KR102051022B1 - Wafer handling wand - Google Patents

Wafer handling wand Download PDF

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Publication number
KR102051022B1
KR102051022B1 KR1020130003099A KR20130003099A KR102051022B1 KR 102051022 B1 KR102051022 B1 KR 102051022B1 KR 1020130003099 A KR1020130003099 A KR 1020130003099A KR 20130003099 A KR20130003099 A KR 20130003099A KR 102051022 B1 KR102051022 B1 KR 102051022B1
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KR
South Korea
Prior art keywords
wafer
foot
arm
transfer arm
handling wand
Prior art date
Application number
KR1020130003099A
Other languages
Korean (ko)
Other versions
KR20140091201A (en
Inventor
성동환
Original Assignee
에스케이실트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스케이실트론 주식회사 filed Critical 에스케이실트론 주식회사
Priority to KR1020130003099A priority Critical patent/KR102051022B1/en
Publication of KR20140091201A publication Critical patent/KR20140091201A/en
Application granted granted Critical
Publication of KR102051022B1 publication Critical patent/KR102051022B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0091—Shock absorbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

The present invention relates to a wafer handling wand capable of reducing the impact force between the wafer and the foot during wafer pickup.
The present invention includes a body (pick-up) to pick-up the wafer in the non-contact by the Bernoulli principle; A body conveying arm for conveying the body in the front and rear directions; A pair of feet provided around the lower side of the body to adjust a horizontal position of the wafer picked up on the lower surface of the body; It provides a wafer handling wand including a foot-arm for transferring the foot in the front-rear direction and a driving device for providing a driving force to the body-carrying arm and the foot-carrying arm.

Description

Wafer Handling Wands {WAFER HANDLING WAND}

The present invention relates to a wafer handling wand capable of reducing the impact force between the wafer and the foot during wafer pickup.

In general, a process of preparing a wafer for manufacturing a semiconductor device is as follows. A silicon ingot is first produced and the manufactured silicon ingot is sawed into individual silicon wafers. The sawed silicon wafers are subjected to several processing processes including lapping, grinding, etching and polishing, and then the front face or the front and back face are mirrored. It is a wafer having a gloss. Then, an epitaxial wafer in which a silicon thin film is grown on the wafer surface by an epitaxial deposition process can be manufactured.

Usually, the epitaxial deposition process is divided into two stages.

In the first step, the pre-baking process, the silicon wafer is loaded onto a susceptor in an epitaxial reactor. The silicon wafer surface is pre-baked at a constant temperature (for example, 1130 ° C.) while hydrogen or a cleaning gas such as hydrogen and hydrochloric acid mixed gas is applied to the silicon wafer surface.

In the second epitaxial growth process, a wafer is applied at a constant temperature (eg 800 ° C.) while a silicon vapor source such as silane or trichlorosilane is applied to the silicon wafer surface. A silicon layer is grown on the surface.

Various wafer pick-up devices have been developed to avoid damaging the wafer for loading a silicon wafer onto a susceptor in an epitaxial reactor. One of these types of pick-up devices, the Bernoulli wand, uses Bernoulli's principle to transfer the wafer onto the susceptor in the reactor or to the susceptor in the reactor, without the wafer carrier plate transferring the wafer directly contacting the wafer. Wafer can be transferred out of the reactor.

Such Bernoulli wands are pulled on Bernoulli principle during wafer loading, as shown in Korean Patent Publication No. 2012-0029099. In order to prevent the wafer from deviating from the fixed position on the wand when the initial pulling force is applied, It is provided.

1 is a view showing a portion of the wafer handling wand according to the prior art.

The conventional wafer handling wand is configured to include a disc shaped body 10, a pair of transfer arms 20, and a pair of feet 30, as shown in FIG.

By the way, the foot 30 is located in a fixed form on the outside of the body 10, the body 10 and the foot 30 is configured to move simultaneously in the front and rear direction by the transfer arm (20) do.

Thus, conventional wafer handling wands have a high impact force when the wafer hits the fixed-foots by a force that is initially strongly pulled, and a kind of particles that collect on the edges of the particles on the wafer. There is a problem that a mound that is a defect is generated.

Of course, the foot supporting the position of the wafer can be buffered by being supported by a spring having a predetermined elasticity, but as the strong impact force is generated initially, the feet are moved back and forth by the predetermined elastic force, causing the foot to shake. By repeatedly moving back and forth in the direction of the wafer, the mound is not only deepened, but the wafer is also damaged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object thereof is to provide a wafer handling wand which can reduce the impact force by increasing the contact time between the wafer and the foot during wafer pickup.

The present invention includes a body (pick-up) to pick-up the wafer in the non-contact by the Bernoulli principle; A body conveying arm for conveying the body in the front and rear directions; A pair of feet provided around the lower side of the body to adjust a horizontal position of the wafer picked up on the bottom of the body; Provided is a wafer handling wand including a foot-arm for transferring the foot in the front-rear direction and a driving device for providing a driving force to the body-carrying arm and the foot-carrying arm.

According to the Bernoulli principle, when the wafer is picked up, the foot is moved through the foot transfer arm, and the position of the foot can be moved in the direction of movement of the wafer for a predetermined time while the wafer is in contact with the foot.

Accordingly, the Bernoulli principle allows the wafer to be stably positioned at a predetermined position during wafer pickup, and as the contact time between the wafer and the foot increases, the impact force between the wafer and the foot can be reduced, and thus the impact force applied to the wafer. Can reduce the occurrence of mound defects in the wafer.

1 illustrates a portion of a wafer handling wand according to the prior art.
2 illustrates a wafer handling wand in accordance with the present invention.
3-4 show the main parts of a wafer handling wand according to the invention.
5A-5D show the operating state of the wafer handling wand in accordance with the present invention.

Hereinafter, with reference to the accompanying drawings for the present embodiment will be described in detail. However, the scope of the inventive concept of the present embodiment may be determined from the matters disclosed by the present embodiment, and the inventive idea of the present embodiment may be implemented by adding, deleting, or changing components with respect to the proposed embodiment. It will be said to include variations.

2 shows a wafer handling wand in accordance with the present invention.

As shown in FIG. 2, the wafer handling wand of the present invention includes a body 110, a body transfer arm 120, a pair of feet 130, a foot transfer arm 140, and a driving device ( 150).

The body transfer arm 120 may move the body 110 forward / reverse in the horizontal direction, and the foot transfer arm 140 may move the foot 130 in the horizontal direction.

The driving device 150 may provide power separately to the body transfer arm 120 and the foot transfer arm 140.

In an embodiment, the driving device 150 is a motor 151 for providing a driving force, and a power for transmitting power from the motor 151 to the body transfer arm 120 and the foot transfer arm 140 separately. The transmission unit is provided, and the power transmission unit may be variously configured as a cam, a gear, a belt pulley, or the like.

Of course, since the body transfer arm 120 and the foot transfer arm 140 are operated separately, the body transfer belt pulley 152 and the foot transfer belt pulley 153 to transfer power from the motor 151. ) May be provided separately.

3-4 show the main parts of a wafer handling wand according to the invention.

Looking at the main portion of the handling wand with reference to Figures 3 to 4, as follows.

The body 110 is configured to adsorb the wafer to face the wafer during the pickup, but is not configured to directly contact the wafer.

At this time, the body 110 is a plate shape, the gas supply line is built, the gas injection hole 110h is provided on the bottom, it is configured to adsorb the wafer by Bernoulli principle.

The body transfer arm is composed of first and second body transfer arms 121 and 122, and is connected to at least two links 121a, 121b, 122a and 122b, respectively, and may be configured in various forms.

Therefore, the body 110 may move forward or backward in the horizontal direction as the first and second body transfer arms 121 and 122 move.

The foot is installed to be movable in the horizontal direction in consideration of the suction position of the wafer under the body 110, the first and second foot (131, 132) is provided to support the outer peripheral end of the wafer.

The foot transfer arm is composed of first and second foot transfer arms 141 and 142 connected to the first and second foots 131 and 132, respectively, and is connected by at least two links 141a, 141b, 142a and 142b. Likewise, it may be configured in various forms.

Accordingly, the first and second foot 131 and 132 may be moved forward or backward in the horizontal direction by the first and second foot transfer arms 141 and 142. As shown in FIG. Although the first and second foots 131 and 132 are located in the inner region of the body 110, the first and second foots 131 and 132 are moved in the direction of movement of the wafer over a set time Δt. As described above, the first and second foots 131 and 132 may be moved from an inner region to an outer region of the body 110.

5A-5D show the operating state of the wafer handling wand in accordance with the present invention.

As shown in FIG. 5A, the body 110 is moved by the body transfer arm 120 to be positioned above a portion of the wafer W, and the foot 130 is moved by the foot transfer arm 140. ) Is moved to be located in the lower inner region of the body (110).

Then, when the gas is injected to the lower side of the body 110, as shown in Figure 5b, using a jet of gas to lower the pressure directly above the wafer (W) than the pressure directly below the wafer (W) Thereby generating a gas flow pattern on the wafer W, and pressure imbalance raises the wafer W upwards.

Thus, as the wafer W is pulled upwards towards the body 110, the same jet that generates lift forces produces a greater repulsive force that blocks the contact of the wafer W with the body 110. As a result, the wafer W can be held under the body 110 in a substantially non-contact manner.

Thereafter, as shown in FIG. 5C, an edge portion of the wafer W comes into contact with the foot 130, and the body 110 maintains a fixed position, but the foot 130 is used for the foot transfer. The arm 140 moves the wafer W in the horizontal movement direction. At this time, the foot 130 is moved in the horizontal movement direction of the wafer W over the set time Δt while the wafer W and the foot 130 are in contact with each other.

Therefore, although the pulling force of the body 110 is constant, the impact force between the wafer W and the foot 130 can be reduced by increasing the contact time between the wafer W and the foot 130.

As such, when the wafer W and the foot 130 are moved in the same direction over the set time Δt in a state in which the wafer W is in contact with each other, as shown in FIG. 5D, the wafer W is disposed below the body 110. In place, the foot 130 is moved to be located in the lower outer area of the body 130.

110: body 120: body transfer arm
130 foot 140 foot transfer arm
150: drive device

Claims (5)

A body for picking up the wafer in a non-contact manner on the basis of the Bernoulli principle;
A body conveying arm for conveying the body in the front and rear directions;
A pair of feet provided around the lower side of the body to adjust a horizontal position of the wafer picked up on the lower surface of the body;
Foot-arm for transporting the foot in the front and rear direction (foot-arm) and
A driving device for providing a driving force to the body transfer arm and the foot transfer arm,
The foot transfer arm,
And a wafer handling wand for controlling the feet to contact the outer circumferential end of the wafer for a predetermined time or more when the wafer is picked up. The method of claim 1,
The foot transfer arm,
Adjust the feet to be located inside the lower side of the body prior to pickup of the wafer,
And a wafer handling wand for moving said feet outside the lower side of said body upon pickup of said wafer. delete The method of claim 1,
The foot transfer arm,
And a wafer handling wand providing a predetermined elastic force in the horizontal direction of the wafer. The method of claim 4, wherein
The foot transfer arm,
A wafer handling wand that is a link to at least one joint.
KR1020130003099A 2013-01-10 2013-01-10 Wafer handling wand KR102051022B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130003099A KR102051022B1 (en) 2013-01-10 2013-01-10 Wafer handling wand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130003099A KR102051022B1 (en) 2013-01-10 2013-01-10 Wafer handling wand

Publications (2)

Publication Number Publication Date
KR20140091201A KR20140091201A (en) 2014-07-21
KR102051022B1 true KR102051022B1 (en) 2019-12-02

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107785299A (en) * 2016-08-30 2018-03-09 上海微电子装备（集团）股份有限公司 A kind of silicon chip pick device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237407A (en) * 2005-02-25 2006-09-07 Semes Co Ltd Substrate conveying device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4642787B2 (en) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 Substrate transfer device and vertical heat treatment device
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
TWI441719B (en) * 2007-06-05 2014-06-21 Nidec Sankyo Corp Industrial robotic arm

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237407A (en) * 2005-02-25 2006-09-07 Semes Co Ltd Substrate conveying device

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