KR102050786B1 - A chemical vapor deposition chamber - Google Patents

Abstract

An objective of the present invention is to further improve the productivity. According to one embodiment of the present invention for solving the above problem, a chamber for chemical vapor deposition comprises: a chamber body; at least one pair of guide units provided on the inner wall of the chamber body and formed to face each other; and first thin plate members provided to be inserted and fixed inside the chamber body along the guide units, made of a flexible material, and provided to be inserted into left and right sidewalls of the chamber body.

Description

A chemical vapor deposition chamber

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamber for chemical vapor deposition. In the process of depositing an object to be deposited using paraline, it is possible to easily maintain and repair the cleanliness in the chamber, thereby reducing PM (Prevent Maintenance) time. The present invention relates to a chamber for chemical vapor deposition which can improve productivity and at the same time improve the deposition quality of a deposition target to be chemical vapor deposited.

In a CVD process in which deposition of a deposition target is carried out using parylene, the parylene coating film made of parylene is formed on all chamber surfaces such as not only a product but also a chamber wall, a viewing window, an exhaust pipe, and the like.

In particular, for a certain period of time, after the deposition process to remove the parylene film in the chamber (Parylene), the parylene (Parylene) is a material having a very high chemical resistance, it is almost impossible to remove with a solvent, At this time, it is not easy to remove the parylene coating layer.

In order to solve this problem, prior to coating, the surface of the deposition chamber before the surface of the surface of the surface of the surfactant, and then the parylene deposition process to prevent the scattering of the surfactant, the parylene (Parylene) coating film can be easily peeled off This method is mainly used, but since the cleaning time is required to prevent the scattering of the surfactant, the cleaning time is long and when the weight of the parylene coating film becomes heavy, the coating film spontaneously There was a problem that the cleaning cycle is shortened because it has a problem that can damage the product fall and the coating film is thick before cleaning.

In addition, there was still a problem that the removal of the parylene coating film did not proceed smoothly in the zone where the application of the surfactant did not proceed, there was still the inconvenience that the operator must scrape off directly.

KR 10-1136539 B1 'Paparin coating device with chamber flange structure' KR 10-0735780 B1 'Paralline monomer supply pipe sealing structure of paraline coating equipment'

The problem to be solved by the present invention was created in order to solve the above problems, by having a plurality of thin plates that are mounted on the inner wall of the chamber for chemical vapor deposition so as to be replaced, when the vapor deposition using the paraline, inside the chamber By preventing the deposition of the paraline directly on the wall surface, it is possible to facilitate the cleaning of the chamber, while maintaining the cleanliness in the chamber and at the same time shorten the maintenance and repair time to improve the productivity of chemical vapor deposition The purpose is to provide a wearing chamber.

According to an embodiment of the present invention for solving the above problems, the chamber for chemical vapor deposition of the present invention is provided on the chamber body, the chamber body inner wall surface and the guide portion formed to face at least one pair, the guide It is characterized in that it comprises a first thin plate member which is provided to be fixed to the inside of the chamber body along the part, is made of a flexible material, the plurality is provided to be inserted into the left and right side walls of the chamber body.

In more detail, a second thin plate member coupled to the inner ceiling surface and the inner bottom surface of the chamber body and provided with a plurality, and further comprising a coupling member coupled to the second thin plate member and the chamber body. do.

In more detail, the chemical vapor deposition chamber is provided to be detachable to the outermost exposed surface of the first thin plate member and the second thin plate member, and any one or more pressure-sensitive adhesives selected from hot melt, rubber, acrylic, and silicone It further comprises a film member composed of.

In more detail, the chemical vapor deposition chamber is applied to a first zone in which the first thin plate member and the guide unit are coupled, and a second zone in which the second thin plate member and the coupling member are coupled to each other. And a sealing material applied between the one thin plate member and the plurality of second thin plate members.

In more detail, the chemical vapor deposition chamber is disposed in the area where the sealing material is applied, the heating member is provided to be wrapped by the sealing material further comprises.

More specifically, the sealing material is characterized in that it maintains the adhesiveness only when the internal temperature of the chamber body is in the temperature range of 15 ℃ to 40 ℃.

According to the present invention as described above, the present invention is provided with a thin plate member of a flexible material provided to be detachable from the chamber body, so that the chamber body during the deposition process in which the paraline is introduced regardless of the shape of the chamber, In addition to providing an effect of improving the ease of cleaning for the same time, it is possible to shorten the time required for cleaning the chamber body can provide an effect that can significantly improve the efficiency of the overall process.

In addition, the present invention provides a thin plate member not only on the inner wall, but also on the ceiling surface and the bottom surface, and allows the thin plate member to be more firmly coupled through a separate coupling member, thereby separating the thin plate member in the chamber body. To prevent the damage to the deposition object can be provided.

In addition, the present invention, through the film member provided to be detachable to the thin plate member, by allowing the thin plate member to be reused for a certain period of time, the effect of not only saving resources but also significantly reducing the cost for producing the thin plate member. Can provide.

In addition, the present invention is to ensure that the sealing material is applied to the micro-space generated when each thin plate member is bonded to the chamber body, so that the paraline does not penetrate into the micro-space during the deposition process in which the paraline is introduced, It can provide an effect that can further improve the ease of cleaning.

In addition, the present invention can provide an effect of inducing deformation of the sealing material so that the sealing material can be peeled off from the thin plate more easily by introducing a heating member into the chamber, thereby further improving the ease of operation.

1 is a perspective view showing a chemical vapor deposition chamber of the present invention.
2 is a perspective view illustrating a path through which a thin plate member provided in a chemical vapor deposition chamber of the present invention is inserted.
3 is a cross-sectional view showing a cross section of the chamber for chemical vapor deposition of the present invention.
4 is an enlarged view of a region B of FIG. 3 showing a cross section of the chamber for chemical vapor deposition according to the present invention.
5 is a cross-sectional view showing a film member adhered to the thin plate member of the chemical vapor deposition chamber of the present invention.
6 is a cross-sectional view showing a chemical vapor deposition chamber provided with a heating member according to another embodiment of the present invention.
FIG. 7 is an enlarged view illustrating a region C of FIG. 6 illustrating a chamber for chemical vapor deposition provided with a heating member according to another exemplary embodiment of the present disclosure.

Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention.

In addition, the Example described below does not unduly limit the content of this invention described in the Claim, and the whole structure described in this Embodiment is not necessarily required as a solution of this invention.

In addition, the matters obvious to those skilled in the art and the art may be omitted, and the description of the omitted elements and functions may be sufficiently referred to without departing from the technical spirit of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the transformer device improved construction according to the present invention.

1 is a perspective view showing a chemical vapor deposition chamber of the present invention, Figure 2 is a perspective view showing a path through which a thin plate member provided in the chemical vapor deposition chamber of the present invention, Figure 3 is a chemical 4 is a cross-sectional view showing a cross section of the vapor deposition chamber, and FIG. 4 is an enlarged view showing a section B of FIG. 3 showing a cross section of the chemical vapor deposition chamber of the present invention, and FIG. 5 is a chemical vapor deposition of the present invention. 6 is a cross-sectional view illustrating a film member adhered to a thin plate member of a wearing chamber, and FIG. 6 is a cross-sectional view illustrating a chamber for chemical vapor deposition provided with a heating member according to another embodiment of the present invention, and FIG. 7 is another embodiment of the present invention. FIG. 6 is an enlarged view illustrating a region C of FIG. 6 illustrating a chamber for chemical vapor deposition provided with a heating member.

1 and 2, the chamber for chemical vapor deposition according to an embodiment of the present invention includes a chamber body 10, a guide part 20, and a first thin plate member 30. do.

First, the chamber body 10 is provided with an accommodation space to accommodate the deposition object therein, is provided to proceed with the deposition process in the state in which the deposition object is disposed in the accommodation space, the shape of the outer peripheral surface is a certain curvature It may be designed to have a cylindrical shape so that deformation does not occur by the pressure change inside the chamber body 10 to hold the.

In particular, the chamber body 10 may be provided with a supply pipe 11 into which the monomer containing the paraline required in the vapor deposition process and a discharge pipe 12 provided to adjust the pressure in the chamber. In order to add or discharge various gases required for the process, a separate supply pipe 11 and a discharge pipe 12 may be additionally provided.

In addition, although not particularly shown in the drawings, a sensor for measuring pressure and temperature of the chamber may be additionally provided in the chamber body 14.

In addition, the door member 13 may be formed in front of the chamber body 10 in order to ensure the ease of injection of the deposition object into the chamber body 10, so that the progress of the vapor deposition process can be confirmed, An inspection window 14 may be formed in the door member.

In addition, although not particularly shown in the drawings, the support for mounting the deposition object in the chamber body 10 may be provided separately.

Next, the guide portion 20 is provided on the inner wall surface of the chamber body 10, at least one pair is formed to face each other.

In this case, the guide part 20 is provided to have the same curvature as the curvature of the inner circumferential surface of the chamber body 10, the first thin plate member 30 to be described later in close contact with the inner circumferential surface of the chamber body 10 To be possible.

In particular, the guide portion 20 is provided to protrude toward the center of the chamber body 10 from the inner wall surface of the chamber body 10, so as to maintain the shape bent upward or downward, the guide The first thin plate member 30 to be described later inserted into the portion 20 may be provided so as not to be separated.

In addition, the guide unit 20 may be provided with at least one or more multi-stage arrangement in the vertical direction, the guide unit 20 formed in a multi-stage mutually adjacent position is provided to be in close contact with each other.

In addition, the guide portion 20 may be spaced apart from the ceiling surface and the bottom surface of the chamber body 10 by a predetermined distance, thereby securing a space for inserting a second thin plate member to be described later, the space The second thin plate member can be more firmly coupled to the chamber body by.

Next, the first thin plate member 30 is provided on the inner wall surface of the chamber body 10, and during the vapor deposition process using the monomer including parylene, the monomer is disposed on the inner wall surface of the chamber body 10. At least one is provided to prevent direct attachment.

In particular, the first thin plate member 30 is made of a deformable material to be in close contact with the inner wall surface of the chamber body 10 having a predetermined curvature and at the same time to allow smooth insertion into the guide unit 20.

In addition, as shown in FIG. 2, by providing a plurality of first thin plate members 30 so as to be respectively inserted toward the left and right sides of the chamber body 10, excessive deformation of the first thin plate member 30. By minimizing, it is possible to secure the long life of the first thin plate member 30.

In addition, among the plurality of first thin plate members 30, the supply pipe may include a first thin plate member 30 disposed at a position where the supply pipe 11 and the discharge pipe 12 formed in the chamber body 10 are formed. A first through hole 31a having a shape corresponding to the shape of the supply pipe 11 and the discharge pipe 12 is formed to smoothly flow various gases introduced and discharged through the 11 and the discharge pipe 12. Can be.

In particular, the first through hole 31a is formed to be larger than or equal to the diameter of the supply pipe 11 and the discharge pipe 12, so that the gas can flow more smoothly.

In addition, when the separation space between the first through hole 31a, the supply pipe 11 and the discharge pipe 12 is generated, it is possible to seal the separation space through a sealing member (not shown) to be described later.

Meanwhile, the guide part 20 having a predetermined curvature may be formed inside the door member 13, and the first thin plate may be formed through the guide part 20 provided inside the door member 13. By allowing the member 30 to be inserted, it is possible to prevent the inner surface of the door member 13 from being directly exposed to the monomer including paraline.

In addition, even in a state where the first thin plate member is inserted into the door member 13, the inside of the chamber body 10 may be formed through the above-described inspection window (not shown) formed in front of the door member 13. In order to observe the vapor deposition progress more smoothly, a second through hole 31b having a shape corresponding to the shape of the inspection window is inserted into the first thin plate member 30 inserted into the door member 13. Can be formed.

In particular, the second through hole 31b may be formed to be larger than or equal to the area of the inspection window, thereby securing the second through hole 31b through the inspection window by the first thin plate member 30 inserted into the door member 13. It is possible to prevent the viewing field from being reduced.

In addition, when the separation space between the second through hole (31b) and the inspection window occurs, it is possible to seal the separation space through a sealing member (not shown) to be described later.

In addition, although not particularly shown in the drawings, in order to ensure the accuracy of the sensor even when the sensor is provided to measure the pressure and temperature in the chamber body, it is separate from the position corresponding to the position where the sensor is disposed A through hole may be additionally provided, and may be provided to have an area larger or smaller than that of the area in which the sensor is provided, so that the separation space may be sealed through a sealing member to be described later when the separation space is generated. It is provided.

Next, as shown in FIGS. 3 and 4, inside the chamber body 10, a first thin plate member 30 mounted on the inner circumferential surface of the chamber body 10 by the guide unit 20 is provided. At the same time, the second thin plate member 40 may be provided on the ceiling surface and the bottom surface of the chamber body 10.

In particular, in the case of coupling the second thin plate member 40 in the chamber body 10, in order to minimize the interference with the guide portion 20, while proceeding to the coupling through a separate coupling member (50) The coupling member may be disposed at a position spaced apart from the guide portion 20 by a predetermined distance so that the coupling member may be coupled to each other.

In addition, as described above, by allowing a predetermined distance from the ceiling surface and the bottom surface of the chamber body 10, a space for inserting the second thin plate member to be described later can be secured, The second thin plate member 40 may be more firmly maintained in engagement with the chamber body 10.

In addition, the second thin plate member 40 may be coupled to the inner ceiling surface of the door member 13 described above.

In addition, as the material of the first thin plate member 30 and the second thin plate member 40, the first thin plate member 30 and the second thin plate member 40 may be selected from stainless steel, aluminum, zinc, tin, and iron. It may be made of a metal material containing any one or more metals, or may be made of a polymer material including any one or more polymers selected from PVC, PP, PE, acrylic, ABS, and PMMA.

When the plurality of first thin plate members 30 are inserted into the left and right sides of the chamber body 10 and disposed in the chamber body 10, between the first thin plate members 30 disposed at opposite positions. The sealing member 70 is provided to prevent the monomer including the paraline from penetrating into the space generated at the same time.

In particular, the sealing member 70 is provided between the pair of first thin plate members 30 disposed at positions facing each other, thereby sealing the separation space.

In addition, as the material constituting the sealing member 70, the first and second thin plate members 30 and 40 while including the same material as the first thin plate member 30 and the second thin plate member 40. It is of course possible that an adhesive can be applied to the attachment surface in order to prevent peeling from.

In addition, as shown in FIG. 4, the sealing member 70 may include a first zone in which the first thin plate member 30 is coupled with the guide portion 20, the second thin plate member 40, and the Coupling members 50 may each be applied to a second zone, which is a zone to which they are coupled.

In addition, the first and second thin plate members 30 and 40, the guide part 20, and the coupling member may be coated to cover the entire range in which the guide part 20 and the coupling member 50 are disposed. It is possible to prevent the monomer from penetrating into the fine separation space that may occur during the coupling between 50).

Next, as shown in FIG. 5, the film member 60 may be attached to one side of the first thin plate member 30 that is made of a flexible material so as to be deformable.

More specifically, the film member 60 is attached to one side of the first thin plate member 30 is exposed from the monomer containing the paraline in the chamber body, the first thin plate member 30 It is prepared for high reusability.

In addition, the film member 60 may be detachably attached to the surface exposed from the monomer of the second thin plate member 40 as well as the first thin plate member.

In addition, the film member 60 may include one or more pressure-sensitive adhesives selected from a hot melt pressure sensitive adhesive, a rubber pressure sensitive adhesive, an acrylic pressure sensitive adhesive, an acrylic pressure sensitive adhesive, and a silicone pressure sensitive adhesive. The workability to the second thin plate member can also provide an effect that can be further improved.

In addition, as another embodiment of the present invention, as shown in Figure 6 and 7, inducing the deformation of the sealing material is the sealing material is the first and second thin plate members 30, 40, the guide portion 20 And a heating member 80 including a heating wire or a heating medium conveying pipe so as to be easily peeled from the coupling member 50.

In particular, the heating member 80 may be provided along an exposed surface of the guide portion 20 and a virtual extension line formed by the plurality of coupling members 50, and may include a plurality of first and second thin plate members ( 30, 40) may be formed in the contact area.

In addition, as shown in FIG. 7, in the formation of the sealing member 70, the sealing member 70 is provided to cover the entire surface of the heating member 80.

In addition, the material of the sealing member 70 provided to surround the heating member 80 may maintain the adhesiveness only when the internal temperature of the chamber body is a temperature range of 15 ℃ to 40 ℃, different kinds of By including a plurality of different acrylic polymers containing a monomer, the peeling force in the said temperature range and the peeling force in the case outside the said temperature range are provided so that it may differ.

Through the sealing member 70 made of the material as described above, during the vapor deposition process through the chamber of the present invention mainly proceeds at room temperature, the sealing member 70 is firmly in the chamber body 10. Maintaining the attached state, when the cleaning process for the chamber body after the completion of the vapor deposition process, by heating the sealing member 70 through the heating member 80, by lowering the peeling force, The removal of the sealing member 70 can be easily performed.

As described above, the present invention includes a thin plate member made of a flexible material, and has an effect of further improving the ease of cleaning of the chamber body during the deposition process in which paraline is introduced, regardless of the shape of the chamber. At the same time, the main technical idea is to provide a chamber for chemical vapor deposition having the effect of reducing the time required for cleaning the chamber body to greatly improve the efficiency of the overall process.

In the following description of the present invention and obvious to those skilled in the art, descriptions may be omitted, and the description of the omitted elements and functions may be sufficiently referred to without departing from the technical spirit of the present invention. .

The description of the configuration and functions of the above-described parts have been described separately from each other for convenience of description, and any configuration and function may be incorporated into other components or be folded or further subdivided as necessary.

As described above with reference to embodiments of the present invention, the present invention is not limited thereto, and various modifications and applications are possible.

That is, those skilled in the art will readily appreciate that many modifications are possible without departing from the spirit of the invention.

In addition, when it is determined that the detailed description of the known function and its configuration or the coupling relationship for each configuration of the present invention may unnecessarily obscure the subject matter of the present invention, it should be noted that the detailed description is omitted. something to do.

10: chamber body
11: supply pipe
12: discharge pipe
13: door member
14: inspection window
20: guide part
30: first thin plate member
31a: first through hole
31b: second through hole
40: second thin plate member
50: coupling member
60 film member
70: sealing material
80: heating member

Claims (6)

Chamber body;
A guide part provided on the inner wall of the chamber body;
A first thin plate member provided to be inserted into the chamber body along the guide part and made of a flexible material;
A second thin plate member coupled to the inner ceiling surface and the inner bottom surface of the chamber body, the second thin plate member being provided in plurality;
A coupling member coupling the second thin plate member and the chamber body to each other; And
While being applied to the first zone where the first thin plate member and the guide portion are coupled and the second zone where the second thin plate member and the coupling member are coupled, between the plurality of first thin plate members, and the plurality of second thin plates. And a sealing material applied between the members. delete The method of claim 1,
The chemical vapor deposition chamber,
And a film member which is provided to be detachably attached to the outermost exposed surface of the first thin plate member and the second thin plate member, and is made of at least one adhesive selected from hot melt, rubber, acrylic, and silicone. A chemical vapor deposition chamber. delete The method of claim 1,
The chemical vapor deposition chamber,
And a heating member disposed in an area to which the sealing material is applied, the heating member being wrapped by the sealing material. The method of claim 5,
The sealing material,
The chamber for chemical vapor deposition, characterized in that the adhesion is maintained only when the internal temperature of the chamber body is in the temperature range of 15 ℃ to 40 ℃.

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