KR102093434B1 - Receptacle connector - Google Patents

Abstract

An insulator including at least one contact array therein; A shell accommodating the insulator therein; And an RFI pad integrally formed with at least a portion of the pad portion attached to the surface of the insulator at the rear of the contact portion of the contact array, and a cover portion integrally covering a rear surface of the insulator accommodated inside the shell. A receptacle connector according to an example is disclosed.

Description

Receptacle Connector {RECEPTACLE CONNECTOR}

The present invention relates to a receptacle connector. More specifically, the present invention relates to a receptacle connector for improving EMC (Electro Magnetic Compatibility) performance.

Recently, the details of the new USB standard C type (type-c) USB connector has been released in the Intel Developer Forum (IDF). The C-type USB connector has a size similar to that of the USB 2.0 Micro-B, and has the advantage of easy attachment and detachment of the plug connector regardless of the connection direction of the plug connector. In addition, the C-type USB connector has a transmission speed of 10 Gbps, which is twice as fast as the existing USB 3.0, and is capable of supplying power up to 100 W, so it is expected to be used in various fields.

The C-type USB receptacle connector has a contact array that is mounted on a PCB while making electrical contact with a plug connector, and data can be transmitted and received while electrical signals flow through the contact array. The ability to block the effect from other devices while the electrical signal flowing through the contact array does not affect other devices is called Electro Magnetic Compatibility (EMC) performance.The C-type USB receptacle connector has no EMC performance considerations. Bar, a C-type USB receptacle connector that can improve EMC performance is required.

The receptacle connector according to an embodiment of the present invention aims to improve EMC performance.

In addition, the receptacle connector according to an embodiment of the present invention is to reduce the number of parts to reduce the production cost of the product and the size of the product.

Receptacle connector according to an embodiment of the present invention,

An insulator including at least one contact array therein; A shell accommodating the insulator; And a pad portion attached to the insulator at the rear of the contact portion of the contact array, and an RFI pad integrally formed with a cover portion covering the rear surface of the insulator accommodated inside the shell.

The insulator may include a first region provided with a slot for providing a contact portion of the contact array and a plug contact array corresponding to the contact array; A second region formed such that the mounting portion of the contact array is exposed to the outside; And a third region formed between the first region and the second region.

The pad portion of the RFI pad may be attached to the third region of the insulator, and the cover portion of the RFI pad may be attached to cover the rear surface of the second region.

The RFI pad includes a connection portion integrally connecting the pad portion and the cover portion between the pad portion and the cover portion, and a coupling portion to which the connection portion is coupled may be formed on an upper surface of the second region of the insulator. .

The engaging portion may include a groove in which the connecting portion is seated.

A through hole penetrating the rear of the insulator may be formed on the cover surface of the cover portion.

The through hole may be formed at a point corresponding to a position of a contact that is connected to a power source among the contacts of the contact array.

The shell, while mounted on a PCB, is connected to ground, and the RFI pad and the shell can be electrically connected to each other.

The RFI pad may be connected to the ground while being mounted on the PCB.

The RFI pad may be electrically connected to a mid-plate connected to the PCB, and may be connected to the ground through the mid-plate.

The RFI pad is connected to the ground, thereby improving the EMC performance of the receptacle connector.

The pad portion of the RFI pad may block signal interference between contacts that occur while signals are being transmitted and received through the contact array.

The cover portion of the RFI pad may block noise generated during transmission / reception of a signal through the contact array in the rear and upper directions of the insulator.

According to the receptacle connector according to an embodiment of the present invention, due to the improvement of EMC performance, reliability of operation of the receptacle connector can be ensured.

Further, according to the receptacle connector according to an embodiment of the present invention, due to the reduction in the number of parts, the production cost of the product and the size of the product are reduced, and thus can be applied to various types of terminal devices.

1 is a view showing the components of a receptacle connector according to an embodiment of the present invention.
2 is a cross-sectional view of a plug connector connectable with a receptacle connector according to an embodiment of the present invention.
3 is a perspective view of a receptacle connector according to an embodiment of the present invention.
4 is an exploded perspective view of the receptacle connector shown in FIG. 3.
5 is an exploded perspective view of the second insulator shown in FIG. 4.
FIG. 6 is an exploded perspective view of the first insulator shown in FIG. 5.
Fig. 7 (a) is a plan view of the second insulator, and Fig. 7 (b) is a plan view of the RFI pad.
Fig. 8 (a) is a perspective view of the second insulator, and Fig. 8 (b) is a perspective view of the RFI pad.
9 (a) and 9 (b) are diagrams showing a distance between a contact connected to a power supply and an RFI pad.
10 is a perspective view of an RFI pad according to another embodiment of the present invention.
11 is a diagram for describing an exemplary method in which an RFI pad is connected to ground.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to completely inform the person having the scope of the invention, and the present invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

In the present specification, 'front' means a direction in which a plug connector is positioned to engage with a receptacle connector, and 'rear' means a direction opposite to the front.

1 is a view showing the components of a receptacle connector according to an embodiment of the present invention. The type of the component parts of the receptacle connector shown in FIG. 1 is an example, and some of the component parts shown in FIG. 1 may be omitted or changed to other component parts within a range apparent to those skilled in the art. Component parts of may be added.

1, the receptacle connector according to an embodiment of the present invention includes a first insulator body 110, a first contact array 130, a mid plate 150, a second insulator body 210, a second contact array 230, a shell 300 and an RFI pad 400.

The first insulator body 110 constitutes the first insulator 100 (see FIG. 5) by including the first contact array 130 and the mid plate 150 therein. The material of the first insulator body 110 may be, for example, a plastic resin, and the materials of the first contact array 130 and the mid plate 150 may be, for example, conductive metal. Some of the contacts of the first contact array 130 may have a surface mount structure, and some of the other contacts may have a dip solder structure.

The second insulator body 210 constitutes the second insulator 200 (see FIG. 4) by including the first insulator 100 and the second contact array 230 therein. The material of the second insulator body 210 may be, for example, a plastic resin, and the material of the second contact array 230 may be, for example, a conductive metal. All contacts of the second contact array 230 may have a surface mount structure.

The first contact array 130 and the second contact array 230 are arranged in a column direction of the second insulator 200 with a plurality of contact pins spaced apart at regular intervals, and provide electrical contact to a plug connector to be coupled to the receptacle connector At the same time, it can be mounted on a PCB.

Specifically, the rear regions of the first contact array 130 and the second contact array 230 exposed to the outside through the bottom surface of the second insulator 200 are mounting portions 130a and 230a mounted on the PCB. The front regions of the first contact array 130 and the second contact array 230 exposed to the front side of the two insulator 200 are contact portions 130b and 230b that provide electrical contact with the contact array of the plug connector.

The mid plate 150 is positioned between the first contact array 130 and the second contact array 230. The mid plate 150 is used to block interference between a signal flowing through the first contact array 130 and a signal flowing through the second contact array 230. For example, when the signal flowing through the first contact array 130 is radiated, the mid plate 150 may cause the signal to flow to ground rather than the second contact array 230.

In addition, the mid plate 150 may include a coupling protrusion 152. The mating projections 152 and the corresponding projections 12 of the plug connector 10 shown in FIG. 2 engage with each other and engage the receptacle connector and the plug connector 10 with each other. Specifically, the engaging projection 152 engages or disconnects the plug connector 10 while engaging the corresponding projection 12 of the plug connector 10 when the plug connector 10 is coupled to or detached from the receptacle connector It can play a role of jamming to a certain extent. Accordingly, the user can be made to recognize whether the plug connector 10 is correctly coupled to the receptacle connector or is correctly separated from the receptacle connector.

In addition, the mid plate 150 is positioned between the first contact array 130 and the second contact array 230, so that the first contact array 130 and the second contact array 230 of the second insulator 200 are The first contact array 130, the second contact array 230 and the mid plate 150 in the region (tongue region) where the contact portions 130b and 230b are arranged to enhance the fastening or assembly strength. It can also play a role.

The shell 300 is made of a metal material, and accommodates the second insulator 200 from the rear. In addition, the shell 300 may be accommodated in the second insulator 200 therein and mounted on the PCB through a solder unit 310 to be described later.

The RFI pad 400 blocks signal interference that may occur between the contact arrays 130 and 230 while signals are being transmitted and received through the first contact array 130 and the second contact array 230. Specifically, when a high-speed signal flows through the first contact array 130 and the second contact array 230, the signal flowing through any one contact may affect the signal flowing through the other contact. The RFI pad 400 connected to the ground may prevent interference between contacts by flowing the divergent signal to the RFI pad 400 instead of other contacts when the signal flowing through any one contact is divergent.

In addition, the RFI pad 400 covers the second insulator 200 from the rear of the second insulator 200 accommodated in the shell 300 and may function as a shield. Specifically, the RFI pad 400, when the signal is transmitted and received through the contact array (130, 230), the noise generated by the transmitted and received signal is emitted in the rear or upper direction to affect the performance of the electrical elements such as antennas Prevent it from reaching. That is, the RFI pad 400 serves as a ground, so that noise generated by signals transmitted and received through the contact arrays 130 and 230 can be prevented from affecting the performance of an electric device such as an antenna.

The RFI pad 400 may be connected to the ground through a PCB to improve EMC performance of the receptacle connector 500.

As an example in which the RFI pad 400 is connected to the ground, when the shell 300 is grounded while being mounted on the PCB, the RFI pad 400 is electrically connected (eg, welded) to the shell 300, The RFI pad 400 may also be grounded.

As another example in which the RFI pad 400 is connected to the ground, at least a portion of the lower surface of the RFI pad 400 is directly mounted on the PCB 40, so that it can be independently connected to the ground through the PCB 40 (see FIG. 11). ).

As another example in which the RFI pad 400 is connected to the ground, the RFI pad 400 is mounted on a PCB and electrically connected to the mid plate 150 connected to the ground, and may be connected to the ground through the mid plate 150. have. At this time, the mid plate 150 may be provided with a protrusion 154 exposed to the outside of the second insulator 200 and coupled with the RFI pad 400.

3 is a perspective view of a receptacle connector 500 according to an embodiment of the present invention, and FIG. 4 is an exploded perspective view of the receptacle connector 500 shown in FIG. 3. The receptacle connector 500 illustrated in FIG. 3 may be a C-type USB receptacle connector.

3 and 4, the receptacle connector 500 according to an embodiment of the present invention includes a second insulator 200, a shell 300 and a radio frequency interference (RFI) pad 400.

First, the second insulator 200 includes a first contact array 130 and a second contact array 230 that are a collection of a plurality of contacts. The second insulator 200 may be provided with a plurality of slots in which the first contact array 130 and the second contact array 230 are disposed.

The shell 300 accommodates the second insulator 200 from the rear. The shell 300 may include a solder portion 310 extending in a downward direction and mounted on the PCB.

The RFI pad 400 blocks signal interference that may occur between respective contacts while electric signals are flowing through the contact arrays 130 and 230, and covers the rear of the second insulator 200.

The receptacle connector 500 according to an embodiment of the present invention can improve the EMC performance of the receptacle connector 500 by employing an RFI pad 400 capable of blocking various types of signal interference.

5 is an exploded perspective view of the second insulator 200 illustrated in FIG. 4, and FIG. 6 is an exploded perspective view of the first insulator 100 illustrated in FIG. 5.

Referring to FIG. 5, the second insulator 200 is formed by molding the second contact array 230 and the first insulator 100 inside the second insulator body 210 by insert molding.

In this case, after inserting and fixing the second contact array 230 and the first insulator 100 into the insert molding mold, insert molding may be performed by injecting plastic resin into the insert molding mold.

In addition, referring to FIG. 6, the first insulator 100 is formed by molding the first contact array 130 and the mid plate 150 inside the first insulator body 110 by insert molding. In this case, after inserting and fixing the first contact array 130 and the mid plate 150 into the insert molding mold, insert molding may be performed by injecting plastic resin into the insert molding mold.

Hereinafter, a coupling relationship between the second insulator 200 and the RFI pad 400 will be described in detail with reference to FIGS. 7 (a), 7 (b), 8 (a), and 8 (b). Explain.

7 (a) is a plan view of the second insulator 200, and FIG. 7 (b) is a plan view of the RFI pad 400. 8 (a) is a perspective view of the second insulator 200, and FIG. 8 (b) is a perspective view of the RFI pad 400.

Referring to FIG. 7A, the second insulator 200 is a first area provided with a plurality of slots for providing contact parts 130a and 230a of the first contact array 130 and the second contact array 130. (200a), the first contact array 130 and the second contact array 230, the mounting portions 130b, 230b of the second region 200b are formed to be exposed to the outside, and the first region 200a and the second The third region 200c formed between the regions 200b may be included. The first region 200a and the third region 200c are collectively referred to as a tongue portion.

7B, the RFI pad 400 includes a pad portion 400a attached to the surface of the second insulator 200, and a cover portion 400b covering the rear surface of the second insulator 200. , And a connection portion 400c that integrally connects at least a portion of the pad portion 400a and the cover portion 400b.

The pad portion 400a of the RFI pad 400 is attached to the surface of the third region 200c of the second insulator 200. When the electrical signal flows through the first contact array 130 and the second contact array 230, the pad unit 400a serves to block signal interference between each contact. To facilitate attachment to the third region 200c, the pad portion 400a may be configured as a separate type. For example, the pad part 400a is connected to the cover part 400b integrally with the first sub pad part 420 and the first sub pad part 420 attached to the upper surface of the third region 200c. It may include a second sub-pad portion 430 is attached to the lower surface of the third region 200c while being coupled with. The first sub-pad part 420 and the second sub-pad part 430 may be connected to the protrusion 154 of the mid plate 150 shown in FIG. 1.

The cover portion 400b of the RFI pad 400 covers the rear surface of the second region 200b of the second insulator 200. In the cover part 400b, noise due to an electric signal is transmitted backward through the mounting parts 130b and 230b of the first contact array 130 and the second contact array 230 exposed to the outside of the second insulator 200. Blocks divergence.

Referring to FIG. 8 (a), a coupling portion 270 for coupling with the RFI pad 400 may be formed on the upper surface of the second region 200b of the second insulator 200. The connection portion 400c of the RFI pad 400 may include a groove on which it is seated.

In summary, in the RFI pad 400 according to the present invention, the pad portion 400a is attached to the surface of the third region 200c of the second insulator 200, and the connecting portion 400c is of the second region 200b. While being seated in the groove formed on the upper surface, the cover portion 400b may cover the rear surface of the second insulator 200.

The USB receptacle connector 500 according to an embodiment of the present invention integrally includes a pad portion 400a capable of blocking signal interference between contacts and a cover portion 400b covering the rear side of the second insulator 200. By forming with, it is possible to reduce the number of component parts, thereby reducing the size and production cost of the product.

Meanwhile, referring to FIG. 8 (b), a through hole 412 penetrated to the rear of the second insulator 200 may be formed on the cover surface 410 of the RFI pad 400. The through hole 412 is provided to space a distance between a contact connected to a power source and a RFI pad 400 connected to ground among contacts of the first contact array 130 and the second contact array 230. The RFI pad 400 should be connected to ground in order to block the divergence of electrical signals and interference between signals.

However, of the contacts exposed to the outside of the second region 200b of the second insulator 200, a current for operating the receptacle connector 500 is supplied to a contact that is connected to a power source, between the contact and the ground. When the distance approaches, there is a problem that the current flowing through the contact can be induced to flow to the ground. Accordingly, the cover surface 410 of the RFI pad 400 according to the present invention penetrates a point corresponding to a position of a contact connected to a power source among contacts of the first contact array 130 and the second contact array 230. The ball 412 is formed so that the distance between the contact connected to the power source and the RFI pad 400 connected to the ground is spaced from each other.

9 (a) and 9 (b), the shortest distance (d) between the cover surface 410 of the RFI pad 400 and the contact 232 connected to a power source when the through hole 412 is not formed It can be seen that the shortest distance D between the cover surface 410 of the RFI pad 410 and the contact 232 connected to a power source when the through hole 412 is formed is longer than).

8 (b) shows that one through hole 412 having a square shape is formed on the cover surface 410, the number and shape of the through holes 412 may be variously changed. For example, two or more square-shaped through-holes 412 may be formed on the cover surface 410, and as shown in FIG. 10, a triangular-shaped through-hole 1012 of the RFI pad 1000 may be formed. It may be formed on the through surface 1010.

According to the receptacle connector 500 according to an embodiment of the present invention, due to the improvement of EMC performance, the performance can be guaranteed. In addition, according to the receptacle connector 500 according to an embodiment of the present invention, the production cost of the product and the size of the product are applied by applying the RFI pad 400 in which the pad part 400a and the cover part 400b are integrally formed. It can be reduced, and thus can be applied to various types of terminal devices.

Although the embodiments of the present invention have been described with reference to the above and the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can implement the present invention in other specific forms without changing its technical spirit or essential features. You will understand that there is. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

100: first insulator 110: first insulator body
130: first contact array 130a: mounting unit
130b: contact portion 150: mid plate
200: second insulator 200a: first region
200b: second area 200c: third area
210: second insulator body 230: second contact array
230a: mounting portion 230b: contact portion
300: shell 310: solder portion
400, 1100: RFI pad 400a: pad section
400b: cover portion 400c: connecting portion
410, 1110: cover surface 412, 1112: through hole
420: first sub pad portion 430: second sub pad portion
500: receptacle connector

Claims (13)

An insulator including at least one contact array therein;
A shell accommodating the insulator; And
The pad portion attached to the insulator at the rear of the contact portion of the contact array, the cover portion covering the rear surface of the insulator accommodated inside the shell, and the pad portion and the cover portion integrally connecting between the pad portion and the cover portion It includes an RFI pad formed with a connection,
The insulator,
A receptacle connector further comprising a coupling portion to which the connection portion is coupled.
According to claim 1,
The insulator,
A first area provided with a slot for providing a contact portion with the plug contact array corresponding to the contact array;
A second region formed such that the mounting portion of the contact array is exposed to the outside; And
And a third area formed between the first area and the second area.
According to claim 2,
The pad portion of the RFI pad is attached to the third area of the insulator, and the cover portion of the RFI pad is attached to cover the rear surface of the second area.
An insulator including at least one contact array therein;
A shell accommodating the insulator; And
Including the pad portion attached to the insulator at the rear of the contact portion of the contact array, and an RFI pad integrally formed with a cover portion covering a rear surface of the insulator accommodated inside the shell,
The insulator,
A first area provided with a slot for providing a contact portion with the plug contact array corresponding to the contact array;
A second region formed such that the mounting portion of the contact array is exposed to the outside; And
And a third region formed between the first region and the second region,
The pad portion of the RFI pad is attached to the third region of the insulator, and the cover portion of the RFI pad is attached to cover the rear surface of the second region,
The RFI pad,
Between the pad portion and the cover portion includes a connecting portion for integrally connecting the pad portion and the cover portion,
On the upper surface of the second region of the insulator,
A receptacle connector, characterized in that a coupling portion to which the connection portion is coupled is formed.
According to claim 4,
The coupling portion,
Receptacle connector, characterized in that it comprises a groove in which the connection portion is seated.
According to claim 1,
A receptacle connector, characterized in that a through hole penetrated to the rear side of the insulator is formed on the cover surface of the cover portion.
The method of claim 6,
The through hole,
Receptacle connector, characterized in that formed at a point corresponding to the position of the contact to be connected to the power of the contacts of the contact array.
According to claim 1,
The shell,
As it is mounted on the PCB, it is connected to ground,
Receptacle connector, characterized in that the RFI pad and the shell are electrically connected to each other.
According to claim 1,
The RFI pad,
A receptacle connector, which is mounted on a PCB and connected to ground.
According to claim 1,
The RFI pad,
A receptacle connector, which is electrically connected to a mid-plate connected to the PCB and grounded through the mid-plate.
The method according to any one of claims 8, 9 and 10,
The RFI pad,
By connecting to ground, the receptacle connector, characterized in that to improve the EMC performance of the receptacle connector.
According to claim 1,
The pad portion of the RFI pad,
Receptacle connector, characterized in that to block signal interference between contacts that occur while the signal is transmitted and received through the contact array.
According to claim 1,
The cover portion of the RFI pad,
Receptacle connector, characterized in that to block the noise generated during the transmission and reception of the signal through the contact array in the rear and upper direction of the insulator.

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