KR102045448B1

KR102045448B1 - Liquid crystal display, LCD

Info

Publication number: KR102045448B1
Application number: KR1020130022632A
Authority: KR
Inventors: 심완건; 이경한
Original assignee: 엘지디스플레이 주식회사
Priority date: 2013-03-04
Filing date: 2013-03-04
Publication date: 2019-11-18
Also published as: KR20140109555A

Abstract

According to an embodiment of the present invention by combining the liquid crystal panel and the backlight unit by using an adhesive member having a concave-convex shape on the top, to prevent wrinkles of the optical sheet due to heat generated from the light source of the backlight unit, to prevent deformation of the optical sheet The present invention provides a liquid crystal display device having improved image quality by preventing warpage of a thin film transistor substrate in a liquid crystal panel.

Description

Liquid Crystal Display (LCD)

The present invention relates to a liquid crystal display device.

Liquid crystal displays take up a large portion of both the small and large display market. When a power is supplied to a liquid crystal panel in which liquid crystal is injected between two thin glass substrates, a liquid crystal display generates a contrast due to a change in the arrangement of liquid crystal molecules. It is a device to display.

According to the driving method of the liquid crystal, one of the core materials of the liquid crystal display device, it is divided into three types of TN, IPS, and VA. In the case of the first commercialized twisted nematic (TN), a rice-shaped liquid crystal device is twisted in the liquid crystal panel, and when the liquid crystal is in a horizontal state, power is supplied to the vertical state. The TN method has the simplest structure and a good response speed, but has a disadvantage in that the viewing angle is limited. In-Plane Switching (IPS) and Vertical Alignment (VA) methods were developed to improve this. In the IPS method, the liquid crystals are arranged horizontally, whereas in the VA method, molecules of the liquid crystal are vertically arranged. In the case of the IPS method, the liquid crystal molecules in the horizontal direction are rotated sideways using a magnetic field. Since the IPS method has excellent transmittance uniformity and a wide viewing angle can be obtained without using an optical film, it can be widely used in professional and advanced liquid crystal display devices of 18 inches or more. However, compared with other methods, the light leakage phenomenon is large and the contrast ratio is low. In the VA method, when the power is not turned on, the liquid crystal molecules are vertical, and when the power is turned on, the liquid crystal molecules are driven horizontally, and the contrast ratio is good. However, there is a disadvantage in that the response speed is lower than other methods.

On the other hand, unlike the organic light-emitting display device and the like, since the liquid crystal display itself is non-emission type, it is necessary to use a backlight unit that is a back light source. The backlight unit serves to provide uniform light over the entire area of the liquid crystal panel. In addition, the backlight unit is divided into an edge type and a direct type according to the position of the light source unit. The edge type is a structure in which a light source is disposed on the side of the light guide plate, and is mainly applied to a relatively small liquid crystal display device such as a laptop type and a notebook computer. Such an edge type backlight unit has good light uniformity, a long service life, and is advantageous for thinning a liquid crystal display device. The edge type backlight unit includes a light source for generating light, a light source cover surrounding the light source, and an optical sheet for improving light characteristics. In a liquid crystal display using an edge type backlight unit, a lot of heat is generated from a light source. In particular, when the lamp is used as the light source, the heat generated in the electrode portion of the lamp is very high. Due to this high heat, the optical sheet or the like may be damaged, resulting in a problem of uneven brightness of the liquid crystal display. When the optical sheet is deformed by heat, the substrate in the liquid crystal panel combined with the optical sheet is also bent, which causes light leakage. In particular, in the case of an IPS type liquid crystal panel which is vulnerable to light leakage, it is more necessary to minimize the deformation of the optical sheet due to heat and to minimize the bending of the substrate in the liquid crystal panel when the optical sheet is deformed.

According to an exemplary embodiment of the present invention, an optical sheet is deformed by heat generated from a light source of a backlight unit, thereby providing a liquid crystal display device which prevents wrinkles on the optical sheet.

According to an exemplary embodiment of the present invention, a liquid crystal display device which prevents light leakage by preventing warpage of a substrate inside a liquid crystal panel due to deformation of an optical sheet is provided.

According to an embodiment of the present invention, a liquid crystal display device includes: a liquid crystal display panel in which a plurality of driving drive chips are mounted in a chip on glass method; A backlight unit disposed below the liquid crystal display panel; And an attachment member for coupling the liquid crystal display panel and the backlight unit, wherein the attachment member has a plurality of protrusions formed on a body and an upper surface of the body, and an upper surface of the protrusion is attached to a rear surface of the liquid crystal display panel. The rear surface of the body is attached to the backlight unit.

In the liquid crystal display according to the exemplary embodiment of the present disclosure, the protrusion is formed to extend in an upper direction from an upper surface of the body.

In an exemplary embodiment of the present invention, the liquid crystal display panel may include a thin film transistor substrate and a color filter substrate facing the thin film transistor substrate, and the driving drive chip may have a region on one side of an upper surface of the thin film transistor substrate. And a protrusion corresponding to the driving drive chip.

In the liquid crystal display according to the exemplary embodiment, the thin film transistor substrate includes a display area and a non-display area adjacent to the display area, the color filter substrate corresponds to the display area, and the driving drive chip is the It is disposed in the non-display area.

In the liquid crystal display according to the exemplary embodiment of the present invention, each of the driving drive chips is spaced apart from each other, and each of the protrusions corresponds to each of the driving drive chips.

In the liquid crystal display according to the exemplary embodiment, an area of an upper surface of each of the protrusions is smaller than that of each of the driving drive chips.

In an embodiment, the backlight unit may include an optical sheet, a light guide plate disposed below the optical sheet, and a light source disposed on a side of the light guide plate to provide light to the light guide plate. The back side is attached to the optical sheet.

In the liquid crystal display according to the exemplary embodiment, an incident surface of the light guide plate through which light is incident from the light source corresponds to the non-display area.

In the liquid crystal display according to the exemplary embodiment of the present invention, a rear surface of the body forms a flat surface, and a front surface of the rear surface of the body is attached to the optical sheet.

In the liquid crystal display according to the exemplary embodiment, the body is spaced apart from the thin film transistor substrate.

In the liquid crystal display according to the exemplary embodiment of the present invention, the protrusion has a material that is stronger than the body.

The liquid crystal display according to the exemplary embodiment of the present invention has an adhesive property only on an upper surface of the protrusion and a rear surface of the body.

According to an embodiment of the present invention by combining the liquid crystal panel and the backlight unit by using an adhesive member having a concave-convex shape on the top, the optical sheet is deformed by the heat generated from the light source of the backlight unit to prevent wrinkles, and the optical sheet The present invention provides a liquid crystal display device having improved image quality by preventing warpage of the thin film transistor substrate in the liquid crystal panel according to the modification of the light emitting phenomenon.

1 is an exploded perspective view showing a liquid crystal display module according to an embodiment of the present invention.
2 is a perspective view illustrating a part of an LCD panel and an attachment member;
3 is a plan view showing a part of the liquid crystal display panel and the attachment member;
4 is a front view showing the thin film transistor substrate and the attachment member.
5 is a front view showing a thin film transistor substrate, an attachment member, and an optical sheet;
6 is a front view of the attachment member.
7 is a front view showing a thin film transistor substrate, an attachment member, and an optical sheet;
8 is a view showing a part of a front view of a thin film transistor substrate and an attachment member.
9 and 10 are photographs experimenting with the light leakage phenomenon according to the position where the protrusion is disposed.

Hereinafter, a liquid crystal display according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is an exploded perspective view illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

As shown in FIG. 1, the liquid crystal display device 300 according to an exemplary embodiment of the present invention is provided with a liquid crystal display panel 200 on which an image is displayed, and is disposed under the liquid crystal display panel 200 to provide light. It may include a backlight unit 120.

The liquid crystal display panel 200 includes a color filter substrate 10 and a thin film transistor substrate 20 bonded together to maintain a uniform cell gap facing each other, and a liquid crystal layer interposed between the two substrates 10 and 20. Not shown).

Although not illustrated in detail, the color filter substrate 10 and the thin film transistor substrate 20 will be described in detail. In the thin film transistor substrate 10, a plurality of gate lines and data lines cross each other to define pixels. A thin flim transistor (TFT) is provided at each of the crossing regions of the pixels, and may be connected in a one-to-one correspondence with the pixel electrode mounted in each pixel.

The color filter substrate 10 is a color filter of red, green, and blue colors corresponding to each pixel. The color filter substrate 10 distinguishes each of these colors and covers a gate line, a data line, and a thin film transistor. It may include a matrix and a common electrode covering all of them.

A driving PCB (not shown) for supplying a driving signal to the gate line and the data line may be provided at the edge of the liquid crystal display panel 200.

The driving PCB may be electrically connected to the liquid crystal display panel 200 by a COG chip 30 mounted on one side of the thin film transistor substrate 20.

The backlight unit 120 disposed below the liquid crystal display panel 200 may include a rectangular box shape bottom cover 110 having an upper surface opened, and a heat dissipation plate provided on an inner surface of one side of the bottom cover 110. 100 and a plurality of light emitting diodes 90 as light sources on the inner surface of the heat dissipation plate 100.

The backlight unit 120 may be disposed in parallel with the light emitting diode 90 to convert point light into surface light, and to be disposed below the light guide plate 70 to travel down the light guide plate 70. A reflective sheet 80 reflecting toward the liquid crystal display panel 200, and an optical sheet 60 disposed on the light guide plate 70 to diffuse and collect light emitted from the light guide plate 70. Can be.

Although not shown in the drawing, the backlight unit 120 accommodates the heat dissipation plate 100, the light emitting diode 90, the light guide plate 70, the optical sheets 60, and the reflective sheet 80, and the bottom cover ( It may further include a support main (not shown) made of a mold having a rectangular frame shape coupled to the 110.

The optical sheet 60 may include a diffusion sheet for diffusing light, a light collecting sheet for collecting the diffused light, and a protective sheet for protecting the light collecting pattern formed on the light collecting sheet.

The heat dissipation plate 100 may include a wiring pattern through which a driving signal for driving the light emitting diode 90 is input, and a pad portion on which the light emitting diode 90 is mounted. That is, the heat dissipation plate 100 may have a function of aligning the light emitting diodes 90. In addition, the heat dissipation plate 100 may have a heat dissipation function of conducting heat generated from the light emitting diodes 90 to the bottom cover 110.

It is not limited to the heat dissipation plate 100 and the light emitting diode 90 as a configuration included in the backlight unit 120, the light emitting diode 90 may be a fluorescent lamp, disposed in a form surrounding the fluorescent lamp And a reflector or a lamp housing reflecting light generated from the fluorescent lamp to the light guide plate 70.

2 is a perspective view illustrating a part of the liquid crystal display panel 200 and the attachment member 40.

Referring to FIG. 2, the liquid crystal display panel 200 includes a color filter substrate 10 and a thin film transistor substrate 20, and faces the thin film transistor substrate 20 on the thin film transistor substrate 20. The color filter substrate 10 may be disposed, and an upper surface of one side of the thin film transistor substrate 20 may be exposed to the outside. One or more COG chips 30 may be mounted on one side upper surface of the exposed thin film transistor substrate 20. That is, when the thin film transistor substrate 20 is divided into a display area 130 and a non-display area 140 adjacent to the display area 130, the color filter substrate 10 may correspond to the display area 130. The COG chip 30 may be mounted in the non-display area 140. The driving driver IC chip is directly mounted on the top surface of the thin film transistor substrate 20 as chip on glass (COG), and the liquid crystal display panel is called a liquid crystal display panel in which the driving drive is mounted in a chip on glass method. . The COG chip 30 may be a gate driving driver or a data driving driver, and may be a chip including both the gate driving driver and the data driving driver, but is not limited thereto. Any chip needed to drive it may be possible.

According to FIG. 2, one or more COG chips 30 are arranged in a line spaced apart on the thin film transistor substrate 20, but the present invention is not limited thereto and may vary depending on the type and size of the COG chips 30 and the size of the LCD panel. It may be arranged.

The attachment member 40 may include one or more protrusions 50 in some regions. The protrusion 50 may extend in an upward direction from a portion of the upper surface of the attachment member 40 and may be formed in a region corresponding to the COG chip 30 mounted on the thin film transistor substrate 20. . In other words, when a plurality of protrusions 50 are formed, each of the protrusions 50 may be formed at a position corresponding to each of the COG chips 30.

Although not shown in the drawing, the attachment member 40 may attach and fix the backlight unit 120 disposed below the liquid crystal display panel 200 to each other. The protrusion 50 protruding from a portion of the attachment member 40 may be attached to a corresponding region of the thin film transistor substrate 20 corresponding to the COG chip 30 mounted on the thin film transistor substrate 20.

3 is a plan view illustrating a part of the liquid crystal display panel 200 and the attachment member 40.

Referring to FIG. 3, the liquid crystal display panel 200 may include a color filter substrate 10 and a thin film transistor substrate 20, and the exposed thin film transistor substrate 20 that does not correspond to the color filter substrate 10. The width L1 of one region of) may be greater than or equal to the width L2 of the adhesive member 40. The width L3 of the COG chip 30 mounted on the thin film transistor substrate 20 may be greater than or equal to the width L4 of the protrusion 50 protruding from a portion of the adhesive member 40.

4 is a front view showing the thin film transistor substrate 20 and the attachment member 40.

Referring to FIG. 4, the width W1 of the thin film transistor substrate 20 is greater than or equal to the width W2 of the adhesive member, and the width W3 of the COG chip 30 mounted on the thin film transistor substrate 20. ) May be greater than or equal to the width W4 of the protrusion 50 protruding from the attachment member 40. 3 and 4, when the attachment member 40 is attached to the lower surface of the thin film transistor substrate 20, the protrusion 50 of the attachment member 40 is formed on the thin film transistor substrate 20. The COG chip 30 may be attached to a corresponding region of the corresponding thin film transistor substrate 20.

5 is a front view illustrating the thin film transistor substrate 20, the attachment member 40, and the optical sheet 60.

Referring to FIG. 5, an attaching member 40 may be attached to a lower surface of the thin film transistor substrate 20, and an optical sheet 60 of the backlight unit may be attached to a lower surface of the attaching member 40. That is, the thin film transistor substrate 20 and the optical sheet 60 may be fixed to each other by the attachment member 40. The protrusion 50 of the attachment member 40 may correspond to a region corresponding to the mounted COG chip 30 in one region of the thin film transistor substrate 20. As shown in FIG. 4, since the width of the protrusion 50 is smaller than the width of the COG chip 30, the protrusion 50 may correspond to the area of the COG chip 30. In other words, an area of the upper surface of the protrusion 50 may be smaller than that of the COG chip 30.

6 is a front view of the attachment member 40.

5 and 6, the non-projection area 41 except for the protrusion 50 of the upper area of the attachment member 40 may not have adhesive properties. Since the non-projection area 41 is not a portion in contact with the thin film transistor substrate 20, it may not need to have an adhesive property. And the upper surface of the protrusion 50 may have an adhesive property. The protrusion 50 may be attached to an area of the thin film transistor substrate 20 corresponding to the COG chip 30 mounted on the thin film transistor substrate 20.

The lower surface, that is, the rear surface of the attachment member 40 may have adhesive properties. Therefore, the optical sheet 60 may be attached to the rear surface 42 of the attachment member 40.

A material having an adhesive property may be applied to the upper surface of the protrusion 50 and the rear surface 42 of the attachment member 40, but is not limited thereto.

Meanwhile, the shape of the protrusion 50 has a quadrangular shape, but is not limited thereto. The side surface 52 of the protrusion 50 may have an inclination at a predetermined angle, and the protrusion 50 may have an elliptical shape. Circular and triangular shapes; In addition, the upper surface 51 of the protrusion 50 may have a concave portion and a convex form, that is, in this case, in this case, the upper surface of the convex portion has an adhesive property, the convex portion may be attached to the thin film transistor substrate 20. . In addition, the protrusions 50 may be decomposed into several pieces so that the plurality of pieces are spaced apart and formed on the upper surface of the attachment member 40. In this case, the disassembled pieces may be limited to a region corresponding to the COG chip 30, and may be formed on the upper surface of the attachment member 40. ) May be attached.

1, 5 and 6, the protrusion 50 of the attachment member 40 of the thin film transistor substrate 20 corresponding to the COG chip 30 mounted on the thin film transistor substrate 20 is described. Attached to the area, the back surface of the attachment member 40 is attached to the optical sheet 60 to prevent the problem of light leakage of the panel or wrinkles in the optical sheet 60.

The same problem occurs when the light source 90 is disposed around one side of the thin film transistor substrate 20 on which the COG chip 30 is disposed, that is, the area of the thin film transistor substrate 20 is displayed in the display area 130. And the non-display area 140, when the color filter substrate 10 corresponds to the display area 130, and the COG chip 30 is mounted on the non-display area 140, the attachment member 40 is formed. The back surface of the region corresponding to the non-display area 140 and corresponding to the non-display area 140 of the thin film transistor substrate 20 and the backlight unit 120 disposed on the rear surface of the thin film transistor substrate 20 are attached to each other. In addition, an incident surface of the light guide plate 70 included in the backlight unit 120 corresponds to the non-display area 140. Therefore, the light source 90 may be disposed around the COG chip 30. In this case, the optical sheet 60 may be deformed by the heat generated from the light source 90, so that the thin film transistor substrate 20 attached to the optical sheet 60 deforms the optical sheet 60. As a result, the bending problem may occur.

When the protrusions 50 are formed on the upper surface of the attachment member 40, a plurality of protrusions are formed on the rear surface of the attachment member 40 and the protrusions are attached to the optical sheet 60. When a space is formed between the optical sheet 60 and the optical sheet 60 is deformed by heat, wrinkles may occur in an area of the optical sheet 60 corresponding to the space between the protrusions. Therefore, the entire back surface of the attachment member 40 may be attached to the optical sheet 60, thereby minimizing a phenomenon in which the optical sheet 60 is deformed due to heat. In addition, the entire back surface of the attachment member 40 is attached to the optical sheet 60 and the entire upper surface of the attachment member 40 in a planar state in which the protrusion 50 is not formed on the attachment surface of the attachment member 40. Referring to the case in which the thin film transistor substrate 20 is attached to the thin film transistor substrate 20, when the optical sheet 60 is bent by heat, the attachment member 40 is bent together and the thin film transistor substrate attached to the attachment member 40 ( 20) can also be bent together.

As such, when the thin film transistor substrate 20 is bent, a light leakage problem may occur. In particular, in the IPS type liquid crystal display device having a transverse electric field type which is vulnerable to the light leakage problem, the light leakage problem is further worsened. May affect However, according to the exemplary embodiment of the present invention, the protrusion 50 protruding from the upper surface of the attachment member 40 may be attached to the region of the thin film transistor substrate 20 corresponding to the COG chip 30.

The COG chip 30 has a higher rigidity than the thin film transistor substrate 20. The thin film transistor substrate 20 may be a glass material, but since the thickness is very thin, such as 0.25mm to 0.3mm, it may be considered that the thin film transistor substrate 20 has a low rigidity compared to the COG chip 30 made of a plastic material. Therefore, when the protrusion 50 is deformed by attaching the protrusion 50 to the region of the thin film transistor substrate 20 corresponding to the relatively rigid COG chip 30, the thin film transistor substrate 20 is The problem of easy bending can be prevented.

According to an exemplary embodiment of the present invention, a problem of light leakage and a problem in which an optical sheet is wrinkled by heat may cause poor image quality.

Meanwhile, when the COG chip 30 is mounted on the thin film transistor substrate 20, an adhesive material is deposited on the thin film transistor substrate 20, the adhesive material is melted with heat, and then the COG chip 30 is mounted on the thin film transistor. It may be attached on the substrate 20, but is not limited thereto.

7 is a front view illustrating the thin film transistor substrate 20, the attachment member 40, and the optical sheet 60.

Referring to FIG. 7, a hole may be formed in a portion of one region of the thin film transistor substrate 20 to insert the COG chip 30. According to FIG. 7, the COG chip 30 is coplanar with the thin film transistor substrate 20, but is not limited thereto. The thickness of the COG chip 30 is thicker than that of the thin film transistor substrate 20. A portion of the COG chip 30 may protrude upward or downward from the thin film transistor substrate 20.

On the other hand, since the protrusion 50 of the attachment member 40 is attached to the COG chip 30, when the optical sheet 60 is deformed by heat, the attachment member 40 may also be deformed, but the protrusion ( Since the 50 is attached to the COG chip 30 having a relatively high rigidity, even when the attachment member 40 is deformed, the COG chip 30 does not bend well. As a result, the thin film transistor substrate 20 This can prevent the bending and thus prevent light leakage. In addition, since the entire back surface of the attachment member 40 is attached to the optical sheet 60, the optical sheet 60 is wrinkled by heat. You can prevent it.

8 is a view showing a part of the front view of the thin film transistor substrate 20 and the attachment member 40.

Referring to FIG. 8, the protrusion 50 of the attachment member 40 may be attached to the region of the thin film transistor substrate 20 corresponding to the COG chip 30 mounted on the thin film transistor substrate 20. In this case, the attachment member 40 and the thin film transistor substrate 20 may be spaced apart by a predetermined distance d. The attachment member 40 and the thin film transistor substrate 20 are spaced apart by a predetermined distance d so that the protrusion is minimized when the attachment member 40 is deformed and its influence is transmitted to the thin film transistor. A thin film transistor substrate 20 may be attached to the thin film transistor substrate 20 to support the thin film transistor substrate 20. The body 43 of the attachment member 40 and the protrusion 50 protruding from the upper surface of the attachment member 40 may be made of the same material, and the protrusion 50 may be formed on the body 43 of the attachment member 40. It can be formed of a material with stronger rigidity than). Thus, when the attachment member 40 and the thin film transistor substrate 20 are compressed, the attachment member 40 and the thin film transistor substrate 20 may be spaced apart by a predetermined distance d. When the bar-shaped body 43 of the attachment member 40 and the protrusion 50 are formed of different materials, the protrusion portion 50 and the portion of the body 43 of the attachment member 40 are bonded to each other. A material may be used to adhere to each other, but is not limited thereto.

9 and 10 are photographs experimenting with the light leakage phenomenon according to the position where the protrusion is disposed.

9 and 10, a plurality of protrusions 50 spaced apart from the upper surface of the adhesive member 40 is formed to have the adhesive member 40 according to the exemplary embodiment of the present invention. . As such, when the backlight unit and the liquid crystal display panel are attached using the adhesive member 40 having the uneven shape, light leakage and optical sheet wrinkles may be prevented. In this case, in order to maximize the effect, the protrusion 50 is preferably attached to the region of the thin film transistor substrate 20 corresponding to the COG chip 30. 9 and 10, the light leakage of the liquid crystal display is compared with the case where the protrusion 50 is limited to and attached to the region of the thin film transistor substrate 20 corresponding to the COG chip 30. Examine the phenomenon.

9 and 10, a dotted square portion corresponds to a portion where the COG chip 30 is mounted, that is, a light incident portion (light source arrangement region).

Referring to FIG. 9, the width w1 of the COG chip 30 mounted on the thin film transistor substrate 20 is smaller than the width w2 of the protrusion 50 formed on the attachment member 40. In this case, the protrusion 50 is attached to not only the region of the thin film transistor substrate 20 corresponding to the COG chip 30 but also the region of the thin film transistor substrate 20 not corresponding to the COG chip 30. In this case, when the screen of the LCD is observed, light leakage may be observed in the dotted rectangular portion.

Referring to FIG. 10, the width w1 of the COG chip 30 mounted on the thin film transistor substrate 20 is greater than the width w2 of the protrusion 50 formed on the attachment member 40. In this case, the protrusion 50 is attached only to an area of the thin film transistor substrate 20 corresponding to the COG chip 30. In this case, when the screen of the liquid crystal display is observed, light leakage is prevented in the dotted rectangular portion, so that the image quality may be improved.

In the detailed description of the present invention described above with reference to the preferred embodiment of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge of the present invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the spirit and scope of the art. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

10. Color filter substrate
20. Thin Film Transistor Board
30.COG chip (drive drive chip)
40. Adhesive member
41. Top surface of adhesive member
42. Back side of adhesive member
43. Body of adhesive member
50. Protrusion
51. Top of protrusion
52. Lateral side of the protrusion
60. Optical sheet
70. Light guide plate
80. Reflective Sheet
90. Light source (light emitting diode)
100. Heat dissipation plate
110. Bottom cover
120. Backlight Unit
130. Display area
140. Non-display Area
200. LCD panel
300. LCD

Claims

A liquid crystal display panel including a thin film transistor substrate and a color filter substrate facing the thin film transistor substrate;
A plurality of driving drive chips disposed in one region of an upper surface of the thin film transistor substrate;
A backlight unit disposed below the liquid crystal display panel; And
An attachment member coupling the liquid crystal display panel and the backlight unit;
The attachment member,
A plurality of protrusions are formed on the body and the upper surface of the body,
The protrusion corresponds to the driving drive chip,
The upper surface of the protrusion is attached to the rear surface of the liquid crystal display panel,
And a rear surface of the body is attached to the backlight unit.

The method of claim 1,
And a protrusion part extending upward from an upper surface of the body.

delete

The method of claim 1,
The thin film transistor substrate includes a display area and a non-display area adjacent to the display area.
The color filter substrate corresponds to the display area,
And the driving drive chip is disposed in the non-display area.

The method of claim 4, wherein
Each of the drive drive chips is spaced apart from each other,
Each of the protrusions corresponds to each of the driving drive chips.

The method of claim 5,
And an area of an upper surface of each of the protrusions is smaller than an area of each of the driving drive chips.

The method of claim 4, wherein
The backlight unit includes an optical sheet, a light guide plate disposed below the optical sheet, and a light source disposed on a side surface of the light guide plate to provide light to the light guide plate,
And a rear surface of the body is attached to the optical sheet.

The method of claim 7, wherein
And an incident surface of the light guide plate through which light is incident from the light source corresponds to the non-display area.

The method of claim 7, wherein
And a rear surface of the body forming a plane, and a front surface of the rear surface of the body is attached to the optical sheet.

The method of claim 1,
The body is a liquid crystal display device spaced apart from the thin film transistor substrate.

The method of claim 1,
The protrusion is a liquid crystal display device of a rigid material than the body.

The method of claim 1,
And an adhesive property only on an upper surface of the protrusion and a rear surface of the body.

The method of claim 1,
And the driving drive chip is inserted into a hole formed in one region of the thin film transistor substrate.