KR102074224B1 - Exhaust damper structure for wafer handling device - Google Patents

Abstract

A disclosed exhaust damper structure for a substrate processing device includes a balloon member so that the inside of an exhaust member can be completely sealed by the balloon member, which is an exhaust damper, and has an advantage of preventing leaks in the exhaust member. The exhaust damper structure for the substrate processing device includes: a balloon member arranged on the exhaust member; and an organic compound removing member capable of removing an organic compound carried on a gas flowing along the exhaust member.

Description

Exhaust damper structure for wafer handling device

The present invention relates to an exhaust damper structure for a substrate processing apparatus.

The semiconductor and display manufacturing equipment is applied with a substrate processing apparatus for processing, for example, cleaning a wafer for semiconductor and display manufacturing, which includes a chuck member on which a substrate is placed, and the substrate mounted on the chuck member. A processing liquid supply member for supplying the processing liquid toward the substrate, a bowl for receiving a cleaning liquid supplied from the processing liquid supply member to the substrate on the chuck member and separated from the substrate, and via the substrate. And an exhaust member through which the gas from which the foreign matter has been removed is exhausted.

Here, the exhaust member is made in the form of a tube, and an exhaust damper is provided to open and close the exhaust member, which can be presented as an example of the exhaust damper, which is one of the patent documents set out below.

However, in the conventional substrate processing apparatus, the exhaust damper is formed in a plate shape that is simply rotated inside the exhaust member in the form of a tube, and is configured to open and close the exhaust damper while being rotated, so that the exhaust damper is inside the exhaust member. There was a problem in that the seal was not completely sealed and leaks occurred.

Patent No. 10-1542489, Registered Date: July 31, 2015, Name of the Invention: Exhaust Damper for Semiconductor Equipment

It is an object of the present invention to provide an exhaust damper structure for a substrate processing apparatus in which the exhaust damper can completely seal the inside of the exhaust member.

An exhaust damper structure for a substrate processing apparatus according to an aspect of the present invention includes a chuck member on which a substrate is placed, a processing liquid supply member supplying a processing liquid toward the substrate mounted on the chuck member, and mounted on the chuck member. Applied to a substrate processing apparatus including an exhaust member through which the gas passing through the substrate is exhausted,

It is disposed on the exhaust member, it can swell inside the exhaust member to seal the inside of the exhaust member while in contact with the inner surface of the exhaust member as a whole, and the inside of the exhaust member is opened while being contracted in the exhaust member A balloon member capable of being made; And
And an organic compound removing member capable of removing the organic compound carried in the gas flowing along the exhaust member.
The organic compound removing member is formed on the inner surface of the balloon member, the photocatalyst coating portion coated with a photocatalyst, and the photocatalyst coated portion to the ultraviolet light to the photocatalyst coating portion to be activated to remove the organic compound It is characterized by including an ultraviolet lamp to irradiate.

According to the exhaust damper structure for a substrate processing apparatus according to an aspect of the present invention, as the exhaust damper structure for a substrate processing apparatus includes a balloon member, the balloon member, which is an exhaust damper, can be completely sealed inside the exhaust member. Therefore, there is an effect that the leak in the exhaust member can be prevented.

1 is a view showing a substrate processing apparatus to which an exhaust damper structure for a substrate processing apparatus according to a first embodiment of the present invention is applied;
FIG. 2 is an enlarged view of a portion A shown in FIG. 1. FIG.
3 is a view showing a state that the balloon member constituting the exhaust damper structure for a substrate processing apparatus according to the first embodiment of the present invention is contracted.
4 is a view showing an expanded state of a balloon member constituting the exhaust damper structure for a substrate processing apparatus according to the second embodiment of the present invention.
FIG. 5 is a view showing the balloon member and the spaced sealing expansion member constituting the exhaust damper structure for the substrate processing apparatus according to the third embodiment of the present invention inflated. FIG.
FIG. 6 is a view showing a balloon, a spaced sealing expansion member, and an internal expansion member swelling forming the exhaust damper structure for a substrate processing apparatus according to a fourth embodiment of the present invention; FIG.
FIG. 7 is a view showing an organic side opening / closing damper constituting the exhaust damper structure for the substrate processing apparatus according to the fifth embodiment of the present invention and the damper expansion member in the retracted state; FIG.
8 is a view showing a state in which the damper expansion member shown in FIG. 7 is inflated.

Hereinafter, an exhaust damper structure for a substrate processing apparatus according to embodiments of the present invention will be described with reference to the drawings.

1 is a view showing a substrate processing apparatus to which an exhaust damper structure for a substrate processing apparatus according to a first embodiment of the present invention is applied, FIG. 2 is an enlarged view of a portion A shown in FIG. 1, and FIG. The balloon member constituting the exhaust damper structure for a substrate processing apparatus according to the first embodiment of FIG.

1 to 3 together, the exhaust damper structure 190 for a substrate processing apparatus according to the present embodiment is applied to the substrate processing apparatus 100 and includes a balloon member 197.

The substrate processing apparatus 100 includes a chuck member 120, a treatment liquid supply member 180, and an exhaust member 114.

The substrate processing apparatus 100 may further include a fan filter member 105, a Paul 150, chuck pins 130 and 140, a Paul lifting member 170, and a chuck rotating member 125. have.

Reference numeral 110 indicates that the chuck member 120, the processing liquid supply member 180, the paul 150, the paul elevating member 170, and the chuck rotating member 125 are disposed inside and isolated from the outside. Reference numeral 101 is a control member 101 capable of controlling each component of the substrate processing apparatus 100.

The chuck member 120 is to be mounted on the substrate 10, is formed in the form of a circular plate, the heater and the like is embedded therein.

The chuck rotating member 125 may rotate the chuck member 120. The chuck rotating member 125 may rotate the chuck rotating shaft 126 and the chuck rotating shaft 126 connected to a lower portion of the chuck member 120. And chuck rotation means 127, such as an electric motor, which can be used.

The processing liquid supply member 180 supplies the processing liquid toward the substrate 10 mounted on the chuck member 120, and the processing liquid supplying the processing liquid such as a cleaning liquid toward the chuck member 120. A supply nozzle 182 for injecting the processing liquid supplied through the supply pipe 181, the processing liquid supply pipe 181 onto the substrate 10 on the chuck member 120, and the processing liquid supply pipe 181. Supply pipe rotation axis 183 is connected to, and the supply pipe rotation means 184, such as an electric motor that can rotate the supply pipe rotation axis 183 within a predetermined angle range.

The paul 150 receives the processing liquid supplied from the processing liquid supply member 180 to the substrate 10 on the chuck member 120 and is separated from the substrate 10. The first Paul 151 disposed relatively outermost from 120, the third Paul 157 disposed relatively innermost from the chuck member 120, the first Paul 151 and the first 3 Include a second Paul (154) placed between Paul (157).

The first Paul 151 has a first Paul body 152 formed in the shape of a circular cylinder, the upper portion of which is open, and the chuck member 120 gradually from an upper end of the first Paul Body 152 to the upper side thereof. It includes a first Paul incidence 153 is formed in the shape of a solid open top so as to narrow toward ().

The third Paul 157 has a third Paul body 158 formed in the shape of a circular cylinder with an upper portion thereof opened, and the chuck member 120 gradually from an upper end of the third Paul Body 158 to an upper side thereof. It includes a third Paul incidence 159 is formed in the form of a solid open upper portion so as to narrow toward ().

The second Paul 154 has a second Paul body 155 formed in the shape of a circular cylinder with an upper portion thereof opened, and the chuck member 120 gradually from an upper end of the second Paul Body 155 toward an upper side thereof. It includes a second Paul incidence 156 is formed in the form of a solid open upper portion so as to narrow toward ().

Here, the first Paul body 152, the second Paul body 155 and the third Paul body 158 is defined as a Paul body formed in the shape of a circular cylinder whose upper portion is open, the first Paul The incidence 153, the second Paul incidence 156 and the third Paul incidence 159 are gradually upwardly narrowed toward the chuck member 120 from the upper end of the Paul body toward the upper side thereof. Is defined as Paul's incidence formed into an open solid form.

The second Paul body 155 is positioned at intervals between the first Paul body 152 and the third Paul body 158, and the first Paul incidence 153 and the third Paul incidence are located. The second Paul incidence 156 is positioned at intervals between the sieves 159. Then, the chuck rotating member 125 in a state where the substrate 10 on the chuck member 120 is disposed at an entrance height between the first and second Paul incidence members 153 and 156. When the chuck member 120 is rotated by, the first liquid of the processing liquid flows through the inlet between the first Paul incident member 153 and the second Paul incident member 156 to allow the first Paul. The substrate 10 on the chuck member 120 is connected with the second Paul incidence 156 while the inside of the body 152 is accommodated and the Paul 150 is lifted by the Paul elevating member 170. When the chuck member 120 is rotated by the chuck rotating member 125 while being disposed at the entrance height between the third Paul incidence bodies 159, the second liquid in the processing liquid enters the second Paul incident. Flows through an inlet between the sieve 156 and the third Paul incidence 159 and is received inside the second Paul body 155 As the Paul 150 is lifted again by the Paul elevating member 170, the substrate 10 on the chuck member 120 is disposed at an entrance height below the third Paul incidence 159. When the chuck member 120 is rotated by the chuck rotating member 125 in a state, a third liquid of the processing liquid flows through an inlet below the third Paul incidence 159 and the third Paul body 158 is housed inside.

Reference numerals 160, 161 and 162 are formed at the bottom of the first Paul body 152, the second Paul body 155 and the third Paul body 158, respectively, the first Paul body 152, And a first discharge pipe, a second discharge pipe, and a third discharge pipe configured to respectively discharge the liquid contained in the second Paul body 155 and the third Paul body 158 to the outside.

The Paul elevating member 170 is capable of elevating the Paul 150 and extending in a bent form from the Paul connector 171 connected to the first Paul 151 and the Paul connector 171. And a Paul lift shaft 172 formed in parallel with the first Paul 151 and a Paul lift means 173 such as a hydraulic cylinder for lifting the Paul lift shaft 172.

The fan filter member 105 is installed above the chamber 110 and blows purified gas to the substrate 10 mounted on the chuck member 120. A filter for purifying the gas and a fan for forming an air stream of the gas are provided therein. The fan filter member 105 is general as already described in Patent No. 10-1417291, and the like. Illustration and description are omitted.

The fan filter member 105 may blow external air and blow it toward the substrate 10 mounted on the chuck member 120. The fan filter member 105 may recirculate and purify the gas exhausted through the exhaust member 114. Next, the chuck member 120 may be blown toward the substrate 10.

The exhaust member 114 is purified by the fan filter member 105 and the substrate 10 on which the gas blown into the substrate 10 mounted on the chuck member 120 is mounted on the chuck member 120. It is a passage through which air is exhausted.

In detail, the exhaust member 114 includes an exhaust source pipe 111 in communication with a bottom surface of the chamber 110, an inorganic side exhaust branch pipe 112 branched to one side from the exhaust source pipe 111, and the exhaust source pipe. An organic side exhaust branch pipe 113 branched to the other side at 111 is included.

The inorganic side exhaust branch pipe 112 is provided with an inorganic side open / close damper 115 capable of opening and closing the inorganic side exhaust branch pipe 112.

The inorganic side opening / closing damper 115 is formed in the form of a circular plate which can block the inorganic side exhaust branch pipe 112, and thus the outer side of the inorganic side opening / closing damper 115 is formed in the inorganic side exhaust branch pipe 112. When rotated so as to face the inner surface of the), the inorganic side opening and closing damper 115 is blocked by the inorganic side exhaust branch pipe 112, the remaining portion except the rotation axis of the inorganic side opening and closing damper 115 is the weapon When rotated to be spaced apart from the inner surface of the side exhaust branch pipe 112, the inorganic side exhaust branch pipe 112 is opened by the inorganic side opening and closing damper 115.

The inorganic compound may be exhausted together with the gas through the inorganic side exhaust branch pipe 112 and the organic compound through the organic side exhaust branch pipe 113, respectively.

The chuck pins 130 and 140 protrude to a predetermined height from the chuck member 120 to support the substrate 10 mounted on the chuck member 120, to remove static electricity of the substrate 10. Carbon nanotubes (CNT) are mixed and molded to have conductivity.

In detail, the chuck pins 130 and 140 are formed by mixing and molding the carbon nanotubes and polyether ether ketone (PEEK).

When the configuration is configured as described above, the chuck pins 130 and 140 may be conductive to remove static electricity of the substrate 10, and may have a resistance of 10 μm 3 Ω or less.

The chuck pins 130 and 140 are manufactured by injection molding a mixture of the carbon nanotubes and the polyether ether ketone. Then, uniformity of the chuck pins 130 and 140 may be improved.

The chuck pins 130 and 140 include a support pin member 130 and an outer chuck pin member 140.

The support pin member 130 supports the substrate 10 on the bottom surface of the substrate 10.

The outer chuck pin member 140 has the substrate at the side of the substrate 10 such that the substrate 10 is prevented from being separated from the chuck member 120 when the chuck member 120 is rotated. 10) to support.

The support pin member 130 and the outer chuck pin member 140 may each be manufactured integrally by injection molding a mixture of the carbon nanotubes and the polyether ether ketone.

A plurality of the support pin member 130 and the outer chuck pin member 140 are arranged on the chuck member 120, and the support pin member 130 is relatively larger than the outer chuck pin member 140. The chuck member 120 is disposed at a position eccentrically toward the center.

In this embodiment, the balloon member 197 is disposed in the exhaust member 114, in detail, the organic side exhaust branch pipe 113, so that the exhaust member 114, in detail the organic side exhaust branch pipe ( Swells inside the 113 and contacts the exhaust member 114, in detail, the inner surface of the organic side exhaust branch pipe 113, and in detail, the exhaust member 114, in detail, the organic side exhaust branch pipe 113. The inside of the exhaust member 114, the organic side exhaust branch pipe 113, and the inside of the exhaust member 114, the organic side exhaust branch pipe 113, while being contracted in the interior of the exhaust member 114, the organic side exhaust branch pipe 113 It can open up.

The balloon member 197 may be made of an elastic material, for example, a rubber material, and may be formed in a sealed form to the outside to swell or contract in a sphere shape.

The exhaust damper structure 190 for the substrate processing apparatus includes a high pressure air supply unit 191 and a high pressure air delivery pipe 192.

The high pressure air supply means 191 supplies high pressure air for inflating the balloon member 197, and a high pressure pump may be provided as an example.

The high pressure air delivery pipe 192 connects the high pressure air supply means 191 and the balloon member 197, and a high pressure air flow hole 193 through which the high pressure air flows is formed.

The high pressure air supply means 191 is disposed outside the exhaust member 114, specifically the organic side exhaust branch pipe 113, and the high pressure air delivery pipe 192 is the exhaust member 114, in detail. The high pressure air supply means 191 and the balloon member 197 communicate with each other through the organic side exhaust branch pipe 113, and the exhaust member 114, in detail, the organic side exhaust branch pipe 113. And which flows along the exhaust member 114, in detail the organic side exhaust branch pipe 113, at the center of the exhaust member 114, in detail in the organic side exhaust branch pipe 113. It is made in the form bent vertically in the flow direction of the gas.

The exhaust member 114 at the distal end of the high pressure air delivery pipe 192, that is, the exhaust member 114, in detail, at the central portion of the organic side exhaust branch pipe 113, and in detail, the organic side exhaust branch pipe 113. A portion bent vertically in the flow direction of the gas flowing along the) is inserted into the balloon member 197, the end portion of the high pressure air delivery pipe 192 and the high pressure air flow hole (193) and the The high pressure air injection hole 194 communicating with the inside of the balloon member 197 is formed.

The high pressure air injection hole 194 is formed in plural to be spaced apart from each other at the distal end of the high pressure air delivery pipe 192, the balloon member 197 in a position surrounding all of the plurality of high pressure air injection hole (194) The high pressure air delivery pipe 192 is tightly coupled. Then, the high pressure air supplied through the high pressure air delivery pipe 192 is supplied to the balloon member 197 through the plurality of high pressure air injection holes 194, and the balloon member 197 may swell. In addition, when a negative pressure is applied through the high pressure air delivery pipe 192, the balloon member 197 may be contracted.

Reference numeral 195 denotes a balloon control unit for controlling expansion and contraction of the balloon member 197, and reference numeral 196 denotes a pressure sensing sensor for detecting a pressure inside the high pressure air delivery pipe 192.

Hereinafter, an operation of the substrate processing apparatus 100 to which the exhaust damper structure 190 for the substrate processing apparatus according to the present embodiment is applied will be described with reference to the accompanying drawings.

When the chuck rotating member 125 is operated while the substrate 10 is supported and fixed to the chuck pins 130 and 140 of the chuck member 120, the chuck member 120 and the substrate ( 10) will rotate.

In this state, when the processing liquid supply member 180 supplies the processing liquid onto the substrate 10, the processing liquid is sputtered on the substrate 10, and the processing such as cleaning on the substrate 10 is performed. Is done.

The processing liquid which has completed the processing such as cleaning of the substrate 10 is returned to the corresponding Paul of the Paul 150.

On the other hand, during the processing of the substrate 10 mounted on the chuck member 120 as described above, the gas is blown toward the substrate 10 in the fan filter member 105.

The gas blown toward the substrate 10 carries the organic compound generated during the processing of the substrate 10 loaded on the chuck member 120 while passing through the substrate 10 to the exhaust member. Ejected through 114.

When the organic side exhaust branch pipe 113 of the exhaust member 114 is to be opened, the high pressure air supply means 191 forms a negative pressure, and accordingly the balloon member 197 contracts and thus the organic side. The exhaust branch pipe 113 is opened.

On the other hand, when the organic side exhaust branch pipe 113 of the exhaust member 114 should be closed, the high pressure air supply means 191 forms the high pressure air, and the balloon member 197 expands accordingly. The organic side exhaust branch pipe 113 is closed.

As described above, as the exhaust damper structure 190 for the substrate processing apparatus includes the balloon member 197, the balloon inside the organic side exhaust branch pipe 113 among the exhaust members 114 may be an exhaust damper. The member 197 can be completely sealed, so that leakage in the exhaust member 114 can be prevented.

Hereinafter, an exhaust damper structure for a substrate processing apparatus according to other exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In carrying out this description, descriptions overlapping with those already described in the above-described first embodiment of the present invention will be replaced with the description thereof, and will be omitted herein.

4 is a view showing an expanded state of the balloon member constituting the exhaust damper structure for a substrate processing apparatus according to the second embodiment of the present invention.

Referring to FIG. 4, the exhaust damper structure for the substrate processing apparatus according to the present embodiment further includes an organic compound removing member 298 together with the balloon member 297.

The organic compound removing member 298 may remove the organic compound loaded on the gas flowing along the exhaust member.

In detail, the organic compound removing member 298 includes a photocatalyst coating portion 298a and an ultraviolet lamp 298b.

The photocatalyst coating part 298a is formed on the inner surface of the balloon member 297 and is coated with a photocatalyst, and preferably, the photocatalyst is coated on the entire inner surface of the balloon member 297.

Titanium dioxide (TiO ₂ ) may be presented as the photocatalyst.

The ultraviolet lamp 298b irradiates ultraviolet rays to the photocatalyst coating part 298a so that the photocatalyst coated on the photocatalyst coating part 298a can be activated to remove the organic compound, and the balloon member 297 ), For example, inside the high pressure air flow hole 293.

As described above, as the organic compound removing member 298 is applied, the organic compound carried in the gas flowing along the exhaust member may be removed by the active oxygen generated in the organic compound removing member 298. do.

FIG. 5 is a view showing the balloon member and the spaced sealing expansion member constituting the exhaust damper structure for the substrate processing apparatus according to the third embodiment of the present invention inflated.

Referring to FIG. 5, the exhaust damper structure for the substrate processing apparatus according to the present embodiment further includes a spaced sealing expansion member 399 along with the balloon member 397.

When the balloon member 397 is inflated, the spaced seal expansion member 399 is spaced apart from the contact portion of the balloon member 397 with the inner surface of the exhaust member, specifically, the organic side exhaust branch pipe. By inflating with the balloon member 397, the balloon member 397 seals the inside of the exhaust member separately from the balloon member 397 at a position spaced apart from the contact portion with the inner surface of the exhaust member by a predetermined distance. .

In detail, the spaced sealing expansion member 399 includes a front spaced sealing expansion balloon 399a and a rear spaced sealing expansion balloon 399b.

The front spaced-around expanded balloon 399a is disposed at a position spaced apart from the highest point of the balloon member 397 by the maximum when the balloon member 397 is inflated at a predetermined interval toward the chuck member, and the balloon member ( By communicating with the inside of the 397c through the front side communication hole 399c, a portion of the high pressure air supplied into the inside of the balloon member 397 when the balloon member 397 swells opens the front side communication hole 399c. It is drawn through it and can swell separately from the surface of the balloon member 397.

The front spaced apart expansion expansion balloon 399a is made of an elastic material such as a rubber material.

The front-sided spaced-amplified expanded balloon 399a has a circular cross-section at a position spaced apart from the highest point of the balloon member 397 at the time when the balloon member 397 is fully inflated toward the chuck member. By being formed in a ring shape, it can be swollen to be in contact with the inside of the exhaust member as a whole.

The rear spaced-around expanded balloon 399b is disposed at a position spaced apart from the highest point of the balloon member 397 when the balloon member 397 is fully inflated, and the balloon member 397 is The balloon member is formed at a position symmetrical with the front-sided spaced-around expansion balloon 399a on the basis of the highest point when it is inflated and communicates with the inside of the balloon member 397 through the rear communication hole 399d. When 397 is inflated, a part of the high pressure air supplied into the balloon member 397 may be introduced through the rear communication hole 399d to separately inflate from the surface of the balloon member 397. .

The rear spaced apart expansion expansion balloon 399b is made of an elastic material such as a rubber material.

The rear spaced-around expanded balloon 399b is formed in a ring shape having a circular cross section at a position spaced apart from a peak at a time when the balloon member 397 is fully inflated from the surface of the balloon member 397. As a result, it is possible to swell to be in contact with the inside of the exhaust member as a whole.

By being formed as mentioned above, by the supply of the said high pressure air, the said front spaced apart spaced expansion balloon 399a, the balloon member 397, and the rear spaced spaced sealed expansion balloon 399b are respectively exhausted independently from the position spaced apart. It is possible to seal the inside of the exhaust member at a plurality of points while contacting the inner surface of the member as a whole.

Hereinafter, an exhaust damper structure for a substrate processing apparatus according to a fourth embodiment of the present invention will be described with reference to the drawings. In carrying out this description, descriptions overlapping with those already described in the above-described first and third embodiments of the present invention will be replaced by the description thereof, and will be omitted herein.

FIG. 6 is a view showing a state in which the balloon member, the spaced sealing expansion member, and the internal expansion member constituting the exhaust damper structure for the substrate processing apparatus according to the fourth embodiment of the present invention are inflated.

Referring to FIG. 6, the exhaust damper structure for the substrate processing apparatus according to the present embodiment further includes an internal expansion member 402 together with the balloon member 497 and the spaced apart sealing member 499.

The inner expansion member 402 swells inside the balloon member 497 when the balloon member 497 swells, thereby pushing the balloon member 497 toward the inner surface of the exhaust member.

In detail, the inner expansion member 402 includes an inner balloon 402a, an inner balloon connecting pipe 402b, and an elastic member 402c.

The internal expansion member 402 may be disposed in plurality at a plurality of points spaced apart from each other.

The inner balloon 402a is disposed in the balloon member 497 and is made of an elastic material such as a rubber material so as to swell inside the balloon member 497. The inner balloon 402a may be inflated in the form of a sphere.

The inner balloon connecting pipe 402b communicates the inner balloon body 402a with one of the plurality of high pressure air injection holes 494 to supply the high pressure air delivered through the high pressure air delivery pipe 492 to the inner balloon body ( 402a).

The elastic member 402c is disposed between the inner balloon body 402a and the high pressure air delivery pipe 492, and is compressed when the inner balloon body 402a swells and is compressed by the restoring force thereof. By pushing 402a toward the inner surface of the exhaust member, a compression spring or the like can be given as an example.

When comprised as mentioned above, by the supply of the said high pressure air, the said balloon member 497 and the said internal balloon 402a swell together, and the balloon member 497 abuts the inner surface of the said exhaust member entirely, An inner balloon 402a pushes the balloon member 497 inside the balloon member 497 so that the balloon member 497 comes into close contact with the inner surface of the exhaust member, and the elastic member 402c is compressed. The inner balloon 402a is pushed toward the inner surface of the exhaust member by the restoring force so that the balloon member 497 is in close contact with the inner surface of the exhaust member.

Here, the inner balloon 402a is shown to be inflated in a spherical shape, but this is exemplary, and the inner balloon 402a is formed in a ring shape having a circular cross section, so that the inner surface of the balloon member 497 You can also come across.

FIG. 7 is a view illustrating an organic side opening / closing damper constituting the exhaust damper structure for a substrate processing apparatus and a damper expansion member in a retracted state, and FIG. 8 is a damper expansion member shown in FIG. 7. The figure shows an inflated state.

7 and 8 together, in the present embodiment, an organic side opening / closing damper 516 capable of opening and closing the organic side exhaust branch pipe 513 is provided in the organic side exhaust branch pipe 513.

The organic side opening / closing damper 516 may be formed to block the organic side exhaust branch pipe 513, for example, in a circular plate shape.

Reference numeral 517 denotes a damper rotating member capable of rotating the organic side opening / closing damper 516. The damper rotating member 517 is a damper rotating means 518 such as an electric motor, and the damper rotating means 518. And a damper rotation shaft 519 connecting a rotation shaft and a lower portion of the organic side opening / closing damper 516.

In the present embodiment, the damper expansion member 503 is disposed along the periphery of the organic side opening / closing damper 516.

The damper expansion member 503 is made of an elastic material such as rubber so as to be inflated by high pressure air supplied from the outside. When the high pressure air is supplied, the damper expansion member 503 swells along the outer side of the organic side opening / closing damper 516. Thus, the gap between the organic side opening / closing damper 516 and the organic side exhaust branch pipe 513 is filled, so that the organic side exhaust branch pipe 513 is sealed.

Reference numeral 504 denotes a high pressure air supply pipe for communicating the high pressure air supply means (not shown) such as an external high pressure pump and the damper expansion member 503.

When configured as described above, when the damper rotation means 518 is operated so that the damper rotation shaft 519 is rotated at an angle, for example, 90 °, as shown in FIG. 7, the organic side opening / closing damper 516. ) Is rotated to be parallel to the flow direction of the gas flowing along the organic side exhaust branch pipe 513, thereby opening the organic side exhaust branch pipe 513.

At this time, the high pressure air is blocked in the damper expansion member 503, so that the damper expansion member 503 maintains the contracted state along the outer side of the organic side opening / closing damper 516.

Then, when the damper rotation means 518 is operated so that the damper rotation shaft 519 is rotated further by an angle, for example, 90 °, as shown in FIG. 8, the organic side opening / closing damper 516 may be The organic side exhaust branch pipe 513 is rotated to be perpendicular to the flow direction of the gas flowing along the organic side exhaust branch pipe 513, thereby closing the organic side exhaust branch pipe 513.

In this case, the high pressure air is supplied to the damper expansion member 503 through the high pressure air supply pipe 504, and thus the damper expansion member 503 swells along the outer side of the organic side opening / closing damper 516. As a result, the gap between the organic side opening / closing damper 516 and the organic side exhaust branch pipe 513 that is in the state of blocking the organic side exhaust branch pipe 513 is filled by the damper expansion member 503. Thus, the inside of the organic side exhaust branch pipe 513 is sealed.

While the invention has been shown and described with respect to specific embodiments thereof, those skilled in the art can variously modify the invention without departing from the spirit and scope of the invention as set forth in the claims below. And that it can be changed. Nevertheless, it will be clearly understood that all such modifications and variations are included within the scope of the present invention.

According to the exhaust damper structure for a substrate processing apparatus according to an aspect of the present invention, since the exhaust damper can completely seal the inside of the exhaust member, it is said that the industrial applicability is high.

100: substrate processing apparatus
120: chuck member
150 Paul
180: treatment liquid supply member
190: Exhaust damper structure for substrate processing apparatus
197 balloon member

Claims (6)

A substrate including a chuck member on which a substrate is raised, a processing liquid supply member supplying a processing liquid toward the substrate mounted on the chuck member, and an exhaust member through which the gas passing through the substrate mounted on the chuck member is exhausted As applied to the processing unit,
It is disposed on the exhaust member, it can swell inside the exhaust member to seal the inside of the exhaust member while in contact with the inner surface of the exhaust member as a whole, and the inside of the exhaust member is opened while being contracted in the exhaust member A balloon member capable of being made; And
And an organic compound removing member capable of removing the organic compound carried in the gas flowing along the exhaust member.
The organic compound removing member
A photocatalyst coating part formed on an inner surface of the balloon member and coated with a photocatalyst;
And an ultraviolet lamp for irradiating ultraviolet rays to the photocatalyst coating part so that the photocatalyst coated on the photocatalyst coating part can be activated to remove the organic compound. The method of claim 1,
The exhaust damper structure for the substrate processing apparatus is
High pressure air supply means for supplying high pressure air for inflating the balloon member; And
And a high pressure air delivery pipe connecting the high pressure air supplying means and the balloon member and having a high pressure air flow hole through which the high pressure air flows.
A distal end of the high pressure air delivery pipe is inserted into the balloon member, and a high pressure air injection hole for communicating the inside of the high pressure air flow hole and the balloon member is formed in the distal end of the high pressure air delivery pipe. Exhaust damper structure for processing unit. delete The method of claim 2,
The exhaust damper structure for the substrate processing apparatus is
When the balloon member swells, the balloon member swells with the balloon member at a position spaced apart from the portion in contact with the inner surface of the exhaust member by a predetermined distance, whereby the balloon member is fixed from a portion in contact with the inner surface of the exhaust member. Spaced apart sealing expansion member for sealing the interior of the exhaust member separate from the balloon member in a spaced apart position;
The spaced sealing expansion member
The balloon member is disposed at a position spaced apart from the highest point of the balloon member when the balloon member is inflated to the chuck member by a predetermined interval, and is in communication with the inside of the balloon member, when the balloon member is inflated A front-sided spaced-amplified expansion balloon in which a portion of the high-pressure air supplied into the air is drawn in and swells separately from the surface of the balloon member,
The balloon member is disposed at a position spaced apart from the highest point when the balloon member is inflated by a maximum swelling of the balloon member, and is symmetrical to the front spaced-apart closed expansion balloon based on the highest point when the balloon member is inflated to the maximum. Formed at a location and in communication with the interior of the balloon member such that a portion of the high pressure air supplied into the balloon member when the balloon member swells is introduced so that a rearward separation is possible to separately swell from the surface of the balloon member. Including a sealed expansion balloon,
By the supply of the high pressure air, the inside of the exhaust member is contacted with the inner surface of the exhaust member at a plurality of points while the front spaced-apart expansion expansion balloon, the balloon member, and the rear spaced-apart expansion expansion balloon are respectively spaced apart from each other. An exhaust damper structure for a substrate processing apparatus, which can be sealed. The method of claim 4, wherein
The exhaust damper structure for the substrate processing apparatus is
And an inner expansion member that swells inside the balloon member when the balloon member swells, thereby pushing the balloon member toward the inner surface of the exhaust member.
The inner expansion member
An inner balloon body disposed in the balloon member and capable of inflation in the balloon member;
An inner balloon connection pipe configured to communicate the inner balloon body with one of the plurality of high pressure air injection holes to supply the high pressure air delivered through the high pressure air delivery pipe to the inner balloon body;
A elastic member disposed between the inner balloon body and the high pressure air delivery pipe and configured to push the inner balloon body toward the inner surface of the exhaust member by a restoring force while being compressed when the inner balloon body is inflated;
By the supply of the high pressure air, the balloon member and the inner balloon body swell together, the balloon member contacts the inner surface of the exhaust member as a whole, and the inner balloon body pushes the balloon member inside the balloon member to push the balloon. The member is brought into close contact with the inner surface of the exhaust member, and the elastic member is compressed so that the balloon member is in close contact with the inner surface of the exhaust member by pushing the inner balloon toward the inner surface of the exhaust member by the restoring force. An exhaust damper structure for a substrate processing apparatus. The method of claim 1,
The exhaust member includes an organic side exhaust branch pipe through which an organic compound is exhausted with gas,
The organic side exhaust branch pipe is provided with an organic side open / close damper that can open and close the organic side exhaust branch pipe,
A damper expansion member is disposed along an outer side of the organic side opening / closing damper, and the damper extension member is made of a material having elasticity, thereby swelling along the outer side of the organic side opening / closing damper, thereby providing the organic side opening / closing damper and the organic side. An exhaust damper structure for a substrate processing apparatus, characterized in that the gap between the exhaust branch pipes is filled so that the organic side exhaust branch pipe is sealed.

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