KR102033827B1 - A method for manufacturing a release film for chip component process and a release film thereof - Google Patents

Abstract

This invention relates to the manufacturing method of the release film for chip component manufacturing processes, and its manufactured release film, The manufacturing method includes the following steps. (1) Base film preparation step, in which 1000-1600ppm added particles are added to a base material to obtain a 20-75μm thick base film, wherein the added particles are silicon dioxide, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, aluminum oxide And one or two or more of titanium oxide, and the particle size of the added particles is 500-1500 nm. (2) preparing a release agent. (3) Preparing a release film: The release film is coated on a base film to obtain a release film. The produced release film has a surface roughness Ra ≦ 0.25 μm, a release agent coating layer thickness of 60-300 nm, a release force of 2-40 g / inch, a residual adhesive force of the release film of 90% or more, and an optimization of 96%.

Description

A manufacturing method of a release film for a chip component manufacturing process, and the release film manufactured thereon {A METHOD FOR MANUFACTURING A RELEASE FILM FOR CHIP COMPONENT PROCESS AND A RELEASE FILM THEREOF}

TECHNICAL FIELD This invention relates to manufacture of a release film. Specifically, It is related with the manufacturing method of the release film for chip component manufacturing processes, and its manufactured release film.

A general method for producing a release film is to coat a release agent (vinyl organosilicon oleoresin) on the surface of a PET base film and obtain it through crosslinking curing under the action of a complex catalyst such as platinum or tin.

The release film excellent in antistatic performance and the release film obtained by the manufacturing method of the kind disclosed in patent CN102582174A have good release characteristics, such as a release force and residual adhesive force, and have the outstanding antistatic performance, and provide a protective adhesive (adhesive) layer It can be used for the general industrial adhesive tape (or adhesive tape) etc. made into the objective, and can also be used effectively for the product of IT field, etc. For example, it can be effectively used in IT field products such as mobile phones, LCDs, semiconductors and displays.

However, these release films have poor surface flatness, large surface roughness, large base film thermal deformation, and large contact angles of the release agent coating layer. Adhesion between the release agent coating layer and the base film is poor, high capacity and high stability, light and thin, small, single-layer ceramic thickness ≤ 3 microns can not satisfy the production of parts.

The problem to be solved by the present invention is to provide a release film manufacturing method for a chip component manufacturing process that can solve the disadvantages existing in the existing release film.

Another problem to be solved by the present invention is to satisfy the chip component manufacturing process, the surface is flat, the surface roughness is low, the thickness of the release agent coating layer is uniform, the release force is stable, the monolayer ceramic thickness is 3 microns or less. It is to provide a release film manufactured by the release film manufacturing method for the chip component manufacturing process.

The manufacturing method of the release film for chip component manufacturing processes by this invention for solving the said subject includes (1) base film preparation step, (2) mold release agent preparation step, and (3) release film preparation step. In the step (1) preparing the base film, 1000-1600 ppm added particles are added to the base material to obtain a base film having a thickness of 20-75 μm, and the added particles include silicon dioxide, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, and aluminum oxide. And one or two or more of titanium oxide, and the particle size of the added particles is 500-1500 nm. The raw materials for the release agent include vinyl-terminated organic silicone resins, butanol, silane coupling agents, platinum compounds, and solvents. (3) Release Film Preparation A release film is obtained by coating the release agent on the base film.

When producing a release film using a conventional release base film, the produced release film has a high surface roughness, poor uniformity of the release agent coating layer thickness, poor release force stability, high capacity and high stability, light, thin, small, It has been found that single-layer ceramic thicknesses cannot satisfy chip component fabrication of less than 3 microns. Through analysis of each component and its process for the release film, the type of particles added, particle size of particles, and the amount of particles added significantly influence the roughness of the surface of the base film during the production of the base film. It has been found that the thickness uniformity of the coating layer, the stability of the release force and the adhesion between the release agent and the base film continue to be affected.

In the present invention, it is possible to effectively control the roughness of the surface of the release film through controlling the addition amount of the added particles by selecting and adding suitable particle types and particles of the particle size portion. The release agent formulation used in this solution is distinctly superior to existing release films in terms of adhesion between the base films of the present method, coating layer thickness uniformity and release force stability, and the release film produced in this method has high capacity, high stability, light weight, thinness and small size. It is possible to satisfy the manufacture of chip components having a single-layer ceramic thickness of ≤ 3 microns.

As an optimization, the raw material for the release agent is 2-15% vinyl-terminated organosilicon resin, 0.01-0.8% butanol, 0.05-0.5% silane coupling agent, 0.01-0.8% platinum compound, 83-97% solvent Contains the component percentage of. Component percentage in the present invention means weight percent and is the same below.

As the component of the release agent, the amount of each component added affects the final film release quality, but it is not known by the existing technology which component affects the performance of the release film. Found.

If the vinyl terminal organosilicon resin content is <2%, the coating liquid viscosity is so low that defects such as sagging and shrinkage tend to occur in the coating layer. If the content is> 15%, the coating liquid viscosity is too high, the leveling of the coating layer is bad, the thickness is not uniform, and defects such as rainbow patterns occur in the appearance.

If the content of butanol <0.01%, the coating layer is not completely cured, affecting the performance of the release film such as release force and residual adhesion, and if the content> 0.8%, the release force stability of the release film is poor and the expiration date is short.

If the content of the silane coupling agent is <0.05%, the produced release film residual adhesion is low, the shelf life is short, and if the content> 0.5%, it affects the release force stability and the manufacturing cost is high.

If the platinum compound <0.01%, the coating layer cannot be cured or is not completely cured, affecting the performance of the release film such as release force or residual adhesion, and if the content> 0.8%, the shelf life of the coating liquid is too short to allow continuous production. There is no manufacturing cost.

If the content of the solvent is <83%, the coating liquid is too high, the level of the coating layer during coating is bad, the thickness is not uniform, and the appearance of a rainbow pattern, such as appearance occurs. If the content is> 97%, the viscosity of the coating liquid is too low, so that poor phenomena such as sagging and shrinkage are likely to occur in the coating layer.

As an optimization, the raw material of the release agent is 2-7% vinyl-terminated organosilicon resin, 0.01-0.8% butanol, 0.05-0.5% silane coupling agent, 0.01-0.8% platinum compound, 91-97% solvent And component percentages.

As an optimization, in step (3), baking is carried out after the release agent is coated, the baking temperature is 60 ° C.-120 ° C., and the baking time is 10 seconds-90 seconds.

When baking was carried out after the release agent coating, it was found that baking temperature and time had a great influence on the release force stability of the final release film and the flatness of the film. In this method, baking temperature and baking time were used to prevent the problem of heat deformation and flatness of the base film.

The added particle diameter of the base material is 800-1200 nm, the added amount is 1000-1200ppm particles, the particles include 80-95% silicon dioxide, 1-10% barium carbonate and 1-10% titanium oxide.

As an optimization, the solvent is one or more of No. 120 solvent oil, butanone, D30 solvent oil, ethyl acetate, isopropyl alcohol.

As a specific optimization, the solvent is 20% -30% 120 solvent oil, 20-30% butanone, 6-15% D30 solvent oil, 20-30% ethyl acetate, 6-15% isopropyl alcohol to be.

The release film produced according to the above production method has a surface roughness Ra ≦ 0.25 μm, a release agent coating layer thickness of 60-300 nm, a release force of 2-40 g / inch, a residual adhesive force of the release film ≧ 90%, and an optimization of 96%.

According to the manufacturing method of the release film for chip component manufacturing processes which concerns on this invention, and the produced release film, there exist the following effects.

First, adding the appropriate particles of the appropriate particle size to the base film and controlling the amount of particle addition can prevent the problem of partially protruding the base film surface, improve the surface flatness of the film product, and reduce the surface roughness do. More fine volume is formed on the surface of the base film, the specific surface area of the PET base film is increased, so that the coating of the release agent is easy, the adhesion between the release agent coating layer and the PET base film is increased, and the problem of separation of the release agent coating layer is prevented. The residual adhesive force of a release film improves.

Second, the proportion of the vinyl terminated organic silicone resin and the thickness of the release agent coating layer in the special release agent formulation realize different release forces. The resulting release film product is uniform in appearance, smooth, transparent and free of rainbow patterns, its release agent coating layer thickness is 60-300 nm, release force is 2-40 g / inch, and the surface contact angle is low.

Third, by using a special release agent, it is possible to realize a low-temperature baking thermosetting 60-120 ℃, preventing the problem of poor thermal deformation and flatness of the PET base film due to the high temperature during baking.

Hereinafter, the present invention will be described in detail with reference to Examples.

Example 1.

The manufacturing method of the release film for chip component manufacturing processes includes the following.

Step 1: prepare PET base film

1600ppm of particles with a particle size of 500 ~ 800nm are put in the PET piece, and the particles may be selected from powder particles such as silicon dioxide, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, aluminum oxide, titanium oxide, etc. In this embodiment, after mixing uniformly using magnesium carbonate, a base film having a thickness of 75 μm is obtained through hot melting, screw mixing, extrusion casting, stretching (horizontal stretching and vertical stretching), slitting and winding.

Step 2: Prepare Release Agent

Release Agents Each component is mixed according to the following percentages. 15% of vinyl-terminated organic silicone resin, 0.8% butanol, 0.05% silane coupling agent, 0.15% platinum compound and 84% solvent are prepared by uniformly mixing. Among them, the solvent may be one or two or more of 120 solvent oil, butanone, D30 solvent oil, ethyl acetate, isopropyl alcohol, ethyl acetate is used in the present embodiment.

Step 3: release agent coating

One side of the PET base film of step 1 is coated with a release agent blended in step 2 by a doctor blade coating method. After coating, the release film obtained through baking temperature 80-120 ℃, baking time 10 seconds, the product appearance is uniform, smooth, transparent, no rainbow pattern, the release agent coating layer thickness is 200-300nm, the release film obtained Release force 2-15 g / inch, surface roughness Ra ≦ 0.2 μm, release film residual adhesive force ≧ 90%.

Example 2

The manufacturing method of the release film for a kind of chip component manufacturing process includes the following.

1.Put 1000ppm of particles with a particle size of 1000 ~ 1500nm into the PET piece, and the particles can be selected as a mixture of silicon dioxide, barium carbonate and titanium oxide.The percentage of the mixture is 80% silicon dioxide, 10% barium carbonate and 10 titanium oxide. After uniformly mixing the%, a release base film having a thickness of 50 μm is obtained by melting, screw mixing, extrusion casting, stretching (horizontal stretching and vertical stretching), slitting and winding.

2. Mix each release agent according to the percentage below. 8% of vinyl-terminated organic silicone resin, 0.5% butanol, 0.05% of silane coupling agent, 0.25% of platinum compound, and 91.2% of solvent are prepared by uniformly mixing. Among them, the solvent may be one or a variety of solvent solvent No. 120, butanone, D30 solvent oil, ethyl acetate, isopropyl alcohol, in the present embodiment, mixed solvent such as No. 120 solvent oil, butanone and the like volume use.

3. Coating the release agent mixed in step 2 by the gravure coating method on one side of the PET base film of step 1. After coating, the release film obtained after baking temperature 60-90 ℃, baking time 30 seconds, the product appearance is uniform, smooth, transparent, no rainbow pattern, release agent coating layer thickness is 100-250nm, the release agent obtained Force 5-20 g / inch, surface roughness Ra ≦ 0.15 μm, release film residual adhesive strength is 92% or more.

Example 3

The manufacturing method of the release film for a kind of chip component manufacturing process includes the following.

1. Put 1200ppm of particles of 800 ~ 1200nm particle size into the PET piece, and the particles can be selected as a mixture of silicon dioxide, barium carbonate and titanium oxide.The percentage of the mixture is 95% silicon dioxide, 1% barium carbonate and titanium oxide 4 After uniformly mixing the%, a release base film having a thickness of 25 μm is obtained by melting, screw mixing, extrusion casting, stretching (horizontal stretching and vertical stretching), slitting and winding.

2. Release agent Each component is mixed according to the following percentages. 2% of vinyl terminal organic silicone resin, 0.1% of butanol, 0.5% of silane coupling agent, 0.4% of platinum compound, and 97% of solvent are prepared by uniformly mixing. In this embodiment, a mixed solvent of 30% No. 120 solvent oil, 22% Butanone, 15% D30 solvent oil, 27% ethyl acetate and 6% isopropyl is used.

3. Coat the release agent mixed in Step 2 on one side of the PET base film of Step 1 by a 3-roll coating method. After coating, the release film obtained after baking temperature 70-100 ℃, baking time 15 seconds, the product appearance is uniform, smooth, transparent, no rainbow pattern, release agent coating layer thickness 60-200nm, release force 15-40g / inch, surface roughness Ra≤0.25μm, release film residual adhesive strength is 96% or more.

Example 4

The manufacturing method of the release film for a kind of chip component manufacturing process includes the following.

1. Put 1200ppm of additional particles of 800 ~ 1000nm particle size into PET pieces, and the additional particles can be selected as a mixture of silicon dioxide, barium carbonate and titanium oxide.The percentage of mixture is 94% silicon dioxide, 5% barium carbonate and titanium oxide 1 After uniformly mixing the%, a release base film having a thickness of 30 μm is obtained by melting, screw mixing, extrusion casting, stretching (horizontal stretching and vertical stretching), slitting and winding.

2. Mix each release agent according to the percentage below. 4% of vinyl-terminated organic silicone resin, 0.2% of butanol, 0.1% of silane coupling agent, 0.2% of platinum compound, and 95.5% of solvent are prepared by uniformly mixing. In this embodiment, a mixed solvent of 25% No. 120 solvent oil, 25% Butanone, 15% D30 solvent oil, 29% ethyl acetate, and 6% isopropyl alcohol is used.

3. Coat the release agent blended in step 2 on one side of the PET base film of step 1 by a 5-roll coating method. After coating, the release film obtained through baking temperature 60-100 ℃, baking time 90 seconds, the product appearance is uniform, smooth, transparent, no rainbow pattern, release agent coating layer thickness 100-180nm, release force 10-25g / inch, surface roughness Ra≤0.20μm, release film residual adhesive strength ≥94%.

Comparative Example 1

The difference from Example 1 is that the release agent used is different, and that the vinyl organosilicon oleoresin and the Sn curing catalyst system are used as the release agent.

Comparative Example 2

The difference from Example 2 is that toluene is used as the solvent without adding particles to the base film.

Comparative Example 3

The difference from Example 2 is that the particle size of the added particles is 1600-4500 nm, the addition amount is 800-900 ppm, and heptane is used as the solvent.

Comparative Example 4

The difference from Example 3 is that each component of the release agent is mixed in a percentage of 20% vinyl-terminated organic silicone resin, 2% butanol, 3% silane coupling agent, 5% platinum compound, and 70% solvent No. 120.

Comparative Example 5

The difference from Example 3 is that the solvent is 10% No. 120 solvent oil, 10% butanone, 20% D30 solvent oil, 30% ethyl acetate, 30% isopropyl alcohol.

The product appearance, surface roughness, release force, and residual adhesive force of the release film obtained in each example and the comparative example are measured.

How to measure

1.Method of measuring surface roughness Ra

(1) Mark the vertical and horizontal directions on a flat, wrinkle-free sample film, and keep the sample film as flat and clean as possible when sampling.

(2) Cut into 4cm * 4cm sample pieces and take 6 pieces each in the vertical and horizontal directions.

(3) Using a roughness meter and keeping the sample platform clean and flat, measure the roughness for the vertical and horizontal samples, respectively, and record the Ra, Rz, and Rmax values.

(4) Calculate the average value of the data and characterize it as the sample surface roughness value.

2. How to measure release force

(1) A 1-inch wide, 200-mm-long TESA 7475 tape is attached to the coated surface of the release film to be measured (stick on one side and consolidate one side to prevent air bubbles between the release films when the tape is applied).

(2) After attaching the tape, it is allowed to stand for 20 hours under the conditions of 25 ± 3 ° C and 50 ± 10%, respectively.

(3) Mounting the tape in the fixture and pulling the tape at 180 degree angle using tensioner, the data displayed on the tensioner computer is the release force (g / in) of the test film, and the average value of 5 data is tested The result is.

3. How to measure residual adhesion

(1) Apply TESA7475 tape, 1 inch wide and 200 mm long, onto the release film and standard steel plate to be tested according to standard methods.

(2) Using a tensioner, record the value of the tape tension force peeled from the standard steel sheet at a tensile speed of 300 mm / min and a tensile angle of 180 degrees.

(3) The tape of the release film adhered was pressurized and removed for 20 hours in an oven at 70 ° C. using 20 g / standard stainless steel, and then naturally cooled under room temperature conditions. After the tape is peeled off the release film, the tape is applied on the standard steel sheet according to the standard method, and the tape is peeled by a tensioner having a tensile speed of 300 mm / min and a tensile angle of 180 degrees, and the tensile force value is recorded as B.

(4) Residual adhesive force = (B / A) * 100%

The measurement results are shown in Table 1.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Product appearance normal normal normal normal Okay Okay Okay Fog and easy adhesion Rainbow Patterns and Fog Surface Roughness Ra 0.12 0.2 0.17 0.15 0.3 0.1 0.6 0.28 0.2 Release force 5 10 30 15 45 10 20 4 8 Residual adhesion 91 93 98 95 60 75 86 88 81

    Note: Each data is an average value.

Referring to Table 1, the surface roughness Ra of the release films obtained in Comparative Examples 1, 3, and 4 was larger than that of Examples, and in Comparative Examples 2 and 5, no particles were added or the added particles were the same as in Examples. The roughness Ra value is close to the embodiment. However, as the addition of particles affects the specific surface area of the release base film, it affects the stability of the release film release force and the residual adhesive force, and the stability of the release film release force obtained in the examples is higher than that of the release film obtained in the comparative example. high. However, since the residual adhesion is an important quality index of the release film, the residual adhesion of the release film obtained in the examples of the present invention is superior to the residual adhesion of the comparative example.

Claims (10)

(a) preparing a base film;
(b) preparing a release agent; And
(c) preparing a release film,
1000-1600ppm added particles are added to the base film to obtain a base film having a thickness of 20-75 μm, wherein the added particles are one or two or more of silicon dioxide, magnesium carbonate, barium carbonate, barium sulfate, aluminum oxide, and titanium oxide. The particle size of the added particles is 500-1500 nm,
Here, when the additive particles contain silicon dioxide, a mixture of silicon dioxide, barium carbonate and titanium oxide is used as the additive particles,
The raw material of the release agent includes a vinyl-terminated organic silicone resin, butanol, a silane coupling agent, a platinum compound, a solvent,
The release film is coated on the base film to obtain a release film. The method of claim 1,
The release agent is 2-15 weight percent vinyl-terminated organic silicone resin, 0.01-0.8 weight percent butanol, 0.05-0.5 weight percent silane coupling agent, 0.01-0.8 weight percent platinum compound, 83-97 weight percent solvent Method for producing a release film for a chip component manufacturing process comprising the component percentage of. The method of claim 1,
Baking is performed after the release agent is coated in the step (c), the baking temperature is 60 ℃-120 ℃, baking time 10 seconds-90 seconds, characterized in that the manufacturing method of the release film for the chip component manufacturing process. The method according to claim 1 or 2,
A solvent is one or more of butanone, ethyl acetate, isopropyl alcohol, or the manufacturing method of the release film for chip component manufacturing processes characterized by the above-mentioned. The method of claim 2,
The raw material for the release agent is 2-7% by weight of vinyl-terminated organic silicone resin, 0.01-0.8% by weight butanol, 0.05-0.5% by weight silane coupling agent, 0.01-0.8% by weight platinum compound, 91-97% by weight The manufacturing method of the release film for chip component manufacturing processes containing the component percentage of a solvent. The method of claim 1,
The particle size of the particles added to the base film is 800-1200 nm, the addition amount is 1000-1200ppm particles, the particles are 80-95% by weight silicon dioxide, 1-10% by weight barium carbonate and 1-10% by weight oxidation The manufacturing method of the release film for chip component manufacturing processes containing titanium. delete It is prepared by a method comprising the step of preparing a base film, preparing a release agent and preparing a release film, by adding 1000-1600ppm added particles to the base film to obtain a base film of 20-75μm thickness, the addition The particles are one or two or more of silicon dioxide, magnesium carbonate, barium carbonate, barium sulfate, aluminum oxide, titanium oxide, and the particle size of the added particles is 500-1500 nm, where silicon dioxide when the added particles contain silicon dioxide A mixture of barium carbonate and titanium oxide is used as the additive particles. The raw material of the release agent includes vinyl-terminated organic silicone resin, butanol, a silane coupling agent, a platinum compound, a solvent, and the base film is coated with the release agent. And a surface roughness of the release film is Ra ≦ 0.25 μm. The method of claim 8,
Release film, characterized in that the release agent coating layer thickness is 60-300nm, the release force is 2-40g / inch. The method of claim 8,
A release film, characterized in that the residual adhesion of the release film is ≥90%.