KR102059377B1 - coil-type on-Chip inductor device - Google Patents

Abstract

The present invention relates to a technology which implements a high capacity inductor used for various fields (for example, oscillators, power convert IC, and DC-DC converters) on on-chip (for example, SoC semiconductor applied or standalone chip component). More specifically, the present invention relates to a technology which can generate high capacity inductance on on-chip by applying through silicon via (TSV) concept to three-dimensionally mold an inductor on on-chip in a coil shape. The present invention has an advantage that high capacity inductance can be obtained even in small size by applying TSV concept to three-dimensionally mold an inductor on on-chip (for example, SoC semiconductor applied or standalone chip component) in a coil shape. Furthermore, the present invention has an advantage that high integration of SoC semiconductor can be achieved and high capacity inductor component can be configured in small size by obtaining high capacity inductance with on-chip. The present invention includes a first side pattern group, a second side pattern group, a lower pattern group, and an upper pattern group.

Description

Coil-type on-chip inductor device

The present invention relates to a technique for implementing a high-capacity inductor used in various fields (eg, an oscillator, a power conversion IC, a DC-DC converter) on-chip (eg, an SoC semiconductor application or a standalone chip component).

More specifically, the present invention relates to a technology capable of generating a high capacitance inductance on the on-chip by applying a through silicon via (TSV) concept to three-dimensionally molded inductor in the coil on-chip.

In general, in electronic circuits such as oscillators, switched power conversion ICs, and DC-DC converters, inductance must be essential to generate the output voltage. For example, an inductor employed in a typical semiconductor on-chip electronic circuit requiring a predetermined value of inductive reactance (X _L = 2πfL) exhibits an inductance in the range of approximately 10 nH to 15 nH, resulting in a high frequency of 100 MHz or higher in the semiconductor on-chip electronic circuit. Play a significant role in

However, when a semiconductor electronic circuit having a high frequency of 100 Mhz or more is configured as a switching circuit, the high frequency rapidly decreases the efficiency of the switching circuit. To solve this problem, the switching frequency on the switching circuit should be reduced to about 10 MHz, and an inductor component having an inductance in the range of about 100 nH to 500 nH corresponding to the lower switching frequency should be used.

Since these inductor components are not available on-chip, separate inductor components with inductance capacities ranging from 100nH to 500nH have been mounted on the switching circuit. However, the use of a separate inductor component has a problem that is not compatible with the recent trend of manufacturing electronic products that seek high integration miniaturization.

The present invention has been proposed in view of the above, and an object of the present invention is to generate high-capacity inductance by on-chip type instead of a separate part by three-dimensionally forming a coil in an on-chip (eg, an SoC semiconductor application or a single chip component). The present invention provides a coil type on-chip inductor device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a coil type on-chip inductor device capable of obtaining a high capacity inductance in the form of on-chip and achieving high integration miniaturization of SoC semiconductors when applied to SoC.

In order to achieve the above object, the present invention is a coil-on-chip inductor device which is integrally patterned on the on-chip to generate a high capacity inductance on-chip, comprising a plurality of first side pattern members disposed independently on the side of the on-chip A first side pattern group forming a plurality of lines (hereinafter, referred to as 'horizontal columns') in a direction; A second side pattern group including a plurality of second side pattern members disposed independently on a side of the on-chip facing the first side pattern group to form a plurality of lines in a horizontal direction corresponding to a horizontal column; A lower pattern group including a plurality of lower pattern members that are long and independently arranged from a lower portion of the first side pattern member to a lower portion of the second side pattern member to form a plurality of lines in a horizontal direction corresponding to a horizontal column; And an upper pattern group including a plurality of upper pattern members for interfacing a current to flow from an upper portion of the second side pattern group to an upper portion of the first side pattern group in an upper portion of the on-chip facing the lower pattern group. The current flowing through the upper pattern group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group in sequence may be configured to flow in the coil type wire pattern.

In this case, the upper pattern group is one of the plurality of upper pattern members, and the first side pattern member (hereinafter, referred to as a 'first side first pattern member') positioned at the outermost side of the first side pattern group is referred to as the first pattern member. An input terminal disposed at an upper side to apply a current to the first side first pattern member; A second side pattern member (hereinafter, referred to as a 'second side n-th pattern member') of one of a plurality of upper pattern members, which is located at the rearmost outer side of the second side pattern group diagonally formed with the first side first pattern member. The current supplied to the input terminal flows through the upper pattern group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group in a coiled wire pattern sequentially. An output terminal for interfacing the output; An upper pattern member disposed between the input terminal and the output terminal, the second side pattern member having one end corresponding to the same line as the first side first pattern member in a horizontal column (hereinafter referred to as a 'second side first pattern member'); First side pattern member (hereinafter referred to as 'first side second pattern member') at a position moved from the first side first pattern member to the rear side line in the horizontal column at the other end thereof Coil-shaped first pattern member connected to the upper portion of the; An upper pattern member disposed between the input terminal and the output terminal, wherein the other end connected to the upper portion of the first side pattern member is moved one space from the horizontal column to the rear line rather than one end connected to the upper portion of the second side pattern member. And at least one coil-type n-pattern member disposed between the coil-shaped first pattern member and the output terminal to form the same pattern as the coil-shaped first pattern member.

On the other hand, the first side pattern member has a plurality of layers formed with a plurality of via holes for vertical conduction in the vertical direction overlapping the upper pattern member and the lower pattern member corresponding to the vertical vertical portion of the first side pattern member The second side pattern member is configured to have a plurality of layers formed with a plurality of via holes for vertically energizing so that the plurality of layers overlap each other in the vertical direction. It may be configured to energize the corresponding lower pattern member.

On the other hand, a plurality of superimposed on the first side pattern member so that current flowing from one end of the upper pattern group connected to the first side pattern group to the other end of the upper pattern group connected to the second side pattern group flows in parallel One or more layers of the layer and one or more layers of the plurality of layers overlapping the second side pattern member are connected to each other so as to enable electricity, one or more parallel pattern group formed in the same pattern as the lower pattern group; have.

And, the thickness of the upper pattern group may be formed relatively thicker than the thickness of the lower pattern group.

According to the present invention, a high capacity inductance can be obtained even with a small size by applying a TSV concept to an inductor in a coil shape on a chip (eg, an SoC semiconductor application or a single chip component).

In addition, the present invention shows the advantage that the high integration of the SoC semiconductor can be achieved as a high capacity inductance can be obtained on-chip.

In addition, the present invention exhibits the advantage that the high-capacity inductor component can be made small.

1 is an exemplary view showing a coil type on-chip inductor device according to a first embodiment of the present invention;
FIG. 2 is a view in which the distance between the first side pattern group, the second side pattern group, the lower pattern group, and the upper pattern group and the configuration of each side pattern group in FIG. 1 are spaced apart in the vertical direction;
3 is a diagram excluding the reference numerals in FIG. 2 and sequentially passes through the upper pattern group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group in the state of [FIG. 2]. Exemplary diagram showing a state in which a current flows in a coiled wire pattern,
4 is an exemplary view showing a coil-on-chip inductor device according to a second embodiment of the present invention;
FIG. 5 is a view in which the distance between the first side pattern group, the second side pattern group, the lower pattern group, and the upper pattern group and the configuration of each side pattern group itself are spaced apart in the vertical direction in FIG. 4;
FIG. 6 is a diagram excluding the reference numerals in FIG. 5 and sequentially passes through the upper pattern group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group in the state of FIG. 2. It is an exemplary figure which shows the state which a current flows in a coil-shaped wire pattern.

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram illustrating a coil-type on-chip inductor device according to a first embodiment of the present invention, and FIG. 2 is a first side pattern group, a second side pattern group, and a lower pattern in FIG. 1. The distance between the group, the upper pattern group and the configuration of each side pattern group spaced apart in the vertical direction, [Fig. 3] is the upper pattern in the state of [Fig. It is an exemplary view showing a state in which a current flowing through the group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group sequentially flows through the coil-shaped wire pattern.

1 to 3, a first embodiment of the present invention is integrally patterned on an on-chip to generate high capacitance inductance on an on-chip (e.g., SoC semiconductor or semiconductor on-chip). The coil type on-chip inductor device may include a first side pattern group 100, a second side pattern group 200, a lower pattern group 300, and an upper pattern group 400.

In the present specification, 'SoC semiconductor', which is an example of an on-chip, refers to a system-on-chip semiconductor, and refers to a case in which the inductor device according to the present invention is mounted together with a peripheral system on a chip. .

In addition, the term “semiconductor on chip” as an example of an on chip in the present specification refers to a single inductor chip in which the inductor device according to the present invention is integrally formed with a semiconductor.

As shown in FIG. 2, the first side pattern group 100 includes a plurality of first side pattern members 110, 120, 130, and 140 that are independently disposed on the side of the on-chip. To achieve).

Here, the 'horizontal column' indicates a plurality of lines (eg, A, B, C, and D) adjacent in the horizontal direction as shown in FIG. 1.

In addition, each of the first side pattern members 110, 120, 130, and 140 has a plurality of layers formed with a plurality of via holes (not shown) for vertically energizing, as shown in FIG. 2. Each of the corresponding upper pattern members 410, 430, 440, and 450 and each of the lower pattern members 310, 320, 330, 340 corresponding to its vertical bottom may be energized.

For example, in the first side pattern member 110 corresponding to the horizontal column 'A', a plurality of first layers 111, 112, and 113 formed with a plurality of via holes for up and down energization are arranged in the vertical direction as illustrated in FIG. 2. Can be.

In addition, in the first side pattern member 120 corresponding to the horizontal column 'B', a plurality of second layers 121, 122, and 123 formed with a plurality of via holes for up and down energization are arranged in the vertical direction as illustrated in FIG. 2. Can be.

In addition, in the first side pattern member 130 corresponding to the horizontal column 'C', a plurality of third layers 131, 132, and 133 formed with a plurality of via holes for up and down energization are arranged in the vertical direction as illustrated in FIG. 2. Can be.

In addition, in the first side pattern member 140 corresponding to the horizontal column 'D', a plurality of fourth layers 141, 142, and 143 formed with a plurality of via holes for up and down energization are arranged in the vertical direction as illustrated in FIG. 2. Can be.

As shown in FIG. 2, the second side pattern group 200 includes a plurality of second side pattern members 210, 220, 230, and 240 that are independently disposed on the side of the on-chip facing the first side pattern group 100, so as to form a 'horizontal column'. Form a plurality of lines (eg, A, B, C, D) in the horizontal direction corresponding to '.

Each of the second side pattern members 210, 220, 230, and 240 has a plurality of layers formed with a plurality of via holes (not shown) for vertically energizing as shown in FIG. Each of the corresponding upper pattern members 420, 430, 440 and 450 and each of the lower pattern members 310, 320, 330 and 340 corresponding to the vertical lower portion thereof may be energized.

For example, in the second side pattern member 210 corresponding to the horizontal column 'A', a plurality of fifth layers 211, 212, and 213 formed with a plurality of via holes for up and down energization are arranged in the vertical direction as illustrated in FIG. 2. Can be.

In addition, in the second side pattern member 20 corresponding to the horizontal column 'B', a plurality of sixth layers 221, 222, and 223 having a plurality of via holes for up and down energization are disposed in the vertical direction as illustrated in FIG. 2. Can be.

In addition, in the second side pattern member 230 corresponding to the horizontal column 'C', a plurality of seventh layers 231, 232, 233 formed with a plurality of via holes for up and down energization are arranged in a plurality of vertical directions as shown in FIG. 2. Can be.

In addition, in the second side pattern member 240 corresponding to the horizontal column 'D', a plurality of eighth layers 241, 242, 243 having a plurality of via holes for up and down energization are arranged in a plurality of vertical directions as shown in FIG. 2. Can be.

The lower pattern group 300 is a lower portion that is independently disposed long from the lower portion of each of the first side pattern members 110, 120, 130, and 140 to the lower portion of each of the second side pattern members 210, 220, 230, and 240, as shown in FIGS. 1 to 3. A plurality of pattern members 310, 320, 330, 340 are provided to form a plurality of lines (eg, A, B, C, D) in a horizontal direction corresponding to the 'horizontal column'.

The upper pattern group 400 is the first side pattern group 100 from the top of the second side pattern group 200 at the top of the on-chip facing the lower pattern group 300 as shown in [Fig. 1] to [3]. A plurality of upper pattern members (410, 420, 430, 440, 450) for interfacing a current to flow to the top of the) is provided.

As a result, as shown in FIG. 3, the upper pattern group 400, the first side pattern group 100, the lower pattern group 300, the second side pattern group 200, and the upper pattern group 400 are sequentially formed. The current passing through the wire can flow in a coiled wire pattern.

On the other hand, the upper pattern group 400 is an upper pattern member, as shown in Figure 2, the input terminal 410, the output terminal 420, the coil type first pattern member 430, the coil type second pattern member ( 440, and a coil type third pattern member 450.

The input terminal 410 is one of a plurality of upper pattern members, as shown in FIGS. 1 to 3, and is a first side pattern member positioned at the outermost front side of the first side pattern group 100. It is disposed on the first side first pattern member 110 to apply a current to the first side first pattern member 110.

The output terminal 420 is one of the plurality of upper pattern members, and the second side pattern member positioned at the rearmost outer side of the second side pattern group 200 which forms a diagonal line with the first side first pattern member 110. The second side fourth pattern member 240 is disposed on the top to receive the current supplied from the second side fourth pattern member 240.

That is, the output terminal 420 has a current supplied to the input terminal 410, as shown in Figure 2 and 3, the upper pattern group 400, the first side pattern group 100, the lower pattern group ( 300, the second side pattern group 200 and the upper pattern group 400 are sequentially passed through the coil-type wire pattern to be output.

The coil type first pattern member 430 represents an upper pattern member disposed between the input terminal 410 and the output terminal 420.

For example, the coil-shaped first pattern member 430 has one end at the same line (eg, A) as the first side first pattern member 110 in the 'horizontal column' as shown in FIGS. 2 and 3. A second line is connected to the top of the second side first pattern member 210 which is a corresponding second side pattern member, and the other end is a rear side line (eg, B) from the first side first pattern member 110 in the 'horizontal column'. It is connected to the upper portion of the first side second pattern member 120 which is the first side pattern member of the position moved one cell.

The coil-shaped second pattern member 440 is an upper pattern member disposed between the input terminal 410 and the output terminal 420. For example, one end of the coil-type pattern member 440 is a 'horizontal column' as shown in FIGS. Is connected to the upper part of the second side second pattern member 220 which is the second side panton member at the position moved to the rear side line (for example, B) of the second side first pattern member 210 at Is the upper side of the first side third pattern member 130 which is the first side pattern member at a position moved from the first side second pattern member 120 to the rear side line (for example, C) in the 'horizontal column'. Is connected to.

The coil type third pattern member 450 is an upper pattern member disposed between the input terminal 410 and the output terminal 420. For example, one end of the coil-shaped third pattern member 450 is a 'horizontal column' as shown in FIGS. 2 and 3. Is connected to an upper portion of the second side third pattern member 230 which is the second side panton member at a position moved to the rear side line (for example, C) of the second side second pattern member 220 at Is an upper portion of the first side fourth pattern member 140 which is the first side pattern member at a position moved from the first side third pattern member 130 to the rear side line (eg, D) in the 'horizontal column'. Is connected to.

As such, the upper pattern group 400 has the coiled nth pattern members 430, 440, and 450 moved one by one space from the 'A' to the 'D' directions in the 'horizontal column'. ) May implement a coiled wire pattern in the same manner as in FIG. 3.

In the present specification, if the input terminal 410 and the output terminal 420 are a relative concept, if the current supplied from the outside is input to the output terminal 420 of FIG. 2, the input terminal 410 of FIG. 2 is an output terminal. The current direction of [Fig. 3] will also flow in the opposite direction to the arrow.

In addition, in the present specification, 'front' and 'rear' are also shown as a relative concept, and the horizontal column 'A' is positioned ahead of the horizontal columns 'B, C, D', and the horizontal column 'D' is the horizontal column 'A,' It is shown to be located behind B, C '.

The thickness of the upper pattern group 400 may be formed to be relatively thicker than the thickness of the lower pattern group 300.

Since the upper pattern group 400 is connected to an external terminal to exchange electricity, the upper pattern group 400 may be thickly formed to have a low resistance as long as it does not escape the trend of on-chip miniaturization.

4 is an exemplary diagram illustrating a coil-type on-chip inductor device according to a second embodiment of the present invention, and FIG. 5 is a first side pattern group, a second side pattern group, and a lower pattern in FIG. 4. The distance between the group, the upper pattern group and the configuration of each side pattern group in the vertical direction spaced apart, and [Fig. 6] is a reference pattern in the state of [Fig. It is an exemplary view showing a state in which a current flowing through the group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group sequentially flows through the coil-shaped wire pattern.

4 to 6, the second embodiment of the present invention may further include one or more parallel pattern groups 500 in the first embodiment.

The parallel pattern group 500 according to the second embodiment of the present invention may be provided with one or more, and the upper pattern group (connected to the first side pattern group 100 as shown in Figs. 5 and 6) ( A current flowing from one end of the 400 to the other end of the upper pattern group 400 connected to the second side pattern group 200 flows in parallel.

To this end, the parallel pattern group 500 includes one layer 111, 121, 131, 141 corresponding to the vertical column 'd' among a plurality of layers overlapping the first side pattern members 110, 120, 130, and 140 as shown in FIGS. 1 and 2. ) And one layer 211, 221, 231, 241 corresponding to the vertical column 'd' among the plurality of layers overlapping the second side pattern members 210, 220, 230, and 240 are electrically connected to each other.

As a result, as shown in FIG. 6, the current supplied from the upper pattern group 400 to the first side pattern group 100 passes through the lower pattern group 300 and the parallel pattern group 500 in parallel with each other. It may be delivered to the side pattern group 200.

At this time, the parallel pattern group 500 is formed in the same pattern as the lower pattern group 300, as shown in Figure 5, the thickness of the upper pattern group 400 is the lower pattern group 300 and the parallel pattern group 500 It can be formed relatively thicker than the thickness of).

Here, the 'vertical column' indicates a plurality of lines (eg, a, b, c, d, and e) adjacent to each other in the vertical direction as shown in FIG. 4.

100: first side pattern group
110,120,130,140: first side pattern member
111,112,113: first layer
121,122,123: second layer
131,132,133: third layer
141,142,143: fourth layer
200: second side pattern group
210,220,230,240: second side pattern member
211,212,213: fifth layer
221,222,223: sixth layer
231,232,233: seventh layer
241,242,243: eighth layer
300: lower pattern group
310,320,330,340: lower pattern member
400: upper pattern group
410: input terminal
420: output terminal
430: coil type first pattern member
440 and 450: coiled nth pattern member
500, 500 ': Parallel pattern group

Claims (5)

A coiled on-chip inductor device that is integrally patterned on the on-chip to produce high capacitance inductance on-chip.
A first side pattern group 100 having a plurality of first side pattern members disposed independently on the side of the on-chip to form a plurality of lines (hereinafter, referred to as a "horizontal column") in a horizontal direction;
A second side pattern group 200 having a plurality of second side pattern members independently disposed on the side of the on-chip facing the first side pattern group to form a plurality of lines in a horizontal direction corresponding to the horizontal column;
A lower pattern group including a plurality of lower pattern members that are long and independently arranged from a lower portion of the first side pattern member to a lower portion of the second side pattern member to form a plurality of lines in a horizontal direction corresponding to the horizontal column ( 300);
An upper pattern group 400 including a plurality of upper pattern members for interfacing a current to flow from an upper portion of the second side pattern group to an upper portion of the first side pattern group in an upper portion of the on-chip facing the lower pattern group ;
Consists of including,
A coil type configured to allow a current flowing through the upper pattern group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group to flow in a coil type wire pattern On-chip inductor device.
The method according to claim 1,
The upper pattern group 400,
One of a plurality of upper pattern members, the first side pattern member (hereinafter referred to as a 'first side first pattern member') positioned at the outermost front side of the first side pattern group, An input terminal 410 for applying a current to the first side first pattern member;
A second side pattern member (hereinafter, referred to as' second side n) of one of the plurality of upper pattern members, positioned at a rearmost outermost side of the second side pattern group diagonally formed with the first side first pattern member. And a current supplied to the input terminal is sequentially arranged in the upper pattern group, the first side pattern group, the lower pattern group, the second side pattern group, and the upper pattern group. An output terminal 420 for interfacing to be output through the coil-shaped wire pattern via the coil;
The upper pattern member disposed between the input terminal and the output terminal, one end of the second side pattern member corresponding to the same line as the first side first pattern member in the horizontal column (hereinafter referred to as a 'second side portion'); The first side pattern member (hereinafter referred to as 'first') at a position connected to an upper portion of the first pattern member, and the other end of which is moved one square from the first side first pattern member to the rear line in the horizontal column. A coil-shaped first pattern member 430 connected to an upper portion of the first side second pattern member;
The upper pattern member disposed between the input terminal and the output terminal, the other end connected to the upper portion of the first side pattern member than the one end connected to the upper portion of the second side pattern member is rearward in the horizontal column. One or more coil-shaped n-th pattern members 440 and 450 disposed between the coil-shaped first pattern member and the output terminal to form the same pattern as the coil-shaped first pattern member as they are disposed one by one by a side line;
Coil-type on-chip inductor device, characterized in that comprising a.
The method according to claim 2,
The first side pattern member has a plurality of layers formed with a plurality of via holes for vertically energizing and is disposed in the vertical direction so that the upper pattern member corresponding to the vertical upper portion thereof and the lower pattern corresponding to the vertical lower portion thereof. Energize the member,
The second side pattern member has a plurality of layers formed with a plurality of via holes for vertically energizing the upper and lower layers, so that the upper pattern member corresponding to the vertical upper portion thereof and the lower pattern corresponding to the vertical lower portion thereof. A coil type on-chip inductor device, characterized in that the member is energized.
The method according to claim 3,
Overlapping the first side pattern member such that a current flowing from one end of the upper pattern group connected to the first side pattern group to the other end of the upper pattern group connected to the second side pattern group flows in parallel At least one parallel pattern group 500 connected to each other so that one or more layers of the plurality of layers and at least one layer of the plurality of layers overlapping the second side pattern member are electrically connected, and formed in the same pattern as the lower pattern group;
Coil-type on-chip inductor device, characterized in that further comprises.
The method according to claim 4,
Coil-type on-chip inductor device characterized in that the thickness of the upper pattern group is formed relatively thicker than the thickness of the lower pattern group.

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