KR102017033B1 - Recombinant wood board using polyimide modified urethane adhesive and method for preparing same - Google Patents
Recombinant wood board using polyimide modified urethane adhesive and method for preparing same Download PDFInfo
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- KR102017033B1 KR102017033B1 KR1020177022805A KR20177022805A KR102017033B1 KR 102017033 B1 KR102017033 B1 KR 102017033B1 KR 1020177022805 A KR1020177022805 A KR 1020177022805A KR 20177022805 A KR20177022805 A KR 20177022805A KR 102017033 B1 KR102017033 B1 KR 102017033B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K3/00—Impregnating wood, e.g. impregnation pretreatment, for example puncturing; Wood impregnation aids not directly involved in the impregnation process
- B27K3/02—Processes; Apparatus
- B27K3/0207—Pretreatment of wood before impregnation
- B27K3/0214—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
- B27M1/08—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by multi-step processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
- B27M3/0013—Manufacture or reconditioning of specific semi-finished or finished articles of composite or compound articles
- B27M3/0086—Manufacture or reconditioning of specific semi-finished or finished articles of composite or compound articles characterised by connecting using glue
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/08—Moulding or pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
- B27N7/005—Coating boards, e.g. with a finishing or decorating layer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4081—Mixtures of compounds of group C08G18/64 with other macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
- C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
- C08G18/6438—Polyimides or polyesterimides
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Abstract
본 발명은 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판 및 이의 을 공개하였다. 본 발명은 접착제로 섬유 스트립을 접착하고, 압착하여 제조된 재조합 블록보드, 상기 재조합 블록보드의 표면에 페인트층이 구비되고, 재조합 블록보드의 측면에 측면장부와 측면홈이 구비되며, 상기 접착제는 중량부에 따라 5~20중량부의 폴리이소시아네이트, 1~10중량부의 폴리산무수물, 30~50중량부의 폴리올, 20~50중량부의 가소제, 0.02~0.20중량부의 촉매, 0.5~3중량부의 소포제, 0.02~0.20중량부의 탈수제, 0.02~0.5중량부의 커플링제, 0.02~0.20중량부의 항산화제인 원료로 제조한다. 본 발명은 나무 재료의 낭비를 효과적으로 감소하고, 목재 자원을 절감하는 동시에, 우월한 경제적 효익을 구비할 수 있다. 이 외에, 본 발명은 나무 장판의 점도와 투광성 및 장판 사이의 연결 강도를 향상시킬 수 있다.The present invention discloses a recombinant wooden board using polyimide modified urethane adhesive and its. The present invention is a recombinant blockboard prepared by adhering and squeezing the fiber strip with an adhesive, the paint layer is provided on the surface of the recombinant blockboard, the side surface and side grooves are provided on the side of the recombinant blockboard, the adhesive 5 to 20 parts by weight of polyisocyanate, 1 to 10 parts by weight of polyacid anhydride, 30 to 50 parts by weight of polyol, 20 to 50 parts by weight of plasticizer, 0.02 to 0.20 parts by weight of catalyst, 0.5 to 3 parts by weight of antifoam, 0.02 It is prepared from a raw material which is ˜0.20 parts by weight of a dehydrating agent, 0.02 to 0.5 parts by weight of a coupling agent, and 0.02 to 0.20 parts by weight of an antioxidant. The present invention can effectively reduce the waste of wood materials, save wood resources, and have superior economic benefits. In addition, the present invention can improve the viscosity of the wooden floorboard and the connection strength between the light transmission and the floorboard.
Description
본 발명은 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판 및 이의 제조 방법에 관한 것으로, 나무 바닥재(장판)에 속하고, 특히 재조합 나무 바닥재의 생산 기술 영역에 속한다.The present invention relates to a recombinant wooden board using a polyimide-modified urethane adhesive and a method for producing the same, which belongs to a wooden flooring (sheetboard), and particularly belongs to the production technology of recombinant wooden flooring.
급속한 경제 발전에 따라, 사람들의 생활 수준이 점차 향상되어, 목재의 소비가 더욱 증가되어, 중국의 목제품의 가격이 인상되었고, 나무 바닥재와 귀중한 목종을 목피로 한 원목 장판의 가격이 계속 오르고 있다. 나무 장판 시장의 공급과 수요의 모순을 완화시키기 위하여, 또한 중국의 귀중한 목종을 보호하고, 지속 가능한 발전을 실현하기 위하여, 현재 수많은 나무 바닥재 업자가 나무판을 생산하는 과정에서 목재를 충분히 이용하는 것을 고려하고 있지만, 효과가 뚜렷하지 않다.With the rapid economic development, people's living standard is gradually improved, the consumption of wood is further increased, the price of wood products in China has been increased, and the price of wooden floor boards made of wood flooring and precious wood is rising. In order to alleviate the contradictions of supply and demand in the wood flooring market, and also to protect China's precious species and to realize sustainable development, many wood flooring companies now consider making full use of wood in the production of wood boards. But the effect is not clear.
본 발명은 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판(wood board) 및 이의 제조 방법을 제공하는 것을 목적으로 한다.It is an object of the present invention to provide a recombinant wood board using a polyimide modified urethane adhesive and a method for producing the same.
본 발명의 기술적 해결 수단은 하기와 같다. 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에 있어서, 접착제로 섬유 스트립을 접착하고, 압착하여 제조된 재조합 블록보드, 상기 재조합 블록보드의 표면에 페인트층이 구비되고, 재조합 블록보드의 측면에 측면장부(side tenon)와 측면홈(side groove)이 구비되며, 상기 접착제는 중량부에 따라 5~20중량부의 폴리이소시아네이트, 1~10중량부의 폴리산무수물, 30~50중량부의 폴리올, 20~50중량부의 가소제, 0.02~0.20중량부의 촉매, 0.5~3중량부의 소포제, 0.02~0.20중량부의 탈수제, 0.02~0.5중량부의 커플링제, 0.02~0.20중량부의 항산화제인 원료로 제조된다.Technical solutions of the present invention are as follows. Recombinant wooden board using a polyimide-modified urethane adhesive, Recombinant block board prepared by bonding a fiber strip with an adhesive, the compression is provided with a paint layer on the surface of the recombinant block board, side mounting on the side of the recombinant block board (side tenon) and side grooves (side groove) is provided, the adhesive is 5 to 20 parts by weight of polyisocyanate, 1 to 10 parts by weight of polyacid anhydride, 30 to 50 parts by weight of polyol, 20 to 50 parts by weight It is prepared from a raw material which is a negative plasticizer, 0.02-0.20 parts by weight of catalyst, 0.5-3 parts by weight of antifoaming agent, 0.02-0.20 parts by weight of dehydrating agent, 0.02-0. 5 parts by weight of coupling agent, and 0.02-0.20 parts by weight of antioxidant.
상술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 접착제는 중량부에 따라 10~15중량부의 폴리이소시아네이트, 3~8중량부의 폴리산무수물, 30~40중량부의 폴리올, 30~50중량부의 가소제, 0.1~0.2중량부의 촉매, 1~2중량부의 소포제, 0.1~0.2중량부의 탈수제, 0.1~0.5중량부의 커플링제, 0.05~0.1중량부의 항산화제인 원료로 제조된다.In the recombinant wood board using the above-described polyimide modified urethane adhesive, the adhesive is 10 to 15 parts by weight of polyisocyanate, 3 to 8 parts by weight of polyacid anhydride, 30 to 40 parts by weight of polyol, 30 to 50 parts by weight, depending on the weight part. It is made of a raw material that is a plasticizer, 0.1 to 0.2 parts by weight of catalyst, 1 to 2 parts by weight of antifoaming agent, 0.1 to 0.2 parts by weight of dehydrating agent, 0.1 to 0.5 parts by weight of coupling agent, and 0.05 to 0.1 parts by weight of antioxidant.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 폴리이소시아네이트는 4,4'-디페닐메탄디이소시아네이트, 톨루엔디이소시아네이트, 헥사메틸렌디이소시아네이트 또는 폴리페닐렌폴리메틸렌폴리이소시아네이트 중의 하나 또는 둘 이상으로부터 선택된다.In a recombinant wooden board using the aforementioned polyimide modified urethane adhesive, the polyisocyanate is one or two or more of 4,4'-diphenylmethane diisocyanate, toluene diisocyanate, hexamethylene diisocyanate or polyphenylenepolymethylenepolyisocyanate. Is selected from.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 폴리산무수물은 피로멜리틱이무수물, 3,3′,4,4′-벤조페논테트라카르복실산이무수물, 3,3′,4,4′-비페닐테트라카르복실산이무수물, 3,3′,4,4′-디페닐에테르테트라카르복실산이무수물 또는 3,3′,4,4′-비페닐술폰테트라카르복실산이무수물 중의 하나 또는 둘 이상으로부터 선택된다.In the recombinant wooden board using the aforementioned polyimide modified urethane adhesive, the polyacid anhydride is pyromellitic dianhydride, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, 3,3', 4, 4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenylethertetracarboxylic dianhydride or 3,3 ′, 4,4′-biphenylsulfontetracarboxylic dianhydride Or at least two.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 폴리올은 중량 평균 분자량이 1000~4000인 폴리테트라히드로퓨란디올, 폴리옥시프로필렌디올, 테트라히드로퓨란-에틸렌옥사이드공중합디올, 폴리트리메틸렌에테르글리콜, 폴리에틸렌글리콜아디페이트디올 중의 하나 또는 둘 이상으로부터 선택된다.In a recombinant wooden board using the aforementioned polyimide modified urethane adhesive, the polyol is a polytetrahydrofurandiol having a weight average molecular weight of 1000 to 4000, polyoxypropylenediol, tetrahydrofuran-ethylene oxide copolymer diol, polytrimethylene ether glycol And polyethylene glycol adipate diols.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 가소제는 프탈레이트계, 테레프탈레이트계, 벤조에이트계 중의 하나 또는 둘 이상으로부터 선택된다.In a recombinant wood board using the polyimide modified urethane adhesive described above, the plasticizer is selected from one or more of phthalate based, terephthalate based, benzoate based.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판 중, 상기 촉매는 트리에탄올아민, 트리에틸렌디아민, 디부틸주석디라우레이트, Dabco33-LV 또는 아연나프탈레이트 중의 하나 또는 둘 이상으로부터 선택되고; 상기 소포제는 DF-520, DF-530, DF-899, DF-834, 디메틸실리콘유(dimethyl silicone oil) 중의 하나 또는 둘 이상으로부터 선택되며; 상기 탈수제는 트리에틸오르쏘포메이트(triethyl orthoformate), p-톨루엔술포닐이소시아네이트 중의 하나 또는 둘 이상으로부터 선택된다.In a recombinant wooden board using the aforementioned polyimide modified urethane adhesive, the catalyst is selected from one or two or more of triethanolamine, triethylenediamine, dibutyltin dilaurate, Dabco33-LV or zinc naphthalate; The antifoaming agent is selected from one or more of DF-520, DF-530, DF-899, DF-834, dimethyl silicone oil; The dehydrating agent is selected from one or more of triethyl orthoformate, p-toluenesulfonylisocyanate.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 커플링제는 γ-아미노프로필트리에톡시실란, γ-글리시독시프로필트리메톡시실란 또는 γ-(메타크릴로일옥시)프로필트리메톡시실란 중의 하나 또는 둘 이상으로부터 선택되고; 상기 항산화제는 트리에틸렌글리콜비스-[3-(3-tert-부틸-4-히드록시-5-메틸페닐)프로피오네이트], 3,5-디-tert-부틸-4-하이드록시페닐프로피온산옥타데카노에이트, 3,5-디-tert-부틸-4-하이드록시벤젠프로피오네이트 중의 하나 또는 둘 이상으로부터 선택된다.In a recombinant wooden board using the aforementioned polyimide modified urethane adhesive, the coupling agent is γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane or γ- (methacryloyloxy) propyltrime One or more of oxysilanes; The antioxidant is triethylene glycol bis- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate], 3,5-di-tert-butyl-4-hydroxyphenylpropionate octa Decanoate, 3,5-di-tert-butyl-4-hydroxybenzenepropionate.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에서, 상기 접착제의 은 순차적으로, 중량비에 따라 폴리올을 칭량하여 반응기에 넣어, 80~100℃까지 교반하면서 가열하고, 3~4시간 동안 진공 탈수 처리하며, 다시 실온까지 냉각시키는 폴리올 탈수 단계1); 소포제와 폴리산무수물을 더 넣고, 균일하게 혼합하여 조합료(composition material)를 얻는 조합료 배합 단계2); 조합료에 폴리이소시아네이트를 넣어, 80~90℃까지 교반하면서 가열하고, 기포가 생성되지 않을 때까지 항온 반응시킨 후 2~3시간 동안 계속하여 반응시켜, 폴리이미드를 함유한 예비 중합체를 제조하는 예비 중합체 제조 단계3); 가소제, 탈수제를 예비 중합체에 넣어, 진공 조건하에서 1~2시간 동안 교반하고, 뒤이어 혼합된 조성물에 항산화제, 커플링제와 촉매를 넣어, 진공 조건하에서 3시간 동안 교반하여, 최종적으로 폴리이미드 개질 우레탄 접착제를 얻는 접착제 제조 단계4)를 포함한다.In the recombinant wooden board using the polyimide-modified urethane adhesive described above, the silver of the adhesive was sequentially weighed, polyol was weighed into the reactor according to the weight ratio, heated to 80-100 ° C with stirring, and vacuum dewatered for 3-4 hours. Polyol dehydration step 1), followed by cooling to room temperature; A combination formulation step 2) further comprising a defoamer and a polyacid anhydride and uniformly mixed to obtain a composition material; The polyisocyanate was added to the mixture, heated to 80-90 ° C. while stirring, incubated until no bubbles were formed, and the reaction was continued for 2 to 3 hours to prepare a prepolymer containing polyimide. Polymer preparation step 3); The plasticizer and the dehydrating agent were added to the prepolymer, stirred for 1 to 2 hours under vacuum conditions, followed by the addition of an antioxidant, a coupling agent and a catalyst to the mixed composition for 3 hours under vacuum conditions, and finally a polyimide-modified urethane. Adhesive production step 4) to obtain the adhesive.
전술한 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판의 제조 방법은 구체적으로, 나무 껍질을 볏겨낸 후, 설비(equipment)로 해리시켜 다발(bundle) 모양의 섬유 스트립을 얻고, 다발 모양의 섬유 스트립을 건조시키는 단계a; 접착제를 열 압착 몰드에 넣고, 다발 모양의 섬유 스트립을 더 넣어 교반하며, 30분 동안 디핑(dipping)시키는 단계b; 열 압착 몰드 중의 재료를 열 압착하고, 경화시켜 재조합 블록보드를 얻는 단계c; 및 재조합 블록보드에 페인트층을 도포하고, 양측에 장부홈(Tongue and groove)을 열어 완성품을 얻는 단계d를 포함한다.The method for producing a recombinant wooden board using the polyimide-modified urethane adhesive described above is specifically, after the bark is cut off, it is dissociated with an equipment to obtain a bundle-shaped fiber strip, and the bundle-shaped fiber strip is obtained. Drying step a; Placing the adhesive in a thermocompression mold, stirring further with a bundle of fiber-like strips, and dipping for 30 minutes b; Thermocompressing and curing the material in the thermocompression mold to obtain a recombinant blockboard c; And d) applying a paint layer to the recombinant blockboard, and opening the groove and grooves at both sides to obtain a finished product.
선행 기술과 비교하여 보면, 본 발명은 빠르게 성장하는 나무, 불규칙적인 목재료, 심지어 남은 재료 또는 폐기물을 가공하여 섬유 다발(fiber bundle)을 얻고, 접착하고, 열 압착하여 재조합 나무판을 얻음으로써, 목재의 낭비를 효과적으로 감소하고, 목재 자원을 절감하는 동시에, 우월한 경제적 효익을 구비한다. 이 외에, 본 발명은 접착제의 배합 방법을 개선하여, 본 발명의 접착제는 합리적인 조성 성분과 배합비를 통해, 폴리이미드 사슬 세그먼트를 우레탄 접착제에 인입하여, 우레탄 접착제의 내 고온 성능을 효과적으로 개선하였고, 우레탄 접착제의 사용 온도 범위를 확장하였다. 동시에, 본 발명은 접착제 중 폴리이미드의 함량을 효과적으로 조절할 수 있을 뿐만 아니라, 폴리이미드 개질 우레탄 접착제를 사용한 나무 장판의 제조 공정을 간소화시키고, 폴리이미드 개질 우레탄 접착제를 사용한 나무 장판의 생산 원가를 줄였으며, 고성능 우레탄 접착제의 공업화 생산 및 국민 공업에서의 이의 광범위한 응용에 적극적인 추진 작용을 하였다. 이 외에, 본 발명은 폴리이미드 개질 우레탄 접착제의 제조 방법 및 상기 접착제를 사용한 나무 장판의 열처리 방법을 제공한다. 상기 방법은 우레탄 예비 중합 과정에서 직접 폴리산무수물 고체 분말을 넣어, 이소시아네이트기와 폴리산무수물간의 반응에 의해 폴리이미드를 형성하여, 폴리이미드의 생성과 인입 작업을 한 단계로 실현함으로써, 폴리이미드 개질 우레탄 접착제를 사용한 나무 장판의 제조 기술을 크게 간소화시키는 동시에, 접착제 중 폴리이미드 함량을 효과적으로 제어할 수 있다. 본 발명의 접착제를 개선하였음으로써, 역학 성능을 크게 향상시켰고, 점도, 압축 강도, 인장 강도, 불투과성 압력 등 방면에서 크게 향상시켰으며, 모두 우월한 효과가 있고, 환경 적응성이 좋으며, 사용 수명이 길다.Compared with the prior art, the present invention is directed to processing fast growing trees, irregular timber, and even remaining materials or waste to obtain fiber bundles, adhering and thermocompressing to obtain a recombinant wood board, It effectively reduces wood waste, saves wood resources, and has superior economic benefits. In addition, the present invention improves the method of blending the adhesive, and the adhesive of the present invention introduces the polyimide chain segment into the urethane adhesive through a rational compositional component and the mixing ratio, thereby effectively improving the high temperature performance of the urethane adhesive, and The use temperature range of the adhesive was extended. At the same time, the present invention not only can effectively control the content of polyimide in the adhesive, but also simplifies the manufacturing process of wooden board using polyimide modified urethane adhesive, and reduces the production cost of wooden board using polyimide modified urethane adhesive. In addition, it has actively promoted the industrial production of high performance urethane adhesive and its wide application in the national industry. In addition, the present invention provides a method for producing a polyimide-modified urethane adhesive and a method for heat-treating a wooden board using the adhesive. In the above method, a polyimide-modified urethane is formed by directly adding a polyacid anhydride solid powder in a urethane prepolymerization process to form a polyimide by a reaction between an isocyanate group and a polyacid anhydride, thereby producing and introducing a polyimide in one step. While greatly simplifying the manufacturing technique of wooden boards using adhesives, it is possible to effectively control the polyimide content in the adhesive. By improving the adhesive of the present invention, the mechanical performance is greatly improved, and in terms of viscosity, compressive strength, tensile strength, impermeable pressure, etc. are greatly improved, all have superior effects, good environmental adaptability, and long service life. .
본 발명은 나무 재료의 낭비를 효과적으로 감소하고, 목재 자원을 절감하는 동시에, 우월한 경제적 효익을 구비할 수 있다. 이 외에, 본 발명은 나무 장판의 점도와 투광성 및 장판 사이의 연결 강도를 향상시킬 수 있다.The present invention can effectively reduce the waste of wood materials, save wood resources, and have superior economic benefits. In addition, the present invention can improve the viscosity of the wooden floorboard and the connection strength between the light transmission and the floorboard.
실시예1.Example 1
폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에 있어서, 접착제로 섬유 스트립을 접착하고, 압착하여 제조된 재조합 블록보드, 상기 재조합 블록보드의 표면에 페인트층이 구비되고, 재조합 블록보드의 측면에 측면장부와 측면홈이 구비되며, 상기 접착제는 중량부에 따라 40중량부의 폴리테트라히드로퓨란디올(분자량은 2000임), 8.7중량부의 4,4'-디페닐메탄디이소시아네이트, 2.2중량부의 피로멜리틱이무수물, 0.8중량부의 디메틸실리콘유(dimethyl silicone oil), 0.06중량부의 트리에틸렌디아민, 20중량부의 디이소옥틸프탈레이트, 0.05중량부의 p-톨루엔술포닐이소시아네이트, 0.05중량부의 γ-아미노프로필트리에톡시실란, 0.05중량부의 3,5-디-tert-부틸-4-하이드록시페닐프로피온산옥타데카노에이트인 원료로 제조된다.Recombinant wooden board using a polyimide-modified urethane adhesive, Recombinant block board prepared by bonding a fiber strip with an adhesive, the compression is provided with a paint layer on the surface of the recombinant block board, side mounting on the side of the recombinant block board And side grooves, the adhesive is 40 parts by weight of polytetrahydrofurandiol (molecular weight is 2000), 8.7 parts by weight of 4,4'-diphenylmethane diisocyanate, 2.2 parts by weight of pyromellitic Anhydride, 0.8 parts by weight of dimethyl silicone oil, 0.06 parts by weight of triethylenediamine, 20 parts by weight of diisooctylphthalate, 0.05 parts by weight of p-toluenesulfonylisocyanate, 0.05 parts by weight of γ-aminopropyltriethoxysilane And 0.05 part by weight of 3,5-di-tert-butyl-4-hydroxyphenylpropionate octadecanoate.
구체적인 제조 단계 하기와 같다.Specific manufacturing steps are as follows.
1) 400g의 분자량이 2000인 폴리테트라히드로퓨란디올을 칭량하여 1L의 반응기에 넣어, 100℃까지 교반하면서 가열하고, 4시간 동안 진공 탈수 처리하며;1) 400 g of polytetrahydrofurandiol having a molecular weight of 2000 was weighed and placed in a 1 L reactor, heated with stirring to 100 ° C., and vacuum dewatered for 4 hours;
2) 탈수 처리 후 실온까지 냉각시킨 폴리테트라히드로퓨란디올에 순차적으로 8g의 디메틸실리콘유(dimethyl silicone oil)과 22g의 피로멜리틱이무수물을 넣어, 균일하게 기계적 교반하고;2) 8 g of dimethyl silicone oil and 22 g of pyromellitic dianhydride were sequentially added to polytetrahydrofurandiol cooled to room temperature after dehydration treatment, and uniformly mechanically stirred;
3) 상기 혼합 재료에 87g의 4,4'-디페닐메탄디이소시아네이트를 넣어, 90℃까지 교반하면서 가열하며, 기포가 생성되지 않을 때까지 항온 반응시킨 후 2시간 동안 계속하여 반응시켜, 폴리이미드를 함유한 예비 중합체를 제조하고; 3) 87 g of 4,4'-diphenylmethane diisocyanate was added to the mixed material, heated with stirring to 90 ° C, incubated until no bubbles were formed, and the reaction was continued for 2 hours. Preparing a prepolymer containing;
4) 제조된 예비 중합체에 순차적으로 200g의 디이소옥틸프탈레이트, 0.5g의 p-톨루엔술포닐이소시아네이트를 넣어, 진공 조건하에서 2시간 동안 교반하고, 뒤이어 혼합된 조성물에 0.6g의 트리에틸렌디아민, 0.5g의 γ-아미노프로필트리에톡시실란, 0.5g의 3,5-디-tert-부틸-4-하이드록시페닐프로피온산옥타데카노에이트를 넣어, 진공 조건하에서 3시간 동안 계속하여 교반하며, 최종적으로 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판을 얻는다.4) 200 g of diisooctylphthalate and 0.5 g of p-toluenesulfonyl isocyanate were sequentially added to the prepared prepolymer, followed by stirring for 2 hours under vacuum conditions, followed by 0.6 g of triethylenediamine, 0.5 to the mixed composition. g of γ-aminopropyltriethoxysilane and 0.5 g of 3,5-di-tert-butyl-4-hydroxyphenylpropionate octadecanoate were added and stirring continued under vacuum conditions for 3 hours, and finally A recombinant wooden board using a polyimide modified urethane adhesive is obtained.
상기 재조합 나무 장판의 생산 방법은 구체적으로 하기와 같은 단계를 포함한다.The production method of the recombinant wooden planks specifically includes the following steps.
나무 껍질을 벗겨낸 후, 설비로 해리시켜 다발 모양의 섬유 스트립을 얻고, 다발 모양의 섬유 스트립을 건조시키는 단계a;Peeling off the bark, dissociating with equipment to obtain a bundle of fiber strips, and drying the bundle of fiber strips a;
접착제를 열 압착 몰드에 넣고, 다발 모양의 섬유 스트립을 더 넣어 교반하며, 30분 동안 디핑시키는 단계b;Placing the adhesive in a thermocompression mold, further adding a bundle of fiber-like strips, stirring and dipping for 30 minutes b;
열 압착 몰드 중의 재료를 열 압착하고, 경화시켜 재조합 블록보드를 얻는 단계c; Thermocompressing and curing the material in the thermocompression mold to obtain a recombinant blockboard c;
재조합 블록보드에 페인트층을 도포하고, 양측에 장부홈을 형성하여 완성품을 얻는 단계d를 포함한다.Applying a paint layer on the recombinant blockboard, and forming a groove on both sides to obtain a finished product.
테스트 결과 본 실시예를 통해 얻은 접착제의 내열 온도를 180℃ 정도까지 향상시킬 수 있다.As a result of the test, the heat resistance temperature of the adhesive obtained through the present example may be improved to about 180 ° C.
폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판의 열처리 방법은, 규격적으로 반가공품을 가마에 넣어, 1분에 1℃씩 승온시키는 속도로 130℃까지 승온시키고, 이때 과열 포화 수증기를 통과시켜, 산소 함량을 2%로 제어하여, 1시간 동안 항온을 유지하도록 하며, 다시 1분에 1℃씩 승온시키는 속도로 200℃까지 승온시켜, 2시간 동안 항온을 유지하도록 하고, 1분에 1℃씩 감온시키는 속도로 130℃까지 감온시키며, 과열 포화 수증기를 닫고, 반시간 동안 항온을 유지하도록 하며, 1분에 1℃씩 감온시키는 속도로 80℃까지 감온시켜, 1시간 동안 항온을 유지하도록 하고, 가열 시스템을 닫으며, 40℃까지 자연 냉각시켜, 전원을 끄고 가마로부터 꺼낸다.In the heat treatment method of a recombinant wooden board using a polyimide-modified urethane adhesive, a semi-finished product is put into a kiln and the temperature is raised to 130 ° C at a rate of 1 ° C per minute. To 2%, to maintain a constant temperature for 1 hour, and again to increase the temperature to 200 ℃ at a rate to increase the temperature by 1 ℃ in 1 minute, to maintain a constant temperature for 2 hours, and to reduce the temperature by 1 ℃ per minute Decrease to 130 ° C at a rate, close superheated saturated water vapor, maintain constant temperature for half hour, reduce temperature to 80 ° C at a rate of 1 ° C per minute, maintain constant temperature for 1 hour, heating system Close, naturally cool to 40 ° C, turn off the power and remove from the kiln.
실시예2.Example 2.
폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에 있어서, 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판에 있어서, 접착제로 섬유 스트립을 접착하고, 압착하여 제조된 재조합 블록보드, 상기 재조합 블록보드의 표면에 페인트층이 구비되고, 재조합 블록보드의 측면에 측면장부와 측면홈이 구비되며, 상기 접착제는 중량부에 따라 35중량부의 테트라히드로퓨란-에틸렌옥사이드공중합디올(분자량은 3000임), 12.2중량부의 헥사메틸렌디이소시아네이트, 5중량부의 3,3′,4,4′-비페닐테트라카르복실산이무수물, 1.6중량부의 디메틸실리콘유(dimethyl silicone oil), 0.12중량부의 트리에틸렌디아민, 35중량부의 디이소옥틸프탈레이트, 0.13중량부의 트리에틸오르쏘포메이트(triethyl orthoformate), 0.3중량부의 γ-(메타크릴로일옥시)프로필트리메톡시실란, 0.08중량부의 3,5-디-tert-부틸-4-하이드록시벤젠프로피오네이트인 원료로 제조된다.In a recombinant wooden board using a polyimide-modified urethane adhesive, In a recombinant wooden board using a polyimide-modified urethane adhesive, Recombinant block board manufactured by adhering a fiber strip with an adhesive and pressing, Paint on the surface of the recombinant block board A layer is provided, and the side block and the side groove are provided on the side of the recombinant blockboard, and the adhesive is 35 parts by weight of tetrahydrofuran-ethylene oxide co-polymer diol (molecular weight is 3000), 12.2 parts by weight of hexamethylene Diisocyanate, 5 parts by weight of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 1.6 parts by weight of dimethyl silicone oil, 0.12 parts by weight of triethylenediamine, 35 parts by weight of diisooctylphthalate 0.13 parts of triethyl orthoformate, 0.3 parts of γ- (methacryloyloxy) propyltrimethoxysil And 0.08 are prepared as parts of 3,5-di -tert- butyl-4-hydroxy-benzene propionate raw material.
구체적인 제조 단계는 하기와 같다.Specific manufacturing steps are as follows.
1) 350g의 분자량인 3000인 테트라히드로퓨란-에틸렌옥사이드공중합디올을 칭량하여 2L의 반응기에 넣어, 95℃까지 교반하면서 가열하고, 4시간 동안 진공 탈수 처리하며;1) A tetrahydrofuran-ethylene oxide copolymerized diol having a molecular weight of 350 g of 3000 was weighed and placed in a 2 L reactor, heated with stirring to 95 ° C., and subjected to vacuum dehydration for 4 hours;
2) 탈수 처리한 후 실온까지 냉각시킨 테트라히드로퓨란-에틸렌옥사이드공중합디올에 순차적으로 16g의 디메틸실리콘유(dimethyl silicone oil)과 50g의 3,3′,4,4′-비페닐테트라카르복실산이무수물을 넣어, 균일하게 기계적 교반하고;2) 16 g of dimethyl silicone oil and 50 g of 3,3 ', 4,4'-biphenyltetracarboxylic acid were sequentially added to tetrahydrofuran-ethylene oxide copolymer diol which was cooled to room temperature after dehydration treatment. Anhydride was added and uniformly mechanically stirred;
3) 상기 혼합 재료에 122g의 헥사메틸렌디이소시아네이트를 넣어, 90℃까지 교반하면서 가열하고, 기포가 생성되지 않을 때까지 항온 반응시킨 후 계속하여 2시간 동안 반응시켜, 예비 중합체를 제조하며;3) 122 g of hexamethylene diisocyanate was added to the mixed material, heated with stirring to 90 ° C., incubated until no bubbles were formed, and then continued for 2 hours to prepare a prepolymer;
4) 제조된 예비 중합체에 순차적으로 350g의 디이소옥틸프탈레이트, 1.3g의 트리에틸오르쏘포메이트(triethyl orthoformate)을 넣어, 진공 조건하에서 2시간 동안 교반하고, 뒤이어 혼합된 조성물에 1.2g의 트리에틸렌디아민, 3g의 γ-(메타크릴로일옥시)프로필트리메톡시실란, 0.8g의 3,5-디-tert-부틸-4-하이드록시벤젠프로피오네이트를 넣어, 진공 조건하에서 3시간 동안 계속하여 교반하며, 최종적으로 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판을 얻는다.4) 350 g of diisooctylphthalate and 1.3 g of triethyl orthoformate were sequentially added to the prepared prepolymer, followed by stirring under vacuum conditions for 2 hours, followed by 1.2 g of triethylene in the mixed composition. Diamine, 3 g of γ- (methacryloyloxy) propyltrimethoxysilane, 0.8 g of 3,5-di-tert-butyl-4-hydroxybenzenepropionate were added, and the mixture was continued for 3 hours under vacuum conditions. And agitated to finally obtain a recombinant wooden board using a polyimide modified urethane adhesive.
상기 재조합 나무 장판의 생산 방법은 구체적으로 하기와 같은 단계를 포함한다. The production method of the recombinant wooden planks specifically includes the following steps.
나무 껍질을 벗겨낸 후, 설비로 해리시켜 섬유 다발 모양의 스트립을 얻고, 다발 모양의 섬유 스트립을 건조시키는 단계a;Peeling off the bark, followed by dissociation with equipment to obtain a fiber bundle strip, and drying the bundle fiber strip a;
접착제를 열 압착 몰드에 넣고, 다발 모양의 섬유 스트립을 더 넣어 교반하며, 30분 동안 디핑시키는 단계b;Placing the adhesive in a thermocompression mold, further adding a bundle of fiber-like strips, stirring and dipping for 30 minutes b;
열 압착 몰드 중의 재료를 열 압착하고, 경화시켜 재조합 블록보드를 얻는 단계c;Thermocompressing and curing the material in the thermocompression mold to obtain a recombinant blockboard c;
재조합 블록보드에 페인트층을 도포하고, 양측에 장부홈을 형성하여 완성품을 얻는 단계d를 포함한다.Applying a paint layer on the recombinant blockboard, and forming a groove on both sides to obtain a finished product.
테스트 결과 본 실시예를 통해 얻은 접착제의 내열 온도를 160℃ 정도까지 향상시킬 수 있다.As a result of the test, the heat resistance temperature of the adhesive obtained through the present example may be improved to about 160 ° C.
폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판의 열처리 방법은, 규격적으로 반가공품을 가마에 넣어, 1분에 1℃씩 승온시키는 속도로 130℃까지 승온시키고, 이때 과열 포화 수증기를 통과시켜, 산소 함량을 2%로 제어하여, 1시간 동안 항온을 유지하도록 하며, 다시 1분에 1℃씩 승온시키는 속도로 200℃까지 승온시켜, 2시간 동안 항온을 유지하도록 하고, 1분에 1℃씩 감온시키는 속도로 130℃까지 감온시키며, 과열 포화 수증기를 닫고, 반시간 동안 항온을 유지하도록 하며, 1분에 1℃씩 감온시키는 속도로 80℃까지 감온시켜, 1시간 동안 항온을 유지하도록 하고, 가열 시스템을 닫으며, 40℃까지 자연 냉각시켜, 전원을 끄고 가마로부터 꺼낸다.In the heat treatment method of a recombinant wooden board using a polyimide-modified urethane adhesive, a semi-finished product is put into a kiln and the temperature is raised to 130 ° C at a rate of 1 ° C per minute. To 2%, to maintain a constant temperature for 1 hour, and again to increase the temperature to 200 ℃ at a rate to increase the temperature by 1 ℃ in 1 minute, to maintain a constant temperature for 2 hours, and to reduce the temperature by 1 ℃ per minute Decrease to 130 ° C at a rate, close superheated saturated water vapor, maintain constant temperature for half hour, reduce temperature to 80 ° C at a rate of 1 ° C per minute, maintain constant temperature for 1 hour, heating system Close, naturally cool to 40 ° C, turn off the power and remove from the kiln.
실시예3. 접착력 종합 성능 테스트는 하기와 같다.Example 3. Adhesion comprehensive performance test is as follows.
전단강도는 GB7124-86에 따라 측정하고;Shear strength is measured according to GB7124-86;
박리강도는 GB/T7122-1996에 따라 측정한다.Peel strength is measured according to GB / T7122-1996.
실시예1과 2의 나무 장판을 취하고, 또 업계 내에서 흔히 사용하는 우레탄 접착제로 제조한 나무 장판을 취하여 대조군으로 하여, 각각 실온에서 24시간 동안 경화시키고, 3일째와 10일째에 이의 전단강도와 박리강도를 측정한 결과는 표1과 같다.Take the wood planks of Examples 1 and 2, and take wood planks made of urethane adhesives commonly used in the industry and as a control, cure for 24 hours at room temperature, respectively, and their shear strength and peeling on the 3rd and 10th The result of measuring the strength is shown in Table 1.
<나무 장판의 접착성 테스트><Adhesive test of wood board>
/KN·m-1 Peel Strength (20 ℃)
/ KNm -1
표1로부터 알 수 있는 바, 실시예1과 실시예2는25℃의 환경하에서, 전단강도는 대조군보다 현저하게 우수하고, 150℃의 환경하에서도 전단강도는 대조군보다 크게 우수하며, 효과가 아주 현저하다. 또한, 실시예1과 실시예2의 박리강도도 대조군보다 크게 우수하다. 이로써, 본 발명은 우월한 접착 성능을 가질 뿐만 아니라, 본 발명은 내 고온 성능을 효과적으로 개선하였고, 사용 온도 범위를 확장시켰음을 알 수 있다.As can be seen from Table 1, in Examples 1 and 2, the shear strength was significantly superior to the control under 25 ° C., and the shear strength was significantly superior to the control under 150 ° C., and the effect was very good. Remarkable In addition, the peel strength of Example 1 and Example 2 is also significantly better than the control. As such, the present invention not only has superior adhesion performance, but it can be seen that the present invention has effectively improved the high temperature resistance and extended the use temperature range.
Claims (10)
35중량부의 분자량이 3000인 테트라히드로퓨란-에틸렌옥사이드공중합디올, 12.2중량부의 헥사메틸렌디이소시아네이트, 5중량부의 3,3′,4,4′-비페닐테트라카르복실산이무수물, 1.6중량부의 디메틸실리콘유, 0.12중량부의 트리에틸렌디아민, 35중량부의 디이소옥틸프탈레이트, 0.13중량부의 트리에틸오르쏘포메이트, 0.3중량부의 γ-(메타크릴로일옥시)프로필트리메톡시실란, 0.08중량부의 3,5-디-tert-부틸-4-하이드록시벤젠프로피오네이트인 원료로 제조되는 것을 특징으로 하는 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판.Recombinant block board prepared by bonding the fiber strip with an adhesive, and the compression, the paint layer is provided on the surface of the recombinant block board, the side face and side grooves are provided on the side of the recombinant block board, the adhesive is follow
35 parts by weight of tetrahydrofuran-ethylene oxide copolymer diol, 12.2 parts by weight of hexamethylene diisocyanate, 5 parts by weight of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 1.6 parts by weight of dimethylsilicone Oil, 0.12 parts by weight of triethylenediamine, 35 parts by weight of diisooctylphthalate, 0.13 parts by weight of triethylorthoformate, 0.3 parts by weight of γ- (methacryloyloxy) propyltrimethoxysilane, 0.08 parts by weight of 3,5 A recombinant wooden board using a polyimide-modified urethane adhesive, which is prepared from a raw material which is -di-tert-butyl-4-hydroxybenzenepropionate.
상기 접착제의 제조 방법은 순차적으로,
중량비에 따라 분자량이 3000인 테트라히드로퓨란-에틸렌옥사이드공중합디올을 칭량하여 반응기에 넣어, 80~100℃까지 교반하면서 가열하고, 3~4시간 동안 진공 탈수 처리하며, 다시 실온까지 냉각시키는 폴리올 탈수 단계1);
디메틸실리콘유와 3,3′,4,4′-비페닐테트라카르복실산이무수물을 더 넣고, 균일하게 혼합하여 조합료를 얻는 조합료 배합 단계2);
조합료에 헥사메틸렌디이소시아네이트를 넣어, 80~90℃까지 교반하면서 가열하고, 기포가 생성되지 않을 때까지 항온 반응시킨 후 2~3시간 동안 계속하여 반응시켜, 폴리이미드를 함유한 예비 중합체를 제조하는 예비 중합체 제조 단계3);
디이소옥틸프탈레이트, 트리에틸오르쏘포메이트를 예비 중합체에 넣어, 진공 조건하에서 1~2시간 동안 교반하고, 뒤이어 혼합된 조성물에 트리에틸렌디아민, γ-(메타크릴로일옥시)프로필트리메톡시실란과 3,5-디-tert-부틸-4-하이드록시벤젠프로피오네이트를 넣어, 진공 조건하에서 3시간 동안 교반하여, 최종적으로 폴리이미드 개질 우레탄 접착제를 얻는 접착제 제조 단계4)를 포함하는 것을 특징으로 하는 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판.The method of claim 1,
The manufacturing method of the adhesive is sequentially,
According to the weight ratio, tetrahydrofuran-ethylene oxide copolymerized diol having a molecular weight of 3000 was weighed and put into a reactor, heated with stirring to 80 to 100 ° C, vacuum dewatered for 3 to 4 hours, and then cooled to room temperature. One);
A compound mixing step 2) further comprising dimethylsilicone oil and 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, and uniformly mixing to obtain a mixture;
Hexamethylene diisocyanate was added to the mixture, heated to 80-90 ° C while stirring, incubated until no bubbles were formed, and the reaction was continued for 2 to 3 hours to prepare a prepolymer containing polyimide. Prepolymer preparation step 3);
Diisooctylphthalate and triethyl orthoformate were added to the prepolymer and stirred for 1 to 2 hours under vacuum conditions, followed by triethylenediamine and γ- (methacryloyloxy) propyltrimethoxysilane in the mixed composition. And 3,5-di-tert-butyl-4-hydroxybenzenepropionate, and stirred for 3 hours under vacuum conditions to finally prepare an adhesive 4) to obtain a polyimide-modified urethane adhesive. Recombinant wooden board using polyimide modified urethane adhesive.
나무 껍질을 볏겨낸 후, 설비로 해리시켜 다발 모양의 섬유 스트립을 얻고, 다발 모양의 섬유 스트립을 건조시키는 단계a;
접착제를 열 압착 몰드에 넣고, 다발 모양의 섬유 스트립을 더 넣어 교반하며, 30분 동안 디핑(dipping)시키는 단계b;
열 압착 몰드 중의 재료를 열 압착하고, 경화시켜 재조합 블록보드를 얻는 단계c;
재조합 블록보드에 페인트층을 도포하고, 양측에 장부홈을 형성하여 완성품을 얻는 단계d를 포함하는 것을 특징으로 하는 폴리이미드 개질 우레탄 접착제를 사용한 재조합 나무판의 제조방법.In the method for producing a recombinant wooden board using the polyimide-modified urethane adhesive according to any one of claims 1 to 2,
Cutting off the bark, dissociating with equipment to obtain a bundle of fiber strips, and drying the bundle of fiber strips a;
Placing the adhesive in a thermocompression mold, stirring further with a bundle of fiber-like strips, and dipping for 30 minutes b;
Thermocompressing and curing the material in the thermocompression mold to obtain a recombinant blockboard c;
A method of manufacturing a recombinant wooden board using a polyimide-modified urethane adhesive, comprising the step of applying a paint layer to the recombinant blockboard, forming a groove on both sides to obtain a finished product.
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| CN201610235047.5A CN105670551B (en) | 2016-04-14 | 2016-04-14 | Using the reconstructed and preparation method thereof of polyimide modified adhesive for polyurethane |
| PCT/CN2016/092776 WO2017177578A1 (en) | 2016-04-14 | 2016-08-02 | Recombined wooden board using polyimide-modified polyurethane adhesive and preparation method therefor |
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| CN112646535B (en) * | 2020-12-23 | 2022-07-12 | 广东龙马新材料科技有限公司 | High-strength environment-friendly wood board adhesive and preparation method thereof |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB712486A (en) | 1951-04-13 | 1954-07-28 | Thomas Frederick Summerton | Improvements in and relating to sewing machines |
| JPS6147775A (en) * | 1984-08-14 | 1986-03-08 | Dainippon Ink & Chem Inc | Adhesive composition for composite laminate film |
| KR970033006A (en) * | 1995-12-27 | 1997-07-22 | 김광호 | Vacuum heating stirring device |
| US6541122B2 (en) * | 2000-03-28 | 2003-04-01 | Ube Industries, Ltd. | Roll of metal film/aromatic polyimide film composite web |
| TW200305587A (en) * | 2002-03-19 | 2003-11-01 | Rohm & Haas | Urethane polymer compositions |
| CN1277894C (en) * | 2002-04-26 | 2006-10-04 | 东洋油墨制造株式会社 | Solventless adhesive and its application |
| CN101230125B (en) * | 2008-02-29 | 2010-12-01 | 安徽大学 | Preparation method of water-soluble alcohol-soluble polyurethane |
| CN101967363B (en) * | 2010-10-15 | 2012-10-03 | 济南大学 | Isocyanate/polyethylene terephthalate (PET) aqueous emulsion adhesive, preparation method thereof and use thereof |
| CN102009424A (en) * | 2010-11-03 | 2011-04-13 | 久盛地板有限公司 | Production technology of wood fiber bundle floor and product |
| CN104031241A (en) * | 2013-03-09 | 2014-09-10 | 东莞市长安东阳光铝业研发有限公司 | Preparing method of organosilicon-modified polyurethane-imide material and applications of the material |
| JP6232723B2 (en) * | 2013-03-29 | 2017-11-22 | 東洋インキＳｃホールディングス株式会社 | Adhesive and adhesive sheet using the same |
| CN104929344A (en) * | 2015-06-25 | 2015-09-23 | 久盛地板有限公司 | Restructured wooden floor and preparation method thereof |
| CN105670551B (en) * | 2016-04-14 | 2018-11-30 | 久盛地板有限公司 | Using the reconstructed and preparation method thereof of polyimide modified adhesive for polyurethane |
| CN105838312A (en) * | 2016-04-14 | 2016-08-10 | 久盛地板有限公司 | Wood flooring adopting polyimide-modified polyurethane adhesive and thermal treatment method of wood flooring |
| CN105860912A (en) * | 2016-04-14 | 2016-08-17 | 久盛地板有限公司 | Polyimide modified polyurethane adhesive and preparing method thereof |
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