KR102065145B1 - Apparatus for processing object using steam - Google Patents

Abstract

The present invention relates to an object treating apparatus using steam, and an object treating apparatus using steam according to an embodiment of the present invention comprises: a pure water preheating unit for resistively heating pure water passing through at least one first flow path; A steam generator for collecting steam received from the first flow path and accommodating the pure water and then heating the resistor to generate steam; A steam heater for heating the steam generated by the steam generator through a second flow path and using induction heating; A power supply unit for supplying power to each of the pure preheating unit, the steam generating unit, and the steam heating unit; And a controller for controlling the power supply unit. It includes; a nozzle unit for injecting a predetermined liquid or gas in the steam generated from the steam heating unit to spray to the object.

Description

Object processing apparatus using steam {APPARATUS FOR PROCESSING OBJECT USING STEAM}

The present invention relates to an object treatment apparatus using steam, specifically, by preheating pure water using resistance heating to generate steam, and further heating the generated steam using induction heating, and then mixing the pure water, The present invention relates to an object treatment apparatus using steam, which can generate steam, but to reduce the size of the entire plant and thereby to reduce the size of the treatment system.

Surfaces of numerous workpieces such as semiconductor wafers, glass substrates of flat panel displays, metal plates, etc., are contaminated with many residual organic materials, particles, organics, and inorganics during the manufacturing process. In the semiconductor device manufacturing process, the cleaning process of forming a pattern on a wafer and then cleaning is repeated. The reason for cleaning the wafer is to remove organic substances such as photoresist film and polymer film, particles and the like. Since organic matter or particles cause product defects, the importance of the cleaning process to remove them is becoming more and more important.

In industries such as semiconductors, wet cleaning methods are widely used, which are inexpensive and have proven their suitability. However, wet scrubbing mainly uses strong acids and strong bases, which are highly toxic. Therefore, the use of wet scrubbing is regulated due to environmental pollution and safety. In addition, as the degree of integration of semiconductor devices increases, it is necessary to keep the purity of the cleaning agent and ultrapure water high. In particular, wet cleaning is difficult to apply to a cluster tool system for performing continuous processes in conjunction with vacuum equipment. Dry cleaning methods have been developed and applied to supplement and solve the disadvantages of wet cleaning methods. Dry cleaning, also called gas phase cleaning, includes ultrasonic cleaning, ionozone cleaning, Excimer ultraviolet (EUV) cleaning, plasma cleaning, and the like. Dry cleaning equipment has a disadvantage in that the configuration is complicated and the area occupies is large.

Meanwhile, steam cleaning equipment using high temperature and high pressure steam, which is environmentally friendly and has excellent cleaning power, has been developed. Steam cleaning equipment uses a heater to heat water in a large-capacity container to generate steam and spray it onto the wafer to clean it.

Most of these steam cleaning equipments use large-capacity containers to generate steam in large quantities, thereby increasing the size of the cleaning system, which takes a part in the semiconductor device manufacturing process.

In addition, large steam cleaning equipment lengthens the steam transfer path from the point where steam is generated to the point where steam is injected, so that considerable effort is required to move the generated steam to a desired position while maintaining temperature and pressure conditions. need. That is, the generated steam may be changed into liquid water by condensing steam in a gaseous state due to a temperature change as the steam transport path is lengthened. Accordingly, such a cleaning system may require the provision of additional equipment to maintain steam temperature and pressure conditions or the application of technology to control the temperature and pressure of steam.

In addition, since the specific heat of water is relatively larger than that of other materials, the temperature change does not appear much. Due to the nature of the water, the steam cleaning equipment needs to prepare a large amount of steam before the steam cleaning process starts by heating the water contained in a large capacity container using a heater.

In other words, the conventional steam washing equipment is difficult to control the temperature of the water, it is difficult to generate steam in a short time. This means that a large amount of steam must be prepared in advance in order to cope with a target object (for example, a wafer, a glass, a substrate, etc.) coming into the steam process in a short time in the steam cleaning process.

In addition, when particles are generated in the container, the generated steam may be contaminated by the particles. When the contamination of the steam is injected onto the wafer, the cleaning power of the wafer is reduced.

Therefore, the conventional steam cleaning equipment can reduce the size of the steam system and provide steam without a separate steam transfer path, and can generate steam at a high speed that can cope with the processing target that enters the steam process within a short time. There is a need for a system to be proposed.

An object of the present invention is to generate a large amount of steam by preheating the pure water by using resistance heating, and further by heating the steam generated by using induction heating, and then mixing the pure water, the total installation area In order to reduce the size of the treatment system to reduce the size, to provide an object treatment apparatus using steam.

Object treatment apparatus according to an embodiment of the present invention, the pure water preheating unit for resistance heating the pure water passing through at least one first flow path; A steam generator for collecting steam received from the first flow path and accommodating the pure water and then heating the resistor to generate steam; A steam heater for heating the steam generated by the steam generator through a second flow path and using induction heating; A power supply unit for supplying power to each of the pure preheating unit, the steam generating unit, and the steam heating unit; And a controller for controlling the power supply unit. It includes; a nozzle unit for injecting a predetermined liquid or gas in the steam generated from the steam heating unit to spray to the object.

When forming the flow path, the pure preheating unit is connected to the steam generating unit to form a plurality of flow paths, or connected to each other to form a single flow path.

The pure water preheating unit includes a heating element supporting part for supporting a heating element therein to heat the pure water and forming a pure water flow path.

The steam generator is divided into a space filled with pure water on the lower side and a space filled with steam on the upper side when the pure water is collected and received.

The steam heating unit, the coil for receiving a power from the power supply to form a high frequency alternating magnetic field; And a body for generating steam by induction heating pure water passing through the second flow path by the high frequency alternating magnetic field.

The body has a plurality of hollows distributed to form a flow path therein.

The steam heating unit forms a plurality of flow paths and is connected to the steam generating unit.

When the steam heating unit forms a plurality of flow paths connected to the steam generating unit, the coils wound around the plurality of flow paths are connected to have the same wire length to the power supply unit.

The nozzle unit simultaneously injects vapor, liquid, and gas onto the object.

The present invention generates steam after preheating pure water using resistance heating, and further heats the generated steam using induction heating, and then mixes pure water to reduce the total plant area. The processing system can be downsized.

In addition, the present invention can provide peeling, cleaning, processing, deposition, etc., on insoluble materials of a semiconductor substrate, a glass substrate, a lens, a disk member, a precision machining member, a mold resin member, a printed circuit board (PCB), and the like. Can be.

In addition, the present invention does not need to provide a large-capacity steam reservoir by further heating the steam within a short time through induction heating and then mixing pure water to generate a large-capacity steam.

In addition, since the present invention does not need to provide a large-capacity container, it is possible to prevent the generation of particles inside the container, thereby preventing the reduction of the wafer cleaning power of the steam as the particles are contained in the vapor.

In addition, the present invention can provide a system capable of generating steam at a high rate that can respond to objects entering the process in a short time.

In addition, the present invention can improve the efficiency of cleaning the object to be cleaned by mixing compressed air in the steam.

In addition, the present invention can not only generate a large amount of steam by rapidly increasing the amount of additional steam by mixing the cleaning liquid in the steam, it is also possible to generate the steam of the optimum conditions for steam cleaning by adjusting the temperature of the steam .

1 is a diagram of an object treating apparatus according to an embodiment of the present invention.
2 is a view of the pure preheating unit and the steam generating unit of FIG.
3A to 3C are views illustrating a flow path formed in the pure preheating unit of FIG. 1.
4 is a detailed view of a cross section of the pure preheating unit of FIG. 2.
5A is a view of the steam heating unit of FIG.
5B is a cross-sectional view taken along line AA ′ of the steam heating unit of FIG. 5A.
5C and 5D are cross-sectional views taken along line BB ′ of the steam heating unit of FIG. 5A.
6 is a diagram illustrating a coil connection method of the steam heating unit of FIG. 1.
7 is a detailed view of the nozzle unit of FIG. 1.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiment of the present invention may be modified in various forms, the scope of the invention should not be construed as limited to the embodiments described in detail below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings and the like may be exaggerated to emphasize a more clear description. It should be noted that the same members in each drawing are sometimes shown with the same reference numerals. Detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention are omitted.

The meaning of the terms in the present specification will be described. Examples of the "object" include a semiconductor substrate, a glass substrate, a lens, a disk member, a precision machining member, a mold resin member, a printed circuit board (PCB), and the like, but are not limited thereto. "Treatment" is performed on an object, for example, peeling, washing | cleaning, processing, vapor deposition, etc. are mentioned, It is not limited to this. The term "insoluble matter" means various insoluble matters generated at the time of processing an object. For example, a resist film, an etching residue after dry etching, a chemically altered resist film, and a semiconductor device are used for a manufacturing process of a semiconductor device or a display device. The reaction byproduct produced after the etching process of the high dielectric layer, the reaction byproduct produced after the etching process of a passivation film, the reaction byproduct produced after the etching process of a metal layer, etc. can be illustrated. "Pure water" may be water having a characteristic of a degree that is used as pure water (DI water) or ultrapure water (treat water) in a process such as semiconductor device or display device manufacture.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described using drawing.

1 is a diagram of an object treating apparatus according to an embodiment of the present invention.

As illustrated in FIG. 1, the object treating apparatus 100 according to an exemplary embodiment of the present invention preheats pure water and generates steam using resistance heating, and then heats generated steam using high frequency induction heating. do. At this time, the object processing apparatus 100 mixes pure water with a small amount of steam (for example, 500 ° C. steam) heated by high frequency induction heating to generate a large amount of steam (for example, 130 to 150 ° C. steam) to produce an object ( By injecting into 4), an insoluble matter generated in the manufacturing process of the semiconductor device or the display device can be treated.

The object processing apparatus 100 generates steam by heating the pure water stored in the mass storage and does not supply the steam generated in the mass storage to the object 4 through a predetermined transfer path, and as soon as the preheated pure water is supplied. After rapid heating to generate steam, the object 4 can be sprayed directly. As such, the object processing apparatus 100 may generate a large amount of steam because it does not need a separate facility for heating a large amount of pure water to generate steam, but the size of the processing system can be reduced by reducing the overall facility area. Can be.

On the other hand, the object processing apparatus 100 processes the object 4 using the following thermal effect phenomenon.

When pure water at room temperature (about 20 ° C) and steam at high temperature (100 ° C or more) are continuously mixed under a constant pressure in a container having a constant capacity, the pure water is heated by the steam and expands. On the other hand, the steam is cooled by water and contracted. These heat exchanges generate vibrations having a certain frequency (10 Hz to 1 MHz).

Pure water (approx. 20 ℃) + steam (over 100 ℃) → vibration

This vibration also decomposes the water molecules H ₂ O into hydrogen ions H + and hydroxide ions OH-.

H ₂ O → H + + OH-

Since the hydrogen ions H + and OH- is a hydroxide ion it is very unstable, and to get back to the water molecules H ₂ O. The object 4 can be cleaned by converting the high energy generated at this time into a mechanical impact. That is, the object processing apparatus 100 generates a cavitation using the above-described heat effect phenomenon, and thereby performs a process such as removing an insoluble matter on the surface of the object 4. Here, the cavitation is a phenomenon in which the vapor pressure is generated in the liquid because the pressure of the liquid is lowered below the vapor pressure when the liquid moves at a high speed. The vapor bubbles may hit the surface of the object 4 to remove insoluble matters.

In other words, when the cavitation jet generated by the heat effect phenomenon is injected onto the surface of the object 4, the surface of the object 4 is cleaned, polished and ground by the high impact force generated when the bubbles due to cavitation disappear. Treatment is carried out to remove insoluble matters.

On the other hand, the object processing apparatus 100 may spray the generated steam, high temperature compressed air or the cleaning liquid selectively on the surface of the object 4, or mix them and spray the surface of the object (4).

The object treating apparatus 100 includes a pure water preheating unit 10, a steam generating unit 20, a steam heating unit 30, a nozzle unit 40, a power supply unit 50, a control unit 60, and a first operation valve ( 1), the second operation valve 2, the third operation valve (3) may be included.

In the present specification, for convenience of description, steam generated by the steam generator 20 is hereinafter referred to as “generated steam”, and steam heated by the steam heater 30 is referred to as “heated steam” and the nozzle unit 40. The steam injected by) is called "injection steam".

The pure water preheating unit 10 generates steam by preheating the pure water supplied from the outside to a boiling point (for example, 85 ° C. to 95 ° C. at normal pressure) before supplying pure water to the steam generating unit 20. It supplies to the part 20. This is to supply the pure water to the steam generating unit 20 that can immediately rise to the boiling point even if heated at a short time in the steam generating unit 20 without directly supplying the pure water at room temperature. . For example, at normal pressure, the steam generator 20 must raise the temperature of pure water to 80 ° C. or higher in order to generate steam in pure water at room temperature (20 ° C.), while generating steam in pure water at 95 ° C. In order to generate | occur | produce, only 5 degreeC or more needs to raise temperature. In other words, when the pure water passes through the steam generator 20, the electrons must raise the temperature of the pure water to the boiling point to generate the generated steam, and then heat it again. On the other hand, in the latter, when the pre-heated pure water passes through the steam generator 20, the temperature of the pure water rises to the boiling point within a short time, thereby generating steam immediately.

Accordingly, since the steam generator 20 receives the pre-heated pure water from the pure preheater 10, the steam generator 20 may not only generate generated steam immediately, but also heat the generated steam with a higher temperature steam.

In addition, the pure water preheating unit 10 preheats the pure water by a resistance heating method of heating pure water by Joule heat generated when a current flows through a heating element directly connected to the power supply unit 50. Here, the heating element may be a metal heating element (iron / chromium / aluminum type, nickel / chromium alloy, single metal, etc.), non-metal heating element (silicon carbide, molybdenum dioxide, tanthanum chromite, carphone / graphite, etc.), sheath heater, ceramic heater, or the like. This can be used. The pure preheating unit 10 may adjust the heating temperature of the pure water according to the strength of the power supplied from the power supply unit 50. At this time, the pure water may be stopped or resumed to be supplied with pure water according to the opening and closing of the first operation valve 1. In this case, the first operation valve 1 may be controlled by the control unit 60.

The pure preheating unit 10 may include one or more bundle structures that form a flow path of pure water and may preheat the pure water using resistance heating. Each flow path of pure water may be connected to each other to form one flow path, or may be introduced into the steam generator 20.

The steam generator 20 receives the pre-heated pure water from the pure preheater 10 and heats it by resistance heating to generate generated steam. That is, the steam generator 20 preheats the pure water by a resistive heating method of heating pure water by Joule heat generated when a current flows through a heating element directly connected to the power supply unit 50. Here, the heating element may be a metal heating element (iron / chromium / aluminum type, nickel / chromium alloy, single metal, etc.), non-metal heating element (silicon carbide, molybdenum dioxide, tanthanum chromite, carphone / graphite, etc.), sheath heater, ceramic heater, or the like. This can be used. At this time, the generated steam may be stopped or resumed supply to the steam heating unit 30 according to the opening and closing of the second operation valve (2). The second operation valve 2 may be controlled by the control unit 60.

At this time, since the steam generator 20 may generate the generated steam in a short time by heating the pure water preheated in advance by the pure water preheating unit 10, the steam generator 20 may have a small storage space in which the generated steam generated is not large. Can be configured. This may result in miniaturization of the object processing apparatus 100 and may reduce the total facility area for the semiconductor device or the display device manufacturing process.

The steam generator 20 may adjust the heating temperature of the generated steam according to the strength of the power supplied from the power supply unit 50. At this time, the steam generator 10 supplies the generated steam having a predetermined temperature (for example, 100 ℃ to 130 ℃ at normal pressure) to maintain the steam state to the steam heating unit 30.

The steam heating unit 30 receives the generated steam from the steam generator 20 and heats the generated steam by high-frequency induction heating to generate heated steam. At this time, the heating steam may be stopped or resumed injection to the object (4) through the nozzle unit 40 in accordance with the opening and closing of the third operation valve (3). The third operation valve 3 may be controlled by the controller 60.

Here, the high frequency induction heating method uses an electromagnetic induction phenomenon. When a conductive metal material is placed in a high frequency alternating magnetic field generated when a high frequency alternating current flows through a heating coil, an induced eddy current is generated on the surface of the metal material. It is a heating method using the principle that Joule heat is generated by the skin resistance of the metal material.

As described above, the steam heating unit 30 further heats the generated steam to generate heated steam at a high temperature (for example, 250 ° C. to 500 ° C. steam) while generating more heat than the generated steam. This is to provide a large capacity processing capacity even if the size of the processing system is not large by forming a large amount of injection steam suitable for the object treatment at a high speed when mixing a small amount of heated steam in the nozzle unit 40.

The steam heating unit 30 may adjust the heating temperature of the heating steam according to the strength of the power supplied from the power supply unit 50.

The power supply unit 50 supplies power required for each of the pure preheating unit 10, the steam generating unit 20, and the steam heating unit 30. That is, the power supply unit 50 supplies commercial AC power or DC power to the pure water preheating unit 10 and the steam generator 20, and supplies high frequency AC power (or RF power) to the steam heating unit 30. . In particular, the power supply unit 50 may supply high-frequency AC power through an impedance matching network for impedance matching to reduce reflection due to the difference in impedance of the steam heating unit 30.

In this way, the power supply unit 50 is provided in a separate configuration required for each of the pure preheating unit 10, the steam generating unit 20 and the steam heating unit 30 to supply power, or a condition corresponding to each in one configuration Power can be supplied according to

The controller 60 controls the operations of the pure preheater 10, the steam generator 20, and the steam heater 30 through the power supply unit 50. Specifically, the controller 60 controls the intensity of the power supplied to each of the pure preheating unit 10, the steam generating unit 20, and the steam heating unit 30 through the power supply unit 50. The pure water heated by 10), the temperature and the amount of steam generated by the steam generator 20, the temperature and the amount of steam generated by the steam heating unit 30 can be controlled. In addition, the controller 60 controls the on / off operation of the pure preheater 10, the steam generator 20, and the steam heater 30 through the power supply unit 50.

In addition, the control unit 60 is a pure preheating unit 10, steam generating unit 20, steam heating unit 30, the first operation valve (1), the second operation valve (2), the third operation valve (3) ) Can be controlled. For example, the controller 60 may detect and control the temperature and pressure of each component when controlling each component. That is, the control unit 60 is a pure preheating unit 10, steam generating unit 20, steam heating unit 30, the first operation valve (1), the second operation valve (2), the third operation valve (3) When the temperature and pressure at any one point of) is detected to be higher than the preset temperature and pressure, the pure preheating unit 10, the steam generating unit 20, and the steam heating unit 30 are respectively provided through the power supply unit 50. You can adjust the strength of the power supplied to the system. In this case, the controller 60 may detect a temperature and pressure of each component and inform the user.

In addition, the controller 60 may control the opening and closing of the first operation valve 1, the second operation valve 2, and the third operation valve 3. That is, the first operation valve 1 may adjust the flow rate of the pure water supplied to the pure water preheating unit 10 according to the degree of opening and closing. The second operation valve 2 may adjust the flow rate of the generated steam supplied to the steam heating unit 30 according to the degree of opening and closing. The third operation valve 3 may adjust the flow rate of the heating steam injected into the nozzle unit 40 according to the degree of opening and closing.

Meanwhile, the controller 60 may control the nozzle unit 40 and / or the object supporter (not shown) in order to uniformly scan the processing target surface of the object 4 to inject steam. That is, while the object support part is fixed, only the nozzle part 40 can be operated alone, and the operation | movement which scans the whole processing surface of the object 4 can be performed combining a movement operation and a rotation operation. Moreover, the nozzle part 40 is fixed, and only the object support part is actuated independently, and the mechanism which enables not only rotation operation but a movement operation is provided, it synchronizes rotation and a movement, and combines the whole process surface of the object 4 Scanning may also be performed. In addition, the movement operation of the nozzle unit 40 and the rotation operation of the object support unit may be controlled so as to operate both in combination so as to be synchronized with each other, to scan the object 4, and to obtain a desired scan speed. It is not limited to this. In this way, the operation of the nozzle portion 40 and the object support portion can be appropriately combined in accordance with the scanning specification, and can be designed to obtain a desired scan speed.

2 is a view of the pure preheating unit and the steam generating unit of FIG.

As shown in FIG. 2, the pure preheating unit 10 and the steam generating unit 20 may be made of one or more hollow pipes, but are not limited thereto.

The pure preheating unit 10 may be composed of two components, that is, the first and second pure preheating units 10a and 10b, respectively. In this case, each of the first and second pure preheating units 10a and 10b forms a flow path through which the pure water can flow through the hollow pipe, and the first and second heating elements 11a and 11b in the longitudinal direction along the flow path. Can be placed. For this reason, the pure water is preheated when passing through the first and second pure preheating units 10a and 10b, and finally the temperature near the boiling point in the steam generating unit 20 (for example, 85 ° C to 95 ° C at normal pressure). It is supplied in a state having.

The steam generating unit 20 has a predetermined space that can receive and receive the pure water supplied from the pure water preheating unit 10. Here, the steam generating unit 20 fills the pure water so as to be divided into a space filled with pure water on the lower side and a space filled with generated steam on the upper side when the pure water converges to receive the pure water.

At this time, the third and fourth heating elements 21a and 21b are disposed on the lower side of the steam generator 20 to heat the pure water filled. The generated steam is supplied to the steam heating unit 30 through the generated steam discharge unit 22 formed on the upper side of the steam generator 20.

3A to 3C are views illustrating a flow path formed in the pure preheating unit of FIG. 1.

As described above, in the pure water preheating unit 10, the pure water flows through the flow path formed therein, and in the steam generator 20, the pure water is heated in the state filled therein.

Meanwhile, the first and second pure preheating units 10a and 10b may each independently form a plurality of flow paths in opposite directions and supply pure water to both ends of the steam generator 20 (see FIG. 3A). This may make the temperature equilibrium state of the pure water filled in the steam generator 20 within a short time.

On the other hand, the first and second pure preheating units 10a and 10b may each independently form a plurality of flow paths in the same direction and supply pure water to one end of the steam generating unit 20 (see FIG. 3B). . It is easy to supply pure water to the steam generating unit 20 by tying up the flow path of pure water.

In addition, the first and second pure preheating units 10a and 10b may be connected to each other to form a single flow path, and may supply pure water to one end of the steam generating unit 20 (see FIG. 3C). At this time, the pure water flow path is formed in a zigzag shape. This may shorten the heating time of the pure water to reduce the size of the first and second pure preheating unit (10a, 10b).

4 is a detailed view of a cross section of the pure preheating unit of FIG. 2.

Referring to FIG. 4, the pure preheating unit 10 forms a cylindrical preheater body 101 having a hollow interior in the form of a pipe or a pipe. Here, the preheater body 101 includes a heating element 11 for directly preheating the pure water therein. Preferably, the heating element 11 also has a cylindrical rod-shaped structure.

In the preheater body 101, a heat generator support part 102 for supporting the heat generator 11 may be disposed to have the same center as the center of the cylindrical preheater body 101. The heat generator support portion 102 has a disc shape, and the heat generator 11 passes through the central portion 102a to support the heat generator 11, and a pure flow path 102b may be formed at the center periphery. Here, the heating element support portion 102 is preferably made of the same material as the preheater body 101 or the heating element (11).

Figure 5a is a view of the steam heating unit of Figure 1, Figure 5b is a view of the AA 'cross section of the steam heating unit of Figure 5a, Figures 5c and 5d is a BB' cross section of the steam heating unit of Figure 5a This is the drawing.

Referring to FIG. 5A, the steam heating unit 30 may include a coil 31 and a body 32.

The coil 31 is connected to the power supply unit 50 to supply a high frequency AC power. Thus, the coil 31 receives a high frequency AC power from the power supply unit 50 to form a high frequency AC magnetic field.

The coil 31 may be wound in the longitudinal direction of the body 112c. That is, the coil 31 may connect the power supply unit 50 to one side and ground the other side by winding the whole body 32 in a single line.

The body 32 may include a coil support and a fixing part (not shown) for supporting and fixing the coil 31 as necessary. At this time, the coil support and the fixing portion guides the winding path of the coil 31 to maintain a constant interval between each winding when winding multiple times. In addition, the coil support and the fixing part may be wound around the body 32 at a predetermined interval to prevent the coil 31 from being directly wound on the surface of the body 32. This is to prevent the temperature of the body 32 heated by induction heating from being directly conducted to the coil 31. That is, the coil support and the fixing portion form an insulating structure.

In addition, the coil 31 may be in the form of a hollow elongated tube (ie, in the form of a pipe or tube). The coil 31 uses the inside of the pipe as a passage for cooling water to cool the heat generated in the coil itself. Preferably the coil 31 is a copper pipe having a conductivity of at least 90%.

The body 32 is a metal material (for example, titanium), and an induction eddy current is generated on the surface due to a high frequency alternating magnetic field generated when a high frequency alternating current flows through the coil 31 by an electromagnetic induction phenomenon. Joule heat is produced. For this reason, the body 32 may further generate heated steam by further heating the generated steam supplied from the steam generator 20.

The body 32 may form a steam injector (not shown) for injecting heated steam generated in the inner space to the outside. In this case, each of the steam injection unit may be individually connected to the nozzle unit 40 or the whole may be collected in one nozzle unit 40 to directly inject the steam to the object (4).

Referring to FIG. 5B, when the flow path of the generated steam is formed, the steam heating part 30 is formed as a hollow bundle-type flow path 33 in which a plurality of hollows are distributed to form a flow path rather than a single flow path. That is, the hollow bundle-type flow path 33 forms a narrow flow path through which the generated steam passes in several paths. This means that it is possible to generate a high temperature heating steam within a short time since the effect of widening the area for transferring heat to the generated steam can be obtained without significantly reducing the flow rate of the generated steam.

5C and 5D, the hollow bundle flow path 33 is a structure formed in the entire steam heating unit 30 (see FIG. 5C), or is disposed in a space inside the steam heating unit 30 and corresponding space. It may be a structure formed of a plurality of structures (33a to 33c) for partitioning (see FIG. 5D). The hollow bundle-type flow path 33 of FIG. 5C constitutes a plurality of independent flow paths from the inlet to discharge of the generated steam, whereas the hollow bundle-type flow path 33 of FIG. 5D is a steam heating unit 30. The flow path of the generated steam partially consists of a plurality of independent flow paths in the inside).

6 is a diagram illustrating a coil connection method of the steam heating unit of FIG. 1.

Referring to FIG. 6, the steam heating unit 30 generates generated steam as heating steam by using induction heating. The steam heating unit 30 may be connected to the steam generating unit 20 through a plurality of flow paths.

The steam heating unit 30 may be connected to have the same wire length from each of the windings 30a to 30d to the power supply unit 50 in winding the coil 31. In this case, the power supply unit 50 supplies power to the coil 112a through a matching network 113a for impedance matching.

That is, the connection lengths L1 to L4 between the windings 30a to 30d of the steam heating unit 30 and the power supply unit 50 are preferably configured to be the same. This is to configure the inductance of each winding 30a to 30d equally.

7 is a detailed view of the nozzle unit of FIG. 1.

Referring to FIG. 7, the nozzle unit 40 may simultaneously supply not only injection steam but also liquid and gas to the object 4.

That is, the nozzle part 40 includes a first nozzle part 41 for injecting the injection steam, a second nozzle part 42 for injecting the liquid, and a third nozzle part 43 for injecting the gas. . In this case, the first nozzle part 41, the second nozzle part 42, and the third nozzle part 43 are connected to the gas supply part 44 or the liquid supply part 45, respectively.

The first nozzle part 41 may inject the injection steam generated by mixing the gas or / and liquid into the heating steam provided from the steam heating unit 30 to the object 4. In this case, the first nozzle part 41 is connected to the gas supply part 44 and the liquid supply part 45. The second nozzle part 42 receives liquid from the liquid supply part 42. The third nozzle part 43 receives gas from the gas supply part 43. Each of the first to third nozzle parts 41 to 43 may be sprayed onto the object 4 by combining injection steam, liquid, and gas as necessary. That is, after spraying the injection steam on the object 4, the object (4) can be dried by spraying a gas (compressed air).

Each of the gas supply part 44 and the liquid supply part 55 may include fourth to seventh operation valves 5 to 8 for controlling supply of gas or liquid.

Embodiments of the present invention described above are merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, it will be understood that the present invention is not limited only to the form mentioned in the above detailed description. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the present invention includes all modifications, equivalents, and substitutes within the spirit and scope of the invention as defined by the appended claims.

10: pure preheating unit 20: steam generating unit
30: steam heating part 40: nozzle part
50: power supply unit 60: control unit
4: object

Claims (9)

Pure preheating unit for resistance heating the pure water passing through at least one first flow path;
A steam generator for collecting steam received from the first flow path and accommodating the pure water and then heating the resistor to generate steam;
A steam heater for heating the steam generated by the steam generator through a second flow path and using induction heating;
A power supply unit for supplying power to each of the pure preheating unit, the steam generating unit, and the steam heating unit;
A control unit for controlling the power supply unit; And
A nozzle unit for injecting a predetermined liquid or gas into the vapor generated from the steam heating unit and injecting the vapor into an object;
Including,
The pure preheating unit, the steam generating unit and the steam heating unit is formed sequentially from the bottom to the top,
The pure water heated while moving in the horizontal direction in the pure preheater is transferred to the steam generating unit formed on the pure preheater,
The generated steam generated while moving in the horizontal direction from the steam generating unit is transferred to the steam heating unit through a plurality of generated steam discharge parts formed in the same vertical direction on the upper side of the steam generating unit,
Heating steam heated in the steam heating unit using the steam delivered to the nozzle unit.
The method of claim 1,
The pure water preheating unit, the object processing apparatus using steam to form a plurality of flow paths by connecting to the steam generating unit, respectively, or connected to each other when forming the flow path.
The method of claim 2,
The pure water preheating unit, the object processing apparatus using the steam including a heating element support for heating the pure water by supporting the heating element therein to form a pure water flow path.
The method of claim 3, wherein
The steam generating unit, the object processing apparatus using the steam divided into a space filled with pure water on the lower side and the space filled with steam on the upper side when receiving the pure water.
The method according to any one of claims 1 to 4,
The steam heating unit,
A coil for receiving a power from the power supply to form a high frequency alternating magnetic field; And
A body for generating steam by induction heating pure water passing through the second flow path by the high frequency alternating magnetic field;
Object processing apparatus using the steam containing.
The method of claim 5,
The body has a plurality of hollows are distributed object processing apparatus using steam to form a flow path therein.
The method of claim 6,
The steam heating unit, the object processing apparatus using the steam to form a plurality of flow paths connected to the steam generating unit.
The method of claim 7, wherein
The steam heating unit, when forming a plurality of flow paths connected to the steam generating unit, the object processing apparatus using steam to connect the coil wound in the plurality of flow paths to have the same wire length to the power supply.
The method of claim 8,
The nozzle unit is an object processing apparatus using steam for simultaneously injecting steam, liquid and gas to the object.

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