CN113462339B - Preparation method of sebum and sweat resistant moisture-curing polyurethane hot melt adhesive - Google Patents
Preparation method of sebum and sweat resistant moisture-curing polyurethane hot melt adhesive Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4202—Two or more polyesters of different physical or chemical nature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention discloses a preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat.A phthalic anhydride polyester polyol, polytetrahydrofuran ether glycol, adipic acid polyester polyol, tackifying resin and an antioxidant are added into a kettle to be uniformly mixed, the temperature is raised to 120-130 ℃, and the dehydration is carried out for 2 hours under the vacuum degree of less than 100 Pa; cooling to 75-95 ℃, adding MDI and a catalyst, and reacting for 2h under the conditions that the vacuum degree is less than 100Pa and the temperature is 85-90 ℃; adding a stabilizer and a latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃; then quickly discharging and packaging under the protection of nitrogen. The preparation process is relatively simple and convenient, and under the synergistic action of various raw materials, the PUR hot melt adhesive prepared by the invention improves the acid and alkali sweat and sebum resistance on the premise of ensuring the general performance of the electronic PUR.
Description
Technical Field
The invention designs a preparation method of a moisture-curing polyurethane hot melt adhesive, in particular relates to a preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat, and belongs to the field of chemical adhesives.
Background
The moisture-curing polyurethane hot melt adhesive (hereinafter referred to as PUR) not only has the advantages of quick bonding and positioning and higher initial bonding strength of the traditional thermoplastic hot melt adhesive, but also can be further cured and crosslinked, so that the bonding force, the cohesive strength and the like of the adhesive layer can be obviously improved. Therefore, the moisture-curing polyurethane hot melt adhesive is widely applied to bonding of textile compounding, rubber, plastics, metal and automobile manufacturing, textile industry, shoe making industry, book binding, wood industry, furniture industry, electronic industry and the like.
With the rapid development of intelligent wearable products, the requirements on the PUR hot melt adhesive for electronics are also improved. Generally, a lot of unsaturated ester bonds are contained in the PUR hot melt adhesive, which affects the acid and alkali resistance and oil resistance of the PUR hot melt adhesive. And in the use of product is dressed to intelligence, the human body can secrete a large amount of sweat and sebum secretion, and under the long-time effect of these secretions, the adhesion strength of PUR hot melt adhesive can descend by a wide margin to cause the degumming of intelligent wearing product and even damage. Therefore, on the premise of ensuring the general performance of the PUR hot melt adhesive for the electronics, the improvement of the acid, alkali, sweat and sebum resistance of the PUR hot melt adhesive becomes a hot point.
Patent CN106634776B discloses a preparation method of sweat-resistant polyurethane hot melt adhesive, which mainly comprises mixing and dehydrating two strong hydrophobic monomers, cooling, adding a catalyst and polyisocyanate, stirring for reaction, and then adding a silane modifier for reaction to prepare a silane end-capped modified prepolymer; then the prepolymer is added after the dehydration step and the reaction step with MDI are finished in a conventional PUR system, and the reaction is carried out to prepare the sweat-resistant PUR. The scheme can enable the PUR product to obtain excellent sweat corrosion resistance, but the preparation steps are complex, the production efficiency is low, the sebum resistance is poor, the attenuation rate after soaking for 24 hours is more than 30%, and the performance is to be improved.
Disclosure of Invention
The invention aims to solve the technical problems and provides a preparation method of a moisture-cured polyurethane hot melt adhesive with sebum and sweat resistance.
The technical scheme adopted by the invention is as follows: a preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat comprises the following steps:
(1) Adding 10-20 parts by mass of phthalic anhydride polyester polyol, 30-40 parts by mass of polytetrahydrofuran ether glycol, 10-20 parts by mass of adipic acid polyester polyol, 10-21 parts by mass of tackifying resin and 0.1 part by mass of antioxidant into a reaction kettle, stirring and mixing uniformly, heating to 120-130 ℃, and dehydrating for 2 hours under the vacuum degree of less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 16.7-19.7 parts of 4,4' -diphenylmethane diisocyanate (MDI for short) and 0.05 part of catalyst, and reacting for 2 hours under the conditions that the vacuum degree is less than 100Pa and the temperature is 85-90 ℃;
(3) Adding 0.05 part of stabilizer and 0.1 part of latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) And rapidly discharging under the protection of nitrogen and packaging to obtain the product.
In the step (1), the phthalic anhydride polyester polyol is one of polyethylene glycol phthalate or neopentyl glycol phthalate glycol, the molecular weight of the polyethylene glycol phthalate is 3500, and the molecular weight of the neopentyl glycol phthalate is 2000; the molecular weight of the polytetrahydrofuran ether glycol is 1000 or 2000; the molecular weight of the adipic polyester polyol is 3000.
The tackifying resin is TPU resin, and the molecular weight of the TPU resin is 15000 or 30000; the antioxidant is under the brand name of 1010 or 1076.
In the step (2), the catalyst is stannous octoate;
in the step (3), the stabilizer is phosphoric acid; the latent curing agent is an aldimine latent curing agent.
The innovation and the beneficial effects of the invention are as follows: a unique raw material proportion and a preparation process are designed, particularly in the initial reaction step, polytetrahydrofuran ether glycol containing more methylene is used for replacing conventional polypropylene oxide glycol, and meanwhile, special tackifier-TPU resin is added, so that the cohesive strength of a system and the acid and alkali sweat and sebum resistance are improved. The preparation process is relatively simple and convenient, and under the synergistic effect of various raw materials, the PUR hot melt adhesive prepared by the invention improves the properties of acid and alkali sweat resistance and sebum resistance on the premise of ensuring the general performance of the electronic PUR.
Detailed Description
The invention is further illustrated by the following examples, without restricting it.
The raw material and test information involved in the performance test and the embodiments of the present invention are as follows:
polyethylene glycol phthalate, molecular weight 3500, trade mark L3017;
poly neopentyl glycol phthalate glycol, molecular weight 2000, designation a3030;
polytetrahydrofuran ether glycol, molecular weight 1000, basf corporation;
adipic acid polyester polyol, molecular weight 3000, trade name XCP-3000H;
tackifying resin: TPU resins, molecular weight 15000 or 30000, lu Borun;
MDI, water white solid, japan NPO corporation;
catalyst: stannous octoate;
aldimine latent curing agent: the brand is Incorez2;
acid-base sweat: acidic sweat ph4.7, alkaline sweat ph 9.3;
the main components of the sebum are: 40% of triolein, 26% of oleic acid, 20% of wax ester, 10% of squalane, 2% of palmitic acid and 2% of cholesterol.
Example 1
A preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat comprises the following steps:
(1) Adding 20 parts of polyethylene glycol phthalate, 40 parts of polytetrahydrofuran ether glycol (molecular weight is 1000), 10 parts of adipic acid polyester polyol, 10 parts of TPU resin (molecular weight is 15000) and 0.1 part of antioxidant (brand 1010) into a reaction kettle, stirring uniformly, heating to 120-130 ℃, and dehydrating for 2 hours under the condition that the vacuum degree is less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 19.7 parts of MDI and 0.05 part of catalyst, and reacting for 2 hours under the conditions that the vacuum degree is less than 100Pa and the temperature is 85-90 ℃;
(3) Adding 0.05 part of phosphoric acid and 0.1 part of aldehyde imine latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) And rapidly discharging under the protection of nitrogen and packaging to obtain the product.
The product sample prepared from example 1 is labeled a.
Example 2
A preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat comprises the following steps:
(1) Adding 10 parts of poly neopentyl glycol phthalate glycol, 32 parts of polytetrahydrofuran ether glycol (molecular weight is 1000), 20 parts of adipic acid polyester polyol, 21 parts of TPU resin (molecular weight is 30000) and 0.1 part of antioxidant (brand number is 1076) into a reaction kettle, uniformly stirring, heating to 120-130 ℃, and dehydrating for 2 hours under the condition that the vacuum degree is less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 16.7 parts of MDI and 0.05 part of catalyst, and stirring for reaction for 2 hours under the conditions that the temperature is 85-90 ℃ and the vacuum degree is less than 100 Pa;
(3) Adding 0.05 part of phosphoric acid and 0.1 part of aldehyde imine latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) And rapidly discharging under the protection of nitrogen and packaging to obtain the product.
The product sample prepared from example 2 is labeled B.
Example 3
A preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat comprises the following steps:
(1) Adding 15 parts of neopentyl glycol phthalate glycol, 35 parts of polytetrahydrofuran ether glycol (molecular weight 2000), 16 parts of adipic acid polyester polyol, 15 parts of TPU resin (molecular weight 15000) and 0.1 part of antioxidant (trade name 1076) into a reaction kettle, uniformly stirring, heating to 120-130 ℃, and dehydrating for 2 hours under the condition that the vacuum degree is less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 18.7 parts of MDI and 0.05 part of catalyst, and stirring for reaction for 2 hours under the conditions that the temperature is 85-90 ℃ and the vacuum degree is less than 100 Pa;
(3) Adding 0.05 part of phosphoric acid and 0.1 part of aldehyde imine latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) And rapidly discharging under the protection of nitrogen and packaging to obtain the product.
The product sample prepared from example 3 was labeled C.
Example 4
A preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat comprises the following steps:
(1) Adding 20 parts of neopentyl glycol phthalate glycol, 40 parts of polytetrahydrofuran ether glycol (molecular weight 2000), 10 parts of adipic acid polyester polyol, 10 parts of TPU resin (molecular weight 15000) and 0.1 part of antioxidant (brand 1010) into a reaction kettle, uniformly stirring, heating to 120-130 ℃, and dehydrating for 2 hours under the condition that the vacuum degree is less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 19.7 parts of MDI and 0.05 part of catalyst, and stirring for reaction for 2 hours under the conditions that the temperature is 85-90 ℃ and the vacuum degree is less than 100 Pa;
(3) Adding 0.05 part of phosphoric acid and 0.1 part of aldehyde imine latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) And rapidly discharging under the protection of nitrogen and packaging to obtain the product.
The product sample prepared from example 4 was labeled D.
Example 5
A preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat comprises the following steps:
(1) Adding 16 parts of neopentyl glycol phthalate glycol, 30 parts of polytetrahydrofuran ether glycol (molecular weight is 1000), 20 parts of adipic acid polyester polyol, 16 parts of TPU resin (molecular weight is 30000) and 0.1 part of antioxidant (brand 1010) into a reaction kettle, uniformly stirring, heating to 120-130 ℃, and dehydrating for 2 hours under the condition that the vacuum degree is less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 17.7 parts of MDI and 0.05 part of catalyst, and stirring for reaction for 2 hours at the temperature of 85-90 ℃ and the vacuum degree of less than 100 Pa;
(3) Adding 0.05 part of phosphoric acid and 0.1 part of aldehyde imine latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) And rapidly discharging under the protection of nitrogen and packaging to obtain the product.
The product sample prepared from example 5 is labeled E.
Application testing
The test procedure for acid and alkali sweat and sebum resistance was: firstly, respectively preparing samples and testing the shear strength of a PC material adhered with the PUR hot melt adhesive by referring to GB/T7124-2008; then, respectively soaking the sample in ph4.7 sweat, ph9.3 sweat and sebum test solution for 24h, 168h and 336h; and finally testing the shearing strength of the sample stuck PC material after soaking. And calculating the attenuation rate of the shear strength, and representing the sebum and sweat resistance performance through the attenuation rate. The specific values of the decay rates of the shear strength of the acidic sweat, the basic sweat, and the sebum sample are shown in tables 1, 2, and 3 below.
Table 1: shear strength decay rate after soaking in acidic sweat.
Table 2: rate of shear strength decay after soaking in alkaline sweat.
Table 3: shear strength decay rate after sebum test solution.
Meanwhile, the inventor also tests other general performances (peel strength and tensile strength), and the general performance of the PUR product prepared by the invention is equal to that of the conventional mature PUR for electronics.
In the aspect of sweat and sebum resistance, as is apparent from the above tables 1 to 3, compared with the existing mature electronic PUR, the PUR product prepared by the method provided by the invention is greatly improved, and can meet the specific requirements in the fields of handheld communication equipment, wearable electronic products and the like.
Claims (4)
1. A preparation method of a moisture-curing polyurethane hot melt adhesive resistant to sebum and sweat is characterized by comprising the following steps:
(1) Adding 10-20 parts by mass of phthalic anhydride polyester polyol, 30-40 parts by mass of polytetrahydrofuran ether glycol, 10-20 parts by mass of adipic acid polyester polyol, 10-21 parts by mass of tackifying resin and 0.1 part by mass of antioxidant into a reaction kettle, stirring and mixing uniformly, heating to 120-130 ℃, and dehydrating for 2 hours under the vacuum degree of less than 100 Pa;
(2) Cooling to 75-95 ℃, adding 16.7-19.7 parts of 4,4' -diphenylmethane diisocyanate and 0.05 part of catalyst, and reacting for 2 hours under the conditions that the vacuum degree is less than 100Pa and the temperature is 85-90 ℃;
(3) Adding 0.05 part of stabilizer and 0.1 part of latent curing agent, and rapidly stirring for 30min under the conditions that the vacuum degree is less than 100Pa and the temperature is 110-120 ℃;
(4) Rapidly discharging under the protection of nitrogen and packaging to obtain the product;
in the step (1), the tackifying resin is TPU resin, and the molecular weight of the tackifying resin is 15000 or 30000;
in the step (1), the phthalic anhydride polyester polyol is one of polyethylene glycol phthalate glycol or neopentyl glycol phthalate glycol.
2. The method of preparing a sebum and sweat resistant moisture curable polyurethane hot melt adhesive of claim 1, wherein: the molecular weight of the polytetrahydrofuran ether glycol is 1000 or 2000; the molecular weight of the polyethylene glycol phthalate is 3500; the molecular weight of the poly neopentyl glycol phthalate glycol is 2000; the molecular weight of the adipic acid polyester polyol is 3000.
3. The method of preparing a sebum and sweat resistant moisture curable polyurethane hot melt adhesive of claim 1, wherein: in the step (2), the catalyst is stannous octoate.
4. The method of preparing a sebum and sweat resistant moisture curable polyurethane hot melt adhesive of claim 1, wherein: in the step (3), the stabilizer is phosphoric acid, and the latent curing agent is an aldimine latent curing agent.
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| CN202010234658.4A CN113462339B (en) | 2020-03-30 | 2020-03-30 | Preparation method of sebum and sweat resistant moisture-curing polyurethane hot melt adhesive |
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| CN202010234658.4A CN113462339B (en) | 2020-03-30 | 2020-03-30 | Preparation method of sebum and sweat resistant moisture-curing polyurethane hot melt adhesive |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016063784A1 (en) * | 2014-10-21 | 2016-04-28 | Dic株式会社 | Adhesive tape, method for manufacturing same, article and portable electronic terminal |
| CN105925230A (en) * | 2015-02-27 | 2016-09-07 | H.B.富乐公司 | Oily Chemical Resistant Articles And Oily Chemical Resistant Moisture Curable Hot Melt Adhesive Compositions |
| CN107987779A (en) * | 2017-12-08 | 2018-05-04 | 杭州之江有机硅化工有限公司 | A kind of reaction type polyurethane hot-melt adhesive and its preparation method and application |
| CN110467898A (en) * | 2018-05-10 | 2019-11-19 | 上海本诺电子材料有限公司 | A kind of PUR adhesive and preparation method thereof |
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2020
- 2020-03-30 CN CN202010234658.4A patent/CN113462339B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016063784A1 (en) * | 2014-10-21 | 2016-04-28 | Dic株式会社 | Adhesive tape, method for manufacturing same, article and portable electronic terminal |
| CN105925230A (en) * | 2015-02-27 | 2016-09-07 | H.B.富乐公司 | Oily Chemical Resistant Articles And Oily Chemical Resistant Moisture Curable Hot Melt Adhesive Compositions |
| CN107987779A (en) * | 2017-12-08 | 2018-05-04 | 杭州之江有机硅化工有限公司 | A kind of reaction type polyurethane hot-melt adhesive and its preparation method and application |
| CN110467898A (en) * | 2018-05-10 | 2019-11-19 | 上海本诺电子材料有限公司 | A kind of PUR adhesive and preparation method thereof |
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Address after: 226413 group 9, Gangcheng village, Changsha Town, Rudong County, Nantong City, Jiangsu Province Applicant after: NANTONG TIANYANG NEW MATERIAL CO.,LTD. Applicant after: Tianyang New Material (Shanghai) Technology Co.,Ltd. Applicant after: Kunshan Tianyang New Material Co.,Ltd. Address before: 226413 group 9, Gangcheng village, Changsha Town, Rudong County, Nantong City, Jiangsu Province Applicant before: NANTONG TIANYANG NEW MATERIAL CO.,LTD. Applicant before: SHANGHAI TIANYANG HOT MELT ADHESIVE Co.,Ltd. Applicant before: KUNSHAN TIANYANG HOT MELT ADHESIVE Co.,Ltd. |
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