KR102093154B1 - Multi-band antenna using outer conductor of non-segmented, and terminal with the same - Google Patents

Abstract

Multi-band antenna according to an embodiment of the present invention, the impedance matching unit having one end and the other end electrically connected to the power supply node of the circuit portion mounted on the substrate; A conductive connection member having one end electrically connected to the other end of the first impedance matching portion and the other end; An outer conductor member disposed to each of the first and second path ends which are different points from the first connection end electrically connected to the other end of the conductive connection member; And conductor frames electrically connected to the first and second path ends of the outer conductor member and the ground portion of the substrate. The outer conductor member includes: a first outer conductor for radiation disposed between the first path end of the outer conductor and the first connecting end; And a second radiation outer conductor formed integrally with the first radiation outer conductor and disposed between the second path end of the outer conductor and the first connection end. It includes.

Description

Multi-band antenna using a non-segmented outer conductor and a terminal including the same {MULTI-BAND ANTENNA USING OUTER CONDUCTOR OF NON-SEGMENTED, AND TERMINAL WITH THE SAME}

The present application relates to a multi-band antenna using a segmented outer conductor in a terminal having an outer conductor, and a terminal thereof.

The popularity of metal designs is gradually increasing in portable terminals such as smartphones. Such a metal design has attracted attention in terms of appearance design and internal robustness of the mobile terminal.

For example, an outer conductor may be used in terms of the exterior design of the terminal, and a conductor frame may be built in in terms of the internal rigidity of the terminal.

Recently, some of the portable terminal manufacturers using a metal design are in the process of research and development to use such an outer conductor as part of an antenna.

For example, in an existing antenna using an outer conductor of a mobile terminal, in order to use the outer conductor as part of the antenna, a gap in which some conductors of the outer conductor exposed to the outside are removed, and a gap is segmented by this gap The end of the outer conductor can be used as an antenna.

However, as the outer conductor is segmented, it has a disadvantage in that it looks poor in appearance and shows low yield in metal processing.

The following prior art documents do not disclose a solution to the above-mentioned conventional technical problem.

Publication of Korean Patent Publication No. 2012-0102517 Korean Patent Publication No. 2014-0119928

One embodiment of the present invention provides a multi-band antenna and a terminal including the multi-band antenna capable of covering the multi-band by using a segmented outer conductor among the outer conductors.

According to an embodiment of the present invention, an impedance matching unit having one end and the other end electrically connected to a feeding node of a circuit unit mounted on a substrate; A conductive connecting member disposed in the non-metallic region of the terminal and having one end and the other end electrically connected to the other end of the first impedance matching unit; An outer conductor member disposed along the outer periphery of the terminal, from the first connecting end electrically connected to the other end of the conductive connecting member to each of the first and second path ends which are different points; And conductor frames electrically connected to the first and second path ends of the outer conductor member and the ground portion of the substrate. The outer conductor member includes: a first outer conductor for radiation disposed between the first path end of the outer conductor and the first connecting end; And a second radiation outer conductor formed integrally with the first radiation outer conductor and disposed between the second path end of the outer conductor and the first connection end. A multi-band antenna comprising a and a terminal comprising the same is proposed.

According to such a multi-band antenna, by allowing the current in the circuit unit to provide different low-frequency current paths and high-frequency current paths through the feed line, the conductive connecting member, and the outer conductor member, there is no outer conductor weight. Multiple bands can be supported by using segmented outer conductors as antenna emitters.

In the solution of the subject, one of several concepts described in the following detailed description is provided. The problem solving means is not intended to identify the core technology or essential technology of the claimed matter, only one of the claimed matter is described, and each of the claimed matter is specifically described in the following detailed description.

According to an embodiment of the present invention, in a terminal having a conductor frame electrically connected to an outer conductor, by implementing an antenna covering a multi-band by using an outer conductor of an unsegmented portion of the outer conductor as an antenna radiator, an outer segment without a segment Since the conductor can be used as the main radiator of the antenna, not only can the antenna performance be improved, but also the metal processing is easy and the yield can be improved.

1 is an external perspective view of a terminal including a multi-band antenna according to an embodiment of the present invention.
2 is a structural conceptual diagram of a multi-band antenna according to an embodiment of the present invention.
3 is a conceptual diagram of an operation of a multi-band antenna according to an embodiment of the present invention.
4A and 4B are exploded perspective views and cross-sectional views of a terminal including a multi-band antenna according to an embodiment of the present invention.
5 (a) and 5 (b) are sectional views of a partially exploded perspective view and a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.
6 is a cross-sectional view of a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.
7 is a cross-sectional view of a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.
8 is a cross-sectional view of a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.
9 is a partially exploded perspective view of a terminal including a multi-band antenna according to an embodiment of the present invention.
10A to 10D are explanatory diagrams of non-metal regions for various metal regions in a terminal according to an embodiment of the present invention.
11 (a) to (f) are exemplary views of a conductive connection member in a terminal according to an embodiment of the present invention.
12 is a perspective view of a conductor frame of a terminal including a multi-band antenna according to an embodiment of the present invention.
13A to 13C are explanatory diagrams of a metal region, a non-metal region, and a segmented portion according to an embodiment of the present invention.
14 (a) to 14 (c) are explanatory diagrams of current flow according to an embodiment of the present invention.
15 is an exemplary view of a connecting structure of a conductive frame and a conductive connecting member of a substrate according to an embodiment of the present invention.
16 is a diagram illustrating the configuration and operation of a multi-band antenna according to an embodiment of the present invention.
17 is an explanatory diagram of the operation and resonance region of the multi-band antenna of FIG. 16.
FIG. 18 is a frequency characteristic diagram of the first impedance matching unit of the multiband antenna of FIG. 16.
19 is a diagram illustrating the configuration and operation of a multi-band antenna according to an embodiment of the present invention.
20 is an exemplary view of a first impedance matching unit IM1 according to an embodiment of the present invention.
21 is an operation explanatory diagram of the multi-band antenna of FIG. 19.
22 is a frequency characteristic diagram of the second impedance matching unit of the multi-band antenna of FIG. 19.
23 is a frequency characteristic diagram of a third impedance matching unit IM3 of the multi-band antenna of FIG. 19.
FIG. 24 is a frequency characteristic diagram when the multi-band antenna of FIG. 19 operates as a PIFA (Planar Inverted-F Antenna) antenna or a loop antenna.
25 is a frequency characteristic diagram for an entire LTE band by a multi-band antenna according to an embodiment of the present invention.
26 is a diagram illustrating an implementation of a first impedance matching unit according to an embodiment of the present invention.
27 is a frequency characteristic diagram of a first impedance matching unit according to an embodiment of the present invention.
28 is an exemplary view of a dense contact conductor line between a substrate and a conductor frame according to an embodiment of the present invention.
29 is an exemplary view of a contact conductor line according to an arrangement structure of a terminal according to an embodiment of the present invention.
30 is an exemplary diagram of a switching device (SWD) for selecting a contact conductor line according to an embodiment of the present invention.
31 is an exemplary view showing an implementation of a contact conductor line according to an embodiment of the present invention.
32 is a diagram illustrating a path of a planar current and a three-dimensional current along a dense contact conductor line according to an embodiment of the present invention.
33 is a diagram illustrating a path of a planar current and a three-dimensional current along each non-uniform contact conductor line according to an embodiment of the present invention.
34 is a view showing resonant frequency characteristics according to via / non-via of a contact conductor line according to an embodiment of the present invention.

In the following, it should be understood that the present invention is not limited to the described embodiments, and can be variously changed without departing from the concept of the present invention.

In addition, in each embodiment of the present invention, the structures, shapes, and numerical values described as one example are only examples to help understanding the technical matters of the present invention, and are not limited thereto. Each of the embodiments of the present invention may be combined with all or part of each other to form a new embodiment of various forms.

In addition, in the drawings referred to the present invention, in view of the overall contents of the present invention, components having substantially the same configuration and function will use the same reference numerals.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

In the multi-band antenna according to an embodiment of the present invention, in a terminal including a substrate and a conductor frame, the one end of the outer conductor of the segment is a circuit part of the substrate through a conductive connection member disposed in a non-metallic region of the inside of the terminal And the other end is connected to the ground part of the substrate through a conductor frame, so that the current in the circuit section flows through the power supply line, the conductive connecting member, the radiation outer conductor and the conductor frame, and the current paths of different low frequency bands and As the current path of the high frequency band is formed, it can operate as a multi-band antenna. This will be described with reference to the drawings.

1 is an external perspective view of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 1, a terminal 10 including a multi-band antenna according to an embodiment of the present invention includes an outer conductor member 203.

At this time, the outer conductor member 203 according to an embodiment of the present invention may be formed integrally with the conductor frame or may be formed independently of the conductor frame and assembled to the terminal. For example, the outer conductor member 203 may or may not be one with the body of the terminal 10.

Here, the outer conductor member 203 according to an embodiment of the present invention may not be segmented at least in a portion functioning as an antenna. Therefore, a segment may be present in a portion that does not function as an antenna.

2 is a structural conceptual diagram of a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 2, the multi-band antenna according to an embodiment of the present invention includes a first impedance matching unit IM1, a conductive connecting member 500, an outer conductor member 203, and a conductor frame 200. .

The first impedance matching unit IM1 includes one end connected to the power supply node FN of the circuit unit 150 mounted on the substrate 100 inside the terminal 10 and the other end connected to the conductive connection member 500. can do. Here, as long as the first impedance matching unit IM1 is disposed inside the terminal, the first impedance matching unit IM1 need not be limited to a specific location, and may be disposed on the substrate 100 as an example.

For example, the first impedance matching unit IM1 may include at least one of a capacitance (capacitive) device, an inductance (inductive) device, and a resistance (resistance) device.

The conductive connection member 500 is disposed in the non-metal region of the terminal 10, and has one end electrically connected to the other end of the first impedance matching unit IM1 and the other end electrically connected to the outer conductor member 203. It can contain.

The outer conductor member 203 of the terminal 10 up to each of the first and second path ends PT1 and PT2 which are different points from the first connecting end CT1 connected to the other end of the conductive connecting member 500. It can be placed along the perimeter.

For example, the outer conductor member 203 may be integrally formed with the conductor frame 200, and may also be manufactured and assembled separately from the conductor frame 200.

As an example, the outer conductor member 203 may include a first outer conductor for radiation 203-1 and a second outer conductor for radiation 203-2.

In this case, the first radiation outer conductor 203-1 provides a first current path between the first path terminal PT1 electrically connected to the conductor frame 200 and the first connection terminal CT1, It functions as a radiator in the first frequency band.

In addition, the second radiation outer conductor 203-2 is formed integrally with the first radiation outer conductor 203-1, and a second path end PT2 electrically connected to the conductor frame 200 and By providing a second current path between the first connection terminal CT1, it functions as a radiator of a second frequency band different from the first frequency band.

For example, the first radiation outer conductor 203-1 and the second radiation outer conductor 203-2 may function as radiators for different frequency bands, so that the first radiation outer conductor 203- 1) may have an electrical length EL2 different from the electrical length EL2 of the second radiation outer conductor 203-2.

Here, each of the first outer conductor for radiation 203-1 and the second outer conductor for radiation 203-2 is made of a non-segmented conductor, and the first outer conductor for radiation 203-1 and the second Radiating outer conductors 203-2 may be integrally formed with each other without segmentation.

The conductive connection member 500 may have an electrical length smaller than the electrical length of each of the first radiation outer conductor 203-1 and the second radiation outer conductor 203-2.

In other words, the first radiating outer conductor 203-1 and the second radiating outer conductor 203-2 may function as the main radiators of the antenna for different frequency bands, respectively. The electrical lengths (EL1 and EL2 of FIG. 3) of the (203-1) and the second radiation outer conductors (203-2) are longer than the electrical lengths of the conductive connecting member 500.

In addition, the conductive connection member 500 may be connected to the first connection end CT1 of the outer conductor member 203 through an electrical connecting structure. As another example, the conductive connection member 500 may be integrally formed with the outer conductor member 203 physically connected to each other.

The conductor frame 200 may be electrically connected to each of the first and second path ends PT1 and PT2 of the outer conductor member 203 and the ground portion GND of the substrate 100. In each embodiment of the present invention, the conductor frame 200 may be a metal cover of the terminal (see FIG. 5), or may be a conductor frame embedded in the terminal (see FIG. 4).

In each embodiment of the present invention, when a conductor frame inside the terminal is used as the conductor frame, a cover may be further included, and at this time, the cover may be a metal cover or a non-metallic cover including conductors at least partially.

In addition, in addition to these, as long as the first and second path ends PT1 and PT2 of the outer conductor member 203 and the ground portion GND of the substrate 100 can be electrically connected, the metal cover or It is not necessary to be limited to the conductor frame.

For example, the conductor frame 200 may include a first conductor region 200-A11 and a second conductor region 200-A12. In this case, the first conductor region 200-A11 is electrically connected to each of the first path end PT1 of the first radiation outer conductor 203-1 and the first ground node GN1 of the circuit unit 150. do. Accordingly, the first conductor region 200-A11 includes the first current path between the first path terminal PT1 of the first radiation-exposed outer conductor 203-1 and the first ground node GN1 of the circuit unit 150 ( PH1).

In addition, the second conductor region 200-A12 is electrically connected to each of the second path end PT2 of the second radiating outer conductor 203-2 and the second ground node GN2 of the circuit unit 150. . Accordingly, the second conductor region 200-A12 is the second current path between the second path terminal PT2 of the second radiation outer conductor 203-2 and the second ground node GN2 of the circuit unit 150. (PH2).

Here, each of the first conductor region 200-A11 and the second conductor region 200-A12 is a region providing first and second current paths PH1 and PH2, but may be a fixed region. As described in the above, it may be a variable region in order to change at least one of the first and second current paths PH1 and PH2.

3 is a conceptual diagram of an operation of a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 3, a multi-band antenna according to an embodiment of the present invention includes a first impedance matching unit IM1, a conductive connecting member 500, an outer conductor member 203, and a conductor frame 200. .

Among the descriptions of the first impedance matching unit IM1, the conductive connection member 500, the outer conductor member 203, and the conductor frame 200 shown in FIG. 3, the same description as that described with reference to FIG. Redundant descriptions may be omitted.

Referring to FIG. 3, the first current path PH1 is a path of current corresponding to the first frequency band, which is a feed node FN of the circuit unit 150, a first impedance matching unit IM1, and conductivity It is formed by the connecting member 500, the first radiation outer conductor 203-1, the first conductor region 200-A11 of the conductor frame 200, and the first ground portion GND1 of the substrate 100. .

In addition, the second current path PH2 is a path of the current corresponding to the second frequency band, which is a feed node FN of the circuit unit 150, a first impedance matching unit IM1, and a conductive connecting member 500 ), The second radiation outer conductor 203-2, the second conductor region 200-A12 of the conductor frame 200, and the second ground portion GND2 of the substrate 100.

In addition, the electrical length of the first current path PH1 is different from the electrical length of the second current path PH2, and accordingly, a multi-band antenna having different bands can be implemented.

Meanwhile, the conductor frame 200 may be, for example, a conductor cover of the terminal 10 (see FIG. 5), and as another example, a conductor frame disposed inside the terminal 10 (see FIG. 4). . As such, the conductor frame 200 need not be specifically limited to a specific component of the terminal, as long as it can be electrically connected to the outer conductor member 203 and the ground portion GND of the substrate 100.

In each embodiment of the present invention, the outer conductor member 203, when assembling the terminal, may have a width sufficient to surround the side of the terminal so that internal components such as a substrate and a display panel are not exposed to the outside. have.

4 to 13, for the sake of brevity, the first impedance matching unit IM1 disposed between the circuit unit 150 and the conductive connecting member 500 is omitted.

4A and 4B are exploded perspective views and cross-sectional views of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIGS. 4A and 4B, the terminal 10 may include a cover 50, a substrate 100, a conductor frame 200, and a display panel 300.

In this case, the terminal employing the multi-band antenna includes a cover 50 and a substrate 100. The substrate 100 may be disposed inside the cover 50 to include a circuit part 150. Here, the circuit unit 150 may include, for example, a central control unit (CPU), a signal processor (ISP), a memory, a communication modem, and an input / output interface to support the functions required by the terminal 10. In addition, the circuit portion 150 is grounded to provide a reference potential for operation is electrically connected to the ground portion of the substrate 100.

For example, the cover 50, the substrate 100, the conductor frame 200, and the display panel 300 may be arranged in order as shown in FIG. 4 (a), but are not limited thereto.

The substrate 100 includes a metal region (conductive region) A1 and a non-metal region (non-conductive region) A2, and at least one circuit portion 150 is disposed in the metal region (conductive region) A1. The conductive connecting member 500 may be disposed in the non-metallic region A2. Here, a ground portion for maintaining a reference potential of the substrate 100 may be disposed in the metal region A1.

Here, in each embodiment of the present invention, the metal region A1 of the substrate 100 is described as a grounding portion, but it is not intended that the entire metal region A1 of the substrate 100 should be a grounding portion.

The conductor frame 200 may be a metal cover or an inner conductor frame. For example, when the conductor frame 200 is an inner conductor frame, the conductor frame 200 includes the substrate 100 of the terminal 10. As a frame for imparting rigidity to the structure, a metal region 201 and a non-metal region 202 may be included. In addition, the conductor frame 200 may be integrally formed with the outer conductor member 203.

For example, the metal region 201 may be partially or entirely made of metal, or all or part of the surface may be made of a metallic material. The non-metallic region 202 may be an empty space (eg, air) from which a part of the metal is removed, or may be made of a non-metallic material such as plastic.

The outer conductor member 203 is a non-segmented outer conductor among outer conductors exposed to the outside of the terminal 10, which may be made of a segment-free conductive material to perform the function of the main radiator of the antenna. At this time, the outer conductor member 203 may be the same as the surface height of the metal region 201 of the conductor frame 200, or may be different from the surface height of the metal region 201.

For example, the outer conductor member 203, as shown in Figure 4 (a), in cooperation with the conductor frame 200, the surface height of the metal region 201 to accommodate the substrate 100 It may include a high step.

The display panel 300 may display information from the circuit unit 150 of the substrate on a screen. Here, the information displayed on the display panel 300 may be information related to the operation of the terminal or / and information selected by the user.

In this case, the other end of the conductive connecting member 500 may be electrically connected to the first connecting end CT1 of the outer conductor member 203, and one end of the conductive connecting member 500 may be provided with the substrate ( It may be connected to the power supply node (FN of FIGS. 2 and 3) of the circuit unit 150 of 100) through a first impedance matching unit (IM1 of FIGS. 2 and 3).

Here, the conductive connection member 500 basically performs a transfer function of transmitting the current (or signal) from the power supply node (FN) of the circuit unit 150 to the outer conductor member 203.

5 (a) and 5 (b) are sectional views of a partially exploded perspective view and a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.

5 (a) and 5 (b), the terminal 10 includes a conductor frame 200A, an outer conductor member 203A, a substrate 100, and a display panel 300 corresponding to a conductor cover. ). At this time, the conductor frame 200A, the substrate 100 and the display panel 300 may be arranged in order as illustrated in FIG. 5A, but are not limited thereto.

In this case, the conductor frame 200A may be formed integrally with the outer conductor member 203A, including the metal region 201A and the non-metal region 202A. At this time, the outer conductor member 203A is disposed on the outer periphery of the conductor frame 200A, which is the conductor cover, and as shown in FIG. 5 (b), the substrate 100 and the display panel 300 are from the outside. It can be formed to wrap.

The metal region 201A may be partially or entirely made of metal, or the surface may be partially or entirely made of a conductive material, and may include at least some conductive material. As described above, the non-metal region 202A may be an empty space (eg, air) from which a part of the metal is removed, or may be made of a non-metal material such as plastic.

The outer conductor member 203A is a segmented outer conductor among the outer conductors exposed to the outside of the terminal 10, which may be made of a segment-free conductive material to perform the function of the main radiator of the antenna. At this time, the outer conductor member 203A may be the same as the surface height of the metal region 201A of the conductor frame 200A, or may be different from the surface height of the metal region 201A.

For example, the outer conductor member 203A, as shown in (a) of FIG. 5, cooperates with the conductor frame 200A, which is the conductor cover, so that the metal region 201A can accommodate the substrate 100. It may include a stepped height higher than the surface height.

On the other hand, in Fig. 5 (b), the fixed object 60 may be made of a non-conductive material such as plastic or a conductive material, for example, it is confirmed that the rigidity of the internal structure of the terminal 10 including the substrate 100 It may be made of a material or shape that can be imparted.

4 and 5, as in a terminal including a multi-band antenna according to an embodiment of the present invention, the arrangement order of the cover, the substrate, the conductor frame and the display panel may be variously combined with each other. It will be described with reference to 6 to 9.

6 is a cross-sectional view of a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 6, the terminal 10 may be arranged and coupled in the order of a non-conductive cover 50, a substrate 100, a conductor frame 200, and a display panel 300. At this time, the outer conductor member 203B may be electrically connected to the conductor frame 200.

For example, referring to FIGS. 5 and 6, the cover 50 may be integrally formed with the outer conductor member 203B, for example, by injection molding of an insert method.

7 is a cross-sectional view of a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 7, the terminal 10 may be arranged and coupled in the order of a non-conductive cover 50, a conductor frame 200, a substrate 100, and a display panel 300. For example, the cover 50 may be integrally formed with the outer conductor member 203 by injection molding or the like of the insert method.

Here, in each embodiment of the present invention, the method for manufacturing the outer conductor member 203 is not particularly limited.

8 is a cross-sectional view of a coupled state of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 8, the terminal 10 may be arranged and coupled in the order of a non-conductive cover 50, a conductor frame 200, a substrate 100, and a display panel 300, for example, the conductor frame The outer conductor member 203 may be integrally formed in the 200.

4 to 8, the outer conductor members 203, 200A, and 200B may be formed integrally with a non-metal or metal cover, or may be formed integrally with the inner conductor frame 200. However, unlike this, the outer conductor member 203, the cover, or the conductor frame may be assembled separately from each other after being separately manufactured.

9 is a partially exploded perspective view of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 9, the terminal may be arranged in the order of the cover 50, the substrate 100, and the conductor frame 200 to be combined.

For example, the outer conductor member 203B may be formed separately from the cover 50 or the conductor frame 200, and may be disposed outside the substrate 100 and the conductor frame 200 and assembled after terminal assembly. have.

In FIG. 9, when the conductor frame 200 is manufactured separately from the outer conductor member 203B, it is shown that, for example, the metal region 201 may be included and the non-metal region may not be included.

As described above, in the terminal according to the embodiment of the present invention, the conductive connection member 500 may be disposed in the non-metallic region A2 of the substrate 100, or a different layer from the substrate 100 It can be placed in a component. For example, the conductive connection member 500 may be disposed on the cover 50 or the conductor frame 200 disposed on a different layer from the substrate 100.

In this way, as long as the conductive connecting member 500 is disposed inside the terminal 10 in a non-metallic region A2 that does not contain a conductive material, or at least in a position overlapping with the non-metallic region A2, the The position to be placed need not be limited to a particular layer or member or component.

10A to 10D are explanatory diagrams of non-metal regions for various metal regions in a terminal according to an embodiment of the present invention.

10 (a) shows a structure in which the outer conductor member 203 can be integrally formed on the conductor frame 200 in a structure in which the substrate 100 and the conductor frame 200 are vertically disposed.

10 (b) shows a structure in which the outer conductor member 203B is separately manufactured and disposed and assembled in a structure arranged in the order of the cover 50, the substrate 100, and the conductor frame 200.

10 (c) is a structure in which the conductive frame 200A and the substrate 100, which are conductive covers, are disposed vertically, the outer conductor member 203A can be formed integrally with the conductor frame 200A. Is showing.

At this time, the conductor frame 200A may include a metal region 201A and a non-metal region 202A.

10 (a), 10 (b), and 10 (c) as described above, in each embodiment of the present invention, the conductive region A1 of the substrate 100 is a conductor frame 200 or 200A or an outer conductor. In the case of being electrically connected to the members 203, 200A or 200B, the metal region shown in Fig. 10D is a plurality of conductive materials that can be electrically connected, for example, a fixture that secures a terminal, It may be modeled as a region including both a conductive portion of the conductor frame 200 and the outer conductor member 203 and a conductive portion of the substrate.

The metal region (or conductive region) in all embodiments of the present invention includes all conductive portions such as a conductor frame or an outer conductor member electrically connected to the metal region of the substrate, as shown in FIG. 10 (d). It can be interpreted as a domain.

Here, a region made of a non-metal other than the metal region of the terminal is called a non-metal region.

Meanwhile, the conductive connection member 500 according to an embodiment of the present invention may be formed in at least one pattern. For example, the conductive connection member 500 may be made of one conductive connection member or two or more conductive connection members.

In addition, the conductive connection member 500 is not particularly limited to a specific shape as long as it can transmit a signal or current from the circuit unit 150 to the outer conductor member 203. Some examples of the conductive connection member 500 having various shapes will be described with reference to FIG. 11.

11 (a) to (f) are exemplary views of a conductive connection member in a terminal according to an embodiment of the present invention.

11A shows a conductive connection member 500 including first and second conductive connection members 510 and 520 that are physically separated from each other. Each of the first and second conductive connection members 510 and 520 illustrated in FIG. 11A may be commonly connected to one power supply line and connected to a circuit unit, and each of the first and second conductive connection members 510 and 520 may be The other end may be connected to the first and second connecting ends CT1 and CT2 which are different points of the outer conductor member.

In this case, the current path can be made by the conductive connecting members 510,520, so that the cover band of the antenna can be changed by the conductive connecting members 510,520.

11B illustrates the conductive connection member 500 and the ground pattern 400. The conductive connection member 500 may have one end connected to the power supply line of the circuit unit, and the other end connected to the first connection end CT1 of the outer conductor member. The ground pattern 400 is formed of a conductive pattern disposed adjacent to the conductive connection member 500, one end of which is connected to the ground portion of the substrate, and the other end of which is connected to the second connection end CT2 of the outer conductor member. You can.

In addition, the conductive connection member 500 and the ground pattern 400 is, for example, as shown in Figure 11 (b), the conductive connection member 500 and the ground pattern 400 is an example of capacitance coupling and They can be arranged adjacent to each other to form the same electromagnetic coupling. Alternatively, as another example, they may be directly connected to each other electrically through conductive wires.

As described above, when the ground pattern 400 is added, the impedance on the current path can be changed, so that the cover band of the antenna can be changed.

11 (c) shows the conductive connecting member 500 having one branch member. The conductive connection member 500 shown in FIG. 11 (c) may have one end connected to the power supply line of the circuit part, and the other end connected to the first connection end CT1 of the outer conductor member. In addition, the brunch member 501 between one end and the other end of the conductive connection member 500 may be connected to the ground portion of the substrate.

11 (d) shows a conductive connection member 500 (eg, an 'h' shape) that may include three terminals. In the conductive connection member 500 shown in (d) of FIG. 11, one terminal is connected to the circuit unit through one feeding line, and the other two terminals are first and second connection terminals, which are different points of the outer conductor member. (CT1, CT2) can be connected to each.

In this case, as the current path is diversified or the impedance on the current path is changed, the cover band may be diversified as necessary. This description can be applied to each embodiment of the present invention.

11 (e) shows a conductive connecting member 500 made of a polygonal (eg, rectangular) conductive member. The conductive connection member 500 shown in (e) of FIG. 11 may be connected to the circuit unit through one feeding line, and two different points, first and second connections, which are different points of the outer conductor member It can be connected to the terminal (CT1, CT2).

FIG. 11F shows a polygonal conductive connecting member 500 having slits formed therein.

Referring to (f) of FIG. 11, the conductive connecting member 500 may include a slit in which the conductive member is removed inside the polygonal conductive member. The conductive connection member 500 shown in (f) of FIG. 11 may be connected to the circuit part through a feeding line at one point, and two different points, first and second connecting ends, which are different points of the outer conductor member ( CT1, CT2).

In this case, since the current paths may be different from each other, the cover band of the antenna may be diversified.

12 is a perspective view of a conductor frame of a terminal including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 12, a conductive connecting member 500A is disposed on the same layer as the conductor frame 200 in an air space that is a non-metallic region 202 of the conductor frame 200 disposed between the cover and the display of the terminal, It may be integrally formed with the outer conductor member 203 of the conductor frame 200.

Here, one end of the conductive connecting member 500A is electrically connected to a circuit portion of the substrate 100 through a power supply line, and the other end of the conductive connecting member 500A can be electrically connected to the outer conductor member 203. have.

On the other hand, in the outer conductor member 203 according to an embodiment of the present invention, at least a segment is not formed in a portion functioning as an antenna, and a segment is present in a portion of the outer conductor member 203 not functioning as an antenna. It is also possible, and will be described with reference to FIG. 13.

13A to 13C are explanatory diagrams of a metal region, a non-metal region, and a segmented portion according to an embodiment of the present invention.

13 (a) shows a structure in which the entire outer conductor member is not segmented, including the outer conductor member 203 to which the conductive connecting member 500 is connected according to an embodiment of the present invention.

13 (b) shows a structure in which the outer conductor member 203 to which the conductive connection member 500 is connected according to an embodiment of the present invention functions as an antenna is not segmented, and an embodiment of the present invention According to an example, a structure in which a segment portion exists in one of the outer conductor members not functioning as an antenna is shown.

13 (c) shows a structure in which the outer conductor member 203 to which the conductive connecting member 500 is connected according to an embodiment of the present invention functions as an antenna is not segmented, and an embodiment of the present invention According to an example, a structure in which segment portions exist in two of the outer conductor members that do not function as an antenna is shown.

13 (a), (b) and (c), regardless of the conductive connecting member 500, a non-metallic region may additionally exist, and the outer conductor located around the additionally-existing non-metallic region If the member does not function as an antenna, it is possible to include a segmented portion. At least there is no segment in the outer conductor member of the entire outer conductor member that is connected to the conductive connecting member and functions as an antenna.

The outer conductor member which does not function as an antenna according to an embodiment of the present invention is independent of the presence of a segment, but according to an embodiment of the present invention, since the outer conductor member can be used for the antenna function in a segment-free state, the entire A non-segmented outer conductor member can be used. Accordingly, when an outer conductor member having no segment is used as a whole, it is possible to provide a number of advantages in aesthetics and production.

Meanwhile, in FIGS. 4 to 11 and 13, the first impedance matching unit IM1 disposed between the circuit unit 150 and the conductive connection member 500 is omitted, but illustrated in FIGS. 2 and 3 As described above, the first impedance matching unit IM1 may be disposed at a portion where the circuit unit 150 and the conductive connection member 500 are electrically connected to each other.

In addition, the conductive connecting member 500 and the outer conductor member 203, the conductive connecting member 500 and the ground portion of the substrate, the ground pattern 400 and the ground portion of the substrate, and the ground pattern 400 and the outer conductor member Each of 203 may be directly electrically connected to each other, or may be connected through an additional impedance matching unit.

At this time, the impedance matching unit including the first impedance matching unit IM1 may include at least one of a capacitance device, an inductance device, and a resistance device, particularly when a capacitance device is used for the first impedance matching unit IM1 Antenna efficiency can be improved.

14 (a) to 14 (c) are explanatory diagrams of current flow according to an embodiment of the present invention.

14 (a) shows a sinusoidal signal as an example of an input signal for explaining the flow of current. 14 (b) shows the current path for the positive (+) phase of the input signal. 14 (c) shows the current path for the negative (-) phase of the input signal.

For example, referring to (a) and (b) of FIG. 14, the current of the + phase includes: a circuit portion, a power supply line, a first impedance matching portion, a conductive connection member, and a first connection terminal of the outer conductor member 203 ( After CT1), it is branched in the left and right directions on the drawing, passing through each of the first radiation outer conductor 203-1 and the second radiation outer conductor 203-2 of the outer conductor member 203 to the ground portion of the substrate. Flows. Also, referring to FIG. 14 (c), the -phase current is reversed.

The first current flow (current flow to the left) of the + phase current according to each embodiment of the present invention (PH1) is a circuit part, a power supply line, a first impedance matching part, a conductive connection member, an outer conductor member 203 The first connection end CT1 and the first radiation outer conductor 203-1 of the outer conductor member 203 are successively formed to form a ground portion of the substrate.

In addition, the second current flow (current flow to the right) PH2 of the current of the + phase is a circuit part, a power supply line, a first impedance matching part, a conductive connection member, and a first connection terminal CT1 of the outer conductor member 203 ), The second conductor of the outer conductor 203-2 of the outer conductor member 203 is successively formed to form a ground portion of the substrate.

And, as shown in Fig. 14 (c), the current of the-phase flows in the opposite direction to the current of the + phase described above.

In addition, each of the first outer peripheral conductor 203-1 and the second outer peripheral conductor 203-2 is formed without segmentation, and the first outer peripheral conductor 203-1 and the second outer radiation The outer conductors 203-2 are integrally formed with each other, and there is no segment therebetween. Here, as described above, the segment means a section in which the conductive material is not continuous but discontinuous, and for example, may be made of a non-metallic material such as air or plastic.

In addition, each of the first radiation outer conductor 203-1 and the second radiation outer conductor 203-2 may function as a main radiator of an antenna for forming different resonance bands. Here, the different resonant bands are not necessarily limited to a specific frequency unless they are identical to each other, for example, a low frequency band lower than 1 GHz and a high frequency band higher than 1 GHz.

When the conductive connecting member 500 disposed on the substrate 100 is not formed integrally with the conductor frame 200, the conductive connecting member 500 may be provided with the outer conductor member through another electrical connecting structure. 203), an example of which will be described with reference to FIG. 15.

15 is an exemplary view of a connecting structure of a conductive frame and a conductive connecting member of a substrate according to an embodiment of the present invention.

Referring to (a) of FIG. 15, the connecting structure of the conductive connecting member 500 and the conductor frame 200 disposed in the non-metal region (A2 in FIG. 4) of the substrate 100 includes a via hole TH and a contact portion ( CA) and clips (CLP).

The via hole TH is a conductive hole penetrating the upper and lower surfaces of the substrate 100, and is electrically connected to the conductive connecting member 500 formed in the non-metal region (A2 in FIG. 4) of the substrate 100, and the substrate 100 As it is electrically connected to the conductive contact portion CA formed on the other surface of the, the conductive connection member 500 and the conductive contact portion CA are electrically connected.

The conductive contact CA may be electrically connected to the conductor frame 200 through a conductive clip CLP.

FIG. 15 (b) is a view of a case where the conductive connecting member 500 and the conductor frame 200 have different heights of surfaces for electrical connection, and FIG. 15 (c) shows the conductive connecting member 500. ) And the conductor frame 200 are for the case where the heights of the surfaces for electrical connection are the same or similar to each other.

15 (b) and (c), the connecting structure of the conductive connecting member 500 of the substrate and the conductor frame 200 may include a screw SR and a conductive plate MP. The conductive connecting member 500 and the conductor frame 200 formed in the non-metallic region of the substrate 100 (A2 in FIG. 4), regardless of the height of the surface for electrical connection, screws SR and conductive plates MP ), It can be electrically connected to each other.

The description with reference to FIG. 15 is only one example among various connecting structures for electrically connecting the conductive connecting member 500 and the conductor frame 200.

16 is a diagram illustrating the configuration and operation of a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 16, as shown in FIG. 16, the conductive connection member 500 may be disposed in some areas of the terminal so as not to overlap with the display area of the display panel (300 of FIG. 5). Here, the non-metal region 202 of the conductor frame 200 may be an empty space (eg, air) from which a part of the metal is removed, as described above, and made of a non-metal material such as plastic or other solid dielectric material. It might be.

For example, as long as the non-metallic region 202 provides a radiation space through the conductive connection member 500, the shape of the non-metallic region 202 is not particularly limited. As an example, it may be a quadrangular shape, a curved shape, a number of at least one, or a plurality of straight line segments.

In the drawings showing each embodiment of the present invention, each example of the non-metallic region 202 is shown, but is not limited thereto.

Referring to FIG. 16, the conductive connection member 500 may be connected to the circuit unit 150 of the substrate 100 through a capacitance device C10 corresponding to an example of the first impedance matching unit, as illustrated in FIG. 15. Through the same connecting structure, it may be electrically connected to the connection end CT1 of the outer conductor member 203 of the conductor frame 200.

The circuit unit 150 of the substrate 100 may be electrically connected to the outer conductor member 203 of the conductor frame 200 through the capacitance device C10 and the conductive connection member 500. In addition, the metal region A1 of the substrate 100 may be electrically connected to the metal region (201 of FIG. 4) of the conductor frame 200. Here, the electric connection means between the metal region A1 of the substrate 100 and the metal region 201 of the conductor frame 200 is not particularly limited as long as it is a means capable of electrically connecting. This will be described with reference to FIGS. 28 to 34.

For example, referring to FIGS. 14 and 16, currents from the circuit unit 150 of the substrate 100 include a feeding line, a first impedance matching unit IM1, a conductive connecting member 500, and a first radiation outer periphery. The first current path PH1 flowing through the conductor 203-1 to the ground portion of the substrate 100 may be formed. In addition, the current coming from the circuit portion 150 of the substrate 100 to the ground portion of the substrate through the feed line, the first impedance matching portion (IM1), the conductive connecting member 500 and the second radiation outer conductor (203-2) A flowing second current path PH2 may be formed.

Here, the first current path PH1 may be a current path in a high frequency band, and the second current path PH2 may be a current path in a low frequency band.

At this time, the position where the conductive connection member 500 is electrically connected to the outer conductor member 203 may be changed according to a frequency band used for selecting a resonance frequency.

The conductive connection member 500 may be electrically connected directly to the outer conductor member 203 or the metal region A1 of the substrate 100 or the metal region 201 of the conductor frame 200, or an impedance device. In this case, the band of the covered antenna may be changed according to the impedance value of the impedance device.

17 is an explanatory diagram of the operation and resonance region of the multi-band antenna of FIG. 16.

17 is a view for explaining the operation and resonance region of the series feed-type coupling antenna applied to FIG.

As illustrated in FIG. 17, when a capacitance device (eg, a capacitor element) is applied to the first impedance matching unit IM1 to form a capacitance coupling, it may operate as a serial feed-type coupling antenna. Through the capacitance coupling, a conductive path in the shape of a loop as shown in FIG. 17 can be formed.

Here, the first impedance matching unit IM1 connected to the power supply line (+) of the circuit unit may be implemented as a capacitance device (eg, a capacitor). Alternatively, instead of the capacitance device, if necessary, the first impedance matching unit IM1 may be implemented as a discrete element such as an inductance device (eg, an inductor) or a resistor.

Alternatively, the first impedance matching unit IM1 may include at least one of a capacitance element, an inductance element, and a resistor, or a combination of the elements.

In FIGS. 16 and 17, the direction of the current flow is indicated by the flow in the + phase, and in FIGS. 16 and 17, when the electric length corresponding to the length of the current flow is described, the right part having a long electrical length is A low frequency resonance fL may be formed, and a high frequency resonance fH may be formed in a left portion having a short electrical length.

An inductance element may be used in place of a capacitance element in the first impedance matching portion connected to the power supply line, and in this case, a resonance may be formed different from that of a coupling antenna by becoming a loop antenna rather than a coupling antenna.

FIG. 18 is a frequency characteristic diagram of the first impedance matching unit of the multiband antenna of FIG. 16.

FIG. 18 is a plot of frequency versus standing-wave-ratio (SWR) showing the influence of the multi-band antennas of FIGS. 16 and 17 by the first impedance matching unit IM1.

Referring to FIG. 18, the first impedance matching unit (IM1 in FIG. 2) is a frequency characteristic diagram for an example in which a low-capacitance element is used. Here, the first impedance matching unit may be an impedance device by at least one of elements, patterns, electrodes, circuits, and metal members capable of providing impedance, and the impedance device is limited to a specific component as long as it can provide impedance. Does not work.

Referring to FIG. 18, according to the length of the loop of the current flow described above, a low frequency resonance having a long electrical loop length and a high frequency resonance having a short electrical loop length may be formed. In addition, 50 ohm matching may be performed using antenna resonance according to the coupling amount of the first impedance matching unit IM1. In this case, as shown in FIG. 18, better low-frequency resonance characteristics can be obtained.

On the other hand, the conductive connection member 500 and the outer conductor member 203, the conductive connection member 500 and the ground portion of the substrate 100, the ground pattern 400 and the ground portion of the substrate 100, and the ground pattern 400 ) And each of the outer conductor members 203 may be directly electrically connected to each other, or may be connected through an additional impedance matching unit. This will be described with reference to FIGS. 19 and 20.

19 is a diagram illustrating the configuration and operation of a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 19, the multi-band antenna, the multi-band antenna according to each embodiment of the present invention described above, the first impedance matching unit (IM1), the second impedance matching unit (IM2) and the third impedance matching unit An impedance matching unit of at least one of (IM3) may be further included.

Here, the first impedance matching unit IM1 may be included in a power supply line between the circuit unit and the conductive connection member 500. The second impedance matching unit IM2 may be included between the conductive connecting member 500 and the outer conductor member 203. In addition, the third impedance matching unit IM3 may be included between a point between both ends of the conductive connection member 500 and the ground portion of the substrate 100.

In this case, FIG. 19 shows an example including all of the first impedance matching unit IM1, the second impedance matching unit IM2, and the third impedance matching unit IM3, but this is only an example, and thus is limited to this. Does not work.

In addition, each of the first impedance matching unit IM1, the second impedance matching unit IM2, and the third impedance matching unit IM3 may have a fixed fixed impedance matching unit or variable impedance to have a predetermined impedance. It can be a variable impedance matching unit.

For example, the fixed impedance matching unit may be implemented by at least one impedance element capable of providing a predetermined impedance. For example, the impedance element may be a passive element such as a capacitor, an inductor, and a resistor.

For example, the variable impedance matching unit may include a variable impedance element such as a varactor diode, and may include a variable impedance circuit that changes impedance using a switch element, and a variable impedance element and a variable impedance circuit. It may include all.

When the fixed impedance matching unit or the variable impedance matching unit includes at least two elements, it may be formed of a combination of various series-parallel circuits.

In addition, when each of the first impedance matching unit IM1, the second impedance matching unit IM2, and the third impedance matching unit IM3 includes a fixed element, a variable element may be further included. The impedance can be varied.

In this way, the cover band of the antenna may be variously changed through at least one impedance variable among the first, second, and third impedance matching units IM3, IM1, IM2, and IM3, and eventually one embodiment of the present invention The LTE full band may be covered by the multi-band antenna according to an example.

20 is an exemplary view of a first impedance matching unit IM1 according to an embodiment of the present invention.

20A is an example in which the first impedance matching unit IM1 is implemented as a fixed impedance matching unit including a fixed capacitance device C10.

20B is an example in which the first impedance matching unit IM1 is implemented as a variable impedance matching unit including a variable coupling element or circuit C20. At this time, the capacitance of the first impedance matching unit IM1 may be changed according to the control voltage SC.

20 (c), the first impedance matching unit IM1 is implemented as a fixed capacitance element C11 and a variable impedance matching portion including a varactor diode CV in parallel to the fixed capacitance element C11. Yes. At this time, C12 and C13 may be DC blocking capacitors, SC is a control voltage (SC) for controlling the capacity of the varactor diode (CV), R11 is a resistor that provides a ground path of the control voltage (SC) to be.

20 (d), the first impedance matching unit IM1 is implemented as a variable impedance matching unit including a fixed capacitance element C11 and a switched impedance circuit in parallel to the fixed capacitance element C11. Yes. Here, the switched impedance circuit may include a switch SW1 and a capacitor C12 connected in series with each other, and / or a switch SW2 and an inductor L11 connected in series with each other.

In this way, (a), (b), (c), and (d) of FIG. 20, the first impedance matching unit IM1 may be variously implemented using a fixed impedance device, a variable impedance device, a switch, and the like. This is only an example, and is not limited thereto.

Meanwhile, when the first impedance matching unit IM1 includes a fixed capacitance element C11 such as a capacitor, the fixed capacitance element may be mainly used for 50 ohm matching through a low capacitive element. The resonance characteristics may be improved as shown in FIG. 18 by 50 ohm matching.

The switched impedance circuit may include a plurality of switches and a plurality of passive elements (R element, L element, C element).

In the above description, an example of the implementation of the first impedance matching unit IM1 has been described, but the above description may be applied to the second and third impedance matching units IM2 and IM3 as it is. As described above, in an embodiment of the present invention, a portion describing the first impedance matching unit IM1 may be applied to the second and third impedance matching units IM2 and IM3 unless otherwise specified.

21 is an operation explanatory diagram of the multiband antenna of FIG. 19, and FIG. 22 is a frequency characteristic diagram of the second impedance matching unit of the multiband antenna of FIG.

21 and 22, the first impedance matching unit IM1 of FIG. 21 serves to match unmatched resonances as illustrated in FIG. 21.

When the first impedance matching unit IM1 includes a high capacitive element or an inductive element, it may operate as a planar inverted-F antenna (PIFA) or a loop antenna instead of a coupling antenna.

In addition, referring to FIGS. 21 and 22, the first impedance matching unit IM1 may serve to match unmatched resonance, but has difficulty in moving resonance.

As illustrated in FIG. 22, when the second impedance matching unit IM2 is used, a length characteristic of a loop of a current flow can be changed, and the second impedance matching unit IM2 includes an inductive element The length of the loop can be increased and, conversely, when a capacitive element is used, the length of the loop can be made relatively short. Accordingly, resonant movement is possible at low and high frequencies.

23 is a frequency characteristic diagram of a third impedance matching unit IM3 of the multi-band antenna of FIG. 19.

Referring to FIGS. 22 and 23, when the second impedance matching unit IM2 is used, there is a limitation in resonance movement, and the third impedance matching unit IM3 may be used to transmit the signal to a lower frequency or a higher frequency.

Referring to the graph G12 of FIG. 23, the lunch graph shifted to the left and the one-dot chain graph shifted to the right, when the third impedance matching unit IM3 is implemented as a capacitive element, resonance movement is performed at a low frequency. It can be, and if implemented as an inductive element, it is possible to move the resonance at a higher frequency.

Here, the resonant movement using the capacitive element and the inductive element is a change in general conditions and can be changed according to various ambient conditions.

24 is a frequency characteristic diagram when the multi-band antenna of FIG. 19 is operated as a PIFA antenna or a loop antenna.

Referring to FIG. 24, as an example, a frequency characteristic diagram of an antenna for a case where the first impedance matching unit IM1 does not include a low-capacitance element and includes a high-capacitance element or a resistance and inductive element.

Referring to FIG. 24, as an example, when the antenna does not form a capacitance coupling, it may operate as a PIFA or loop antenna. In this case, the standing wave ratio characteristic may be shown as the graph G13 shown in FIG. 24, which is also an antenna characteristic under general conditions and may vary according to conditions.

25 is a frequency characteristic diagram for an entire LTE band by a multi-band antenna according to an embodiment of the present invention.

In FIG. 25, the graph G12 of FIG. 23 and the graph G13 of FIG. 24 are shown together. Referring to FIG. 25, the above-described first, second and third impedance matching units IM3 (IM1, IM2, and IM3), a conductive connecting member, an outer conductor member, and a metal region of a substrate connected to the outer conductor member, etc. By using, it can be seen that the entire LTE band can be covered.

For example, the combination of the first impedance matching unit IM1 and the second impedance matching unit IM2 is 824 to 960 [MHz] (center frequency fL), 1710 to 2170 [MHz] (center frequency fM), and 2300 to 2690 [MHz] (center frequency fH) may be satisfied, and a third impedance matching unit (IM3) may be added to cover 703 to 803 [MHz]. Of course, it can be covered in many different combinations.

26 is a diagram illustrating an implementation of a first impedance matching unit according to an embodiment of the present invention.

26A shows an example in which the first impedance matching unit IM1 includes a fixed capacitance device C10. For example, the fixed capacitance device C10 may be a capacitor.

26B, the first impedance matching unit IM1 can provide a fixed capacitance using two conductive members without using the fixed capacitance device C10.

Referring to FIG. 26B, a conductive connection terminal CCT1 may be formed adjacent to an end 500T1 of the conductive connection member 500. At this time, the end 500T1 of the conductive connection member 500 and the conductive connection terminal CCT1 are shown as an example of forming a capacitance coupling as they are disposed adjacent to each other.

26 (c), the first impedance matching portion IM1 has a larger area than the end portion 500T2 of the conductive connection member 500 and FIG. 26 (b), and the end portion of the conductive connection member 500 The conductive connection terminal CCT2 forming the capacitance coupling with 500T2) may also include a larger area than the conductive connection terminal CCT2 shown in FIG. 26B.

In this case, an example of forming a large capacitance coupling by coupling a relatively large area is shown.

27 is a frequency characteristic diagram of a first impedance matching unit according to an embodiment of the present invention.

27 (a) shows an example in which the first impedance matching unit IM1 includes a fixed capacitance device C10.

FIG. 27B is a graph showing a resonance band that can be formed when the first impedance matching unit IM1 is implemented as a fixed capacitance device C10, and the first impedance matching unit IM1 is a fixed capacitance device. When implemented in (C10), the low frequency band fL of 1 GHz or less has a low frequency resonance as in G11 (RP11) and a resonance corresponding to a multiplication frequency of the basic resonance frequency as in G11 (RP12).

At the same time, in the high frequency band fH of 1 GHz or more, high frequency resonance as in G12, and above the basic resonance frequency of G12, may have resonance corresponding to a multiplication frequency (not shown). Here, the fixed capacitance device C10 may be, for example, a low capacitive element of 10 pF or less.

In addition, FIG. 27C shows an example in which the first impedance matching unit IM1 includes the fixed inductance element L10.

27D is a graph showing a resonance band that can be formed when the first impedance matching unit IM1 is implemented as a fixed inductance element L10, and the first impedance matching unit IM1 is a fixed inductance element When implemented in (L10), as in G13, it may have a medium to high frequency resonance of 1 GHz or more.

On the other hand, when the terminal according to each embodiment of the present invention includes a conductor frame 200 and a substrate, the metal region 201 of the conductor frame 200 and the metal region A1 of the substrate 100 It may include a plurality of contact conductor line (CM) for electrically connecting. This will be described with reference to FIGS. 28 and 34.

28 is an exemplary view of a dense contact conductor line between a substrate and a conductor frame according to an embodiment of the present invention.

Referring to FIG. 28, the metal region A1 of the substrate 100 and the metal region 201 of the conductor frame 200 according to an embodiment of the present invention are electrically formed by a densely formed contact conductor line CM. Can be connected. Here, the contact conductor line CM is a means for electrically connecting the ground portion of the substrate 100 (for example, a metal region) and other conductors (for example, a conductor frame or / and an outer conductor member) other than the substrate. it means.

The example shown in FIG. 28 is only an example in which the contact conductor lines CM are uniformly and densely formed, and the more such densely formed contact conductor lines are, the more the metal region A1 and the conductor frame 200 of the substrate 100 are formed. The metal regions 201 may be modeled electrically as one conductive connecting member.

For example, a dense contact conductor line may mean that the spacing of the contact conductor lines is shorter than the wavelength of the band frequency used.

29 is an exemplary view of a contact conductor line according to an arrangement structure of a terminal according to an embodiment of the present invention.

29 (a) is an exemplary view of a contact conductor line for a structure in which the substrate 100 and the conductor frame 200 are disposed vertically. Referring to (a) of FIG. 29, the metal region A1 of the substrate 100 and the metal region 201 of the conductor frame 200 may be electrically connected by a plurality of contact conductor lines.

FIG. 29B is an exemplary view of a contact conductor line for a structure in which the conductor frame 200A, which is a metal cover, and the substrate 100 are disposed vertically.

Referring to (b) of FIG. 29, the conductor frame 200A, which is a conductor cover in which the outer conductor 203A is integrally formed, and the metal region A1 of the substrate 100 may be electrically connected by a plurality of contact conductor lines. have.

29 (c) is an exemplary view of a contact conductor line for a structure in which the cover 50, the substrate 100, and the conductor frame 200 are sequentially arranged, and have a separate outer conductor member 203B.

Referring to FIG. 29 (c), the metal region of the substrate 100, the conductor frame 200, and the outer conductor member 203B may be electrically connected by a plurality of contact conductor lines.

Referring to (a), (b) and (c) of FIG. 29, since the contact conductor line can provide a current path, the metal area A1 of the substrate 100 and the metal area of the conductor frame 200 ( 201) and the outer conductor member (203 or 203A or 203B) may change the resonance according to the electrical connection position.

In addition, the terminal according to each embodiment of the present invention selects or deselects some of the contact conductor lines among the plurality of contact conductor lines between the metal region (eg, the ground portion) of the substrate 100 and the conductor frame 200. It may include a switching device (SWD in FIG. 30) for.

For example, the switching device SWD may include at least one switch for selecting at least one of a plurality of contact conductor lines between the metal region A1 of the substrate 100 and the conductor frame 200. .

30 is an exemplary diagram of a switching device (SWD) for selecting a contact conductor line according to an embodiment of the present invention.

Referring to FIG. 30, a terminal according to an exemplary embodiment of the present invention may include, for example, the first, second, and third terminals between the metal region A1 of the substrate 100 and the conductor frame 200. When the contact conductor lines CM1, CM2, and CM3 are included, the switching device SWD includes first, second, and third contacts between the metal region A1 of the substrate 100 and the conductor frame 200. The first, second, and third switches SW11, SW12, and SW13 for selecting the conductor lines CM1, CM2, and CM3 may be included.

Here, one end of each of the first, second, and third contact conductor lines CM1, CM2, and CM3 may be connected to the first, second, and second contact points P21, P22, and P23 of the conductor frame 200. Each of the other ends may be connected to the first, second, and second contact points P11, P12, and P13 of the substrate 100.

The first switch SW11 may be disposed between the first contact point P11 of the substrate 100 and the first ground portion GND11, and the second switch SW12 of the substrate 100 It may be disposed between the second contact point (P12) and the second ground (GND12), the third switch (SW13) is the third contact point (P13) and the third ground (GND13) of the substrate 100 ).

As the first, second, and third switches SW11, SW12, and SW13 are turned on or off, specific contacts among the first, second, and third contact conductor lines CM1, CM2, and CM3 Conductor lines can be selected or unselected.

Here, the arrangement positions of the first, second, and third switches SW12, SW12, and SW13 need not be particularly limited as long as the contact conductor line can be selected, for example, may be disposed on the substrate 100. .

As described above, the switch of FIG. 30 may be applied to all of the plurality of contact conductor lines, or alternatively, may be applied to some of the plurality of contact conductor lines.

As described above, in the terminal according to an embodiment of the present invention, the impedance is varied through the impedance matching unit, or the antenna resonance is variously changed by connecting (on) or shorting (off) the contact conductor line through a switch. Can be.

The contact conductor lines in FIGS. 28 to 30 are examples, and the position and number of the conductor lines are not particularly limited.

31 is an exemplary view showing an implementation of a contact conductor line according to an embodiment of the present invention. 31A and 31B are views showing the structure of a contact conductor line using a conductor C clip (CLP2) and a screw (SR2).

Referring to (a) of FIG. 31, the metal region A1 of the substrate 100 and the metal region A1 of the conductor frame 200 may be electrically connected by a conductor C clip CLP2, or a screw ( The metal region A1 of the substrate 100 and the metal region 201 of the conductor frame 200 may be directly electrically connected by SR2). This is described in more detail below.

The first view from the top of FIG. 31B is a conductive contact CA2 formed on the other surface of the substrate 100 through the conductive via hole TH2 in which the metal region A1 of the substrate 100 is formed in the substrate 100. ), And the conductive contact CA2 may be electrically connected to the conductor frame 200 through the conductor C-clip CLP2.

The second view from the top of FIG. 31 (b) shows an example in which the substrate 100 and the conductor frame 200 have different heights of the surfaces for electrical connection. The third view from the top of FIG. 31 (c) shows an example in which the metal region of the substrate 100 and the conductor frame 200 have the same or similar heights of surfaces for electrical connection.

Referring to the second and third drawings of FIG. 31 (b), the metal region A1 of the substrate 100 and the conductor frame 200, regardless of the height of the surface for electrical connection, screws SR2 ) And the conductive plate MP2 to electrically connect the metal region A1 of the substrate 100 and the conductor frame 200.

The description with reference to FIG. 31 is only one example of means for electrically connecting the metal region A1 of the substrate 100 and the conductor frame 200.

32 is an exemplary view showing a planar current and a three-dimensional current path according to a dense contact conductor line according to an embodiment of the present invention, and FIG. 33 is a plan view of each non-uniform contact conductor line according to an embodiment of the present invention. It is an example of the path of phosphorus current and three-dimensional current.

32A and 32B are exemplary views in which contact conductor lines are densely formed between the metal region A1 of the substrate 100 and the conductor frame 200.

Referring to (a) and (b) of FIG. 32, the metal region A1 of the substrate 100 and the conductor frame 200 are tightly connected to each other by the contact conductor line CM, so that the current from the circuit part After flowing through the feed line, the conductive connecting member and the outer conductor member, when the first contact conductor line CM is selected, it flows through the shortest path to the ground part of the circuit part.

33A and 33B are exemplary views in which contact conductor lines are non-uniformly formed between the metal region A1 of the substrate 100 and the conductor frame 200.

33 (a) and 33 (b), the metal region A1 of the substrate 100 and the conductor frame 200 are unevenly connected by contact conductor lines, so that the current from the circuit is fed. After passing through the line, the conductive connecting member, and the outer conductor member, the first contact conductor line CM2 is turned off, so that it does not immediately flow through the path closest to the ground portion of the circuit unit, and is connected to the first contact conductor line CM1. It flows through the adjacent second contact conductor line CM2, which can be seen that a current path is formed differently from the current paths shown in (a) and (b) of FIG. 32, whereby antenna resonance is generated. can be changed.

34 is a view showing resonant frequency characteristics according to via / non-via of a contact conductor line according to an embodiment of the present invention.

FIG. 34 (a) is a diagram showing a current path for the case where the first contact conductor line CM1 is selected. Referring to (a) of FIG. 34, when the first contact conductor line CM1 is selected, it can be seen that a current path is formed through the first contact conductor line CM1.

FIG. 34B is a view showing a current path for a case in which the first contact conductor line is not selected and the second contact conductor line is selected. Referring to (b) of FIG. 34, when the first contact conductor line CM1 is not selected, current does not pass through the first contact conductor line CM1, and thus the first contact conductor line CM1 It can be seen that current flows through the adjacent selected second contact conductor line CM2.

Referring to (a) and (b) of FIG. 34, when a current path is changed according to whether a contact conductor line is selected, for example, when the first contact conductor line CM1 is selected as shown in FIG. 34 (a). When the electric length of the current path is relatively short, resonance may be located in a relatively high frequency band among the low frequency bands. As an example, when the first contact conductor line CM1 is not selected as shown in FIG. 34 (b), the electrical length of the current path is relatively long, and thus resonance of a relatively low frequency among low frequency bands is obtained.

According to the above, it is possible to vary the resonance frequency by turning the corresponding contact conductor line on / off through a switch. That is, as an advantage of changing the position of the contact conductor line, the current path can be changed, and accordingly, the electrical length of the antenna can be changed, and the resonance frequency can be varied by changing the electrical length.

Here, in an embodiment of the present invention, the position of the contact conductor line may be changed depending on the target resonance frequency.

On the other hand, in addition to the contact conductor line for changing the antenna resonance length, the contact conductor line is densely formed, in that the metal region of the substrate 100 and the conductor frame 200 can be modeled as one conductor. It is advantageous in that the loss of current can be reduced only when it is made of one grounding part (GND).

On the other hand, looking at an example in which service bands are different for each cellular service area, in the past, the mobile phone can be used only in the network of the corresponding communication service provider, but the modern mobile phone can communicate in the service area of the different communication service providers as well as the corresponding network. The frequency assigned to the telecommunications provider is different for each operator, but the antenna of the mobile phone must cover multiple frequency bands to use the roaming service in different service areas, for example, other countries.

In order to cover such a wide frequency band, a roaming service may be used by using one or more antennas or by selecting a frequency using an impedance variable network such as a switch.

As an example, when a terminal according to an embodiment of the present invention is powered on by a mobile phone, the automatic band scan algorithm is driven to change the impedance matching unit and the contact conductor line in the mobile phone while scanning all searchable bands, making it the most powerful base station. The signal band of can be scanned, and the strongest signal band can be set as the use band.

In each embodiment of the present invention described above, at least one of the first impedance matching unit, the second impedance matching unit and the third impedance matching unit is a high frequency band higher than 1 GHz by a capacitance coupling or an inductance element or a combination thereof, as well as In particular, it can be seen that it can cover a low frequency band lower than 1 GHz.

According to the embodiment of the present invention as described above, it is possible to secure the price competitiveness by increasing the processing yield of the conductor frame, and at the same time, secure the antenna performance and design competitiveness.

100: substrate
200: conductor frame
203, 203A, 203B: no outer conductor
300: display panel
400: ground pattern
500: conductive connecting member

Claims (49)

A first impedance matching unit having one end and the other end electrically connected to a feeding node of a circuit part mounted on the substrate;
A conductive connecting member disposed in the non-metallic region of the terminal and having one end and the other end electrically connected to the other end of the first impedance matching unit;
An outer conductor member disposed along the outer periphery of the terminal, from the first connecting end electrically connected to the other end of the conductive connecting member to each of the first and second path ends which are different points; And
A conductor frame electrically connected to each of the first and second path ends of the outer conductor member and the ground portion of the substrate; Including,
The outer conductor member,
A first outer peripheral conductor disposed between the first path end of the outer conductor member and the first connecting end; And
A second radiation outer conductor formed integrally with the first radiation outer conductor and disposed between the second path end of the outer conductor member and the first connection end; Including,
The conductor frame
One of the conductor covers and the inner conductor frame
Multiband antenna.
The method of claim 1, wherein the first impedance matching unit
A multiband antenna comprising at least one of a capacitance device, an inductance device and a resistance device.
According to claim 1, The first outer conductor for radiation
A multi-band antenna having an electrical length different from that of the second radiation outer conductor.
The method of claim 1, wherein the conductive connecting member
A multi-band antenna having an electrical length that is smaller than the electrical length of each of the first radiation outer conductor and the second radiation outer conductor.
The method of claim 1, wherein the conductive connecting member
A multi-band antenna connected to the first connection end of the outer conductor member through an electrical connecting structure.
The method of claim 1, wherein the conductive connecting member
A multi-band antenna formed integrally by being physically connected to the outer conductor member.
The multi-band antenna of claim 1,
And a second impedance matching portion disposed between the conductive connection member and the first connection end of the outer conductor member.
The method of claim 1, wherein the outer conductor member,
A multi-band antenna formed integrally with the conductor frame.
delete The method of claim 1, wherein the conductor frame
A first conductor region electrically connected to each of the first path end of the first radiation outer conductor and the first ground node of the circuit unit; And
A second conductor region electrically connected to each of the second path end of the second radiation outer conductor and the second ground node of the circuit unit;
Multi-band antenna comprising a.
The method of claim 1, wherein the conductor frame
A multi-band antenna disposed between the cover and the substrate of the terminal or between the substrate and the display panel.
The method of claim 1, wherein the conductive connecting member
A multi-band antenna including a brunch member extending between one end and the other end of the conductive connecting member and connected to the ground portion of the substrate of the terminal.
The method of claim 1, wherein the conductive connecting member
It includes three terminals, and one terminal of the three terminals is connected to the circuit unit through one feeding line, and the other two terminals are connected to each of the first and second connecting terminals, which are different points of the outer conductor member. Band antenna.
The method of claim 1, wherein the conductive connecting member
The first and second conductive connection members are formed physically separated from each other,
Each end of the first and second conductive connecting members may be connected to a circuit part by being commonly connected to one feeding line, and the other end of each of the first and second conductive connecting members may be different points of the outer conductor member. Multiband antenna connected to the second connection.
According to claim 1,
Made of a conductive pattern disposed adjacent to the conductive connecting member,
A multi-band antenna further comprising a ground pattern, one end of which is connected to the ground portion of the substrate, the other end of which is connected to the second connection end of the outer conductor member.
The method of claim 1, wherein the conductive connecting member
It is made of a conductive member having a polygonal shape, one point of which is connected to the circuit part through one feeding line, and two different points are connected to the first and second connecting ends, which are different points of the outer conductor member. antenna.
The method of claim 16, wherein the conductive connecting member
A multi-band antenna including a slit in which the conductive member is removed inside the polygonal conductive member.
The method of claim 1, wherein the conductive connecting member
A multi-band antenna that is disposed on the same layer as a conductor frame in an air space that is a non-metallic region of a conductor frame disposed between the cover and the display of the terminal, and is integrally formed with the outer conductor member of the conductor frame.
According to claim 1,
A third impedance matching portion disposed between a point between both ends of the conductive connecting member and the ground portion of the substrate; Multi-band antenna further comprising a.
A substrate disposed inside the terminal and having a circuit portion;
A first impedance matching unit having one end and the other end connected to the feeding node of the circuit unit;
A conductive connection member disposed in the non-metallic region of the terminal and having one end connected to the other end of the first impedance matching unit and the other end;
An outer conductor member disposed along the outer periphery of the terminal, from the first connecting end connected to the other end of the conductive connecting member to each of the first and second path ends which are different points;
A conductor frame electrically connected to each of the first and second path ends of the outer conductor member and the ground portion of the substrate; And
A display panel for displaying information from the circuit portion; Including,
The outer conductor member,
A first radiation outer conductor disposed between the first path end of the outer conductor member and the first connection end and functioning as a radiator in a first frequency band; And
The second radiation is formed integrally with the outer conductor for the first radiation, disposed between the second path end of the outer conductor member and the first connection end, and functions as a radiator of a second frequency band different from the first frequency band. Radial outer conductors; Including,
The conductor frame,
One of the conductor covers and the inner conductor frame
terminal.
The method of claim 20, wherein the first impedance matching unit
A terminal comprising at least one of a capacitance device, an inductance device and a resistance device.
21. The method of claim 20, wherein the first outer conductor for radiation
A terminal having an electrical length different from the electrical length of the second radiation outer conductor.
The method of claim 20, wherein the conductive connecting member
A terminal having an electrical length smaller than the electrical length of each of the first outer conductor for radiation and the second outer conductor for radiation.
The method of claim 20, wherein the conductive connecting member
A terminal connected to the first connecting end of the outer conductor member through an electrical connecting structure.
The method of claim 20, wherein the conductive connecting member
A terminal formed integrally by being physically connected to the outer conductor member.
The method of claim 20, wherein the terminal,
A terminal further comprising a second impedance matching portion disposed between the conductive connection member and the first connection end of the outer conductor member.
The method of claim 20, wherein the outer conductor member,
A terminal formed integrally with the conductor frame.
delete The method of claim 20, wherein the terminal,
A plurality of contact conductor lines electrically connecting the metal region of the conductor frame and the metal region of the substrate; Terminal further comprising a.
A substrate disposed inside the terminal and having a circuit portion;
A first impedance matching unit having one end and the other end connected to the feeding node of the circuit unit;
A conductive connection member disposed in the non-metallic region of the terminal and having one end connected to the other end of the first impedance matching unit and the other end;
An outer conductor member disposed along the outer periphery of the terminal, from the first connecting end connected to the other end of the conductive connecting member to each of the first and second path ends which are different points;
A conductor frame electrically connected to each of the first and second path ends of the outer conductor member and the ground portion of the substrate;
A display panel for displaying information from the circuit portion;
A plurality of contact conductor lines electrically connecting the metal region of the conductor frame and the metal region of the substrate; And
A switching device including at least one switch for selecting at least one of a plurality of contact conductor lines between the metal region of the substrate and the conductor frame; Including,
The outer conductor member,
A first radiation outer conductor disposed between the first path end of the outer conductor member and the first connection end and functioning as a radiator in a first frequency band; And
The second radiation is formed integrally with the outer conductor for the first radiation, disposed between the second path end of the outer conductor member and the first connection end, and functions as a radiator of a second frequency band different from the first frequency band. Radial outer conductors; Terminal comprising a.
The method of claim 30, wherein the first impedance matching unit,
A terminal comprising at least one of a capacitance device, an inductance device and a resistance device.
31. The method of claim 30, wherein the first outer conductor for radiation,
A terminal having an electrical length different from the electrical length of the second radiation outer conductor.
31. The method of claim 30, The conductive connecting member,
A terminal having an electrical length smaller than the electrical length of each of the first outer conductor for radiation and the second outer conductor for radiation.
31. The method of claim 30, The conductive connecting member,
A terminal connected to the first connecting end of the outer conductor member through an electrical connecting structure.
31. The method of claim 30, The conductive connecting member,
A terminal formed integrally by being physically connected to the outer conductor member.
The method of claim 30, wherein the terminal,
A terminal further comprising a second impedance matching portion disposed between the conductive connection member and the first connection end of the outer conductor member.
31. The method of claim 30, wherein the outer conductor member,
A terminal formed integrally with the conductor frame.
The method of claim 30, wherein the conductor frame,
A terminal that is one of a conductor cover and an inner conductor frame.
delete A substrate disposed inside the terminal and having a circuit portion;
A first impedance matching unit having one end and the other end connected to the feeding node of the circuit unit;
A conductive connection member disposed in the non-metallic region of the terminal and having one end connected to the other end of the first impedance matching unit and the other end;
An outer conductor member disposed along the outer periphery of the terminal, from the first connecting end connected to the other end of the conductive connecting member to each of the first and second path ends which are different points;
A conductor frame electrically connected to each of the first and second path ends of the outer conductor member and the ground portion of the substrate;
A display panel for displaying information from the circuit portion;
A plurality of contact conductor lines electrically connecting the metal region of the conductor frame and the metal region of the substrate; And
A switching device for selecting or deselecting some of the contact conductor lines among the plurality of contact conductor lines between the metal region of the substrate and the conductor frame; Including,
The outer conductor member,
A first radiation outer conductor disposed between the first path end of the outer conductor member and the first connection end and functioning as a radiator in a first frequency band; And
The second radiation is formed integrally with the outer conductor for the first radiation, disposed between the second path end of the outer conductor member and the first connection end, and functions as a radiator of a second frequency band different from the first frequency band. Radial outer conductors; Including,
The switching device,
And at least one switch for selecting at least one of a plurality of contact conductor lines between the metal region of the substrate and the conductor frame.
terminal.
41. The method of claim 40, The first impedance matching unit,
A terminal comprising at least one of a capacitance device, an inductance device and a resistance device.
41. The method of claim 40, wherein the first outer conductor for radiation,
A terminal having an electrical length different from the electrical length of the second radiation outer conductor.
41. The method of claim 40, The conductive connecting member,
A terminal having an electrical length smaller than the electrical length of each of the first outer conductor for radiation and the second outer conductor for radiation.
41. The method of claim 40, The conductive connecting member,
A terminal connected to the first connecting end of the outer conductor member through an electrical connecting structure.
41. The method of claim 40, The conductive connecting member,
A terminal formed integrally by being physically connected to the outer conductor member.
41. The method of claim 40, wherein the terminal,
A terminal further comprising a second impedance matching portion disposed between the conductive connection member and the first connection end of the outer conductor member.
41. The method of claim 40, wherein the outer conductor member,
A terminal formed integrally with the conductor frame.
41. The method of claim 40, wherein the conductor frame,
A terminal that is one of a conductor cover and an inner conductor frame.
delete

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