KR102100554B1 - Detector Using Terahertz Wave and the Operating Method thereof - Google Patents

Abstract

The terahertz wave-based detector according to an embodiment of the present invention includes a terahertz wave emitting unit generating terahertz waves, and a guide guiding a terahertz wave generated by the terahertz wave emitting units to a measurement object along a length direction. The wire and the guide wire may include a vibrating unit that vibrates in the width direction of the guide wire.

Description

Detector using terahertz wave and the operating method thereof

The present invention relates to a terahertz wave-based detector and an operation method thereof, and more particularly, to a terahertz wave-based detector having high speed and high resolution and an operation method thereof.

The terahertz wave has excellent permeability to non-conductive materials other than metal, and has harmless properties to the human body with energy lower than that of x-ray. The terahertz wave has attracted a lot of attention from high value-added services such as healthcare, telecommunications and security, and high-tech industries. In addition, due to its excellent permeability to non-conductive materials and its harmless properties, it can be applied as a non-contacting and non-destructive testing technology, and has been spotlighted as a next-generation non-destructive testing technology.

However, as far as it has been studied, it has not been developed successfully in terms of resolution and speed, so it has not reached commercialization.

Accordingly, the present inventors invented a terahertz wave-based detector having high speed and high resolution and a method of operating the same.

One technical problem to be solved by the present invention is to provide a terahertz wave-based detector capable of high-speed scanning and an operation method thereof.

Another technical problem to be solved by the present invention is to provide a terahertz wave-based detector capable of high-resolution scanning and an operation method thereof.

Another technical problem to be solved by the present invention is to provide a terahertz wave based detector having a simple configuration and a method of operating the same.

Another technical problem to be solved by the present invention is to provide a terahertz wave-based detector that is easy to control and an operation method thereof.

The technical problem to be solved by the present invention is not limited to the above.

A terahertz wave-based detector according to an embodiment of the present invention, a terahertz wave emitting unit for generating terahertz waves, and a terahertz wave generated by the terahertz wave emitting unit along a longitudinal direction, to guide a measurement object It may be made of a guide wire and a vibration unit for vibrating the guide wire in the width direction of the guide wire.

According to an embodiment, the vibration unit may include a first vibration unit disposed on one side of the guide wire and a second vibration unit disposed at a predetermined distance from the first vibration unit.

According to an embodiment, the first vibrating unit may be disposed inside the guide wire.

According to one embodiment, the first vibrating unit may be disposed on the outer surface of the guide wire.

According to one embodiment, the first vibrating unit may be fixed to the outer surface of the guide wire as a non-conductor.

According to an embodiment, the first vibrating unit may be formed of a magnet, and the second vibrating unit may be formed of a coil.

According to one embodiment, the terahertz wave emitter and the guide wire further comprises a control unit for controlling the position of the coupling substrate with respect to the coupling substrate and the measurement object, the control unit is the vibration caused by the The position of the coupling substrate may be controlled to correct a change in distance between a guide wire end and a measurement object.

According to an embodiment, the vibration frequency of the guide wire by the vibration unit and the correction frequency of the coupling substrate may be linked to each other.

According to one embodiment, the guide wire has conductivity, and the width of the guide wire tip may be several nm to several um.

According to one embodiment, the area irradiated with the terahertz wave may be larger than the tip size of the guide wire by the vibration.

A method of operating a terahertz wave-based detector according to an embodiment of the present invention includes a preparation step of preparing a measurement object, a position step of positioning a guide wire providing a path of the terahertz wave on one side of the measurement object, and the guide Including the irradiation step of irradiating terahertz waves to the measurement object through the wire, the irradiation step may further include the step of vibrating the guide wire in the width direction of the guide wire.

According to one embodiment, by vibrating the irradiation step, the terahertz wave may be irradiated to a larger area than the terahertz wave beam spot provided by the tip of the guide wire.

According to an embodiment, a correction step of correcting a change in the distance between the tip of the guide wire and the measurement object according to the vibration of the irradiation step may be further included.

According to one embodiment, the correction step, when the distance between the tip of the guide wire and the measurement object increases according to the vibration of the irradiation step, the guide wire is moved in the direction of the measurement object, the vibration of the irradiation step Accordingly, when the distance between the tip of the guide wire and the measurement object is close, the guide wire may be moved in a direction away from the measurement object.

 The terahertz wave-based detector according to an embodiment of the present invention includes a terahertz wave emitting unit generating terahertz waves, and a guide guiding a terahertz wave generated by the terahertz wave emitting units to a measurement object along a length direction. The wire and the guide wire may include a vibrating unit that vibrates in the width direction of the guide wire.

The terahertz wave may be irradiated to a wider range than the terahertz wave beam spot determined by the tip of the guide wire due to the vibration of the guide wire. Accordingly, high-speed scanning may be possible.

In addition, even when the distance between the end of the guide wire and the measurement object changes during vibration of the guide wire, the coupling substrate may be controlled to maintain a constant distance between the end of the guide wire and the measurement object. Accordingly, since a uniform beam spot can be provided, detection of high resolution and high reliability may be possible.

1 is a block diagram illustrating the configuration of a terahertz wave-based detector according to an embodiment of the present invention.
2 is a view for explaining a terahertz wave-based detector according to an embodiment of the present invention.
3 to 6 are diagrams for explaining vibration control of a terahertz wave-based detector according to an embodiment of the present invention.
7 is a view for explaining correction control of a terahertz wave-based detector according to an embodiment of the present invention.
8 is a view for explaining an operation method of a terahertz wave-based detector according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed contents are thorough and complete and that the spirit of the present invention is sufficiently conveyed to those skilled in the art.

In the present specification, when a component is referred to as being on another component, it means that it may be formed directly on another component, or a third component may be interposed between them. In addition, in the drawings, the shape and size are exaggerated for effective description of technical content.

Further, in various embodiments of the present specification, terms such as first, second, and third are used to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another component. Therefore, what is referred to as the first component in one embodiment may be referred to as the second component in another embodiment. Each embodiment described and illustrated herein also includes its complementary embodiment. Also, in this specification, 'and / or' is used to mean including at least one of the components listed before and after.

In the specification, a singular expression includes a plural expression unless the context clearly indicates otherwise. Also, terms such as “include” or “have” are intended to indicate the presence of features, numbers, steps, elements or combinations thereof described in the specification, and one or more other features, numbers, steps, or configurations. It should not be understood as excluding the possibility of the presence or addition of elements or combinations thereof. In addition, in this specification, "connecting" is used in a sense to include both indirectly connecting a plurality of components, and directly connecting.

In addition, in the following description of the present invention, when it is determined that detailed descriptions of related well-known functions or configurations may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted.

1 is a block diagram illustrating a configuration of a terahertz wave-based detector according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating a terahertz wave-based detector according to an embodiment of the present invention. 3 to 6 are diagrams for explaining vibration control of a terahertz wave-based detector according to an embodiment of the present invention. 7 is a diagram for explaining correction control of a terahertz wave-based detector according to an embodiment of the present invention.

1 and 2, the terahertz wave-based detector 100 according to an embodiment of the present invention, the terahertz wave emitter 110, the terahertz wave receiver 112, the guide wire 120, the guide It may be made of at least one of a wire vibration unit 140 (hereinafter abbreviated as a vibration unit), a correction unit 150, a control unit 160, and an analysis and imaging unit 190. Hereinafter, each configuration will be described.

Terahertzpa Release 110 and receiver 112

The terahertz wave emitting unit 110 may generate and emit terahertz waves.

According to an embodiment, the wavelength of the terahertz wave may be 3 mm to 30 μm, and the frequency of the terahertz wave may be 0.1 THz to 10 THz. The terahertz wave, as having the above-described frequency range, may exhibit a stronger transmittance than visible light or infrared light.

Further, the terahertz wave light source may be continuous or pulsed, and the number of light sources may be one or more.

According to an example, the terahertz wave emission unit 110 may be disposed upward toward the measurement object S.

The terahertz wave receiver 112 may transmit a terahertz wave that is transmitted through the measurement object S or reflected from the measurement object S. According to an embodiment, the terahertz wave emission and reception may be performed in a transmission type, a reflection type, or a pitch and catch method. If the transmission type, as shown in Figure 2, the terahertz wave receiver 112 may be disposed under the measurement object (S).

guide wire (120)

The guide wire 120 may guide the terahertz wave emitted from the terahertz wave emitting unit 110 to the measurement object S. To this end, the guide wire 120 may have conductivity. In this case, the terahertz wave emitted from the terahertz wave emitting unit 110 may be irradiated along the longitudinal direction of the guide wire 120.

According to an example, the guide wire 120 may be made of, for example, a conductive polymer. The conductive polymer may include at least one of olyaniline, polypyrrole and polythiophene. If the guide wire 120 is made of a conductive polymer, it can provide convenience in controlling the diameter of the guide wire 120. For another example, the guide wire 120 may be made of a metal such as copper and silver, or for example, a conductive metal may be coated.

In addition, the terahertz wave emitted from the terahertz wave emitting unit 110 may be coupled to the guide wire 120 in various ways. For example, it can be coupled in at least one of direct end-fire coupling, surface plasmon coupling, wire to wire coupling, and quasi-optical coupling.

The guide wire 120 may induce a terahertz wave (TH) in the longitudinal direction as shown in FIG. 2. At this time, the size of the beam spot of the terahertz wave (TH) induced by the guide wire 120 may be proportional to the width of the tip of the guide wire 120. Accordingly, the width of the tip of the guide wire 120 may be designed according to a desired resolution. For example, the width of the tip of the guide wire 120 may be several tens of um at several nm.

In addition, since the guide wire 120 must be able to vibrate (V in FIG. 2) in the width direction of the guide wire 120 by the vibration unit 140, it may have a predetermined flexibility.

guide wire Vibration (140)

The guide wire vibrator 140 may perform the function of vibrating the guide wire 120 in the width direction of the guide wire 120. In this case, since the irradiation area of the terahertz wave is wider than the tip area of the guide wire 120, high-speed scanning may be possible.

To this end, the guide wire vibration unit 140 is disposed at a predetermined distance from the first vibration unit 142 and the first vibration unit 142 provided on one side of the guide wire 120, and the first The vibration unit 142 may include a second vibration unit 146 that vibrates.

For example, one of the first vibrating unit 142 and the second vibrating unit 146 may be a magnet and the other may be a coil. Hereinafter, for convenience of description, it is assumed that the first vibrating unit 142 is a magnet and the second vibrating unit 146 is a coil.

As shown in Figure 4 (a), the first vibration unit 142 may be disposed inside the guide wire 120, as shown in Figure 4 (b), the first vibration unit 142 may be disposed on the outer surface of the guide wire 120. When the first vibrating unit 142 is disposed on the outer surface of the guide wire 120, the first vibrating unit 142 may be fixed as a non-conductor. This takes into account that the nonconductor has high permeability to terahertz waves. That is, it is possible to solve the occurrence of terahertz wave optical path distortion caused by the nonconductor fixing the first vibration unit 142. For example, the first vibrating unit 142 may be fixed to the outer surface of the guide wire 120 with Teflon.

In addition, the first vibration unit 142 may be disposed in an annular shape along the outer peripheral surface in the width direction of the guide wire 120. As illustrated in FIG. 5, the second vibrating unit 146 may be disposed to be spaced apart at a predetermined interval d based on the guide wire 120. In another aspect, by controlling the current applied to the coil of the second vibrating unit 146, the guide wire 120 may vibrate in an annular shape.

Referring to FIG. 3 for a more detailed description, as shown in FIG. 3 (a), the guide wire 120 in an initial state may be in a state without bending. That is, in this case, the second vibration unit 146 may be in an off state. Thereafter, as shown in FIG. 3 (b), the second vibrating unit 146 on the left side of the guide wire 120 may be turned on to bend the guide wire 120 to the left. That is, by applying the magnetic field to the first vibrating portion 142 provided on the guide wire 120, the first vibrating portion 146 can be bent to the left. In addition, as shown in Figure 3 (c), the second vibrating portion 146 on the right side of the guide wire 120 is turned on, and the second vibrating portion 146 on the left side of the guide wire 120 is turned off. , The guide wire 120 may be bent to the right.

In this way, the second vibrating unit 146 is controlled, so that the guide wire 120 can vibrate at a predetermined level. Therefore, the irradiation range of terahertz waves can be extended by vibration.

Referring to FIG. 6 for a more detailed description, if the guide wire 120 does not vibrate, the terahertz wave irradiation area depends on the tip area of the guide wire 120. In this case, the scanning range is limited to Wp. On the other hand, when the guide wire 120 is vibrated by the vibration unit 140, the terahertz wave irradiation area becomes wider than the tip area of the guide wire 120. In this case, the scanning range can be extended to Wi.

Correction (150)

The correction unit 150 may correct that the distance between the end of the guide wire 120 and the measurement object S is varied by vibration. In the case where the terahertz wave emitting portion 110 is disposed on the coupling substrate 111 and the guide wire 120 is also disposed on the coupling substrate 111, the end of the guide wire 120 and the measurement object ( When the distance between S) increases, the coupling substrate 111 may move in the direction of the measurement object S, and on the contrary, when the distance between the end of the guide wire 120 and the measurement object S approaches, coupling The substrate 111 may move in a direction away from the measurement object S. Accordingly, even if the guide wire 120 vibrates, the distance between the guide wire 120 and the measurement object S may be kept constant.

For more detailed description, referring to FIG. 7 (a), when the guide wire 120 is in an initial state, the distance between the guide wire 120 and the measurement object S is a coupling substrate 111 and a measurement object S ) May be DL excluding the length L of the guide wire 120 from the distance L.

However, when the guide wire 120 vibrates, as illustrated in FIG. 7B, the distance between the end of the guide wire 120 and the measurement object S may be changed to D-Lcosθ. That is, the distance between the end of the guide wire 120 and the measurement object S is farther than the D-L of FIG. 7 (a).

Therefore, as illustrated in FIG. 7C, the coupling substrate 111 can be moved in the direction of the measurement object 111 by L (1-cosθ). Accordingly, even when the guide wire 120 is bent, the distance between the end of the guide wire 120 and the measurement object S may be maintained at D-L.

Therefore, aberrations due to terahertz wave-based detection can be minimized.

The coupling substrate 111 may also be referred to as a bullseye substrate.

Control unit 160

Referring back to FIG. 1, the control unit 160 may control each configuration of the terahertz wave-based detector 100 according to an embodiment of the present invention. To this end, the control unit 160 may include at least one of the vibration control unit 170 and the correction control unit 180.

The vibration control unit 170 may vibrate the guide wire 120 described with reference to FIGS. 3 to 6 in the width direction of the guide wire 120. That is, the vibration control unit 170 may control the vibration direction and the vibration width of the guide wire 120 by controlling the current applied to the coil which is the second vibration unit 146.

The correction control unit 180 controls the coupling substrate 111 so that the distance between the end of the guide wire 120 and the measurement object S described above with reference to FIG. 7 is kept constant even during vibration of the guide wire 120. can do.

According to an example, the correction control unit 180 may control the second vibration unit 146 on / off or may be controlled by a PID method.

The analysis and imaging unit 190 may perform a function of analyzing a signal received from the terahertz wave receiving unit 112 and imaging it. That is, the analysis and imaging unit 190 may detect a terahertz wave and detect a defect of a measurement object, and display the image through the display unit.

According to an example, the vibration frequency in the vibration control unit 170 and the correction frequency in the correction control unit 180 may be associated with each other. This is because the distance between the guide wire and the measurement object is generated by the vibration frequency in the vibration control unit 170, and the correction control unit 180 is for maintaining a constant distance between the guide wire and the measurement object. . For example, the vibration frequency in the vibration control unit 170 and the correction frequency in the correction control unit 180 may be the same. That is, by making the vibration frequency of the guide wire 120 and the correction frequency of the coupling substrate 111 the same, the difference in the beam spot caused by the vibration can be compensated by the position correction of the coupling substrate. In addition, when the vibration frequency and the correction frequency are the same, the control variable can be reduced, thereby providing an advantage from a control point of view.

Referring to FIGS. 1 to 7, a terahertz wave-based detector according to an embodiment of the present invention has been described. Hereinafter, an operation method of a terahertz wave based detector will be described with reference to FIG. 8.

8 is a view for explaining an operation method of a terahertz wave-based detector according to an embodiment of the present invention.

Referring to FIG. 8, an operation method of a terahertz wave-based detector according to an embodiment of the present invention includes a preparation step (S100) of preparing a measurement object, and a guide wire providing a path of the terahertz wave to one side of the measurement object The positioning step (S110) to be positioned at and while vibrating the guide wire in the width direction of the guide wire, may include at least one step of the irradiation step (S120) of irradiating terahertz waves to the measurement object. Each step will be described below.

In step S100, the measurement object may be mounted. For example, the measurement object may be a semiconductor package.

In step S110, a guide wire 120 providing a path of terahertz waves may be located on one side of the measurement object S. In the case of a transmissive type, the terahertz wave emitter 110 may be located above the measurement object S, and the terahertz wave receiving unit 112 may be located below the measurement object S.

In step S120, the terahertz wave emission unit 110 may emit the terahertz wave. The emitted terahertz waves can be moved along the guide wire 120 and irradiated to the measurement object S.

At this time, the vibration control unit 170 may vibrate the guide wire 120 in the width direction of the guide wire 120. That is, the vibration control unit 170 may control the magnetic field provided to the first vibration unit 142 provided in the guide wire 120 by controlling the current applied to the second vibration unit 146. Accordingly, the guide wire 120 may be bent in a predetermined direction according to an applied magnetic field. According to an example, the vibration control unit 170 may bend the guide wire 120 in an annular direction. Therefore, as described above, the irradiation range of the terahertz wave can be extended than the tip area of the guide wire 120.

Meanwhile, the operation method according to an embodiment may further include a correction step of correcting a change in the distance between the tip of the guide wire and the measurement object according to the vibration of the irradiation step.

That is, the correction control unit 180 may control the height of the coupling substrate 111 so that the distance between the end of the guide wire 120 variable by step S120 and the measurement object S is kept constant. In other words, when the distance between the tip of the guide wire 120 and the measurement object S increases according to the vibration of the irradiation step, the correction step moves the guide wire 120 in the direction of the measurement object S. When the distance between the tip of the guide wire 120 and the measurement object S is close according to the vibration of the irradiation step, the guide wire 120 may be moved in a direction away from the measurement object S. You can. Therefore, errors in terahertz wave detection can be minimized.

In addition, the analysis and imaging unit 190 may image the inside of the measurement object based on the terahertz waves detected through the terahertz wave receiver 112. For example, the analysis and imaging unit 190 may provide a 2D image. Accordingly, internal analysis of the measurement object may be possible in a non-destructive manner.

The operation method of the terahertz wave-based detector according to an embodiment of the present invention has been described above with reference to FIG. 8.

According to the terahertz wave-based detector and its operation method according to the above-described embodiment of the present invention, the terahertz wave is irradiated along the guide wire based on the apertureless near field, but the guide wire can be bent. Accordingly, since an area larger than the size of the beam spot can be scanned, high-speed scanning may be possible.

On the other hand, when a high-speed scanning is realized by positioning a predetermined diffusion lens on a terahertz wave and a measurement object, a problem may arise in that beam spot sizes at the center and side of the diffusion lens are different. In addition, since the beam spot at the side becomes large, a problem that resolution is deteriorated may occur.

However, in the present invention, since the guide wire is vibrated, the problem of non-uniformity of the size of the beam spot does not occur, and there is an advantage that the irradiation area can be widened.

In addition, according to an embodiment of the present invention, since the size of the beam spot depends on the tip area of the guide wire, it may be possible to reduce the frequency of the terahertz wave while minimizing the beam spot. When the frequency of the terahertz wave is lowered, the power of the terahertz wave can be increased, so that the penetration rate can be improved, and the measurement precision can be improved.

Furthermore, according to one embodiment of the present invention, even if the distance between the end of the guide wire and the measurement object changes due to the vibration of the guide wire, the distance change can be corrected by moving the coupling substrate to improve the reliability of the measurement. .

According to a terahertz wave substrate detector and its operation method according to an embodiment of the present invention, defects such as gaps and pattern defects between chips and peeling / porosity in a high-density and miniaturized semiconductor package in a non-contact and non-destructive manner can do.

As described above, the present invention has been described in detail using preferred embodiments, but the scope of the present invention is not limited to specific embodiments, and should be interpreted by the appended claims. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

100: terahertz wave based detector
110: terahertz wave emitter
112: terahertz wave receiver
120: guide wire
140: guide wire vibration unit
142: first vibrating unit
146: second vibrating unit
150: correction unit
160: control unit
170: vibration control
180: correction control
190: analysis and imaging unit

Claims (14)

A terahertz wave emitter for generating terahertz waves;
A guide wire for guiding the terahertz wave generated in the terahertz wave emitting unit along a longitudinal direction to a measurement object; And
It includes a vibration unit for vibrating the guide wire in the width direction of the guide wire,
The vibration unit,
A first vibrating unit disposed on one side of the guide wire and
A terahertz wave-based detector including a second vibrating unit spaced a predetermined distance from the first vibrating unit. delete According to claim 1,
The first vibrating unit is a terahertz wave-based detector disposed inside the guide wire. According to claim 1,
The first vibrating unit is a terahertz wave-based detector disposed on the outer surface of the guide wire. According to claim 4,
The first vibrating unit is a non-conductive terahertz wave-based detector fixed to the outer surface of the guide wire. According to claim 1,
The first vibrating unit is made of a magnet,
The second vibrating unit is a terahertz wave-based detector made of a coil. According to claim 1,
A coupling substrate on which the terahertz wave emitting portion and the guide wire are disposed; And
Further comprising a control unit for controlling the position of the coupling substrate relative to the measurement object,
The control unit controls the position of the coupling substrate to correct a change in distance between the end of the guide wire and the measurement object due to the vibration, a terahertz wave-based detector. The method of claim 7,
A terahertz wave based detector in which the frequency of the guide wire vibration by the vibration unit and the correction frequency of the coupling substrate are linked to each other. According to claim 1,
The guide wire has conductivity,
The width of the guide wire tip is several nm to several um, terahertz wave-based detector. According to claim 1,
The terahertz wave-radiated region is larger than the tip size of the guide wire by the vibration, the terahertz wave-based detector. A preparation step of preparing a measurement object;
A positioning step of positioning a guide wire providing a path of terahertz waves on one side of the measurement object; And
Including the irradiation step of irradiating a terahertz wave to the measurement object through the guide wire;
In the irradiation step, a width of the guide wire is adjusted by operating a vibrating unit including a first vibrating unit disposed on one side of the guide wire and a second vibrating unit spaced a predetermined distance from the first vibrating unit. A method of operating a terahertz wave based detector further comprising vibrating in a direction. The method of claim 11,
By the vibration of the irradiation step,
The terahertz wave is irradiated to a larger area than the terahertz wave beam spot provided by the tip of the guide wire, and the method of operating the terahertz wave based detector. The method of claim 11,
And a correction step of correcting a change in the distance between the tip of the guide wire and the measurement object according to the vibration of the irradiation step. The method of claim 13,
The correction step,
When the distance between the tip of the guide wire and the measurement object increases according to the vibration of the irradiation step, the guide wire is moved in the direction of the measurement object,
When the distance between the tip of the guide wire and the object to be measured is approached according to the vibration of the irradiation step, the method of operating the terahertz wave-based detector moves the guide wire in a direction away from the object to be measured.

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