy.

So far, specific embodiments of the present invention have been described. Those skilled in the art to which the present invention pertains will understand that the present invention may be implemented in a modified form without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered in terms of explanation, not limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the equivalent range should be interpreted as being included in the present invention.

Claims (15)

Polypropylene;
Modified polypropylene;
Rubber;
Petroleum resin; And
It contains an adhesive polymer compound,
The adhesive polymer compound is an adhesive resin composition comprising the following formula (1).
[Formula 1]

(In the formula 1,
Ar represents a benzene ring,
A and B each represent a hydrocarbon group having 2 to 9 carbon atoms,
-Ar- silver

And

At least one of them,
-A- represents -(CH ₂ ) _a -(a is an integer of 2 or more and 9 or less),
-B- represents -(CH ₂ ) _b -(b represents an integer of 2 or more and 9 or less) According to claim 1,
The adhesive resin composition,
30 to 80 parts by weight of the polypropylene,
3 to 15 parts by weight of the modified polypropylene,
10 to 30 parts by weight of the rubber,
3 to 20 parts by weight of the petroleum resin, and
The adhesive resin composition comprising 3 to 12 parts by weight of the adhesive polymer compound. According to claim 1,
Adhesive resin composition further comprising a flame retardant. The method of claim 3,
The adhesive resin composition,
Adhesive flame retardant composition comprising 1 to 15 parts by weight of the flame retardant. According to claim 1,
The polypropylene has a melt index of 1 ~ 10g / 10 minutes (230 ℃, 2.16kg),
The modified polypropylene has a melt index of 10 ~ 100g / 10 minutes (230 ℃, 2.16kg),
The rubber has a melt index of 0.05 ~ 10g / 10 minutes (190 ℃, 2.16kg),
The adhesive polymer compound has a melt index of 1 ~ 15g / 10 minutes (190 ℃, 2.16kg),
The adhesive resin composition is an adhesive resin composition, characterized in that it has a melt index of 5 ~ 15g / 10 minutes (230 ℃, 2.16kg). According to claim 1,
The modified polypropylene is an adhesive resin composition, characterized in that maleic acid is formed by grafting on polypropylene. According to claim 1,
The rubber is an adhesive resin composition comprising EPR (Ethylene Propylene Rubber), EBR (Ethylene Butene Rubber), EOR (Ethylene Octene Rubber), or a combination thereof. According to claim 1,
The petroleum resin is an adhesive resin composition comprising a C5-based petroleum resin, C9-based petroleum resin, or a combination thereof. delete delete According to claim 1,
In Chemical Formula 1,

versus

The ratio of 1:1 to 10:1, characterized in that the adhesive resin composition. In claim 1,
In Chemical Formula 1,
-A- represents at least one of -(CH ₂ ) ₂ -, -(CH ₂ ) ₃ -and -(CH ₂ ) ₄ -,
-B- is an adhesive resin composition characterized in that it represents at least one of -(CH ₂ ) ₂ -and -(CH ₂ ) ₄ -. According to claim 1,
In Formula 1, the molecular weight of the part of Formula 3 is 1,000 to 10,000, characterized in that the adhesive resin composition.
[Formula 3]

According to claim 1,
The molecular weight of the adhesive polymer compound is an adhesive resin composition, characterized in that 100,000 ~ 200,000. According to claim 1,
The adhesive polymer composition is an adhesive resin composition, characterized in that it has a hot-melt adhesive.