KR102079938B1 - Ceramic substrate for led and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a ceramic substrate for an LED having flexible properties and a manufacturing method thereof. According to the present invention, the method for manufacturing the ceramic substrate for the LED comprises the steps of: forming a via hole (a) at an edge of a ceramic thin plate (100); filling and heat-treating the via hole (a) with a conductive paste; forming and heat-treating a bottom pattern (10) on one surface of the ceramic thin plate (100); forming and heat-treating a common electrode pattern (20) on the other surface of the ceramic thin plate (100); forming an insulating layer (200) by applying an insulating material on the other surface of the ceramic thin plate (100) and the common electrode pattern (20); forming a via hole (b) in the insulating layer (200); forming and heat-treating a red LED electrode pattern (30) and a blue LED electrode pattern (40) on the insulating layer (200); forming an insulating layer (300) by applying and heat-treating the insulating material on the via hole (b), the insulating layer (200), the red LED electrode pattern (30) and the blue LED electrode pattern (40); forming a via hole (d) in the insulating layer (300) formed on the blue LED electrode pattern (40); forming and heat-treating a green LED electrode pattern (50) on the insulating layer (300); forming an insulating layer (400) by applying and heat-treating the insulating material on the via hole (b), a via hole (c), the via hole (d), the insulating layer (300) and the green LED electrode pattern (50); forming a via hole (e) in the insulating layer (400); and forming and heat-treating a green LED electrode pad pattern (90) on the via hole (e).

Description

CERAMIC SUBSTRATE FOR LED AND METHOD OF MANUFACTURING THE SAME

The present invention relates to a ceramic substrate for LEDs and a method of manufacturing the same, and more particularly, to enable the attachment of small size LEDs by using thin ceramic thin plates, and to form pads using a laminated structure and to form holes formed in the substrate. The present invention relates to a ceramic substrate for LEDs and a method of manufacturing the same, which minimizes the number of manufacturing costs.

Light emitting diodes (LEDs) may be widely used in various wavelength bands from ultraviolet rays to infrared rays. Since Nichia's commercialization of nitride light emitting diodes (GaN LEDs), thanks to the continuous development of semiconductor thin film technology, process technology, and device technology, GaN-LED has shown a dramatic improvement in performance and reliability. LED demand is exploding due to the launch of high-brightness and high-power applications such as mobile phones, TVs, lighting, electronic signs, traffic lights, automobiles, and home appliances. In particular, since 2005, the total light efficiency increased rapidly, and a large market was formed as the LCD backlight unit of the display industry. Development is expected to increase steadily. However, at present, the domestic LED industry has faced a limit in price competitiveness of domestic companies as global market competition intensified by late-stage investors such as China and the policy to foster industry. have. In order to create a new market that can overcome this difficult situation, development of convergence technologies for next-generation display, medical / bio, telecommunications, autonomous driving devices, textiles, and agriculture and fisheries are required.

Recently, a number of research papers have been published that apply the effects of the degree of freedom of LED scaling, flexible characteristics, and selective emission wavelength. LEDs used for lighting are mainly 1000 μm × 1000 μm in size. If the area of the LED is reduced to 1/100 or less, the size of the hair becomes about 100 μm × 100 μm, which is about the thickness of the hair. Such an LED is called a micro LED. These micro LEDs can be mounted on stretchable boards, flexible boards, and 3D boards, and applied to various fields such as wearable displays, skin-attached medical devices, semiconductor devices, autonomous driving sensors, and light sources for big data services. can do.

Such micro LEDs can be applied to various fields with extremely small size and thin thickness, which can be used for micro LED displays. The micro LED display, which is attracting attention as the next-generation display, adopts RGB micro LEDs of 100 μm or less that emit light by pixels of pixels. Its power consumption is lower than that of conventional OLEDs and LCDs, and efficiency and reliability are high. Arrangement has the advantage of large area.

In order to apply such a micro LED to a display, not only a study on the micro LED itself but also a research and development on a substrate to which the micro LED is attached are required. In order to attach an RGB micro LED smaller than 100 μm in size, the thickness of the substrate itself must be thin, and in order to maintain the flexible property of the thin substrate, the number of holes formed in the substrate must be reduced. However, it is difficult to manufacture a substrate having a thin thickness enough to accommodate a small LED as a material used in a conventional LED substrate, and there is no plan to reduce the number of holes formed in the substrate, so research on this is very urgent. It is true. In the conventional LED substrate, as many holes as the number of RGB micro LEDs had to be formed.

Korea Patent Office Registered Patent Publication No. 10-1308698 Korean Utility Model Publication No. 20-2016-0002657 Korean Patent Office Publication No. 10-2010-0103156

SUMMARY OF THE INVENTION An object of the present invention is to provide a ceramic substrate for LEDs and a method of manufacturing the same, which can be bent using a thin thin plate of ceramic material and at the same time firmly attach a small size micro LED.

Another object of the present invention is to provide a ceramic substrate for LEDs and a method of manufacturing the same, which have flexible properties by minimizing the number of holes formed in the substrate through a laminated design.

In order to achieve the above object, a method of manufacturing a ceramic substrate for an LED according to an embodiment of the present invention comprises the steps of forming a via hole (a) in the edge of the ceramic thin plate (100); Filling the via hole (a) with a conductive paste and performing heat treatment; Forming a bottom pattern 10 on one surface of the ceramic thin plate 100 and performing heat treatment; Forming a common electrode pattern 20 on the other surface of the ceramic thin plate 100 and performing heat treatment; Forming an insulating layer 200 by applying an insulating material and heat treatment to the other surface of the ceramic thin plate 100 and the common electrode pattern 20; Forming a via hole (b) in the insulating layer (200) formed on the common electrode pattern (20); Filling a conductive paste into the via hole (b), forming a red LED electrode pattern 30 and a blue LED electrode pattern 40 on the insulating layer 200 and then performing heat treatment; Forming an insulating layer 300 by applying an insulating agent on the via hole (b), the insulating layer 200, the red LED electrode pattern 30, and the blue LED electrode pattern 40; The via hole b is extended in the insulating layer 300 formed on the via hole b, the via hole c is formed in the insulating layer 300 formed on the red LED electrode pattern 30, and the blue LED electrode pattern 40 is formed. Forming a via hole (d) in the insulating layer (300) formed on the substrate; Filling a conductive paste into the via hole (b), the via hole (c) and the via hole (d), and forming and heat-treating the green LED electrode pattern 50 on the insulating layer 300; Forming an insulating layer 400 by applying and thermally treating an insulating material on the via hole (b), the via hole (c), the via hole (d), the insulating layer 300 and the green LED electrode pattern 50; The via hole (b) extends in the insulating layer 400 formed on the via hole (b), and the via hole (c) extends in the insulating layer 400 formed on the via hole (c), and the insulating layer formed on the via hole (d). Forming a via hole d in the 400 and forming a via hole e in the insulating layer 400 formed on the green LED electrode pattern 50; And a conductive paste is filled in the via holes (b), the via holes (c), the via holes (d), and the via holes (e), the common electrode pad pattern 60 is formed on the via holes (b), and the red LEDs on the via holes (c). Forming an electrode pad pattern 70, forming a blue LED electrode pad pattern 80 over the via hole d, forming a green LED electrode pad pattern 90 over the via hole e, and then performing heat treatment. do.

Preferably, the method of manufacturing a ceramic substrate for LEDs includes a common electrode pad pattern 60, a red LED electrode pad pattern 70, a blue LED electrode pad pattern 80, a green LED electrode pad pattern 90, and an insulating layer. Forming an insulating layer 500 by applying and thermally insulating an insulating material on the 400; Red LED grooves are formed in the insulating layer 500 formed on the common electrode pad pattern 60 and the red LED electrode pad pattern 70, and are formed on the common electrode pad pattern 60 and the blue LED electrode pad pattern 80. Forming a groove for the blue LED in the insulating layer 500 and forming a groove for the green LED in the insulating layer 500 formed on the common electrode pad pattern 60 and the green LED electrode pad pattern 90; Attaching a red LED to the groove for the red LED, attaching a blue LED to the groove for the blue LED, and attaching the green LED to the groove for the green LED; And planarizing the surface of the insulating layer 500 and one surface of the ceramic thin plate 100.

Preferably, the insulation forming the insulating layer 500 is characterized in that black.

Preferably, the method of manufacturing a ceramic substrate for LEDs, when the two LED ceramic substrates are connected to each other, the leftmost side of the LED and the other ceramic substrate for LEDs provided on the rightmost side of any one ceramic substrate for LEDs And cutting the outer circumferential surface of the ceramic substrate for the LEDs such that the spacing between the LEDs provided in the same is equal to the interval between the LEDs provided in the ceramic substrate for one LED.

Preferably, the insulating agent corresponds to at least one of glass, ceramic, epoxy, and polyimide, and at least any one of the insulating layer 200, the insulating layer 300, the insulating layer 400, and the insulating layer 500. One thickness may correspond to 2 to 100 microns.

Preferably, the conductive paste corresponds to one or more materials of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W, the common electrode pattern 20, the red LED electrode pattern 30, The thickness of at least one of the blue LED electrode pattern 40 and the green LED electrode pattern 50 may correspond to 1 to 10 microns.

Preferably, the diameter of at least one of the via hole (a), the via hole (b), the via hole (c), the via hole (d), and the via hole (e) may correspond to 10 to 200 microns.

Ceramic substrate for LED according to another embodiment of the present invention is manufactured by the above-described method for manufacturing a ceramic substrate for LED.

The present invention can provide a ceramic substrate for LED and a method of manufacturing the same, which can be bent using a thin thin plate of ceramic material and at the same time firmly attached to a small size micro LED.

The present invention can provide a ceramic substrate for LED and its manufacturing method to have a flexible property by minimizing the number of holes formed in the substrate through a laminated design.

1 is a view showing a perspective view of a ceramic thin plate formed with a via hole on the edge according to an embodiment of the present invention.
2 to 13 is a view showing a cross-sectional view of the ceramic substrate for LED corresponding to each step of the method for manufacturing a ceramic substrate for LED according to an embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail through exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if displayed on different drawings.

In the following description of embodiments of the present invention, detailed descriptions of related well-known configurations or functions will be omitted if it is determined that the understanding of the embodiments of the present invention is impeded.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms.

1 to 13, the structure of the ceramic substrate for LED (hereinafter referred to as "ceramic substrate for LED") and the manufacturing method of the ceramic substrate for LED according to an embodiment of the present invention (hereinafter, "main LED" Ceramic substrate manufacturing method ”will be described below.

The method of manufacturing a ceramic substrate for LEDs includes forming a via hole (a) at an edge of the ceramic thin plate (100); Filling the via hole (a) with a conductive paste and performing heat treatment; Forming a bottom pattern 10 on one surface of the ceramic thin plate 100 and performing heat treatment; Forming a common electrode pattern 20 on the other surface of the ceramic thin plate 100 and performing heat treatment; Forming an insulating layer 200 by applying an insulating agent on the other surface of the ceramic thin plate 100 and the common electrode pattern 20; Forming a via hole (b) in the insulating layer (200) formed on the common electrode pattern (20); Filling a conductive paste into the via hole (b), forming a red LED electrode pattern 30 and a blue LED electrode pattern 40 on the insulating layer 200 and then heat-treating them; Forming an insulating layer 300 by applying and thermally insulating an insulating layer on the via hole (b), the insulating layer 200, the red LED electrode pattern 30, and the blue LED electrode pattern 40; The via hole b is extended in the insulating layer 300 formed on the via hole b, the via hole c is formed in the insulating layer 300 formed on the red LED electrode pattern 30, and the blue LED electrode pattern 40 is formed. Forming a via hole (d) in the insulating layer (300) formed on the substrate; Filling a conductive paste into the via hole (b), the via hole (c) and the via hole (d), and forming and heat-treating the green LED electrode pattern 50 on the insulating layer 300; Forming an insulating layer 400 by applying and thermally treating an insulating material on the via hole (b), the via hole (c), the via hole (d), the insulating layer 300 and the green LED electrode pattern 50; The via hole (b) extends in the insulating layer 400 formed on the via hole (b), and the via hole (c) extends in the insulating layer 400 formed on the via hole (c), and the insulating layer formed on the via hole (d). Forming a via hole d in the 400 and forming a via hole e in the insulating layer 400 formed on the green LED electrode pattern 50; A conductive paste is filled in the via holes (b), the via holes (c), the via holes (d), and the via holes (e), the common electrode pad pattern 60 is formed on the via holes (b), and the red LED electrodes on the via holes (c). Forming a pad pattern 70, forming a blue LED electrode pad pattern 80 over the via hole d, forming a green LED electrode pad pattern 90 over the via hole e, and then performing heat treatment; Insulating layer is applied to the common electrode pad pattern 60, the red LED electrode pad pattern 70, the blue LED electrode pad pattern 80, the green LED electrode pad pattern 90, and the insulating layer 400, and then heat treated. Forming 500; Red LED grooves are formed in the insulating layer 500 formed on the common electrode pad pattern 60 and the red LED electrode pad pattern 70, and formed on the common electrode pad pattern 60 and the blue LED electrode pad pattern 80. Forming a groove for the blue LED in the insulating layer 500 and forming a groove for the green LED in the insulating layer 500 formed on the common electrode pad pattern 60 and the green LED electrode pad pattern 90; Attaching a red LED to the groove for the red LED, attaching a blue LED to the groove for the blue LED, and attaching the green LED to the groove for the green LED; And / or planarizing the surface of the insulating layer 500 and one surface of the ceramic thin plate 100.

1 to 13, each of the above-described steps will be described in detail below.

1 is a view showing a perspective view of a ceramic thin plate formed with a via hole on the edge according to an embodiment of the present invention.

Referring to FIG. 1, the method of manufacturing a ceramic substrate for LEDs includes forming a via hole a at an edge of the ceramic thin plate 100.

In this step, the thickness of the ceramic thin plate 100 may be 10 to 500 microns (μm), the diameter of the via hole (a) may be 10 to 200 microns. The via hole (a) may be formed through a process such as laser irradiation, mechanical drilling, chemical etching, or the like.

2 to 13 are cross-sectional views of the LED ceramic substrates corresponding to the respective steps of the present method of manufacturing a ceramic substrate for LEDs. FIG. 2 is a cross-sectional view of the ceramic thin plate 100 of FIG. 1 cut along the AA ′ direction, and FIGS. 3 to 13 are ceramic substrates for LEDs manufactured according to respective processes of the present method of manufacturing a ceramic substrate for LEDs. Is a cross-sectional view cut along the AA 'direction.

Referring to FIG. 2, the method of manufacturing a ceramic substrate for LEDs includes filling a conductive paste in a via hole (a) formed in the ceramic thin plate 100 and performing heat treatment.

In this step, filling the conductive paste into the via hole (a) of the ceramic thin plate (100) is the common electrode pattern 20, red LED electrode pattern (30), blue LED electrode pattern (to be formed later on the ceramic thin plate (100) 40 and / or to electrically connect the green LED electrode pattern 50 and the bottom pattern 10 to be formed under the ceramic thin plate 100. Further, the conductive paste of this step means a composite material in which the conductor powder, the binder, and the like are dispersed in a flowable resin solution, and the conductors used in the conductive paste are Ag, Cu, Au, Pd, Pt, Ag- It may correspond to one or more materials of Pd, Ni, Mo, and W.

In this step, the heat treatment temperature depends on the melting point of the conductor used as the conductive paste, but when Ag is used as the conductive paste, the heat treatment temperature may correspond to 600 ° C to 900 ° C, preferably 800 ° C in the atmospheric environment. Can be. At this time, the term heat treatment refers to heating to give the original function of the material within the range that the properties of the material does not change.

Referring to FIG. 3, the method of manufacturing a ceramic substrate for LEDs includes forming a bottom pattern 10 on one surface of the ceramic thin plate 100 and performing heat treatment.

In this step, one surface of the ceramic thin plate 100 means a lower surface of the ceramic thin plate 100, and the bottom pattern 10 is printed using a conductive paste. The conductor used in the conductive paste of this step may correspond to one or more of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W. The thickness of the bottom pattern 10 may be 1 to 10 microns. The bottom pattern 10 may be connected to a power source to supply power to the LED.

In this step, the heat treatment temperature depends on the melting point of the conductor used as the conductive paste, but when Ag is used as the conductive paste, the heat treatment temperature may correspond to 600 ° C to 900 ° C, preferably 800 ° C in the atmospheric environment. Can be.

Referring to FIG. 4, the method of manufacturing a ceramic substrate for LEDs includes forming and heating a common electrode pattern 20 on the other surface of the ceramic thin plate 100.

In this step, the other surface of the ceramic thin plate 100 refers to the upper surface of the ceramic thin plate 100, and the common electrode pattern 20 is printed using a conductive paste. The conductor used in the conductive paste of this step may correspond to one or more of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W. The common electrode pattern 20 may have a thickness of 1 to 10 microns.

The common electrode pattern 20 is also printed on the upper surface of the via hole a to make an electrical connection with the via hole a, and is also electrically connected to the bottom pattern 10 through the via hole a. The common electrode of the LED is electrically connected to the common electrode pattern 20 later. The common electrode may mean a ground electrode.

In this step, the heat treatment temperature depends on the melting point of the conductor used as the conductive paste, but when Ag is used as the conductive paste, the heat treatment temperature may correspond to 600 ° C to 900 ° C, preferably 800 ° C in the atmospheric environment. Can be.

Referring to FIG. 5, the method of manufacturing a ceramic substrate for LEDs includes forming an insulating layer 200 by applying an insulating agent and heat treatment on the other surface of the ceramic thin plate 100 and the common electrode pattern 20.

In this step, the insulation is applied on the ceramic thin plate 100 and the common electrode pattern 20 with a material that does not affect the ceramic thin plate 100 and the common electrode pattern 20. The insulation may be an inorganic material and / or an organic material, the inorganic material may include glass, ceramics, and the like, and the organic material may include epoxy, polyimide, or the like. This insulation forms the insulation layer 200, the thickness of the bonding layer may be 2 to 100 microns.

In this step, the heat treatment temperature may vary depending on the melting point of the insulation, and in order to prevent melting up to the conductive paste filled in the ceramic thin plate 100, printed patterns and / or via holes during the heat treatment process, the insulation The melting point of may be lower than the melting point of the ceramic thin plate 100, the melting point of the conductive paste used for pattern printing and the melting point of the conductive paste filled in the via hole. Therefore, in this step, one embodiment of the present invention may be heat-treated at a temperature higher than the melting point of the insulation and lower than the melting point of the ceramic thin plate 100 and the melting point of the conductive paste.

Referring to FIG. 6, in the method of manufacturing a ceramic substrate for LEDs, forming a via hole b in the insulating layer 200 formed on the common electrode pattern 20 and / or filling a conductive paste in the via hole b, And forming and heat treating the red LED electrode pattern 30 and the blue LED electrode pattern 40 on the insulating layer 200.

The via hole b is formed on the common electrode pattern 20 in the insulating layer 200. The diameter of the via hole b may be 10 to 200 microns. The via hole b may be formed through a process such as laser irradiation, chemical etching, or the like. The conductor used in the conductive paste of this step may correspond to one or more of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W.

The red LED electrode pattern 30 and the blue LED electrode pattern 40 are formed where the via hole b is not formed on the insulating layer 200. That is, the red LED electrode pattern 30 and the blue LED electrode pattern 40 are not electrically connected to the via hole b, the common electrode pattern 20 and / or the via hole a. The red LED electrode pattern 30 and the blue LED electrode pattern 40 are not shown in this drawing, but other via holes (not shown) formed in the insulating layer 200 and another via holes formed in the ceramic thin plate 100 are not shown. The bottom pattern 10 is electrically connected to the bottom pattern 10.

The red LED electrode pattern 30 is electrically connected to a non-common electrode among two electrodes provided in the red LED, and the blue LED electrode pattern 40 is an electrode that is not a common electrode among the two electrodes provided in the blue LED. Is connected. The thickness of the red LED electrode pattern 30 and / or the blue LED electrode pattern 40 may be 1 to 10 microns.

In this step, the heat treatment temperature depends on the melting point of the conductor used as the conductive paste, but when Ag is used as the conductive paste, the heat treatment temperature may correspond to 600 ° C to 900 ° C, preferably 800 ° C in the atmospheric environment. Can be.

Referring to FIG. 7, in the method of manufacturing a ceramic substrate for LEDs, an insulating layer is coated on a via hole (b), an insulating layer 200, a red LED electrode pattern 30, and a blue LED electrode pattern 40 and heat-treated to form an insulating layer. Forming 300.

In this step, the insulation is applied with a material that does not affect the ceramic thin plate 100, the red LED electrode pattern 30, the blue LED electrode pattern 40 and / or the via holes b. The insulation may be an inorganic material and / or an organic material, the inorganic material may include glass, ceramics, and the like, and the organic material may include epoxy, polyimide, or the like. This insulation forms the insulation layer 300, the thickness of the bonding layer may be 2 to 100 microns.

In this step, the heat treatment temperature may vary depending on the melting point of the insulation, and in order to prevent melting up to the conductive paste filled in the ceramic thin plate 100, printed patterns and / or via holes during the heat treatment process, the insulation The melting point of may be lower than the melting point of the ceramic thin plate 100, the melting point of the conductive paste used for pattern printing and the melting point of the conductive paste filled in the via hole. Therefore, in this step, one embodiment of the present invention may be heat-treated at a temperature higher than the melting point of the insulation and lower than the melting point of the ceramic thin plate 100 and the melting point of the conductive paste.

Referring to FIG. 8, in the method of manufacturing a ceramic substrate for LEDs, a via hole b is extended in an insulating layer 300 formed on the via hole b, and the insulating layer 300 formed on the red LED electrode pattern 30. Forming a via hole (c) and forming a via hole (d) in the insulating layer (300) formed on the blue LED electrode pattern (40) and / or conductive in the via hole (b), via hole (c) and via hole (d) Filling the paste, and forming a green LED electrode pattern 50 on the insulating layer 300 and heat treatment.

The via hole c is formed on the red LED electrode pattern 30 in the insulating layer 300, the via hole d is formed on the blue LED electrode pattern 40 in the insulating layer 300, and the via hole b is insulated. It extends through the layer 300 to the upper surface of the insulating layer 300. The diameter of the via hole (c) and / or via hole (d) may be 10 to 200 microns. The via hole (c) and / or the via hole (d) may be formed through a process such as laser irradiation or chemical etching. The conductor used in the conductive paste of this step may correspond to one or more of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W.

The green LED electrode pattern 50 is formed where the via hole b, the via hole c, and / or the via hole d are not formed on the insulating layer 300. That is, the green LED electrode pattern 50 includes a via hole (b), a via hole (c), a via hole (d), a common electrode pattern 20, a red LED electrode pattern 30, a blue LED electrode pattern 40, and / or It is not electrically connected to the via hole a. Although the green LED electrode pattern 50 is not shown in the drawing, another via hole (not shown) formed in the insulating layer 300, another via hole (not shown) formed in the insulating layer 200, and the ceramic thin plate 100 may be formed. Another via hole (not shown) may be electrically connected to the bottom pattern 10.

The green LED electrode pattern 50 may be electrically connected to a non-common electrode among two electrodes provided in the green LED, and the thickness of the green LED electrode pattern 50 may be 1 to 10 microns.

In this step, the heat treatment temperature depends on the melting point of the conductor used as the conductive paste, but when Ag is used as the conductive paste, the heat treatment temperature may correspond to 600 ° C to 900 ° C, preferably 800 ° C in the atmospheric environment. Can be.

Referring to FIG. 9, in the method of manufacturing a ceramic substrate for LEDs, an insulating material is coated on a via hole (b), a via hole (c), a via hole (d), an insulating layer 300, and a green LED electrode pattern 50 and heat treated. Forming an insulating layer 400.

In this step, the insulation is applied with a material that does not affect the ceramic thin plate 100, the via hole (b), the via hole (c), the via hole (d) and / or the green LED electrode pattern 50. The insulation may be an inorganic material and / or an organic material, the inorganic material may include glass, ceramics, and the like, and the organic material may include epoxy, polyimide, or the like. This insulation forms an insulating layer 400, the thickness of the bonding layer may be 2 to 100 microns.

In this step, the heat treatment temperature may vary depending on the melting point of the insulation, and in order to prevent melting up to the conductive paste filled in the ceramic thin plate 100, printed patterns and / or via holes during the heat treatment process, the insulation The melting point of may be lower than the melting point of the ceramic thin plate 100, the melting point of the conductive paste used for pattern printing and the melting point of the conductive paste filled in the via hole. Therefore, in this step, one embodiment of the present invention may be heat-treated at a temperature higher than the melting point of the insulation and lower than the melting point of the ceramic thin plate 100 and the melting point of the conductive paste.

Referring to FIG. 10, in the method of manufacturing a ceramic substrate for LEDs, the via hole b is extended to the insulating layer 400 formed on the via hole b, and the via hole c is formed on the insulating layer 400 formed on the via hole c. ) And extending the via hole (d) in the insulating layer (400) formed on the via hole (d), and forming the via hole (e) in the insulating layer (400) formed on the green LED electrode pattern (50). It includes.

Referring to FIG. 11, in the method of manufacturing a ceramic substrate for LEDs, conductive paste is filled in the via holes b, the via holes c, the via holes d, and the via holes e, and the common electrode pad pattern is formed on the via holes b. 60, a red LED electrode pad pattern 70 is formed on the via hole c, a blue LED electrode pad pattern 80 is formed on the via hole d, and a green LED electrode pad pattern is formed on the via hole e. Forming 90 and then heat treating it.

The via hole e is formed on the green LED electrode pattern 50 in the insulating layer 400, and the via hole b, the via hole c and / or the via hole d penetrate the insulating layer 400 to form an insulating layer ( It is formed extending to the upper surface of 400). The diameter of the via hole (e) may be 10 to 200 microns. The via hole e may be formed through a process such as laser irradiation, chemical etching, or the like. The conductor used in the conductive paste of this step may correspond to one or more of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W.

The red LED electrode pad pattern 70 is formed on the insulating layer 400 in contact with the via hole c, and is electrically connected to the red LED electrode pattern 30 through the via hole c.

The common electrode pad pattern 60 is formed on the insulating layer 400 in contact with the via hole b, and is electrically connected to the common electrode pattern 20 through the via hole b.

The green LED electrode pad pattern 90 is formed on the insulating layer 400 in contact with the via hole e, and is electrically connected to the green LED electrode pattern 50 through the via hole e.

The blue LED electrode pad pattern 80 is formed on the insulating layer 400 in contact with the via hole d, and is electrically connected to the blue LED electrode pattern 40 through the via hole d.

The red LED electrode pad pattern 70, the common electrode pad pattern 60, the green LED electrode pad pattern 90, and / or the blue LED electrode pad pattern 80 may have a thickness of 1 to 10 microns.

In this step, the heat treatment temperature depends on the melting point of the conductor used as the conductive paste, but when Ag is used as the conductive paste, the heat treatment temperature may correspond to 600 ° C to 900 ° C, preferably 800 ° C in the atmospheric environment. Can be.

Referring to FIG. 12, the method of manufacturing a ceramic substrate for LEDs includes a common electrode pad pattern 60, a red LED electrode pad pattern 70, a blue LED electrode pad pattern 80, a green LED electrode pad pattern 90, and insulation. Applying an insulation over the layer 400 and heat treatment to form an insulation layer 500.

In this step, the insulation is applied to the ceramic thin plate 100, the red LED electrode pad pattern 70, the common electrode pad pattern 60, the green LED electrode pad pattern 90, and / or the blue LED electrode pad pattern 80. It is applied with a material that does not affect it. The insulation may be an inorganic material and / or an organic material, the inorganic material may include glass, ceramics, and the like, and the organic material may include epoxy, polyimide, or the like. This insulation forms the insulation layer 500, the thickness of the bonding layer may be 2 to 100 microns.

In this step, the heat treatment temperature may vary depending on the melting point of the insulation, and in order to prevent melting up to the conductive paste filled in the ceramic thin plate 100, printed patterns and / or via holes during the heat treatment process, the insulation The melting point of the ceramic thin plate 100 may be lower than the melting point of the conductive paste used in the pattern printing, the melting point and the conductive paste filled in the via hole. Therefore, in this step, one embodiment of the present invention may be heat-treated at a temperature higher than the melting point of the insulation and lower than the melting point of the ceramic thin plate 100 and the melting point of the conductive paste.

Referring to FIG. 13, in the method of manufacturing a ceramic substrate for LEDs, red LED grooves are formed in the insulating layer 500 formed on the common electrode pad pattern 60 and the red LED electrode pad pattern 70, and the common electrode pad pattern is formed. The blue LED groove is formed in the insulating layer 500 formed on the 60 and blue LED electrode pad patterns 80, and the insulating layer 500 formed on the common electrode pad pattern 60 and the green LED electrode pad patterns 90 is formed. Forming a groove for the green LED, attaching the red LED (1) to the groove for the red LED, attaching the blue LED (3) to the groove for the blue LED, and inserting the green LED (for the green LED groove) Attaching 2); And / or planarizing the surface of the insulating layer 500 and one surface of the ceramic thin plate 100.

The grooves for red LEDs, grooves for blue LEDs and / or grooves for green LEDs represent grooves for inserting and combining LEDs emitting three primary colors into the ceramic substrate for the LED.

The red LED 1 is attached to the groove for the red LED so that the common electrode of the red LED 1 contacts the common electrode pad pattern 60 and the non-common electrode contacts the red LED electrode pad pattern 70. . The blue LED 3 is attached to the groove for the blue LED so that the common electrode of the blue LED 3 contacts the common electrode pad pattern 60 and the non-common electrode contacts the blue LED electrode pad pattern 80. . Similarly, the green LED 2 is placed in the groove for the green LED such that the common electrode of the green LED 2 is in contact with the common electrode pad pattern 60 and the non-common electrode is in contact with the green LED electrode pad pattern 60. Attached.

Thus, the common electrode of the red LED 1 is electrically connected to the common electrode pattern 20 existing in the insulating layer 200 through the common electrode pad pattern 60 and the via hole b, and the common electrode pattern 20. ) Is electrically connected to the bottom pattern 10 through the via hole a, so that the common electrode of the red LED 1 is connected to the positive or negative pole of the power source connected to the bottom pattern 10. The remaining electrode of the red LED 1 is electrically connected to the red LED electrode pattern 30 existing in the insulating layer 300 through the red LED electrode pad pattern 70 and the via hole c. The pattern 30 may have a bottom pattern 10 through a via hole (not shown) formed through the insulating layer 200, and a via hole (a) formed through the ceramic thin plate 100 and another via hole (not shown). By being electrically connected to another bottom pattern (not shown), the remaining electrode of the red LED 1 is connected to the positive or negative pole of the power source connected to the bottom pattern (not shown).

Similarly, the common electrode of the blue LED 3 is electrically connected to the common electrode pattern 20 existing in the insulating layer 200 through the common electrode pad pattern 60 and the via hole b, and the common electrode pattern 20. ) Is electrically connected to the bottom pattern 10 through the via hole a, so that the common electrode of the blue LED 3 is connected to the positive or negative pole of the power source connected to the bottom pattern 10. The other electrode of the blue LED 3 is electrically connected to the blue LED electrode pattern 40 existing in the insulating layer 300 through the blue LED electrode pad pattern 80 and the via hole d, and the blue LED electrode. The pattern 40 may have a bottom pattern 10 through a via hole (not shown) formed through the insulating layer 200 and via holes (a) and other via holes (not shown) formed through the ceramic thin plate 100. By being electrically connected to another bottom pattern (not shown), the remaining electrode of the blue LED 3 is connected to the positive or negative pole of the power source connected to the bottom pattern (not shown).

In addition, the common electrode of the green LED 2 is also electrically connected to the common electrode pattern 20 existing in the insulating layer 200 through the common electrode pad pattern 60 and the via hole b, and the common electrode pattern 20. ) Is electrically connected to the bottom pattern 10 through the via hole a, so that the common electrode of the green LED 2 is connected to the (+) or (-) pole of the power source connected to the bottom pattern 10. The remaining electrode of the green LED 2 is electrically connected to the green LED electrode pattern 50 present in the insulating layer 400 through the green LED electrode pad pattern 60 and the via hole e, and the green LED electrode. The pattern 50 may include a via hole (not shown) formed through the insulating layer 300 and the insulating layer 200, and a via hole (a) formed through the ceramic thin plate 100 and another via hole (not shown). By being electrically connected to the bottom pattern 10 and another bottom pattern (not shown) through, the remaining electrode of the green LED (2) is connected to the (+) or (-) pole of the power source connected to the bottom pattern (not shown) do.

As described above, according to the method of manufacturing a ceramic substrate for LEDs, through the interlayer electrical connection using patterns and via holes formed in each layer together with the laminated substrate structure, it is not necessary to drill holes in the substrate as many as the number of LED electrodes. Thereby, processing efficiency can be improved and the flexible property of a board | substrate can be maintained.

Furthermore, according to the method of manufacturing a ceramic substrate for LEDs, by utilizing a ceramic thin plate having high thermal conductivity and low thermal deformation, heat is efficiently emitted from the LED, and the deformation caused by such heat is less, and thus the durability is very high compared to a conventional PCB substrate.

In addition, according to the method of manufacturing a ceramic substrate for LEDs, by using a thin ceramic plate that can be manufactured in a thin thickness, it is possible to firmly attach a micro-LED having a smaller size while having all the above-described effects.

According to an embodiment of the present invention, the method for manufacturing a ceramic substrate for LEDs includes two LED ceramic substrates connected to each other, and one LED ceramic and the other LED ceramic provided on the rightmost side of the ceramic substrate for one LED. And cutting the outer circumferential surface of the ceramic substrate for LEDs such that the spacing between the LEDs provided on the leftmost side of the substrate is equal to the spacing between the LEDs provided in one ceramic substrate for LEDs.

According to the method of manufacturing a ceramic substrate for LEDs, the ceramic substrate for LEDs may be manufactured by a unit of a block, and then a substrate having a desired size may be manufactured by a process of joining the manufactured blocks. In this case, the ceramic substrate for the LED may mean one block, and may mean a completed substrate to which a plurality of blocks are attached.

All LED spacings must be constant on boards made of multiple blocks. Therefore, in the process of joining the block and the block, the spacing between the LEDs of each block closest to each other in contact with the two blocks should be equal to the LED spacing in one block.

To this end, the present invention adjusts the LED spacing by cutting the outer peripheral surface of the block. For example, the block may be cut so that the outer circumferential surface of the block is formed close to the outer surface of the via hole existing near the outer circumferential surface of the block, or the block may be cut so that the outer circumferential surface of the block crosses the origin of the via hole.

This process may be performed using a defendant laser, and this precise cutting may be possible because a thin plate made of ceramic material is used.

According to one embodiment of the present invention, the insulation forming the insulating layer 500 of FIG. 13 may be black. This can be implemented by including a black pigment in the insulation, thereby forming a partition of the black insulating layer 500 between each LED to prevent the light emitted from each LED is mixed with each other.

The protection scope of the present invention is not limited to the description and the expression of the embodiments explicitly described above. In addition, it is further noted that the scope of protection of the present invention may not be limited due to obvious changes or substitutions in the technical field to which the present invention pertains.

1: red LED 2: green LED
3: blue LED 10: bottom pattern
20: common electrode pattern 30: red LED electrode pattern
40: blue LED electrode pattern 50: green LED electrode pattern
60: common electrode pad pattern 70: red LED electrode pad pattern
80: blue LED electrode pad pattern 90: green LED electrode pad pattern
100: ceramic thin plate 200, 300, 400, 500: insulating layer
a, b, c, d, e: via hole

Claims (8)

Forming a via hole (a) at an edge of the ceramic thin plate (100);
Filling the via hole (a) with a conductive paste and performing heat treatment;
Forming a bottom pattern 10 on one surface of the ceramic thin plate 100 and performing heat treatment;
Forming a common electrode pattern 20 on the other surface of the ceramic thin plate 100 and performing heat treatment;
Forming an insulating layer 200 by applying an insulating material and heat treatment to the other surface of the ceramic thin plate 100 and the common electrode pattern 20;
Forming a via hole (b) in the insulating layer (200) formed on the common electrode pattern (20);
Filling a conductive paste into the via hole (b), forming a red LED electrode pattern 30 and a blue LED electrode pattern 40 on the insulating layer 200 and then performing heat treatment;
Forming an insulating layer 300 by applying and thermally insulating an insulating layer on the via hole (b), the insulating layer 200, the red LED electrode pattern 30, and the blue LED electrode pattern 40;
The via hole b is extended in the insulating layer 300 formed on the via hole b, the via hole c is formed in the insulating layer 300 formed on the red LED electrode pattern 30, and the blue LED electrode pattern 40 is formed. Forming a via hole (d) in the insulating layer (300) formed on the substrate;
Filling a conductive paste into the via hole (b), the via hole (c) and the via hole (d), and forming and heat-treating the green LED electrode pattern 50 on the insulating layer 300;
Forming an insulating layer 400 by applying and thermally treating an insulating material on the via hole (b), the via hole (c), the via hole (d), the insulating layer 300 and the green LED electrode pattern 50;
The via hole (b) extends in the insulating layer 400 formed on the via hole (b), and the via hole (c) extends in the insulating layer 400 formed on the via hole (c), and the insulating layer formed on the via hole (d). Forming a via hole d in the 400 and forming a via hole e in the insulating layer 400 formed on the green LED electrode pattern 50; And
A conductive paste is filled in the via holes (b), the via holes (c), the via holes (d), and the via holes (e), the common electrode pad pattern 60 is formed on the via holes (b), and the red LED electrodes on the via holes (c). Forming a pad pattern 70, forming a blue LED electrode pad pattern 80 on the via hole d, forming a green LED electrode pad pattern 90 on the via hole e, and then performing heat treatment. Method for manufacturing a ceramic substrate for LED. The method according to claim 1, The ceramic substrate manufacturing method for LED,
Insulating layer is applied to the common electrode pad pattern 60, the red LED electrode pad pattern 70, the blue LED electrode pad pattern 80, the green LED electrode pad pattern 90, and the insulating layer 400 and then heat treated. Forming 500;
Red LED grooves are formed in the insulating layer 500 formed on the common electrode pad pattern 60 and the red LED electrode pad pattern 70, and are formed on the common electrode pad pattern 60 and the blue LED electrode pad pattern 80. Forming a groove for the blue LED in the insulating layer 500 and forming a groove for the green LED in the insulating layer 500 formed on the common electrode pad pattern 60 and the green LED electrode pad pattern 90;
Attaching a red LED to the groove for the red LED, attaching a blue LED to the groove for the blue LED, and attaching the green LED to the groove for the green LED; And
The method of manufacturing a ceramic substrate for an LED, characterized in that it further comprises the step of planarizing the surface of the insulating layer (500) and one surface of the ceramic thin plate (100). The method according to claim 2,
Method for producing a ceramic substrate for the LED, characterized in that the insulating layer forming the insulating layer 500 is black. The method according to claim 2, The ceramic substrate manufacturing method for LED,
When the two LED ceramic substrates are connected to each other, the distance between the LED provided on the rightmost side of one of the ceramic substrates for LEDs and the LED provided on the leftmost side of the other ceramic substrate for one LED, And cutting the outer circumferential surface of the ceramic substrate for LEDs so as to be equal to the spacing between the LEDs provided in the ceramic substrates. The method according to claim 2,
The insulation corresponds to at least one of glass, ceramic, epoxy and polyimide,
The thickness of at least any one of the insulating layer (200), the insulating layer (300), the insulating layer (400) and the insulating layer (500) corresponds to 2 to 100 microns. The method according to claim 2,
The conductive paste corresponds to at least one material of Ag, Cu, Au, Pd, Pt, Ag-Pd, Ni, Mo, and W,
The thickness of at least one of the common electrode pattern 20, the red LED electrode pattern 30, the blue LED electrode pattern 40 and the green LED electrode pattern 50 corresponds to 1 to 10 microns Ceramic substrate manufacturing method. The method according to claim 2,
At least one of the via hole (a), the via hole (b), the via hole (c), the via hole (d) and the via hole (e) has a diameter corresponding to 10 to 200 microns. The ceramic substrate for LED manufactured by the manufacturing method of the ceramic substrate for LED of Claim 1 or 2.

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