KR102018775B1 - Methof for Manufacturing A Force Sensing Sheet With Air Vent Hole - Google Patents

Abstract

Pressure sensing sheet having an air hole according to the present invention,
A pair of base films;
A circuit portion stacked on an upper surface of one base film, the circuit portion having a plurality of circuit elements serially arranged on a pattern;
A sensor unit stacked on another base film and having a plurality of pressure-sensitive sensors serially corresponding to the pattern;
As bonding between the pair of base film,
And an adhesive sheet including a plurality of air holes penetrated to correspond to the pattern.

Description

Method for manufacturing pressure sensing sheet with air hole {Methof for Manufacturing A Force Sensing Sheet With Air Vent Hole}

The present invention relates to a pressure sensing sheet having an air hole and a method of manufacturing the same. More specifically, the present invention provides a pressure sensing sheet having an air hole, which can effectively protect an installed circuit device and a pressure sensor from external pressure, The present invention relates to a pressure sensing seat having an air hole and a method of manufacturing the same.

Since the 2000s, individual interest in health care has increased due to increased income and increased health benefits from various welfare policies, and health care products have exploded. In addition, individuals have begun to emerge as 'productive consumers' who are not just consumers who use products as consumers, but also directly participate in product development and distribution.

In addition, with the recent development of electronic technology and information communication technology, the field of health care has been rapidly developed, and accordingly, health care products such as furniture, clothes, shoes, etc. which are frequently used in daily life can be health-cared. Increasingly, the demand for use is increasing.

In other words, there is a demand for a health care system that can measure the physical condition of a person using biometric information. For example, a technology for detecting a wearer's health state, a walking posture, and the like by installing a pressure sensor in a shoe has been developed.

On the other hand, shoes generally include sneakers, fashion shoes, and indoor shoes. Sneakers of such footwear have been developed for each sport shoes having a structure suitable for the sport, in particular, these sneakers are characterized by the sole structure in particular, fashion shoes are commonly worn in outing or everyday life It is a shoe, and slippers are light and simple shoes that can be worn indoors, in the courtyard, or around a house. The most important part of these shoes is the insole where the sole of the user touches.

Therefore, when mounting a sensor for detecting the pressure in the shoe, the sensor is to be mounted on the insole that is directly in contact with the sole of the user, the prior art for this is disclosed as follows.

Referring to the 'pressure sensing insole' disclosed in Korean Patent Publication No. 10-2017-0054088, the present invention relates to a pressure sensing insole, the first electrode layer including a first conductive region, on the first electrode layer A first adhesive layer disposed on the first adhesive layer, an intermediate layer disposed on the first adhesive layer, a second adhesive layer disposed on the intermediate layer, and disposed on the second adhesive layer, and disposed on the second adhesive layer. And a second electrode layer comprising a conductive region.

This pressure sensing insole can accurately detect the pressure according to the applied weight and has the advantage of accurately detecting the pressure distribution.However, it is difficult to provide sufficient cushioning that the insole can provide, and the load applied repeatedly There was a limit to being vulnerable.

Therefore, there is a need to develop a pressure sensing seat having an air hole and a method of manufacturing the same, which can effectively protect the circuit elements and the decompression sensor installed to solve the above problems and provide sufficient cushioning. to be.

SUMMARY OF THE INVENTION The present invention has been made to overcome the problems of the above technology, and is a pressure sensing sheet having an air hole, which can effectively protect an installed circuit element and a pressure sensor from external pressure and provide a sufficient cushioning feeling. It is a main object to provide a pressure sensing sheet and a method of manufacturing the same.

Another object of the present invention is to provide a detailed configuration of the adhesive sheet to adhere the base film and to protect the circuit element and the pressure-sensitive sensor as an external impact.

Still another object of the present invention is to provide a separate additional film configuration to prevent foreign matter from being introduced into the separate ventilation space formed in the pressure-sensitive adhesive sheet in the manufacturing process of the pressure sensing sheet having an air hole during the manufacturing process.

A further object of the present invention is to make the added film disappear in the bonding process so that problems such as poor breathability or poor connection may be caused by the additional film configuration.

In order to achieve the above object, the pressure sensing sheet having an air hole according to the present invention, a pair of base film; A circuit portion stacked on an upper surface of one base film, the circuit portion having a plurality of circuit elements serially arranged on a pattern; A sensor unit stacked on another base film and having a plurality of pressure-sensitive sensors serially corresponding to the pattern; And a pressure-sensitive adhesive sheet including a plurality of air holes penetrated to correspond to the pattern as bonding between the pair of base films.

Further, the air hole may include a through hole formed through the pattern so as to have a larger cross-sectional area than the circuit element and the decompression sensor, and a through hole extending in the row direction so as to pass through the through hole extending in the same row. It is characterized by including.

In addition, the connection hole is connected to the inner through the plurality of the through-hole, and formed through the diameter smaller than the connecting part to pass through the outside of the through-hole and the adhesive sheet, the through-hole side It is characterized by consisting of a vented portion tapered to increase in diameter as it extends to the outer side of the adhesive sheet.

Pressure sensing sheet having an air hole and a manufacturing method thereof according to the present invention,

1) A pressure sensing sheet having an air hole, which provides a pressure sensing sheet having an air hole and a method of manufacturing the same, which effectively protects the installed circuit elements and the pressure sensor from external pressure and provides a sufficient cushioning feeling.

2) Bonding the base film and providing the detailed configuration of the adhesive sheet to protect the circuit element and the pressure-sensitive sensor as an external shock,

3) In the manufacturing process of the pressure sensing sheet having an air hole to provide a separate auxiliary film configuration to prevent foreign matter from entering the separate ventilation space formed in the adhesive sheet during the manufacturing process,

4) The secondary film disappeared during the bonding process to solve problems such as poor breathability or poor connection caused by the additional film composition.

1 is a conceptual diagram showing a pressure sensing sheet having an air hole of the present invention.
2 is a cross-sectional view of the pressure sensing sheet of the present invention.
Figure 3 is a conceptual view showing an enlarged air hole of the adhesive sheet of the present invention.
Figure 4 is a flow chart illustrating a method of manufacturing a pressure sensing sheet of the present invention.
5 is a conceptual diagram showing the configuration of a pressure-sensitive adhesive sheet to which the silica coating liquid of the present invention is applied.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The accompanying drawings are not drawn to scale, and like reference numerals in each of the drawings refer to like elements.

1 is a conceptual diagram illustrating a pressure sensing sheet 10 having an air hole 410 of the present invention, and FIG. 2 is a cross-sectional view of the pressure sensing sheet 10 of the present invention.

Referring to FIGS. 1 and 2, the pressure sensing sheet 10 of the present invention includes a base film 100, a circuit part 200, a sensor part 300, and an air hole 410. Sheet 400.

First, the base film 100 is made of a resin material, and may be a material manufactured for a flexible substrate, for example, polyimide, polyethylene terephthalate, or the like, so that a circuit may be configured on one surface thereof. It is made of terephthalate (PET) material. The sensor unit 300 and the circuit unit 200 to be described later may be extended on the upper or lower surface of the base film 100. In this case, the upper surface represents a direction in which the sensor unit 300 extends, that is, the upper side of the base film 100 on the drawing, as shown in the cross-sectional view of FIG. 2, and the lower surface represents a circuit portion as shown in the cross-sectional view of FIG. 2. The direction 200 is extended, that is, the lower side of the base film 100 on the drawing.

The circuit unit 200 is stacked on an upper surface of one of the base films 100 and includes a plurality of circuit elements 210 extending on a pattern. In this case, the pattern may be printed on the base film 100 in advance, or means that the shape in which the circuit unit 200 is extended through the program is designed in advance. The pattern may be in the row direction or the column direction, or may be in the form of a matrix considering both the row direction and the column direction.

The circuit unit 200 is composed of a plurality of circuit elements 210, the circuit elements 210 are laminated on the base film 100, preferably printed on the base film 100, that is, silver, etc. The circuit unit 200 may be formed by forming a circuit element 210 by patterning a conductive material. In this case, the patterning process may be performed several times to form the circuit part 200. In this case, the conductive material on which the patterning process is performed is not limited to silver, copper, and aluminum, but is composed of silver to realize high conductivity. This is preferred.

In addition, the circuit unit 200 may be connected to a separate power line and a data line, and the power line and the data line may be connected to the circuit unit 200 and electrically connected to the outside through an air hole 410 which will be described later. .

The sensor unit 300 is stacked on the lower surface of the other base film 100 and is extended on the same pattern as the pattern of the circuit unit 200. The sensor unit 300 includes a plurality of pressure-sensitive sensors 310, and more preferably, an FSR sensor (Force sensing resistor sensor) may be used as the pressure-sensitive sensor 310.

The pressure sensor 310 may be attached to the sensor unit 300 or may be extended in the same patterning manner as the circuit unit 200, in which case the pressure sensing sheet 10 of the present invention is recognized according to the use It is desirable to adjust the value of the resistance value.

The adhesive sheet 400 is made of an adhesive material to serve to bond between the pair of the base film 100, without limiting the material, but having a sticky state while maintaining the film state between the base film 100 To be able to bond. At this time, the circuit part 200 and the sensor part 300 are extended to the base film 100, respectively, and the circuit part 200 and the sensor part 300 are attached to face each other. In addition, since the material of the adhesive sheet 400 is not limited, a natural resin, a synthetic resin, a polymer or the like having adhesiveness may be used as the adhesive sheet 400.

The adhesive sheet 400 is used to bond between the circuit part 200 and the sensor part 300, and the base film 100 on which the circuit part 200 is extended and the base film on which the sensor part 300 is extended. It includes a plurality of air holes 410 penetrating to correspond to the pattern to perform a smooth contact between the (100). This is to form an air hole 410 by penetrating the adhesive sheet 400 in the same pattern as the circuit element 210 and the pressure-sensitive sensor 310 is a series pattern, the above-described through the air hole 410 The data line and the power line can also escape to the outside.

At this time, the thickness of the adhesive sheet 400 is not particularly limited, but the thickness of the adhesive sheet 400 may be adjusted according to the force applied to the pressure sensing sheet 10. In other words, the stronger the force should be applied to the pressure sensing sheet 10, the thicker the thickness of the adhesive sheet 400 is to keep the distance between each base film 100 farther. Through this, the circuit unit 200 and the sensor unit 300 can be smoothly protected from the impact applied from the outside.

3 is an enlarged conceptual view of the air hole 410 of the pressure-sensitive adhesive sheet 400 of the present invention.

Referring to FIG. 3, the pressure sensing sheet 10 of the present invention includes an air hole 410 to serve as a contact between the circuit unit 200 and the sensor unit 300, and at the same time serves as a cushioning role with breathability. In addition, the role of the air hole 410 may be important.

Referring to the structure of the air hole 410 in more detail, the air hole 410 of the present invention consists of a through hole 411 and a connection hole 412 through which the through hole 411 pass through each other.

First, the through hole 411 is a portion where the circuit element 210 and the pressure sensor 310 are actually inserted, and is formed through the pattern to accommodate the circuit element 210 and the pressure sensor 310. To this end, it is preferable that the through-section is formed to have a larger cross-sectional area than the circuit soba and the pressure-sensitive sensor 310, preferably, the circuit element 210 and the pressure-sensitive sensor 310. Therefore, the circuit elements 210 and the pressure reduction sensor 310 respectively formed in the base film 100 are inserted into the respective through holes 411. Therefore, the number of through-holes 411 should correspond to the number of circuit elements 210 and the pressure-sensitive sensor 310 constituting the circuit unit 200 and the sensor unit 300, wherein the circuit element 210 and the pressure-sensitive sensor Of course, the number of 310 must match.

The connection hole 412 is formed to penetrate a smaller diameter than the through hole 411 to pass through the plurality of through holes 411, and preferably through the through holes 411 extending in the same row. Play a role. To this end, a connection hole 412 extends in a row direction from one through hole 411 to connect another through hole 411 adjacent to the one through hole 411 in the same row. ) Is to handle the inner cylinder. In addition, the connection hole 412 may serve as a passage of the power line or data line as described above, as well as the through hole 411 by connecting the connection hole 412 to the outside of the pressure sensing sheet 10. It is also possible to play a role of dissipating heat generated by the circuit element 210 or the pressure-sensitive sensor 310 inserted into the outside.

In addition, at this time, the connection hole 412 may be formed of a connection part 413 and a ventilation part 414. The connection part 413 connects each other between the plurality of through holes 411 extending in the same row. That is, extending through-holes are formed so as to pass through the through-holes 411. Therefore, it can be said that the through holes 411 in the same row are connected to each other through the connection part 413.

Ventilation part 414 serves to connect the outside of the through hole 411 and the adhesive sheet 400, the through hole 411 and the adhesive sheet so that the outside air can be circulated to the through hole 411 It passes through the outside of 400. That is, the ventilation part 414 is formed only at both ends of the through-hole 411 extending in the row direction, that is, the through-hole 411 located at the start of the row direction and the through-hole 411 located at the end. The vent part 414 should be able to directly discharge the heat generated by the circuit element 210 or the pressure-sensitive sensor 310 inserted into the through hole 411 to the outside, and through and outside As much as passing through the hole 411, foreign matters to be introduced into the through hole 411 should be prevented.

To this end, the vent part 414 has a tapered shape to increase in diameter as it extends from the through hole 411 to the outer side of the adhesive sheet 400, and thus includes a circuit element inserted into the through hole 411. The heat generated from the 210 and the decompression sensor 310 may be smoothly released to the outside, and may block foreign substances that may flow into the through hole 411 through the vent part 414 from the outside.

The pressure sensing sheet 10 having the air hole 410 can effectively protect the installed circuit element 210 and the pressure reduction sensor 310 from external pressure and provide a sufficient cushioning feeling. The heat generated from the device 210 and the decompression sensor 310 may be discharged to the outside. The manufacturing method of the pressure sensing sheet 10 having the air hole 410 will be described with reference to the accompanying drawings.

4 is a flowchart illustrating a manufacturing method of the pressure sensing sheet 10 of the present invention.

Referring to Figure 4, the manufacturing method of the pressure sensing sheet 10 of the present invention, the step of forming a pattern on the base film 100, the step of forming the circuit portion 200, the sensor unit 300 Forming, forming the air hole 410 in the pressure-sensitive adhesive sheet 400, the step of attaching the pressure-sensitive adhesive sheet 400, characterized in that it comprises a step of manufacturing a laminate.

Forming a pattern on the base film 100 is a step of forming a pattern on a pair of base film 100 made of a resin material, preferably polyethylene terephthalate material, the pattern is formed at this time The pattern is directly printed on the 100, or the shape of the base film 100, that is, the shape of the base film 100 formed as necessary, is recognized, and the circuit part 200 and the sensor part 300 are adapted to the shape. Refers to a step of designing a pattern to be formed in advance. Therefore, even if the pattern is not directly printed or displayed on the surface of the base film 100, when the pattern is designed it can be said that the pattern is formed on the base film 100. More preferably, the pattern is displayed on the base film 100 for accurate mounting. In this case, two sheets of the patterned base film 100 are required for manufacturing the laminate. That is, a pattern should be formed on the pair of base films 100.

The step of forming the circuit part 200 is to form the circuit part 200 by extending a plurality of circuit elements 210 on any one pattern of the base film 100. At this time, the method of extending the circuit element 210 is not limited, so that the circuit element 210 may be attached to the base film 100, but in order to further reduce the thickness of the pressure sensing sheet 10, the base film ( The circuit element 210 is serialized by patterning the circuit element 210 in the method 100. In this case, as described above, the pattern may be a matrix image in which the row direction or the column direction, or both the row direction and the column direction are considered. In this case, the base film 100 has a thickness of about 0.2 to 0.3 mm, preferably 0.25 mm, based on when the circuit unit 200 is formed.

The forming of the sensor unit 300 is a process of forming the circuit unit 200 by extending a plurality of pressure-sensitive sensors 310 on another pattern of the base film 100. In this case, the method of extending the decompression sensor 310 also does not have a separate limitation as in the step of forming the circuit unit 200, and the decompression sensor 310 is preferably an FSR sensor as described above. The base film 100 on which the sensor unit 300 is formed has a thickness of about 0.1 to 0.2 mm, preferably about 0.13 mm.

The step of penetrating the air hole 410 in the pressure-sensitive adhesive sheet 400 is to penetrate the air hole 410 on the pattern of the pressure-sensitive adhesive sheet 400 on which the same pattern as the pattern of the base film 100 is formed. The through-holes 410 are formed through the same pattern as that in which the circuit element 210 and the pressure sensor 310 are located. At this time, the air hole 410 is formed through the same number as the number of circuit elements 210 and the pressure-sensitive sensor 310, it should be said that the number of circuit elements 210 and the pressure-sensitive sensor 310 must also be the same. none. At this time, the pressure-sensitive adhesive sheet 400 is a material having adhesiveness to bond the pair of base films 100 to each other, and the type thereof is not limited thereto.

Attaching the pressure-sensitive adhesive sheet 400 is a step of attaching the pressure-sensitive adhesive sheet 400 on the upper surface of the circuit unit 200. At this time, when the pressure-sensitive adhesive sheet 400 is attached, the circuit unit may correspond to the pattern of the circuit unit 200. The adhesive sheet 400 is attached to the upper surface of the 200. Therefore, the circuit unit 200 is extended to the pattern of the base film 100, the adhesive sheet 400 is attached to the upper surface of the circuit unit 200 to match the pattern. Accordingly, the circuit element 210 constituting the circuit unit 200 is inserted into the air hole 410 formed in the adhesive sheet 400.

The manufacturing of the laminate is a process of laminating the other base film 100 on the upper surface of the adhesive sheet 400 so that the circuit unit 200 and the sensor unit 300 face each other. At this time, even when the base film 100 is laminated, the other base film 100 is attached to match the pattern of the adhesive sheet 400. Accordingly, the pattern and the adhesion formed on the pair of base film 100 are applied. The patterns formed on the sheet 400 are attached to match each other. Through this, the circuit element 210 and the pressure reduction sensor 310 may be accommodated in the air hole 410, and may be manufactured in the shape of FIGS. 1 and 2.

In addition, the air hole 410 is said to be composed of a through hole 411 and a connection hole 412 as described above in the structure, as described above, the air hole 410 consisting of a through hole 411 and a connection hole 412 In order to form, the step of forming the air hole 410 may include forming a through hole 411 and extending the connection hole 412.

The step of penetrating the through hole 411 is a step of penetrating the through hole 411 on the pattern of the adhesive sheet 400 that matches the pattern of the base film 100. The through hole 411 is formed through the same pattern as that of the 210 and the decompression sensor 310. At this time, the through hole 411 is to be formed to have a cross-sectional area larger than the cross-sectional area of the circuit element 210 and the pressure-sensitive sensor 310, the circuit element 210 and the pressure-sensitive sensor ( 310 may be inserted into the through hole 411 according to the adhesion to the adhesive sheet 400. At this time, in order to form the through hole 411, an etching treatment or physical cutting through the application of an etchant may be used, and the method of forming the through hole 411 is not limited.

The extending of the connection hole 412 is a process of extending the connection hole 412 in the row direction so that the through holes 411 extending in the same row pass through each other. In addition to the connection between the respective through holes 411, the through-holes 411 extending in both ends of the row direction and the connection hole 412 is formed to extend through the outside through the air permeability To increase. In this case, an etching process or physical cutting may be performed even when the connection hole 412 is extended through, and the method is not limited thereto. In addition, the data line and the power line as described above may be inserted into the connection hole 412.

In addition, the adhesive sheet 400 including the air hole 410 consisting of the through hole 411 and the connection hole 412 of the present invention is laminated on the upper surface of the base film 100 in the process of manufacturing the pressure sensing sheet 10. Is processed. In this case, although the circuit element 210 and the pressure-sensitive sensor 310 are inserted into the through hole 411, the connection hole 412 is empty, and through this connection hole 412 during the manufacturing process. Foreign matter may enter the hole 411 and other parts.

Therefore, a configuration may be added to temporarily block the connection hole 412 so as to prevent the inflow of foreign substances. After this, the connection hole 412 extends through the connection hole 412. Attaching the auxiliary film on at least one side of the adhesive sheet 400 to cover the) may be further included.

The auxiliary film temporarily covers the empty connection hole 412, and does not cover the through hole 411 into which the pressure-sensitive sensor 310 and the circuit element 210 are inserted. It is attached to the surface of the connection hole 412 connecting to each other serves to cover the connection hole 412 temporarily. However, in order to prevent the increase in the thickness of the pressure sensing sheet 10 of the present invention, such an auxiliary film should not be exposed to the outside when the pressure sensing sheet 10 is manufactured. By adding so that it can be melted to increase the adhesiveness of the pressure-sensitive adhesive sheet 400 provided with the auxiliary film at the same time as the secondary film is not required to be able to melt naturally disappear.

In this case, if too much heat is required to melt the auxiliary film, it may not only affect the circuit element 210 and the pressure sensor 310 provided in the base film 100, but also the adhesive sheet 400 may also be melted. , So that the melting point of the auxiliary film can be adjusted to 70 to 120 ℃ can be easily melted even in a relatively low temperature range, in this case after the step of manufacturing the laminate, the laminate to 70 to 120 ℃ 30 seconds to The method may further include a step of thermal compression for 3 minutes to melt the auxiliary film included in the laminate and to further increase the adhesion between the base film 100 and the adhesive sheet 400 constituting the laminate. To help.

In addition, as shown in the description, the secondary film, which is characterized by a thermoplastic material having a tacky adhesiveness while showing a melting point of 70 to 120 ° C., is characterized by its outstanding characteristics, which will be described in detail below.

The preparing of the auxiliary film of the adhesive thermoplastic material may include preparing a primary mixed solution, preparing a primary mixed resin, forming a secondary mixed resin, and pelletizing the secondary mixed resin. And the step of filming the pelletized secondary mixed resin.

The preparing of the primary mixed solution is a process of preparing a primary mixed solution by mixing 75 to 90 wt% of the hydrophilic polyether polyol and 10 to 25 wt% of the glycols. At this time, since the glycols and hydrophilic polyether polyols have properties of being well mixed with each other, a separate stirring process is not required, but a stirring process using a stirrer may be performed together for more smooth mixing. In addition, the hydrophilic polyether polyol used at this time is preferably at least one selected from the group consisting of polyethylene glycol, polytetramethylene glycol and polypropylene glycol, and glycols are 1.5 pentanediol and hydroquinone di- (ß-hydrozetyl). It is characterized in that at least one member selected from the group consisting of ether, 3-methyl 1,5-pentanediol, diethylene glycol.

In addition, when the content of glycols exceeds 25% by weight, the strength of the auxiliary film produced is weak and not suitable for filming, so the glycols do not exceed 25%, and the content of glycols below 10% by weight will be described later. Since the mixing with diphenylmethane diisocyanate may not be smooth, the content of glycols should not be less than 10% by weight.

The preparing of the primary mixed resin is a process of preparing the primary mixed resin by mixing 50 to 70 wt% of the primary mixed solution and 30 to 50 wt% of diphenylmethane diisocyanate. And diphenylmethane diisocyanate satisfy the number average molecular weight ratio of 1: 0.9 to 1: 1.1 of the primary mixed solution and the diphenylmethane diisocyanate relative to the total number average molecular weight of the primary mixed resin. It is characterized in that the mixing process. Therefore, polymerization occurs through the mixing of diphenylmethane diisocyanate to form a resin.

At this time, if the mixing ratio of diphenylmethane diisocyanate is less than 30% by weight, it is difficult to form a film and the strength of the obtained film may not be sufficient, so the mixing ratio should be 30% by weight or more, and the mixing ratio exceeds 50% by weight. If so, it may be difficult to impart tack so that the mixing ratio does not exceed 50% by weight.

In addition, in the process of manufacturing the first mixed resin, additives or catalysts for promoting a smooth polymerization reaction together with the mixing treatment through a separate stirrer may be further added, as well as in the range of 0 to 100 ° C so that polymerization occurs. The reaction can also be maintained.

When the primary mixed resin is prepared as described above, the secondary mixed resin is formed by mixing and stirring 85 to 95 wt% of the primary mixed resin, 3 to 10 wt% of polyethylene glycol, and 0.1 to 5 wt% of hydrophilic fumed silica. In this case, the strength of the auxiliary film prepared by the addition of hydrophilic fumed silica can be increased, and smooth mixing with polyethylene glycol can be expected. At this time, polyethylene glycol can be adjusted in the range of 3 to 10% by weight according to the desired pellet size in the strength and pelletizing of the desired auxiliary film, even in the case of hydrophilic fumed silica 0.1 to 0.1 depending on the range of strength control and density control of the film Its content can be adjusted in the range of 5% by weight.

The step of pelletizing the secondary mixed resin is to pelletize the secondary mixed resin prepared by adding polyethylene glycol and submerged fumed silica to the primary mixed resin into pellets having a diameter of 1 to 20 mm. In this case, the filming can be performed more easily through the pelletizing process, and the moldability can be increased by performing molding using pellets through the pelletizing of the thermoplastic resin. In this case, since a conventional granulator may be used for pelletizing, detailed description thereof will be omitted.

The step of filming the secondary mixed resin is to film the pelletized secondary mixed resin through pelletizing, and a method such as a roll-to-roll process of the pelletized secondary mixed resin through pelletizing It is to perform the film treatment through. At this time, by filming the pelletized secondary mixed resin is to increase the transparency of the auxiliary film produced is to be able to lower the risk that the auxiliary film can cover the pattern of the adhesive sheet (400).

By forming the auxiliary film as described above, the adhesion between the base film 100 and the adhesive sheet 400 constituting the laminate may be further increased, and foreign matter is introduced into the connection hole 412 from the outside in the manufacturing process. Although it can be prevented, there is a risk that the shape of the through-hole 411 formed in the adhesive sheet 400 may be distorted because a separate thermal compression is required when the auxiliary film is provided.

Therefore, in order to prevent this, a higher strength is given to maintain the shape of the through hole 411 and a dense heat resistant film is formed along the circumference of the through hole 411 to increase the protection effect for the through hole 411. This may be described with reference to the accompanying drawings.

5 is a conceptual diagram showing the configuration of the pressure-sensitive adhesive sheet 400 is coated with the silica coating liquid of the present invention.

Referring to FIG. 5, between the step of forming the air hole 410 and the step of attaching the pressure-sensitive adhesive sheet 400, the pressure-sensitive adhesive sheet 400 of the pressure-sensitive adhesive sheet 400 is formed along the circumference of the through-hole 411. The step of forming the recess 420 on at least one surface, and applying a silica coating liquid to the depression 420, and the drying treatment; may be further included.

The step of forming the depression 420 is a process of forming the depression 420 in at least one surface of the adhesive sheet 400 along the circumference of the through hole 411. The periphery of the through hole 411 may be applied to etch the periphery of the through hole 411, or the perforation jaw 420 may be formed by scraping the periphery of the through hole 411 through physical cutting. The depression 420 may be formed on at least one surface of the adhesive sheet 400, but preferably, both surfaces are formed.

Thereafter, the silica coating solution is filled into the depression 420 and the drying treatment is performed to fill the depression 420 with the silica coating solution. Thus, the silica coating layer 421 having dried the silica coating solution fills the depression 420. This silica is a colloidal silica dispersed as a colloidal type to form a dense film on the surface not only to increase the strength around the through hole 411, but also to shape the shape of the through hole 411 from the heat applied to melt the auxiliary film. It protects and prevents heat from being transferred to the decompression sensor 310 and the circuit element 210 through the through hole 411.

In this case, the method for preparing the silica coating liquid dispersed in such a colloidal form will be described. The preparing of the silica coating liquid may include preparing a base silica liquid, preparing a silica sol, and growing liquid. And a step of preparing a colloidal silica liquid, and removing residual sodium ions, wherein betacyclodextrin is added to increase the adhesion between the silica coating liquid and the impregnation jaw 420. May be further included.

The step of preparing a base silica solution is a process of preparing a base silica solution containing 3 to 10% by weight of silica based on the total weight of the base silica solution by adding distilled water to sodium silicate, the base silica solution is flame retardant and forms a dense film It is used to obtain colloidal silica.

In the preparing of the silica sol, 50 to 65% by weight of the base silica solution and 35 to 50% by weight of the cation exchange resin are mixed, and then filtered after stirring for 3 to 10 minutes at 250 to 500 rpm at a temperature of 20 to 40 ° C. As a process for preparing a silica sol having a pH of 2 to 2.5, such silica sol is added as a basic material for the growth of colloidal silica.

The step of preparing a growth solution is a process of preparing a growth solution containing 1 to 10% by weight of silica based on the total weight of the growth solution by adding distilled water to sodium silicate, wherein the growth solution has a lower silica content than the base silica solution. , The growth liquid is to be used for the growth of the silica sol prepared through the step of preparing the above-described silica sol.

In the preparing of the colloidal silica solution, the growth solution is heated to 70 to 90 ° C., and then the silica sol 6 to 7 times the weight of the growth solution is added at 1 to 10 ml / min and maintained for 4 to 8 hours. As a colloidal silica solution, the colloidal silica produced is an active type of colloidal silica, which forms a dense film and exhibits flame retardancy to protect the through hole 411 from heat with high strength. Has

Removing the remaining sodium ions is a process of removing the remaining sodium ions by adding a polystyrene sulfonic acid resin to the colloidal silica liquid, the remaining sodium ions from the sodium ions contained in the sodium silicate to remove the polystyrene sulfonic acid resin Will be removed through.

The silica coating solution containing colloidal silica is then impregnated by adding betacyclodextrin, a natural thickener, by adding 0.1 to 3% by weight of betacyclodextrin relative to the total weight of the colloidal silica solution from which residual sodium ions have been removed. The adhesion to 420 is better to form the silica coating layer 421 and at the same time, it is possible to further increase the preservation of the silica coating liquid through the beta cyclodextrin that serves as an antimicrobial additive.

As described so far, the configuration and operation of the pressure sensing sheet 10 having the air hole 410 and the manufacturing method thereof according to the present invention have been represented in the above description and the drawings, but the present invention is merely described by way of example. The spirit of the present invention is not limited to the above description and drawings, and various changes and modifications are possible without departing from the technical spirit of the present invention.

10: pressure sensing sheet 100: base film
200: circuit portion 210: circuit element
300: sensor unit 310: pressure-sensitive sensor
400: adhesive sheet 410: air hole
411: through hole 412: connecting hole
413: Connection part 414: Ventilation part
420: impregnation jaw 421: silica coating layer

Claims (11)

delete delete delete As a method of manufacturing a pressure sensing sheet having an air hole,
Forming a pattern on the pair of base films;
Forming a circuit part by extending a plurality of circuit elements on a pattern of one base film;
Forming a sensor unit by extending a plurality of pressure-sensitive sensors on a pattern of another base film;
Forming a plurality of air holes through the pattern of the pressure sensitive adhesive sheet;
Attaching the adhesive sheet to an upper surface of the circuit unit;
Manufacturing a laminate by stacking the other base film on the upper surface of the adhesive sheet so that the circuit unit and the sensor unit face each other;
Forming through the air hole,
Forming through-holes on the pattern, and extending through-holes in a row direction so that the through-holes extending in the same row pass through each other;
After forming the connection hole through the extension,
And attaching an auxiliary film to at least one surface of the adhesive sheet to cover the connection hole. delete delete The method of claim 4, wherein
The auxiliary film,
It is a sticky thermoplastic material with a melting point of 70 to 120 ℃,
After the step of manufacturing the laminate,
And thermally compressing the laminate at 70 to 120 ° C. for 30 seconds to 3 minutes. The method of manufacturing a pressure sensing sheet having an air hole further comprises. The method of claim 7, wherein
Preparing the auxiliary film,
Preparing a primary mixed solution by mixing 75 to 90 wt% of a hydrophilic polyether polyol and 10 to 25 wt% of glycols;
Preparing a primary mixed resin by mixing 50 to 70 wt% of the primary mixed solution and 30 to 50 wt% of diphenylmethane diisocyanate;
85 to 95 wt% of the primary mixed resin, 3 to 10 wt% of polyethylene glycol, and 0.1 to 5 wt% of hydrophilic fumed silica, followed by stirring to form a secondary mixed resin;
Pelletizing the secondary mixed resin;
And forming a film of the pelletized secondary mixed resin. The method of claim 7, wherein
Between the step of forming through the air hole and attaching the adhesive sheet,
Forming a recess in at least one surface of the adhesive sheet along a circumference of the through hole; And,
And applying a silica coating solution to the recess and drying the coating step. The method of manufacturing a pressure sensing sheet having an air hole is further included. The method of claim 9,
Preparing the silica coating solution,
Adding distilled water to sodium silicate to prepare a base silica solution comprising 3 to 10 wt% of silica relative to the total weight of the base silica solution;
50 to 65% by weight of the base silica solution and 35 to 50% by weight of the cation exchange resin were mixed, and then stirred at 250 to 500 rpm for 3 to 10 minutes at a temperature condition of 20 to 40 ° C, followed by filtration and silica having a pH of 2 to 2.5 Preparing a sol;
Adding a distilled water to sodium silicate to prepare a growth solution comprising 1 to 10% by weight of silica relative to the total weight of the growth solution;
Preparing a colloidal silica liquid by heating the growth solution to 70 to 90 ° C. and then adding 6 to 7 times the silica sol to 1 to 10 ml / min based on the weight of the growth solution and maintaining for 4 to 8 hours. ;
And removing the remaining sodium ions by adding polystyrenesulfonic acid resin to the colloidal silica solution. The method of claim 10,
After removing the remaining sodium ions,
A method of manufacturing a pressure sensing sheet having an air hole, characterized in that the method further comprises adding 0.1 to 3% by weight of betacyclodextrin relative to the total weight of the colloidal silica liquid from which the remaining sodium ions have been removed.

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