KR102008491B1 - Photosensitive resin composition for organic insulator - Google Patents

Abstract

The present invention relates to a photosensitive resin composition suitable for an organic insulating film of various display processes, and more particularly, it is possible not only to obtain high flatness, sensitivity, heat resistance, transparency and adhesion, but also to maintain a high residual film ratio. It is related with the photosensitive resin composition for organic insulating films which improved.

Description

Photosensitive resin composition for organic insulators

The present invention relates to a photosensitive resin composition suitable for an organic insulating film of various display processes, and more particularly, it is possible not only to obtain high flatness, sensitivity, heat resistance, transparency and adhesion, but also to maintain a high residual film ratio. It is related with the photosensitive resin composition for organic insulating films which improved.

The photosensitive resin composition for an organic insulating film is a plastic optical component, various display panels, such as a liquid crystal display (LCD), a plasma display (PDP), a cathode ray tube (CRT), an electroluminescent display (EL), a protective film, a flattening film, It is used for the purpose of electrode wiring connection.

TFT-LCD (Thin Film Transistor Liquid Crystal Dispaly) refers to display by applying an electrical signal after forming a panel by introducing a color filter layer and a liquid crystal layer to the organic substrate formed TFT-array. In order to form a TFT-array, a photosensitive resin composition for an organic insulating film that protects electrodes and can be connected by wires is required. In recent years, research on TFT-LCD has focused on improving the resolution, and in order to realize high resolution, it has to be excellent in pattern development while maintaining a high residual film ratio of the photosensitive resin composition for an organic insulating film.

The conventional photosensitive resin composition for organic insulating films has a problem that the residual film ratio is lowered when the pattern developability is excellent, and the pattern developability is lowered when the residual film ratio is excellent, thereby decreasing the size of the hole pattern.

An object of the present invention is to provide a photosensitive resin composition for an organic insulating film which not only has excellent flatness, sensitivity, heat resistance, transparency, residual film ratio, etc., but also excellent pattern developability and maintains a high residual film ratio.

In order to achieve the above object, one embodiment of the present invention comprises [A] alkali soluble resin, [B] unsaturated unsaturated monomer, [C] photoinitiator and [D] solvent, [B] The unsaturated ethylenic monomer provides b-1) an unsaturated ethylene monomer represented by the following Chemical Formula 1 and b-2) an ethylene monomer having a trifunctional or more than three functional unsaturated group. .

<Formula 1>

In Formula 1, R is an alkyl group having 1 to 6 carbon atoms, an aliphatic hydrocarbon group or a phenyl group.

In a preferred embodiment of the present invention, b-1) the monomer represented by Formula 1 may be characterized in that the weight average molecular weight of 100 to 2,000g / mol.

In a preferred embodiment of the present invention, the hard coating photosensitive resin composition is [A] alkali soluble resin 5 to 80% by weight, [B] unsaturated unsaturated ethylene monomer 5 to 60% by weight, [C] photoinitiator 0.5 ~ 20 to 80% by weight and the solvent [D] 20 to 80% by weight.

In a preferred embodiment of the present invention, the [A] alkali soluble resin is selected from the group consisting of a-1) unsaturated carboxylic acids, unsaturated carboxylic anhydrides and mixtures thereof, a-2) epoxy group-containing unsaturated compounds and a-3) It is characterized by being the copolymer resin of an olefinic unsaturated compound.

In a preferred embodiment of the present invention, the [A] alkali soluble resin may be characterized in that the weight average molecular weight of 5,000 to 40,000g / mol.

In a preferred embodiment of the present invention, the hard coating photosensitive resin composition may be characterized in that the room temperature viscosity is 3 to 30cps.

Another embodiment of the present invention is a display device including the organic insulating layer.

The photosensitive resin composition according to the present invention is an organic insulating film suitable for high resolution display with a composition having excellent flatness, sensitivity, heat resistance and transparency, and particularly having a high residual film ratio and excellent pattern shape.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In general, the nomenclature used herein is well known and commonly used in the art.

Throughout this specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding the other components unless specifically stated otherwise.

The present invention consistently includes the [A] alkali soluble resin, the [B] unsaturated ethylenic monomer, the [C] photopolymerization initiator and the [D] solvent, wherein the [B] unsaturated unsaturated monomer is b-1. The present invention relates to an unsaturated ethylene monomer represented by the following formula (1) and b-2) an ethylene monomer having a trifunctional or higher unsaturated group.

<Formula 1>

In Formula 1, R is an alkyl group having 1 to 6 carbon atoms, an aliphatic hydrocarbon group or a phenyl group.

Hereinafter, the present invention will be described in more detail.

The photosensitive resin composition for hard coating according to the present invention comprises a-1) a compound selected from the group consisting of unsaturated carboxylic acids, unsaturated carboxylic anhydrides and mixtures thereof, a-2) epoxy group-containing unsaturated compounds and a-3) olefins [A] alkali-soluble resin which is a copolymer resin of an unsaturated compound; b-1) [B] unsaturated ethylene monomer comprising an unsaturated ethylene monomer represented by Formula 1 and b-2) an ethylene monomer having a tri- or higher functional unsaturated group; [C] photoinitiator and [D] solvent.

Looking at each component of the photosensitive resin composition according to the invention in detail.

 [A] Alkali Soluble Resin

The alkali soluble resin [A] used in the present invention is selected from the group consisting of a-1) unsaturated carboxylic acids, unsaturated carboxylic anhydrides and mixtures thereof, a-2) epoxy group-containing unsaturated compounds and a-3) olefins. It may be a copolymer resin of the unsaturated compound.

The compound selected from the group consisting of a-1) unsaturated carboxylic acid, unsaturated carboxylic anhydride and mixtures thereof includes acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid and Anhydrides alone or in combination of these dicarboxylic acids can be used. Of these, acrylic acid, methacrylic acid, maleic anhydride and the like are preferably used in view of easy polymerization polymerization resistance, heat resistance and availability. The a-1) monomer is preferably contained in 1 to 15% by weight of the alkali soluble resin [A].

In addition, the a-2) epoxy group-containing unsaturated compound is glycidyl methacrylate, glycidyl acrylate, glycidyl methacrylate, α-ethyl acrylate glycidyl ester, and α-n-propyl acrylate. Cydyl ester, α-n-butyl acrylate glycidyl ester, acrylic acid-3,4-epoxybutyl ester, methacrylic acid-3,4-epoxybutyl ester, acrylic acid-6,7-epoxyheptyl ester, methacrylic acid -6,7-epoxyheptyl ester, α-ethylacrylic acid-6,7-epoxyheptyl ester, o-vinylbenzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, and the like. It is preferably used in view of increasing copolymerization reactivity and heat resistance and hardness of the obtained thin film. These compounds are used alone or in combination. The a-2) monomer is preferably contained in 1 to 15% by weight of the alkali soluble resin [A].

As the a-3) olefin unsaturated compound, styrene, o-methyl styrene, m-methyl styrene, p-methyl styrene, vinyl toluene, p-methoxy styrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinyl chloride Leaden, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, dicyclopentyl acrylate, and the like. The a-3) monomer is preferably contained in 1 to 30% by weight of the alkali soluble resin [A].

Such an alkaline soluble resin [A] may have a solid content of 10 to 70 wt% with respect to the [A] component, and more preferably 20 to 50 wt%. If the solid content is less than 10% by weight, there is a tendency to solidify due to poor polymerization control when preparing a polymer containing both the preservation safety of the copolymer [A] and the components of [a1] to [a3]. When exceeding%, there exists a tendency for developability, heat resistance, surface hardness, etc. of copolymer [A] to fall.

It is preferable that [A] alkali-soluble resin which is the said copolymer resin is contained in 10 to 80 weight% in a composition. When the content of the [A] alkali soluble resin is within the above range, there is an effect of improving the water resistance, heat resistance, developability and coating properties.

As a solvent used for the synthesis | combination of the said copolymer [A], Alcohol, such as methanol and ethanol; Ethers such as tetrahydrofuran, diethylene glycol dimethyl ether and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate and propylene glycol butyl ether acetate are preferable. The solvent is preferably contained in 60 to 70% by weight of the alkali soluble resin [A].

As a polymerization initiator used for the synthesis | combination of the said copolymer [A], as long as it is generally known as a radical polymerization initiator, it can be used without limitation, For example, 2,2'- azobisisobutyronitrile, 2,2 ' Azo compounds such as -azobis- (2,4-dimethylvaleronitrile) and 2,2'-azobis- (4-methoxy-2,4-dimethylvaleronitrile); Organic peroxides such as benzoyl peroxide, t-butylperoxy pibarate, 1,1'-bis- (t-butylperoxy) cyclohexane; And hydrogen peroxide. When a peroxide is used as a radical polymerization initiator, you may use it as a redox initiator by using a peroxide together with a reducing agent. The polymerization initiator is preferably contained in 1 to 10% by weight of the alkali soluble resin [A].

The above-mentioned [A] alkali soluble resin is a weight average molecular weight of 5,000 to 40,000 g / mol. When the weight average molecular weight of the alkali-soluble resin is in the above range may have excellent coating properties and developability.

[B] Unsaturated Ethylene Monomer

In the present invention, the unsaturated ethylenic monomer used is an acrylic monomer, which has good polymerization property with mono-, bi-, or tri- or more (meth) acrylates, and has low adhesion shrinkage during exposure, so that the adhesion strength is high even at high temperature and high humidity conditions. It is preferable from the viewpoint of improving. Such mono-, bi-, or tri- or higher (meth) acrylates are used alone or in combination.

B-1) Including an unsaturated ethylenic monomer represented by Formula 1, it is possible to obtain an excellent pattern developability while maintaining a high residual film ratio.

<Formula 1>

In Formula 1, R is an alkyl group having 1 to 6 carbon atoms, an aliphatic hydrocarbon group or a phenyl group.

In detail, the conventional photosensitive resin composition having a polyfunctional unsaturated ethylenic monomer had a problem that the residual film rate decreased when the content was decreased to improve the pattern developability, and the pattern development occurred when the content was increased to increase the residual film rate. There was a problem of poor properties, in the present invention by applying the unsaturated ethylenic monomer of formula (1) was able to obtain the effect of improving the pattern development while maintaining the excellent residual film ratio.

The unsaturated ethylene monomer represented by b-1) formula (1) preferably has a weight average molecular weight of 100 to 2,000 g / mol. If the weight average molecular weight is less than 100g / mol, there is a problem that the heat resistance, the residual film ratio is lowered, and when the weight average molecular weight exceeds 2,000g / mol, there is a problem of poor coating properties, resolution.

In addition, the unsaturated ethylene monomer represented by b-1 Formula 1 is preferably contained in 5 to 50% by weight in the [B] unsaturated ethylene monomer. If the content is less than 3% by weight, the adhesion, the resolution is lowered, if it exceeds 50% by weight there is a disadvantage that the heat resistance, residual film rate and the like.

B-2) Examples of the ethylene monomer having a tri- or higher functional unsaturated group include trishydroxyethyl isocyanate tri (meth) acrylate, trimethyl propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, Pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc. are mentioned.

The unsaturated ethylenic monomer may be included in the amount of 5 to 60% by weight based on the total content of the composition, when in the content range it can be obtained the effect having development resistance and pattern resistance.

[C] photopolymerization initiator

The photoinitiator in the present invention means a compound which causes decomposition or bonding upon exposure and generates active species capable of initiating polymerization of the above-mentioned [B] unsaturated ethylenic monomers such as radicals, anions and cations.

The photocurable resin composition of the present invention comprises a photopolymerization initiator to be 0.5 to 20% by weight of the total composition. If the content is less than 0.5% by weight, the sensitivity of the hard coating film is insufficient, so that the hard coating film is easily lost in the developing process, and even if the hard coating film is maintained in the developing process, it is difficult to obtain a hard coating film having a sufficiently high crosslinking density. . When the content of the photopolymerization initiator is more than 20% by weight, heat resistance, planarization property, etc. of the hard coat film tend to be reduced.

Examples of such photoinitiators include thioxanthone, 2,4-diethylthioxanthone, thioxanthone-4-sulfonic acid, benzophenone, 4,4'-bis (diethylamino) benzophenone, acetophenone, p- Dimethylaminoacetophenone, α_α'-dimethoxyacetoxybenzophenone, 2,2'-dimethoxy-2-petylacetophenone, p-methoxyacetophenone, 2-methyl [4- (methylthio) phenyl] -2 Morpholino-1-propane, 2-benzyl-2-diethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-hydroxy-2-methyl-1-phenylpropane Ketones anthraquinone, 1, 4- naphthoquinone, such as a 1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2- propyl) ketone, and 1-hydroxy cyclohexyl phenyl ketone Quinones 1,3,5-tris (trichloromethyl) -s-triazine, 1,3-bis (trichloromethyl) -5- (2-chlorophenyl) -s-triazine, 1,3 Halogens such as -bis (trichlorophenyl) -s-triazine, phenacyl chloride, tribromomethylphenyl sulfone, and tris (trichloromethyl) -s-triazine And acyl phosphine oxides such as peroxide 2,4,6-trimethylbenzoyldiphenylphosphine oxide, such as a logen compound di-t-butylperoxide.

These photoinitiators can be used alone or in combination.

[D] solvent

As the solvent used in the present invention, the following materials can be used in the preparation of the copolymer [A] or as a solvent capable of maintaining the solid content and the viscosity of the composition. Specifically, Alcohol, such as methanol and ethanol; Ethers such as tetrahydrofuran, diethylene glycol dimethyl ether and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, and propylene glycol butyl ether acetate. Diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol methyl ether acetate methyl ethyl ketone, cyclohexanone, 4-hydride from the viewpoint of solubility, reactivity with each component, and convenience of coating film formation in such a solvent Methyl esters, ethyl esters, propyl esters and butyl esters of ketone acetic acids such as oxy-4-methyl-2-pentanane; Ethyl ester and methyl ester of 2-hydroxypropionic acid; Ethyl ester of 2-hydroxy-2-methylpropionic acid; Methyl ester of hydroxyacetic acid, ethyl ester, butyl ester; Ethyl lactate, propyl lactate, butyl lactate; Methyl ester of methoxy acetic acid, ethyl ester, propyl ester, butyl ester; Methyl esters, ethyl esters, propyl esters, butyl esters of propoxyacetic acid; Methyl ester of butoxy acetic acid, ethyl ester, propyl ester, butyl ester; Methyl ester of 2-methoxypropionic acid, ethyl ester, propyl ester, butyl ester; Methyl ester, ethyl ester, propyl ester, butyl ester of 2-ethoxypropionic acid; Methyl ester, ethyl ester, propyl ester, butyl ester of 2-butoxypropionic acid; Methyl ester, ethyl ester, propyl ester, butyl ester of 3-methoxypropane; Methyl ester, ethyl ester, propyl ester, butyl ester of 3-ethoxypropionic acid; Ester, such as methyl ester of 3-butoxy propionic acid, ethyl ester, propyl ester, and butyl ester, is mentioned.

Moreover, it is also possible to use a high boiling point solvent together with the said solvent. As a high boiling point solvent which can be used together, it is N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, for example. And benzyl ethyl ether.

The solvent is preferably included 20 to 80% by weight relative to the total content of the composition in that it improves the flatness during coating.

In addition, other additives that may be added include a surfactant for improving applicability. Surfactants include fluorine and silicone-based surfactants, for example, 3M's FC-129, FC-170C, FC-430, DIC's F-172, F-173, F-183, F-470, F -KP322, KP323, KP340, KP341 by Shin-Etsu Silicone, etc. are mentioned. Such surfactant is used in an amount of preferably 5 parts by weight or less, more preferably 2 parts by weight or less, based on 100 parts by weight of the [A] alkali-soluble resin. When the amount of the surfactant exceeds 5 parts by weight, bubbles are likely to occur during application.

It is also possible to use an adhesion aid in order to improve the adhesion with the base. As such an adhesion aid, a functional silane coupling agent is preferably used. For example, trimethoxysilyl benzoic acid, methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ- Isocyanate propyl triethoxysilane, (gamma)-glycidoxy propyl trimethoxysilane, etc. are mentioned. Such adhesion aid is used in an amount of preferably 20 parts by weight or less, more preferably 10 parts by weight or less, based on 100 parts by weight of the [A] alkali-soluble resin. When the amount of the adhesion aid exceeds 20 parts by weight, the heat resistance tends to be lowered.

The above-mentioned hard coating photosensitive resin composition has a viscosity of 3 to 30 cps at room temperature, which can achieve the effect of forming an overall flat coating, that is, a hard coating film during spin or spinless coating. It is.

In another aspect, the present invention relates to a hard coat film formed by using the photosensitive resin composition for hard coating.

The hard coating film according to the present invention includes a hard coating layer formed by applying the above-described hard coating composition on one side or both sides of a transparent substrate and then curing. The hard coating film prepared using the composition according to the present invention is excellent in hardness, flatness, sensitivity, heat resistance, transparency, water resistance, etc., and at the time of reliability evaluation at high temperature and high humidity (85 ° C., 85% RH, 500hrs). Reliability can be improved by solving adhesion.

As the transparent substrate, any substrate can be used as long as it is transparent. For example, any film can be used as long as it is a plastic film, glass, a transparent electrode, or a silicon nitride film. The plastic film is, for example, norbornene or polycyclic ring. Cycloolefin derivatives having units of monomers containing cycloolefins such as norbornene monomers, diacetyl cellulose, triacetyl cellulose, acetyl cellulose butyrate, isobutyl ester cellulose, propionyl cellulose, butyryl cellulose or acetyl propionyl Cellulose selected from cellulose, ethylene-vinyl acetate copolymer, polyester, polystyrene, polyamide, polyetherimide, polyacryl, polyimide, polyether sulfone, polysulfone, polyethylene, polypropylene, polymethylpentene, polyvinyl chloride , Polychlorinated Nilidene, polyvinyl alcohol, polyvinyl acetal, polyether ketone, polyether ether ketone, polyether sulfone, polymethyl methacrylate, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycarbonate, polyurethane, One selected from the epoxy may be used, and an unstretched uniaxial or biaxially oriented film may be used.

Among them, a monoaxial or biaxially stretched polyester film having excellent transparency and heat resistance, but a cycloolefin derivative film capable of coping with a large film while providing transparency and heat resistance, and triacetyl due to its transparency and optical anisotropy Cellulose film can be used suitably.

The above-described photosensitive resin composition for an organic insulating film has a viscosity of 3 to 50 cps at room temperature, which can achieve an effect of forming an overall flat coating film, that is, an organic insulating film during spin or spinless coating. will be.

Another embodiment of the present invention is a display device including the organic insulating film.

Hereinafter, preferred examples and comparative examples of the present invention will be described. However, one embodiment below is only a preferred embodiment of the present invention and the present invention is not limited to the following embodiment.

Preparation Example 1 Alkali Soluble Resin Manufacture

In a reaction vessel equipped with a cooling tube and a stirrer, 10 parts by weight of 2,2'-azobisisobutyronitrile was dissolved in 200 parts by weight of a solvent propylene glycol monomethyl ether acetate as a photopolymerization initiator. Subsequently, 65 parts by weight of styrene, 15 parts by weight of methacrylic acid, and 20 parts by weight of glycidyl methacrylate were added thereto, followed by nitrogen replacement, followed by gentle stirring. The temperature of the solution was raised to 70 ° C., and this temperature was maintained for 4 hours to obtain a polymer solution including a copolymer. Solid content concentration of the obtained polymer solution was 35 weight%. This is called alkali-soluble resin.

<Examples 1 to 5 and Comparative Examples 1 to 3>

As a photosensitive material, an alkali-soluble resin, a solvent, propylene glycol monomethyl ether acetate, and a monomer having an unsaturated ethylene bond (dipentaerythritol hexa (meth) acrylate) are mixed, and a silane compound having the formula (1) structure is used as an adhesion aid. As shown in Table 1 below, the compound was blended with varying content to prepare a photosensitive resin.

division [A] alkali soluble resin
[B] ethylenically unsaturated monomers
Monomer of Formula 1 [B] 6-functional ethylenically unsaturated monomer
[C] oxime photopolymerization initiator
[D] solvent Example 1 33 One 17 2 47 Example 2 33 2 16 2 47 Example 3 33 6 12 2 47 Example 4 33 9 9 2 47 Example 5 33 10 8 2 47 Comparative Example 1 30 0 21 2 47 Comparative Example 2 33 0 18 2 47 Comparative Example 3 36 0 15 2 47

1) The content unit is weight percent.

2) [B] The ethylenically unsaturated monomer (monomer of Chemical Formula 1) is DPE6A-MS (Cooperative).

3) [B] The 6 functional ethylenically unsaturated monomer is DPHA (Gyoei Co., Ltd.).

4) [C] oxime photopolymerization initiator OXE-01 (BASF).

The physical properties of the compositions prepared in Examples and Comparative Examples were evaluated as follows, and the results are shown in Table 2 below.

(1) flatness

Each photosensitive resin composition prepared on the glass patterned with color resist was spin-coated and pre-dried at a temperature of 100 ° C. for 120 seconds on a hot plate to form a photoresist film having a thickness of 3 μm. After developing for 60 seconds in a 2.38% TMAH aqueous solution and again subjected to strong heat treatment for 220 ℃, 1 hour. The thickness of 5 points of the dry coating film obtained here was measured, and flatness was measured.

The flatness was measured to indicate that the thickness deviation was less than 0.025 µm,?, 0.026 µm to 0.05 µm,?, 0.06 µm to 0.1 µm, and? And 0.1 µm, respectively.

(2) sensitivity

Each photosensitive resin composition prepared in Glass was coated with a spin of 800 rpm, pre-dried at a temperature of 100 ° C. and 120 seconds on a hot plate, and the exposure dose was set at 60, 70, 80, 90, 30, 60, 90 mJ / cm 2, respectively. After exposure, the solution was developed in a 2.38% TMAH aqueous solution for 60 seconds, and then subjected to a strong heat treatment at 220 ° C. for 1 hour. The thickness of the coating film obtained at this time was measured.

The thickness was measured to obtain 90% or more of the thickness of the coating film obtained at 90 mJ / cm 2 as the sensitivity in each composition.

(3) heat resistance

The widths of the top, bottom, left and right sides of the pattern film formed by the sensitivity measurement were measured. At this time, when the change rate of each angle is 0 to 10%, ◎, 11 to 20%, ○, 21 to 40%, and △, 40% or more, before the mid-baking (100 ° C, 2 minutes) It is represented by X.

(4) adhesion

Each photosensitive resin composition prepared in Glass was coated with a spin of 800 rpm, pre-dried at 100 ° C. for 120 seconds on a hot plate, using a mask according to pattern size (4 μm to 100 μm), and the exposure amount was exposed at 50 mJ / cm 2. After developing for 60 seconds in a 2.38% TMAH aqueous solution and again subjected to strong heat treatment for 220 ℃, 1 hour. At this time, the minimum pattern size remaining without loss was confirmed.

The case where the minimum pattern size remaining without loss in the above measurement is 5 µm or less,?, 6-10 µm,?, 11-15 µm,?, And 15 µm are represented by X.

(5) transmittance

The transmittance | permeability measured the transmittance | permeability in 400 nm using the spectrophotometer.

(6) pattern developability

Each photosensitive resin composition prepared in Glass was coated with a spin of 800 rpm, pre-dried at 100 ° C. for 120 seconds on a hot plate, using a mask according to pattern size (4 μm to 100 μm), and the exposure amount was exposed at 50 mJ / cm 2. After developing for 60 seconds in a 2.38% TMAH aqueous solution and again subjected to strong heat treatment for 220 ℃, 1 hour. At this time, the minimum pattern size of the coating film obtained clearly was measured.

(7) residual film rate

Each photosensitive resin composition prepared in Glass was spin-coated and pre-dried at a temperature of 100 ° C. for 120 seconds on a hot plate to form a photoresist film having a thickness of 3 μm. After developing for 60 seconds and again subjected to strong heat treatment for 220 ℃, 1 hour. The film thickness during predrying and the thickness of the formed film after solvent removal through post-cure were measured, and the residual film rate was measured by ratio measurement.

division Composition
Viscosity
(cps) Flatness Sensitivity
(mJ / ㎠) Heat resistance Adhesion Pattern development
(Μm) Residual rate
(%) Transmittance
(%) Example 1 8 ○ 40 ◎ △ 9 85 97 Example 2 8 ○ 40 ◎ ○ 8 85 97 Example 3 8 ○ 40 ◎ ○ 7 85 97 Example 4 8 ○ 40 ◎ ○ 7 84 97 Example 5 8 ○ 40 ○ ◎ 7 82 97 Comparative Example 1 8 ○ 37 ○ △ 14 90 97 Comparative Example 2 8 ○ 40 ◎ △ 10 85 97 Comparative Example 3 8 ○ 43 ◎ ○ 6 81 97

The photosensitive resin composition prepared in Examples 1 to 5 according to the present invention through Table 2 was excellent in flatness, sensitivity, heat resistance, transparency, residual film ratio, etc., in particular, excellent pattern developability and excellent adhesion to the substrate The result was obtained.

All simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims (8)

[A] alkali-soluble resin, [B] unsaturated ethylenic monomer, [C] photoinitiator and [D] solvent, wherein the [B] unsaturated unsaturated monomer is represented by b-1) Photosensitive resin composition for organic insulating films containing unsaturated ethylene monomer and b-2) ethylene monomer which has a trifunctional or more than trifunctional unsaturated group

<Formula 1>

In Formula 1, R is an alkyl group having 1 to 6 carbon atoms, an aliphatic hydrocarbon group or a phenyl group. The photosensitive resin composition for an organic insulating film according to claim 1, wherein the monomer represented by b-1) formula (1) has a weight average molecular weight of 100 to 2,000 g / mol. [Claim 2] The photosensitive resin composition for organic insulating film according to claim 1, wherein the unsaturated ethylene monomer represented by b-1) is represented by 5 to 50 wt% in the [B] unsaturated ethylene monomer. The ethylene monomer having an unsaturated group of trifunctional or higher than b-2) is trishydroxyethyl isocyanate tri (meth) acrylate, trimethyl propane tri (meth) acrylate, or pentaerythritol tri (meth). ), Pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, or a mixture of two or more thereof. According to claim 1, wherein the resin composition is [A] alkali-soluble resin 5 to 80% by weight, [B] unsaturated unsaturated ethylene monomer 5 to 60% by weight, [C] photoinitiator 0.5 to 20% by weight and [D] Photosensitive resin composition for organic insulating films characterized by including 20 to 80% by weight of the solvent The photosensitive resin composition for organic insulating films according to claim 1, wherein the resin composition has a room temperature viscosity of 3 to 30 cps. An organic insulating film prepared using the composition according to any one of claims 1 to 6. A display device comprising the organic insulating film according to claim 7.