KR102135846B1 - Receptacle connector - Google Patents

Abstract

An insulator including at least one contact array and a mid plate therein; And an RFI pad attached to the surface of the insulator at the rear of the contact portion of the contact array, wherein a portion of the mid plate is exposed to the outside of the insulator, and the mid plate and the RFI pad exposed to the outside are electrically connected to each other through contact. Disclosed is a receptacle connector according to an embodiment of the present invention.

Description

Receptacle Connector {RECEPTACLE CONNECTOR}

The present invention relates to a receptacle connector. More specifically, the present invention relates to a receptacle connector applied with a new ground connection structure.

Recently, the details of the new USB standard C type (type-c) USB connector has been released in the Intel Developer Forum (IDF). The C type USB connector has a size similar to that of the USB 2.0 Micro-B, and has the advantage of being easy to attach and detach the plug connector regardless of the connection direction of the plug connector. In addition, the C-type USB connector has a transmission speed of 10 Gbps, which is twice as fast as the existing USB 3.0, and is capable of supplying power up to 100 W, so it is expected to be used in various fields.

The C-type USB receptacle connector is provided with a contact array mounted on a PCB, making electrical contact with a plug connector, and data can be transmitted and received while electrical signals flow through the contact array.

The ability to block the effects of electrical signals flowing through the contact array from affecting other devices while also affecting other devices is called EMC (Electro Magnetic Compatibility) performance.

To improve EMC performance, shells, radio frequency interference (RFI) pads, mid-plates, etc. are used in C-type USB receptacle connectors, and these shells are used to block the interference of electrical signals. The RFI pad and mid plate should be connected to ground. However, effective ground connection structures such as shells, RFI pads and mid plates have not been considered.

One embodiment of the present invention aims to propose a new ground connection structure of the receptacle connector.

In addition, one embodiment of the present invention aims to reduce the size of the receptacle connector.

In addition, one embodiment of the present invention aims to improve the production operation rate of the receptacle connector.

Receptacle connector according to an embodiment of the present invention,

An insulator including at least one contact array and a mid plate therein; And an RFI pad attached to the surface of the insulator at the rear of the contact portion of the contact array, wherein a portion of the mid plate is exposed to the outside of the insulator, and the mid plate exposed to the outside and the RFI pad are in contact. It can be electrically connected to each other through.

The at least one contact array may include a first contact array and a second contact array, and the mid plate may be located between the first contact array and the second contact array.

The RFI pad may be a separate RFI pad fastened to the insulator along the circumference of the insulator.

Some regions of the mid plate may include engaging projections projecting out of the insulator.

The RFI pad includes: a first sub RFI pad having a first engaging groove formed corresponding to the engaging protrusion of the mid plate, the first engaging groove being attached to one surface of the insulator while receiving the engaging protrusion; And a second engaging groove formed corresponding to the first engaging groove or the engaging projection, while receiving the first engaging groove or the engaging projection where the second engaging groove protrudes outward, on the other surface of the insulator. It may include a second sub-RFI pad attached.

The first engaging groove of the first sub RFI pad has an inwardly concave and convex outer surface structure facing the engaging projection, and the second engaging groove of the second sub RFI pad has a through hole It can take the form.

The insulator may include a first region provided with a slot for providing a contact portion of the contact array and a plug contact array corresponding to the contact array; A second region formed such that the mounting portion of the contact array is exposed to the outside; And a third region formed between the first region and the second region.

Some regions of the mid plate may be exposed to the outside by grooves formed in the third region of the insulator.

The mid-plate may be formed with a deep solder portion or a surface mount portion exposed to the outside of the insulator and mounted on a printed circuit board (PCB).

The mid plate may be surface-mounted to the PCB and connected to ground, and the RFI pad may be connected to ground through a mid plate connected to the PCB.

The RFI pad may include: a pad portion attached to the third region; And a fastening portion extending from the pad portion and inserted into a coupling groove formed in an upper surface of the second region.

The receptacle connector further includes a shell for accommodating the insulator, wherein the shell is mounted on a PCB and connected to ground, and the RFI pad is in contact with an upper surface of the fastening part and an inner surface of the shell. , It can be electrically connected to the shell.

The RFI pad is connected to the ground, thereby improving the EMC performance of the receptacle connector.

The RFI pad may block signal interference between contacts that occur while signals are being transmitted and received through the contact array.

Receptacle connector according to another embodiment of the present invention,

An insulator including at least one contact array and a mid plate therein; And an RFI pad attached to the surface of the insulator at the rear of the contact portion of the contact array, wherein the first region and the second region of the mid plate are exposed outside the insulator, and the first region of the mid plate is In contact with the RFI pad, the second region of the mid plate may be surface mounted on the PCB.

According to an embodiment of the present invention, the size of the receptacle connector can be reduced by using a new ground connection structure.

In addition, according to an embodiment of the present invention, the production operation rate of the receptacle connector can be improved.

In addition, according to an embodiment of the present invention, it is possible to manufacture a receptacle connector for various purposes.

1 is a view showing the components of a receptacle connector according to an embodiment of the present invention.
2 is a cross-sectional view of a plug connector connectable with a receptacle connector according to an embodiment of the present invention.
3 is a perspective view of a receptacle connector according to an embodiment of the present invention.
4 is an exploded perspective view of the receptacle connector shown in FIG. 3.
5 is an exploded perspective view of the second insulator shown in FIG. 4.
FIG. 6 is an exploded perspective view of the first insulator shown in FIG. 5.
7(a) is a bottom view of the mid plate according to the first embodiment, and FIG. 7(b) is a bottom view of the second insulator to which the mid plate according to the first embodiment is applied.
8 is a view showing a coupling relationship between the second insulator shown in FIG. 7 (b) and the RFI pad.
FIG. 9 is a view showing another coupling relationship between the second insulator shown in FIG. 7(b) and the RFI pad.
Fig. 10(a) is a perspective view of the mid plate according to the second embodiment, and Fig. 10(b) is a perspective view of the receptacle connector to which the mid plate according to the second embodiment is applied.
FIG. 11 is a view showing a coupling relationship between the second insulator shown in FIG. 10(b) and the RFI pad.
12 is a view showing another coupling relationship between the second insulator shown in FIG. 10(b) and the RFI pad.
13(a) is a perspective view of the mid plate according to the third embodiment, and FIG. 13(b) is a perspective view of the receptacle connector to which the mid plate according to the third embodiment is applied.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, and the present invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

In addition, in this specification,'front' means a direction in which a plug connector is positioned to engage a receptacle connector, and'rear' means a direction opposite to the front.

1 is a view showing the components of a receptacle connector according to an embodiment of the present invention. The type of the component parts of the receptacle connector shown in FIG. 1 is one example, and some of the component parts shown in FIG. 1 may be omitted or changed to other component parts within a range apparent to those skilled in the art. Component parts of may be added.

1, the receptacle connector according to an embodiment of the present invention includes a first insulator body 110, a first contact array 130, a mid plate 150, a second insulator body 210, a second contact array 230, an RFI pad 300 and a shell 400.

The first insulator body 110 constitutes the first insulator 100 (see FIG. 5) by including the first contact array 130 and the mid plate 150 therein. The material of the first insulator body 110 may be, for example, a plastic resin, and the material of the first contact array 130 and the mid plate 150 may be, for example, a conductive metal. Some of the contacts of the first contact array 130 may have a surface mount structure, and some of the other contacts may have a dip solder structure.

The second insulator body 210 constitutes the second insulator 200 (see FIG. 4) by including the first insulator 100 and the second contact array 230 therein. The material of the second insulator body 210 may be, for example, a plastic resin, and the material of the second contact array 230 may be, for example, a conductive metal. All of the contacts of the second contact array 230 may have a surface mount structure.

The first contact array 130 and the second contact array 230 are arranged in a column direction of the second insulator 200 with a plurality of contact pins spaced apart at regular intervals, and provide electrical contact to a plug connector to be coupled to the receptacle connector At the same time, it can be mounted on a PCB.

Specifically, the rear regions of the first contact array 130 and the second contact array 230 exposed to the outside through the bottom or rear surface of the second insulator 200 are mounting portions 130a and 230a mounted on the PCB. , The front regions of the first contact array 130 and the second contact array 230 exposed to the front side of the second insulator 200 are contact portions 130b and 230b that provide electrical contact with the contact array of the plug connector. to be.

The mid plate 150 is positioned between the first contact array 130 and the second contact array 230. The mid plate 150 is used to block interference between a signal flowing through the first contact array 130 and a signal flowing through the second contact array 230. For example, when the signal flowing through the first contact array 130 is diverged, the mid plate 150 may cause the signal to flow to ground rather than the second contact array 230.

In addition, the mid plate 150 may include a coupling protrusion 152. The mating projections 152 and the corresponding projections 12 of the plug connector 10 shown in FIG. 2 engage with each other while engaging the receptacle connector and the plug connector 10 with each other. Specifically, the engaging projection 152 engages or disconnects the plug connector 10 while engaging the corresponding projection 12 of the plug connector 10 when the plug connector 10 is coupled to or detached from the receptacle connector It can play a role of jamming to a certain extent. Accordingly, it is possible to allow the user to recognize whether the plug connector 10 is correctly coupled to the receptacle connector or is correctly disconnected from the receptacle connector.

In addition, the mid plate 150 is positioned between the first contact array 130 and the second contact array 230, so that the first contact array 130 and the second contact array 230 of the second insulator 200 are The first contact array 130, the second contact array 230 and the mid plate 150 in the area (tongue area) where the contact parts 130b and 230b are arranged to enhance the fastening or assembly strength. It can also play a role.

The RFI pad 300 blocks signal interference that may occur between the contact arrays 130 and 230 while signals are being transmitted and received through the first contact array 130 and the second contact array 230. Specifically, when a high-speed signal flows through the first contact array 130 and the second contact array 230, the signal flowing through any one contact may affect the signal flowing through the other contact. When the signal flowing through any one contact is diverted to the RFI pad 300 connected to the ground, interference between the contacts can be prevented by flowing the divergent signal to the RFI pad 300 rather than the other contact.

The shell 400 is made of a metal material, and accommodates the second insulator 200 from the rear. In addition, the shell 400 may be mounted on the PCB through the solder portion 410 to be described later while accommodating the second insulator 200 therein.

3 is a perspective view of a receptacle connector according to an embodiment of the present invention, and FIG. 4 is an exploded perspective view of the receptacle connector shown in FIG. 3. The receptacle connector 500 illustrated in FIG. 3 may be a C type USB receptacle connector.

3 and 4, the receptacle connector 500 according to an embodiment of the present invention may include a second insulator 200, an RFI pad 300, and a shell 400.

First, the second insulator 200 is located between the first contact array 130, the second contact array 230, and the first contact array 130 and the second contact array 230, which are a collection of a plurality of contacts. The mid plate 150 is included therein. The second insulator 200 may be provided with a plurality of slots in which the first contact array 130 and the second contact array 230 are disposed.

The RFI pad 300 is attached to the surfaces of the second insulator 200 at the rear of the contact portions 130b and 230b of the first contact array 130 and the second contact array 230. The RFI pad 300 may be configured as a separate type that is fastened to the second insulator 200 along the circumference of the second insulator 200.

Some regions of the mid plate 150 are exposed to the outside of the second insulator 200, and as will be described later, the mid plate 150 and the RFI pad 300 are electrically connected to each other through the regions exposed to the outside. . That is, according to the present invention, the RFI pad 300 and the mid plate 150 are directly connected, and when either one of the RFI pad 300 and the mid plate 150 is connected to the ground, the other may be connected to the ground. . This will be described in detail with reference to FIGS. 7 to 13.

The shell 400 may include a solder portion 410 extending in a downward direction and mounted on the PCB. The solder portion 410 is mounted on the PCB and connected to ground.

5 is an exploded perspective view of the second insulator 200 illustrated in FIG. 4, and FIG. 6 is an exploded perspective view of the first insulator 100 illustrated in FIG. 5.

Referring to FIG. 5, the second insulator 200 is formed by molding the second contact array 230 and the first insulator 100 inside the second insulator body 210 by insert molding.

In this case, after inserting and fixing the second contact array 230 and the first insulator 100 into the insert molding mold, insert molding may be performed by injecting plastic resin into the insert molding mold.

In addition, referring to FIG. 6, the first insulator 100 is formed by molding the first contact array 130 and the mid plate 150 inside the first insulator body 110 by insert molding. In this case, after inserting and fixing the first contact array 130 and the mid plate 150 in the insert molding mold, insert molding may be performed by injecting plastic resin into the insert molding mold.

FIG. 7(a) is a bottom view of the mid plate 150 according to the first embodiment, and FIG. 7(b) is a bottom view of the second insulator 200 including the mid plate 150 according to the first embodiment. It is. In addition, FIG. 8 is a view showing a coupling relationship between the second insulator 200 and the RFI pad 300 shown in FIG. 7(b), and FIG. 9 is a second insulator 200 shown in FIG. 7(b) ) And the RFI pad 300.

Referring to Figure 7 (a), the mid plate 150 according to the first embodiment includes a coupling protrusion 152, the mid plate 150 is mounted in the second insulator 200, Figure 7 (b) As described above, the engaging projection 152 may be exposed outside the second insulator 200.

The second insulator 200 includes a first area 200a and a first contact array 130 in which slots in which the contact portions 130b and 230b of the first contact array 130 and the second contact array 230 are disposed are provided. And a second region 200b in which the mounting portions 130a and 230a of the second contact array 230 are exposed to the outside, and a third region formed between the first region 200a and the second region 200b ( 200c). Here, the first region 200a and the third region 200c are collectively referred to as a tongue region.

The coupling protrusion 152 of the mid plate 150 may be exposed outside in the third region 200c of the second insulator 200.

Next, referring to FIG. 8 for explaining the coupling relationship between the second insulator 200 and the RFI pad 300, the RFI pad 300 is a separate type, the first sub RFI pad 310 and the second sub RFI pad It may include (330). Coupling grooves 312 and 332 for coupling with the coupling protrusion 152 may be formed in each of the first sub RFI pad 310 and the second sub RFI pad 330.

First, the first coupling groove 312 of the first sub RFI pad 310 may be attached to one surface of the second insulator 200, for example, a lower surface while receiving the coupling protrusion 152. The first coupling groove 312 may be embodied in a concave and convex outer surface structure on the inside facing the coupling protrusion, and according to an embodiment, the first coupling groove 312 may have a through hole shape. Can have 8 shows the first coupling groove 312 of the first sub RFI pad 310 as a concave inward and outwardly convex. When the first coupling groove 312 is a through hole, the coupling protrusion 152 will be exposed to the outside through the through hole.

After the first sub RFI pad 310 is mounted on the second insulator 200, the second coupling groove 332 of the second sub RFI pad 330 is the coupling protrusion 152 or the first coupling groove convex outward While receiving (312) it may be attached to the other surface of the second insulator 200, for example, the upper surface. The second coupling groove 332 may have a shape of a through hole, and depending on the embodiment, the second coupling groove 332 may be embodied as a concave inward and convex outward. 8 shows the second coupling groove 332 of the second sub RFI pad 330 in the form of a through hole.

In addition, as shown in FIG. 8, the second sub RFI pad 330 includes a pad portion 334 attached to the second insulator 200 and a fastening portion 336 formed extending from the pad portion 334. It may be configured, the fastening portion 336 may be inserted into the coupling groove 250 formed on the upper surface of the second region 200b of the second insulator 200.

Next, referring to FIG. 9 for explaining the coupling relationship between the second insulator 200 and the RFI pad 300, the RFI pad 300 is a separate type, the first sub RFI pad 310 and the second sub RFI pad It may include (330). Coupling grooves 312 and 332 for coupling with the coupling protrusion 152 may be formed in each of the first sub RFI pad 310 and the second sub RFI pad 330.

First, the second coupling groove 332 of the second sub RFI pad 330 may be attached to one surface of the second insulator 200, for example, the upper surface while receiving the coupling protrusion 152. The second coupling groove 332 may be embodied in a concave and convex outer surface structure inwardly facing the coupling protrusion, and depending on the embodiment, the second coupling groove 332 may have a through hole shape. Can have 9 shows the second coupling groove 332 of the second sub RFI pad 330 inwardly concave and outwardly convex. When the second coupling groove 332 is a through hole, the coupling protrusion 152 will be exposed to the outside through the through hole.

After the second sub RFI pad 330 is mounted on the second insulator 200, the first coupling groove 312 of the first sub RFI pad 310 is the engaging projection 152 or the second engaging groove convex outward. While receiving 332, it may be attached to the other surface of the second insulator 200, for example, a lower surface. The first coupling groove 312 may have a shape of a through hole, and depending on the embodiment, the first coupling groove 312 may be concave inward and may be embodied in a convex outer surface structure. 9 shows the first coupling groove 312 of the first sub RFI pad 310 in the form of a through hole.

The structure of the mid plate 150 and the RFI pad 300 shown in FIGS. 7, 8 and 9, the RFI pad 300 is connected to the mid plate 150, and the RFI pad 300 is a shell 400 ), for example, a structure for a method that is connected to ground by welding.

That is, in the state in which the mid plate 150 and the RFI pad 300 are connected to each other through the coupling protrusion 152 of the mid plate 150, the upper surface and the shell 400 of the fastening portion 336 of the RFI pad 300 ) May be electrically connected to each other by contacting each other. When the solder portion 410 of the shell 400 is mounted on the PCB and connected to the ground, the RFI pad 300 and the mid plate 150 connected to the shell 400 may also be connected to the ground. The upper surface of the fastening portion 336 and the inner surface of the shell 400 may be electrically connected to each other through welding or soldering. Alternatively, preferably, the upper surface of the fastening portion 336 and the inner surface of the shell 400 may be electrically connected to each other through welding bonding.

On the other hand, depending on the embodiment, the coupling protrusion 152 is not formed in the mid plate 150, instead, the second insulator (2) in such a way that grooves are formed in the third region 200c of the second insulator 200 A portion of the mid plate 150 included in the interior of the 200) may be exposed to the outside. In this case, coupling protrusions corresponding to grooves formed in the third region 200c may be provided in the first sub RFI pad 310 and the second sub RFI pad 330. After one coupling protrusion of the first sub RFI pad 310 and the second sub RFI pad 330 is inserted into the groove formed in the third area 200c, the other coupling protrusion is the third area 200c. By being inserted into the groove formed in, the RFI pad 300 and the mid plate 150 may be electrically connected to each other.

According to the structure of the mid plate 150 according to the first embodiment shown in FIG. 7 (a), there is no need to provide a separate mounting portion for mounting the PCB on the mid plate 150, so manufacturing the receptacle connector 500 During the process, the mounting portion of the mid plate 150 may be deformed or damaged to solve a problem that the process is delayed.

10(a) is a perspective view of the mid plate 1050 according to the second embodiment, and FIG. 10(b) is a perspective view of the receptacle connector 1000 to which the mid plate 1050 according to the second embodiment is applied.

The mid plate 1050 shown in FIG. 10(a) includes a coupling protrusion 1052 as the mid plate 150 of the first embodiment shown in FIG. 7(a), and furthermore, a surface for PCB mounting. A mounting portion 1054 may be further included. Referring to FIG. 10(b), the surface mounting portion 1054 of the mid plate 1050 may be exposed to the outside through the bottom or rear surface of the second insulator 1020 for mounting the Surface Mounter Technology (SMT) with the PCB. .

FIG. 11 is a view showing a coupling relationship between the second insulator 1020 and the RFI pad 1070 shown in FIG. 10(b), and FIG. 12 is a view of the second insulator 1020 shown in FIG. 10(b). It is a figure showing another coupling relationship between the RFI pads 1070.

Referring to FIG. 11, the RFI pad 1070 is a separate type, and may include a first sub RFI pad 1072 and a second sub RFI pad 1074. Coupling grooves 1073 and 1075 for coupling with the coupling protrusion 1052 may be formed in each of the first sub RFI pad 1072 and the second sub RFI pad 1074.

First, the first coupling groove 1073 of the first sub-RFI pad 1072 may be attached to one surface of the second insulator 1020, for example, a lower surface while receiving the coupling protrusion 1052. The first engaging groove 1073 may be embodied as a concave inside and convex outer surface structure facing the engaging protrusion 1052, and the first engaging groove 1073 may pass through according to the embodiment. It can take the form of a ball. 11 shows the first engagement groove 1073 of the first sub RFI pad 1072 in a concave inward and outwardly convex shape. When the first coupling groove 1073 is a through hole, the coupling protrusion 1052 will be exposed to the outside through the through hole.

After the first sub RFI pad 1072 is mounted on the second insulator 1020, the second coupling groove 1075 of the second sub RFI pad 1074 is the engaging projection 1052 or the first engaging groove convex outward. While receiving (1073) it may be attached to the other surface of the second insulator 1020, for example, the upper surface. The second coupling groove 1075 may have a shape of a through hole, and depending on the embodiment, the second coupling groove 1075 may be embodied inward and may be embodied in a convex outer surface structure. 11 shows the second coupling groove 1075 of the second sub RFI pad 1074 in the form of a through hole.

Next, referring to FIG. 12, the RFI pad 1070 is a separate type, and may include a first sub RFI pad 1072 and a second sub RFI pad 1074. Coupling grooves 1073 and 1075 for coupling with the coupling protrusion 1052 may be formed in each of the first sub RFI pad 1072 and the second sub RFI pad 1074.

First, the second coupling groove 1075 of the second sub RFI pad 1074 may be attached to one surface of the second insulator 1020, for example, the upper surface while receiving the coupling protrusion 1052. The second coupling groove 1075 may be embodied in a concave and outwardly convex surface structure on the inside facing the coupling protrusion 1052, and depending on the embodiment, the second coupling groove 1075 may pass through It can take the form of a ball. 12 shows the second engagement groove 1075 of the second sub RFI pad 1074 with a concave inward and convex outward surface structure. When the second coupling groove 1075 is a through hole, the coupling protrusion 1052 will be exposed to the outside through the through hole.

After the second sub RFI pad 1074 is mounted on the second insulator 1020, the first engaging groove 1073 of the first sub RFI pad 1072 is the engaging projection 1052 or the second engaging groove convex outward. While receiving (1075) it may be attached to the other surface of the second insulator 1020, for example, the lower surface. The first coupling groove 1073 may have a form of a through hole, and depending on the embodiment, the first coupling groove 1073 may be concave inward and may be embodied in a convex outer surface structure. 12 shows the first coupling groove 1073 of the first sub RFI pad 1072 in the form of a through hole.

Unlike the second sub RFI pad 330 illustrated in FIGS. 8 and 9, the second sub RFI pad 1074 illustrated in FIGS. 11 and 12 does not include a fastening portion 336. When the mid plate 1050 is independently connected to the ground through the surface mounting portion 1054, the RFI pad 1070 and the shell 400 need not be in contact with each other, so the products shown in FIGS. 8 and 9 are eliminated. The fastening part 336 of the pad part 334 and the fastening part 336 of the 2 sub RFI pad 330 may be omitted. Through this, the thickness of the receptacle connector 1000 can be reduced.

13(a) is a perspective view of the mid plate 1350 according to the third embodiment, and FIG. 13(b) is a perspective view of the receptacle connector 1300 to which the mid plate 1350 according to the third embodiment is applied.

The mid plate 1350 shown in FIG. 13(a) includes a coupling protrusion 1352 as shown in the mid plate 150 shown in FIG. 7(a), and further, a dip solder for PCB mounting ) Portion 1354 may be further included. 13(b), the deep solder part 1354 of the mid plate 1350 may be exposed to the outside through the bottom surface of the second insulator 1320 for PCB mounting.

The coupling relationship between the second insulator 1320 shown in FIG. 13(b) and the RFI pad is the same as that shown in FIGS. 11 and 12. That is, the mid plate 1350 shown in FIG. 13(a) is also used as a structure used to independently connect the mid plate 1350 itself to ground, similar to the mid plate 1050 shown in FIG. 10(a). , The thickness of the receptacle connector 1300 can be reduced.

According to the receptacle connector according to an embodiment of the present invention, by directly connecting the mid plate and the RFI pad, it is possible to employ various types of ground connection methods. In other words, the ground connection method of connecting the RFI pad and the shell can be applied to improve the production utilization rate of the receptacle connector, or the size of the receptacle connector can be reduced by independently connecting the mid plate to the ground.

Although the embodiments of the present invention have been described with reference to the above and the accompanying drawings, those skilled in the art to which the present invention pertains can implement the present invention in other specific forms without changing its technical spirit or essential features. You will understand that there is. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

100: first insulator 110: first insulator body
130: first contact array 130a: mounting unit
130b: contact portion 150, 1050, 1350: mid plate
152, 1052, 1352: engaging projection 200, 1020, 1320: second insulator
200a: first area 200b: second area
200c: third region 210: second insulator body
230: second contact array 230a: mounting unit
230b: contact portion 250: engaging groove
300, 1070: RFI pad 310, 1072: first sub RFI pad
312, 1073: first coupling groove 330, 1074: second sub RFI pad
332, 1075: second engaging groove 334: pad portion
336: fastening part 400: shell
410: solder section
500, 900, 1300: receptacle connector
1054: surface mounting portion 1354: dip solder portion

Claims (15)

delete delete delete delete delete delete delete delete delete An insulator including at least one contact array and a mid plate therein; And
RFI pad attached to the surface of the insulator at the rear of the contact portion of the contact array,
The mid plate is surface mounted on the PCB and connected to ground and includes a coupling protrusion protruding to the outside of the insulator,
The RFI pad is connected to the ground through contact with the engaging projection,
The insulator,
A first area provided with a slot for providing a contact portion with the plug contact array corresponding to the contact array;
A second region formed such that the mounting portion of the contact array is exposed to the outside; And
And a third region formed between the first region and the second region,
The RFI pad
A receptacle connector comprising a pad portion attached to the third region, and not a fastening portion inserted into a coupling groove formed in an upper surface of the second region.
delete delete The method of claim 10,
The RFI pad,
By connecting to the ground, the receptacle connector, characterized in that to improve the EMC performance of the receptacle connector.
The method of claim 10,
The RFI pad,
Receptacle connector, characterized in that to block signal interference between contacts that occur while the signal is transmitted and received through the contact array.
delete

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