KR102106751B1 - Thermal fusing divice between xps insulstion boards - Google Patents

Abstract

The present invention relates to an apparatus for laminating XPS insulation boards, and more specifically, an XPS insulation board lamination for supplying lamination XPS insulation boards laminated to the actual required thickness required at a construction site by laminating XPS insulation boards produced in a predetermined thickness. It is about the device.
The XPS insulation board laminating device 1 of the present invention for achieving the above object is bolted to each tube of the steel in a rectangular shape of a rectangular parallelepiped, the board input portion 110 on the left and the heating portion 120 of the central portion, and A frame 100 including a plurality of rail holders 140 which are formed on the right side of the lamination part 130 and are bolted to the front and rear sides of both sides of the board input part 110; A pair of upper and lower board guide rails 200 and 200 'which are installed and fixed to the rail holder 140 and supply upper and lower XPS insulating boards X1 and X2; The push board assembly provided at the lower portion of the board input portion 110 to move the upper and lower XPS insulating boards X1 and X2 fed to the upper and lower board guide rails 200 and 200 'forward ( 300) and; A heater 400 for melting the respective surfaces of the upper and lower XPS insulating boards X1 and X2 supplied from the upper and lower board guide rails 200 and 200 '; The heater 400 is installed on the upper and lower parts of each of the upper and lower XPS insulating boards (X1) (X2) provided from the upper and lower board guide rails 200 and 200 'of the heater 400. Upper and lower pressurizing rollers 500 and 500 'that are pressed in close contact with the upper and lower surfaces; The upper and lower lamination rollers installed on the right lamination section 130 of the heating section 120 to pressurize the upper and lower XPS insulating boards X1 and X2 on which one surface is melted by the heater 400 ( 600) (600 '); A driving motor 700 for driving power; A control box (not shown) for controlling operation; A transfer roller 900 for transferring the laminated paper XPS insulating board X3 to the next process; In the XPS insulation board laminating device comprising a loading and packaging stand (not shown) for loading and packing the transferred lamination XPS insulation board (X3), in the front and rear of both sides of the board inlet 110 A plurality of rail guides 140 are provided with bolts, respectively, and the upper and lower board guide rails 200 and the left and right lower board guide rails 200 'are provided at the upper and lower portions of the rail guides 140, respectively. It is characterized in that it is installed and fixed in pairs to be movable up and down.
According to the present invention, the XPS insulating board laminating device configured as described above, the XPS insulating board laminating device capable of laminating the XPS insulating board produced in a predetermined thickness and supplying the laminated XPS insulating board with the actual required thickness required at the construction site. Will be provided.

Description

XPS insulation board laminating device {THERMAL FUSING DIVICE BETWEEN XPS INSULSTION BOARDS}

The present invention relates to an apparatus for laminating XPS insulation boards, and more specifically, an XPS insulation board lamination for supplying lamination XPS insulation boards laminated to the actual required thickness required at a construction site by laminating XPS insulation boards produced in a predetermined thickness. It is about the device.

Insulation boards are used in construction sites to insulate the interior and exterior of buildings.

In the past, the bead method insulation board has been mainly used, but recently, polystyrene resin is foamed and extruded in the form of a sheet to form a number of fine closed cells, resulting in high strength, uniform surface, and excellent water resistance XPS. Insulation boards (aka extruded polystyrene insulation boards, XPS) are provided.

XPS insulation board put polystyrene polymer of the same solid as the raw material of bead method insulation plate (aka Styrofoam) into an extruder, mix a blowing agent and a specific additive, melt it at high temperature and high pressure to make a viscous plastic resin, and then extrude and cool it through a mold. It was cut.

XPS insulation board has a dense texture density, so it has been in the spotlight as a building material because of its excellent insulation and moisture resistance.

In addition, XPS insulation boards are preferred in construction sites because they have a self-extinguishment that is self-extinguishing when the garden is removed.

However, the above-described XPS insulating board has a problem in that it is difficult to produce with a thickness greater than a predetermined thickness in the production technology because it is formed by foaming and extruding polystyrene resin in a sheet form.

In order to compensate for this, the XPS insulation board produced in a predetermined thickness is adhered and laminated by an adhesive means, thereby providing an XPS insulation board having a predetermined thickness required at a construction site.

Conventionally, as the bonding means for the above-mentioned lamination, it has mainly relied on bond-bonding lamination.

However, in the case of lamination by bond bonding, an additional bond application process is required, which complicates the production process, as well as an increase in production cost due to an increase in additional labor costs and material costs, leading to a price competitiveness and falling behind in bond bonding. The products laminated by the product have a high defect rate, such as a cracking phenomenon due to partial non-adhesion, and a phenomenon in which the adhesive portion is peeled off during an external impact, and the use of bonds in insulating materials is a limiting factor, and a negative factor in the evaluation of hazards It is becoming.

In addition, since direct recycling is not possible during recycling, an additional bond removal process is required, which also increases the labor cost according to the additional process.

The present invention has been devised to solve the above problems, and the XPS insulation board lamination for supplying the laminated XPS insulation board laminated to the actual required thickness required at the construction site by laminating the XPS insulation board produced in a predetermined thickness. It is intended to provide a device.

The XPS insulation board laminating device 1 of the present invention for achieving the above object is bolted to each tube of the steel in a rectangular shape of a rectangular parallelepiped, the board input portion 110 on the left and the heating portion 120 of the central portion, and A frame 100 including a plurality of rail holders 140 which are formed on the right side of the lamination part 130 and bolted to the front and rear sides of both sides of the board input part 110; A pair of upper and lower board guide rails 200 and 200 'which are installed and fixed to the rail holder 140 and supply upper and lower XPS insulating boards X1 and X2; The push board assembly provided at the lower portion of the board input portion 110 to move the upper and lower XPS insulating boards X1 and X2 fed to the upper and lower board guide rails 200 and 200 'forward ( 300) and; A heater 400 for melting the respective surfaces of the upper and lower XPS insulating boards X1 and X2 supplied from the upper and lower board guide rails 200 and 200 '; The heater 400 is installed on the upper and lower parts of each of the upper and lower XPS insulating boards (X1) (X2) provided from the upper and lower board guide rails 200 and 200 'of the heater 400. Upper and lower pressurizing rollers 500 and 500 'that are pressed in close contact with the upper and lower surfaces; The upper and lower lamination rollers installed on the right lamination section 130 of the heating section 120 to pressurize the upper and lower XPS insulating boards X1 and X2 on which one surface is melted by the heater 400 ( 600) (600 '); A driving motor 700 for driving power; A control box (not shown) for controlling operation; A transfer roller 900 for transferring the laminated paper XPS insulating board X3 to the next process; In the XPS insulation board laminating device comprising a loading and packaging stand (not shown) for loading and packing the transferred lamination XPS insulation board (X3), in the front and rear of both sides of the board inlet 110 A plurality of rail guides 140 are provided with bolts, respectively, and the upper and lower board guide rails 200 and the left and right lower board guide rails 200 'are provided at the upper and lower portions of the rail guides 140, respectively. It is characterized in that it is installed and fixed in pairs to be movable up and down.

According to the present invention, the XPS insulating board laminating device configured as described above, the XPS insulating board laminating device capable of laminating the XPS insulating board produced in a predetermined thickness and supplying the laminated XPS insulating board with the actual required thickness required at the construction site. Will be provided.

1 is a schematic view of the present invention XPS insulation board laminating device.
2 is an explanatory view of the present invention XPS insulation board laminating device.
3 is an explanatory view of the case where the lower board guide rail of the present invention XPS insulating board laminating device is horizontally installed.
4 is an explanatory diagram of a push board assembly of the present invention.
5 is a configuration diagram of the push board of FIG.
6 and 7 are explanatory views of the inclined board forming angle of FIG. 3.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration, operation and effect of the present invention XPS insulation board laminating device (1).

Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to ordinary or lexical meanings, and the inventor appropriately explains the concept of terms to explain his or her invention in the best way. Based on the principle that it can be defined, it should be interpreted as meanings and concepts consistent with the technical spirit of the present invention. Therefore, the embodiments described in this specification are only the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention, and at the time of filing the present invention, various equivalents and modifications that can replace them It should be understood that there may be examples. In addition, in describing the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, when adding reference numerals to each component, it should be noted that the same components have been denoted by the same reference numerals and the same names as possible, even though they are indicated on different drawings.

1 is an explanatory view of the present invention XPS insulating board laminating device.

1, the XPS insulation board laminating device 1 of the present invention is bolted to each tube of steel in a rectangular shape of a rectangular parallelepiped to the left side of the board input portion 110 and the central portion of the heating portion 120 And a frame 100 including a plurality of rail holders 140 which are formed on the right side of the lamination part 130 and are bolted to the front and rear sides of both sides of the board input part 110; A pair of upper and lower board guide rails 200 and 200 'which are installed and fixed to the rail holder 140 and supply upper and lower XPS insulating boards X1 and X2; The push board assembly provided at the lower portion of the board input portion 110 to move the upper and lower XPS insulating boards X1 and X2 fed to the upper and lower board guide rails 200 and 200 'forward ( 300) and; A heater 400 for melting the respective surfaces of the upper and lower XPS insulating boards X1 and X2 supplied from the upper and lower board guide rails 200 and 200 '; The heater 400 is installed on the upper and lower parts of each of the upper and lower XPS insulating boards (X1) (X2) provided from the upper and lower board guide rails 200 and 200 'of the heater 400. Upper and lower pressurizing rollers 500 and 500 'that are pressed in close contact with the upper and lower surfaces; The upper and lower lamination rollers installed on the right lamination section 130 of the heating section 120 to pressurize the upper and lower XPS insulating boards X1 and X2 on which one surface is melted by the heater 400 ( 600) (600 '); A driving motor 700 for driving power; A control box (not shown) for controlling operation; A transfer roller 900 for transferring the laminated paper XPS insulating board X3 to the next process; In the XPS insulation board laminating device comprising a loading and packaging stand (not shown) for loading and packing the transferred lamination XPS insulation board (X3), in the front and rear of both sides of the board inlet 110 A plurality of rail guides 140 are provided with bolts, respectively, and the upper and lower board guide rails 200 and the left and right lower board guide rails 200 'are provided at the upper and lower portions of the rail guides 140, respectively. It is characterized in that it is installed and fixed in pairs to be movable up and down.

Hereinafter, it will be described in more detail.

The frame 100 is formed by bolting each tube of iron to a rectangular parallelepiped.

The frame 100 may be divided into a board input part 110 on the left side of the heating part 120, a heating part 120 and a lamination part 130 on the right side of the heating part 120.

The board input part 110 is provided with upper and lower board guide rails 200, 200 'and a push board assembly 300 installed, and the heating part 120 has a heater 400 and an upper part. , The lower pressure roller 500, 500 'is installed and provided, the upper and lower lamination rollers 600, 600' and the driving motor 700 and a normal control box (not shown) in the lamination section 130 ) Is installed and provided.

First, the upper and lower board guide rails 200, 200 'and the push board assembly 300 are installed and provided in the board input part 110 on the left side of the heating part 120.

As shown in FIG. 1, the board input part 110 is provided with a plurality of rail fasteners 140 bolted to the front and rear sides of each side, and the upper and lower parts of each rail fastener 140 are provided. The left and right upper board guide rails 200 and the left and right lower board guide rails 200 'are installed and fixed in pairs so as to move up and down, respectively.

The upper and lower XPS insulation boards X1 are input to the left and right upper board guide rails 200, and the lower XPS thermal insulation boards X2 are input to the left and right lower board guide rails 200 '.

"과 같은 형상으로 가이드벽을 형성하고, 장치의 전방을 향한 상기 우측 상,하부 보드가이드레일(200),(200')의 우단은 "

" 과 같은 형상으로 가이드벽을 형성하는 것이 바람직하다.In addition, the left end of the upper and lower board guide rails 200 and 200 'toward the front of the device is "

"The guide wall is formed in the same shape, and the right end of the upper and lower board guide rails 200 and 200 'toward the front of the device is"

It is preferable to form the guide wall in a shape such as ".

)히터(400)의 상하 이등변면의 연장선상에 또는 연장선과 평행선상에 각각 설치 고정되게 된다.The upper and lower board guide rails 200 and 200 ', which are fixedly installed on the rail holder 140 to move up and down, have an isosceles triangle shape in cross section (

) The heater 400 is installed and fixed on the extension line of the upper and lower isosceles surfaces, or on the extension line and the parallel line, respectively.

)인 히터(400)의 상면(상부 이등변면) 연장선과 일치되게 좌상부로부터 하향 경사지게 설치 고정되고, 상기 하부 보드가이드레일(200')은, 바닥면에 투입되는 하부XPS단열보드(X2)의 상면이 상기 히터(400)의 하면(하부 이등변면) 연장선과 일치되게 좌하부로부터 상향 경사지게 설치 고정되게 된다.That is, as can be seen in Figures 1 and 2, the upper board guide rail 200, the bottom surface is a cross-section isosceles triangle shape (

) Is fixed to be installed downwardly inclined from the upper left to coincide with the upper surface (upper isosceles) extension line of the heater 400, and the lower board guide rail 200 'of the lower XS insulation board X2 input to the bottom surface The upper surface of the heater 400 (lower isosceles surface) is installed and fixed to be inclined upwardly from the lower left to match the extension line.

For reference, X1 and X2 in FIGS. 2 and 3 represent the upper XPS insulation board and the lower XPS insulation board, and the drawings show the movement trajectory for convenience of description.

However, the lower board guide rail 200 'may be installed horizontally on the ground, as shown in FIG.

)인 히터(400)의 상면(상부 이등변면) 연장선과 일치되게 좌상부로부터 하향 경사지게 설치 고정된다.Even when the lower board guide rail 200 'is installed horizontally on the ground as described above, the upper board guide rail 200 has a cross-section isosceles triangle shape (

) Is installed and fixed to be inclined downward from the upper left to coincide with the extension line of the upper surface (upper isosceles) of the heater 400.

)인 히터(400)의 하부 이등변면이 지면에 수평이 되도록 히터(400)의 설치각도를 조절하고, 상기 하부 보드가이드레일(200')은, 바닥면에 투입된 하부XPS단열보드(X2)의 상면이 상기 히터(400)의 하부 이등변면 연장선상에 일치되도록 설치 고정한 다음, 상기 상부 보드가이드레일(400)은, 바닥면이 상기 히터(400)의 상부 이등변면 연장선상에 일치되도록 설치 고정하면 되는 것이다.At this time, first, the cross-section isosceles triangle shape (

) Adjust the installation angle of the heater 400 so that the lower isosceles of the heater 400 is horizontal to the ground, and the lower board guide rail 200 'of the lower XS insulation board X2 inserted into the bottom surface. If the upper surface is installed and fixed to match the extension line of the lower isosceles surface of the heater 400, then the upper board guide rail 400 is installed and fixed so that the bottom surface matches the extension line of the upper isosceles surface of the heater 400. Will be.

In addition, a push board assembly 300 is provided at a lower center portion of the board input portion 110 as shown in FIG. 1.

The push board assembly 300 includes a push board 310, a push board rail 320, a power transmission chain 330, and a DC motor 340, as shown in FIG.

The push board 310, as shown in Figures 4 to 5, the bottom plate 311 is formed horizontally on the ground and the support board 312 is installed to bend upward in the left end of the bottom plate 311 And the support board 312, the pivot (P) is rotatably coupled to the lower end of the inclined board 313 in close contact with the support board 312 is made integrally by the coupling.

The forward and reverse rotation motion of the DC motor 340, which is the driving motor of the push board assembly 300, is transmitted to the push board 310 by the power transmission chain 330, so that the push board 310 is pushed. Reciprocating motion along the board rail 320 and simultaneously pushing the upper and lower XPS insulation boards (X1) (X2) input to the upper and lower board guide rails (200, 200 '), and then repeating the original position. Is done.

That is, when the upper and lower XPS insulation boards (X1) (X2) are inserted into the upper and lower board guide rails 200 and 200 ', and the push board assembly 300 is switched on, the push board ( 310), the upper and lower board guide rails (200) (200 '), the upper and lower XPS insulation board (X1) (X2) by simultaneously pushing the heater 400 toward the heater 400 and the upper and lower pressurization Each of the rollers 500 and 500 'is separated from each other and the original position is repeated.

At this time, the push board 310, as shown in Figures 2 and 4 to 5, the upper and lower XPS insulation board (X1) by the inclined board 313 in close contact with the support board 312 which is a vertical portion ) (X2) is pushed to the front at the same time, the heater 400 and the upper and lower pressure rollers (500) (500 ') are respectively introduced into the separation.

)인 히터(400)의 하부 이등변면을 지면에 수평되게 설치하는 경우에는, 상기 푸시보드(310)의 지지보드(312)에 밀착 직립되어 있는 상기 경사보드(313)는 상,하부 XPS단열보드(X1)(X2)를 동시에 밀 수 없게 되므로 합지된 합지XPS단열보드(X3)는 상층과 하층이 층이지게 엇갈려 합지될 수 있다.However, when the heater 400 is formed in a shape such as a right triangle, not an isosceles triangle, or a cross-section isosceles triangle shape (

) When the lower isosceles of the heater 400 is installed horizontally on the ground, the inclined board 313 in close contact with the support board 312 of the push board 310 is the upper and lower XPS insulation board Since the (X1) and (X2) cannot be pushed at the same time, the laminated lamination XPS insulation board X3 may be staggered so that the upper and lower layers are layered.

Therefore, in this case, referring to FIGS. 3 and 5 to 7, when the pivot P of the push board 310 is matched to an arbitrary point of the lower board guide rail 200 ', the inclined board 313 is fixed to coincide with the PM line connecting the pivot P and a point M of the upper board guide rail 200 equal to the length from the right vertex of the heater 400 to the pivot. You can operate it.
That is, the inclined board 313, when the shape of the heater 400 is formed in a shape other than an isosceles triangle, pivots the push board 310 at any point of the lower board guide rail 200 '. PM line which matches (P) and connects the pivot (P) and a point (M) of the upper board guide rail (200) equal to the length from the right vertex of the heater (400) to the pivot (P). When fixed and operated in accordance with, the push board 310 moves the upper and lower XPS insulation boards (X1) (X2) into the upper and lower board guide rails 200 and 200 'toward the heater 400. At the same time, the heaters 400 and the upper and lower pressurized rollers 500 and 500 'can be respectively inserted into the spaced portions.

For reference, FIGS. 5 to 7 are explanatory views seen from the front for explaining the inclination angle of the inclined board 313 among the components of the push board 310.

That is, first, as shown in Figures 2 and 6, the installation angle of the heater 400 is adjusted and fixed,

Next, the lower board guide rail 200 ′, as shown in FIG. 2, is an upper surface of the lower XS insulation board X2 inserted into the lower board guide rail 200 ′ on an extension line of the lower surface of the heater 400. Fix it to match,

Next, the upper board guide rail 200, as shown in Figure 2, the bottom surface is installed and fixed to match the extension line of the upper surface of the heater 400,

Next, as shown in FIGS. 5 and 6, the pivot P of the push board 310 is matched to an arbitrary point of the lower board guide rail 200 ',

Next, as shown in FIGS. 6 and 7, one point of the upper board guide rail 200 equal to the length of the pivot P and the right end vertex of the heater 400 to the pivot P When the inclined board 313 of the push board 310 is matched and fixed to the PM line to which M) is connected,

The line connecting the one point (M) of the upper board guide rail 200 from the vertex of the heater 400 right and the one point (P) of the lower board guide rail 200 'from the vertex of the right end of the heater 400 The connected line and the line connecting both points (M, P) on the inclined board 313 form an isosceles triangle with the line connecting both points (M, P) on the inclined board 313 as the base. So,

The inclined board 313 coinciding with the PM line simultaneously pushes the upper and lower XPS insulating boards X1 and X2 input to the upper and lower board guide rails 200 and 200 'with the heater 400. The upper and lower press rollers 500 and 500 'are simultaneously drawn into each spaced portion, so that the front and rear and left and right surfaces can be obtained by joining the laminated XPS insulation board X3.

On the other hand, in this case, although not shown in the drawing, the configuration of the push board assembly 300 is omitted, and one known push such as a cylinder provided on each of the upper and lower board guide rails 200 and 200 ' Upper and lower XPS insulation by causing the device (not shown) to push the upper and lower XPS insulation boards (X1) (X2) respectively on the upper and lower board guide rails 200 and 200 'individually and sequentially. Board (X1) (X2) of the heater 400 and the upper and lower pressurized rollers (500) (500 ') by entering into the separation portion of the required shape in the construction site of the XPS insulation board (X3) to obtain Of course it is possible.

In addition, although not shown in the drawings, depending on the construction site, it may be necessary for a single layer to be stacked on the front and rear surfaces of the laminated XPS insulating board X3.

In this case, the configuration of the push board assembly 300 is omitted, and a known push device (not shown) such as a cylinder provided on each of the upper and lower board guide rails 200 and 200 'is allowed. Upper and lower XPS insulation boards (X1) (X2) by pushing the upper and lower XPS insulation boards (X1) (X2) respectively on the upper and lower board guide rails 200 and 200 'individually and sequentially. Of course, it is also possible to obtain a laminated XPS insulating board X3 having a shape required at a construction site by introducing the heater 400 and the upper and lower pressurized rollers 500 and 500 'into each spaced part.

)인 히터(400)와 상,하부 가압롤러(500)(500')가 설치되어 구비된다.Next, in the heating section 120 of the central portion, as shown in Fig. 2, a cross-section isosceles triangle shape (

), The heater 400 and the upper and lower pressure rollers 500 and 500 'are installed and provided.

)으로 된 소정길이의 횡방향 이등변삼각기둥 형상으로 형성된다.The heater 400, an electric coil heater is built in, and the cross-section isosceles triangle shape from the board input portion 110 on the left side to the lamination portion 130 on the right side (

) Is formed in the shape of a transverse isosceles triangular column of a predetermined length.

Accordingly, the upper and lower board guide rails 200 of the upper and lower board guide rails 200 and 200 ', which are installed and fixed in pairs to be movable up and down on the rail holder 140, have a bottom surface of the heater 400. The upper board (upper isosceles) is fixed to be installed downwardly inclined from the upper left to coincide with the extension line, and the lower board guide rail 200 'has the upper surface of the lower XS insulation board X2 inserted into the bottom surface of the heater 400. It is installed and fixed to be inclined upward from the lower left to match the extension line of the lower surface (lower isosceles).

The contact surfaces of the upper and lower XPS insulating boards (X1) (X2) are melted by the heating heat of the heater 400 and the lower surface.

The heater 400 is installed and fixed so that the installation angle can be adjusted.

In addition, the heater 400, it is also preferable to configure the width of the bottom side to be adjustable so that the input angle of the upper and lower XPS insulation board (X1) (X2) to be input.

In addition, the heater 400, it is also preferable to have a plurality of the length of the base is formed in various ways to be used in accordance with the various thicknesses of the upper and lower XPS insulation boards (X1) (X2) to be input.

At this time, the length of the bottom side of the heater 200 is preferably formed to be small as long as the melting of the heater 400 bonding surface of the upper and lower XPS insulating boards (X1) (X2) to be input.

In addition, the length of the isosceles of the heater 400 is preferably formed to be long as long as melting of the junction surface of the heater 400 of the upper and lower XPS insulating boards X1 and X2 is input.

This minimizes the input angle of the upper and lower XPS insulation boards (X1) (X2), and the upper and lower XPS insulation boards (X1) by pressurization during pressurization by the upper and lower lamination rollers 600 and 600 '. This is to minimize the impact on X2).

The temperature of the heater 400 is preferably heated to maintain a temperature of 150 to 250 degrees so that instantaneous melting of the heater junction surfaces of the upper and lower XPS insulating boards (X1) (X2) is possible.

On the other hand, the upper and lower portions of the heater 400 are spaced apart at predetermined intervals from the heater 400 to the upper and lower portions, respectively, and are provided with an upper pressure roller 500 and a lower pressure roller 500 '.

The upper and lower pressurized rollers 500 and 500 'adjust the spacing intervals corresponding to the thickness of the upper and lower XPS insulating boards X1 and X2, which are introduced into the separation space between the upper and lower surfaces of the heater 400. It is fixed so that it can be moved up and down to enable it.

The upper and lower pressurized rollers 500 and 500 'apply the predetermined pressure to the upper and lower XPS insulating boards X1 and X2, which are introduced into the space between the upper and lower surfaces of the heater 400, and the heater. The contact surfaces of the upper and lower XPS insulating boards X1 and X2 contacting the upper and lower surfaces of the 400 are instantaneously melted.

Next, the upper and lower laminating rollers 600, 600 ', a driving motor 700, and a known control box (not shown) are installed on the laminating portion 130 on the right side of the heating portion 120.

The upper and lower laminating rollers 600 and 600 'are installed and fixed to the right side of the heater 400 and the upper and lower pressurizing rollers 500 and 500', as shown in FIG. Each surface is melt-bonded by the heater 400 and the upper and lower pressurized rollers 500 and 500 'to be pressurized to increase the degree of fusion of the laminated XPS insulation board X3.

X3 (Paper XPS Insulation Board) shown in FIG. 2 shows a laminated XPS Insulation Board (X3) in which one surface of the upper and lower XPS insulation boards (X1) (X2) is melt-bonded. For convenience, the movement trajectory is displayed.

The upper and lower laminating rollers 600 and 600 'are laminated paper XPS insulating boards on which one surface is melt-bonded and transported by the heater 400 and the upper and lower pressurizing rollers 500 and 500'. It is fixedly installed to move up and down so that the gap can be adjusted in response to the thickness of X3).

The laminated paper XPS insulation board (X3) air-cooled along the transport roller 900 and transported to a loading and packaging platform (not shown) to package products according to the demands of the construction site.

The preferred embodiment of the present invention of the XPS insulating board laminating device 1 has been described in detail, but the present invention is not limited to this and is applicable to thermal lamination of bulky insulating materials of various materials, and in particular, the claims and inventions of the invention. It is possible to carry out various modifications within the scope of the detailed description and the accompanying drawings, and it will be apparent that this also belongs to the scope of the present invention.

1 XPS insulation board laminating device
X1 Upper XPS Insulation Board X2 Lower XPS Insulation Board X3 Lamination XPS Insulation Board
100 Frame 120 Heating section 110 Board input section 130 Lamination section 140 Rail mount
200 Upper board guide rail 200 'Lower board guide rail
300 Push Board A
400 heater
500 upper pressure roller 500 'lower pressure roller
600 upper lamination roller 600 'lower lamination roller
700 drive motor
900 transfer roller

Claims (14)

Bolting each tube of steel into a rectangular parallelepiped to form a board input part 110 on the left side, a heating part 120 on the left side, and a lamination part 130 on the right side, and the inside of both sides of the board input part 110. , A frame 100 including a plurality of rail fixtures 140 that are bolted to the rear, respectively; A pair of upper and lower board guide rails 200 and 200 'which are installed and fixed to the rail holder 140 and supply upper and lower XPS insulating boards X1 and X2; The push board assembly provided at the lower portion of the board input portion 110 to move the upper and lower XPS insulating boards X1 and X2 fed to the upper and lower board guide rails 200 and 200 'forward ( 300) and; A heater 400 for melting the respective surfaces of the upper and lower XPS insulating boards X1 and X2 supplied from the upper and lower board guide rails 200 and 200 '; The heater 400 is installed on the upper and lower parts of each of the upper and lower XPS insulating boards (X1) (X2) provided from the upper and lower board guide rails 200 and 200 'of the heater 400. Upper and lower pressurizing rollers 500 and 500 'that are pressed in close contact with the upper and lower surfaces; The upper and lower lamination rollers installed on the right lamination section 130 of the heating section 120 to pressurize the upper and lower XPS insulating boards X1 and X2 on which one surface is melted by the heater 400 ( 600) (600 '); A driving motor 700 for driving power; A control box (not shown) for controlling operation; A transfer roller 900 for transferring the laminated paper XPS insulating board X3 to the next process; In the XPS insulation board laminating device comprising a loading and packaging stand (not shown) for loading and packing the transferred lamination XPS insulation board (X3), in the front and rear of both sides of the board inlet 110 A plurality of rail guides 140 are provided with bolts, respectively, and the upper and lower board guide rails 200 and the left and right lower board guide rails 200 'are provided at the upper and lower portions of the rail guides 140, respectively. XPS insulation board laminating device, characterized in that this is installed and fixed in pairs to move up and down. delete delete delete According to claim 1, The push board assembly 300 is made of a push board 310, a push board rail 320, a power transmission chain 330, and a DC motor 340, the drive motor The forward and reverse rotational motion of the DC motor 340 is transmitted to the push board 310 by the power transmission chain 330, so that the push board 310 reciprocates along the push board rail 320 and moves to the phase. XPS insulation board laminating device characterized in that the upper and lower XPS insulation boards (X1) (X2) inputted to the lower board guide rails 200 and 200 'are simultaneously pushed forward (PUSH) and repeated to return to the original position. . According to claim 5, The push board 310, the bottom plate 311 is formed horizontally on the ground and the support plate 312 and the support board 312 is installed to bend upward to the bottom plate 311 ) The XPS insulation board laminating device, characterized in that the inclined board 313, which is pivotally coupled to the lower left and right bottom and is in close contact with the support board 312, is formed integrally by coupling. According to claim 5, When the shape of the heater 400 is formed in a shape other than an isosceles triangle, the configuration of the push board assembly 300 is omitted, and each of the upper and lower board guide rails 200 ( 200 ') A single push device (not shown) such as a cylinder provided on the upper and lower XPS insulation boards (X1) (X2) put on the upper and lower board guide rails 200 and 200' By pushing each of them individually and sequentially, and inserting the upper and lower XPS insulation boards (X1) and (X2) into each spaced part between the heater 400 and the upper and lower pressurized rollers 500 and 500 '. XPS insulation board laminating device, characterized in that to obtain a laminated paper XPS insulation board (X3) of the required shape. The method of claim 6, wherein the inclined board 313, when the shape of the heater 400 is formed in a shape other than an isosceles triangle, the push board at any point of the lower board guide rail 200 '( The pivot P of 310) is matched, and the pivot P and a point M of the upper board guide rail 200 equal to the length from the right apex of the heater 400 to the pivot P are XPS insulation board laminating device, characterized in that it is fixed in accordance with the connected PM line. delete According to claim 1, The heater 400, XPS insulation board laminating device, characterized in that installed to enable adjustment of the installation angle. According to claim 1, The heater 400, XPS insulation board lamination characterized in that it is configured to be able to adjust the width of the base so that the input angle adjustment of the upper and lower XPS insulation board (X1) (X2) to be input Device. delete delete delete

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