KR102091419B1 - 광투과성 연마층을 갖는 기판 연마 시스템 - Google Patents

광투과성 연마층을 갖는 기판 연마 시스템 Download PDF

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Publication number
KR102091419B1
KR102091419B1 KR1020180083777A KR20180083777A KR102091419B1 KR 102091419 B1 KR102091419 B1 KR 102091419B1 KR 1020180083777 A KR1020180083777 A KR 1020180083777A KR 20180083777 A KR20180083777 A KR 20180083777A KR 102091419 B1 KR102091419 B1 KR 102091419B1
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KR
South Korea
Prior art keywords
polishing
substrate
value
optical interference
interference signal
Prior art date
Application number
KR1020180083777A
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English (en)
Korean (ko)
Other versions
KR20200009424A (ko
Inventor
이성구
Original Assignee
주식회사 케이씨텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020180083777A priority Critical patent/KR102091419B1/ko
Priority to CN201811043090.7A priority patent/CN110732965B/zh
Publication of KR20200009424A publication Critical patent/KR20200009424A/ko
Application granted granted Critical
Publication of KR102091419B1 publication Critical patent/KR102091419B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020180083777A 2018-07-19 2018-07-19 광투과성 연마층을 갖는 기판 연마 시스템 KR102091419B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020180083777A KR102091419B1 (ko) 2018-07-19 2018-07-19 광투과성 연마층을 갖는 기판 연마 시스템
CN201811043090.7A CN110732965B (zh) 2018-07-19 2018-09-07 具有光透过性研磨层的基板的研磨系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180083777A KR102091419B1 (ko) 2018-07-19 2018-07-19 광투과성 연마층을 갖는 기판 연마 시스템

Publications (2)

Publication Number Publication Date
KR20200009424A KR20200009424A (ko) 2020-01-30
KR102091419B1 true KR102091419B1 (ko) 2020-03-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180083777A KR102091419B1 (ko) 2018-07-19 2018-07-19 광투과성 연마층을 갖는 기판 연마 시스템

Country Status (2)

Country Link
KR (1) KR102091419B1 (zh)
CN (1) CN110732965B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547445B (zh) * 2020-04-03 2023-03-24 重庆超硅半导体有限公司 一种抛光头中心压力精确监测方法
CN111545545B (zh) * 2020-04-22 2021-02-19 深圳市迅特通信技术股份有限公司 光纤端面清洁方法、装置、设备及计算机可读存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101669554B1 (ko) * 2010-07-23 2016-10-26 가부시키가이샤 에바라 세이사꾸쇼 기판 폴리싱의 진행을 감시하는 방법 및 폴리싱장치
KR101867385B1 (ko) 2010-10-15 2018-06-15 어플라이드 머티어리얼스, 인코포레이티드 광학 모니터링을 위한 스펙트럼들의 라이브러리 구축

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TW398036B (en) * 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
TW434103B (en) * 1998-10-23 2001-05-16 Taiwan Semiconductor Mfg Chemical mechanical polishing device with terminal point detection functions
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
KR20040073172A (ko) * 2003-02-13 2004-08-19 삼성전자주식회사 연마 공정에서 종점을 검출하기 위한 장치 및 방법
DE602004022158D1 (de) * 2003-05-29 2009-09-03 Sumitomo Metal Ind Stanzersubstrat und prozess zu seiner herstellung
JP2011035093A (ja) * 2009-07-31 2011-02-17 Fujitsu Semiconductor Ltd 半導体装置の製造方法
JP2013219248A (ja) * 2012-04-10 2013-10-24 Ebara Corp 研磨装置および研磨方法
CN106457507B (zh) * 2014-04-22 2019-04-09 株式会社荏原制作所 研磨方法
SG10201501196PA (en) * 2015-02-16 2016-09-29 Lighthaus Photonics Pte Ltd Compact spectrometer
JP6404172B2 (ja) * 2015-04-08 2018-10-10 株式会社荏原製作所 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101669554B1 (ko) * 2010-07-23 2016-10-26 가부시키가이샤 에바라 세이사꾸쇼 기판 폴리싱의 진행을 감시하는 방법 및 폴리싱장치
KR101867385B1 (ko) 2010-10-15 2018-06-15 어플라이드 머티어리얼스, 인코포레이티드 광학 모니터링을 위한 스펙트럼들의 라이브러리 구축

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Publication number Publication date
KR20200009424A (ko) 2020-01-30
CN110732965A (zh) 2020-01-31
CN110732965B (zh) 2022-12-16

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