KR102071634B1 - Pressure and temperature integrated sensor for expansion type valve - Google Patents

Abstract

The present invention relates to an integrated sensor for pressure and temperature for an expansion valve which can detect accurate measurement values. The integrated sensor for pressure and temperature for an expansion valve comprises: a housing including an empty upper coupling unit whose upper portion is opened, a middle body unit extended from the upper coupling unit and provided with a second chamber and a pressure inlet hole formed therein, and a temperature sensing unit protruding and being extended from the lower surface of the middle body unit; a connector including an empty cover having a shape whose lower portion is opened and being inserted and coupled to the upper coupling unit, and a plurality of connector pins arranging by penetrating the upper surface of the cover; a circuit board installed below the connector and electrically connected to the connector pins; a pressure sensing element installed below the connector and electrically connected to the circuit board to transfer an electric signal in accordance with a pressure change; a middle frame installed in the housing and provided with a pressure penetration hole formed at a position corresponding to the pressure inlet hole; a temperature sensing element installed in the temperature sensing unit and electrically connected to the circuit board to transfer an electric signal in accordance with a temperature change; and a sealing member which has a circular ring shape and is tightly fixed on the inner circumferential surface of the second chamber.

Description

Integrated temperature and pressure sensor for expansion valves {PRESSURE AND TEMPERATURE INTEGRATED SENSOR FOR EXPANSION TYPE VALVE}

The present invention relates to a temperature and pressure integrated sensor for an expansion valve, and more particularly, to an expansion valve temperature and pressure integrated sensor that can be installed in the expansion valve to detect the pressure and temperature of the object to be measured.

In general, the automotive air conditioning system for comfortably maintaining the temperature, humidity and air flow in the vehicle interior is composed of a controller, a heater core, an evaporator, a condenser, and a compressor. Here, expansion valve is the most basic controller in automobile air-conditioning system, and rapidly expands the high temperature and high pressure refrigerant sent from the compressor to the gas and delivers it to the evaporator. It will act as a lowering.

As such, the expansion valve is installed between the compressor and the evaporator to control the flow of the refrigerant flowing from the compressor to the evaporator. In general, a temperature-controlled automatic expansion valve is mainly used. The automatic expansion valve is provided with a temperature sensor and a pressure sensor to measure the pressure and temperature of the refrigerant.

In the related art, the temperature sensor and the pressure sensor were separately mounted on the automatic expansion valve, and accordingly, a separate space for sensing the temperature and pressure of the fluid had to be secured at the time of design, which leads to an increase in manufacturing cost. there was.

To solve this problem, an integrated temperature and pressure sensor with a temperature sensor and a pressure sensor in one module has been developed. However, in the conventional integrated temperature and pressure sensor, since the temperature element and the pressure element are provided in one housing, each element affects each other, causing an error in the accuracy and response time of each element.

In other words, the temperature element and the pressure element must be spaced apart from each other by a predetermined distance so as not to affect each other, so that the temperature element and the pressure element cannot be simultaneously located at the same position. However, this spaced distance between the temperature element and the pressure element makes it difficult to detect accurate measurements at the desired location.

Therefore, there is a need for an integrated temperature and pressure sensor that is isolated from the temperature element and the pressure element so as not to influence each other, and at the same time positioned as close as possible to detect accurate measurement values at a desired position.

1. Registered Patent No. 10-0545312 (registered on Jan. 16, 2006): Pressure sensor device with integrated temperature sensor

The present invention has been made to solve the above-described problems, it is possible to stably isolate the pressure inlet and temperature inlet through the pressure sensing element and the temperature sensing element located so that the pressure sensing element and the temperature sensing element are not affected by each other. It is an object of the present invention to provide an integrated temperature and pressure sensor for an expansion valve that allows the pressure sensing element and the temperature sensing element to be positioned as close as possible, so that accurate measurement values can be detected at the same desired position.

The objects of the embodiments of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description. .

According to an embodiment of the present invention, the integrated temperature and pressure sensor for the expansion valve of the present invention has an upper coupling portion having an empty inside and an open upper portion, and extending from the upper coupling portion and having a second chamber and a pressure inlet hole formed therein. A housing configured to include a central body part, a temperature sensing part protruding from the lower surface of the central body part, a cover having an empty shape inside the lower part of the lower part and being inserted into the upper coupling part and being coupled to the upper coupling part; A connector comprising a plurality of connector pins provided through the upper surface, a circuit board installed under the connector and electrically connected to the connector pin, and installed under the connector and electrically connected to the circuit board. And a pressure sensing element for transmitting an electrical signal according to the pressure change, and installed inside the housing and corresponding to the pressure inlet hole. An intermediate frame having a pressure through-hole formed at a predetermined position and a temperature sensing element installed inside the temperature sensing unit and electrically connected to the circuit board to transfer an electrical signal according to a temperature change, and having a circular ring shape. It may be characterized in that it comprises a sealing member that is tightly fixed to the inner peripheral surface of the chamber.

Specifically, the second chamber may be covered by the intermediate frame to the upper side and the pressure inlet hole is connected to the lower position.

Specifically, the temperature sensing unit may be characterized in that it is composed of the outer temperature sensing unit body and the temperature inlet hole inside the hollow cylindrical shape inside.

Specifically, the temperature inlet hole may be characterized in that the inside is filled with any one selected from polyimide resin, polyester resin, epoxy resin, Teflon resin and silicone resin.

Specifically, the upper edge of the second chamber forms a first inclined step inclined outward, the upper edge of the pressure inlet forms a second inclined step inclined outward, and the upper edge of the temperature inlet It may be characterized in that to form a third inclined stepped to the outside.

Specifically, the housing is made of aluminum, and the material of the cover contains a carbon fiber or glass fiber component for strength and impact resistance in a thermoplastic plastic of polyamide or polyphthalamide. The material of the pin may be characterized in that the brass.

Specifically, the circuit board may be a flexible PCB (FPCB) capable of bending or changing the shape.

Specifically, the pressure sensing device may be a semiconductor type for measuring the diaphragm deformation according to the pressure after the diaphragm is made of a silicon (Si) semiconductor.

Specifically, the intermediate frame is formed with at least one lead wire through-hole penetrating the intermediate frame body at a position corresponding to the temperature inlet hole, the material of the intermediate frame may be characterized in that the ceramic.

Specifically, the material of the sealing member is nitrile butadiene rubber (NBR), ethylene propylene rubber (EPDM), fluorinated rubber (FKM), acrylic rubber (ACM), silicone rubber (VMQ), fluorosilicone rubber (FVMQ), styrene Butadiene rubber (SBR), butadiene rubber (BR) and chloroprene rubber (CR) may be any one selected from.

The integrated temperature and pressure sensor for the expansion valve according to an embodiment of the present invention, the pressure inlet and temperature inlet through the pressure sensing element and the temperature sensing element is located so that the pressure sensing element and the temperature sensing element are not affected by each other. The pressure sensing element and the temperature are arranged side by side, but a sealing member is installed in the second chamber located at the upper end of the pressure inlet hole, and an intermediate frame is installed on the pressure inlet hole and the temperature inlet hole to increase the sealing effect and prevent the thermocouple. It is effective to stably isolate the sensing element.

In addition, the integrated temperature and pressure sensor for the expansion valve of the present invention by forming a step in the upper edge of the second chamber and the temperature inlet hole is sealed with the intermediate frame and the sealing member, respectively, the upper middle frame is pushed inwards when the coupling is inserted Since it is easy to enter and the contact area is enlarged, the sealing effect is improved.

In addition, the integrated temperature and pressure sensor for the expansion valve of the present invention can stably isolate the pressure sensing element and the temperature sensing element as described above, so that the pressure sensing element and the temperature sensing element are positioned as close as possible so that they can be precisely positioned at the desired position. There is an effect that can detect the measured value.

1 is a perspective view of a temperature and pressure integrated sensor for an expansion valve according to an embodiment of the present invention.
FIG. 2 is a vertical sectional view of the temperature and pressure integrated sensor for the expansion valve shown in FIG.
3 is a horizontal sectional view of the integrated temperature and pressure sensor for an expansion valve of the present invention cut along the line AA shown in FIG.

Advantages and features of the embodiments of the present invention, and methods of achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various different forms, and the present embodiments merely make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In describing the embodiments of the present invention, if it is determined that a detailed description of a known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, terms to be described below are terms defined in consideration of functions in the embodiments of the present invention, which may vary according to intentions or customs of users and operators. Therefore, the definition should be made based on the contents throughout the specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of an integrated temperature and pressure sensor for an expansion valve according to an embodiment of the present invention, Figure 2 is a vertical cross-sectional view of the integrated temperature and pressure sensor for an expansion valve shown in Figure 1, the expansion of the present invention The integrated temperature and pressure sensor for the valve includes a housing 110, a connector 120, a circuit board 130, a pressure sensing element 140, an intermediate frame 150, a temperature sensing element 160, and a sealing member 170. It may include.

The housing 110 is a structure that forms the outside of the integrated temperature and pressure sensor for the expansion valve, and comprises a large upper coupling portion 111, the central body portion 112 and the temperature sensing unit 113.

First, the overall shape of the housing 110 is combined with the upper coupling portion 111 and the central body portion 112, the upper portion is open and the lower portion has a closed cylindrical shape, but is thin on the lower surface of the central body portion 112. The cylindrical temperature sensing unit 113 protrudes.

The intermediate frame 150 and the connector 120 are sequentially inserted into and assembled into the first chamber 111b, which is an inner space of the upper coupling part 111 of the housing 110, and as a result, the central body 112 The second chamber 112b, which is a space formed by being blocked by the intermediate frame 150, is present. Here, the second chamber 112b is connected to the pressure inlet hole 112c so that the pressure sensing element 140 detects a pressure change of the second chamber 112b to generate an electrical signal, which will be described later. Shall be.

In addition, three steps are formed inside and outside of the housing 110. The upper edges of the second chamber 112b are respectively inclined outwardly to the first inclined step 111c and the upper edges of the pressure inlet hole 112c. The second inclined stepped portion 112d formed to be inclined outward and the upper edge of the temperature inflow hole 113b is a third inclined stepped 113c formed to be inclined outward. Details thereof will be described later.

In addition, the material of the housing 110 is exemplified as being aluminum or stainless in one embodiment of the present invention. Of course, this is only one embodiment. In addition, like the aluminum or stainless steel, the material of the housing 110 is excellent in thermal conductivity and well deformed at high temperature and high pressure. It will be obvious that any metal material having excellent stability, chemical resistance that does not cause brittleness due to a chemical action by gas, and a resilient metal that can be restored to its original state after deformation can be used as a substitute.

The upper coupling portion 111 is a structure having a cylindrical shape with an empty inside and an open upper portion as described above. The upper coupling portion 111 is coupled to the upper portion and the central body portion 112 is coupled to the lower portion. Specifically, it may be configured to include an upper coupling body 111a, the first chamber 111b and the first inclined step (111c).

The upper coupling part body 111a refers to the overall structure of the upper coupling part 111 and has a cylindrical shape, but the upper cylinder and the lower cylinder have two-stage structures having different diameters from each other. Since the diameter of the upper cylinder is smaller than the diameter of the lower cylinder, the joining portion of the upper cylinder and the lower cylinder forms a step.

The first chamber 111b refers to an inner empty space of the upper coupling part 111. The inner space of the first chamber 111b also has an upper space and an intermediate frame 150 into which the connector 120 is inserted and coupled. It has a two-stage structure with a lower space to be inserted and coupled. In one embodiment of the present invention has been illustrated that the space diameter of the upper is formed larger than the space diameter of the lower, which can of course be changed as necessary.

The first inclined stepped portion 111c is formed to be connected to the first chamber 112b of the bottom surface of the first chamber 111b, and refers to an upper edge of the second chamber 112b formed to be inclined outward. This is when the intermediate frame 150 is inserted into the space of the lower portion of the first chamber 111b, when the pressure is applied from above, the bottom surface of the intermediate frame 150 is slightly pushed into the first inclined step 111c and the second The area where the intermediate frame 150 comes into contact with the first inclined step 111c becomes larger than when the upper edge of the chamber 112b is formed at right angles. Therefore, the sealing effect of preventing the fluid flowing into the pressure inlet hole 112c from leaking to the outside by the first inclined stepped portion 111c is improved.

In this case, the intermediate frame 150 serves as an insulator of electricity and heat to the circuit board 130 and the pressure sensing element 140 installed on the upper surface, and at the same time to seal the second chamber 112b. It is preferably made of a ceramic composite made by mixing ceramic materials. Details thereof will be described later.

The central body portion 112 has a cylindrical shape having a low height but is extended from the upper coupling portion 111 to the lower portion thereof, and has a general flange shape because the diameter thereof is larger than that of the upper coupling portion 111. 112b and the pressure inflow hole 112c are formed. Specifically, the central body portion 112 includes a central body 112a, a second chamber 112b, a pressure inlet hole 112c, and a second inclined stepped portion 112d.

The central body 112a refers to the overall structure of the central body part 112 and has a cylindrical shape having a low height as described above. The upper part is connected to the upper coupling part body 111a, and the temperature sensing part body 113a is protruded and connected to a part of the lower surface.

The second chamber 112b is one of the inner empty spaces of the central body portion 112 and has a cylindrical shape and is formed at an eccentric position in the center of the empty space inside the central body portion 112 to form the second chamber 112b by the fluid. The pressure sensing element 140 installed on the upper surface of the intermediate frame 150 detects a change in pressure) (see FIG. 3).

In addition, the second chamber 112b is covered by the intermediate frame 150 to the upper portion and the pressure inlet hole 112c is connected to the lower portion and the portion connected to the pressure inlet hole 113b is a stepped second inclined step. 112d is formed. Details of the second slope 112d will be described later.

The pressure inlet hole 112c is a channel formed at the center of the lower surface of the second chamber 112b and narrower than the cross-sectional area of the second chamber 112b as described above, and is formed from the lower surface of the central body portion 112 to be an opening. It is formed through the central body portion 112 to the center of the second chamber (112b) that is the outlet. Therefore, the fluid can reach the second chamber 112b through the pressure inlet hole 112c from the outside, and again, the pressure sensing through the pressure through hole 152 of the intermediate frame 150 from the second chamber 112b. Reaching and contacting the element 140 allows the pressure sensing element 140 to detect the pressure of the fluid.

The second inclined stepped portion 112d refers to a portion where the upper edge of the pressure inlet hole 112c connected to the second chamber 112b is inclined outwardly, thereby widening the cross-sectional area of the fluid flowing through the pressure inlet hole 112c. It will perform the function of slowing down the speed.

The temperature sensing unit 113 is a structure that protrudes outward from the lower surface of the central body portion 112, and is formed at an eccentric position in the center of the lower surface of the central body portion 112, similarly to the pressure inlet hole 112c. It is to be spaced apart from the pressure inlet (112c) by a certain distance.

The temperature sensing unit 113 includes a temperature sensing unit body 113a, a temperature inflow hole 113b, and a third inclined step 113c.

The temperature sensing unit body 113a refers to an external structure having a hollow cylindrical shape, so that the temperature sensing unit body 113a has a cross-sectional area narrower than that of the lower surface of the central body 112a. And in one embodiment of the present invention can be such that the length of the temperature sensing unit body 113a can be increased or decreased as needed.

The temperature inlet hole 113b refers to a space inside the temperature sensing unit body 113b and functions as a space in which the temperature sensing element 160 can be inserted.

In addition, the temperature inlet hole 113b may be filled with any one selected from polyimide resin, polyester resin, epoxy resin, Teflon resin, and silicone resin so that the temperature sensing element 160 is located inside from the external fluid. Prevent deformation or damage by heat.

In addition, as described above, the temperature inlet hole 113b is spaced apart from the pressure inlet hole 112c by a predetermined distance, and a partition wall is positioned therebetween to prevent direct contact with the fluid.

The third inclined step 113c refers to a portion where the temperature inflow hole 113b is formed to be inclined outward at an upper edge connected to the first chamber 111b, which means that the intermediate frame 150 is the first chamber 111b. When inserted into the space of the lower portion of the, when pressure is applied from above the bottom surface of the intermediate frame 150 is slightly pushed into the third inclined step (113c) than when the upper edge of the temperature inlet hole (113b) is formed at a right angle The area where the intermediate frame 150 is in contact with the third inclined step 113c is increased. By improving the sealing effect by the third inclined step 113c, the fluid flowing in the pressure inlet hole 112c does not penetrate the partition wall into the temperature inlet hole 113b.

In addition, the material of the intermediate frame 150 is a function of sealing the second chamber (112b) while at the same time performing the function of insulator of electricity and heat to the circuit board 130 and the pressure sensing element 140 installed on the upper as described above. It is preferable that the ceramic composite is prepared by mixing a metal material and a ceramic material in order to perform the step. Details thereof will be described later.

The connector 120 is a structure that is coupled to an upper portion of the housing 110 to transfer electrical signals generated by the pressure sensing element 140 and the temperature sensing element 160 installed inside the housing 110 to the outside. The cover 121 and the connector pin 122 is configured.

The cover 121 is a structure in which the inside is empty and the bottom is opened and inserted and coupled to the upper coupling part 111. In one embodiment of the present invention, the outer shape of the cover 121 is the upper and lower portions 2. The cylindrical shape consisting of a short structure, but the diameter of the upper cylinder is configured to be smaller than the diameter of the lower cylinder to illustrate that the stepped portion is formed in the connection portion of the upper cylinder and the lower cylinder.

Accordingly, when the cover 121 is inserted and coupled to the housing 110, the upper edge of the upper engaging portion body 111a of the housing 110 is wrapped so that the cover 121 is separated from the cover 121. At the same time, the lower surface edge of the cover 121 is caught by the stepped portion formed inside the housing 110, thereby completely fixing the cover 121.

In addition, the material of the cover 121 may contain a carbon fiber or glass fiber component for strength and impact resistance in a thermoplastic plastic of polyamide or polyphthalamide.

The connector pin 122 is a plurality of metal pins penetrating the upper surface of the cover 121 is connected to the internal circuit board 130 to perform the function of transmitting the electrical signal to the outside, the material of the present invention In one embodiment of the exemplified to be brass. Of course, the material of the connector pin 122 may be replaced by any other metal having similar electrical conductivity.

The circuit board 130 is installed below the connector 120 and on the upper surface of the intermediate frame body 151 and is electrically connected to the connector pin 122 and at the same time, the pressure sensing element 140 and the temperature sensing element 160. Is electrically connected to the Accordingly, the electric signal generated from the pressure sensing element 140 and the temperature sensing element 160 is received, and arithmetic processing and amplification are performed through an element such as an IC, and then a function is transmitted to the outside through the connector pin 122. Done.

The circuit board 130 is an example of a flexible PCB (FPCB) capable of bending or changing the shape in one embodiment of the present invention. Of course, in addition to the various materials can be used as a PCB.

The pressure sensing element 140 is installed below the connector 120 and on the upper surface of the intermediate frame body 151 and is electrically connected to the circuit board 130 to transmit an electric signal according to the pressure change.

The pressure sensing device 140 exemplifies a semiconductor type in which the diaphragm is made of silicon (Si) semiconductor and then the silicon diaphragm deformation is measured according to the pressure. In other words, the pressure sensing element 140 manufactured in such a semiconductor type generally includes a diaphragm made of a silicon single crystal and a plurality of resistors disposed on the surface of the diaphragm. Of course, the pressure sensing element 140 is manufactured in a semiconductor manner is only an example, and it will be obvious that the pressure sensing element 140 may be replaced with various types of pressure sensing elements.

Looking at the actual operation of the semiconductor pressure-sensing device 140, first, when the diaphragm is deformed by the pressure, the resistance disposed on the surface is also deformed, this deformation action is a change in the resistance value disposed on the surface Will cause. Finally, the generated electrical signal according to the change of the resistance value is transmitted to the circuit board 130 electrically connected to the pressure sensing element 140.

The intermediate frame 150 is a ceramic structure having a cylindrical shape and is inserted into an interior space of the first chamber 111b of the housing 110. The intermediate frame body 151, the pressure through hole 152, and the lead wire through hole ( 153).

The intermediate frame body 151 is a ceramic structure having a cylindrical shape with a predetermined height as a whole. In addition, as described above, the pressure sensing element 140 is installed at one side of the upper surface of the intermediate frame body 151 with respect to the center, and the circuit board 130 is installed at the other side. In addition, the lower surface of the intermediate frame body 151 covers and closes the open upper portions of the second chamber 112b and the temperature inlet hole 113b formed in the central body 112 of the housing 110, respectively. do.

Therefore, the intermediate frame body 151 functions as an insulator of electricity and heat to the circuit board 130 and the pressure sensing element 140 installed on the upper surface and simultaneously opens the second chamber 112b and the temperature inlet hole 113b. In order to perform the function of sealing the upper portion, it is preferable to be made of a ceramic composite prepared by mixing a metal material and a ceramic material having a certain degree of ductility. As an example, in the embodiment of the present invention, the material of the intermediate frame body 151 is a ceramic of selan tarur compound or an alumina silicon ceramic. Of course, the material of the intermediate frame body 151 is not limited thereto, and various materials having similar properties may be used.

Pressure through hole 152 is a narrow cross-sectional area formed through the intermediate frame 150, that is, the intermediate frame body 151, the pressure sensing element 140 is installed on the upper surface and the pressure inlet formed in the lower portion It is formed at a position corresponding to (112c). Therefore, the fluid introduced into the pressure inlet hole 112c may contact the pressure sensing element 140 through the pressure through hole 152 through the second chamber 112b.

The lead wire through hole 153 is another flow path having a narrow cross-sectional area formed through the body of the intermediate frame 150, that is, the intermediate frame body 151, and is formed at the bottom of the circuit board 130 and the lower surface. It is to be formed in a position corresponding to the temperature inlet hole (113b). Therefore, the lead wire 162 extending from the element body 161 located at the end of the temperature sensing unit body 113a penetrates through the body of the intermediate frame 150 and is provided on the upper surface of the intermediate frame 150. Allow electrical connection.

The temperature sensing element 160 is installed inside the temperature sensing unit 113 and is electrically connected to the circuit board 130 to perform a function of transmitting an electrical signal according to a temperature change. The temperature sensing unit body 113a It includes a device body 161 and a lead wire 162 of a metal material extending from the device body 161 and electrically connected to the circuit board 130 positioned at the end of the. In addition, such a temperature sensing element 160 may be formed of a general thermistor element in one embodiment of the present invention, which is just an example and may be replaced by various types of temperature sensing elements.

The sealing member 170 is an elastic body having a circular ring shape, and is tightly fixed to the inner circumferential surface of the second chamber 112b so that the fluid flowing into the second chamber 112b through the pressure inlet hole 112c leaks to the outside. It performs a function that prevents it.

The material of the sealing member 170 is nitrile butadiene rubber (NBR), ethylene propylene rubber (EPDM), fluorinated rubber (FKM), acrylic rubber (so as to have electrical and thermal insulation and chemical resistance in one embodiment of the present invention) ACM), silicone rubber (VMQ), fluorosilicone rubber (FVMQ), styrene butadiene rubber (SBR), butadiene rubber (BR) and chloroprene rubber (CR) may be any one selected.

As described above, the integrated temperature and pressure sensor for an expansion valve according to the present invention includes a pressure inlet hole and a temperature inlet hole that pass through the pressure sensing element and the temperature sensing element to be located so that the pressure sensing element and the temperature sensing element are not affected by each other. However, the pressure sensing device and the temperature sensing device are installed because the sealing member is installed in the second chamber located at the upper end of the pressure inlet hole, and the intermediate frame is installed on the pressure inlet hole and the temperature inlet hole to increase the sealing effect and prevent the thermocouple. There is an effect that can be reliably isolated.

In addition, the integrated temperature and pressure sensor for the expansion valve of the present invention by forming a step in the upper edge of the second chamber and the temperature inlet hole is sealed with the intermediate frame and the sealing member, respectively, the upper middle frame is pushed inwards when the coupling is inserted Since it is easy to enter and the contact area is enlarged, the sealing effect is improved.

In addition, the integrated temperature and pressure sensor for the expansion valve of the present invention can stably isolate the pressure sensing element and the temperature sensing element as described above, so that the pressure sensing element and the temperature sensing element are positioned as close as possible, so as to be accurate at the desired position. There is an effect that can detect the measured value.

In the above description, various embodiments of the present invention have been described and described, but the present invention is not necessarily limited thereto, and a person having ordinary skill in the art to which the present invention pertains can make various modifications without departing from the technical spirit of the present invention. It will be readily appreciated that branch substitutions, modifications and variations are possible.

100: integrated temperature and pressure sensor
110: housing 111: upper coupling portion
111a: upper coupling body 111b: first chamber
111c: first slope step 112: central body portion
112a: central body 112b: second chamber
112d: second inclination step 113: temperature sensing unit
113a: temperature sensing unit body 113b: temperature inlet hole
113c: third inclination step 120: connector
121: cover 122: connector pin
130: circuit board 140: pressure sensing element
150: intermediate frame 151: intermediate frame body
152: pressure through hole 153: lead wire through hole
160: temperature sensing element 161: element body
162: lead wire 170: sealing member

Claims (10)

An upper coupling part having an empty interior and an open upper part, a central body part extending from the upper coupling part and having a second chamber and a pressure inlet hole formed therein, and a temperature sensing part protruding from the lower surface of the central body part; A housing configured to include;
A connector having a hollow interior and an open bottom, and including a cover inserted into the upper coupling part and a plurality of connector pins provided through the upper surface of the cover;
A circuit board installed below the connector and electrically connected to the connector pins;
A pressure sensing element installed under the connector and electrically connected to the circuit board to transmit an electrical signal according to a pressure change;
An intermediate frame installed inside the housing and having a pressure through hole formed at a position corresponding to the pressure inlet hole;
A temperature sensing element installed inside the temperature sensing unit and electrically connected to the circuit board to transmit an electrical signal according to a temperature change; And
And a sealing member that has a circular ring shape and is tightly fixed to the inner circumferential surface of the second chamber.
The temperature sensing unit is composed of an external temperature sensing unit body having an inner cylindrical shape and a temperature inlet hole therein,
The upper edge of the second chamber forms a first inclined step inclined outward, the upper edge of the pressure inflow hole forms a second inclined step inclined outward, and the upper edge of the temperature inflow hole outward An integrated temperature and pressure sensor for an expansion valve, characterized by forming an inclined third stepped step.
The method according to claim 1,
And the second chamber is covered by the intermediate frame to the upper side and the pressure inlet hole is connected to the lower side.
delete The method according to claim 1,
The temperature inlet hole is a temperature and pressure integrated sensor for an expansion valve, characterized in that the inside is filled with any one selected from polyimide resin, polyester resin, epoxy resin, Teflon resin and silicone resin.
delete The method according to claim 1,
The housing is made of aluminum, and the cover is made of polyamide (Polyamide) or polyphthalamide (PolyPhtalamide), and contains a carbon fiber or glass fiber component for strength and impact resistance, and the material of the connector pin. Temperature and pressure integrated sensor for expansion valve, characterized in that the brass.
The method according to claim 1,
The circuit board is an integrated temperature and pressure sensor for an expansion valve, characterized in that the flexible PCB (FPCB) capable of bending or changing the shape.
The method according to claim 1,
The pressure sensing device is an integrated temperature and pressure sensor for an expansion valve, characterized in that the semiconductor type for measuring the diaphragm deformation in accordance with the pressure after making the diaphragm with a silicon (Si) semiconductor.
The method according to claim 1,
The intermediate frame is formed with at least one lead wire through-hole penetrating the intermediate frame body at a position corresponding to the temperature inlet hole,
Temperature and pressure integrated sensor for the expansion valve, characterized in that the material of the intermediate frame is ceramic.
The method according to claim 1,
Nitrile butadiene rubber (NBR), ethylene propylene rubber (EPDM), fluorinated rubber (FKM), acrylic rubber (ACM), silicone rubber (VMQ), fluorosilicone rubber (FVMQ), styrene butadiene rubber ( SBR), butadiene rubber (BR) and chloroprene rubber (CR) any one selected from the temperature and pressure integrated sensor for expansion valves.

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